A chip testing method

Abstract

The present invention relates to a chip testing method, which includes providing a chip and setting an initial pressure value according to the chip; covering the bottom of the sealing mechanism on the testing machine and covering the sorting machine connection frame on the top of the sealing mechanism; obtaining a floating pressure range according to the initial pressure value, obtaining a maximum preset pressure value and a minimum preset pressure value according to the floating pressure range, obtaining an upper limit of the vacuum value according to the maximum preset pressure value and the vacuum action area, and obtaining a lower limit of the vacuum value according to the minimum preset pressure value and the vacuum action area; evacuating the testing space in the sealing mechanism to form a negative pressure and maintaining the air pressure in the testing space within the range between the upper limit and the lower limit of the vacuum value to test the chip. The present invention can provide a sealing mechanism and limit it within the range between the upper limit and the lower limit of the vacuum value by means of the negative pressure method, replacing the existing screw fixation, which is stable and highly flexible.

Description

Technical Field

[0001] The present invention relates to a semiconductor testing process, and more particularly to a chip testing method. Background Art

[0002] The description in this part only provides background information related to the disclosure of the present invention and does not constitute prior art.

[0003] Automatic testing in chip testing is called ATE (Automatic Test Equipment). ATE requires devices such as sorters and testers. Among them, the function of the tester is to emit signals to test the chip, and the sorter classifies the chips according to the test results. The tools connecting the sorter and the tester include corresponding fixtures and test sockets. The fixture is used to fix the test socket stably so that the test arm of the tester can effectively test the chip.

[0004] Specifically, in the prior art, generally multiple test sockets are arranged on the tester, and then the fixture is placed on the test socket and locked to the test board of the tester through the test socket with screws. Among them, since the number of general test sockets is large, it is necessary to fix them one by one with screws, and the manual operation is extremely cumbersome. Moreover, the screw locking may cause uneven pressure due to slipping teeth, and there may be a problem of unstable fixation, affecting the final test accuracy. In particular, the existing mechanical fixing method has a low fault tolerance rate and cannot well adapt to the fast processing rhythm. At the same time, since the screw is a one-time connection and cannot be separated, in some cases, when the test arm provides abnormal pressure, due to the inability to separate in time, structural damage is caused.

[0005] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the present invention and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art just because these solutions are described in the background art part of the present invention. Summary of the Invention

[0006] The purpose of the present invention is to provide a chip testing method, which can provide a sealing mechanism and limit it within the range between the upper limit of the vacuum value and the lower limit of the vacuum value by means of a negative pressure method, replacing the existing screw fixation, being stable and highly flexible, and being separable in case of abnormality to avoid damage.

[0007] To achieve the above object, the present invention discloses the following chip testing method, which includes:

[0008] Providing a chip, installing the chip on a test socket, the test socket being installed on a tester, and setting an initial pressure value according to the chip;

[0009] Cover the bottom of the sealing mechanism on the testing machine, and cover the connecting frame of the sorter on the top of the sealing mechanism. Among them, the testing seat is arranged in the testing space enclosed by the sealing mechanism, and the testing space has a vacuum acting area;

[0010] The sealing mechanism includes a first air duct, a second air duct, and a perforation. The first air duct communicates with the outside from the top of the sealing mechanism, the second air duct communicates with the outside from the bottom of the sealing mechanism, and the perforation is used for the testing arm to pass through and abut against the chip. The top surface near the perforation of the partial sealing mechanism is used for the testing arm to abut against;

[0011] Obtain a floating pressure range according to the initial pressure value, and obtain a maximum preset pressure value and a minimum preset pressure value according to the floating pressure range. Obtain an upper limit of the vacuum value according to the maximum preset pressure value and the vacuum acting area, and obtain a lower limit of the vacuum value according to the minimum preset pressure value and the vacuum acting area;

[0012] Evacuate the testing space in the sealing mechanism to form a negative pressure, and make the air pressure in the testing space maintain within the range between the upper limit and the lower limit of the vacuum value. Synchronously, test the chip;

[0013] After completing the test of the chip, restore the air pressure in the testing space of the sealing mechanism.

