Fine grinding optical part polishing device

Abstract

The invention discloses an accurate grinding optical part polishing device which comprises an upper table plate and a lower table plate which are fixed with each other, and further comprises a plurality of wafers which are placed on the lower table plate through a containing structure to wait for polishing, and a plurality of polishing devices, and the pushing structure is arranged between the lower table plate and the upper table plate and used for pushing the wafers on the containing structure to be polished, and an acting block is installed on the pushing structure. The wafer polishing machine has the advantages that wafers are continuously and efficiently placed on the polishing table in sequence to be subjected to front and back turning polishing, it can be guaranteed that the front and back of each wafer can be accurately turned, it is guaranteed that the two faces are evenly polished, non-uniformity and omission of manual turning are eliminated, the wafers can be automatically lifted after polishing is completed, and the polishing efficiency is improved. And the collision and injury risks possibly occurring in the carrying process of workers are reduced, the processing speed of a production line is greatly shortened, the workers are prevented from making direct contact with high-temperature and high-speed running equipment and chemical solvents, and potential safety hazards in operation are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of polishing devices, and in particular to a polishing device for fine grinding optical parts. Background Art

[0002] The surface flatness of the wafer is crucial to the subsequent semiconductor manufacturing process, especially in the processes of lithography, etching, deposition, etc. If there are tiny irregularities or defects on the wafer surface, it will affect the accurate transmission of the pattern, and then cause circuit defects or failure. The precision grinding optical parts polishing device can remove tiny surface unevenness and make the surface smoother and flatter.

[0003] The existing precision optical parts polishing equipment requires manual operation for the placement, polishing and removal of each wafer when polishing the wafer, resulting in a long overall production cycle. Especially when a large number of wafers need to be polished, manual operation will cause low production efficiency, which may lead to inaccurate wafer placement, uneven polishing force or improper polishing time control, thereby affecting the polishing quality and consistency, and unable to achieve large-scale, efficient automated production. Summary of the invention

[0004] The purpose of the present invention is to solve the problem of low polishing efficiency in the prior art and to propose a polishing device for finely grinding optical parts.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A fine grinding optical parts polishing device, comprising an upper platen and a lower platen, which are fixed to each other, and further comprising:

[0007] A plurality of wafers are placed on the lower platen through a holding structure to wait for polishing;

[0008] A pushing structure, which is arranged between the lower platen and the upper platen, and is used to push the wafers on the holding structure to polishing in sequence, and an action block is installed on the pushing structure;

[0009] A polishing structure, which is arranged on the upper platen and is used for polishing the wafer, and a lower pressing half ring and two gear rods are installed on the polishing structure;

[0010] A polishing table, which is fixedly arranged on the lower table plate, a limit frame is placed on the polishing table, a flip structure for flipping and polishing the wafer is installed on the limit frame, and an extrusion half ring is installed on the flip structure;

[0011] Two tooth plates are both slidably arranged on the lower platen, and a lifting structure is installed between the lower platen and the polishing table. The lifting structure is used to push the flipped and polished wafer upwards in cooperation with the pushing structure.

[0012] To sum up, the present invention can ensure that the front and back sides of each wafer can be accurately turned over and both sides are evenly polished by placing the wafers on the polishing table in sequence continuously and efficiently for front and back side flipping and polishing, thereby eliminating the unevenness and omissions caused by manual flipping. After polishing is completed, the wafer can be automatically lifted, reducing the risk of collision and injury that may occur during the workers' transportation process, greatly shortening and significantly improving the processing speed of the production line, avoiding direct contact between workers and high-temperature, high-speed equipment and chemical solvents, and reducing safety hazards in operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the structure of a polishing device for fine grinding optical parts proposed by the present invention;

[0014] Figure 2 It is a structural schematic diagram of another perspective of the present invention;

[0015] Figure 3 It is a schematic diagram of the structure of the downward pressing half ring and the supporting rod in the present invention;

[0016] Figure 4 It is a structural schematic diagram of the polishing table and the limiting frame in the present invention;

[0017] Figure 5 For the present invention Figure 4 A top view of

[0018] Figure 6 For the present invention Figure 5 Structural cross-sectional view of the middle and lower table plates and polishing table along the AA direction;

