Inductor and preparation method thereof

Abstract

The invention provides an inductor and a preparation method thereof. The preparation method comprises the following steps: preparing a conductor; preparing a first magnet, wherein a convex column and a containing groove surrounding the periphery of the convex column are arranged on one side of the first magnet; placing the first magnet in a hot-pressing die, and then placing the conductor in the hot-pressing die to be assembled with the first magnet to obtain an assembly; preparing a second magnet, placing the second magnet in a hot-pressing mold, and performing hot-pressing molding on the second magnet and the assembly; removing the hot-pressing mold to obtain an initial inductor; the conductor is located in the accommodating groove, and a first pin and a second pin of the conductor are exposed out of the initial inductor; preparing an insulating layer on the surface of the initial inductor; the insulating layers at the first pin and the second pin are subjected to paint stripping, so that the insulating layers are exposed; and preparing electroplated layers at the first pin and the second pin to obtain the inductor. Compared with the prior art, the manufacturing method is simple, the inductor can be formed at a time, the input cost is low, the inductor manufactured through the method is simple in structure, the application form of multiple electrodes and multiple combinations can be formed, and space is saved.

Description

Technical Field

[0001] The present invention relates to an inductor and a preparation method thereof, belonging to the technical field of inductors. Background Art

[0002] With the development of AI technology, there are more and more application demands for inductors with low voltage, large current, and low DC resistance in the market. For the preparation of integrated inductors, the traditional winding method is used, the wire diameter will be very thick, and it is difficult to wind and bend, and the program steps are cumbersome when preparing multi-electrode inductors. In addition, the inductor prepared by the winding method has a complex structure, the multi-electrode inductor occupies a large space, and the cost increases. When preparing, the multi-electrodes of the inductor cannot be formed at one time, and in the case of multi-combination application forms, the flexibility of inductor preparation is poor.

[0003] In view of this, it is necessary to improve the existing inductor and its preparation method to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a preparation method of an inductor, which has simple steps, can form an inductor at one time, has a low input cost, and the inductor prepared by this method has a simple structure, can form multi-electrodes, and has a multi-combination application form, saving space.

[0005] To achieve the above purpose, the present invention provides a preparation method of an inductor, including:

[0006] S1, preparing a conductor, the conductor has a first pin and a second pin which are electrically connected;

[0007] S2, preparing a first magnet, one side of the first magnet is provided with a convex column and a receiving groove surrounding the outer periphery of the convex column;

[0008] S3, placing the first magnet in a hot pressing mold, and then placing the conductor into the hot pressing mold to assemble with the first magnet to obtain an assembly;

[0009] S4, preparing a second magnet, and placing the second magnet in the hot pressing mold to be hot-pressed and formed together with the assembly;

[0010] S5, removing the hot pressing mold to obtain an initial inductor; wherein, the conductor is located in the receiving groove, and the first pin and the second pin are both exposed outside the initial inductor;

[0011] S6, performing a rolling spray treatment on the surface of the initial inductor to prepare an insulating layer;

[0012] S7, stripping the paint on the insulating layer at the first pin and the second pin to expose the first pin and the second pin;

[0013] At the first pin and the second pin, electroplating treatment is performed to prepare an electroplated layer, thereby obtaining an inductor.

[0014] Optionally, the method for preparing the conductor in step S1 includes: copper sheet stamping and copper sheet cutting.

[0015] Optionally, the specific steps for preparing the first magnet in step S2 are: filling a micro-nano composite soft magnetic material in a first magnet mold and cold pressing to obtain the first magnet; the specific steps for preparing the second magnet in step S4 are: filling a micro-nano composite soft magnetic material in a second magnet mold and cold pressing to obtain the second magnet.

[0016] Optionally, in step S3, the assembly is formed by assembling one first magnet and one conductor, or the assembly is formed by alternately assembling a plurality of first magnets and a plurality of conductors.

