Optical module heat dissipation structure and communication equipment

Abstract

The invention relates to the technical field of communication equipment, in particular to an optical module heat dissipation structure and communication equipment, the optical module heat dissipation structure comprises a circuit board and at least one optical module assembly, a plurality of optical module assemblies are arranged on the circuit board and are arranged along the extension direction of the circuit board; the circuit board is provided with a through ventilation slot, the orthographic projection of the optical module assembly on the circuit board covers the ventilation slot, and the circuit board is provided with the ventilation slot for ventilation, so that external cold air can reach the optical module assembly from the ventilation slot, that is, on the basis of original heat dissipation, the heat dissipation efficiency of the optical module assembly is improved, and the service life of the optical module assembly is prolonged. According to the optical module assembly, the ventilation slot interacting with the external environment is added, and the ventilation channel for heat dissipation is formed on the basis of the ventilation slot, so that the process of heat exchange between external cold air and the optical module assembly is increased, the overall use temperature of the optical module assembly is ensured, and normal operation of the optical module assembly is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to an optical module heat dissipation structure and communication equipment. Background Art

[0002] With the rapid development of the communications industry, various communications equipment are gradually showing a trend of high integration and miniaturization, and the heat flux density of electronic devices is also increasing. Optical modules are one of the main heat-generating components in communication devices. In order to meet the current user's transmission rate and distance requirements, the power consumption of optical modules is increasing, resulting in a large amount of heat generated by the optical modules when working. However, due to the limited installation space of the existing radiator, the power and heat dissipation efficiency of the radiator are limited, which in turn leads to high temperatures near the optical module, resulting in the optical module components not being able to be used normally, thus affecting the normal use of communication equipment. Summary of the invention

[0003] The invention discloses an optical module heat dissipation structure and communication equipment, which are used to improve the heat dissipation of the optical module and ensure the normal operation of the optical module.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides an optical module heat dissipation structure, comprising: a circuit board and at least one optical module assembly;

[0006] A plurality of the optical module assemblies are arranged on the circuit board and arranged along the extension direction of the circuit board;

[0007] A through ventilation slot is provided on the circuit board, and the orthographic projection of the optical module assembly on the circuit board covers the ventilation slot.

[0008] The present application provides ventilation slots for ventilation on the circuit board, and the position of the ventilation slots is within the range of the positive projection of the optical module assembly on the circuit board, so that cold air from the outside can reach the optical module assembly through the ventilation slots. That is, the present application adds a ventilation slot that interacts with the external environment on the basis of the original heat dissipation, and forms a ventilation channel for heat dissipation based on the ventilation slots. Furthermore, the present application adds a process of heat exchange between the outside cold air and the optical module assembly, thereby ensuring the overall operating temperature of the optical module assembly and ensuring the normal operation of the optical module assembly.

[0009] In some embodiments, the optical module heat dissipation structure also includes an installation panel, which is used to install multiple optical module components, and the installation panel has a heat dissipation area for heat dissipation, and at least one ventilation hole is provided in the heat dissipation area and passes through the installation panel, and the ventilation hole is connected to the ventilation groove.

[0010] In some embodiments, axes of any two ventilation holes among the plurality of ventilation holes are in the same plane.

[0011] In some embodiments, the optical module heat dissipation structure further includes at least one wind shield, which is disposed on a side of the mounting panel facing the circuit board and is located outside the heat dissipation area.

[0012] In some embodiments, the optical module assembly includes an optical module body and an optical cage, the optical cage is plugged into the optical module body, and a vent hole is formed on a side of the optical cage facing the circuit board, and the vent holes are connected to the ventilation slots.

[0013] In some embodiments, the vent is within the ventilation slot.

[0014] In some embodiments, a distance D between a side of the light cage facing the circuit board and the circuit board satisfies the following range: 0.20 mm≤D≤0.40 mm.

[0015] In some embodiments, the optical module heat dissipation structure further includes a heat sink assembly, and the heat sink assembly is disposed inside the ventilation slot and in contact with the optical module body.

[0016] In some embodiments, the heat sink assembly and the circuit board are an integrated structure;

[0017] Alternatively, the heat sink assembly and the optical module assembly are an integrated structure.

[0018] In a second aspect, the present invention further proposes a communication device, comprising an optical module heat dissipation structure as described in any one of the above items and a device body, wherein the circuit board in the optical module heat dissipation structure is arranged inside the device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional schematic diagram of the overall structure in an embodiment of the present invention;

[0020] Figure 2 It is a schematic diagram of an explosion of a part of the overall structure in an embodiment of the present invention;

[0021] Figure 3 It is a schematic diagram of a part of the structure of the overall structure of the present invention from a top view angle;

[0022] Figure 4 It is a schematic diagram of a part of the structure of the overall structure of the present invention from a side view angle;

[0023] Figure 5 This is a schematic diagram of the structure of the light cage provided with ventilation holes in an embodiment of the present invention;

[0024] Figure 6 It is a structural schematic diagram of an embodiment of a heat sink assembly in an embodiment of the present invention.