[0019] Figure 7 For the present invention Figure 5 Structural cross-sectional view of the middle and lower table plates and polishing table along the BB direction;

[0020] Figure 8 For the present invention Figure 7 A schematic diagram of the structure of part a in the middle is enlarged;

[0021] Fig. 9 A schematic diagram of the structure of the extrusion half ring proposed by the present invention;

[0022] Fig.10 It is a structural schematic diagram of the guide rod and the action block in the present invention;

[0023] Fig.11 It is a structural schematic diagram of the sliding rod and the moving rod in the present invention;

[0024] Fig.12 It is a schematic diagram of the structure of the connecting rod and the triangular block in the present invention.

[0025] In the figure: 1, upper plate; 2, lower plate; 3, gear rod 1; 4, polishing plate; 5, storage cover; 6, wafer; 7, electric telescopic rod; 8, gear rod 2; 9, fixed rod; 10, fixed frame; 11, lower half ring; 12, support rod; 13, hydraulic rod; 14, fixed plate; 15, push rod; 16, polishing table; 17, limit frame; 18, clamp ring; 19, lifting plate; 20, slide rod; 21, moving rod; 22, spring 1; 23, gear plate; 24, limit Block; 25, round rod; 26, lifting rod; 27, extrusion block; 28, connecting rod; 29, sliding hole; 30, pressing plate; 31, guide rod; 32, action block; 33, rotating rod; 34, vertical rod; 35, rotating plate; 36, fixing ring; 37, spring two; 38, spiral groove; 39, extrusion half ring; 40, action rod; 41, gear one; 42, gear two; 43, gear three; 44, gear four; 45, connecting frame; 46, triangular block; 47, spring three. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Reference Figure 1 , Figure 2 , Fig. 9 as well as Fig.10 , a fine grinding optical parts polishing device, comprising an upper platen 1 and a lower platen 2, the lower platen 2 is arranged in an L shape, the upper platen 1 is fixedly arranged at the upper end of the lower platen 2, and also comprises: a plurality of wafers 6, which are placed on the lower platen 2 through a containing structure and wait for polishing, the containing structure comprises a pad and an electric telescopic rod 7 fixedly arranged on the lower platen 2, a storage cover 5 is fixedly installed on the driving end of the electric telescopic rod 7, the storage cover 5 is in an intercommunication state up and down, and a plurality of wafers 6 are stacked in the storage cover 5, the lowest wafer 6 falls on the pad under the action of gravity, and the distance between the lower port of the storage cover 5 and the pad is slightly larger than the thickness of the single wafer 6, the driving end of the electric telescopic rod 7 can drive the storage cover 5 to rise and fall, and can change the vertical distance between the storage cover 5 and the pad according to the thickness of the wafer 6, so as to facilitate subsequent operations.

[0028] The push structure also includes a pushing structure, which is arranged between the lower platen 2 and the upper platen 1, and is used to push the wafer 6 on the holding structure to polishing. An action block 32 is installed on the pushing structure. The pushing structure includes a rotating rod 33 fixedly arranged on the lower platen 2, and a push rod 15 is rotatably installed on the rotating rod 33. The push rod 15 is arc-shaped and can better push the wafer 6 to prevent it from being skewed. The action block 32 is fixedly installed on the lower surface of the push rod 15. A spiral groove 38 is opened on the push rod 15. The path of the spiral groove 38 is spiral. The starting point (end) and the end point (end tail) of the spiral groove 38 are connected by a continuous curve to form a gradually rotating trajectory. The upper platen 1 is fixedly mounted on the lower surface of the fixing rod 9, a fixing ring 36 is fixedly mounted on the lower end of the fixing rod 9, a rotating plate 35 is rotatably mounted in the middle of the fixing ring 36, a spring 2 37 is fixedly mounted on the lower surface of the rotating plate 35, a pressing plate 30 is fixedly mounted on the lower end of the spring 2 37, a vertical rod 34 is fixedly mounted on the lower surface of the pressing plate 30, a guide rod 31 is fixedly mounted on the lower end of the vertical rod 34, the guide rod 31 slides in the spiral groove 38 for use, and the setting of the spiral groove 38 allows the guide rod 31 to only rotate 360° along its path therein, as the guide rod 31 advances along the spiral groove 38, the rotation of the object gradually increases, and finally completes a complete circle of rotation.