[0017] Another object of the present invention is to provide an inductor prepared by using the above preparation method.

[0018] To achieve the above object, the present invention provides an inductor prepared by using the above preparation method, and the inductor includes:

[0019] A conductor having a first pin and a second pin that are electrically connected;

[0020] A first magnet, on one side of which there is a convex post and a receiving groove surrounding the outer periphery of the convex post, the conductor is received in the receiving groove, and the first pin and the second pin are exposed outside the receiving groove;

[0021] A second magnet, which is in contact and cooperation with the first magnet and covers the receiving groove, and the conductor is located between the first magnet and the second magnet.

[0022] Optionally, the conductor further includes a main body portion connecting the first pin and the second pin, the main body portion is arranged in an n shape, the first pin and the second pin are respectively located at both ends of the main body portion and extend away from each other, and the main body portion is received in the receiving groove.

[0023] Optionally, the first magnet has a bottom surface and a top surface that are oppositely arranged, and a first side surface connecting the bottom surface and the top surface, the receiving groove is recessed from the top surface towards the bottom surface and penetrates the first side surface, and both the first pin and the second pin are exposed outside the first side surface.

[0024] Optionally, there is one first magnet, the conductor is located in the receiving groove, and the second magnet is in contact and cooperation with the top surface of the first magnet.

[0025] Optionally, the second magnet has the same structure as the first magnet, the top surfaces of the first magnet and the second magnet are in contact with each other, the two convex columns are in contact with each other, and the two receiving grooves communicate with each other to jointly receive the conductor.

[0026] Optionally, a plurality of the first magnets are stacked, the bottom surface of one of the first magnets is in contact and cooperation with the top surface of the adjacent first magnet, the conductor is disposed in the receiving groove of each first magnet, and the second magnet is in contact and cooperation with the top surface of the topmost first magnet.

[0027] The beneficial effects of the present invention are as follows: By preparing a conductor, a first magnet, and a second magnet, with a convex column provided on one side of the first magnet and a receiving groove surrounding the outer periphery of the convex column, and the conductor being located in the receiving groove, the second magnet is hot-pressed with the assembly formed by the first magnet and the conductor to form an initial inductor, and then an inductor is obtained by preparing an insulating layer and an electroplated layer. The preparation method of the present invention is simple, can form an inductor in one step, has a low input cost, and the inductor prepared by this method has a simple structure, can form multiple electrodes and multiple combinations of application forms, and saves space. Description of the Drawings

[0028] Figure 1 is a flowchart of the preparation method of the inductor of the present invention.

[0029] Figure 2 is a schematic perspective view of the first embodiment of the inductor of the present invention.

[0030] Figure 3 is an assembly drawing of the conductor, the first magnet, and the second magnet in the first embodiment of the inductor of the present invention.

[0031] Figure 4 is Figure 3 a schematic perspective view of the conductor in

[0032] Figure 5 is Figure 3 a schematic perspective view of the first magnet in

[0033] Figure 6 is Figure 3 a schematic perspective view of the second magnet in

[0034] Figure 7 is an assembly drawing of the conductor, the first magnet, and the second magnet in the second embodiment of the inductor of the present invention.

[0035] Figure 8 is a schematic perspective view of the third embodiment of the inductor of the present invention.

[0036] Figure 9It is an assembly diagram of a conductor, a first magnet, and a second magnet in the third embodiment of the inductor of the present invention.

[0037] Figure 10 It is another schematic three-dimensional structure diagram in the third embodiment of the inductor of the present invention.