[0014] As a further description of the above technical solution, in the process of the step "Evacuate the testing space in the sealing mechanism to form a negative pressure, and make the air pressure in the testing space maintain within the range between the upper limit and the lower limit of the vacuum value. Synchronously, test the chip", provide a pressure sensor, and place the pressure sensor at the position between the sealing mechanism and the connecting frame of the sorter, and read the real-time pressure value of the pressure sensor in real time.

[0015] As a further description of the above technical solution, provide a plurality of the pressure sensors, and respectively arrange them at the corners of the sealing mechanism, and synchronously obtain and compare the real-time pressure values read by the plurality of pressure sensors.

[0016] As a further description of the above technical solution, in the process of the step "Synchronously obtain and compare the real-time pressure values read by the plurality of pressure sensors", set a pressure fluctuation ratio. When the ratio of at least two of the real-time pressure values exceeds the pressure fluctuation ratio, stop the test.

[0017] As a further description of the above technical solution, in the step of "pumping air out of the test space in the sealing mechanism to form a negative pressure, and maintaining the air pressure in the test space within the range between the upper limit and the lower limit of the vacuum value, and synchronously testing the chip", negative pressure is formed by pumping air out of the top of the sealing mechanism through the first air duct, and negative pressure is formed by pumping air out of the bottom of the sealing mechanism through the second air duct.

[0018] As a further description of the above technical solution, the connection position of the end of the first air duct and the top of the sealing mechanism is arranged at the edge position of the top of the sealing mechanism.

[0019] As a further description of the above technical solution, two annular top sealing rings with different sizes are arranged at the top position of the sealing mechanism, and an annular top negative pressure area for pumping air to form a negative pressure is arranged between the two top sealing rings.

[0020] As a further description of the above technical solution, the connection position of the end of the second air duct and the bottom of the sealing mechanism is arranged at the middle position of the bottom of the sealing mechanism.

[0021] As a further description of the above technical solution, an annular bottom sealing ring is arranged at the bottom position of the sealing mechanism, and a rectangular bottom negative pressure area for pumping air to form a negative pressure is arranged inside the bottom sealing ring.

[0022] As a further description of the above technical solution, the floating pressure range is set to 1 - 1.2 times the initial pressure value.

[0023] By means of the above technical solution, the beneficial effects of the present invention are as follows:

[0024] The chip testing method of the present invention can provide a sealing mechanism, and limit it within the range between the upper limit and the lower limit of the vacuum value by means of the negative pressure method, replacing the existing screw fixation, which is stable and highly flexible, and can avoid the situation of damaging the bottom structure when the test arm applies too much pressure. The sealing mechanism can be pushed open by the test arm, and the sealing mechanism is separated from the connection frame of the sorter. In the case of screw fixation, the sealing mechanism cannot be pushed open by the test arm, and it is impossible to avoid the damage to the bottom structure when the test arm has abnormal conditions. Specifically, the sealing mechanism is covered on the testing machine and arranged under the connection frame of the sorter, and the chip to be tested is arranged in the fixing seat therein. The connection between the sealing mechanism and the upper and lower structures is realized by pumping air to form a negative pressure. Compared with screw connection, it has higher stability and controllability, and there is a redundancy of the upper limit and the lower limit of the vacuum value, which can indirectly improve the efficiency.

[0025] To enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description of the present invention and the drawings. However, the provided drawings are only for reference and illustration, and are not used to limit the present invention. Description of the Drawings

[0026] To more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in this specification. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 is an exploded schematic diagram of a chip testing method provided by an embodiment of this specification;

[0028] Figure 2 is a top view of a sealing mechanism of a chip testing method provided by an embodiment of this specification;

[0029] Figure 3 is a bottom view of a sealing mechanism of a chip testing method provided by an embodiment of this specification;

[0030] In the figure:

[0031] 1. Test socket; 11. Test socket sealing ring;

[0032] 2. Testing machine;

[0033] 3. Classifier connection frame;

[0034] 4. Sealing mechanism; 41. First air passage; 42. Second air passage; 43. Top sealing ring; 44. Bottom sealing ring;

[0035] 5. Pressure sensor. Detailed Embodiment

[0036] To enable those skilled in the art of this technology to better understand the technical solutions in this specification, the following will clearly and completely describe the technical solutions in the embodiments of this specification in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only some embodiments of this specification, rather than all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this specification.

