Liquid cooling heat dissipation device and electronic equipment

Abstract

The invention provides a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation equipment. The liquid cooling heat dissipation device comprises a base, a plurality of connecting pieces and a plurality of cold plate assemblies. The multiple connecting pieces are detachably arranged on the same side of the base. The cold plate assembly is correspondingly connected with the connecting piece, and the cold plate assembly is configured to be correspondingly connected with the piece to be cooled. The liquid cooling heat dissipation device is compact in overall structure and convenient to install. During installation, all the cold plate assemblies are integrated on the base through the connecting pieces, so that the cold plate assemblies can be close to a piece to be cooled through the base, and then the cold plate assemblies and the piece to be cooled are correspondingly installed according to the position of the piece to be cooled.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a liquid cooling device and an electronic device. Background Art

[0002] As the computing needs of electronic devices continue to increase, more high-power processors (such as CPUs and GPUs) need to be configured. The operation of these processors will generate a lot of heat, which puts higher requirements on the cooling system of electronic devices.

[0003] In the related art, liquid cooling is mainly used to dissipate heat from the processor in the electronic device. Each processor is equipped with a liquid cooling plate, and each liquid cooling plate is connected in sequence to form a liquid cooling system. The coolant flows in the liquid cooling system to remove the heat generated by the processor.

[0004] However, due to the large number of liquid cooling plates, the installation of the liquid cooling system in the electronic equipment is more troublesome. Summary of the invention

[0005] The present application provides a liquid cooling device and an electronic device, which are used to solve the problem that the liquid cooling system is difficult to install in the electronic device.

[0006] In a first aspect, the liquid cooling device provided by the embodiment of the present application includes:

[0007] Pedestal;

[0008] A plurality of connecting pieces, wherein the plurality of connecting pieces are detachably arranged on the same side of the base;

[0009] A plurality of cold plate assemblies are connected to the connecting members correspondingly, and the cold plate assemblies are configured to be connected to the heat dissipation members correspondingly.

[0010] In a possible implementation, in the liquid cooling device provided in the embodiment of the present application, the connecting member includes a first connecting portion and at least one second connecting portion, and the first connecting portion is connected to the second connecting portion;

[0011] A plurality of limiting parts are arranged on the base, and the first connecting part is detachably connected to the limiting part;

[0012] The second connection portion is connected to the cold plate assembly.

[0013] In a possible implementation, the liquid cooling heat dissipation device provided in the embodiment of the present application further includes a fastener, the second connecting portion is provided with a second connecting hole, and the fastener is connected to the cold plate assembly through the second connecting hole;

[0014] There is a gap between the inner wall of the second connecting hole and the fastener, so that the cold plate assembly can move relative to the second connecting portion.

[0015] In a possible implementation, in the liquid cooling heat dissipation device provided in an embodiment of the present application, the connector further includes at least one adjustment portion, which is disposed between the second connection portion and the cold plate assembly to adjust the distance between the second connection portion and the cold plate assembly.

[0016] In a possible implementation, the liquid cooling heat dissipation device provided in the embodiment of the present application, the cold plate assembly includes:

[0017] A support member, the support member is movably connected to the second connecting portion, and a mounting through hole is provided on the support member;

[0018] A cold plate is arranged in the mounting through hole and is used to abut against the heat dissipation element to be cooled.

[0019] In a possible implementation, in the liquid cooling heat dissipation device provided in the embodiment of the present application, the cold plate assembly further includes at least one locking member, and the locking member includes a locking portion and a reset portion;

[0020] The locking part is inserted on the support member, and the locking part is used to connect with the heat member to be cooled so as to limit the support member to be placed on the heat member to be cooled;

[0021] The reset portion is arranged between the locking portion and the reset portion to drive the locking portion to reset.

[0022] In a possible implementation, in the liquid cooling heat dissipation device provided in the embodiment of the present application, a protrusion is provided on one side of the support member facing the base, the protrusion is arranged around the peripheral side of the mounting through hole, and the protrusion, part of the support member and the cold plate together form a first liquid collecting tank;

[0023] The cold plate has a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet are located in the first liquid collecting tank.

