System and method for measuring dynamic resistance of stacked high-temperature superconducting tape in pulsed magnetic field

Abstract

The invention belongs to the application field of superconducting materials, and provides a system and a method for measuring dynamic resistance of stacked high-temperature superconducting tapes in a pulsed magnetic field, the measuring system comprises a measuring instrument, a power supply device, a cooling device, a pulsed magnetic field generating device and a computer, and the whole process comprises the following steps: S1, building a dynamic resistance measuring system; s2, stacking the superconductive strips with the marks and the superconductive strips without the marks in different arrangement modes; s3, setting related parameters of the pulsed magnetic field; according to the system for measuring the dynamic resistance of the stacked superconducting tape, the dynamic resistance of a pulsed magnetic field to a single high-temperature superconducting tape and the stacked high-temperature superconducting tape can be accurately measured; according to the measurement method, basic parameters of the pulsed magnetic field are considered, and influences of the phase and the duty ratio are also included, so that influence factors in various aspects of the dynamic resistance of the superconducting tape are measured; through analysis of a measurement result, parameters of the pulsed magnetic field can be optimized, and a powerful technical means is provided for performance regulation and control of the superconducting tape in practical application.

Description

Technical Field

[0001] The present invention belongs to the technical field of the application of superconducting materials, and specifically relates to a measurement system and method for the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields. Background Art

[0002] In the field of application of superconducting materials, high-temperature superconducting tapes exhibit great application potential in many aspects such as power transmission, maglev transportation, and high-energy physics research due to their excellent electrical properties. However, the dynamic resistance characteristics of superconducting tapes, especially their performance under pulsed magnetic fields, are crucial for their performance in practical applications.

[0003] In the prior art, the research on the dynamic resistance of superconducting tapes mostly focuses on the analysis under steady magnetic fields or simple magnetic field conditions, lacking a comprehensive and in-depth understanding of the dynamic resistance characteristics of superconducting tapes in a pulsed magnetic field environment.

[0004] Therefore, those skilled in the art have proposed a measurement system and method for the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields to solve the problems raised in the background art. Summary of the Invention

[0005] To solve the above technical problems, the present invention provides a measurement system and method for the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields, so as to solve the problems that in the prior art, the research on the dynamic resistance of superconducting tapes mostly focuses on the analysis under steady magnetic fields or simple magnetic field conditions, lacking a comprehensive and in-depth understanding of the dynamic resistance characteristics of superconducting tapes in a pulsed magnetic field environment; at the same time, for scarred and non-scarred stacked high-temperature superconducting tapes, the research on the influence of different arrangement methods is less, restricting the performance optimization of superconducting tapes in stacked applications, etc.

[0006] A measurement method for the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields includes:

[0007] S1. Set up a dynamic resistance measurement system;

[0008] S2. Stack scarred and non-scarred superconducting tapes in different arrangement methods;

[0009] S3. Set the relevant parameters of the pulsed magnetic field;

[0010] S4. Measure and analyze the dynamic resistance of single and stacked high-temperature superconducting tapes.

[0011] Preferably, it also includes considering the influence of factors such as the frequency and duty cycle of the pulsed magnetic field on the dynamic resistance of high-temperature superconducting tapes to improve the comprehensiveness and accuracy of the measurement.

[0012] Preferably, the specific description of step S1 is as follows:

[0013] S1.1. To ensure the measurement accuracy, a nanovoltmeter is selected as the measuring device for the dynamic voltage. As a new type of sensor based on nanotechnology, the nanovoltmeter can achieve high sensitivity and fast response functions at the nanoscale and can be used to measure physical quantities at the microscale.

[0014] S1.2. The current required to measure the dynamic resistance of the superconducting tape is a direct current, and a direct current source is used as the power supply device.

[0015] S1.3. High-temperature superconducting tapes need to be at the critical temperature to exhibit their superconducting properties. Therefore, a cooling device is required to keep them in the liquid nitrogen temperature range. An adiabatic container cryogenic dewar is often used as the cooling device.

[0016] S1.4. A pulsed magnetic field generating device can generate the pulsed magnetic field required for measurement, and the dynamic resistance of the superconducting tape can be measured by adjusting parameters such as amplitude and phase.

[0017] S1.5. The data signals of the direct current source and the nanovoltmeter are simultaneously connected to the computer, and the measured value of the dynamic resistance of the superconducting tape can be obtained through the program.