[0038] Figure 11 It is Figure 2 a schematic diagram of the insulating layer in

[0039] Figure 12 It is Figure 2 a schematic diagram of the insulating layer and the electroplated layer in

[0040] Figure 13 It is Figure 8 a schematic diagram of the insulating layer and the electroplated layer in Detailed implementation manners

[0041] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Please refer to Figure 1 and in combination with Figures 2 - 13 as shown, the present invention discloses a method for manufacturing an inductor, including:

[0043] S1. Prepare a conductor 10. The conductor is prepared by either stamping a copper sheet or cutting a copper sheet. The conductor 10 has a first pin 11 and a second pin 12 that are electrically connected. In this embodiment, the first pin 11 and the second pin 12 are the electrodes of the inductor 100. The conductor 10 further includes a main body portion 13 that connects the first pin 11 and the second pin 12. The main body portion 13 is arranged in an n shape. The first pin 11 and the second pin 12 are respectively located at both ends of the main body portion 13 and extend away from each other. The corners of the conductor 10 are also ground to form an arc transition surface 14, and the corner radius is approximately 0.5 - 0.8 mm. In this embodiment, the copper sheet mainly includes oxygen-free copper, high-purity copper, single-crystal copper, high-strength high-conductivity copper alloy, copper-based composite materials, etc.

[0044] S2. Prepare a first magnet 21. One side of the first magnet 21 is provided with a convex post 211 and a receiving groove 212 surrounding the convex post 211; a micro-nano composite soft magnetic material is filled in the first magnet mold, and the first magnet 21 is obtained by cold pressing. The micro-nano composite soft magnetic material has multiple characteristics such as low loss, high magnetic permeability, high saturation, and high temperature resistance. The specific parameter requirements for this cold pressing are: at room temperature, the unit pressure is controlled at 5t - 6t, preferably 5.5t. The pressing time is approximately 2 seconds. The first magnet 21 is arranged in an E shape.

[0045] S3. Place the first magnet 21 into a hot pressing mold, and then place the conductor 10 into the hot pressing mold to assemble with the first magnet 21, obtaining an assembly. In this embodiment, the first magnet 21 and the conductor 10 can be accurately placed into the hot pressing mold respectively through a first magnet filler and a conductor filler in combination with a vision mechanism, and the main body portion 13 of the conductor 10 is located within the receiving groove 212 of the first magnet 21, with the first lead 11 and the second lead 12 exposed outside the receiving groove 212.

[0046] S4. Prepare the second magnet 22. Fill a micro-nano composite soft magnetic material into a second magnet mold, and obtain the second magnet 22 through cold pressing. The parameter requirements for this cold pressing are the same as those for preparing the first magnet 21. The second magnet 22 is accurately placed into the hot pressing mold through a second magnet filler and a vision mechanism, and is hot pressed and formed together with the assembly. The parameter requirements for this hot pressing and forming are: the temperature is controlled at 190 °C, the unit pressure is controlled at 5t - 6t, and the pressing and forming time is approximately 100 seconds. During the hot pressing process, the first magnet 21 and the second magnet 22 will be compressed, and the distance between the conductor 10 and the first magnet 21 and the second magnet 22 will continuously decrease until they are in complete contact.

[0047] S5. Remove the hot pressing mold to obtain an initial inductor. Both the first lead 11 and the second lead 12 are exposed outside the initial inductor. The first magnet 21 and the second magnet 22 form a magnet housing 20, and both the first lead 11 and the second lead 12 are exposed outside the surface of the magnet housing 20.

[0048] S6. Perform a rolling spray treatment on all surfaces of the initial inductor to prepare an insulating layer 30. The coating material selected for the rolling spray treatment is a new type of nano-coating material or a water-based SUP nano-coating material, which has the advantages of non-sticking, corrosion resistance, high temperature resistance, high insulation, good wear resistance, and environmental friendliness.

[0049] S7. Strip the paint on the insulating layer 30 at the first lead 11 and the second lead 12 to expose the first lead 11 and the second lead 12.

[0050] S8. Perform an electroplating treatment at the first lead 11 and the second lead 12, that is, electroplate Cu, Ni, and Sn in sequence to prepare an electroplating layer 40, obtaining an inductor 100. The electroplating layer 40 can increase the solderability, solder resistance, and adhesion of the electrodes.