[0029] The polishing structure is also included, which is arranged on the upper platen 1 for polishing the wafer 6. A pressing half ring 11 and two toothed rods 3 are installed on the polishing structure. The pressing half ring 11 is used in conjunction with the pressing plate 30. The pressing plate 30 is provided with an annular groove. When the pressing half ring 11 descends, it can engage in the annular groove to drive the vertical rod 34 to descend. At this time, the spring 37 is stretched, and the push rod 15 rotates under the cooperation of the guide rod 31 and the spiral groove 38; when the pressing half ring 11 is separated from the pressing plate 30, the vertical rod 34 is driven to move upward under the rebound of the spring 37 (the rebound force of the spring 37 can only overcome The vertical rod 34 is driven to rotate upward in cooperation with the guide rod 31 and the spiral groove 38, so that the rotating plate 35 rotates in the fixed ring 36. The push rod 15 rotates and drives the action block 32 to rotate at the same time. The horizontal height of the push rod 15 is flush with the distance between the lower port of the storage cover 5 and the pad. If necessary, the rotating rod 33 can be set as a telescopic rod with lockable height (this is the prior art and will not be elaborated on here).

[0030] Reference Figure 1-Figure 3The polishing structure includes a hydraulic rod 13 fixedly arranged on the lower surface of the upper platen 1, a motor is fixedly installed on the driving end of the hydraulic rod 13, a polishing disc 4 is fixedly installed on the driving end of the motor, the motor rotates to drive the polishing disc 4 to rotate to polish the wafer 6, the hydraulic rod 13 is telescopic to drive the polishing disc 4 to move up and down, a support rod 12 and a fixed plate 14 are fixedly installed on the driving end of the hydraulic rod 13, and two gear rods 13 are respectively fixedly arranged at both ends of the fixed plate 14, the lower pressing half ring 11 is fixedly arranged on the upper end of the support rod 12, and the support rod 12 extends upward, so that the polishing disc 4 can be lowered to a lower height than the initial height ( Figure 1 When the half ring 11 is pressed down, the contact with the pressing plate 30 is maintained.

[0031] Reference Figure 9-12 , and also includes a polishing table 16, which is fixedly arranged on the lower table 2, and the upper surface of the polishing table 16 is flush with the upper surface of the pad, and the polishing table 16 is located on the circular motion trajectory of the push rod 15. The rotation of the push rod 15 can drive the bottommost chip 6 in the storage cover 5 to fall exactly on the center position of the polishing table 16, and a limit frame 17 is placed on the polishing table 16. The upper and lower sides of the polishing table 16 and the limit frame 17 are provided with magnetically attracted magnets, which can ensure the relative stability between the polishing table 16 and the limit frame 17, and ensure the stability of polishing.

[0032] The limit frame 17 is provided with a flipping structure for flipping and polishing the wafer 6, and an extrusion half ring 39 is provided on the flipping structure, and the two ends of the extrusion half ring 39 are arranged in a trapezoidal shape. The flipping structure includes two clamping rings 18 slidably arranged on the limit frame 17, and the clamping rings 18 are made of low-hardness materials such as rubber to prevent damage to the clamping of the wafer 6. Triangular blocks 46 are fixedly installed at both ends of the two clamping rings 18, and a spring three 47 is commonly arranged between the two ends of the two clamping rings 18. The two clamping rings 18 are located on the same circular arc, and the height of the upper surfaces of the two clamping rings 18 is slightly lower than the height of the limit frame 17 to prevent the wafer 6 from slipping, and the diameter of the wafer 6 is larger than the inner diameter formed between the two clamping rings 18, and smaller than the inner diameter of the limit frame 17 and the outer diameter formed between the two clamping rings 18. When the clamping rings 18 move in a direction away from each other, the wafer 6 just falls onto the polishing table 16, and when the two clamping rings 18 are close to each other, the wafer 6 on the polishing table 16 can be fixedly clamped.