[0018] Preferably, the specific description of step S2 is as follows:

[0019] S2.1. Regularly and neatly engrave the surface coating of the high-temperature superconducting tape to make it have multiple scratch groups with staggered distributions.

[0020] S2.2. Stack the high-temperature superconducting tapes without scratches and the high-temperature superconducting tapes with scratches with the same number of roots respectively.

[0021] S2.3. Stack the high-temperature superconducting tapes without scratches and the high-temperature superconducting tapes with scratches with the same number of roots in different arrangements: the upper half is the high-temperature superconducting tape with scratches and the lower half is the high-temperature superconducting tape without scratches, and the high-temperature superconducting tape with scratches and the high-temperature superconducting tape without scratches are stacked.

[0022] Preferably, the setting of the pulsed magnetic field includes the frequency and amplitude of the magnetic field to adapt to the characteristics and application scenarios of different superconducting tapes.

[0023] Preferably, the specific description of step S3 is as follows:

[0024] S3.1. According to the application requirements and experimental conditions of the superconducting tape, determine parameters such as the frequency, amplitude, pulse width, and phase of the pulsed magnetic field.

[0025] S3.2. Set the pulsed magnetic field in the pulsed magnetic field generating device.

[0026] Preferably, the specific description of step S4 is as follows:

[0027] S4.1. Set up the program in the computer. The dynamic resistance measurement value can be obtained through the data signals of the connected DC current source and nanovoltmeter.

[0028] S4.2. Run the measurement system to measure and analyze the dynamic resistance of a single superconducting tape under the action of a pulsed magnetic field.

[0029] S4.3. Record the measurement results, including key indicators such as dynamic voltage and dynamic resistance.

[0030] S4.4. Measure and analyze the general stacked high-temperature superconducting tapes, considering the influence of the stacking effect on the dynamic resistance.

[0031] S4.5. Analyze the measurement results of the dynamic resistance of high-temperature superconducting tapes under different arrangements, and analyze the role played by the scarred superconducting tapes.

[0032] A measurement system for the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field, which is applied to the method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as described above, includes an input module, a measurement module, and an output module, where:

[0033] The input module is used to receive the DC current source and the pulsed magnetic field generating device input by the user.

[0034] The measurement module uses a high-precision nanovoltmeter for measurement.

[0035] The output module is used to display the measurement results, including the dynamic voltage and dynamic resistance values of the superconducting tape.

[0036] A processor is configured to execute the method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as described above.

[0037] A computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as described above.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] 1. By using a professional device to build a dynamic resistance measurement system for superconducting tapes, the present invention can accurately measure the dynamic resistance of superconducting tapes under a pulsed magnetic field.

[0040] 2. For stacked high-temperature superconducting tapes, the present invention introduces an analysis formula for the stacking effect, which can quantitatively evaluate the regulation effect of the stacking effect on the dynamic resistance. It not only deepens the understanding of the dynamic resistance characteristics of stacked superconducting tapes, but also provides an important theoretical basis and guidance for the performance optimization of superconducting tapes in stacked applications.

[0041] 3. The dynamic resistance of the scarred and non-scarred stacked superconducting tapes was measured using different arrangements, and the influence of multiple superconducting channels on the dynamic resistance was quantified. Description of the Drawings

[0042] Figure 1 It is a flowchart of the method for measuring the dynamic resistance of the stacked high-temperature superconducting tape of the present invention under a pulsed magnetic field;

[0043] Figure 2 It is a system framework diagram of the method for measuring the dynamic resistance under a pulsed magnetic field of the present invention.

[0044] Figure 3 It is a schematic diagram of the scarred superconducting tape of the present invention.

[0045] Figure 4 It is a schematic diagram of the principle for measuring the dynamic resistance under a pulsed magnetic field of the present invention. Detailed Embodiments

[0046] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0047] Example: The present invention provides a method for measuring the dynamic resistance of a stacked high-temperature superconducting tape under a pulsed magnetic field, as Figure 1 shown, including:

[0048] S1. Build a dynamic resistance measurement system;

[0049] S2. Stack the scarred and non-scarred superconducting tapes in different arrangements;

[0050] S3. Set the parameters related to the pulsed magnetic field;

[0051] S4. Measure and analyze the dynamic resistance of a single and stacked high-temperature superconducting tape. The definition of the dynamic resistance:

[0052]

[0053] where U(t) is the dynamic voltage generated by the superconducting tape, I is the direct current flowing through, S is the cross-sectional area of the superconducting tape, L is the length of the superconducting tape, and f is the magnetic field frequency.

