Heat dissipation plate, heat dissipation device and computing equipment

Abstract

The invention relates to a heat dissipation plate, a heat dissipation device and computing equipment. The heat dissipation plate comprises a frame, a cold plate and a vapor chamber, the frame is provided with a first containing cavity and a second containing cavity, the first containing cavity is communicated with the second containing cavity, the end face of the frame is provided with a first opening, and the first opening is communicated with the second containing cavity. The cold plate is installed in the first containing cavity and comprises a first shell, the first shell is provided with a liquid cooling cavity, a liquid cooling working medium is arranged in the liquid cooling cavity, the first shell is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both communicated with the liquid cooling cavity, the liquid inlet is used for inputting the liquid cooling working medium into the liquid cooling cavity, and the liquid outlet is used for outputting the liquid cooling working medium in the liquid cooling cavity. The vapor chamber is installed in the second containing cavity, one end of the vapor chamber corresponds to the first opening, the other end of the vapor chamber is connected with the cold plate, and a phase change working medium is arranged in the vapor chamber. The heat dissipation plate, the heat dissipation device and the computing equipment have the advantages of being high in heat exchange efficiency and high in heat dissipation capacity.

Description

Technical Field

[0001] The present application relates to the technical field of computer accessories, and in particular to a heat sink, a heat sink and a computing device. Background Art

[0002] With the acceleration of the global digitalization process and the explosive growth in computing power demand, server chips are becoming more and more powerful during the iterative upgrade process, and the requirements for heat dissipation are also becoming higher and higher.

[0003] In order to meet the increasing heat dissipation requirements of server chips, the heat dissipation capacity of the heat dissipation device needs to be continuously improved. The current heat dissipation device is a cold plate radiator, which relies on the liquid cooling medium flowing inside the cold plate to remove the surface heat of the chip. However, the single-phase liquid convection heat transfer capacity of the liquid cooling medium is limited, and it is difficult to meet the heat dissipation requirements of high-power chips. Therefore, the current heat dissipation device has the defects of low heat exchange efficiency and poor heat dissipation capacity. Summary of the invention

[0004] Based on this, it is necessary to provide a heat sink, a heat sink and a computing device to address the problems of low heat exchange efficiency and poor heat dissipation capacity of the heat sink.

[0005] The present invention provides a heat dissipation plate, comprising:

[0006] A frame, wherein the frame is provided with a first accommodating cavity and a second accommodating cavity, the first accommodating cavity and the second accommodating cavity are communicated with each other, and an end surface of the frame is provided with a first opening, the first opening is communicated with the second accommodating cavity;

[0007] A cold plate, the cold plate is installed in the first accommodating cavity, the cold plate comprises a first shell, the first shell is provided with a liquid cooling cavity, a liquid cooling medium is arranged in the liquid cooling cavity, the first shell is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both connected to the liquid cooling cavity;

[0008] and a heat spreader, wherein the heat spreader is installed in the second accommodating cavity, one end of the heat spreader is arranged corresponding to the first opening, the other end of the heat spreader is connected to the cold plate, and a phase change medium is arranged inside the heat spreader.

[0009] In one embodiment, the heat spreader includes a second shell, a capillary wick and a support member, the second shell is provided with an evaporation end face and a condensation end face, the evaporation end face is arranged toward the first opening, the condensation end face is connected to the cold plate, the second shell is provided with a vacuum cavity, the capillary wick covers the inner wall of the vacuum cavity, the support member includes multiple ones, one end of the support member is connected to the evaporation end face, the other end of the support member is connected to the condensation end face, and the phase change working medium is arranged in the vacuum cavity.

[0010] In one embodiment, one end of the support member is disposed obliquely with the evaporation end surface, the other end of the support member is disposed obliquely with the condensation end surface, and a plurality of the support members are sequentially connected end to end in the vacuum chamber to form a zigzag line structure; or,

[0011] One end of the support member is vertically connected to the evaporation end surface, and the other end of the support member is vertically connected to the condensation end surface.