[0037] The following is to illustrate the embodiments of the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0038] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. In addition, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of more of the associated listed items.

[0039] Please refer to Figures 1-3 , which is a chip testing method for this embodiment, where the chip testing method includes:

[0040] Provide a chip, install the chip on the test socket 1, and install the test socket on the testing machine 2, and set the initial pressure value according to the chip;

[0041] Cover the bottom of the sealing mechanism 4 on the testing machine 2, and cover the sorter connection frame 3 on the top of the sealing mechanism 4. Among them, the test socket 1 is arranged in the test space enclosed by the sealing mechanism 4, and the test space has a vacuum acting area;

[0042] Obtain a floating pressure range according to the initial pressure value, and obtain the maximum preset pressure value and the minimum preset pressure value according to the floating pressure range. Obtain the upper limit of the vacuum value according to the maximum preset pressure value and the vacuum acting area, and obtain the lower limit of the vacuum value according to the minimum preset pressure value and the vacuum acting area;

[0043] Exhaust the test space in the sealing mechanism 4 to form a negative pressure, and make the air pressure in the test space maintain within the range of the upper limit and the lower limit of the vacuum value. Synchronously, test the chip;

[0044] After completing the test of the chip, restore the air pressure in the test space of the sealing mechanism 4.

[0045] In the above method, the testing machine 2 can specifically be a flat testing circuit board. The testing socket 1 is smaller than the above-mentioned testing machine 2 and is a support tool placed above the testing machine 2 to assist in connecting the chip to the testing machine 2. The sealing mechanism 4 mainly serves to replace the original fixture and realizes the function of connecting the testing machine 2 and the connecting frame 3 of the sorter.

[0046] In the specific operation steps of the above method, first, the chip is placed and installed on the testing socket 1 of the testing machine 2. Then, the sealing mechanism 4 is preliminarily tightened on all the testing sockets 1 and placed, and the top of the sealing mechanism 4 is installed under the connecting frame 3 of the sorter. Initially, the operator can obtain an initial pressure value according to the chip and the corresponding matching testing socket 1. The initial pressure value is the applied force recommended for the regular factory testing of the chip. The initial pressure value can be the pressure provided downward by the testing arm that penetrates the connecting frame 3 of the sorter and is used to connect to the chip at the bottom under normal operation.

[0047] Then, based on this initial pressure value, a floating pressure range is calculated. Among them, in the middle position of the connecting frame 3 of the sorter, the testing arm presses against the testing socket 1. The testing arm passes through the middle empty frame of the connecting frame 3 of the sorter, and a part of the testing arm passes through the perforation of the sealing mechanism 4, so that the testing arm abuts against the chip and abuts against the top surface near the perforation of a part of the sealing mechanism 4 to achieve the connection of the chip. However, the pressure applied downward by the testing arm is uncontrollable in some cases. For example, when the pressure applied by the testing arm to the testing socket 1 is too large, the elastic ejector pins connected inside the testing socket 1 may undergo permanent deformation, or other structural damages may occur, such as the fracture of the testing board of the testing machine 2. Therefore, a maximum preset pressure value is set as the maximum pressure value that the structures such as the testing socket 1 can withstand from the testing arm. If it exceeds the maximum preset pressure value, since the bottom of the testing arm can abut against the top surface near the perforation of a part of the sealing mechanism 4, the sealing mechanism 4 is pushed open by the testing arm, and the connecting frame 3 of the sorter and the sealing mechanism 4 will separate to avoid further damage to the structures such as the testing socket 1 caused by the testing arm applying pressure. On the basis of screw fixation, the above-mentioned automatic separation at the maximum pressure value cannot be achieved, thus solving the problem of possible structural damage caused by the abnormal pressure of the testing arm. The minimum preset pressure value is the pressure just enough to enable effective electrical connection between the chip and the testing arm. At this time, the connecting frame 3 of the sorter and the sealing mechanism 4 still remain tightly connected. If it is lower than the minimum preset pressure value, the most basic connection force cannot be achieved. That is to say, within the range of the above-mentioned minimum preset pressure value to the maximum preset pressure value, effective electrical connection of the chip can be achieved without damaging any other structures.