[0033] A fixing frame 10 is fixedly installed on the lower table 2, and an extrusion half ring 39 is slidably installed on the fixing frame 10 up and down. The upward movement of the extrusion half ring 39 will drive the two clamping rings 18 to move away from each other through the two triangular blocks 46. An action rod 40 is fixedly installed on one side of the extrusion half ring 39. The rotation of the action block 32 can drive the action rod 40 to lift, and the intersection of the action block 32 and the action rod 40 is wedge-shaped. When the push rod 15 rotates, it can drive the action block 32 and the action rod 40 to contact each other, so that the action rod 40 slides upward. When the action block 32 rotates more than 90°, the action rod 40 is no longer subject to the extrusion and lifting force of the action block 32 and then drops back to the initial state.

[0034] Reference Figure 5-Figure 12 , also includes two tooth plates 23, two slots are provided on the lower plate 2, the two tooth plates 23 are slidably arranged in the corresponding slots, a lifting structure is installed between the lower plate 2 and the polishing table 16, the lifting structure is used to push the polished wafer 6 upward, connecting frames 45 are fixedly installed on both sides of the limit frame 17, short shafts are fixedly installed on the sides of the two connecting frames 45 away from each other, and the two short shafts are rotatably arranged on the corresponding tooth plates 23, one-way bearings 1 are fixedly installed at both ends of the two short shafts, gears 44 are fixedly installed on the outer sides of the two one-way bearings 1, and the tooth plate 23 is located between the corresponding gear 44 and the connecting frame 45.

[0035] Two gear rods 28 and two fixed columns are fixedly installed on the lower table 2. When the two gears 44 move up to a certain height, they can mesh and rotate with the gear rod 28 under the action of the one-way bearing 1. A horizontal shaft is rotatably installed between the two fixed columns and the corresponding gear rods 28. One-way bearings 2 are fixedly installed on the two horizontal shafts. Gears 1 41 are fixedly installed on the outer sides of the two one-way bearings 2. Gear rod 1 3 is meshed with gear 1 41 for use. When the gear rod 1 3 moves up, it can drive the horizontal shaft to rotate through the one-way bearing 2. Gear 2 42 is fixedly installed on the two horizontal shafts. A round shaft is rotatably installed on one side of the two gear rods 28. Gears 3 43 are fixedly installed on the two round shafts, and the two gears 3 43 are meshed with the corresponding gear plate 23 and gear 2 42.

[0036] The lower ends of the two tooth plates 23 are fixedly installed with extrusion blocks 27, and two springs 22 are fixedly installed between the lower ends of the two tooth plates 23 and the lower table 2. A transverse groove is provided in the lower table 2, and two moving rods 21 are slidably installed in the transverse groove. The lower end of the extrusion block 27 and the two ends of the moving rod 21 are arranged in an inclined surface. The downward movement of the extrusion block 27 will make the two moving rods 21 approach each other. A vertical groove is provided in the lower table 2, and a sliding hole 29 is provided on the polishing table 16, and the vertical groove, the transverse groove and the sliding hole 29 are connected. A sliding rod 20 is slidably installed in the vertical groove and the sliding hole 29, and a plurality of lifting rods 26 are fixedly installed on the upper end of the sliding rod 20. A moving hole is provided on the polishing table 16, and the moving hole and the sliding hole 29 are connected. The two ends of the extrusion half ring 39 are connected, and a connecting rod 28 is fixedly installed between them, and the connecting rod 28 slides in the movable hole, and a round rod 25 is slidably installed in the sliding hole 29, and a vertical hole is opened in the middle position of the connecting rod 28, and the round rod 25 slides in the vertical hole, a limit block 24 is fixedly installed on one side of the round rod 25, and a lifting plate 19 is fixedly installed on the upper end of the round rod 25. The lifting plate 19 is made of rubber or a material with lower hardness to prevent damage to the wafer 6. In the absence of any force, the upper surface height of the lifting plate 19 is flush with the upper surface of the polishing table 16, the lower end surface of the round rod 25 is higher than the lowest surface of the connecting rod 28, and the round rod 25, the limit block 24 and the lifting plate 19 all slide in the sliding hole 29.

[0037] It is further explained that the above-mentioned fixed connection should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be welding, gluing, or one-piece molding, etc., which are conventional means well known to those skilled in the art.