[0012] In one of the embodiments, the cold plate further includes a plurality of fins, the plurality of fins are arranged at intervals in the liquid cooling cavity, and the plurality of fins are connected to an end surface of the first shell close to the heat spreader.

[0013] In one embodiment, the capillary wick is a wire mesh capillary wick, a sintered capillary wick or a grooved capillary wick.

[0014] In one embodiment, the phase change working fluid is high-purity water or ethanol.

[0015] In one embodiment, the frame is further provided with a second opening, the second opening is arranged on the side opposite to the first opening, an end surface of the cold plate away from the heat spreader faces the second opening, and the liquid inlet and the liquid outlet are both arranged on an end surface of the cold plate away from the heat spreader.

[0016] In one of the embodiments, the heat sink further includes a fastener, which is disposed on the frame and is used to connect the frame to a device to be cooled.

[0017] The present invention also provides a heat dissipation device, comprising a water pump, a first pipe, a second pipe, a water tank and the heat sink described in any of the above embodiments, the output end of the water tank and the liquid inlet of the heat sink are connected through the first pipe, the liquid outlet of the heat sink and the input end of the water tank are connected through the second pipe, the water tank, the heat sink, the first pipe and the second pipe are connected in sequence to form a circulating pipe, and the water pump is arranged in the circulating pipe.

[0018] The present invention further provides a computing device, comprising a computing element and the heat sink described in any one of the above embodiments, wherein the heat sink is installed on the computing element.

[0019] The above-mentioned heat sink is achieved by installing the cold plate in the first accommodating cavity of the frame, and the heat spreader in the second accommodating cavity of the frame. The cold plate is connected to the heat spreader, and the side of the heat spreader facing the first opening is used to be installed on the component that needs heat dissipation. The heat of the component is transferred to the heat spreader, so that the phase change medium absorbs heat and evaporates from liquid to gas. The cold plate inputs the liquid cooling medium into the liquid cooling cavity of the first shell through the liquid inlet, and the heat spreader transfers heat to the cold plate on the side close to the cold plate, so that the evaporated gas condenses into liquid. The alternating process of evaporation and condensation inside the heat spreader will take away a large amount of heat. Therefore, phase change heat transfer relying on liquid evaporation and gas condensation can transfer more heat in a short time than simple convection heat transfer relying on the cold plate, which can significantly enhance the heat dissipation capacity of the heat sink, thereby reducing the temperature of the component, and has the advantages of high heat exchange efficiency and strong heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the heat sink described in an embodiment of the present application.

[0021] Figure 2 This is a schematic structural diagram of a heat sink according to another embodiment of the present application.

[0022] Figure Number:

[0023] 100, frame; 100A, first accommodating cavity; 100B, second accommodating cavity; 100C, first opening; 100D, second opening; 110, fastener;

[0024] 200, cold plate; 210, first shell; 210A, liquid cooling chamber; 210B, liquid inlet; 210C, liquid outlet; 220, fin;

[0025] 300, heat sink; 310, second shell; 311, evaporation end surface; 312, condensation end surface; 310A, vacuum chamber; 320, capillary wick; 330, support member. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0028] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0030] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0032] See also Figure 1 , shows a schematic structural diagram of a heat sink in an embodiment of the present application, the heat sink includes a frame 100, a cold plate 200 and a heat spreader 300, the frame 100 is provided with a first accommodating cavity 100A and a second accommodating cavity 100B, the first accommodating cavity 100A and the second accommodating cavity 100B are connected, the end surface of the frame 100 is provided with a first opening 100C, the first opening 100C is connected with the second accommodating cavity 100B. The cold plate 200 is installed in the first accommodating chamber 100A. The cold plate 200 includes a first shell 210. The first shell 210 is provided with a liquid cooling chamber 210A. The liquid cooling chamber 210A is provided with a liquid cooling medium. The first shell 210 is provided with a liquid inlet 210B and a liquid outlet 210C. The liquid inlet 210B and the liquid outlet 210C are both connected to the liquid cooling chamber 210A. The liquid inlet 210B is used to input the liquid cooling medium into the liquid cooling chamber 210A, and the liquid outlet 210C is used to output the liquid cooling medium in the liquid cooling chamber 210A. The heat spreader 300 is installed in the second accommodating chamber 100B. One end of the heat spreader 300 is arranged corresponding to the first opening 100C. The other end of the heat spreader 300 is connected to the cold plate 200. The interior of the heat spreader 300 is provided with a phase change medium.