[0024] In a possible implementation, the liquid cooling heat dissipation device and the water pipe assembly provided in the embodiment of the present application include:

[0025] A water inlet main pipe, a first water branch pipe and a plurality of water inlet branch pipes, the first water branch pipe connects the water inlet main pipe and the plurality of water inlet branch pipes, and the water inlet branch pipes are connected to the liquid inlet of the cold plate;

[0026] A water outlet main pipe, a second water distribution pipe and a plurality of water outlet branch pipes, the second water distribution pipe connects the water outlet main pipe and the plurality of water outlet branch pipes, and the water outlet branch pipes are connected to the liquid outlet of the cold plate;

[0027] The first water distribution pipe and the second water distribution pipe are both arranged on the connecting piece through a water distribution pipe bracket.

[0028] In a possible implementation, in the liquid cooling heat dissipation device provided in the embodiment of the present application, a second liquid collecting tank is provided on the water distribution pipe bracket, and the first water distribution pipe and the second water distribution pipe are both provided corresponding to the second liquid collecting tank.

[0029] In a second aspect, an electronic device provided in an embodiment of the present application includes a device body and a liquid cooling and heat dissipation device as described above, which is arranged on the device body.

[0030] The present invention provides a liquid-cooled heat dissipation device and an electronic device. The liquid-cooled heat dissipation device includes a base, a plurality of connectors and a plurality of cold plate assemblies. The plurality of connectors are detachably arranged on the same side of the base. The cold plate assembly is correspondingly connected to the connector, and the cold plate assembly is configured to be correspondingly connected to the heat dissipation element to be cooled. The overall structure of the liquid-cooled heat dissipation device is compact and easy to install. During installation, each cold plate assembly is integrated on the base through the connector, so that the cold plate assembly can be brought close to the heat dissipation element to be cooled through the base, and then the cold plate assembly is installed correspondingly to the heat dissipation element according to the position of the heat dissipation element to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0032] Figure 1 A schematic diagram of the structure of assembling multiple liquid cooling devices provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 A schematic diagram of the structure of the liquid cooling device;

[0034] Figure 3 for Figure 2 A schematic diagram of the structure of the base and the connecting parts;

[0035] Figure 4 for Figure 3 A schematic diagram of the structure of the connecting parts in FIG.

[0036] Figure 5 for Figure 1 A partial structural schematic diagram of a liquid cooling device in FIG.

[0037] Figure 6 for Figure 2 A schematic diagram of the structure of the cold plate assembly;

[0038] Figure 7 for Figure 6 A schematic structural diagram of the cold plate assembly from another perspective;

[0039] Figure 8 for Figure 6 Exploded view of the cold plate assembly in Figure 1.

[0040] Description of reference numerals:

[0041] 100, base; 110, limit portion; 120, avoidance through hole; 130, handle portion; 140, reinforcement portion;

[0042] 200, connecting member; 210, first connecting portion; 211, first connecting hole; 220, second connecting portion; 221, second connecting hole; 230, adjusting portion;

[0043] 300, cold plate assembly; 310, support member; 311, mounting through hole; 312, raised portion; 313, first liquid collecting tank; 314, limit mark; 315, positioning column; 320, cold plate; 321, liquid inlet; 322, liquid outlet; 330, locking member; 331, locking portion; 332, reset portion; 340, thermal conductive material; 350, sealing ring;

[0044] 400, water pipe assembly; 410, water inlet main pipe; 420, first water distribution pipe; 430, water inlet branch pipe; 440, water outlet main pipe; 450, second water distribution pipe; 460, water outlet branch pipe; 470, water distribution pipe bracket; 471, second liquid collecting tank;

[0045] 500. Fasteners.

[0046] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0048] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] As mentioned in the background technology, in the related art, liquid cooling is mainly used to dissipate heat from the processor in the electronic device. Each processor is equipped with a liquid cooling plate, and each liquid cooling plate is connected in sequence to form a liquid cooling system. The coolant flows in the liquid cooling system to remove the heat generated by the processor.

[0050] However, due to the large number of liquid cooling plates, the installation of the liquid cooling system in the electronic equipment is more troublesome.

