High-precision high-static-pressure differential pressure transmitter

Abstract

The invention relates to the technical field of force or fluid pressure measurement, in particular to equipment or an instrument for measuring two or more fluid pressure difference values. According to the technical scheme, the high-precision high-static-pressure differential pressure transmitter comprises a pressure sensing assembly and a positive and negative pressure cavity located below the pressure sensing assembly, the pressure sensing assembly comprises a pressure sensing chip and a pressure sensing base, a substrate is arranged on the pressure sensing base, the pressure sensing chip is arranged on the pressure sensing base through the substrate, and the positive and negative pressure cavity is located below the pressure sensing assembly. The positive and negative pressure cavity comprises a differential pressure positive electrode body, a differential pressure negative electrode body and a middle partition plate located between the differential pressure positive electrode body and the differential pressure negative electrode body, a positive isolation sheet is installed on the outer side of the differential pressure positive electrode body, a negative isolation sheet is installed on the outer side of the differential pressure negative electrode body, and pressure partition plates are fixed to the positive isolation sheet and the negative isolation sheet. The high-precision and high-static-pressure differential pressure transmitter solves the problems that in the prior art, precision is low, errors are large, damage is prone to occurring, and the transmitter cannot be used in the high-static-pressure environment, and the purposes that packaging cost is low, the structure is simple, precision is high, and the transmitter can be used in the high-static-pressure environment are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of measuring force, stress, torque, work, mechanical power, mechanical efficiency or fluid pressure, in particular to a device or instrument for measuring the pressure difference of two or more fluids. Background Art

[0002] In actual industrial sites, there are application scenarios for high-precision and high-static pressure range pressure and liquid level measurement. Considering that the actual product measurement pressure is 60kPa~250kPa, but during on-site debugging, the pipeline pressure will be 30~40MPa. For example: when there is high static pressure in the one-way or two-way fluid direction of the pipeline, when the measurement pressure is such as unidirectional static pressure 30~40MPa, it often causes damage to the transmitter product or data overflow, accompanied by the output accuracy of ±1%FS~±2%FS, and the measurement data will fluctuate and be unstable, resulting in actual production efficiency and waste of resources, causing some production lines to stop or stop; the traditional differential pressure transmitter uses a large pressure sensing chip packaging structure, the product has poor static pressure resistance, high cost, poor reliability, zero-point thermal hysteresis, In the case of zero drift, the measurement accuracy is poor, the error precision will reach ±2%FS, the annual drift will reach more than 0.5%FS, and the packaging process is complicated, the manufacturing efficiency is low, etc. In order to ensure the high quality requirements of the transmitter measuring instrument, the industrial site requires the measuring instrument accuracy to be ±0.03%FS@20℃, the full temperature range to be ±0.1%FS@-40~85℃, and the high static pressure needs to reach 30~40MPa; such as the differential pressure transmitter, the high static pressure capacity is required to reach 30~40MPa, but the actual measured pressure is 60~250kpa, and the accuracy is required to reach ±0.03%FS. The measurement error between the two differs by 1000 times. The traditional differential pressure transmitter with a measurement accuracy of ±0.2%FS@20℃ is already the limit and cannot meet the use requirements.

[0003] For example, a Chinese patent with publication number CN118936722A discloses a differential pressure transmitter and provides the following technical solution: the present invention discloses a differential pressure transmitter, including a differential pressure transmitter body, the two side walls of the differential pressure sensor of the differential pressure transmitter body for setting the diaphragm are provided with inner cavities, the two diaphragms of the differential pressure transmitter body are provided one by one on the first cavity walls of the two inner cavities of the differential pressure sensor, the first ends of the two liquid-filling channels in the differential pressure sensor are connected one by one with the two diaphragms; the first cavity wall of the inner cavity is relatively distributed with the cavity opening. In this solution, the two side walls of the differential pressure sensor originally used to set the diaphragm are provided with inner cavities, so that the spacing of the side wall parts of the differential pressure sensor for setting the diaphragm is reduced, so that the spacing after the diaphragm is set is reduced, and then the horizontal effective length of the two liquid-filling channels is shortened, and then the differential pressure generated by the deadweight of the liquid column in the two liquid-filling channels on both sides of the sensor chip is also reduced accordingly, so that the influence of the differential pressure transmitter on the change of the installation position is also reduced. However, the above-mentioned differential pressure transmitter cannot be used well under high static pressure conditions. In a high static pressure environment, the transmitter may have low accuracy, large errors, and damage, and cannot meet the use requirements. Summary of the invention

[0004] The present invention solves the problems of low precision, large error, easy damage and inability to be used in high static pressure environments in the prior art, and proposes a high-precision high static pressure differential pressure transmitter, which achieves the goals of low packaging cost, simple structure, high precision and usability in high static pressure environments.