[0025] Wherein: 1-optical module assembly, 11-optical cage, 111-ventilation hole, 12-optical module body, 2-circuit board, 21-ventilation slot, 22-ventilation hole, 3-installation panel, 31-ventilation hole, 4-heat sink assembly, 5-wind shield. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] like Figure 1-Figure 2 As shown, in a first aspect, the present invention provides an optical module heat dissipation structure, comprising: a circuit board 2 circuit board 2 and at least one optical module assembly 1;

[0028] A plurality of optical module assemblies 1 are arranged on the circuit board 2 and arranged along the extension direction of the circuit board 2;

[0029] A through ventilation slot 21 is formed on the circuit board 2 , and the orthographic projection of the optical module assembly 1 on the circuit board 2 covers the ventilation slot 21 .

[0030] The present application provides a ventilation slot 21 for ventilation on the circuit board 2, and the position of the ventilation slot 21 is located within the range of the positive projection of the optical module assembly 1 on the circuit board 2, so that the cold air from the outside can reach the optical module assembly 1 through the ventilation slot. That is, on the basis of the original heat dissipation, the present application adds a ventilation slot 21 that interacts with the external environment, and forms a ventilation channel for heat dissipation based on the ventilation slot 21. Furthermore, the present application adds a process of heat exchange between the cold air from the outside and the optical module assembly 1, thereby ensuring the overall operating temperature of the optical module assembly 1 and ensuring the normal operation of the communication equipment.

[0031] In a possible implementation, the optical module heat dissipation structure also includes an installation panel 3, the installation panel 3 is used to install multiple optical module assemblies 1, and the installation panel 3 has a heat dissipation area for heat dissipation, and at least one ventilation hole 31 penetrating the installation panel 3 is opened in the heat dissipation area, and the ventilation hole 31 is connected to the ventilation slot 21. In this application, multiple ventilation holes 111 are opened on the installation panel 3, and the ventilation holes 111 can blow the external cold air into the ventilation slot 21, and then blow it onto the optical module assembly 1, so as to complete the heat exchange between the optical module assembly 1 and the external cold air.

[0032] In a possible implementation, the axes of any two ventilation holes 31 among the plurality of ventilation holes 31 are on the same plane, and the ventilation holes 31 arranged on the same plane can better conduct the external airflow.

[0033] For a possible implementation method, please refer to Figure 3 The optical module heat dissipation structure further includes at least one windshield 5, which is arranged on the side of the mounting panel 3 facing the circuit board 2 and is located outside the heat dissipation area. The present application further provides a windshield 5, wherein the number of windshields 5 is not specifically limited in the present application, but is Figure 3 In the diagram, the present application takes two wind shields 5 as an example. The two wind shields 5 block the external cold air in the direction in which the circuit board 2 extends laterally, so that when the cold air passes through the ventilation holes 31 and enters the gap between the mounting panel 3 and the circuit board 2, the cold air will not be transmitted too much in the lateral direction, but will directly enter the interior of the ventilation slot 21 to dissipate heat for the optical module assembly 1. However, it is worth noting that when there is only one wind shield 5, the maximum lateral movement distance of the cold air is limited in a single direction, and the input cold air can also be effectively driven more into the ventilation slot 21. The present application does not make any specific limitation on this.

[0034] In the above structure, ventilation grooves 21 are provided on the circuit board 2, which can maximize the conduction space for cold air during the conduction process. When the optical module assembly 1 in the present application dissipates heat, the heat dissipation path toward the side of the circuit board 2 is the optical module assembly 1-ventilation grooves 21-ventilation holes 31-external cold air, and the heat dissipation path on the side of the optical module assembly 1 is the same as the heat dissipation process described above, thereby ensuring effective heat dissipation.

[0035] For a possible implementation method, please refer to Figure 1 , Figure 4 , Figure 5 The optical module assembly 1 includes an optical module body 12 and an optical cage 11. The optical cage 11 is plugged into the optical module body 12. A vent 111 is provided on the side of the optical cage 11 facing the circuit board 2. The vents 111 are all connected to the ventilation slots 21. A certain gap is formed between the optical cage 11 and the circuit board 2, and so is the optical module body 12. On this basis, the present application also provides vents 111 on the side of the optical cage 11 facing the circuit board 2 so that the outside cold air can be directly conducted to the surface of the optical module body 12 on the basis of the wind shield 5. The optical cage 11 is provided with vents 111 for ventilation. In this way, the outside cold air can be directly conducted to the surface of the optical module body 12, and the heat of the optical module body 12 when working can be conducted to the outside environment, thereby avoiding the phenomenon that this part of the heat is transferred to the circuit board 2, and ensuring that the circuit board 2 will not have a locally high temperature.

[0036] In one possible implementation, the orthographic projection of the vent hole 111 on the circuit board 2 is located inside the ventilation slot 21 . This design can ensure that the airflow can better enter the interior of the vent hole 111 and better dissipate the heat of the optical module assembly 1 .

