DR4 silicon optical chip, optical engine and production method

Abstract

The invention relates to a DR4 silicon optical chip, which is characterized in that an input waveguide and a plurality of output waveguides are arranged on the same side of the upper surface of a chip main body, a first glue storage groove is formed between the input waveguide and the output waveguides on the upper surface of the chip main body, and a first glue amount observation groove is formed between the input waveguide and the first glue storage groove on the upper surface of the chip main body; and a first glue blocking dam is formed between the first glue storage groove and the first glue amount observation groove on the upper surface of the chip main body. According to the optical engine, an optical fiber array is coupled with a plurality of output waveguides of a DR4 silicon optical chip, and light path glue is dispensed between the optical fiber array and the DR4 silicon optical chip. The beneficial effects are that the first glue storage groove can absorb and store redundant optical path glue, and prevents the optical path glue from overflowing into the port groove of the input waveguide, thereby preventing the coupling efficiency from being reduced when the laser chip in the light emitting end is coupled with the input waveguide of the DR4 silicon optical chip, and ensuring the product yield and the quality reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of optical engines, and in particular to a DR4 silicon photonic chip, an optical engine, and a production method. Background Art

[0002] The specific structure of the traditional light engine is as follows Figure 1 As shown, it includes: a DR4 silicon photonic chip, a light emitting end and a multi-channel optical fiber array, the DR4 silicon photonic chip has an input waveguide and four output waveguides on the same side, the DR4 silicon photonic chip has cutting paths around it, the input waveguide is coupled with an input of a first 1×2 coupler, the two outputs of the first 1×2 coupler are respectively coupled with an input of a second 1×2 coupler, and the two outputs of each second 1×2 coupler are respectively coupled with an output waveguide via an MZM modulator, the first 1×2 coupler and the two second 1×2 couplers are all split in equal proportion, so that the light entering the input waveguide is split to the four output waveguides in equal proportion, the light emitting end and the DR4 silicon The input waveguides in the optical chip are coupled, and the light emitting end includes: a laser chip, a collimating lens, an optical isolator and a converging lens coupled in sequence along the direction of light propagation. The converging lens is coupled to the input waveguide, and the laser chip is on a ceramic heat sink; the multi-channel optical fiber array is coupled to the four output waveguides in the DR4 silicon photonic chip. When the multi-channel optical fiber array is coupled to the DR4 silicon photonic chip, optical path glue is usually applied between the multi-channel optical fiber array and the DR4 silicon photonic chip (to match the refractive index). During production, a small part of the glue overflows into the input waveguide port groove due to poor control of the glue amount, thereby causing the coupling efficiency to decrease when the laser chip in the light emitting end is coupled to the input waveguide of the DR4 silicon photonic chip. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a DR4 silicon photonic chip, an optical engine and a production method to overcome the deficiencies in the above-mentioned prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows:

[0005] A DR4 silicon photonic chip comprises: a chip body, wherein an input waveguide and a plurality of output waveguides are provided on the same side of the upper surface of the chip body, a first glue storage groove is provided on the upper surface of the chip body between the input waveguide and the output waveguide, a first glue quantity observation groove is provided on the upper surface of the chip body between the input waveguide and the first glue storage groove, and a first glue dam is formed on the upper surface of the chip body between the first glue storage groove and the first glue quantity observation groove.

[0006] The beneficial effect of the present invention is that when the optical fiber array is coupled with multiple output waveguides of the DR4 silicon photonic chip, and optical path glue is applied between the optical fiber array and the DR4 silicon photonic chip, the first glue storage tank can absorb and store excess optical path glue, and the first glue dam can block the optical path glue from flowing into the first glue quantity observation tank through the first glue storage tank, thereby preventing the optical path glue from overflowing into the port slot of the input waveguide, thereby avoiding a decrease in coupling efficiency when the laser chip in the light emitting end is coupled with the input waveguide of the DR4 silicon photonic chip, thereby ensuring product yield and quality reliability.