[0051] In view of the above-mentioned problems existing in the prior art, the present invention provides a liquid-cooled heat dissipation device and an electronic device. The liquid-cooled heat dissipation device includes a base, a plurality of connectors and a plurality of cold plate assemblies. The plurality of connectors are detachably arranged on the same side of the base. The cold plate assembly is correspondingly connected to the connector, and the cold plate assembly is configured to be correspondingly connected to the heat dissipation element to be cooled. The overall structure of the liquid-cooled heat dissipation device is compact and easy to install. During installation, each cold plate assembly is integrated on the base through the connector, so that the cold plate assembly can be brought close to the heat dissipation element to be cooled through the base, and then the cold plate assembly is installed corresponding to the heat dissipation element to be cooled according to the position of the heat dissipation element to be cooled.

[0052] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0053] The liquid cooling heat dissipation device provided in the embodiment of the present application can be applied to electronic devices, and the heat dissipation part can be a processor in the electronic device, such as a GPU (Graphics Processing Unit), a CPU (Central Processing Unit), etc. Exemplarily, the electronic device can be a server, and the liquid cooling heat dissipation device provided in the embodiment of the present application is described below by taking a server as an example.

[0054] Reference Figure 1 and Figure 2 As shown, the liquid cooling heat dissipation device provided in the embodiment of the present application includes a base 100 , a plurality of connectors 200 and a plurality of cold plate assemblies 300 .

[0055] The plurality of connectors 200 are detachably disposed on the same side of the base 100. The cold plate assembly 300 is connected to the connector 200, and the cold plate assembly 300 is configured to be connected to the heat element to be cooled.

[0056] When assembling the liquid cooling heat dissipation device provided in the embodiment of the present application, the multiple connectors 200 can be connected to the multiple cold plate assemblies 300 in a one-to-one correspondence, and then the connectors 200 can be fixed on the base 100 in sequence.

[0057] The cold plate assembly 300 can move relative to the connector 200, so that when it is subsequently connected to the processor in the server, the position of the cold plate assembly 300 can be adjusted so that the cold plate assembly 300 is precisely aligned with the processor to avoid affecting the heat dissipation performance due to misalignment.

[0058] Reference Figure 1 and Figure 2 As shown, the operator can hold the base 100 to lift the entire liquid cooling device, bring the cold plate assembly 300 close to the processor in the server, and then connect the cold plate assembly 300 to the processor one by one according to the position of each processor.

[0059] Among them, the multiple connecting members 200 are all detachably connected to the base 100. After the cold plate assembly 300 and the processor are installed, the base 100 can be removed from the connecting member 200 separately to facilitate the subsequent operation and maintenance of the single cold plate assembly 300 and the processor. Of course, the base 100 can also be retained, and the embodiment of the present application does not impose too many restrictions on this.

[0060] Exemplarily, the connector 200 and the base 100 may be detachably connected via a bolt structure or a snap-fit ​​structure, and the embodiments of the present application do not impose too many restrictions on this.

[0061] The plurality of connectors 200 are all located on the same side of the base 100 , so that the plurality of cold plate assemblies 300 are all located on the same side of the base 100 , facilitating one-to-one connection between the cold plate assemblies 300 and the processors in the server.

[0062] Reference Figure 3 and Figure 4 As shown, in some embodiments, the connector 200 includes a first connector 210 and at least one second connector 220 , and the first connector 210 is connected to the second connector 220 .

[0063] The base 100 is provided with a plurality of limiting parts 110 , and the first connecting part 210 is detachably connected to the limiting part 110 . The second connecting part 220 is connected to the cold plate assembly 300 .

[0064] The first connection portion 210 may be provided with a first connection hole 211 for connecting with the limiting portion 110 .

[0065] In the above embodiment, the first connection part 210 is used to connect with the base 100, and the second connection part 220 is used to connect with the cold plate assembly 300. The limiting part 110 can be inserted into the first connection hole 211 on the first connection part 210 to fix each first connection part 210 on the base 100.

[0066] For example, the limiting portion 110 may be a buckle, and the first connection hole 211 may be a slot adapted thereto. The limiting portion 110 may also be a bolt, and the first connection hole 211 may also be a threaded hole. The present application embodiment does not impose too many restrictions on this.

[0067] The second connection part 220 can be movably connected to the cold plate assembly 300. For example, the second connection part 220 and the cold plate assembly 300 can be rotatably connected, and the cold plate assembly 300 rotates relative to the second connection part 220, so that the cold plate assembly 300 corresponds to the processor, and then the cold plate assembly 300 and the processor are fixed. The second connection part 220 and the cold plate assembly 300 can also be slidably connected, and the cold plate assembly 300 slides relative to the second connection part 220, so that the cold plate assembly 300 corresponds to the processor, and then the cold plate assembly 300 and the processor are fixed.

