Wafer core particle full-automatic alignment device of probe station

Abstract

The invention relates to the technical field of probe stations, and discloses a wafer core particle full-automatic alignment device of a probe station, which comprises a base, the top of the base is fixedly connected with a full-automatic probe device, two sides of the top of the full-automatic probe device are fixedly connected with Y shafts, an X shaft is slidably connected between the two Y shafts, and the X shaft is fixedly connected with the full-automatic probe device. A mounting table is slidably connected to the top of the X shaft, a cooling table is fixedly connected to the top of the mounting table, a vacuum replacement mechanism is arranged at the top of the cooling table, the position of the mounting table can be adjusted through cooperation of the Y shaft and the X shaft, and adjustment of the vacuum replacement mechanism and the cooling table is further achieved. Through the dust cleaning mechanism, dust can be automatically cleaned when wafer testing is carried out on the full-automatic probe station, and then the situation that a probe is in poor contact with a chip, the surface of the wafer is scratched, and microscope observation is affected can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of probe stations, and specifically to a fully automatic wafer die alignment device for a probe station. Background Art

[0002] A fully automatic probe station is composed of structures such as a micro-stage, a probe card, a microscope system, a control system, and a fixing system, and has characteristics such as high precision, high efficiency, intelligence, and multi-function. It is widely used in industries such as semiconductors, optoelectronics, and integrated circuit packaging and testing. A wafer die automatic alignment device is a device that can automatically align wafer dies.

[0003] The existing wafer die automatic alignment device adapted to a fully automatic probe station can automatically drive the movement of wafer dies to achieve alignment. However, currently, the wafer die automatic alignment device generally does not have the function of dust cleaning. Dust is easily floating in the working space, which may then cause dust to adhere to the wafer carrier on the automatic alignment device, and then cause dust to contaminate the wafer dies. Subsequently, problems such as poor contact between the probe and the chip during wafer processing, scratching of the wafer surface, and affecting microscope observation may occur. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a fully automatic wafer die alignment device for a probe station, which solves the problems in the prior art that the wafer die automatic alignment device adapted to a fully automatic probe station is prone to dust contamination, which may then lead to poor contact between the probe and the chip, scratching of the wafer surface, and affecting microscope observation.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A fully automatic wafer die alignment device for a probe station includes a base. A fully automatic probe device is fixedly connected to the top of the base. Y-axes are fixedly connected to both sides of the top of the fully automatic probe device. An X-axis is slidably connected between the two Y-axes. An installation table is slidably connected to the top of the X-axis. A cooling table is fixedly connected to the top of the installation table. A vacuum replacement mechanism is arranged on the top of the cooling table. The cooperation of the Y-axis and the X-axis can realize the position adjustment of the installation table, and further realize the adjustment of the vacuum replacement mechanism and the cooling table. Therefore, it is convenient for the automatic alignment of wafer dies. A dust cleaning mechanism is arranged inside the fully automatic probe device, and the dust cleaning mechanism is used for cleaning dust.

[0006] Preferably, the dust cleaning mechanism includes a vacuum pump, the outside of which is fixedly connected to the outside of the full-automatic probe device. The input end of the vacuum pump is fixedly connected with an air pipe, and the end of the air pipe far away from the vacuum pump is fixedly connected with a dust collection box. One side of the dust collection box is fixedly connected with a connecting hose, and the end of the connecting hose far away from the dust collection box is fixedly connected with an outer sleeve. A sliding rod is slidably connected inside the outer sleeve. One end of the sliding rod far away from the connecting hose is fixedly connected with a plug, and the other end of the sliding rod far away from the plug is fixedly connected with a switching head. A return spring is arranged inside the outer sleeve. A dust discharge hole is formed inside the switching head, and an air suction hole is formed at the top of the switching head. The end of the outer sleeve far away from the connecting hose is fixedly connected with a connecting pipe. One side of the top of the cooling table is fixedly connected with a dust suction head, and the other side of the top of the cooling table is fixedly connected with a blowing head. The outer end of the dust suction head is fixedly connected with a dust suction pipe, and the end of the dust suction pipe far away from the dust suction head is fixedly connected to the top of the outer sleeve. One side of the blowing head far away from the dust suction head is fixedly connected with a blowing hose, and the end of the blowing hose far away from the blowing head is fixedly connected to the output end of the vacuum pump.

