Gallium arsenide wafer surface cleaning device

Abstract

The utility model discloses a gallium arsenide wafer surface cleaning device which comprises a bottom plate, supporting columns are fixedly connected to the periphery of the top of the bottom plate, a cleaning box is fixedly connected to the tops of the supporting columns, a driving motor is fixedly installed on the right side of the cleaning box, and the output end of the driving motor is fixedly connected with a supporting frame. Damping springs are fixedly connected to the two sides of the front end and the rear end of the inner surface of the supporting frame. According to the gallium arsenide wafer cleaning device, the pull rod is pulled, the pull rod drives the limiting plate to move towards one end, meanwhile, the damping spring is extruded, a gallium arsenide wafer needing to be cleaned is placed at one end of the limiting plate, the limiting plate is loosened, the structure is reset through the characteristics of the damping spring, and the supporting frame and the gallium arsenide wafer are driven by the driving motor to rotate. The water pump sprays water on the surface of the gallium arsenide wafer under the cooperation of the second pipeline and the first pipeline, automatic overturning is achieved, the water and the gallium arsenide wafer are in all-directional contact, time and labor are saved, the cleaning time is shortened, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, and more specifically, to a surface cleaning device for gallium arsenide wafers. Background Technique

[0002] Semiconductor devices made of gallium arsenide have the advantages of good high-frequency, high-temperature, low-temperature performance, low noise, and strong radiation resistance. Gallium arsenide is a material with multiple advantages among semiconductor materials. During the production process of gallium arsenide wafers, a large amount of impurities will adhere to the surface. After production, it is necessary to clean its surface.

[0003] Currently, when cleaning gallium arsenide wafers, the gallium arsenide wafers are usually directly placed in the inner cavity of the cleaning tank. Through the cooperation of the water pump in the second pipeline and the first pipeline, water is sprayed on the surface of the gallium arsenide wafers for cleaning. However, in the actual operation process, only a single surface can be cleaned. When it is necessary to clean the other surface, the user needs to manually flip it, which is time-consuming and laborious, increasing the labor intensity of the user. At the same time, it increases the cleaning time of the gallium arsenide wafers and reduces the cleaning work efficiency.

[0004] Therefore, we provide a surface cleaning device for gallium arsenide wafers. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide a surface cleaning device for gallium arsenide wafers. Pull the pull rod, drive the limit plate to move towards one end through the pull rod, and at the same time squeeze the damping spring. Place the gallium arsenide wafer to be cleaned at one end of the limit plate, release the limit plate, and use the characteristics of the damping spring to reset the structure. Drive the support frame and the gallium arsenide wafer to rotate through the drive motor. The water pump sprays water on the surface of the gallium arsenide wafer through the cooperation of the second pipeline and the first pipeline, realizing automatic flipping, enabling the water and the gallium arsenide wafer to be in full contact, saving time and effort, reducing the cleaning time, and improving the cleaning efficiency, so as to solve the problems raised in the above background technique.

[0007] (2) Technical Solutions

[0008] To achieve the above object, the present utility model provides the following technical solutions. The technical solutions adopted by a gallium arsenide wafer surface cleaning device are as follows: It includes a bottom plate. Support columns are fixedly connected to the four peripheries of the top of the bottom plate. A cleaning box is fixedly connected to the top of the support columns. A driving motor is fixedly installed on the right side of the cleaning box. A support frame is fixedly connected to the output end of the driving motor. Damping springs are fixedly connected to both sides of the front and rear inner surfaces of the support frame. A limiting plate is fixedly connected to one end of the damping spring, and a pull rod is fixedly connected to the other end of the damping spring. A delivery pipe is fixedly connected to the bottom of the cleaning box. A connection box is fixedly connected to the bottom of the delivery pipe. A water pump is fixedly installed on the back of the connection box. A second pipe is fixedly connected to the input end of the water pump, and a first pipe is fixedly connected to the output end of the water pump.

[0009] As a preferred solution, a first filter plate is fixedly connected to the upper end of the inner cavity of the connection box, and a second filter plate is fixedly connected to the lower end of the inner cavity of the connection box.

[0010] Optionally, during the cleaning process, water falls to the bottom of the inner cavity of the cleaning box and is conveyed to the inner cavity of the connection box through the delivery pipe. During the process of the water falling in the inner cavity of the connection box, it comes into contact with the first filter plate and the second filter plate. Through the cooperation of the first filter plate and the second filter plate, impurities in the water are adsorbed and blocked, achieving the purpose of filtration, improving the cleanliness of the water, eliminating the need to replace the water multiple times, and reducing the cost required for cleaning.