[0005] To achieve the above object, the present invention adopts the following technical solution: A high-precision, high-static pressure differential pressure transmitter comprises a pressure-sensitive component and positive and negative pressure cavities located below the pressure-sensitive component, the pressure-sensitive component comprises a pressure-sensitive chip and a pressure-sensitive base, the pressure-sensitive base is provided with a substrate, the pressure-sensitive chip is arranged on the pressure-sensitive base through the substrate, the positive and negative pressure cavities comprise a differential pressure positive electrode body and a differential pressure negative electrode body and a middle partition plate located therebetween, a positive isolation sheet is installed on the outer side of the differential pressure positive electrode body, a negative isolation sheet is installed on the outer side of the differential pressure negative electrode body, and pressure partition plates are fixed on both the positive isolation sheet and the negative isolation sheet.

[0006] The advantage of this design is that it can effectively isolate positive and negative pressures, ensure measurement accuracy, and improve the product's overload resistance and stability.

[0007] Preferably, the pressure-sensitive chip is fixed on the pressure-sensitive base by a curing process, a gold layer is printed on the substrate, and the pressure-sensitive chip is connected to the substrate by gold wire bonding to derive the pin signal in the pressure-sensitive base.

[0008] The advantage of this design is that it can improve the stability and reliability of the pressure-sensing chip while ensuring the efficiency and accuracy of signal transmission.

[0009] Preferably, the pressure-sensing base is welded with an argon arc-welded sheath tube, and the top of the pressure-sensing component is wrapped with an electronic compartment interface.

[0010] Preferably, a welding sleeve surrounds the outer side of the pressure-sensing component, and a signal transmission board is provided on the top of the pressure-sensing component.

[0011] The advantage of this design is that it can effectively protect the pressure-sensitive components and signal transmission boards from the influence of the external environment, while improving the product's waterproof and dustproof capabilities.

[0012] Preferably, the signal transmission board collects analog electrical signals from the pressure-sensing chip, amplifies the signals from the sensor interface J2 through a conditioning chip and converts them into digital signals. The conditioning chip uses 16 bits or 24 bits, and the amplification gain is 0 to 128PGA; pin 1 of the sensor interface J2 is connected to the reference voltage, pin 2 is connected in parallel to pin 1 of capacitor C6, pin 1 of capacitor C5, and pin 6 of the conditioning chip, pin 3 is connected in parallel to pin 1 of capacitor C4, pin 2 of capacitor C5, and pin 5 of the conditioning chip, and pin 4 is connected in parallel to pin 1 of resistor RJ1, pin 1 of capacitor C3, and BT+; pin 2 of capacitor C6 is connected in parallel to the ground wire and pin 2 of capacitor C4.

[0013] The advantage of this design is that it can achieve signal amplification and conversion, improve signal accuracy and stability, and ensure efficient and accurate signal transmission.

[0014] Preferably, after the signal transmission board receives the digital signal, the MCU performs analog signal processing and converts it into a corresponding analog electrical signal. Pin 37 of the MCU is connected to pin 8 of chip U1, pin 38 is connected to pin 9 of chip U1, pin 39 is connected to pin 7 of chip U1, and pin 40 is connected to pin 10 of chip U1.

[0015] The advantage of this design is that it can realize analog signal processing and conversion, improve signal accuracy and stability, and ensure efficient and accurate signal transmission.

[0016] Preferably, pin 16 of the chip U1 is connected in parallel to one end of the capacitor group and the cathodes of the Zener diodes Z3 and Z4, the other end of the capacitor group is connected to LOOP+, pin 14 of the chip U1 is connected in parallel to pin 1 of capacitor C8, pin 2 of the capacitor C8 is connected to pin 1 of capacitor C9, and pin 2 of the capacitor C9 is connected in parallel to the cathodes of the Zener diodes Z18 and Z19 and HART-OUT.

[0017] The advantage of this design is that it can achieve signal stabilization and protection, improve signal stability and reliability, and ensure efficient and accurate signal transmission.

