Microwave chip test tool

Abstract

The invention discloses a microwave chip testing tool, relates to the technical field of microwave chip testing, and aims to solve the technical problem that the microwave chip testing tool has insufficient functions for a clamping instrument. A conveying assembly is arranged on the testing machine table; a basic transfer assembly is arranged on the testing machine table opposite to the output end of the conveying assembly; a plurality of auxiliary carrying tables used for conducting power-on operation on the microwave chips are arranged below the basic transfer assembly. And a clamping assembly for stably limiting the test operation of the microwave chip is arranged on the side of the auxiliary carrying table. Based on the adjustment setting of the clamping assembly, the clamping assembly has two different clamping modes to form a flexible clamping state and an elastic maintaining state, different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in a power-on test are simulated through the two different clamping modes, and the operation functionality is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave chip testing, and more specifically, to a microwave chip testing tooling. Background Art

[0002] Microwave chips are the core components of microwave radio frequency integrated circuits and play a key role in fields such as wireless communication; microwave chips are mainly used to process signals in the microwave frequency band (usually referring to 300 MHz - 300 GHz). It integrates various microwave circuit elements such as transistors, capacitors, inductors, etc. on a semiconductor chip to achieve functions such as signal generation, amplification, filtering, mixing, modulation, and demodulation. Characteristics: It has characteristics such as high frequency, high speed, high integration, and low power consumption. Since it operates in the microwave frequency band and the signal frequency is extremely high, it is required that components such as transistors inside the chip have extremely short switching times and very high electron migration speeds to achieve high-speed signal processing; at the same time, in order to meet the requirements of miniaturization and portability of modern wireless communication devices, microwave chips need to have high integration and be able to implement complex microwave circuit functions on a very small chip area; in addition, low power consumption is also one of its important characteristics to extend the usage time of battery-powered devices.

[0003] There are the following physical differences between gallium arsenide (GaAs) microwave chips and gallium nitride (GaN) microwave chips during the circuit testing process: Coefficient of thermal expansion: The coefficient of thermal expansion of gallium nitride is relatively small. When the temperature changes, it is not easy to have dimensional changes and deformations, and its performance is more stable during high and low temperature cycle tests. The coefficient of thermal expansion of gallium arsenide is relatively large, and attention should be paid to the influence of temperature changes on its structure and performance during testing.

[0004] Gallium nitride chips: Its coefficient of thermal expansion is relatively small. After circuit testing, using an elastic fixing structure can adapt to its small thermal expansion and contraction changes at different temperatures. Elastic fixing can provide a certain amount of buffering force. When the chip undergoes dimensional changes due to temperature changes, the fixing structure can elastically deform accordingly, without generating excessive stress on the chip, thereby protecting the chip from damage and at the same time ensuring the fixing effect of the chip, enabling it to remain stable during subsequent use or testing.

[0005] Gallium arsenide chips: Due to its relatively large coefficient of thermal expansion, the degree of thermal expansion and contraction is more obvious when the temperature changes. Adopting a flexible fixing method can better conform to the dimensional changes of the chip. Flexible materials or structures can deform more fully to adapt to the thermal expansion and contraction of the chip, reducing the risk of internal structural damage or performance changes of the chip caused by thermal stress, and ensuring the stability and reliability of the chip in different temperature environments.

[0006] During the simulation of power-on use for microwave chip testing, different temperatures are generated, resulting in structural limit fixation of the clamping device during use and low adaptability. The thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips are different. Although both are fixed flexibly, when the actual temperature changes, it is impossible to accurately adapt to their respective thermal expansion and contraction degrees. For example, the gallium arsenide chip has a large thermal expansion coefficient. When the temperature rises, a flexible fixing structure with a large expansion and contraction range is required to adapt. While the gallium nitride chip has a small thermal expansion coefficient. If the fixing structure is too flexible, it may not provide enough fastening force at normal or low temperatures, resulting in loose chip fixation. In the existing microwave chip testing tooling, the clamping instruments are mostly operated through fixed clamping mechanisms, which cannot effectively adapt to the different thermal expansions of gallium arsenide and gallium nitride microwave chips. In view of this, we propose a microwave chip testing tooling. Summary of the Invention

[0007] The purpose of the present invention is to provide a microwave chip testing tooling to solve the technical problem of insufficient functions of the clamping instruments in the microwave chip testing tooling.