[0051] Optionally, in step S3, the assembly is formed by assembling one first magnet 21 and one conductor 10, or the assembly is formed by assembling a plurality of first magnets 21 and a plurality of conductors 10 at intervals. That is, when the assembly is formed by assembling one first magnet 21 and one conductor 10, the inductor 100 prepared by hot pressing the second magnet 22 and the assembly is an inductor with a set of electrodes. When the assembly is formed by assembling a plurality of first magnets 21 and a plurality of conductors 10 at intervals, the inductor 100 prepared by hot pressing the second magnet 22 and the assembly is an inductor 100 with multiple sets of electrodes. The inductor 100 can also be tested and packaged. Test the size, insulation impedance, and Rdc of the product to eliminate defective products with poor size and performance, and package the qualified products.

[0052] Combined with Figures 2 - 13 As shown, the present invention also provides an inductor 100 prepared by using the above preparation method. The inductor 100 includes: a conductor 10 and a magnet housing 20. The conductor 10 has a first pin 11 and a second pin 12 that are electrically connected. The magnet housing 20 includes a first magnet 21 and a second magnet 22. One side of the first magnet 21 is provided with a convex post 211 and a receiving groove 212 surrounding the outer periphery of the convex post 211. The conductor 10 is received in the receiving groove 212, and the first pin 11 and the second pin 12 are exposed outside the receiving groove 212. The second magnet 22 is in contact and cooperation with the first magnet 21 and covers the receiving groove 212, and the conductor 10 is located between the first magnet 21 and the second magnet 22.

[0053] Preferably, the conductor 10 further includes a main body portion 13 connecting the first pin 11 and the second pin 12. The main body portion 13 is arranged in an n shape. The first pin 11 and the second pin 12 are respectively located at both ends of the main body portion 13 and extend away from each other. The main body portion 13 is received in the receiving groove 212. As Figure 4 shown, an arc transition surface 14 is formed at the corner of the conductor 10, and the corner radius is approximately 0.5 - 0.8 mm. The first magnet 21 and the second magnet 22 will be compressed during the hot pressing process, and the distance between the conductor 10 and the first magnet 21 and the second magnet 22 will continuously decrease until they are in full contact. That is, the main body portion 13 is in close contact with the first magnet 21 and / or the second magnet 22 to ensure the relative fixation of the conductor 10 and the magnet housing 20. The setting of the arc transition surface 14 can further prevent the corner of the conductor 10 from having a gap with the magnet housing 20.

[0054] In this embodiment, the first magnet 21 is provided with a bottom surface (not shown) and a top surface 23 which are oppositely arranged, and a first side surface 24 connecting the bottom surface and the top surface 23, as Figure 2 shown. The receiving groove 212 is arranged in an n shape, and the receiving groove 212 is recessed from the top surface 23 towards the bottom surface and penetrates through the first side surface 24. The first magnet 21 is arranged in an E shape. Both the first lead 11 and the second lead 12 are exposed on the first side surface 24. That is to say, the first lead 11 and the second lead 12 are exposed on the same side of the magnet housing 20. The inductor 100 of the present invention has a simple structure, and multiple electrodes and multiple combinations of application forms can be formed by the cooperation of the conductor 10 and the magnet housing 20, saving space.

[0055] In the first embodiment of the present invention, the first magnet 21 has a rectangular columnar structure, and the second magnet 22 has a plate-like structure. That is, the first magnet 21 has an E-shaped structure, and the second magnet 22 has an I-shaped structure. As Figures 3 - 6 shown, there is one first magnet 21, the conductor 10 is located in the receiving groove 212, and the second magnet 22 is in contact and cooperation with the top surface 23 of the first magnet 21. The second magnet 22 abuts against the convex column 211 and covers the receiving groove 212. In the first embodiment, the magnet housing 20 is composed of the first magnet 21 and the second magnet 22 with two different structures, and correspondingly, the inductor 100 has a set of electrodes.