[0018] Preferably, a welding bracket is provided in the pressure-sensing component and the positive and negative pressure chambers, the pressure-sensing component is connected to the positive and negative pressure chambers through the welding bracket, an oil filling hole is provided on the pressure-sensing base, and the internal area of ​​the welding bracket is filled with pressure-transmitting medium silicone oil.

[0019] The advantage of this design is that it can effectively fix the pressure-sensing components and the positive and negative pressure chambers, thereby improving the stability and reliability of the product.

[0020] Preferably, the MCU receives a corresponding four-wire HART communication interface and outputs signals via a HART chip.

[0021] The advantage of this design is that it can realize signal communication and output, and improve the communication capability and functionality of the product.

[0022] Preferably, the pressure-sensitive chip is a MEMS pressure-sensitive chip, and the substrate is a gold-plated ceramic substrate.

[0023] The advantage of this design is that it can improve the sensitivity and accuracy of the pressure-sensing chip, while improving the conductivity and corrosion resistance of the substrate.

[0024] Compared with the prior art, the invention has the following beneficial effects.

[0025] 1. The present invention adopts an innovative high-precision and high static pressure overload structural arrangement. This design significantly enhances the transmitter's ability to withstand high pressure and vibration in extreme industrial environments. This structural arrangement not only optimizes the product's mechanical properties, enabling it to withstand a static pressure of up to 30-40MPa, but also maintains stability when encountering severe vibrations. This design not only reduces the risk of damage to the equipment due to high static pressure, but also greatly improves production efficiency, ensuring the accuracy of measurement data and the long-term reliability of the equipment during continuous production.

[0026] 2. In the overall arrangement of the differential pressure forward and reverse directions and the middle partition, the present invention carefully designs the forward and reverse oil circuits. This layout effectively ensures the uniform transmission of pressure under high static pressure environment, avoids the problems of oil circuit blockage and signal distortion. The use of the middle partition not only enhances the stability of the structure, but also optimizes the response speed of the pressure sensor. This overall arrangement enables the transmitter to maintain high-precision measurement performance under complex industrial field conditions, meeting the user's high standards for measurement accuracy and quality control.

[0027] 3. The present invention adopts high-precision signal processing technology and optimized control circuits to achieve accurate amplification and conversion of tiny signals, ensuring the stability and accuracy of the output signal. This circuit design not only reduces signal drift and error, but also improves the real-time and reliability of the signal. During long-term operation, the transmitter can maintain a high-precision output within ±0.03% FS and an annual drift within ±0.1% FS, providing users with high-standard measurement solutions and excellent performance experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is an overall cross-sectional view of a high-precision high static pressure differential pressure transmitter of the present invention.

[0029] Figure 2 The present invention is a partial cross-sectional view of a pressure sensing component of a high-precision high-static pressure differential pressure transmitter.

[0030] Figure 3 This is a partial cross-sectional view of the positive and negative pressure chambers of a high-precision high static pressure differential pressure transmitter of the present invention.

[0031] Figure 4 The present invention discloses a circuit diagram of a conditioning chip for a high-precision high-static pressure differential pressure transmitter.

[0032] Figure 5 The present invention discloses an MCU circuit diagram of a high-precision high static pressure differential pressure transmitter.

[0033] Figure 6 The present invention discloses a HART chip circuit diagram of a high-precision high static pressure differential pressure transmitter.

[0034] Illustration Description: 1. Differential pressure positive electrode; 2. Differential pressure negative electrode; 3. Middle partition; 4. Pressure partition; 5. Forward isolation sheet; 6. Reverse isolation sheet; 9. Welding bracket; 10. Base plate; 11. Pressure sensing chip; 12. Pressure sensing base; 13. Protective sleeve; 14. Electronic compartment interface 15. Welding sleeve; 16. Signal transmission board; 17. Dielectric silicone oil. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the present disclosure clearer, the following will further describe the embodiments of the present disclosure in detail with reference to the accompanying drawings. The proportions of the components are not drawn according to the actual proportions, and the proportions and sizes shown in the accompanying drawings should not limit the substantial technical scheme of the present invention. These embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described.