[0008] To solve the above technical problems, the present invention provides the following technical solution: A microwave chip testing tooling includes a testing machine table; a conveying component is arranged on the testing machine table; a basic transfer component is arranged on the testing machine table at a position opposite to the output end of the conveying component; several auxiliary carriers for power-on operation of microwave chips are arranged below the basic transfer component; a clamping component for stable limit of microwave chip testing operation is arranged on the side of the auxiliary carrier; a double-axis platform is arranged at the output end of the basic transfer component; a material coding mechanism is arranged at the second movable end of the double-axis platform; a vision testing mechanism connected to the testing machine table is arranged above the material coding mechanism; wherein, the clamping component has a flexible clamping state and an elastic holding state.

[0009] Based on the adjustment setting of the clamping component, the clamping component has two different clamping methods to form a flexible clamping state and an elastic holding state. By the two different clamping methods, the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips during simulated power-on testing are realized, effectively improving the functionality of the operation.

[0010] Preferably, the basic transfer component includes a vertical seat arranged on the testing machine table; a horizontal displacement adjustment guide rail is horizontally arranged on the vertical seat; a plurality of vertical adjustment guide rails are arranged at the movable end of the horizontal displacement adjustment guide rail through a mounting block; a synchronous seat for installing and connecting with the plurality of vertical adjustment guide rails is arranged on one side of the horizontal displacement adjustment guide rail; an adsorption shaft is arranged on the synchronous seat through a plurality of downward guide rails.

[0011] Preferably, the auxiliary carrier includes a connecting seat arranged on one side of the vertical seat; the connecting seat is provided with a plurality of power-on heating test components that match the pins of the microwave chip, and a plurality of thimble cavities are formed by the gaps between the power-on heating test components and the connecting seat; a release thimble is arranged in the thimble cavity through a spring.

[0012] Preferably, the biaxial platform includes an adjustment guide rail A arranged horizontally and an adjustment guide rail B arranged longitudinally on the adjustment guide rail A; and the blanking mechanism includes a blanking table installed at the movable end of the adjustment guide rail B; conveying rollers are arranged on both sides of the blanking table; a driving motor is arranged at the input end of one of the conveying rollers, and the two conveying rollers are connected by a conveyor belt; among them, a plurality of guide columns are sequentially arranged on the blanking table at positions corresponding to the upper surface of the conveyor belt; among them, a blanking cavity is formed by the gaps between two adjacent guide columns.

[0013] Preferably, the vision test mechanism includes a test driving guide rail arranged above the conveyor belt; a vision test component is arranged at the movable end of the test driving guide rail through a driving seat.

[0014] Preferably, the clamping component includes an auxiliary connecting seat arranged on one side of the connecting seat; an adjustment movable cylinder is installed on the auxiliary connecting seat; an auxiliary block is arranged at the movable end of the adjustment movable cylinder; two adjustment slide rails are symmetrically arranged on the auxiliary block; the adjustment slide rails are arranged obliquely or horizontally; a clamping unit is arranged at the movable end of the adjustment slide rail through a mounting seat.

[0015] Preferably, the clamping unit includes a clamping base arranged at the movable end of the adjustment slide rail; sliding grooves are symmetrically formed on the clamping base; the included angle of the sliding grooves is less than or equal to ninety degrees; a driving shaft is movably inserted into the clamping base; a negative pressure suction structure is formed between the clamping base and the driving shaft; an arc-shaped buckle is arranged at the end of the driving shaft; connecting limit groove blocks are arranged on both sides of the end of the driving shaft; a rotating hook connection groove in the shape of a cylinder and a receiving adaptation groove with a width smaller than the radial diameter of the rotating hook connection groove are formed on the inner wall of the connecting limit groove block.

[0016] Preferably, the clamping unit further includes a bi-directional restoring arc-shaped spring fixed to the arc-shaped buckle; rubber blocks are arranged on both sides and at the "C"-shaped opening of the bi-directional restoring arc-shaped spring; hook connection sliding seats are fixedly arranged at both ends of the bi-directional restoring arc-shaped spring; the hook connection sliding seats are slidably matched with the sliding grooves; among them, a limit rotating shaft is arranged at the position of the hook connection sliding seat relative to the connecting limit groove block; the limit rotating shaft is composed of a central part in the shape of a rectangle and rotating parts in the shape of a fan arranged on both sides of the central column.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. Based on the adjustment settings of the clamping assembly, the present invention enables the clamping assembly to have two different clamping methods to form a flexible clamping state and an elastic holding state. By these two different clamping methods, the different coefficients of thermal expansion of gallium arsenide and gallium nitride microwave chips in the simulated power-on test are realized, effectively improving the functionality of the operation.