[0007] Based on the above technical solution, the present invention can also be improved as follows.

[0008] Furthermore, a first labyrinth glue blocking groove communicating with the first glue storage groove is provided on the upper surface of the chip body between the first glue storage groove and the first glue blocking dam.

[0009] The above further beneficial effects are: the first labyrinth glue blocking groove is used to extend the flow path of the glue, thereby preventing the glue from flowing into the first glue quantity observation groove through the first glue blocking dam as much as possible, and at the same time, after the flow path becomes longer, it is conducive to subsequent curing.

[0010] Furthermore, the upper surface of the first glue blocking dam is flush with the upper surface of the chip body.

[0011] Furthermore, a second maze-shaped glue blocking groove is provided on the upper surface of the chip body on the side of the input waveguide away from the first glue amount observation groove, and a cutting path is provided on the edge of the upper surface of the chip body from the direction of the output waveguide to connect the first glue storage groove with the second maze-shaped glue blocking groove.

[0012] A further beneficial effect of the above method is that when glue flows in the opposite direction toward the input waveguide through the cutting path, the second maze-shaped glue blocking groove is used to extend the flow path of the glue, thereby preventing the glue from flowing into the port groove of the input waveguide as much as possible. At the same time, after the flow path becomes longer, it is beneficial to subsequent curing.

[0013] Furthermore, a second glue amount observation groove is provided on the upper surface of the chip body between the second labyrinth glue blocking groove and the input waveguide, and a second glue blocking dam is formed on the upper surface of the chip body between the second glue amount observation groove and the second labyrinth glue blocking groove.

[0014] A further beneficial effect of the above method is that if glue bypasses the second glue dam, the glue situation can be conveniently observed through the second glue quantity observation groove.

[0015] Furthermore, the input waveguide divides the light into a plurality of output waveguides in equal proportions.

[0016] Further, the input waveguide is coupled to the input of a first 1×2 coupler, the two outputs of the first 1×2 coupler are each coupled to the input of a second 1×2 coupler, and the two outputs of each second 1×2 coupler are each coupled to an output waveguide via an MZM modulator.

[0017] Based on the above technical solution, the present invention also provides an optical engine, including: an optical fiber array and a DR4 silicon photonic chip, the optical fiber array is coupled with multiple output waveguides of the DR4 silicon photonic chip, and optical path glue is applied between the optical fiber array and the DR4 silicon photonic chip.

[0018] A further beneficial effect of the above method is that when the optical fiber array is coupled with multiple output waveguides of the DR4 silicon photonic chip and optical path glue is applied between the optical fiber array and the DR4 silicon photonic chip, the coupling efficiency decrease when the laser chip in the optical emitting end is coupled with the input waveguide of the DR4 silicon photonic chip can be avoided, thereby ensuring product yield and quality reliability.

[0019] Furthermore, the input waveguide of the DR4 silicon photonic chip is coupled to the optical emission end.

[0020] Based on the above technical solution, the present invention also provides a method for producing a light engine, which is used to produce the above light engine, and comprises the following steps:

[0021] S1, coupling the optical fiber array with multiple output waveguides of the DR4 silicon photonic chip;

[0022] S2. Apply optical path glue between the optical fiber array and the DR4 silicon photonic chip;

[0023] S3, curing the light path glue, and using a CCD camera to collect images of the coupling point, and then identifying whether there is glue in the first glue amount observation slot according to the collected image, if there is no glue, it is judged to be qualified, if there is glue, enter S4;

[0024] S4. Use a high-power microscope to observe whether there is glue in the port groove of the input waveguide. If there is no glue, it is judged to be qualified. If there is glue, it is judged to be unqualified.