[0036] See also Figure 1-6As shown, a high-precision high-static pressure differential pressure transmitter includes a pressure-sensitive component and positive and negative pressure cavities located below the pressure-sensitive component, the pressure-sensitive component includes a pressure-sensitive chip 11 and a pressure-sensitive base 12, the pressure-sensitive base 12 is provided with a substrate 10, the pressure-sensitive chip 11 is arranged on the pressure-sensitive base 12 through the substrate 10, the positive and negative pressure cavities include a differential pressure positive electrode body 1 and a differential pressure negative electrode body 2 and a middle partition plate 3 located therebetween, a positive isolation sheet 5 is installed on the outer side of the differential pressure positive electrode body 1, a negative isolation sheet 6 is installed on the outer side of the differential pressure negative electrode body 2, and pressure partition plates 4 are fixed on both the positive isolation sheet 5 and the negative isolation sheet 6.

[0037] The present invention deforms the welding isolation diaphragm through the forward and reverse fluid directions of the medium, and changes the Wheatstone bridge value of the MEMS pressure sensing chip under the action of the medium silicone oil 17, thereby realizing the change of the electrical signal, and through the ADC & DAC signal processing of the PCBA signal transmission board 16, the output analog signal 4-20mA or industrial HART & RS485 & FF communication signal is achieved. Among them, the forward fluid direction refers to the direction from left to right in the figure, and the reverse fluid direction refers to the direction from right to left in the figure.

[0038] like Figure 1 In one embodiment shown, Figure 1 This is an overall cross-sectional view of a high-precision high static pressure differential pressure transmitter of the present invention.

[0039] The present invention relates to a high-precision high-static pressure differential pressure transmitter, which mainly includes a pressure-sensing component and a positive and negative pressure chamber located below the pressure-sensing component. The pressure-sensing component is composed of a pressure-sensing chip 11 and a pressure-sensing base 12, wherein a substrate 10 is provided on the pressure-sensing base 12. The pressure-sensing chip 11 is arranged on the pressure-sensing base 12 through the substrate 10 to form an integral pressure-sensing unit.

[0040] The structure of the positive and negative pressure chamber is composed of a differential pressure positive body 1 and a differential pressure negative body 2, and an intermediate partition 3 is arranged between the two. A positive isolation sheet 5 is installed on the outside of the differential pressure positive body 1, and a negative isolation sheet 6 is installed on the outside of the differential pressure negative body 2. Pressure partitions 4 are fixed on both isolation sheets 5 and 6 to enhance the structural stability and sealing performance of the transmitter.

[0041] In order to ensure the stable operation of the pressure-sensitive chip 11, the pressure-sensitive chip is fixed on the pressure-sensitive base 12 through a curing process. At the same time, a gold layer is printed on the substrate 10. This design enables the pressure-sensitive chip 11 to be connected to the substrate 10 by gold wire bonding, thereby deriving the pin signal in the pressure-sensitive base 12. This process ensures the reliability of signal transmission.

[0042] The pressure-sensing base 12 is connected to the protective sleeve 13 by argon arc welding, ensuring the sealing and pressure resistance of the entire module. The top of the pressure-sensing component is wrapped with an electronic compartment interface 14, which facilitates the installation and connection of subsequent electronic components. The outside of the pressure-sensing component is surrounded by a welding sleeve 15, which is used to enhance the protection of the internal structure and provide better anti-vibration ability.

[0043] In the overall design, a signal transmission board 16 is also provided on the top of the pressure sensing component, which is responsible for processing and transmitting the pressure signal collected by the pressure sensing chip 11. In order to ensure the stability and accuracy of the signal, welding brackets 9 are provided in the pressure sensing component and the positive and negative pressure chambers, which connect the pressure sensing component with the positive and negative pressure chambers to form a stable overall structure.

[0044] It is worth noting that the pressure sensing base 12 is provided with an oil filling hole, and the inner area of ​​the welding bracket 9 is filled with pressure transmission medium silicone oil 17. This design not only improves the pressure resistance of the transmitter, but also optimizes the fluid dynamics characteristics of signal transmission, ensuring stability in a high static pressure environment.

[0045] The pressure sensing chip 11 used in the differential pressure transmitter is a MEMS pressure sensing chip, and the substrate 10 is a gold-plated ceramic substrate. This combination of material selection and structural design enables the sensor to have higher static pressure resistance, stability and long-term reliability.

[0046] The design of the high-precision high-static pressure differential pressure transmitter designed by the present invention has many advantages. First, the compactness of the structure and the modular design make the product more efficient in the production and maintenance process, and it is convenient for mass production. By adopting the combination of MEMS pressure-sensitive chip and gold-plated ceramic substrate, not only the sensing accuracy is improved and the stability of the output signal is ensured, but also the cost is greatly reduced. This design can effectively meet the customer's demand for high-precision measurement within ±0.03% FS and high static pressure ≥30MPa, thereby solving the problems of unstable measurement and instrument damage that are common in industrial sites.