[0019] 2. Through the horizontal adjustment of the horizontal displacement adjustment guide rail and the lifting adjustment of the vertical adjustment guide rail, the present invention realizes the transfer of the microwave chip from the output end of the conveying assembly to the auxiliary carrier, and through sequential operations, realizes sequential operations to perform multiple simulated power-on operations on the microwave chip, reducing the single operation environment of different microwave chips in use, where the test data cannot effectively support the actual use of the microwave chip, and the operation is convenient with a simple structure.

[0020] 3. By driving the opposing approach of the adjustment slide rails, the two clamping units approach each other relatively to clamp and fix the microwave chip, reducing the slight movement and offset of the microwave chip test tooling during the test work, which may cause poor contact between the pins of the microwave chip and the power-on and temperature-rising test assembly.

[0021] 4. Through the stroke work of the drive shaft, in cooperation with the elastic restoring force of the bi-directional restoring arc spring, the bi-directional restoring arc spring and the rubber block as a whole expand as shown in Figure 7 . The flexible clamping operation of both sides of the microwave chip is carried out through two groups of bi-directional restoring arc springs and rubber blocks distributed oppositely. And this clamping method is based on the axial compression of the "C"-shaped cavity of the bi-directional restoring arc spring and the deformation of the rubber block to achieve flexible clamping, effectively adapting to the large coefficient of thermal expansion of gallium arsenide microwave chips and maintaining the adaptable clamping operation; through the return stroke work of the drive shaft, the two ends of the hooked sliding seat are driven to move centrally and rotate, and in cooperation with the arc buckle to traction and adjust the middle end of the bi-directional restoring arc spring, the bi-directional restoring arc spring and the rubber block as a whole form a "U"-shaped state. And, it enables the "U"-shaped bi-directional restoring arc spring and the rubber block at both ends to be spring-like compressed. During the rotation adjustment, the limiting rotating shaft and the accommodating and adapting groove are fitted, enabling the two hooked sliding seats to have the space required during the compression process. The bi-directional restoring arc spring elastically acts on both sides of the gallium nitride microwave chip for clamping work, and simultaneously adapts to the relatively small coefficient of thermal expansion of gallium nitride, while maintaining good clamping stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic three-dimensional structure diagram of the whole of the present invention;

[0023] Figure 2 is a schematic three-dimensional structure diagram of the whole from another perspective of the present invention;

[0024] Figure 3 For the present invention Figure 2 Schematic diagram of the enlarged partial structure at position A in the present invention;

[0025] Figure 4 Schematic diagram of the three-dimensional structure of the material coding mechanism and the vision testing mechanism of the present invention;

[0026] Figure 5 Schematic diagram of the three-dimensional structure of the auxiliary carrier and the clamping assembly of the present invention;

[0027] Figure 6 Schematic diagram of the three-dimensional structure of the release ejector pin of the present invention;

[0028] Figure 7 Schematic diagram of the three-dimensional split structure of the clamping unit of the present invention;

[0029] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged partial structure at position B in the present invention;

[0030] Figure 9 For the present invention Figure 7 Schematic diagram of the enlarged partial structure at position C in the present invention.

[0031] Explanation of the reference numerals in the figure:

[0032] 1. Testing machine platform; 2. Conveying assembly; 3. Basic transfer assembly; 4. Auxiliary carrier; 5. Clamping assembly; 6. Biaxial platform; 7. Material coding mechanism; 8. Vision testing mechanism;

[0033] 301. Upright seat; 302. Horizontal displacement adjustment guide rail; 303. Vertical adjustment guide rail; 304. Synchronization seat; 305. Downward guide rail; 306. Suction shaft;

[0034] 401. Connection seat; 402. Power-on and temperature-rising testing assembly; 403. Release ejector pin;