[0056] In the second embodiment of the present invention, the second magnet 22 has the same structure as the first magnet 21. As Figure 7 shown, both the second magnet 22 and the first magnet 21 are arranged in an E shape and the second magnet 22 is symmetrically arranged with the first magnet 21 in a mirror image. The top surface 23 of the first magnet 21 and the top surface 23 of the second magnet 22 are in contact with each other, the two convex columns 211 abut against each other, and the two receiving grooves 212 communicate with each other. The conductor 10 is received in the receiving space surrounded by the two receiving grooves 212. In the second embodiment, the magnet housing 20 is composed of the first magnet 21 and the second magnet 22 with two same structures, or rather, the magnet housing 20 is composed of two first magnets 21, and correspondingly, the inductor 100 has a set of electrodes.

[0057] In the third embodiment of the present invention, the structures of the first magnet 21' and the second magnet 22' are the same as those in the first embodiment. Different from the first embodiment, a plurality of first magnets 21' are stacked, as Figure 8 and Figure 9As shown, the bottom surface of one of the first magnets 21' is in contact and cooperation with the top surface 23 of the adjacent first magnet 21', that is, a plurality of the first magnets 21' are arranged in translational superposition, and the plurality of the first magnets 21' are in contact and cooperation with each other. The conductor 10 is disposed in the receiving groove 212 of each of the first magnets 21'. The second magnet 22' is in contact and cooperation with the top surface 23 of the topmost first magnet 21'. In the third embodiment, the magnet housing 20 is composed of a plurality of first magnets 21' and a second magnet 22' having a different structure from that of the first magnet 21', and the inductor 100' has multiple sets of electrodes. Of course, in other alternative embodiments, the second magnet 22 may also be arranged in an E-shaped structure, but the depth of the second magnet 22 and the receiving groove 212 of the topmost first magnet 21 is relatively shallow to jointly enclose the receiving space in the second embodiment. In the third embodiment, by combining a plurality of conductors 10 and the first magnets 21', a multi-electrode and multi-combination application form can be formed, which can save space and reduce costs. Preferably, there are various superposition methods for the first magnets 21', including but not limited to linear superposition, side-by-side superposition, etc. As Figure 10 shown, the inductor 100" is formed by side-by-side superposition of the inductors 100' in the third embodiment.

[0058] As Figures 11 - 13 shown, the inductor 100 further includes an insulating layer 30. The insulating layer 30 covers the outer surface of the magnet housing 20. That is to say, the insulating layer 30 is not in contact with the first lead 11 and the second lead 12. In this embodiment, a groove is provided on the first side surface 24 of the magnet housing 20. The groove is located between the first lead 11 and the second lead 12, and the insulating layer 30 is provided in the groove. When the inductor 100 has multiple sets of electrodes, an insulating layer 30 is provided between the first leads 11 and the second leads 12 of two adjacent conductors 10. The inductor 100 further includes a plating layer 40, and the plating layer 40 is plated on the surfaces of the first lead 11 and the second lead 12 exposed outside the magnet housing 20. Preferably, on the first side surface 24, the magnet housing on the sides of the first lead 11 and the second lead 12 is exposed, and the plating layer 40 extends to the exposed magnet housing 20 to increase the solderability, solder resistance and adhesion of the electrodes.

[0059] In summary, the present invention prepares a conductor 10, a first magnet 21, and a second magnet 22. A convex column 211 and a receiving groove 212 surrounding the outer periphery of the convex column 211 are provided on one side of the first magnet 21. The conductor 10 is located in the receiving groove 212, so that the second magnet 22 and the assembly formed by assembling the first magnet 21 and the conductor 10 are hot-pressed to form an initial inductor. Furthermore, an inductor 100 is obtained by preparing an insulating layer 30 and a plating layer 40. The preparation method of the present invention is simple, can form an inductor in one step, has a low input cost, and the inductor 100 prepared by this method has a simple structure, can form multiple electrodes and multiple combination application forms, and saves space.