[0025] A further beneficial effect of adopting the above is that the product yield and reliability quality can be ensured through this production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of a light engine in the prior art;

[0027] Figure 2 This is a structural diagram of the DR4 silicon photonic chip in the present invention;

[0028] Figure 3A side view of the DR4 silicon photonic chip of the present invention;

[0029] Figure 4 It is a structural diagram of the light engine in the present invention.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 1. DR4 silicon photonic chip, 110. Chip body, 111. First glue storage tank, 112. First glue quantity observation tank, 113. First glue blocking dam, 114. First maze-type glue blocking tank, 115. Cutting road, 116. Second glue quantity observation tank, 117. Second glue blocking dam, 118. Second maze-type glue blocking tank, 120. Input waveguide, 130. Output waveguide, 140. First 1×2 coupler, 150. Second 1×2 coupler, 160. MZM modulator, 2. Optical fiber array, 3. Optical path glue, 4. Laser chip, 5. Collimating lens, 6. Optical isolator, 7. Converging lens, 8. Ceramic heat sink. DETAILED DESCRIPTION

[0032] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0033] Example 1

[0034] like Figure 2 As shown, a DR4 silicon photonic chip comprises: a chip body 110, wherein the chip body 110 is provided with an input waveguide 120 and a plurality of output waveguides 130 on the same side of the upper surface. In this embodiment, the plurality may refer to four. A first glue storage tank 111 is provided between the input waveguide 120 and the output waveguide 130 on the upper surface of the chip body 110, a first glue quantity observation tank 112 is provided between the input waveguide 120 and the first glue storage tank 111 on the upper surface of the chip body 110, and a first glue blocking dam 113 is formed between the first glue storage tank 111 and the first glue quantity observation tank 112 on the upper surface of the chip body 110. The first glue blocking dam 113 can block the light path. The glue 3 flows into the first glue quantity observation groove 112. When the optical fiber array 2 is coupled with the multiple output waveguides 130 of the DR4 silicon photonic chip 1 and the optical path glue 3 is applied between the optical fiber array 2 and the DR4 silicon photonic chip 1, the first glue storage groove 111 can absorb and store excess optical path glue 3, and the first glue dam 113 can block the optical path glue 3 from flowing into the first glue quantity observation groove 112 through the first glue storage groove 111, thereby preventing the optical path glue 3 from overflowing into the port groove of the input waveguide 120, thereby avoiding a decrease in coupling efficiency when the laser chip in the light emitting end is coupled with the input waveguide 120 of the DR4 silicon photonic chip 1, thereby ensuring product yield and quality reliability.

[0035] Example 2

[0036] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0037] The first glue storage groove 111 has a length of 0.65 mm±0.1 mm, a width of 0.3 mm±0.05 mm, and a depth of 20 μm-60 μm.

[0038] Furthermore, a first maze-shaped glue blocking groove 114 connected to the first glue storage groove 111 is provided on the upper surface of the chip body 110 between the first glue storage groove 111 and the first glue blocking dam 113. The first maze-shaped glue blocking groove 114 is used to extend the flow path of the glue, thereby preventing the glue from flowing into the first glue quantity observation groove 112 through the first glue blocking dam 113 as much as possible. At the same time, after the flow path becomes longer, it is beneficial to subsequent curing.

[0039] The upper surface of the first glue blocking dam 113 is preferably flush with the upper surface of the chip body 110 .

[0040] Example 3

[0041] like Figure 2 , Figure 3 As shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the details are as follows:

[0042] The upper surface of the chip body 110 is provided with a second labyrinth-shaped glue blocking groove 118 on the side of the input waveguide 120 away from the first glue quantity observation groove 112, and a cutting path 115 is provided on the edge of the upper surface of the chip body 110 from the direction of the output waveguide 130 to connect the first glue storage groove 111 with the second labyrinth-shaped glue blocking groove 118. Figure 2 Taking the shown example, assuming that the side of the chip body 110 with the input waveguide 120 is the first side, and the other three sides clockwise are the second side, the third side and the fourth side, then the cutting path 115 starts from the first glue storage groove 111 on the first side, passes through the output waveguide 130 and enters the second side, the third side and the fourth side in sequence, and finally connects with the second maze-shaped glue blocking groove 118. When glue flows in the opposite direction toward the input waveguide 120 through the cutting path 115, the second maze-shaped glue blocking groove 118 is used to extend the flow path of the glue, thereby avoiding the glue from flowing into the port groove of the input waveguide 120 as much as possible. At the same time, after the flow path becomes longer, it is beneficial to subsequent curing.