[0035] 501. Auxiliary connection seat; 502. Adjusting movable cylinder; 503. Auxiliary block; 504. Adjusting slide rail; 505. Clamping unit; 5051. Clamping base; 5052. Sliding groove; 5053. Driving shaft; 5054. Arc-shaped buckle; 5055. Connecting limit groove block; 5056. Rotating hook connection groove; 5057. Accommodating and adapting groove; 5058. Bi-directional restoring arc-shaped spring; 5059. Rubber block; 50510. Hook connection sliding seat; 50511. Limit rotating shaft;

[0036] 701. Material coding table; 702. Conveying roller; 703. Driving motor; 704. Guide post;

[0037] 801. Testing driving guide rail; 802. Vision testing assembly. Detailed implementation mode

[0038] As shown Figures 1 to 9 in the figure, a microwave chip testing tooling according to the present invention includes a testing machine table 1; a conveying component 2 is arranged on the testing machine table 1; a basic transfer component 3 is arranged at a position opposite to the output end of the conveying component 2 on the testing machine table 1; several auxiliary carriers 4 for energizing the microwave chip are arranged below the basic transfer component 3; a clamping component 5 for stably limiting the microwave chip during testing operation is arranged on the side of the auxiliary carrier 4; a double-axis platform 6 is arranged at the output end of the basic transfer component 3; a material coding mechanism 7 is arranged at the second movable end of the double-axis platform 6; a vision testing mechanism 8 connected to the testing machine table 1 is arranged above the material coding mechanism 7; among them, the clamping component 5 has a flexible clamping state and an elastic holding state. Based on the adjustment setting of the clamping component 5, the clamping component 5 has two different clamping methods to form a flexible clamping state and an elastic holding state, and the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips during simulated power-on testing are realized through the two different clamping methods, effectively improving the functionality of the operation.

[0039] In an embodiment of the present invention, the basic transfer component 3 includes a vertical seat 301 arranged on the testing machine table 1; a horizontal displacement adjustment guide rail 302 is arranged horizontally on the vertical seat 301; several vertical adjustment guide rails 303 are arranged at the movable end of the horizontal displacement adjustment guide rail 302 through a mounting block; a synchronous seat 304 connected to and installed with several vertical adjustment guide rails 303 is arranged on one side of the horizontal displacement adjustment guide rail 302; an adsorption shaft 306 is arranged on the synchronous seat 304 through several downward guide rails 305. In the present invention, through the horizontal adjustment of the horizontal displacement adjustment guide rail 302 and the lifting adjustment of the vertical adjustment guide rail 303, the microwave chip is transferred from the output end of the conveying component 2 to the auxiliary carrier 4, and through sequential operations, sequential operations are carried out to perform multiple simulated power-on operations on the microwave chip, reducing the single operation environment of different microwave chips in use, and the test data cannot effectively support the actual use of the microwave chip, and the operation is convenient and the structure is simple.

[0040] In an embodiment of the present invention, the auxiliary carrier 4 includes a connection seat 401 arranged on one side of the vertical seat 301; the connection seat 401 is provided with several power-on and temperature-rising test components 402 that are in line with the pins of the microwave chip, and a plurality of thimble cavities are formed in the gap between the power-on and temperature-rising test components 402 and the connection seat 401; a release thimble 403 is arranged in the thimble cavity through a spring. In the present invention, the power-on and temperature-rising test component 402 simulates the power-on operation of the microwave chip, and the spring is used to apply an upward thrust to the release thimble 403, so that the microwave chip is easy to be separated.

[0041] In an embodiment of the present invention, the biaxial platform 6 includes an adjustment guide rail A arranged horizontally and an adjustment guide rail B arranged longitudinally on the adjustment guide rail A; moreover, the material loading mechanism 7 includes a material loading table 701 installed at the movable end of the adjustment guide rail B; conveying rollers 702 are arranged on both sides of the material loading table 701; a driving motor 703 is arranged at the input end of one of the conveying rollers 702, and the two conveying rollers 702 are connected by a conveyor belt; wherein, a number of guide columns 704 are sequentially arranged on the material loading table 701 at positions corresponding to the upper surface of the conveyor belt; wherein, the gap between two adjacent guide columns 704 forms a material loading cavity. The present invention limits the two sides of the microwave chip through the material loading cavity, and cooperates with the conveying drive of the conveyor belt, so that a plurality of microwave chips are sequentially placed on the conveyor belt, facilitating the positioning test by the vision test mechanism 8.

