Electronic device

Abstract

The invention relates to an electronic device. The electronic device comprises an immersion tank and at least one server, the at least one server comprises a shell, a circuit board, at least one main heat source, at least one secondary heat source and at least one radiator. The shell is vertically arranged in the immersion tank and is provided with a side plate; the circuit board is arranged on the side plate and provided with a front face and a back face which are back to back. The back surface faces the side plate. The at least one main heat source is arranged on the back. At least one primary heat source is disposed on the front surface. The calorific value of the at least one secondary heat source is less than that of the at least one main heat source. The at least one radiator is disposed on the side plate and thermally coupled to the at least one main heat source.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to a server with a main heat source arranged on the back of a circuit board. Background Art

[0002] With the advent of the big data era and the continuous development of cloud technology, all walks of life have higher and higher requirements for high-performance servers. The amount of data that needs to be processed by the server is getting larger and larger, which greatly increases the heat flux density and heat generation of the server. Therefore, the heat dissipation problem needs to be solved urgently.

[0003] Generally speaking, servers can dissipate heat through liquid cooling systems. However, the heat dissipation efficiency of high-power electronic components in servers is still insufficient, which in turn affects the operation of the server. Therefore, how to improve the heat dissipation efficiency of high-power electronic components in servers is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides an electronic device to improve the heat dissipation efficiency of the heat source in the server.

[0005] An electronic device disclosed in an embodiment of the present invention includes an immersion tank and at least one server. The at least one server includes a housing, a circuit board, at least one main heat source, at least one primary heat source and at least one radiator. The housing is erected in the immersion tank and has a side panel. The circuit board is disposed on the side panel and has a front side and a back side facing each other. The back side faces the side panel. At least one main heat source is disposed on the back side. At least one primary heat source is disposed on the front side. The heat generated by the at least one primary heat source is less than the heat generated by the at least one main heat source. At least one radiator is disposed on the side panel and is thermally coupled to the at least one main heat source.

[0006] According to the electronic device of the above embodiment, since the main heat sources and the secondary heat sources are respectively arranged on the back and the front of the circuit board, the main heat sources can be kept away from the secondary heat sources to distinguish the heat dissipation areas exclusively for the main heat sources. Therefore, the main heat sources can have more space to dissipate heat to avoid the heat generated by the main heat sources and the secondary heat sources being concentrated in one place and difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 FIG. 4 is a schematic side view of an electronic device according to an embodiment of the present invention.

[0010] Figure 2 for Figure 1 A three-dimensional schematic diagram of a server of an electronic device.

[0011] Figure 3 for Figure 1 An exploded schematic diagram of a server of an electronic device.

[0012] Figure 4 for Figure 1 A schematic cross-sectional view of a server of an electronic device.

[0013] Figure 5 for Figure 1 A three-dimensional schematic diagram of a heat sink for an electronic device.

[0014] Figure 6 for Figure 1 A three-dimensional schematic diagram of a heat sink for an electronic device with a heat-conducting substrate omitted.

[0015] Notes on the attached drawings:

[0016] 10: Electronic devices

[0017] 20: Immersion tank

[0018] 30: Server

[0019] 31: Shell

[0020] 311: Side Panel

[0021] 312: Fluid inlet

[0022] 313: Fluid outlet

[0023] 32: Tray

[0024] 321,321A: First yielding position

[0025] 33: Circuit Board

[0026] 331: Positive

[0027] 332: Back

[0028] 34: Main heat source

[0029] 35: Secondary heat source

[0030] 36: Secondary heat source

[0031] 37: Radiator

[0032] 371: Thermally conductive substrate

[0033] 3711: Second yielding position

[0034] 3712: Raised part

[0035] 372: Fins

[0036] 373: Heat pipe

[0037] 374: first heat conducting member

[0038] 375: Second heat conducting member

[0039] 38: Current limiting plate

[0040] 381: Flow limiting hole

[0041] 39: Flow guide DETAILED DESCRIPTION

[0042] See also Figures 1 to 4 . Figure 1 FIG. 4 is a schematic side view of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a server of an electronic device. Figure 3 for Figure 1 An exploded schematic diagram of a server of an electronic device. Figure 4 for Figure 1 A schematic cross-sectional view of a server of an electronic device.