[0007] Preferably, the vacuum replacement mechanism includes a mounting seat, the bottom of which is fixedly connected to the top of the cooling table. A storage box is fixedly connected to the top of the mounting seat. One side of the outside of the mounting seat far away from the connecting pipe is fixedly connected with a mounting cylinder. A sliding plug is slidably connected inside the mounting cylinder. One side of the sliding plug far away from the mounting seat is fixedly connected with a hollow rod, and a plurality of ventilation holes are formed at both ends of the outside of the hollow rod. A pushing spring is arranged inside the mounting cylinder. A bearing platform is arranged inside the storage box. One end of the outside of the mounting seat far away from the pull ring is fixedly connected to the end of the connecting pipe far away from the outer sleeve.

[0008] Preferably, one end of the return spring is fixedly connected to the end of the switching head far away from the sliding rod, and the other end of the return spring is fixedly connected to the inside of the outer sleeve.

[0009] Preferably, a rotating door is rotatably connected to the outside of the dust collection box, and the air suction hole is connected to the dust discharge hole.

[0010] Preferably, the plug is arranged inside the outer sleeve, and the switching head is slidably connected inside the outer sleeve.

[0011] Preferably, a sealing ring is fixedly connected to the inner side of the storage box, and the outside of the sealing ring is in contact with the bearing platform.

[0012] Preferably, one end of the pushing spring is fixedly connected to one side of the sliding plug, and the other end of the pushing spring is fixedly connected to the inner side of the mounting cylinder.

[0013] Preferably, a pull ring is fixedly connected to one end of the hollow rod away from the mounting base, and a plurality of holes are formed inside the sliding plug.

[0014] Preferably, the outside of the dust collection box is fixedly connected to the outside of one side of the full-automatic probe device, and support feet are fixedly connected to the four corners of the bottom of the base.

[0015] The present invention provides a full-automatic wafer die alignment device for a probe station. It has the following beneficial effects:

[0016] 1. Through the dust cleaning mechanism of the present invention, when the wafer is tested on the full-automatic probe station, the dust can be automatically cleaned, thereby avoiding the situations of poor contact between the probe and the chip, scratching the surface of the wafer, and affecting the microscope observation.

[0017] 2. Through the vacuum replacement mechanism of the present invention, after the carrier is placed inside the loading box, the carrier can be tightly adsorbed inside the loading box by means of vacuum adsorption, so as to realize the rapid and convenient replacement of the carrier, improving the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional view of the present invention Figure 1 ;

[0019] Figure 2 is a three-dimensional view of the present invention Figure 2 ;

[0020] Figure 3 is a schematic structural view of the dust suction head in the present invention;

[0021] Figure 4 is a schematic structural view of the outer sleeve in the present invention;

[0022] Figure 5 is a schematic structural view of the switching head in the present invention;

[0023] Figure 6 is a schematic structural view of the loading box in the present invention;

[0024] Figure 7 is a schematic structural view of the sliding plug in the present invention;

[0025] Figure 8 is a schematic structural view of the hollow rod in the present invention.

[0026] Among them, 1. Base; 2. Full-automatic probe device; 3. Y-axis; 4. X-axis; 5. Installation table; 6. Dust cleaning mechanism; 601. Vacuum pump; 602. Vent pipe; 603. Dust collection box; 604. Connecting hose; 605. Outer sleeve; 606. Sliding rod; 607. Plug; 608. Switching head; 609. Suction hole; 610. Dust discharge hole; 611. Return spring; 612. Connecting pipe; 613. Dust suction head; 614. Blowing head; 615. Dust suction pipe; 616. Blowing hose; 617. Rotating door; 7. Vacuum replacement mechanism; 701. Mounting seat; 702. Storage box; 703. Sealing ring; 704. Installation cylinder; 705. Sliding block; 706. Hollow rod; 707. Vent hole; 708. Push spring; 709. Pull ring; 710. Carrying platform; 8. Cooling table. Specific implementation mode