[0042] In an embodiment of the present invention, the vision test mechanism 8 includes a test drive guide rail 801 arranged above the conveyor belt; a vision test component 802 is arranged at the movable end of the test drive guide rail 801 through a drive seat. The present invention takes pictures and compares the shapes of the microwave chips after multiple simulated power-on operations through the vision test component 802 to test the expansion condition of the microwave chips.

[0043] In an embodiment of the present invention, the clamping component 5 includes an auxiliary connection seat 501 arranged on one side of the connection seat 401; an adjustment movable cylinder 502 is installed on the auxiliary connection seat 501; an auxiliary block 503 is arranged at the movable end of the adjustment movable cylinder 502; two adjustment slide rails 504 are symmetrically arranged on the auxiliary block 503; the adjustment slide rails 504 are arranged obliquely or horizontally; the movable ends of the adjustment slide rails 504 are provided with clamping units 505 through mounting seats. The present invention drives the adjustment slide rails 504 to approach each other, so that the two clamping units 505 approach each other relatively to clamp and fix the microwave chip, reducing the situation of poor contact between the pins of the microwave chip and the power-on and temperature-rising test component 402 caused by slight movement and offset of the microwave chip testing tooling during the test work.

[0044] In an embodiment of the present invention, the clamping unit 505 includes a clamping base 5051 arranged at the movable end of the adjustment slide rail 504; symmetrically arranged sliding grooves 5052 are formed on the clamping base 5051; the included angle of the sliding grooves 5052 is less than or equal to ninety degrees; a driving shaft 5053 is movably inserted into the clamping base 5051; a negative pressure suction structure is formed between the clamping base 5051 and the driving shaft 5053; an arc-shaped buckle 5054 is arranged at the end of the driving shaft 5053; connecting limit groove blocks 5055 are arranged on both sides of the end of the driving shaft 5053; a rotating hook connection groove 5056 in the shape of a cylinder and an accommodation adaptation groove 5057 with a width smaller than the radial diameter of the rotating hook connection groove 5056 are formed on the inner wall of the connecting limit groove block 5055. In the present invention, the suction gas connection port arranged at one end of the clamping base 5051 is matched with a suction pump, and the driving shaft 5053 performs a reciprocating stroke through negative pressure and pressurization, so as to realize the adjustment of the clamping unit 505.

[0045] In an embodiment of the present invention, the clamping unit 505 further includes a bi-directional restoring arc-shaped spring 5058 fixed to the arc-shaped buckle 5054; rubber blocks 5059 are arranged on both sides and at the "C"-shaped opening of the bi-directional restoring arc-shaped spring 5058; hook connection sliding seats 50510 are fixedly arranged at both ends of the bi-directional restoring arc-shaped spring 5058; the hook connection sliding seats 50510 are slidably matched with the sliding grooves 5052; wherein, a limit rotating shaft 50511 is arranged at the position of the hook connection sliding seat 50510 relative to the connecting limit groove block 5055; the limit rotating shaft 50511 is composed of a central part in a rectangular structure and rotating parts in a fan-shaped structure arranged on both sides of the central column. In the present invention, through the stroke work of the driving shaft 5053 and the elastic restoring force of the bi-directional restoring arc-shaped spring 5058, the whole of the bi-directional restoring arc-shaped spring 5058 and the rubber block 5059 is caused to be like Figure 7Expand as shown, and perform a clamping operation on both sides of the microwave chip in a flexible clamping state through two sets of oppositely distributed bi-directional complex force arc springs 5058 and rubber blocks 5059. This clamping method is based on the axial compression of the "C" - shaped cavity of the bi-directional complex force arc spring 5058 and the deformation of the rubber block 5059 to achieve flexible clamping, effectively adapting to the large coefficient of thermal expansion of the gallium arsenide microwave chip and maintaining an adaptable clamping operation; by the return operation of the drive shaft 5053, drive the two ends of the hook - connected sliding seat 50510 to move centrally and rotate for adjustment, and cooperate with the arc buckle 5054 to traction - adjust the middle end of the bi-directional complex force arc spring 5058, causing the bi-directional complex force arc spring 5058 and the rubber block 5059 to form a "U" - shaped state as a whole. Moreover, the "U" - shaped state formed can perform spring - like compression at both ends of the bi-directional complex force arc spring 5058 and the rubber block 5059. During the rotation adjustment process, the limit rotation shaft 50511 and the accommodation and adaptation groove 5057 are fitted, enabling the two hook - connected sliding seats 50510 to have the space required during the compression process. Clamp both sides of the gallium nitride microwave chip through the elastic force of the bi-directional complex force arc spring 5058, and simultaneously adapt to the relatively small coefficient of thermal expansion of gallium nitride while maintaining good clamping stability.