[0047] Secondly, the reasonable layout of the welding bracket 9 and the setting of the pressure partition 4 effectively enhance the anti-vibration performance of the transmitter, especially in a high-pressure environment, ensuring the reliability and safety of the instrument. The application of the positive isolation sheet 5 and the negative isolation sheet 6 further optimizes the sealing performance of the positive and negative pressure chambers, avoids leakage during the measurement process, and thus improves the measurement accuracy and stability.

[0048] Finally, the oil filling hole and silicone oil filling technology in the design ensure the stability of the pressure transmission medium in a high static pressure environment, avoid signal fluctuations caused by bubble generation, improve the response speed, and ensure the rapid response capability of the transmitter.

[0049] In one embodiment, the positive ventilation area refers to the area where the positive fluid flows from the positive fluid direction 7 through the positive isolation sheet 5 and through the medium silicone oil 17 into the Figure 3 In the core module described in the embodiment, the MEMS pressure sensing chip 11 is used to realize the output of the overall forward analog signal. The reverse ventilation area refers to the reverse fluid direction 8 passing through the forward isolation sheet 6 and entering the medium silicone oil 17. Figure 3 In the core module described in the specification, the MEMS pressure sensing chip 11 is used to realize the output of the overall reverse analog signal. At the same time, with the action of the middle partition 3, the overall structural layout method of high static pressure and high precision can be guaranteed in both the forward and reverse directions, which can make the overall structure more reliable and compact, and is suitable for batch manufacturing and production.

[0050] When the transmitter is acted in the direction of the fluid, the PCBA signal transmission board 16 contacts the MEMS pressure-sensitive chip 11, and the high-vacuum and high-sealing oil-filling technology is used to enable the MEMS signal to be transmitted in real time and reliably. At this time, after the PCBA signal transmission board 16 processes the signal by ADC & DAC and implements the calibration software, it can achieve high-precision real-time output of ±0.03% FS and ensure the reliability of the signal.

[0051] like Figure 2 In one embodiment shown, Figure 2 This is a partial cross-sectional view of the pressure sensing component of a high-precision high static pressure differential pressure transmitter of the present invention. This is the core packaging module of the present invention. When the MEMS pressure sensing chip 11 is fixed on the TO pressure sensing base 12 through a curing process, the gold-plated ceramic substrate 10 is fixed on the TO pressure sensing base 12 through glue. Since the ceramic substrate 10 is printed with a gold layer, the MEMS pressure sensing chip 11 can be connected to the ceramic substrate 10 through gold wire bonding, thereby realizing the pin signal export in the TO pressure sensing base 12. At this time, the packaging of the core is completed. The peripheral structure part is to weld the TO pressure sensing base 12 to the protective sleeve 13 through argon arc welding. At this time, the overall sealing can be achieved. Since there is an oil injection hole on the TO pressure sensing base 12, the pressure transmission medium silicone oil is injected through the high vacuum silicone oil injection technology, so that the silicone oil fills the internal area of ​​the welding bracket 9. At this time, this high-pressure and high-precision core packaging module can be completed.

[0052] like Figure 3 In one embodiment shown, Figure 3This is a partial cross-sectional view of the positive and negative pressure chambers of a high-precision high-static pressure differential pressure transmitter of the present invention. This is the positive and negative pressure chamber welding module of the present invention. The differential pressure positive electrode body 1 and the differential pressure negative electrode body 2 are simultaneously subjected to argon arc welding with the middle partition plate 3. After welding, they are detected by leak detection equipment. To ensure that the oil filling process is completed, the first step is to weld the positive isolation sheet 5 on the differential pressure positive plate body 1, and then weld the sheet 4 on the positive isolation sheet 5, so that the positive pressurization area can form a closed loop, and the positive pressure end can work independently. The second step is to weld the reverse isolation sheet 6 on the differential pressure negative plate body 2, and then weld the sheet 4 on the reverse isolation sheet 6, so that the reverse pressurization area can form a closed loop, and at the same time act on the middle partition plate 3 in the positive and negative cavity bodies, which is used to realize the high static pressure processing method of the transmitter. The above steps are the semi-finished assembly of the welding module.