[0038] The specific implementation of the present invention is as follows:

[0039] Polishing one side: place the wafer 6 to be polished in the storage cover 5, drive the hydraulic rod 13 to extend and drive the polishing disc 4 to move downward, when it falls to a certain height, the pressing half ring 11 contacts the pressing plate 30, and drives the pressing plate 30 to move downward, and the pressing plate 30 moves downward and drives the guide rod 31 to move in the spiral groove 38 through the vertical rod 34, and at this time, the push rod 15 is driven to approach the wafer 6 on the pad under the setting of the spiral groove 38, and the push rod 15 rotates to push the wafer 6 on the upper surface of the pad onto the two clamping rings 18, when the wafer 6 is about to reach the center position of the polishing table 16, the action block 32 contacts the action rod 40, and the action block 32 drives the action rod 40 to rise as the push rod 15 rotates, and at this time, the action rod 40 drives the extrusion half ring 39 to move upward, and the extrusion half ring 39 moves upward The movement will make the two triangular blocks 46 move away from each other. At this time, the spring three 47 is stretched, and the two triangular blocks 46 move away from each other, driving the two clamping rings 18 to move away from each other, until the wafer 6 reaches the center position of the polishing table 16. At this time, the movement distance between the two clamping rings 18 is the largest, and the wafer 6 falls on the upper surface of the polishing table 16 and is between the two clamping rings 18. Then the action block 32 and the action rod 40 are staggered (moved away) with each other, and the action rod 40 drives the extrusion half ring 39 to move downward. At this time, under the action of the spring three 47, the two clamping rings 18 approach each other to clamp the wafer 6 to keep the wafer 6 stable before polishing. At this time, the polishing disk 4 just reaches the top of the wafer 6 and contacts it, and the push rod 15 also stops rotating and stays between the polishing table 16 and the storage cover 5 (but has not reached the initial position, the initial position is Figure 4 State), at this time, the driving motor drives the polishing disc 4 to polish the wafer 6.

[0040] Turn over the wafer 6: when the single-side polishing of the wafer 6 is completed, the hydraulic rod 13 is driven to shorten and drive the polishing plate 4 to rise. While the driving end of the hydraulic rod 13 shortens, it drives the two gear rods 1 3 to move upward through the fixed plate 14. At this time, the gear rod 1 3 drives the gear 1 41 to rotate, and drives the gear 2 42 to rotate through the horizontal axis. The rotation of the gear 2 42 drives the gear 3 43 to rotate, and the rotation of the gear 3 43 drives the tooth plate 23 to move upward. The two tooth plates 23 move upward and drive the limit frame 17 to move upward through the connecting frame 45. When moving a certain distance, the gear 44 is meshed with the gear rod 2 8, driving the limit The frame 17 and the structure on the limit frame 17 rotate together. When the moving distance is greater than the radius of the limit frame 17, the gear four 44 drives the limit frame 17 to rotate to a vertical state, and then moves upward until the limit frame 17 rotates and flips 180° to complete the flipping of the wafer 6; while the hydraulic rod 13 is running, it drives the pressing half ring 11 to rise to the bottom of the fixed ring 36 through the support rod 12 (at this time the spring two 37 is still stretched). During the rising process of the pressing half ring 11, the vertical rod 34 is driven to rotate under the rebound force of the spring two 37. At this time, the push rod 15 and the rotating rod 33 remain relatively stationary.

[0041] Polishing the flip surface: at this time, the driving end of the hydraulic rod 13 is driven to extend it again, and the gear rod 3 moves downward. The gear rod 3 moves downward and drives the gear 41 to rotate in the opposite direction. The reverse rotation of the gear 41 will not drive the horizontal axis to rotate through the one-way bearing 2. Under the action of gravity, the gear plate 23 drives the horizontal axis to rotate in the opposite direction through the gear 3 43 and the gear 2 42, so that the overall structure on the limit frame 17 moves downward and falls on the polishing table 16 again. At the same time, according to the above principle, the guide rod 31 drives the push rod 15 to rotate again until the polishing disk 4 contacts the wafer 6. At this time, the push rod 15 rotates to the initial state, and the motor is turned on to drive the polishing disk 4 to polish the other side of the wafer 6.