[0037] For a possible implementation method, please refer to Figure 4 , the distance D between the side of the light cage 11 facing the circuit board 2 and the circuit board 2 satisfies the following range: 0.20mm≤D≤0.40mm. In the above structure, the gap between the light cage 11 and the circuit board 2 of the present application can be changed according to actual needs. In addition, the thickness of the light cage 11 in the present application is not specifically limited. In the description of this article, the thickness of the light cage 11 of the present application is 0.25mm, and the gap can be 0.75mm. The purpose of such design is to provide a larger heat dissipation space for the side wall of the light cage 11, so as to facilitate heat transfer of the light cage 11.

[0038] For a possible implementation method, please refer to Figure 5 , Figure 6 The heat dissipation structure of the optical module also includes a heat sink component 4, which is arranged inside the ventilation slot 21 and contacts the optical module body 12. Specifically, there are multiple heat sink components 4 in the present application, and some of the heat sink components 4 are arranged on the side of the optical module component 1 away from the circuit board 2 and contact the optical module component 1, and the other part is arranged inside the ventilation slot 21 and contacts the other side of the optical module body 12. This design increases the heat dissipation path of the optical module component 1, specifically: in the direction where the optical module component 1 is close to the heat sink component 4, the heat dissipation path of the optical module component 1 is: optical module component 1-heat sink component 4, and in the direction where the optical module component 1 is away from the heat sink component 4, the heat dissipation path of the optical module component 1 is: optical module component 1-heat sink component 4-external cold air. In the above-mentioned heat dissipation process of the optical module component 1, the present application can ensure that heat is dissipated at any position of the optical module component 1, thereby ensuring that the overall temperature of the optical module component 1 is low, reducing its impact on the circuit board 2, and ensuring the normal operation of the communication equipment.

[0039] In one possible implementation, the heat sink assembly 4 and the circuit board 2 are an integrated structure;

[0040] Alternatively, the heat sink assembly 4 and the optical module assembly 1 are an integrated structure. In the above structure, the heat sink assembly 4 and the circuit board 2 can be an integrated structure. The heat sink assembly 4 can not only dissipate heat for the optical module assembly 1, but also dissipate heat for the circuit board 2, and at the same time, it also improves the installation stability between the heat sink assembly 4 and the circuit board 2. In addition, the heat sink assembly 4 in the present application can also be set as an integrated structure with the optical module assembly 1, further improving the installation stability between the heat sink assembly 4 and the optical module assembly 1.

[0041] In the second aspect, the present invention also proposes a communication device, comprising an optical module heat dissipation structure as described above and a device body, wherein the circuit board 2 in the optical module heat dissipation structure is arranged inside the device body. By adopting the above design, the present application can ensure the normal operation of the communication device.

[0042] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An optical module heat dissipation structure, It is characterized in that include: a circuit board and at least one optical module assembly; A plurality of the optical module assemblies are arranged on the circuit board and arranged along the extension direction of the circuit board; A through ventilation slot is provided on the circuit board, and the orthographic projection of the optical module assembly on the circuit board covers the ventilation slot.

2. The optical module heat dissipation structure according to claim 1, It is characterized in that The optical module heat dissipation structure also includes a mounting panel, which is used to mount a plurality of the optical module assemblies, and the mounting panel has a heat dissipation area for heat dissipation, wherein at least one ventilation hole penetrating the mounting panel is provided in the heat dissipation area, and the ventilation hole is connected to the ventilation slot.

3. The optical module heat dissipation structure according to claim 2, It is characterized in that Axis lines of any two ventilation holes among the plurality of ventilation holes are on the same plane.

4. The optical module heat dissipation structure according to claim 2, It is characterized in that The optical module heat dissipation structure further includes at least one wind shield, which is arranged on a side of the mounting panel facing the circuit board and is located outside the heat dissipation area.

5. The optical module heat dissipation structure according to claim 1, It is characterized in that The optical module assembly comprises an optical module body and an optical cage, wherein the optical cage is plugged into the optical module body, and a vent hole is provided on a side of the optical cage facing the circuit board, and the vent hole is communicated with the ventilation slot.

6. The optical module heat dissipation structure according to claim 5, It is characterized in that The orthographic projection of the vent hole on the circuit board is located inside the ventilation slot.

7. The optical module heat dissipation structure according to claim 6, It is characterized in that A distance D between the side of the light cage facing the circuit board and the circuit board satisfies the following range: 0.20 mm≤D≤0.40 mm.

8. The optical module heat dissipation structure according to claim 7, It is characterized in that The optical module heat dissipation structure further includes a heat sink assembly, which is disposed inside the ventilation slot and in contact with the optical module body.

9. The optical module heat dissipation structure according to claim 8, It is characterized in that The heat sink assembly and the circuit board are an integrated structure; Alternatively, the heat sink assembly and the optical module assembly are an integrated structure.

10. A communication device, It is characterized in that It comprises the optical module heat dissipation structure as described in any one of claims 1 to 9 and a device body, wherein the circuit board in the optical module heat dissipation structure is arranged inside the device body.

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