[0053] When the measuring medium enters the forward and reverse isolation sheets along the fluid direction, under the action of the medium fluid force, the MEMS pressure-sensitive chip 11 senses the corresponding pressure through the pressure-transmitting medium silicone oil 17, causing the silicon film of the MEMS chip itself to deform. At this time, the PCBA signal adapter board 16 is generally about 5V to 24V when powered on, which can make the MEMS pressure-sensitive chip 11 output an analog electrical signal. Generally, the greater the medium pressure, the stronger the analog electrical signal output by the MEMS pressure-sensitive chip 11; and the analog electrical signal is amplified and collected through the signal adapter board 16, and output as an analog signal 4-20mA or an industrial HART&RS485&FF communication signal through the signal calibration collection method.

[0054] like Figure 4 In one embodiment shown, Figure 4 This is a circuit diagram of a conditioning chip for a high-precision high-static pressure differential pressure transmitter of the present invention. The signal transmission board 16 collects analog electrical signals from the pressure-sensing chip 11, amplifies the signals from the sensor interface J2 through the conditioning chip and converts them into digital signals. The conditioning chip uses 16 bits or 24 bits, and the amplification gain is 0-128PGA; Pin 1 of the sensor interface J2 is connected to the reference voltage, Pin 2 is connected in parallel to Pin 1 of capacitor C6, Pin 1 of capacitor C5, and Pin 6 of the conditioning chip, Pin 3 is connected in parallel to Pin 1 of capacitor C4, Pin 2 of capacitor C5, and Pin 5 of the conditioning chip, Pin 4 is connected in parallel to Pin 1 of resistor RJ1, Pin 1 of capacitor C3, and BT+; Pin 2 of capacitor C6 is connected in parallel to the ground wire and Pin 2 of capacitor C4.

[0055] In one embodiment, when the product is working, the PCBA signal transmission board 12 collects analog electrical signals from the MEMS pressure sensing chip 6. Figure 4It can be seen that the J2 sensor interface (1, 2, 3, 4) amplifies the signal through the conditioning chip ADBRU. Generally, the conditioning chip adopts 16-bit or 24-bit signal processing, and the amplification gain is 0-128PGA, thereby realizing the transmission of digital signals and the conversion of electrical signals into digital signals with high-precision code values.

[0056] The design of the signal transmission board 16 plays a vital role in the entire high-precision high-static pressure differential pressure transmitter. Through the analog electrical signals collected from the MEMS pressure-sensing chip 11, the signal transmission board can amplify and digitally convert these signals through the conditioning chip, thereby ensuring the high quality and high stability of signal transmission. The use of 16-bit or 24-bit conditioning chips significantly improves the accuracy of signal processing, and can achieve more detailed signal amplification. The amplification gain range is 0 to 128PGA, which greatly enhances the transmitter's ability to respond to tiny signal changes. This high-precision signal processing solution not only improves the overall performance of the transmitter, but also reduces the measurement errors caused by signal attenuation or interference, ensuring the reliability of the product in various complex environments.

[0057] In addition, the design of the sensor interface J2 takes into account the flexibility and stability of the circuit. By carefully arranging the connections of each foot, the smooth transmission of the signal and reliable grounding are ensured, further reducing the impact of noise interference on signal processing. This electrical connection method effectively improves the anti-interference ability of the system and provides a stable working environment for the system. In practical applications, the working status of the product can quickly and accurately reflect the real-time pressure changes, improve the real-time and accuracy of data acquisition, and better meet the strict requirements of industrial sites for instrument accuracy and response speed.

[0058] In high static pressure environments, reliable signal transmission is particularly important. By adopting this signal processing method, the transmitter can maintain stable output under high pressure conditions and avoid signal fluctuations caused by changes in ambient pressure. At the same time, the output format of the digital signal enables it to seamlessly connect with modern data acquisition systems and control systems, facilitating subsequent data analysis and processing. This design not only improves the user's operational convenience, but also provides greater flexibility for system integration.

[0059] Finally, the design of the signal transmission board effectively reduces the complexity of the overall system, making maintenance and upgrades easier. Through standardized interfaces and modular design, users can easily perform troubleshooting and system upgrades, thereby reducing the system's operation and maintenance costs.

[0060] like Figure 5 In one embodiment shown, Figure 5The MCU circuit diagram of the high-precision high static pressure differential pressure transmitter of the present invention is shown. After the signal transmission board 16 receives the digital signal, the MCU performs analog processing of the signal and converts it into a corresponding analog electrical signal. The 37th pin of the MCU is connected to the 8th pin of the chip U1, the 38th pin is connected to the 9th pin of the chip U1, the 39th pin is connected to the 7th pin of the chip U1, and the 40th pin is connected to the 10th pin of the chip U1.