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to the attached Figure 1 - attached Figure 8 As shown in the figure, the embodiments of the present invention provide a full-automatic alignment device for wafer chips of a probe station, including a base 1. A full-automatic probe device 2 is fixedly connected to the top of the base 1. Y-axes 3 are fixedly connected to both sides of the top of the full-automatic probe device 2. An X-axis 4 is slidably connected between the two Y-axes 3. An installation table 5 is slidably connected to the top of the X-axis 4. A cooling table 8 is fixedly connected to the top of the installation table 5. A vacuum replacement mechanism 7 is arranged on the top of the cooling table 8. The cooperation of the Y-axis 3 and the X-axis 4 can realize the position adjustment of the installation table 5, and further realize the adjustment of the vacuum replacement mechanism 7 and the cooling table 8. Therefore, it can facilitate the automatic alignment of wafer chips. A dust cleaning mechanism 6 is arranged inside the full-automatic probe device 2, and the dust cleaning mechanism 6 is used for cleaning dust.

[0029] The dust cleaning mechanism 6 includes a vacuum pump 601. The outside of the vacuum pump 601 is fixedly connected to the outside of the full-automatic probe device 2. An air pipe 602 is fixedly connected to the input end of the vacuum pump 601. The air pipe 602 can play a connecting role. One end of the air pipe 602 away from the vacuum pump 601 is fixedly connected to a dust collection box 603. The dust collection box 603 can play a role in dust collection. A connecting hose 604 is fixedly connected to one side of the dust collection box 603. The connecting hose 604 can play a connecting role. One end of the connecting hose 604 away from the dust collection box 603 is fixedly connected to an outer sleeve 605. The outer sleeve 605 can play an installation role. A sliding rod 606 is slidably connected inside the outer sleeve 605. The sliding rod 606 plays a connecting role. One end of the sliding rod 606 away from the connecting hose 604 is fixedly connected to a plug 607. The plug 607 can play a plugging role. One end of the sliding rod 606 away from the plug 607 is fixedly connected to a switching head 608. The switching head 608 can switch the route of gas inhalation. A return spring 611 is arranged inside the outer sleeve 605. The return spring 611 can use its own elastic force to push and reset the switching head 608, the sliding rod 606 and the plug 607 when there is no gas inhalation. A dust discharge hole 610 is opened inside the switching head 608. An air suction hole 609 is opened at the top of the switching head 608. One end of the outer sleeve 605 away from the connecting hose 604 is fixedly connected to a connecting pipe 612. One side of the top of the cooling table 8 is fixedly connected to a dust suction head 613. The other side of the top of the cooling table 8 is fixedly connected to a dust blowing head 614. One end of the outside of the dust suction head 613 is fixedly connected to a dust suction pipe 615. One end of the dust suction pipe 615 away from the dust suction head 613 is fixedly connected to the top of the outer sleeve 605. One side of the dust blowing head 614 away from the dust suction head 613 is fixedly connected to a blowing hose 616. The blowing hose 616 can play a role in gas connection. One end of the blowing hose 616 away from the dust blowing head 614 is fixedly connected to the output end of the vacuum pump 601. One end of the return spring 611 is fixedly connected to the end of the switching head 608 away from the sliding rod 606. The other end of the return spring 611 is fixedly connected to the inside of the outer sleeve 605. A rotating door 617 is rotatably connected to the outside of the dust collection box 603. The air suction hole 609 is connected to the dust discharge hole 610. The plug 607 is arranged inside the outer sleeve 605. The switching head 608 is slidably connected inside the outer sleeve 605. The outside of the dust collection box 603 is fixedly connected to the outside of one side of the full-automatic probe device 2. Support feet are fixedly connected to the four corners of the bottom of the base 1. Before the base 1 works, the vacuum pump 601 is started. After the input end of the vacuum pump 601 is started, suction will be generated, and the air inside the dust collection box 603 will be sucked out. At this time, suction is generated inside the dust collection box 603. The suction of the dust collection box 603 will be transmitted to the inside of the outer sleeve 605 through the connecting hose 604. At this time, the air inside the vacuum replacement mechanism 7 can be pumped away by using the holes on the switching head 608 and the outer sleeve 605.Meanwhile, the switching head 608 will move towards the direction of the connecting hose 604 under the action of suction force, thereby being able to compress the return spring 611. At the same time, it will drive the sliding rod 606 and the plug 607 to move towards the direction of the connecting hose 604, using the plug 607 to block the outer sleeve 605. At the same time, the suction hole 609 on the switching head 608 will align with the side of the outer sleeve 605 where the dust suction pipe 615 is located. At this time, the suction force will be transmitted to the dust suction pipe 615 through the suction hole 609, and the suction force will be transmitted to the inside of the dust suction head 613 through the dust suction pipe 615. The dust suction head 613 is used to suck away the dust on the top of the vacuum replacement mechanism 7. At the same time, the output end of the vacuum pump 601 can discharge gas, and the gas can be transmitted to the blowing head 614 through the blowing hose 616. The blowing head 614 sprays gas, which can blow up the dust of the wafer chips on the top of the vacuum replacement mechanism 7 and can be sucked away by the dust suction head 613, thereby being able to keep the working space and the wafer chips clean. The dust will be transmitted to the inside of the dust collection box 603 through the connecting hose 604, and the dust collection box 603 is used to store the dust.,