[0042] When polishing is completed: when the polishing of the front and back sides of the wafer 6 is completed, the driving end of the hydraulic rod 13 is driven to shorten again, so that the polishing disc 4 returns to the initial state. When the hydraulic rod 13 moves to drive the toothed rod 3 to separate from the gear 41, the friction between the gear 41 and the toothed rod 3 no longer affects the toothed plate 23. The toothed plate 23 drives the limit frame 17 and the structure thereon to fall more quickly. At this time, the spring 22 is subjected to the extrusion force, and the extrusion block 27 squeezes the moving rod 21 downward. The two moving rods 21 approach each other and drive the slide bar 20 to move upward. The slide bar 20 drives multiple lifting rods 26 to move upward. The lifting rods 26 on both sides first contact the connecting rod 28 and drive it to move upward. The upward movement of the connecting rod 28 will drive the two clamping rings 18 to move away from each other through the extrusion semi-ring 39. At this time, the wafer 6 is no longer clamped, and then the middle lifting rod 26 squeezes the round rod 25 upward, and the round rod 25 drives the lifting plate 19 upward to rise, so that the polished wafer 6 returns to the top of the two clamping rings 18, which is convenient for personnel to collect the wafer 6.

[0043] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A polishing device for fine grinding optical parts, comprising an upper platen (1) and a lower platen (2), which are fixed to each other, characterized in that: Also includes: A plurality of wafers (6) are placed on the lower platen (2) through a holding structure to wait for polishing; A pushing structure, which is arranged between the lower platen (2) and the upper platen (1), and is used to push the wafers (6) on the containing structure to polishing in sequence, and an action block (32) is installed on the pushing structure; A polishing structure, which is arranged on an upper platen (1) and is used for polishing a wafer (6), wherein a lower pressing half ring (11) and two toothed rods (3) are installed on the polishing structure; A polishing table (16) is fixedly arranged on the lower table (2), a limiting frame (17) is placed on the polishing table (16), a turning structure for turning and polishing the wafer (6) is installed on the limiting frame (17), and an extrusion half ring (39) is installed on the turning structure; Two tooth plates (23) are both slidably arranged on the lower table (2); a lifting structure is installed between the lower table (2) and the polishing table (16); the lifting structure is used to push the flipped polished wafer (6) upwards in cooperation with the pushing structure.

2. The polishing device for fine grinding optical parts according to claim 1, characterized in that: The containing structure comprises a support platform and an electric telescopic rod (7) fixedly arranged on a lower platform (2); a storage cover (5) is fixedly installed on the driving end of the electric telescopic rod (7); a plurality of wafers (6) are stacked in the storage cover (5); the bottom wafer (6) is placed on the support platform and is located directly below the support platform and the storage cover (5).

3. The polishing device for fine grinding optical parts according to claim 1, characterized in that: The pushing structure comprises a rotating rod (33) fixedly arranged on the lower platform (2), a push rod (15) is rotatably mounted on the rotating rod (33), and an action block (32) is fixedly mounted on the lower surface of the push rod (15), a spiral groove (38) is provided on the push rod (15), and a rotating mechanism is installed on the upper platform (1).

4. The polishing device for fine grinding optical parts according to claim 3, characterized in that: The rotating mechanism comprises a fixed rod (9) fixedly mounted on the lower surface of the upper platform (1), a fixed ring (36) fixedly mounted on the lower end of the fixed rod (9), a rotating plate (35) rotatably mounted in the middle of the fixed ring (36), a spring 2 (37) fixedly mounted on the lower surface of the rotating plate (35), a pressing plate (30) fixedly mounted on the lower end of the spring 2 (37), a lower pressing half ring (11) used in conjunction with the pressing plate (30), a vertical rod (34) fixedly mounted on the lower surface of the pressing plate (30), a guide rod (31) fixedly mounted on the lower end of the vertical rod (34), the guide rod (31) slidingly mounted in the spiral groove (38) for use, and the setting of the spiral groove (38) enables the guide rod (31) to only rotate 360° along its path therein.