[0043] Furthermore, a second glue amount observation groove 116 is provided on the upper surface of the chip body 110 between the second maze-shaped glue blocking groove 118 and the input waveguide 120, and a second glue blocking dam 117 is formed on the upper surface of the chip body 110 between the second glue amount observation groove 116 and the second maze-shaped glue blocking groove 118. The second glue blocking dam 117 can block the optical path glue 3 from flowing into the second glue amount observation groove 116 through the second maze-shaped glue blocking groove 118. If glue bypasses the second glue blocking dam 117, the glue situation can be conveniently observed through the second glue amount observation groove 118. The upper surface of the second glue blocking dam 117 is preferably flush with the upper surface of the chip body 110.

[0044] Example 4

[0045] like Figure 2 As shown, this embodiment is a further improvement on the basis of Embodiment 1, 2 or 3, and the details are as follows:

[0046] The input waveguide 120 splits the light into a plurality of output waveguides 130 in equal proportions.

[0047] Furthermore, the input waveguide 120 is coupled to the input of a first 1×2 coupler 140, and the two outputs of the first 1×2 coupler 140 are respectively coupled to the input of a second 1×2 coupler 150, that is, there are two second 1×2 couplers 150, and the two outputs of each second 1×2 coupler 150 are respectively coupled to an output waveguide 130 via an MZM modulator 160, that is, there are four MZM modulators 160, and the first 1×2 coupler 140 and the two second 1×2 couplers 150 all split light in equal proportions, so that the light entering the input waveguide 120 is split to the four output waveguides 130 in equal proportions.

[0048] Example 5

[0049] like Figure 3 As shown, an optical engine includes: an optical fiber array 2 and a DR4 silicon photonic chip 1 as in any one of embodiments 1 to 4, the optical fiber array 2 is coupled to a plurality of output waveguides 130 possessed by the DR4 silicon photonic chip 1, and optical path glue 3 is applied between the optical fiber array 2 and the DR4 silicon photonic chip 1.

[0050] When the optical fiber array 2 is coupled with the multiple output waveguides 130 of the DR4 silicon photonic chip 1, and the optical path glue 3 is applied between the optical fiber array 2 and the DR4 silicon photonic chip 1, the coupling efficiency can be prevented from decreasing when the laser chip in the light emitting end is coupled with the input waveguide 120 of the DR4 silicon photonic chip 1, thereby ensuring the product yield and quality reliability.

[0051] Furthermore, the input waveguide 120 of the DR4 silicon photonic chip 1 is coupled with the light emitting end, and the light emitting end includes: a laser chip 4, a collimating lens 5, an optical isolator 6 and a converging lens 7 coupled in sequence along the light propagation direction, the converging lens 7 is coupled with the input waveguide 120, and the laser chip 4 is located on the ceramic heat sink 8, that is, the light emitted by the laser chip 4 is coupled into the input waveguide 120 of the DR4 silicon photonic chip 1 after passing through the collimating lens 5, the optical isolator 6 and the converging lens 7 in sequence.

[0052] Example 6

[0053] A method for producing a light engine, for producing the light engine as claimed in claim 5, comprising the following steps:

[0054] S1, coupling the optical fiber array 2 with a plurality of output waveguides 130 of the DR4 silicon photonic chip 1;

[0055] S2, apply optical path glue 3 between the optical fiber array 2 and the DR4 silicon photonic chip 1;

[0056] S3, curing the optical path glue 3, the curing method can be UV curing or heating curing, and using a CCD camera to collect images of the coupling point. Under normal circumstances, the CCD camera collects 100%, and then identifies whether there is glue in the first glue quantity observation slot 112 according to the collected image. If there is no glue, it is judged to be qualified. If there is glue, enter S4;

[0057] S4. Use a high-power microscope (200-500 times) to observe whether there is glue in the port groove of the input waveguide 120. If there is no glue, it is judged to be qualified; if there is glue, it is judged to be unqualified.