[0030] The vacuum replacement mechanism 7 includes a mounting base 701. The function of the mounting base 701 is to provide a mounting position. The bottom of the mounting base 701 is fixedly connected to the top of the cooling table 8. A storage box 702 is fixedly connected to the top of the mounting base 701. On the outer side of the mounting base 701 away from the connecting pipe 612, a mounting cylinder 704 is fixedly connected. The mounting cylinder 704 provides a mounting position. A sliding plug 705 is slidably connected inside the mounting cylinder 704. The sliding plug 705 has the function of blocking. A hollow rod 706 is fixedly connected to the side of the sliding plug 705 away from the mounting base 701. The hollow rod 706 can play a connecting role. A plurality of ventilation holes 707 are opened at both outer ends of the hollow rod 706. The ventilation holes 707 have the function of ventilation. A pushing spring 708 is arranged inside the mounting cylinder 704. The pushing spring 708 can push the sliding plug 705 to reset. A bearing platform 710 is arranged inside the storage box 702. One end of the outer side of the mounting base 701 away from the pull ring 709 is fixedly connected to the end of the connecting pipe 612 away from the outer sleeve 605. A sealing ring 703 is fixedly connected to the inner side of the storage box 702. The outer part of the sealing ring 703 is in contact with the bearing platform 710. One end of the pushing spring 708 is fixedly connected to one side of the sliding plug 705. The other end of the pushing spring 708 is fixedly connected to the inner side of the mounting cylinder 704. A pull ring 709 is fixedly connected to the end of the hollow rod 706 away from the mounting base 701. A plurality of holes are opened inside the sliding plug 705. When replacing the bearing platform 710, turn off the vacuum pump 601 and pull the pull ring 709. The pull ring 709 can drive the hollow rod 706 and the sliding plug 705 to move away from the mounting base 701, thereby compressing the pushing spring 708. When the sliding plug 705 no longer blocks the mounting cylinder 704, the outside air will enter the inside of the mounting cylinder 704 through the ventilation holes 707 and can enter the inside of the mounting base 701 through the holes on the sliding plug 705 and through the mounting cylinder 704, and then the air pressure inside the mounting base 701 can be balanced, so that the bearing platform 710 can be easily disassembled. When installing the bearing platform 710, place the bearing platform 710 inside the sealing ring 703 and use the sealing ring 703 to improve the sealing performance. Then start the vacuum pump 601. The input end of the vacuum pump 601 can suck out the air inside the mounting base 701 through the holes on the outer sleeve 605 and the holes on the switching head 608, and then the air pressure inside the mounting base 701 can be reduced. Therefore, the bearing platform 710 can be tightly adsorbed inside the storage box 702. Due to the suction force generated inside the mounting base 701, the sliding plug 705 will also tightly adhere to the inner side of the mounting cylinder 704, so that no air will be sucked in.