[0011] As a preferred solution, hot air blowers are fixedly installed on both the front and rear of the left side of the cleaning box, and a connection pipe is fixedly connected to the output end of the hot air blower.

[0012] Optionally, after the cleaning is completed, the user starts the hot air blower to work. Through the cooperation of the hot air blower and the connection pipe, hot air is conveyed into the inner cavity of the cleaning box and comes into contact with the cleaned gallium arsenide wafer to perform the drying work. There is no need for natural air drying, the drying speed is fast, and the overall efficiency of the cleaning work is improved.

[0013] As a preferred solution, support blocks are fixedly connected to the four peripheries of the bottom of the bottom plate, and the support blocks are rubber blocks.

[0014] Optionally, through the setting of the support blocks, the overall device is effectively supported.

[0015] As a preferred solution, a drain pipe is fixedly connected to the bottom of the right side of the connection box, and an electromagnetic valve is arranged at the top of the drain pipe.

[0016] Optionally, through the setting of the electromagnetic valve and the drain pipe, it is convenient for the user to discharge the cleaning water.

[0017] As a preferred solution, mounting blocks are fixedly connected to the upper and lower ends on both sides of the inner cavity of the connection box, and the first filter plate, the second filter plate and the mounting blocks are fixedly connected by mounting bolts.

[0018] Optionally, through the settings of the mounting bolts and the mounting blocks, it is convenient for users to install the first filter plate and the second filter plate.

[0019] (III) Beneficial effects

[0020] Compared with the prior art, the present utility model provides a surface cleaning device for gallium arsenide wafers, which has the following beneficial effects.

[0021] 1. In the present utility model, the pull rod is pulled, the limiting plate is driven by the pull rod to move towards one end, and at the same time, the damping spring is compressed. The gallium arsenide wafer to be cleaned is placed at one end of the limiting plate, the limiting plate is released, and the structure is reset by using the characteristics of the damping spring. The driving motor drives the support frame and the gallium arsenide wafer to rotate. The water pump sprays water on the surface of the gallium arsenide wafer in cooperation with the second pipeline and the first pipeline, realizing automatic flipping, enabling all-round contact between the water and the gallium arsenide wafer, saving time and effort, reducing the cleaning duration, and improving the cleaning efficiency.

[0022] 2. During the cleaning process, the water falls to the bottom of the inner cavity of the cleaning box and is conveyed to the inner cavity of the connection box through the conveying pipe. During the falling process of the water in the inner cavity of the connection box, it comes into contact with the first filter plate and the second filter plate. Through the cooperation of the first filter plate and the second filter plate, the impurities in the water are adsorbed and blocked, achieving the purpose of filtration, improving the cleanliness of the water, eliminating the need for multiple water replacements, and reducing the cleaning cost.

[0023] 3. After the cleaning is completed, the user starts the hot air blower to work. Through the cooperation of the hot air blower and the connecting pipe, hot air is conveyed into the inner cavity of the cleaning box and contacts the cleaned gallium arsenide wafer to dry it. There is no need for natural air drying, the drying speed is fast, and the overall efficiency of the cleaning work is improved. Description of the drawings

[0024] Figure 1 is a schematic structural diagram of the present utility model;

[0025] Figure 2 is a cross-sectional view of the connection box of the present utility model;

[0026] Figure 3 is a rear view of the cleaning box of the present utility model.

[0027] In the figure: 1, support frame; 2, limit plate; 3, damping spring; 4, cleaning tank; 5, drive motor; 6, support column; 7, bottom plate; 8, support block; 9, connecting pipe; 10, hot air blower; 11, mounting bolt; 12, mounting block; 13, conveying pipe; 14, electromagnetic valve; 15, drain pipe; 16, first filter plate; 17, second filter plate; 18, connecting box; 19, first pipe; 20, second pipe; 21, water pump; 22, pull rod. Detailed implementation manners

[0028] The following further describes in detail the implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0029] Please refer to Figures 1-3 , and the following further illustrates the embodiments of the present utility model in conjunction with the accompanying drawings.