[0048] That is to say, in this embodiment, when the pressure is not less than the minimum preset pressure value, the classifier connection frame 3 and the sealing mechanism 4 can remain connected, enabling the test arm to be effectively connected to the chip. At the same time, when the pressure exceeds the maximum preset pressure value, the test arm can just push the classifier connection frame 3 and the sealing mechanism 4 apart from each other.

[0049] Immediately afterwards, according to the above pressure values, based on the comprehensive vacuum action area, the upper limit of the vacuum value corresponding to the maximum preset pressure value and the lower limit of the vacuum value corresponding to the minimum preset pressure value are deduced. That is to say, in actual operation, the negative pressure provided to the sealing mechanism 4 is limited within a reasonable range, so that within this range, a force that can provide a vacuum negative pressure varying between the minimum preset pressure value and the maximum preset pressure value can be provided, and during the following test process, it always fluctuates within this negative pressure range.

[0050] In the above embodiment, the chip to be tested is set as a regular sheet, and the test seat 1 is set as a rectangular projection surface seat body with a larger contour than the chip. In this embodiment, multiple chips of the same specification can be batch-tested simultaneously. Among them, as Figure 1 shown, the corresponding test seats 1 are arranged adjacent to each other according to a certain rule, forming a two-column test array, and are all installed above the top surface of the testing machine 2, and the specific position is close to the geometric central area of the top surface of the testing machine 2. After the chips are installed in place, the chips do not contact each other.

[0051] The test seat 1 can be installed on the testing machine 2 by means of snap limit. The testing machine 2 is directly connected to the bottom of the test seat 1 through the internal docking circuit. The elastic thimble in the test seat 1 is between the docking circuit inside the testing machine 2 and the chip installed therein. The top position of the chip is set in the direction of the classifier connection frame 3. Only when the testing machine 2 and the classifier connection frame 3 apply sufficient pressure to the direction of the chip during this period can the chip achieve effective electrical connection with the testing machine 2, and the pressure value is the initial pressure value. This initial pressure value has different settings according to the actual specifications of the chips.

[0052] The vacuum action area in this embodiment specifically refers to the direct contact area between the top surface of the sealing mechanism 4 and the classifier connection frame 3. This area determines the possible pressure between the classifier connection frame 3 and the top surface of the sealing mechanism 4. That is to say, based on the relationship formula between pressure, force and area: F = P×S, where F represents the maximum preset pressure value or the minimum preset pressure value between the classifier connection frame 3 and the top surface of the sealing mechanism 4, P represents the upper limit of the vacuum value or the lower limit of the vacuum value. Since S is a fixed value, the value of P can be inferred from the floating range of F.

[0053] Specifically, taking Figure 1For example, in the pressing sequence, speaking from top to bottom, the classifier connection frame 3 presses the sealing mechanism 4 below it, so that the sealing mechanism 4 directly presses the test socket 1 below it. At the same time, the sealing mechanism 4 also presses the chip in the test socket 1 against the test socket 1. By restricting the pressing force as described above, it is avoided that the chip presses the elastic thimble connected in the test socket 1 to damage, and it is also avoided that the connection is unstable due to too light pressure.