[0031] Working principle: Before the base 1 starts working, start the vacuum pump 601. After the input end of the vacuum pump 601 starts, suction is generated and the air inside the dust collection box 603 is sucked out. At this time, suction is generated inside the dust collection box 603, and the suction of the dust collection box 603 is transmitted to the inside of the outer sleeve 605 through the connecting hose 604. At this time, the air inside the vacuum replacement mechanism 7 can be pumped out by using the switching head 608 and the holes on the outer sleeve 605. At the same time, the switching head 608 will move towards the connecting hose 604 under the action of suction, and then the return spring 611 can be compressed. At the same time, the sliding rod 606 and the plug 607 will be driven to move towards the connecting hose 604. The plug 607 is used to block the outer sleeve 605. At the same time, the suction hole 609 on the switching head 608 will be aligned with the side of the outer sleeve 605 where the dust suction pipe 615 is located. At this time, the suction will be transmitted to the dust suction pipe 615 through the suction hole 609, and the suction will be transmitted to the inside of the dust suction head 613 through the dust suction pipe 615. The dust suction head 613 is used to suck the dust on the top of the vacuum replacement mechanism 7. At the same time, the output end of the vacuum pump 601 can discharge gas, and the gas can be transmitted to the blowing head 614 through the blowing hose 616. The blowing head 614 sprays gas, and then the dust on the top of the vacuum replacement mechanism 7 can be blown up and sucked away by the dust suction head 613. Then the working space and the wafer core particles can be kept clean. The dust will be transmitted to the inside of the dust collection box 603 through the connecting hose 604, and the dust collection box 603 is used to store the dust;

[0032] When replacing the carrier 710, turn off the vacuum pump 601 and pull the pull ring 709. The pull ring 709 can drive the hollow rod 706 and the sliding plug 705 to move away from the mounting seat 701, so as to compress the pushing spring 708. When the sliding plug 705 no longer blocks the mounting cylinder 704, the outside gas will enter the inside of the mounting cylinder 704 through the ventilation hole 707 and enter the inside of the mounting seat 701 through the holes on the sliding plug 705. Then the air pressure inside the mounting seat 701 can be balanced, and thus the carrier 710 can be easily disassembled. When installing the carrier 710, place the carrier 710 inside the sealing ring 703, and use the sealing ring 703 to improve the sealing performance. Then start the vacuum pump 601. The input end of the vacuum pump 601 can pump out the gas inside the mounting seat 701 through the holes on the outer sleeve 605 and the holes on the switching head 608. Then the air pressure inside the mounting seat 701 can be reduced. Therefore, the carrier 710 can be tightly adsorbed inside the storage box 702. Due to the suction generated inside the mounting seat 701, the sliding plug 705 will also tightly adhere to the inner side of the mounting cylinder 704, so that no gas will be sucked in.

[0033] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic wafer core alignment device for a probe station, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a fully automatic probe device (2), both sides of the top of the fully automatic probe device (2) are fixedly connected to a Y axis (3), an X axis (4) is slidably connected between the two Y axes (3), the top of the X axis (4) is slidably connected to a mounting table (5), the top of the mounting table (5) is fixedly connected to a cooling table (8), the top of the cooling table (8) is provided with a vacuum replacement mechanism (7), the cooperation of the Y axis (3) and the X axis (4) can realize the position adjustment of the mounting table (5), and further realize the adjustment of the vacuum replacement mechanism (7) and the cooling table (8), so as to facilitate the automatic alignment of the wafer core particles, and the interior of the fully automatic probe device (2) is provided with a dust cleaning mechanism (6), and the dust cleaning mechanism (6) is used to clean dust.