[0030] Embodiment

[0031] The technical solution adopted by a gallium arsenide wafer surface cleaning device is as follows: It includes a bottom plate 7. Support columns 6 are fixedly connected to the four sides of the top of the bottom plate 7. The top of the support column 6 is fixedly connected to a cleaning tank 4. A drive motor 5 is fixedly installed on the right side of the cleaning tank 4. The output end of the drive motor 5 is fixedly connected to a support frame 1. Damping springs 3 are fixedly connected to both sides of the front end and the rear end of the inner surface of the support frame 1. One end of the damping spring 3 is fixedly connected to a limit plate 2, and the other ends of the damping springs 3 are fixedly connected to a pull rod 22. A conveying pipe 13 is fixedly connected to the bottom of the cleaning tank 4. The bottom of the conveying pipe 13 is fixedly connected to a connecting box 18. A water pump 21 is fixedly installed on the back of the connecting box 18. The input end of the water pump 21 is fixedly connected to a second pipe 20, and the output end of the water pump 21 is fixedly connected to a first pipe 19.

[0032] Specifically: When it is necessary to clean the gallium arsenide wafer, the user pulls the pull rod 22, drives the limit plate 2 to move to one end through the pull rod 22, and simultaneously squeezes the damping spring 3. After the squeezing is completed, the user places the gallium arsenide wafer to be cleaned at one end of the limit plate 2. After the placement is completed, the user releases the limit plate 2, and uses the characteristics of the damping spring 3 to reset the structure to limit the gallium arsenide wafer, avoiding the gallium arsenide wafer from falling during the automatic flipping process. After the limiting is completed, the user starts the drive motor 5 to work, drives the support frame 1 to rotate in the clockwise direction through the drive motor 5, and drives the gallium arsenide wafer to rotate through the support frame 1. During the continuous flipping process, the user starts the water pump 21 to work. Through the cooperation of the water pump 21 with the second pipe 20 and the first pipe 19, water is sprayed on the surface of the gallium arsenide wafer, realizing automatic flipping, enabling the water and the gallium arsenide wafer to be in full contact, saving time and effort, reducing the cleaning duration, and improving the cleaning efficiency.

[0033] A first filter plate 16 is fixedly connected to the upper end of the inner cavity of the connection box 18, and a second filter plate 17 is fixedly connected to the lower end of the inner cavity of the connection box 18. Hot air blowers 10 are fixedly installed at the front end and the rear end on the left side of the cleaning box 4. The output end of the hot air blower 10 is fixedly connected to a connecting pipe 9. Support blocks 8 are fixedly connected to the four peripheries of the bottom of the bottom plate 7, and the support blocks 8 are rubber blocks. A drain pipe 15 is fixedly connected to the bottom on the right side of the connection box 18. An electromagnetic valve 14 is arranged at the top of the drain pipe 15. Mounting blocks 12 are fixedly connected to the upper and lower ends on both sides of the inner cavity of the connection box 18. The first filter plate 16, the second filter plate 17 and the mounting blocks 12 are fixedly connected through mounting bolts 11.

[0034] Specifically: During the cleaning process, water falls to the bottom of the inner cavity of the cleaning box 4 and is conveyed to the inner cavity of the connection box 18 through the conveying pipe 13. During the process of the water falling in the inner cavity of the connection box 18, it comes into contact with the first filter plate 16 and the second filter plate 17. Through the cooperation of the first filter plate 16 and the second filter plate 17, impurities in the water are adsorbed and blocked, achieving the purpose of filtration, improving the cleanliness of the water, eliminating the need for multiple water replacements, and reducing the cost required for cleaning. After the cleaning is completed, the user starts the hot air blower 10 to work. Through the cooperation of the hot air blower 10 and the connecting pipe 9, hot air is conveyed to the inner cavity of the cleaning box 4 and contacts the cleaned gallium arsenide wafer to dry it. There is no need for natural air drying, the drying speed is fast, and the overall efficiency of the cleaning work is improved. Through the setting of the support blocks 8, the whole device is effectively supported, and at the same time, the purpose of anti-slip is achieved, greatly improving the overall stability of the device. The user starts the electromagnetic valve 14 to work. Through the cooperation of the electromagnetic valve 14 and the drain pipe 15, it is convenient for the user to discharge the cleaning water. The user inserts the first filter plate 16 and the second filter plate 17 into the inner cavity of the mounting block 12. After the insertion is completed, the user turns the mounting bolt 11 with the aid of external tools and screws the mounting bolt 11 into the inner cavities of the first filter plate 16, the second filter plate 17 and the mounting block 12, and then the installation work of the first filter plate 16 and the second filter plate 17 can be completed. The operation steps are simple, achieving the purpose of quick installation.