[0054] As can be seen from the above, by building a measurement system for the dynamic resistance of superconducting tapes and using a pulsed magnetic field generating device to provide a magnetic field for the superconducting tapes, the dynamic resistance of single and stacked high-temperature superconducting tapes under pulsed magnetic fields can be accurately measured. Different stacking methods are used for the scarred and scarless superconducting tapes, which improves the comprehensiveness of the measurement. By analyzing the measurement results, the parameters of the pulsed magnetic field can be optimized to reduce the adverse effects on the dynamic resistance, providing a powerful technical means for performance regulation of superconducting tapes in practical applications.

[0055] Further, the specific description of step S1 is as follows:

[0056] S1.1. Select a nanovoltmeter as the measuring device for dynamic voltage. As a new type of sensor based on nanotechnology, the nanovoltmeter can achieve high sensitivity and fast response functions at the nanoscale and can be used to measure physical quantities at the microscale.

[0057] S1.2. The current required for measuring the dynamic resistance of the superconducting tape is a direct current. Use an N8754A direct current source as the power supply device, which can control the magnitude of the direct current.

[0058] S1.3. The cooling device uses an adiabatic container cryogenic dewar. During measurement, the superconducting tape and the sample holder are completely immersed in the liquid nitrogen cryogenic constant temperature container.

[0059] S1.4. The pulsed magnetic field generating device uses an ES-9100 pulsed magnetic field generator, which can change parameters such as the amplitude and pulse width of the pulsed magnetic field.

[0060] S1.5. Collect the data measured by the direct current source and the nanovoltmeter through a computer, and then obtain the measured value of the dynamic resistance of the superconducting tape.

[0061] S1.6. After the measurement is completed, post-processing of the measurement results is required to extract useful information. Through reasonable processing settings, it is more convenient to analyze and compare the measurement results.

[0062] As can be seen from the above, by selecting professional measuring devices, power supply devices, cooling devices and pulsed magnetic field generating devices to build a measurement system for the dynamic resistance of superconducting tapes, the dynamic resistance of high-temperature superconducting tapes can be accurately measured. At the same time, the precise pulsed magnetic field generating device lays a solid foundation for subsequent analysis of the influence of pulsed magnetic fields on the dynamic resistance of superconducting tapes, which helps to obtain more accurate measurement results and more valuable analysis conclusions.

[0063] Further, the specific description of step S2 is as follows:

[0064] S2.1. Regularly and neatly engrave the surface coating of the high-temperature superconducting tape to make it have multiple groups of scratches distributed in a staggered manner;

[0065] S2.2. Each scratch is distributed along the length direction of the superconducting tape. The scratches between each scratch group are parallel to each other and the spacing is less than 1 mm, and the length is 5 cm.

[0066] S2.3. The interval length between different scratch groups is less than 1 cm.

[0067] S2.2. Stack the non-scratched high-temperature superconducting tapes and the scratched high-temperature superconducting tapes with the same number of tapes respectively.

[0068] S2.3. Stack the non-scratched high-temperature superconducting tapes and the scratched high-temperature superconducting tapes with the same number of tapes respectively in different arrangements: the upper half is the scratched high-temperature superconducting tape and the lower half is the non-scratched high-temperature superconducting tape, the scratched high-temperature superconducting tape and the non-scratched high-temperature superconducting tape are stacked.

[0069] As can be seen from the above, most of the existing coating processes for superconducting tapes are complete surface coatings, and the coatings are single complete superconducting channels. If the superconducting channel is cut into multiple superconducting channels, the loss can be further reduced; the regular staggered scratch groups can enable the superconducting channel of the current group to pass through two superconducting channels when entering the next group of superconducting channels. Even if one of them is blocked, it will not affect the transmission. Measuring the scratched and non-scratched stacked high-temperature superconducting tapes under different arrangements can explore the influence of different arrangements on the dynamic loss of multiple superconducting channels, providing a powerful tool for the research on regulating the dynamic resistance of superconducting tapes by pulsed magnetic fields.

[0070] Furthermore, the setting of the pulsed magnetic field includes the frequency, amplitude and pulse width of the magnetic field to adapt to the characteristics and application scenarios of different superconducting tapes.

[0071] Furthermore, the specific description of step S3 is as follows:

[0072] S3.1. Determine the parameters such as the frequency, amplitude and pulse width of the pulsed magnetic field according to the application requirements and experimental conditions of the superconducting tape.