[0054] Regarding the fixation between the sealing mechanism 4 and the test machine 2 below it, since the fixation between the two only needs to be stable and has little actual impact on the chip, in this embodiment, simple four-corner fasteners can be used for fixation, or fixed by one-time gluing, or fixed by buckles. In one preferred embodiment, the fixation between the sealing mechanism 4 and the test machine 2 below it can also be connected by the air pressure pressing method between the classifier connection frame 3 and the sealing mechanism 4. Specifically, the actual physical contact surface between the top surface of the sealing mechanism 4 and the test machine 2 constitutes another vacuum acting area. Similarly, by means of the above-mentioned vacuum pumping method, it is pressed and fixed by means of atmospheric pressure. However, below the top surface of the sealing mechanism 4 and the test machine 2, the air pressure is maintained. Among them, since there is no problem of upper limit value restriction that may damage the test machine 2, the vacuum value only needs to be such that the pressure between the bottom surface of the sealing mechanism 4 and the test machine 2 is not less than the minimum preset pressure value, that is to say, there is only a limit on the minimum vacuum value lower limit.

[0055] The following are two corresponding embodiments:

[0056] Embodiment 1

[0057] In this embodiment, the initial pressure value is 3793N. The 3793N of the initial pressure value can be used as the minimum preset pressure value. Combining the current situation of material strength and test arm performance, a floating pressure range is set to be 1-1.2 times the initial pressure value, which has a certain universality. Therefore, the maximum preset pressure value can be obtained as 4552N, and the collected vacuum acting area is 0.05m2. According to the relationship formula between pressure, force and area: F = P×S, it can be obtained that the upper limit and lower limit of the vacuum value need to be controlled between -91kpa and -76kpa. That is to say, in the subsequent vacuum negative pressure link, as long as the sealing mechanism 4 is pumped between -91kpa and -76kpa, the stability of the test can be maintained.

[0058] Embodiment 2

[0059] Same as Embodiment 1, where the initial pressure value is 2579N, the floating pressure range is 1-1.2 times the initial pressure value, and the vacuum acting area is 0.05m2. Therefore, it can be obtained that the upper limit and lower limit of the vacuum value need to be controlled between -62kpa and -52kpa.

[0060] Specifically, in the above embodiments, since an upper limit and a lower limit interval of the vacuum value of an active range are set, the negative pressure environment in the sealing mechanism 4 is restricted within the interval of the upper limit and the lower limit of the vacuum value by means of the negative pressure method. This not only replaces the existing screw fixation, which is stable and highly flexible, but also has a redundancy of the upper limit and the lower limit of the vacuum value, which can indirectly improve efficiency. That is to say, as long as a certain value within the space is maintained, it can operate stably continuously, without being limited to a specific negative pressure value, and has better robustness. However, the existing mechanical fastener connection scheme requires strict control force to avoid breakage, and has extremely high instability. If the same redundancy is required, the overall material strength needs to be increased, which adds too much cost to the entire system. And this system has a set of templates applicable to most test systems.

[0061] Furthermore, in the process of the step "pumping air from the test space in the sealing mechanism 4 to form a negative pressure and maintaining the air pressure in the test space within the interval of the upper limit and the lower limit of the vacuum value, and simultaneously, testing the chip", a pressure sensor 5 is provided. The pressure sensor 5 is placed at the position between the sealing mechanism 4 and the classifier connection frame 3, and the real-time pressure value of the pressure sensor 5 is read in real time. Specifically, it is possible to judge whether the fixation is stable through the change of the pressure value. In addition, the pressure sensor can measure the specific existing pressure value between the upper and the lower, so it is possible to judge whether the preset pressure supply requirement is met.

[0062] Based on the above situation, in another embodiment, a plurality of pressure sensors 5 are provided and are respectively arranged at the corners of the sealing mechanism 4, and the real-time pressure values read by the plurality of pressure sensors 5 are synchronously acquired and compared. At the same time, in the process of the step "synchronously acquiring and comparing the real-time pressure values read by the plurality of pressure sensors 5", a pressure fluctuation ratio is set. When the ratio of at least two real-time pressure values exceeds the pressure fluctuation ratio, the test is stopped. That is to say, in this embodiment, four pressure sensors 5 are placed at the four corners of the overall structure. Under normal and stable fixed connection conditions, the values of the four pressure sensors 5 should be stable and have no difference. However, due to factors such as product processing errors and placement, a reasonable fluctuation range can exist. Within this range, a relatively balanced fixation can still be maintained, and the pressure provided by two of the corners can change partially. However, this change cannot affect the test, so the change value is limited, which is extended to the ratio index of two of the pressure values. The specific fluctuation ratio can be determined according to factors such as material strength and test arm performance. For example, in one of the embodiments, the fluctuation ratio can be set to 1.03. If the minimum pressure value / maximum pressure value of the four corners is greater than 1.03, it is considered that there may be air leakage and other situations. At this time, the consistency of the test of multiple chips is unstable and there are problems with the test results, and the test needs to be stopped.