[0068] It is understandable that there is at least one second connection part 220, and the number of the second connection part 220 can be one. The number of the second connection parts 220 can also be two or more, and each second connection part 220 is respectively connected to the first connection part 210 to improve the overall structural strength of the connector 200 and ensure the connection stability between the base 100 and the cold plate assembly 300.

[0069] Reference Figure 3 and Figure 4As shown, in some embodiments, a fastener 500 is further included, and a second connection hole 221 is provided on the second connection portion 220, and the fastener 500 is connected to the cold plate assembly 300 through the second connection hole 221. There is a gap between the inner wall of the second connection hole 221 and the fastener 500, so that the cold plate assembly 300 can move relative to the second connection portion 220.

[0070] In the above embodiment, the fastener 500 can pass through the second connection hole 221 to connect with the cold plate assembly 300, so as to limit the second connection portion 220 on the cold plate assembly 300. In addition, there is a gap between the inner wall of the second connection hole 221 and the fastener 500, so that the cold plate assembly 300 has a movable space on a plane perpendicular to the extension direction of the fastener 500, so that the cold plate assembly 300 can slide relative to the second connection portion 220, thereby adjusting the position of the cold plate assembly 300 so that the cold plate assembly 300 can be docked with the processor.

[0071] For example, the fastener 500 may be a bolt, and the cold plate assembly 300 has a threaded hole adapted therefor.

[0072] Reference Figure 3 and Figure 4 As shown, in some embodiments, the connector 200 further includes at least one adjusting portion 230 , which is disposed between the second connector 220 and the cold plate assembly 300 to adjust the distance between the second connector 220 and the cold plate assembly 300 .

[0073] In the above embodiment, an adjustment portion 230 is provided between the second connection portion 220 and the cold plate assembly 300 to adjust the distance between the second connection portion 220 and the cold plate assembly 300, thereby lengthening or shortening the length of the connector 200 so that each cold plate assembly 300 can be adaptively abutted against each processor, thereby preventing the cold plate assembly 300 from being unable to contact or excessively contacting some processors due to the shape of some processors, thereby affecting subsequent installation.

[0074] Exemplarily, the adjusting portion 230 may be a gasket, such as a silicone gasket, a rubber gasket, a metal gasket, etc. The adjusting portion 230 may also be a spring.

[0075] It is understandable that at least one adjusting part 230 may be one, such as a spring, a silicone gasket or a rubber gasket, which performs adaptive adjustment by virtue of its elasticity. The number of adjusting parts 230 may be multiple, such as metal gaskets, which perform adjustment by stacking.

[0076] Reference Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments, the cold plate assembly 300 includes a support 310 and a cold plate 320 .

[0077] The support member 310 is movably connected to the second connection portion 220 . A mounting through hole 311 is formed on the support member 310 . The cold plate 320 is disposed in the mounting through hole 311 . The cold plate 320 is used to abut against the heat element to be cooled.

[0078] In the above embodiment, the support member 310 is mainly used to connect with the second connection part 220 and to install the cold plate 320. The side of the cold plate 320 away from the support member 310 and the connection member 200 is used to abut against the processor. The position of the support member 310 relative to the second connection part 220 can be adjusted so that the cold plate 320 abuts against the processor accordingly.

[0079] The cooling liquid flows in the cold plate 320 to remove the heat generated by the processor. The heat generated by the part of the area where the processor contacts the support member 310 can be transferred to the cold plate 320 by the support member 310 .

[0080] Among them, the cold plate 320 can be installed in the mounting through hole 311 and fixed in the mounting through hole 311 by fastening structures such as bolts to prevent the cold plate 320 from falling off the support member 310, and the fastener 500 can pass through the second connecting hole 221 on the second connecting part 220 and connect to the support member 310 to flexibly connect the second connecting part 220 with the cold plate assembly 300.

[0081] Reference Figure 6 As shown, in some embodiments, the cold plate assembly 300 further includes at least one locking member 330 , and the locking member 330 includes a locking portion 331 and a restoring portion 332 .