[0073] S3.2. Set the required parameters on the ES-9100 pulsed magnetic field generator.

[0074] As can be seen from the above, by carefully determining the parameters of the pulsed magnetic field, such as frequency, amplitude and pulse width, according to the application requirements and experimental conditions of the superconducting tape, an accurate magnetic field environment setting is provided for subsequent measurement and analysis, providing a more accurate and reliable basis for analyzing the influence of the pulsed magnetic field on the dynamic resistance of the superconducting tape.

[0075] Furthermore, the specific description of step S4 is as follows:

[0076] S4.1. Run the measurement system.

[0077] S4.2. Measure the dynamic resistance of single and stacked superconducting tapes under pulsed magnetic fields with different arrangements respectively;

[0078] S4.3. Record the measurement results, including key data such as dynamic voltage, DC current, and dynamic resistance;

[0079] S4.4. Analyze the stacked high-temperature superconducting tapes, consider the influence of the stacking effect on the dynamic resistance, and introduce a stacking effect analysis formula. This formula can be derived based on the relationship between the dynamic resistance value of a single superconducting tape and the dynamic resistance value of the stacked superconducting tape. The formula is as follows:

[0080] R stack = k·R single +ΔR;

[0081] Where, R stack is the dynamic resistance value of the stacked superconducting tape, R single is the dynamic resistance value of a single superconducting tape, k is the stacking effect coefficient, and ΔR is the additional resistance value caused by the stacking effect;

[0082] S4.5. Compare the measurement results of single and stacked superconducting tapes, and analyze the influence of the stacking effect on the dynamic resistance;

[0083] S4.6. Compare the measurement results of stacked superconducting tapes with different arrangements, and analyze the influence of multiple superconducting channels on the dynamic resistance.

[0084] As can be seen from the above, by carefully setting the parameters of the superconducting tapes, the pertinence and accuracy of the measurement results are ensured; measure the dynamic resistance of a single superconducting tape and record the key indicators; further, consider the influence of the stacking effect on the measurement results of the stacked high-temperature superconducting tapes, and introduce a stacking effect analysis formula for quantitative evaluation, which enables us to more deeply understand the regulation mechanism of the stacking effect on the dynamic resistance; finally, by comparing the dynamic resistances of stacked superconducting tapes with and without traces, the influence of multiple superconducting channels on the dynamic loss can be intuitively found, providing an important basis for the performance optimization of superconducting tapes in stacked applications and helping to improve the overall performance of superconducting tapes in practical applications.

[0085] A measurement system for the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields, as Figure 2 shown, is applied to the above-mentioned method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under pulsed magnetic fields, and includes an input module, a measurement module, and an output module, where:

[0086] The input module is used to receive the DC current source and the pulsed magnetic field generating device input by the user;

[0087] The measurement module uses a high-precision nanovoltmeter for measurement;

[0088] The output module is used to display the measurement results, including the dynamic voltage and dynamic resistance values of the superconducting tape.

[0089] Working principle: The working principle of this technical solution is to select professional experimental devices to build a measurement system for the dynamic resistance of superconducting tapes; stack the scarred and scarless high-temperature superconducting tapes in different arrangements; then, according to the application requirements and experimental conditions of the superconducting tapes, set the parameters of the pulsed magnetic field, including frequency, amplitude, pulse width, etc.; finally, measure the dynamic resistance of single and stacked high-temperature superconducting tapes in different arrangements under the action of the pulsed magnetic field, record the key indicators, and introduce the stacking effect analysis formula to quantitatively evaluate the influence of the stacking effect on the dynamic resistance, so as to comprehensively understand the influence of the pulsed magnetic field and multi-superconducting channels on the dynamic resistance of superconducting tapes.

[0090] The embodiment of the present application provides an electronic device, which is applicable to the method for measuring the dynamic resistance of the stacked high-temperature superconducting tapes under a pulsed magnetic field as described above, including:

[0091] A memory, used to protect computer programs and data;

[0092] A processor, used to run the system program.

[0093] The embodiment of the present application provides a computer storage medium, which is applicable to the method for measuring the dynamic resistance of the stacked high-temperature superconducting tapes under a pulsed magnetic field, and performs hierarchical confidentiality management on the above system and data according to the requirements of confidentiality management.

[0094] Those skilled in the art should understand that the embodiments of the present application can be provided as a system or a computer program product. Therefore, the present application can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0095] The present application is described with reference to the flowcharts and / or block diagrams of the devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, and the combination of processes and / or blocks in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate for implementing in the process Figure 1 one process or multiple processes and / or blocks Figure 1means for the functions specified in one or more boxes.