[0035] The working principle of the present utility model is as follows: When it is necessary to clean a gallium arsenide wafer, the user pulls the pull rod 22, drives the limit plate 2 to move towards one end through the pull rod 22, and simultaneously squeezes the damping spring 3. After the squeezing is completed, the user places the gallium arsenide wafer to be cleaned at one end of the limit plate 2. After the placement is completed, the user releases the limit plate 2, and uses the characteristics of the damping spring 3 to reset the structure, limit the gallium arsenide wafer, and avoid the gallium arsenide wafer from falling during the automatic flipping process. After the limiting is completed, the user starts the driving motor 5 to work, drives the support frame 1 to rotate clockwise through the driving motor 5, and drives the gallium arsenide wafer to rotate through the support frame 1. During the continuous flipping process, the user starts the water pump 21 to work, and sprays water on the surface of the gallium arsenide wafer through the cooperation of the water pump 21 with the second pipeline 20 and the first pipeline 19, realizing automatic flipping, enabling the water and the gallium arsenide wafer to be in full contact, saving time and effort, reducing the cleaning duration, and improving the cleaning efficiency. During the cleaning process, the water falls to the bottom of the inner cavity of the cleaning tank 4 and is conveyed to the inner cavity of the connection box 18 through the conveying pipe 13. During the falling process of the water in the inner cavity of the connection box 18, it contacts the first filter plate 16 and the second filter plate 17, and adsorbs and blocks the impurities in the water through the cooperation of the first filter plate 16 and the second filter plate 17, achieving the purpose of filtration, improving the cleanliness of the water, eliminating the need for multiple water replacements, and reducing the cost required for cleaning. After the cleaning is completed, the user starts the hot air blower 10 to work, and conveys hot air to the inner cavity of the cleaning tank 4 through the cooperation of the hot air blower 10 with the connecting pipe 9, and dries the cleaned gallium arsenide wafer, eliminating the need for natural air drying, with a fast drying speed, and improving the overall efficiency of the cleaning work.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. A gallium arsenide wafer surface cleaning device, comprising a bottom plate (7), characterized in that: The top of the bottom plate (7) is fixedly connected with support columns (6) on all sides, the top of the support columns (6) is fixedly connected with a cleaning box (4), the right side of the cleaning box (4) is fixedly installed with a driving motor (5), the output end of the driving motor (5) is fixedly connected with a supporting frame (1), the front end and the rear end of the inner surface of the supporting frame (1) are fixedly connected with damping springs (3), one end of the damping spring (3) is fixedly connected to a limiting plate (2), and the other end of the damping spring (3) is fixedly connected with a pull rod (22), the bottom of the cleaning box (4) is fixedly connected with a delivery pipe (13), the bottom of the delivery pipe (13) is fixedly connected with a connecting box (18), the back of the connecting box (18) is fixedly installed with a water pump (21), the input end of the water pump (21) is fixedly connected with a second pipeline (20), and the output end of the water pump (21) is fixedly connected with a first pipeline (19).

2. The gallium arsenide wafer surface cleaning device according to claim 1, characterized in that: The upper end of the inner cavity of the connection box (18) is fixedly connected to a first filter plate (16), and the lower end of the inner cavity of the connection box (18) is fixedly connected to a second filter plate (17).

3. The gallium arsenide wafer surface cleaning device according to claim 1, characterized in that: A hot air blower (10) is fixedly installed at the front and rear ends of the left side of the cleaning box (4), and a connecting pipe (9) is fixedly connected to the output end of the hot air blower (10).

4. The gallium arsenide wafer surface cleaning device according to claim 1, characterized in that: The bottom of the base plate (7) is fixedly connected with support blocks (8) on all sides, and the support blocks (8) are rubber blocks.

5. The gallium arsenide wafer surface cleaning device according to claim 1, characterized in that: A drainage pipe (15) is fixedly connected to the bottom of the right side of the connection box (18), and an electromagnetic valve (14) is arranged on the top of the drainage pipe (15).

6. The gallium arsenide wafer surface cleaning device according to claim 2, characterized in that: The upper and lower ends of both sides of the inner cavity of the connection box (18) are fixedly connected with mounting blocks (12), and the first filter plate (16), the second filter plate (17) and the mounting blocks (12) are fixedly connected by mounting bolts (11).

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