[0063] In another embodiment, the pressure sensors 5 can also be arranged at the four corners of the bottom position of the sealing mechanism 4, and the principle is similar.

[0064] Furthermore, the sealing mechanism 4 includes a first air passage 41 that communicates with the outside at the top position, and the sealing mechanism 4 includes a second air passage 42 that communicates with the outside at the bottom position. During the step of "evacuating the test space in the sealing mechanism 4 to form a negative pressure and maintaining the air pressure in the test space within the range between the upper limit and the lower limit of the vacuum value, and synchronously testing the chip", the top of the sealing mechanism 4 is evacuated to form a negative pressure by means of the first air passage 41, and the bottom of the sealing mechanism 4 is evacuated to form a negative pressure by means of the second air passage 42. That is to say, in this embodiment, in fact, negative pressure can be provided simultaneously in the upper and lower directions of the sealing mechanism 4, making the provided force more stable.

[0065] Specifically, as Figure 2 shown, the connection position where the end of the first air passage 41 communicates with the top of the sealing mechanism 4 is set at the edge position of the top of the sealing mechanism 4. Two annular top sealing rings 43 of different sizes are arranged at the top position of the sealing mechanism 4, and an annular top negative pressure area for evacuating to form a negative pressure is arranged between the two top sealing rings 43. That is Figure 2 the peripheral area shown around the areas for inserting the corresponding test sockets 1. Therefore, this structure can achieve no structural interference between the area of the test socket 1 and the top sorting machine connection frame 3.

[0066] Specifically, as Figure 3 shown, the connection position where the end of the second air passage 42 communicates with the bottom of the sealing mechanism 4 is set at the middle position of the bottom of the sealing mechanism 4. An annular bottom sealing ring 44 is arranged at the bottom position of the sealing mechanism 4, and a rectangular bottom negative pressure area for evacuating to form a negative pressure is arranged inside the bottom sealing ring 44. Therefore, this structure can make the fixation between the area of the test socket 1 and the test board and other planar structures of the bottom testing machine 2 more stable.

[0067] Specifically, the above-mentioned first air passage 41 is used to evacuate and fix the structure above the sealing mechanism 4. In the system of the first air passage, the actual physical contact surface between the top surface of the sealing mechanism 4 and the sorting machine connection frame 3 constitutes the vacuum acting area, and by maintaining the air pressure within the range between the upper limit and the lower limit of the vacuum value, the fixing strength suction force between the sealing mechanism 4 and the sorting machine connection frame 3 is maintained, and it is maintained within the floating pressure range, so that the sorting machine connection frame 3 and the sealing mechanism 4 can be separated in the case of abnormally large pressure of the test arm, avoiding further damage, and being able to maintain a tight connection.

[0068] Similarly, the second air duct 42 is used to maintain a fixed strength between the sealing mechanism 4 and the testing machine 2 by means of vacuum pumping. The actual physical contact surface between the bottom surface of the sealing mechanism 4 and the testing machine 2 constitutes another vacuum acting area. However, by maintaining the air pressure below, it is only necessary to ensure that the force between the top surface of the sealing mechanism 4 and the testing machine 2 is not less than the minimum preset pressure value.

[0069] The above-described fixing methods for the upper and lower surfaces can be arranged simultaneously, and need to spread with the unique sealing mechanism 4 as the center point, which can make the balance of the rectangular structure under negative pressure better.