[0058] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A DR4 silicon photonic chip, characterized in that: include: A chip body (110), wherein the chip body (110) is provided with an input waveguide (120) and a plurality of output waveguides (130) on the same side of an upper surface, a first glue storage groove (111) is provided on the upper surface of the chip body (110) between the input waveguide (120) and the output waveguide (130), a first glue quantity observation groove (112) is provided on the upper surface of the chip body (110) between the input waveguide (120) and the first glue storage groove (111), and a first glue blocking dam (113) is formed on the upper surface of the chip body (110) between the first glue storage groove (111) and the first glue quantity observation groove (112).

2. The DR4 silicon photonic chip according to claim 1, characterized in that: A first labyrinth-shaped glue blocking groove (114) communicating with the first glue storage groove (111) is provided on the upper surface of the chip body (110) between the first glue storage groove (111) and the first glue blocking dam (113).

3. A DR4 silicon photonic chip according to claim 1 or 2, characterized in that: The upper surface of the first glue blocking dam (113) is flush with the upper surface of the chip body (110).

4. A DR4 silicon photonic chip according to claim 1, 2 or 3, characterized in that: A second labyrinth-shaped glue blocking groove (118) is provided on the upper surface of the chip body (110) at a side of the input waveguide (120) away from the first glue quantity observation groove (112), and a cutting path (115) is provided on the edge of the upper surface of the chip body (110) in a direction from the output waveguide (130) to connect the first glue storage groove (111) with the second labyrinth-shaped glue blocking groove (118).

5. The DR4 silicon photonic chip according to claim 4, characterized in that: A second glue quantity observation groove (116) is provided on the upper surface of the chip body (110) between the second labyrinth-shaped glue blocking groove (118) and the input waveguide (120), and a second glue blocking dam (117) is formed on the upper surface of the chip body (110) between the second glue quantity observation groove (116) and the second labyrinth-shaped glue blocking groove (118).

6. The DR4 silicon photonic chip according to claim 1, characterized in that: The input waveguide (120) divides the light into a plurality of output waveguides (130) in equal proportions.

7. The DR4 silicon photonic chip according to claim 6, characterized in that: The input waveguide (120) is coupled to an input of a first 1×2 coupler (140), two outputs of the first 1×2 coupler (140) are respectively coupled to an input of a second 1×2 coupler (150), and two outputs of each second 1×2 coupler (150) are respectively coupled to an output waveguide (130) via an MZM modulator (160).

8. A light engine, characterized in that: include: An optical fiber array (2) and a DR4 silicon photonic chip (1) as claimed in any one of claims 1 to 7, wherein the optical fiber array (2) is coupled to a plurality of output waveguides (130) of the DR4 silicon photonic chip (1), and optical path glue (3) is applied between the optical fiber array (2) and the DR4 silicon photonic chip (1).

9. The light engine according to claim 8, characterized in that: The input waveguide (120) of the DR4 silicon photonic chip (1) is coupled to the light emitting end.

10. A method for producing a light engine, characterized in that: The method for producing the light engine as claimed in claim 8 or 9 comprises the following steps: S1, coupling the optical fiber array (2) with a plurality of output waveguides (130) of the DR4 silicon photonic chip (1); S2, apply optical path glue (3) between the optical fiber array (2) and the DR4 silicon photonic chip (1); S3, curing the optical path glue (3), and using a CCD camera to collect images of the coupling point, and then identifying whether there is glue in the first glue quantity observation slot (112) based on the collected image, if there is no glue, it is judged to be qualified, and if there is glue, it goes to S4; S4. Observe whether there is glue in the port groove of the input waveguide (120) with a manual high-power microscope. If there is no glue, it is judged to be qualified; if there is glue, it is judged to be unqualified.

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