[0060] The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for preparing an inductor, characterized in that: include: S1, preparing a conductor, wherein the conductor has a first pin and a second pin electrically connected; S2, preparing a first magnet, wherein one side of the first magnet is provided with a protrusion and a receiving groove surrounding the outer periphery of the protrusion; S3, placing the first magnet in a hot pressing mold, and then placing the conductor in the hot pressing mold and assembling it with the first magnet to obtain an assembly; S4, preparing a second magnet, and placing the second magnet in the hot pressing mold, and hot pressing the second magnet together with the assembly; S5, removing the hot pressing mold to obtain an initial inductor; wherein the conductor is located in the receiving groove, and the first pin and the second pin are both exposed outside the initial inductor; S6, performing roller spraying treatment on the surface of the initial inductor to prepare an insulating layer; S7, stripping the insulating layer at the first pin and the second pin to expose the first pin and the second pin; S8, performing electroplating treatment on the first pin and the second pin to prepare an electroplating layer to obtain an inductor.

2. The method for preparing an inductor according to claim 1, characterized in that: The methods of preparing the conductor in step S1 include: copper sheet stamping and copper sheet cutting.

3. The method for preparing an inductor according to claim 1, characterized in that: The step of preparing the first magnet in step S2 is specifically: filling the first magnet mold with micro-nano composite soft magnetic material, and cold pressing to obtain the first magnet; the step of preparing the second magnet in step S4 is specifically: filling the second magnet mold with micro-nano composite soft magnetic material, and cold pressing to obtain the second magnet.

4. The method for preparing an inductor according to claim 1, wherein: In step S3, the assembly is formed by assembling one of the first magnets and one of the conductors, or the assembly is formed by assembling a plurality of the first magnets and a plurality of the conductors in an interval manner.

5. An inductor, characterized in that: The inductor is prepared by the preparation method according to any one of claims 1 to 4, and comprises: A conductor having a first pin and a second pin electrically connected; A first magnet, wherein a protrusion and a receiving groove surrounding the protrusion are provided on one side of the first magnet, the conductor is received in the receiving groove, and the first pin and the second pin are exposed outside the receiving groove; The second magnet contacts and cooperates with the first magnet and covers the receiving groove, and the conductor is located between the first magnet and the second magnet.

6. The inductor according to claim 5, characterized in that: The conductor also includes a main body connecting the first pin and the second pin, the main body is arranged in an n-shape, the first pin and the second pin are respectively located at two ends of the main body and extend back to back to each other, and the main body is accommodated in the accommodation groove.

7. The inductor according to claim 6, characterized in that: The first magnet is provided with a bottom surface and a top surface arranged opposite to each other, and a first side surface connecting the bottom surface and the top surface. The accommodating groove is formed by being recessed from the top surface toward the bottom surface and passes through the first side surface. The first pin and the second pin are both exposed on the first side surface.

8. The inductor according to claim 7, characterized in that: The first magnet is provided with one, the conductor is located in the accommodating groove, and the second magnet is in contact with and matched with the top surface of the first magnet.

9. The inductor according to claim 7, characterized in that: The second magnet has the same structure as the first magnet, and the top surface of the first magnet and the top surface of the second magnet are in contact with each other, the two protrusions abut against each other, and the two accommodating grooves are connected to each other to jointly accommodate the conductor.

10. The inductor according to claim 7, characterized in that: The first magnets are stacked in plurality, wherein the bottom surface of one of the first magnets contacts and cooperates with the top surface of the adjacent first magnet, the conductor is provided in the receiving groove of each of the first magnets, and the second magnet contacts and cooperates with the top surface of the first magnet located at the top.

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