[0082] The locking part 331 is inserted on the support member 310, and the locking part 331 is used to connect with the heat dissipation element to limit the support member 310 on the heat dissipation element to be cooled. The reset part 332 is arranged between the locking part 331 and the reset part 332, and is used to drive the locking part 331 to reset.

[0083] In the above embodiment, the locking member 330 is mainly used to fix the support member 310 on the processor. Among them, the locking portion 331 can be connected to the heat dissipation element to connect the support member 310 to the processor. When the locking portion 331 is connected to the processor, the locking portion 331 will squeeze the reset portion 332 so that the reset portion 332 is in a compressed energy storage state. After the locking portion 331 is disconnected from the processor, under the action of the reset portion 332, the locking portion 331 can be quickly reset.

[0084] Specifically, the locking portion 331 may be a bolt, and the reset portion 332 may be a spring, and the spring is sleeved on the bolt.

[0085] The heat dissipation temperature specifications of different areas of the processor (such as GPU) are different. In order to reduce the cost of the cold plate assembly 300 and improve the heat dissipation efficiency, the support member 310 can be in contact with the area of ​​the processor with lower heat, and the cold plate 320 can be in contact with the area of ​​the processor with higher heat. The support member 310 can be made of aluminum, and the cold plate 320 can be made of copper. Figure 7 As shown, a heat-conducting material 340 is installed in a portion of the area where the support member 310 contacts the processor, and a heat-conducting material 340 can also be installed between the support member 310 and the cold plate 320 .

[0086] Exemplarily, the thermally conductive material 340 may be thermally conductive silicone grease, thermally conductive silicone rubber, thermally conductive silicone rubber sheet, etc.

[0087] Among them, the thermal conductive material 340 has a certain viscosity. When disassembling the support member 310 and the processor, the bolt of the locking member 330 is loosened to a predetermined position, and the spring of the locking member 330 will give the bolt an upward force to pull up the bolt and lift the support member 310 to prevent the support member 310 from sticking to the processor.

[0088] Reference Figure 7 As shown, a plurality of limit marks 314 are provided on the support member 310 , and the limit marks 314 can guide the thermal conductive material 340 to be accurately arranged at a designated position on the support member 310 to avoid deviation or installation error.

[0089] Reference Figure 7 As shown, at least one positioning column 315 is provided on the side of the support member 310 facing away from the connector 200 . The positioning column 315 is mainly used to be plugged into the positioning hole on the processor to ensure that the support member 310 is accurately docked with the processor.

[0090] Reference Figure 6 and Figure 8 As shown, in some embodiments, a protrusion 312 is provided on the side of the support member 310 facing the base 100 , and the protrusion 312 is arranged around the peripheral side of the mounting through hole 311 . The protrusion 312 , part of the support member 310 and the cold plate 320 together form a first liquid collecting tank 313 .

[0091] The cold plate 320 has a liquid inlet 321 and a liquid outlet 322 , and both the liquid inlet 321 and the liquid outlet 322 are located in the first liquid collecting tank 313 .

[0092] In the above embodiment, the coolant can enter the cold plate 320 through the liquid inlet 321 and flow out of the cold plate 320 through the liquid outlet 322. The liquid inlet 321 and the liquid outlet 322 are both located in the first liquid collecting tank 313, so that when the coolant leaks, the coolant can be collected by the first liquid collecting tank 313 to avoid the coolant leaking and damaging the processor.

[0093] Reference Figure 6 and Figure 8 As shown, a sealing ring 350 is arranged between the support member 310 and the cold plate 320, and the sealing ring 350 is arranged around the outer periphery of the mounting through hole 311, so as to ensure the sealing of the first collecting tank 313 and prevent the coolant in the first collecting tank 313 from leaking through the gap between the support member 310 and the cold plate 320.

[0094] Reference Figure 2 and Figure 5 As shown, in some embodiments, a water pipe assembly 400 is also included, and the water pipe assembly 400 includes a water inlet main pipe 410, a first water branch pipe 420 and a plurality of water inlet branch pipes 430. The first water branch pipe 420 connects the water inlet main pipe 410 and the plurality of water inlet branch pipes 430, and the water inlet branch pipes 430 are connected to the liquid inlet 321 of the cold plate 320.