[0070] In another embodiment, the top surface of the sealing mechanism 4 and the sorting machine connection frame 3 can be connected by means of the vacuum method of the present invention to solve the problem of cumbersome connection in the top surface direction of the test socket 1, while the sealing mechanism 4 and the testing machine 2 can be considered to be connected by fasteners. Generally, it is only necessary to fix the four corners, which is relatively simple.

[0071] The content disclosed above is only the preferred feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the scope of the patent application of the present invention.

[0072] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other, and the key points of each embodiment are the differences from other embodiments.

[0073] Although the present application is depicted through embodiments, those of ordinary skill in the art know that the present application has many variations and changes without departing from the spirit of the present application. It is hoped that the appended embodiments include these variations and changes without departing from the present application.

Claims

1. A chip testing method, characterized in that, The chip testing method includes the following steps: Provide a chip, install the chip on a test socket, and install the test socket on a testing machine. Set an initial pressure value according to the chip. Cover the bottom of the sealing mechanism on the testing machine, and cover the classifier connection frame on the top of the sealing mechanism. Among them, the test socket is arranged in the test space enclosed by the sealing mechanism, and the test space has a vacuum acting area. The sealing mechanism includes a first air passage, a second air passage, and a perforation. The first air passage communicates with the outside from the top of the sealing mechanism, the second air passage communicates with the outside from the bottom of the sealing mechanism, and the perforation is used for a test arm to pass through and abut against the chip, and the top surface near the perforation of the local sealing mechanism is used for the test arm to abut against. Obtain a floating pressure range according to the initial pressure value, and obtain a maximum preset pressure value and a minimum preset pressure value according to the floating pressure range. Obtain an upper limit of the vacuum value according to the maximum preset pressure value and the vacuum acting area, and obtain a lower limit of the vacuum value according to the minimum preset pressure value and the vacuum acting area. Exhaust the test space in the sealing mechanism to form a negative pressure, and keep the air pressure in the test space within the range between the upper limit and the lower limit of the vacuum value. Synchronously, test the chip. During the process, exhaust the top of the sealing mechanism to form a negative pressure through the first air passage, and exhaust the bottom of the sealing mechanism to form a negative pressure through the second air passage. After completing the test of the chip, restore the air pressure in the test space of the sealing mechanism. The connection position of the end of the first air passage and the top of the sealing mechanism is set at the edge position of the top of the sealing mechanism. Two annular top sealing rings of different sizes are arranged at the top position of the sealing mechanism, and an annular top negative pressure area for exhausting to form a negative pressure is arranged between the two top sealing rings.

2. The chip testing method according to claim 1, wherein: During the process of the step "Exhaust the test space in the sealing mechanism to form a negative pressure, and keep the air pressure in the test space within the range between the upper limit and the lower limit of the vacuum value. Synchronously, test the chip", provide a pressure sensor. The pressure sensor is placed at the position between the sealing mechanism and the classifier connection frame, and the real-time pressure value of the pressure sensor is read in real time.

3. The chip testing method according to claim 2, wherein: Provide a plurality of the pressure sensors, and respectively arrange them at the corners of the sealing mechanism, and synchronously obtain and compare the real-time pressure values read by the plurality of pressure sensors.

4. The chip testing method according to claim 3, wherein: During the process of the step "Synchronously obtain and compare the real-time pressure values read by the plurality of pressure sensors", set a pressure fluctuation ratio. When the ratio of at least two of the real-time pressure values exceeds the pressure fluctuation ratio, stop the test.

5. The chip testing method according to claim 1, characterized in that: The connection position of the end of the second air passage and the bottom of the sealing mechanism is set at the middle position of the bottom of the sealing mechanism.

6. The chip testing method according to claim 5, wherein: An annular bottom sealing ring is arranged at the bottom position of the sealing mechanism, and a rectangular bottom negative pressure area for exhausting to form a negative pressure is arranged inside the bottom sealing ring.

7. The chip testing method according to claim 1, wherein: The floating pressure range is set to 1 - 1.2 times the initial pressure value.

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