[0061] In one embodiment, when the product is working, the PCBA signal transmission board 12 Figure 4 The corresponding digital signal is received in the digital transmission, and the analog signal is processed by MCU, and the corresponding electronic devices, capacitors, resistors, inductors, TVS devices, and corresponding program debugging are used to Figure 5 It can be seen from the MCU that there are corresponding HART communication interfaces in 37~40, which convert digital signals into corresponding analog electrical signals.

[0062] like Figure 6 In one embodiment shown, Figure 6 The circuit diagram of the HART chip of a high-precision high static pressure differential pressure transmitter of the present invention is shown. The 16-pin of the chip U1 is connected in parallel to one end of the capacitor group and the cathodes of the voltage-stabilizing diodes Z3 and Z4, and the other end of the capacitor group is connected to LOOP+. The 14-pin of the chip U1 is connected in parallel to the 1-pin of the capacitor C8, the 2-pin of the capacitor C8 is connected to the 1-pin of the capacitor C9, and the 2-pin of the capacitor C9 is connected in parallel to the cathodes of the voltage-stabilizing diodes Z18 and Z19 and HART-OUT. The MCU receives the corresponding four-wire HART communication interface and outputs the signal via the HART chip.

[0063] In one embodiment, when the product is working, the power supply 16-24V input signal is generally powered on, and the PCBA signal transmission board 16 receives the Figure 6 The corresponding four-wire HART communication interface is received in the MCU. It can be seen that pins 7, 8, 9, and 10 receive HART signals and output signals through the HART chip. At this time, reliable HART two-wire transmission at the output end can be achieved, and LOOP+ and HART-OUT can be seen.

[0064] In the high-precision high static pressure differential pressure transmitter of the present invention, the integrated design of MCU and HART chip provides significant advantages for signal processing and transmission. First, the signal transmission board 16 performs analog processing on the received digital signal through the MCU, ensuring high-quality conversion of the signal. The connection between pins 37 to 40 of the MCU and the chip U1 forms an efficient data transmission path, which promotes the smooth flow of signals in different processing stages. This design not only improves the response speed of the system, but also ensures the real-time performance of signal processing, so that the transmitter can quickly and accurately reflect pressure changes in a dynamic pressure environment.

[0065] The rational structure of MCU enables it to work with other electronic devices such as capacitors, resistors, inductors and TVS devices, further enhancing the stability of the signal. This combination of electronic devices can effectively filter power fluctuations and external noise, ensuring that the MCU is always in the best state when processing signals. In addition, the combination of MCU and HART communication protocol provides a strong guarantee for the effective transmission of digital signals. The two-way communication capability of HART protocol enables users to monitor and adjust equipment parameters in real time, greatly improving the intelligence level and ease of operation of the equipment.

[0066] The circuit design of the HART chip also reflects its importance. The connection between the 16th pin of the chip U1 and the capacitor group and the voltage-stabilizing diode ensures the stability of the power supply, thereby improving the accuracy and reliability of the signal. The use of the voltage-stabilizing diode effectively prevents the influence of voltage fluctuations on signal transmission, providing additional protection for the system. This design feature enables the transmitter to maintain a high degree of stability and accuracy in a high static pressure environment, meeting the needs of modern industry for high-performance instruments.

[0067] In addition, the four-wire HART communication interface received by the MCU enables the transmitter to seamlessly connect with other devices in a standardized industrial environment. Through the connection of the LOOP+ and HART-OUT interfaces, the transmitter can achieve stable signal output and ensure the integrity and reliability of data in long-distance transmission. This efficient signal transmission design not only optimizes the data acquisition process, but also provides more flexibility for the integration of industrial systems.

[0068] In summary, the design of the present invention effectively combines MCU with HART chip to achieve innovation in signal processing and transmission of high-precision, high-static pressure differential pressure transmitter. Such a design not only improves the performance and service life of the transmitter product, but also provides users with a safer, more reliable and convenient monitoring solution to meet the ever-changing industrial needs.

[0069] The present invention is not limited to the above-mentioned embodiments. No matter any changes are made in the shape or material composition, any structural design provided by the present invention is a variation of the present invention and should be considered to be within the protection scope of the present invention.