5. The polishing device for fine grinding optical parts according to claim 1, characterized in that: The polishing structure comprises a hydraulic rod (13) fixedly arranged on the lower surface of the upper table (1), a motor fixedly installed on the driving end of the hydraulic rod (13), a polishing disc (4) fixedly installed on the driving end of the motor, a support rod (12) and a fixed plate (14) fixedly installed on the driving end of the hydraulic rod (13), and two toothed rods (3) fixedly arranged at the two ends of the fixed plate (14), respectively, and a lower pressing half ring (11) fixedly arranged on the upper end of the support rod (12).

6. The polishing device for fine grinding optical parts according to claim 1, characterized in that: The flip structure comprises two clamping rings (18) slidably mounted on a limit frame (17), triangular blocks (46) being fixedly mounted at both ends of the two clamping rings (18), and a spring (47) being commonly arranged between both ends of the two clamping rings (18). A fixing frame (10) is fixedly mounted on the lower platform (2), and an extrusion half ring (39) is slidably mounted on the fixing frame (10). When the extrusion half ring (39) moves upward, it drives the two clamping rings (18) to move away from each other through the two triangular blocks (46). An action rod (40) is fixedly mounted on one side of the extrusion half ring (39). The rotation of the action block (32) can drive the action rod (40) to rise. When the action block (32) rotates more than 90°, the action rod (40) is lowered accordingly.

7. The polishing device for fine grinding optical parts according to claim 1, characterized in that: Connecting frames (45) are fixedly mounted on both sides of the limiting frame (17); short shafts are fixedly mounted on the sides of the two connecting frames (45) that are away from each other, and the two short shafts are rotatably arranged on the corresponding toothed plates (23); one-way bearings (1) are fixedly mounted on both ends of the two short shafts; gears (44) are fixedly mounted on the outer sides of the two one-way bearings (1); and the toothed plates (23) are located between the corresponding gears (44) and the connecting frames (45).

8. The polishing device for fine grinding optical parts according to claim 7, characterized in that: Two gear rods 2 (8) and two fixed columns are fixedly mounted on the lower platform (2). When the two gears 4 (44) move up to a certain height, they can mesh and rotate with the gear rod 2 (8) under the action of the one-way bearing 1. A transverse shaft is rotatably mounted between the two fixed columns and the corresponding gear rods 2 (8). One-way bearings 2 are fixedly mounted on the two transverse shafts. Gears 1 (41) are fixedly mounted on the outer sides of the two one-way bearings 2. Gear rods 1 (3) mesh with gears 1 (41) for use. When the gear rods 1 (3) move up, they can drive the transverse shafts to rotate through the one-way bearings 2. Gears 2 (42) are fixedly mounted on the two transverse shafts. A round shaft is rotatably mounted on one side of the two gear rods 2 (8). Gears 3 (43) are fixedly mounted on the two round shafts, and the two gears 3 (43) mesh with the corresponding gear plates (23) and gears 2 (42).

9. The polishing device for fine grinding optical parts according to claim 1, characterized in that: The lifting structure comprises extrusion blocks (27) respectively fixedly mounted on the lower ends of the two tooth plates (23); two springs (22) are fixedly mounted between the lower ends of the two tooth plates (23) and the lower platform (2); a transverse groove is provided in the lower platform (2); two moving rods (21) are slidably mounted in the transverse groove; downward movement of the extrusion block (27) causes the two moving rods (21) to approach each other.

10. The polishing device for fine grinding optical parts according to claim 9, characterized in that: A vertical groove is provided in the lower plate (2), a sliding hole (29) is provided on the polishing table (16), and the vertical groove, the transverse groove and the sliding hole (29) are connected to each other, a sliding rod (20) is slidably installed in the vertical groove and the sliding hole (29), a plurality of lifting rods (26) are fixedly installed on the upper end of the sliding rod (20), a moving hole is provided on the polishing table (16), and the moving hole is connected to the sliding hole (29), and the two ends of the extrusion half ring (39) are fixedly installed between them. A connecting rod (28) is installed, and the connecting rod (28) slides in the movable hole. A round rod (25) is slidably installed in the sliding hole (29). A vertical hole is opened on the connecting rod (28), and the round rod (25) slides in the vertical hole. A limit block (24) is fixedly installed on one side of the round rod (25). A lifting plate (19) is fixedly installed on the upper end of the round rod (25), and the round rod (25), the limit block (24) and the lifting plate (19) all slide in the sliding hole (29).

Images