2. The wafer chip fully automatic alignment device of a probe station according to claim 1, characterized in that: The dust cleaning mechanism (6) comprises a vacuum pump (601), the outside of the vacuum pump (601) is fixedly connected to the outside of the full-automatic probe device (2), the input end of the vacuum pump (601) is fixedly connected to a ventilation pipe (602), the end of the ventilation pipe (602) away from the vacuum pump (601) is fixedly connected to a dust collecting box (603), one side of the dust collecting box (603) is fixedly connected to a connecting hose (604), the end of the connecting hose (604) away from the dust collecting box (603) is fixedly connected to an outer sleeve (605), the inner part of the outer sleeve (605) is slidably connected to a sliding rod (606), the end of the sliding rod (606) away from the connecting hose (604) is fixedly connected to a plug (607), the end of the sliding rod (606) away from the plug (607) is fixedly connected to a switching head (608), and the inner part of the outer sleeve (605) is provided with a complex A spring (611) is provided in the switching head (608), a dust exhaust hole (610) is provided inside the switching head (608), an air suction hole (609) is provided on the top of the switching head (608), a connecting pipe (612) is fixedly connected to one end of the outer sleeve (605) away from the connecting hose (604), a dust suction head (613) is fixedly connected to one side of the top of the cooling table (8), a blowing head (614) is fixedly connected to the other side of the top of the cooling table (8), a dust suction pipe (615) is fixedly connected to the outer end of the dust suction head (613), an end of the dust suction pipe (615) away from the dust suction head (613) is fixedly connected to the top of the outer sleeve (605), a blowing hose (616) is fixedly connected to the side of the blowing head (614) away from the dust suction head (613), and an end of the blowing hose (616) away from the blowing head (614) is fixedly connected to the output end of the vacuum pump (601).

3. The wafer chip fully automatic alignment device of a probe station according to claim 2, characterized in that: The vacuum replacement mechanism (7) comprises a mounting seat (701), the bottom of the mounting seat (701) is fixedly connected to the top of the cooling platform (8), the top of the mounting seat (701) is fixedly connected to a receiving box (702), the outside of the mounting seat (701) is fixedly connected to a mounting tube (704) on a side away from the connecting pipe (612), the inside of the mounting tube (704) is slidably connected to a sliding block (705), and the sliding block (705) is away from the connecting pipe (612). A hollow rod (706) is fixedly connected to one side of the mounting seat (701), and a plurality of ventilation holes (707) are provided at both ends of the outside of the hollow rod (706). A push spring (708) is provided inside the mounting tube (704), and a supporting platform (710) is provided inside the receiving box (702). An end of the outside of the mounting seat (701) away from the pull ring (709) is fixedly connected to an end of the connecting tube (612) away from the outer sleeve (605).

4. The wafer chip fully automatic alignment device of a probe station according to claim 2, characterized in that: One end of the return spring (611) is fixedly connected to an end of the switching head (608) away from the sliding rod (606), and the other end of the return spring (611) is fixedly connected to the inside of the outer sleeve (605).

5. The wafer chip fully automatic alignment device of a probe station according to claim 2, characterized in that: The outer side of the dust collecting box (603) is rotatably connected to a rotating door (617), and the air intake hole (609) is connected to the dust exhaust hole (610).

6. The wafer chip fully automatic alignment device of a probe station according to claim 2, characterized in that: The plug head (607) is arranged inside the outer sleeve (605), and the switching head (608) is slidably connected inside the outer sleeve (605).

7. The wafer chip fully automatic alignment device of a probe station according to claim 3, characterized in that: A sealing ring (703) is fixedly connected to the inner side of the receiving box (702), and the outer side of the sealing ring (703) is in contact with the supporting platform (710).

8. The wafer chip fully automatic alignment device of a probe station according to claim 3, characterized in that: One end of the push spring (708) is fixedly connected to one side of the sliding block (705), and the other end of the push spring (708) is fixedly connected to the inner side of the mounting tube (704).

9. The wafer chip fully automatic alignment device of a probe station according to claim 3, characterized in that: One end of the hollow rod (706) away from the mounting seat (701) is fixedly connected with a pull ring (709), and a plurality of holes are provided inside the sliding block (705).

10. The wafer chip fully automatic alignment device of a probe station according to claim 2, characterized in that: The outside of the dust box (603) is fixedly connected to one side of the outside of the full-automatic probe device (2), and the four bottom corners of the base (1) are fixedly connected with supporting feet.

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