[0033] In an optional embodiment, the frame 100 is a cubic structure, and the cold plate 200 and the heat spreader 300 are arranged in the frame 100 in a stacked manner.

[0034] In an optional embodiment, if Figure 1 As shown, the first accommodating chamber 100A is located at the upper layer of the second accommodating chamber 100B, and the heating element to be installed is located at the lower layer of the second accommodating chamber 100B, that is, the first accommodating chamber 100A is arranged at the end of the second accommodating chamber 100B away from the heating element, and the cold plate 200 is connected to the end of the heat spreader 300 away from the heating element.

[0035] The heat sink described in the embodiment of the present application is provided by installing the cold plate 200 in the first accommodation cavity 100A of the frame 100, and the heat spreader 300 in the second accommodation cavity 100B of the frame 100. The cold plate 200 is connected to the heat spreader 300. The side of the heat spreader 300 facing the first opening 100C is used to be installed on the component that needs to dissipate heat. The heat of the component is transferred to the heat spreader 300, so that the phase change medium absorbs heat and evaporates from liquid to gas. The cold plate 200 inputs the liquid cooling medium into the liquid cooling cavity 210A of the first shell 210 through the liquid inlet 210B. The heat spreader 300 transfers heat to the cold plate 200 on the side close to the cold plate 200, so that the evaporated gas condenses into liquid. The alternating process of evaporation and condensation inside the heat spreader 300 will take away a large amount of heat.

[0036] The heat sink described in the embodiment of the present application, by arranging a phase change medium in the heat spreader 300, relies on the phase change heat transfer of liquid evaporation and gas condensation of the phase change medium to transfer the heat on the component that needs to be dissipated to the cold plate 200 to be taken away by the liquid cooling medium. Compared with the simple convection heat transfer of the cold plate 200, it can transfer more heat in a short time, can significantly enhance the heat dissipation capacity of the heat sink, and thus reduce the temperature of the component, and has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0037] In some embodiments, Figure 1 As shown, the heat spreader 300 includes a second shell 310, a capillary wick 320 and a support member 330. The second shell 310 is provided with an evaporation end surface 311 and a condensation end surface 312. The evaporation end surface 311 is arranged toward the first opening 100C, and the condensation end surface 312 is connected to the cold plate 200. The second shell 310 is provided with a vacuum chamber 310A. The capillary wick 320 covers the inner wall of the vacuum chamber 310A. The support member 330 includes a plurality of support members 330, one end of the support member 330 is connected to the evaporation end surface 311, and the other end of the support member 330 is connected to the condensation end surface 312. The phase change working medium is arranged in the vacuum chamber 310A. By arranging a sealed vacuum chamber 310A in the second shell 310, the sealed vacuum chamber 310A can ensure that the phase change working medium is efficiently phase-changed and circulated in the second shell 310. The phase change medium is arranged in the vacuum chamber 310A, and then the capillary core 320 is covered on the inner wall of the vacuum chamber 310A, so that the phase change medium, driven by the capillary force, causes the liquid phase change medium condensed on the condensation end surface 312 to flow back to the evaporation end surface 311, thereby forming a circulation reflux of the phase change medium. Furthermore, a support member 330 is also arranged in the vacuum chamber 310A, and the two ends of the support member 330 are respectively connected to the evaporation end surface 311 and the condensation end surface 312, thereby providing support force for the evaporation end surface 311 and the condensation end surface 312, preventing the heat spreader 300 from being deformed by pressure, and maintaining the stability of the vacuum chamber 310A.