[0046] Working principle: This embodiment provides a microwave chip testing tooling, and the using steps are as follows:

[0047] S100, Loading process: Manually or mechanically place the microwave chip on the conveying component 2 for sequential conveying;

[0048] S200, Clamping process: Through the horizontal adjustment of the horizontal displacement adjustment guide rail 302 and the lifting adjustment of the vertical adjustment guide rail 303, cause the adsorption shaft 306 to perform negative pressure adsorption on the microwave chip located on the conveying component 2, and place the microwave chip on the power - on and temperature - rising test component 402 in cooperation with the horizontal displacement adjustment guide rail 302 and the vertical adjustment guide rail 303;

[0049] S300, Adjustment process:

[0050] If the adjustment process for clamping the gallium arsenide microwave chip: Through the pumping of the suction pump, cause the drive shaft 5053 to perform a stroke motion, and cooperate with the elastic restoring force of the bi-directional complex force arc spring 5058, causing the bi-directional complex force arc spring 5058 and the rubber block 5059 to expand as a whole. This clamping method utilizes the axial compression of the "C" - shaped cavity of the bi-directional complex force arc spring 5058 and the deformation of the rubber block 5059 to achieve flexible clamping;

[0051] If the gallium nitride microwave chip is clamped and adjusted: The suction pump is used to suck, so that the drive shaft 5053 moves back to drive the two ends of the hook-connected sliding seat 50510 to move centrically and rotate, and cooperate with the arc buckle 5054 to adjust the traction of the middle end of the bi-directional restoring arc spring 5058, so that the bi-directional restoring arc spring 5058 and the rubber block 5059 as a whole form a "U" shape, and, make the "U" shape formed can be spring-compressed at both ends of the bi-directional restoring arc spring 5058 and the rubber block 5059;

[0052] S400. Clamp the two sides of the microwave chip in an adapted state by moving the two sets of adjustment slide rails 504 relatively closer to maintain stability during the test;

[0053] S500. Simulation test process: The energized heating test component 402 is caused to work through an adapted on-off circuit to simulate the operation of the microwave chip;

[0054] S600. Stacking process: The adsorption shaft 306 is used to negatively adsorb the microwave chip located on the conveying component 2 through the horizontal displacement adjustment guide rail 302 for horizontal adjustment and the lifting adjustment of the vertical adjustment guide rail 303, and cooperate with the horizontal displacement adjustment guide rail 302 and the vertical adjustment guide rail 303 to place the microwave chip on the conveyor belt after multiple simulated power-on uses. The conveyor belt is driven by the drive motor 703 to adjust the displacement, and multiple microwave chips are stacked;

[0055] S700. Visual test: The shape of the microwave chip after multiple simulated power-on operations is photographed and compared through the visual test component 802 to test the expansion condition of the microwave chip.

[0056] The embodiments disclosed in the present invention are preferred embodiments, but not limited thereto. Those of ordinary skill in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. As long as they do not depart from the spirit of the present invention, they are within the protection scope of the present invention.

Claims

1. A microwave chip testing tool, characterized in that: The test machine (1) comprises a test platform (1); a conveying component (2) is arranged on the test platform (1); a basic transfer component (3) is arranged on the test platform (1) at a position relative to the output end of the conveying component (2); A plurality of auxiliary carriers (4) for energizing the microwave chips are arranged below the basic transport assembly (3); A clamping assembly (5) for stably limiting the position of the microwave chip test operation is arranged on the side of the auxiliary carrier (4); The output end of the basic transfer component (3) is provided with a double-axis platform (6); the second movable end of the double-axis platform (6) is provided with a coding mechanism (7); and a visual testing mechanism (8) connected to the testing machine (1) is provided above the coding mechanism (7); Wherein, the clamping assembly (5) has a flexible clamping state and an elastic holding state.