Claims

1. A high-precision high static pressure differential pressure transmitter, characterized in that: The invention comprises a pressure-sensitive component and a positive and negative pressure cavity located below the pressure-sensitive component, wherein the pressure-sensitive component comprises a pressure-sensitive chip (11) and a pressure-sensitive base (12), wherein a substrate (10) is provided on the pressure-sensitive base (12), wherein the pressure-sensitive chip (11) is arranged on the pressure-sensitive base (12) through the substrate (10), wherein the positive and negative pressure cavity comprises a differential pressure positive electrode body (1) and a differential pressure negative electrode body (2) and an intermediate partition plate (3) located therebetween, wherein a positive isolation sheet (5) is installed on the outer side of the differential pressure positive electrode body (1), and a negative isolation sheet (6) is installed on the outer side of the differential pressure negative electrode body (2), and pressure partition plates (4) are fixed on both the positive isolation sheet (5) and the negative isolation sheet (6).

2. A high-precision high static pressure differential pressure transmitter according to claim 1, characterized in that: The pressure-sensitive chip (11) is fixed on the pressure-sensitive base (12) through a curing process, a gold layer is printed on the substrate (10), and the pressure-sensitive chip (11) is connected to the substrate (10) through gold wire bonding to export pin signals in the pressure-sensitive base (12).

3. A high-precision high static pressure differential pressure transmitter according to claim 1 or 2, characterized in that: The pressure-sensing base (12) is welded with a sheath tube (13) through argon arc welding, and the top of the pressure-sensing component is wrapped with an electronic compartment interface (14).

4. A high-precision high static pressure differential pressure transmitter according to claim 3, characterized in that: A welding sleeve (15) surrounds the outer side of the pressure-sensing component, and a signal transmission plate (16) is provided on the top of the pressure-sensing component.

5. A high-precision high static pressure differential pressure transmitter according to claim 4, characterized in that: The signal transmission board (16) collects analog electrical signals from the pressure sensing chip (11), amplifies the signals from the sensor interface J2 through a conditioning chip and converts them into digital signals. The conditioning chip adopts 16 bits or 24 bits, and the amplification gain is 0-128PGA; Pin 1 of the sensor interface J2 is connected to a reference voltage, Pin 2 is connected in parallel to Pin 1 of capacitor C6, Pin 1 of capacitor C5 and Pin 6 of the conditioning chip, Pin 3 is connected in parallel to Pin 1 of capacitor C4, Pin 2 of capacitor C5 and Pin 5 of the conditioning chip, and Pin 4 is connected in parallel to Pin 1 of resistor RJ1, Pin 1 of capacitor C3 and BT+; Pin 2 of capacitor C6 is connected in parallel to a ground wire and Pin 2 of capacitor C4.

6. A high-precision high static pressure differential pressure transmitter according to claim 5, characterized in that: After the signal transmission board (16) receives the digital signal, the MCU processes the analog quantity of the signal and converts it into a corresponding analog electrical signal. Pin 37 of the MCU is connected to pin 8 of the chip U1, pin 38 is connected to pin 9 of the chip U1, pin 39 is connected to pin 7 of the chip U1, and pin 40 is connected to pin 10 of the chip U1.

7. A high-precision high static pressure differential pressure transmitter according to claim 6, characterized in that: Pin 16 of the chip U1 is connected in parallel to one end of the capacitor group and the cathodes of the Zener diodes Z3 and Z4, and the other end of the capacitor group is connected to LOOP+, pin 14 of the chip U1 is connected in parallel to pin 1 of capacitor C8, pin 2 of the capacitor C8 is connected to pin 1 of capacitor C9, and pin 2 of the capacitor C9 is connected in parallel to the cathodes of the Zener diodes Z18 and Z19 and HART-OUT.

8. A high-precision high static pressure differential pressure transmitter according to claim 5, 6 or 7, characterized in that: A welding bracket (9) is provided in both the pressure sensing component and the positive and negative pressure chambers, the pressure sensing component is connected to the positive and negative pressure chambers via the welding bracket (9), an oil filling hole is provided on the pressure sensing base (12), and the internal area of ​​the welding bracket (9) is filled with pressure transmission medium silicone oil (17).

9. A high-precision high static pressure differential pressure transmitter according to claim 6 or 7, characterized in that: The MCU receives the corresponding four-wire HART communication interface and outputs the signal via the HART chip.

10. The high-precision high static pressure differential pressure transmitter according to claim 8, characterized in that: The pressure-sensing chip (11) is a MEMS pressure-sensing chip, and the substrate (10) is a gold-plated ceramic substrate.

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