[0095] The water pipe assembly 400 further includes a main water outlet pipe 440 , a second water branch pipe 450 and a plurality of branch water outlet pipes 460 . The second water branch pipe 450 connects the main water outlet pipe 440 and the plurality of branch water outlet pipes 460 . The branch water outlet pipes 460 are in communication with the liquid outlet 322 of the cold plate 320 .

[0096] The first water distribution pipe 420 and the second water distribution pipe 450 are both disposed on the connecting member 200 through a water distribution pipe bracket 470 .

[0097] In the above embodiment, the water inlet main pipe 410 and the water outlet main pipe 440 can both be connected to an external water source. After the coolant enters through the water inlet main pipe 410, it is divided through the first water branch pipe 420, and the divided coolant enters each cold plate 320 through each water inlet branch pipe 430. Then, the coolant in each cold plate 320 is collected in the second water branch pipe 450 through each water outlet branch pipe 460, and finally discharged through the water outlet main pipe 440. In this way, the heat generated by each processor can be taken away by the coolant.

[0098] Among them, the water inlet branch pipe 430 and the water outlet branch pipe 460 can be both arranged between the base 100 and the cold plate assembly 300, the water inlet branch pipe 430 can be connected to the liquid inlet 321 of the cold plate 320 through the first liquid collecting tank 313, and the water outlet branch pipe 460 can be connected to the liquid outlet 322 of the cold plate 320 through the first liquid collecting tank 313, so that the overall structure is more compact and convenient for installation and arrangement.

[0099] Reference Figure 2 and Figure 5As shown, the water distribution pipe bracket 470 is mainly used to install the first water distribution pipe 420 and the second water distribution pipe 450 to the connecting piece 200, so as to play a certain limiting role on the water inlet main pipe 410, the water inlet branch pipe 430, the water outlet main pipe 440 and the water outlet branch pipe 460, and avoid unnecessary shaking caused by external force.

[0100] Furthermore, the first water distribution pipe 420 and the second water distribution pipe 450 are integrated with the connector 200 through the water distribution pipe bracket 470, so that the overall installation process can be simplified.

[0101] Reference Figure 2 and Figure 5 As shown, in some embodiments, a second liquid collecting tank 471 is disposed on the water distribution pipe support 470 , and the first water distribution pipe 420 and the second water distribution pipe 450 are both disposed corresponding to the second liquid collecting tank 471 .

[0102] In the above embodiment, the second liquid collecting tank 471 is mainly used to collect the coolant leaked from the first water distribution pipe 420 and the second water distribution pipe 450 to prevent the coolant from leaking and damaging the components inside the server.

[0103] Reference Figure 2 and Figure 3 As shown, in some embodiments, at least one avoidance through hole 120 is opened on the base 100 , and the area surrounded by the avoidance through hole 120 forms a handle portion 130 .

[0104] In the above embodiment, the operator can lift the entire liquid cooling device by the handle portion 130 to facilitate installation of the liquid cooling device in the server.

[0105] Among them, refer to Figure 2 and Figure 3 As shown, a reinforcing portion 140 is provided on the base 100, and the extension shape of the reinforcing portion 140 is the same as the extension shape of the handle portion 130. The reinforcing portion 140 is correspondingly provided on the handle portion 130 and is fixedly connected to the base 100. In this way, the structural strength of the handle portion 130 and the base 100 can be increased by the reinforcing portion 140, thereby preventing the handle portion 130 from bending due to stress.

[0106] Reference Figure 2 and Figure 3 As shown, the limiting portion 110 may be disposed at an edge of the avoidance through hole 120 , so that additional operating space may be provided by the avoidance through hole 120 to facilitate installation between the limiting portion 110 and the connector 200 .

[0107] The electronic device provided in the embodiment of the present application includes a device body and a liquid cooling and heat dissipation device as described above, which is arranged on the device body.

[0108] Among them, since the electronic equipment adopts the liquid cooling and heat dissipation device in the above embodiment, it also correspondingly has the advantages and benefits brought by the above liquid cooling and heat dissipation device, which will not be further described here.

[0109] For example, refer to Figure 1 As shown, two liquid cooling devices may be provided, and the two liquid cooling devices are arranged in parallel. Each liquid cooling device may be provided with six cold plate assemblies 300 arranged in an array, so as to be responsible for the heat dissipation of six processors (such as GPU, CPU, etc.) respectively.