2. A microwave chip testing tool according to claim 1, characterized in that: The basic transfer assembly (3) comprises a stand (301) arranged on the test machine (1); a horizontal displacement adjustment guide rail (302) is horizontally arranged on the stand (301); a plurality of vertical adjustment guide rails (303) are arranged at the movable end of the horizontal displacement adjustment guide rail (302) through a mounting block; a synchronous seat (304) is arranged on one side of the horizontal displacement adjustment guide rail (302) and is mounted and connected to the plurality of vertical adjustment guide rails (303); and an adsorption shaft (306) is arranged on the synchronous seat (304) through a plurality of descending guide rails (305).

3. A microwave chip testing tool according to claim 2, characterized in that: The auxiliary carrier (4) comprises a connecting seat (401) arranged on one side of the standing seat (301); the connecting seat (401) is provided with a plurality of power-on temperature rise test components (402) that match the pins of the microwave chip, and the gap between the power-on temperature rise test components (402) and the connecting seat (401) forms a plurality of ejector cavities; and a loose ejector (403) is provided in the ejector cavity via a spring.

4. A microwave chip testing tool according to claim 3, characterized in that: The dual-axis platform (6) includes an adjustment guide rail A arranged in a transverse direction and an adjustment guide rail B arranged in a longitudinal direction on the adjustment guide rail A; and the coding mechanism (7) includes a coding platform (701) installed at the movable end of the adjustment guide rail B; conveying rollers (702) are arranged on both sides of the coding platform (701); a driving motor (703) is arranged at the input end of one of the conveying rollers (702), and the two conveying rollers (702) are connected through a conveyor belt transmission; wherein, a plurality of guide columns (704) are sequentially arranged on the coding platform (701) relative to the upper surface of the conveyor belt; wherein, the gap between two adjacent guide columns (704) constitutes a coding cavity.

5. A microwave chip testing tool according to claim 4, characterized in that: The visual testing mechanism (8) comprises a testing driving guide rail (801) arranged above the conveyor belt; a visual testing assembly (802) is provided at a movable end of the testing driving guide rail (801) via a driving seat.

6. A microwave chip testing tool according to claim 5, characterized in that: The clamping assembly (5) comprises an auxiliary connecting seat (501) arranged on one side of the connecting seat (401); an adjustable movable cylinder (502) is installed on the auxiliary connecting seat (501); an auxiliary block (503) is arranged at the movable end of the adjustable movable cylinder (502); two adjustable slide rails (504) are symmetrically arranged on the auxiliary block (503); the adjustable slide rails (504) are arranged inclined or horizontally; and a clamping unit (505) is arranged at the movable end of the adjustable slide rail (504) through a mounting seat.

7. A microwave chip testing tool according to claim 6, characterized in that: The clamping unit (505) comprises a clamping base (5051) arranged at the movable end of the adjusting slide rail (504); the clamping base (5051) is symmetrically provided with sliding grooves (5052); the included angle of the sliding grooves (5052) is less than or equal to ninety degrees; A driving shaft (5053) is movably provided in the clamping base (5051); a negative pressure suction structure is formed between the clamping base (5051) and the driving shaft (5053); The end of the driving shaft (5053) is provided with an arc-shaped buckle (5054); connecting limit slot blocks (5055) are provided on both sides of the end of the driving shaft (5053); The inner wall of the connection limiting groove block (5055) is provided with a rotating hooking groove (5056) in a cylindrical structure and an accommodating adapting groove (5057) whose width is smaller than the radial diameter of the rotating hooking groove (5056).

8. A microwave chip testing tool according to claim 7, characterized in that: The clamping unit (505) further comprises a bidirectional compound force arc spring (5058) fixed on the arc buckle (5054); rubber blocks (5059) are arranged on both sides of the bidirectional compound force arc spring (5058) and at the "C"-shaped opening; hook-connecting sliding seats (50510) are fixedly arranged at both ends of the bidirectional compound force arc spring (5058); the hook-connecting sliding seat (50510) is slidably matched with the sliding groove (5052); The hook-connecting sliding seat (50510) is provided with a limited rotation axis (50511) relative to the connection limit slot block (5055); the limited rotation axis (50511) is composed of a central portion of a rectangular structure and a rotating portion of a fan-shaped structure arranged on both sides of the central column.

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