[0038] In an exemplary embodiment, the heat sink works in such a way that the evaporation end surface 311 of the heat sink contacts the packaging surface of the element to be cooled via a thermally conductive contact material, wherein the thermally conductive contact material may be thermally conductive paste, a thermally conductive gasket, a thermally conductive filler, or the like.

[0039] In an exemplary embodiment, the support member 330 is a cylindrical structure, and two ends of the cylinder are respectively connected to the evaporation end surface 311 and the condensation end surface 312 .

[0040] In an exemplary embodiment, the second housing 310 is made of a highly thermally conductive metal, such as copper or copper-aluminum alloy, to improve the thermal conductivity of the heat sink 300, thereby improving the heat dissipation efficiency of the heat sink. In other embodiments, the second housing 310 may also be made of aluminum to accommodate some lightweight scenarios.

[0041] In an exemplary embodiment, the material of the support member 330 and the material of the second housing 310 are the same metal material, so that the support member 330 provides a certain strength support for the vapor chamber 300 .

[0042] In an optional embodiment, if Figure 1 As shown, one end of the support member 330 is obliquely arranged with the evaporation end face 311, and the other end of the support member 330 is obliquely arranged with the condensation end face 312, and multiple support members 330 are sequentially connected end to end in the vacuum chamber 310A to form a zigzag line structure. By setting the support member 330 and the end face of the second shell 310 in an inclined state, and connecting multiple support members 330 into a zigzag line structure, the support structure of the support member 330 is more stable, avoiding deformation of the evaporation end face 311 and the condensation end face 312 of the second shell 310, resulting in the second shell 310 and the first shell 210 The connection is not tight enough, thereby avoiding affecting the conduction of heat and improving the heat dissipation efficiency of the heat sink. Moreover, the support member 330 is set in an inclined state, which can also be used to guide the phase change working medium condensed into a liquid state, so that the deformation working medium forms a cycle.

[0043] In other embodiments, Figure 2 As shown, one end of the support member 330 is vertically connected to the evaporation end surface 311, and the other end of the support member 330 is vertically connected to the condensation end surface 312. Arranging the support member 330 to vertically connect the evaporation end surface 311 and the condensation end surface 312 can also provide support force for the second shell 310 to prevent the second shell 310 from deforming.

[0044] In an optional embodiment, if Figure 1As shown, the cold plate 200 further includes a plurality of fins 220, which are spaced apart in the liquid cooling chamber 210A, and are connected to the end surface of the first housing 210 close to the vapor chamber 300. By connecting a plurality of fins 220 to the end surface of the first housing 210 close to the vapor chamber 300, the heat dissipation contact area of ​​the original end surface is expanded to the fins 220, so that the heat dissipation surface area of ​​the cold plate 200 is enlarged, more heat exchange interfaces are provided for heat transfer, and the heat dissipation effect of the heat sink is better.

[0045] In an optional embodiment, the capillary core 320 is a wire mesh capillary core, a sintered capillary core or a grooved capillary core. Among them, the wire mesh capillary core is formed by stacking multiple layers of metal wire woven mesh, the wire mesh capillary core has a high permeability, and the flow resistance of the gaseous phase change working fluid is small. The sintered capillary core is a porous structure formed by high-temperature sintering of metal powder. The capillary force of the sintered capillary core is extremely strong, and the phase change working fluid can be quickly pumped back to the evaporation end face 311. The grooved capillary core is mechanically or chemically etched into micro grooves on the inner wall of the second shell 310, and the diffusion channel of the gaseous phase change working fluid is open, and the permeability is the highest. Through the differentiated design of the capillary core 320, the heat sink can accurately match the thermal management requirements of different scenarios to achieve the optimal balance of efficiency, cost and reliability.