[0110] Those skilled in the art will readily appreciate other embodiments of the present application after considering the description and practicing the contents disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The description and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0111] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A liquid cooling device, characterized in that: include: Base(100); A plurality of connecting members (200), wherein the plurality of connecting members (200) are detachably arranged on the same side of the base (100); A plurality of cold plate assemblies (300), wherein the cold plate assemblies (300) are connected correspondingly to the connecting members (200), and the cold plate assemblies (300) are configured to be connected correspondingly to a heat member to be cooled.

2. The liquid cooling device according to claim 1, characterized in that: The connecting member (200) comprises a first connecting portion (210) and at least one second connecting portion (220), wherein the first connecting portion (210) is connected to the second connecting portion (220); A plurality of limiting portions (110) are provided on the base (100), and the first connecting portion (210) is detachably connected to the limiting portion (110); The second connection portion (220) is connected to the cold plate assembly (300).

3. The liquid cooling device according to claim 2, characterized in that: It also comprises a fastener (500), the second connecting portion (220) being provided with a second connecting hole (221), and the fastener (500) being connected to the cold plate assembly (300) via the second connecting hole (221); There is a gap between the inner wall of the second connection hole (221) and the fastener (500), so that the cold plate assembly (300) can move relative to the second connection portion (220).

4. The liquid cooling device according to claim 2 or 3, characterized in that: The connecting member (200) further comprises at least one adjusting portion (230), wherein the adjusting portion (230) is arranged between the second connecting portion (220) and the cold plate assembly (300) to adjust the distance between the second connecting portion (220) and the cold plate assembly (300).

5. The liquid cooling device according to claim 2 or 3, characterized in that: The cold plate assembly (300) comprises: A support member (310), the support member (310) being movably connected to the second connection portion (220), and a mounting through hole (311) being provided on the support member (310); A cold plate (320), the cold plate (320) being arranged in the mounting through hole (311), the cold plate (320) being used to abut against the heat element to be cooled.

6. The liquid cooling device according to claim 5, characterized in that: The cold plate assembly (300) further comprises at least one locking member (330), wherein the locking member (330) comprises a locking portion (331) and a reset portion (332); The locking portion (331) is inserted into the support member (310), and the locking portion (331) is used to connect with the heat member to be cooled, so as to limit the support member (310) to be located on the heat member to be cooled; The reset portion (332) is arranged between the locking portion (331) and the reset portion (332) to drive the locking portion (331) to reset.

7. The liquid cooling device according to claim 5, characterized in that: A protrusion (312) is provided on one side of the support member (310) facing the base (100); the protrusion (312) is arranged around the peripheral side of the mounting through hole (311); the protrusion (312), a part of the support member (310) and the cold plate (320) together form a first liquid collecting tank (313); The cold plate (320) has a liquid inlet (321) and a liquid outlet (322), and the liquid inlet (321) and the liquid outlet (322) are both located in the first liquid collecting tank (313).

8. The liquid cooling device according to claim 7, characterized in that: Also included is a water pipe assembly (400), wherein the water pipe assembly (400) comprises: a water inlet main pipe (410), a first water branch pipe (420) and a plurality of water inlet branch pipes (430), wherein the first water branch pipe (420) is connected to the water inlet main pipe (410) and the plurality of water inlet branch pipes (430), and the water inlet branch pipes (430) are connected to the liquid inlet (321) of the cold plate (320); a water outlet main pipe (440), a second water distribution pipe (450) and a plurality of water outlet branch pipes (460), wherein the second water distribution pipe (450) is connected to the water outlet main pipe (440) and the plurality of water outlet branch pipes (460), and the water outlet branch pipes (460) are connected to the liquid outlet (322) of the cold plate (320); The first water distribution pipe (420) and the second water distribution pipe (450) are both arranged on the connecting piece (200) via a water distribution pipe bracket (470).

9. The liquid cooling device according to claim 8, characterized in that: The water distribution pipe support (470) is provided with a second liquid collecting tank (471), and the first water distribution pipe (420) and the second water distribution pipe (450) are both provided corresponding to the second liquid collecting tank (471).

10. An electronic device, characterized in that: It comprises a device body and a liquid cooling heat dissipation device as claimed in any one of claims 1 to 9 arranged on the device body.

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