[0096] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to operate in a particular manner, such that the instructions stored in the computer-readable memory produce a manufacture including an instruction means that implements the functions specified in one Figure 1 one or more processes and / or boxes Figure 1 or more boxes.

[0097] These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus, such that a series of operational steps are performed on the computer or other programmable apparatus to produce a computer-implemented process, whereby the instructions executed on the computer or other programmable apparatus provide steps for implementing the functions specified in one Figure 1 one or more processes and / or boxes Figure 1 or more boxes.

[0098] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0099] The memory may include non-permanent memory in the form of computer-readable media, random access memory (RAM) and / or non-volatile memory such as read-only memory (ROM) or flash memory (flash RAM). The memory is an example of a computer-readable medium.

[0100] Computer-readable media includes both permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. The information may be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices, or any other non-transmission media that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media such as modulated data signals and carrier waves.

[0101] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, commodity or device including the elements.

[0102] The embodiments of the present invention are provided for the purpose of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field, characterized in that: include: S1. Build a dynamic resistance measurement system; S2. Stacking the superconducting tapes with and without traces in different arrangements; S3, setting pulse magnetic field related parameters; S4. Measure and analyze the dynamic resistance of single and stacked high-temperature superconducting tapes.

2. A method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as claimed in claim 1, characterized in that: The specific description of step S1 is: S1.

1. The measuring instrument is a nanovoltmeter to measure the dynamic voltage of the superconducting tape, and the four-lead method is used for measurement; S1.2, the power supply device uses a DC current source to regulate the DC current flowing into the superconducting tape, the direction of which is perpendicular to the external magnetic field; S1.

3. The cooling device uses an insulated container Dewar to ensure that the temperature of the high-temperature superconducting tape is in the liquid nitrogen temperature range; S1.4, a pulse magnetic field generating device generates a pulse magnetic field perpendicular to the direct current flowing into the superconducting tape; S1.

5. The data measured by the DC current source and the nanovoltmeter are collected by a computer to obtain the measured value of the dynamic resistance of the superconducting tape.

3. A method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as claimed in claim 1, characterized in that: The specific description of step S2 is: S2.

1. Regularly and neatly engrave the surface coating of the high-temperature superconducting tape so that it has a plurality of staggered scratch groups; S2.

2. Stack the same number of seamlessly stacked high-temperature superconducting tapes and traced high-temperature superconducting tapes in different arrangements.

4. A method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as claimed in claim 1, characterized in that: The specific description of step S3 is: S3.

1. Determine the amplitude, frequency, phase, duty cycle and other parameters of the pulsed magnetic field according to the application requirements and experimental conditions of the superconducting tape; S3.

2. Set the corresponding parameters in the pulse magnetic field generating device.

5. The method for measuring the dynamic resistance of stacked high-temperature superconducting tapes under a pulsed magnetic field as claimed in claim 1, characterized in that: The specific description of step S4 is as follows: S4.

1. Set up the measurement program in the computer; S4.

2. operate the measurement system to measure the dynamic resistance of a single superconducting tape and stacked superconducting tapes in different arrangements under the action of a pulsed magnetic field; S4.

3. Record the measurement results; S4.

4. Analyze the measurement results of the dynamic resistance of a single stacked high-temperature superconducting tape, considering the influence of the stacking effect on the dynamic resistance; S4.

5. Analyze the measurement results of the dynamic resistance of high-temperature superconducting tapes under different arrangements, and analyze the role of the trace superconducting tapes.

6. A system for regulating the dynamic resistance of a superconducting tape by a pulsed magnetic field, characterized in that: A method for measuring the dynamic resistance of a stacked high-temperature superconducting tape under a pulsed magnetic field as claimed in any one of claims 1 to 5, comprising an input module, a measurement module and an output module, wherein: The input module is used to receive the DC current source and pulse magnetic field generating device input by the user; The measurement module uses a high-precision nanovoltmeter for measurement; The output module is used to display the measurement results, including the dynamic resistance value of the superconducting tape.

7. A processor, characterized in that: The method is configured to perform the method for measuring the dynamic resistance of a stacked high temperature superconducting tape under a pulsed magnetic field according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the method for measuring the dynamic resistance of a stacked high-temperature superconducting tape under a pulsed magnetic field according to any one of claims 1 to 5 is implemented.

Images