[0046] In an optional embodiment, the phase change working fluid is high-purity water or ethanol. The latent heat of evaporation of high-purity water is 2260 kJ / kg, and the unit mass of working fluid can absorb more heat, which is suitable for high-power heat dissipation scenarios. The freezing point of ethanol is as low as -114°C, which is suitable for extreme low temperature environments to avoid freezing and failure of the phase change working fluid. By reasonably selecting the phase change working fluid, the heat sink can accurately match the heat source characteristics and environmental conditions to maximize the heat dissipation efficiency and reliability.

[0047] In an optional embodiment, if Figure 1 As shown, the frame 100 is further provided with a second opening 100D, and the second opening 100D is arranged on a side opposite to the first opening 100C, and an end surface of the cold plate 200 away from the vapor chamber 300 faces the second opening 100D, and the liquid inlet 210B and the liquid outlet 210C are both arranged on an end surface of the cold plate 200 away from the vapor chamber 300. By arranging the second opening 100D on the side opposite to the frame 100, the liquid inlet 210B and the liquid outlet 210C on the cold plate 200 are arranged at the second opening 100D, so that the liquid inlet 210B and the liquid outlet 210C are conveniently connected to the pipeline, which has the advantage of convenient operation.

[0048] In an optional embodiment, if Figure 1As shown, the heat sink further includes a fastener 110, which is disposed on the frame 100 and is used to connect the frame 100 to the device to be radiated. The heat sink can be mounted on the component to be radiated through the fastener 110, so that the heat sink and the component are tightly connected, thereby transferring the heat on the component to the heat sink.

[0049] In an exemplary embodiment, the fastener 110 is a bolt, and the frame 100 is connected to the device requiring heat dissipation through the bolt.

[0050] On the other hand, an embodiment of the present application also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank and the heat sink described in any of the above embodiments, the output end of the water tank and the liquid inlet 210B of the heat sink are connected through a first pipe, the liquid outlet 210C of the heat sink and the input end of the water tank are connected through a second pipe, the water tank, the heat sink, the first pipe and the second pipe are connected in sequence to form a circulating pipe, and the water pump is arranged in the circulating pipe.

[0051] The heat dissipation device described in this embodiment inputs the liquid cooling medium in the water tank into the heat dissipation plate through a water pump, thereby taking away the heat in the heat dissipation plate to achieve the purpose of cooling. The heat dissipation plate sets a phase change medium in the heat spreader 300, and relies on the phase change heat transfer of liquid evaporation and gas condensation of the phase change medium to transfer the heat on the component that needs to be dissipated to the cold plate 200 to be taken away by the liquid cooling medium. Compared with the simple convection heat transfer of the cold plate 200, it can transfer more heat in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate, thereby reducing the temperature of the component, and has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0052] On the other hand, an embodiment of the present application further provides a computing device, comprising a computing element and the heat sink described in any of the above embodiments, wherein the heat dissipation device is installed on the computing element.

[0053] The computing device described in this embodiment dissipates heat from the computing element by installing a heat dissipation device on the computing element to ensure stable operation of the computing element. The heat dissipation device is provided with a heat sink, which is connected to the computing element. The heat sink is provided with a heat sink in the heat spreader 300, and relies on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium to transfer the heat on the element that needs to be dissipated to the cold plate 200 to be taken away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, it can transfer more heat in a short time, and can significantly enhance the heat dissipation capacity of the heat sink, thereby reducing the temperature of the element. Under the computing element with the same power consumption, the heat sink of this embodiment can allow a higher water inlet temperature, which can reduce the power of the heat sink, save the operating cost of the heat sink, and has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0054] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat sink, characterized in that: include: A frame (100), the frame (100) being provided with a first accommodating cavity (100A) and a second accommodating cavity (100B), the first accommodating cavity (100A) and the second accommodating cavity (100B) being communicated with each other, and an end surface of the frame (100) being provided with a first opening (100C), the first opening (100C) being communicated with the second accommodating cavity (100B); A cold plate (200), the cold plate (200) being mounted on the first accommodating cavity (100A), the cold plate (200) comprising a first shell (210), the first shell (210) being provided with a liquid cooling cavity (210A), a liquid cooling medium being arranged in the liquid cooling cavity (210A), the first shell (210) being provided with a liquid inlet (210B) and a liquid outlet (210C), the liquid inlet (210B) and the liquid outlet (210C) both being in communication with the liquid cooling cavity (210A); and A heat spreader (300), the heat spreader (300) being installed in the second accommodating cavity (100B), one end of the heat spreader (300) being arranged corresponding to the first opening (100C), the other end of the heat spreader (300) being connected to the cold plate (200), and a phase change working medium being arranged inside the heat spreader (300).

2. The heat sink according to claim 1, characterized in that: The heat spreader (300) comprises a second shell (310), a capillary wick (320) and a support member (330); the second shell (310) is provided with an evaporation end surface (311) and a condensation end surface (312); the evaporation end surface (311) is arranged toward the first opening (100C); the condensation end surface (312) is connected to the cold plate (200); the second shell (310) is provided with a vacuum cavity (310A); the capillary wick (320) covers the inner wall of the vacuum cavity (310A); the support member (330) comprises a plurality of support members; one end of the support member (330) is connected to the evaporation end surface (311); the other end of the support member (330) is connected to the condensation end surface (312); and the phase change working medium is arranged in the vacuum cavity (310A).

3. The heat sink according to claim 2, characterized in that: One end of the support member (330) is disposed obliquely with the evaporation end surface (311), and the other end of the support member (330) is disposed obliquely with the condensation end surface (312), and a plurality of the support members (330) are sequentially connected end to end in the vacuum chamber (310A) to form a zigzag line structure; or, One end of the support member (330) is vertically connected to the evaporation end surface (311), and the other end of the support member (330) is vertically connected to the condensation end surface (312).

4. The heat sink according to claim 1, characterized in that: The cold plate (200) further comprises a plurality of fins (220), the plurality of fins (220) being arranged at intervals in the liquid cooling cavity (210A), and the plurality of fins (220) being connected to an end surface of the first shell (210) close to the heat spreader (300).

5. The heat sink according to claim 2, characterized in that: The capillary wick (320) is a wire mesh capillary wick, a sintered capillary wick or a grooved capillary wick.

6. The heat sink according to claim 2, characterized in that: The phase change working fluid is high-purity water or ethanol.

7. The heat sink according to claim 1, characterized in that: The frame (100) is further provided with a second opening (100D), the second opening (100D) being arranged on a side opposite to the first opening (100C), an end surface of the cold plate (200) away from the heat spreader (300) facing the second opening (100D), and the liquid inlet (210B) and the liquid outlet (210C) being arranged on an end surface of the cold plate (200) away from the heat spreader (300).

8. The heat sink according to claim 1, characterized in that: The heat dissipation plate further comprises a fastener (110), wherein the fastener (110) is arranged on the frame (100), and the fastener (110) is used to connect the frame (100) to a device to be cooled.

9. A heat dissipation device, characterized in that: The invention comprises a water pump, a first pipe, a second pipe, a water tank and the heat sink according to any one of claims 1 to 8, wherein the output end of the water tank and the liquid inlet (210B) of the heat sink are connected via the first pipe, the liquid outlet (210C) of the heat sink and the input end of the water tank are connected via the second pipe, the water tank, the heat sink, the first pipe and the second pipe are sequentially connected to form a circulation pipe, and the water pump is arranged in the circulation pipe.

10. A computing device, characterized in that: The invention comprises a computing element and the heat dissipation plate as claimed in claim 9, wherein the heat dissipation device is mounted on the computing element.

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