[0043] The electronic device 10 of this embodiment is applied to a single-phase immersion liquid cooling system, for example, and includes an immersion tank 20 and a plurality of servers 30. The immersion tank 20 is used to accommodate a cooling fluid (not shown). The cooling fluid is, for example, water or a refrigerant. These servers 30 are arranged side by side, and each server 30 includes a housing 31, a tray 32, a circuit board 33, a plurality of primary heat sources 34, a plurality of secondary heat sources 35, a plurality of secondary heat sources 36 and a plurality of radiators 37. The housing 31 is erected in the immersion tank 20 and immersed in the cooling fluid. The housing 31 has a side panel 311. The tray 32 is disposed in the housing 31 and carries the circuit board 33. The circuit board 33 has a front side 331 and a back side 332 opposite to each other. The back side 332 faces the side panel 311.

[0044] These main heat sources 34 are, for example, CPU chips. These auxiliary heat sources 35 are, for example, electronic components such as VR and MOS chips. These main heat sources 34 and these auxiliary heat sources 35 are arranged on the back side 332. These secondary heat sources 36 are, for example, low-power electronic components such as DIMM and, for example, capacitors and inductors with higher heights, and are arranged on the front side 331. That is to say, these main heat sources 34 and these auxiliary heat sources 35 and these secondary heat sources 36 are respectively arranged on opposite sides of the circuit board 33, that is, these main heat sources 34, these auxiliary heat sources 35 and these secondary heat sources 36 are arranged in layers, and these main heat sources 34 and these auxiliary heat sources 35 are located on the bottom side (lower layer) of the circuit board 33. Among them, the heat generation of these secondary heat sources 36 is less than the heat generation of these main heat sources 34. These radiators 37 are arranged on the side panels 311, and are thermally coupled to these main heat sources 34 and these auxiliary heat sources 35, respectively.

[0045] Please also read Figure 5 and Figure 6 . Figure 5 for Figure 1 A three-dimensional schematic diagram of a heat sink for an electronic device. Figure 6 for Figure 1 A three-dimensional schematic diagram of a heat sink for an electronic device with a heat-conducting substrate omitted.

[0046] In detail, each heat sink 37 includes a heat-conducting substrate 371, a fin 372, a plurality of heat pipes 373, a plurality of first heat-conducting members 374, and a plurality of second heat-conducting members 375. The fin 372 and the heat pipes 373 are disposed on the heat-conducting substrate 371. The heat pipes 373 are, for example, layered on the heat-conducting substrate 371, but not limited thereto. The tray 32 has a plurality of first clearance openings 321, 321A, and the heat-conducting substrate 371 has a plurality of second clearance openings 3711. The second clearance openings 3711 correspond to the first clearance openings 321, respectively. The main heat sources 34 are disposed through the first clearance openings 321 and the second clearance openings 3711 and are thermally coupled to the heat pipes 373.

[0047] In this embodiment, the heat conductive substrate 371 has a plurality of protrusions 3712, and the auxiliary heat sources 35 are disposed through the first openings 321A and are thermally coupled to the protrusions 3712. Since the height of the auxiliary heat sources 35 is smaller than the height of the main heat sources 34, the radiator 37 can be thermally coupled to the auxiliary heat sources 35 more closely by providing the protrusions 3712.

[0048] The first heat conducting member 374 is, for example, a heat conducting interface material such as heat conducting glue, and is, for example, thermally coupled between the primary heat sources 34 and the heat pipes 373. The second heat conducting member 375 is, for example, a heat conducting pad, and is, for example, thermally coupled between the secondary heat sources 35 and the protrusions 3712.

[0049] The housing 31 has a fluid inlet 312 and a fluid outlet 313. The fluid inlet 312 is used for cooling fluid to flow into the housing 31 to dissipate heat from the primary heat sources 34 and the secondary heat sources 36, while the fluid outlet 313 is used for cooling fluid to flow out of the housing 31.

[0050] In this embodiment, since the primary heat sources 34 and the secondary heat sources 36 are respectively disposed on the back side 332 and the front side 331 of the circuit board 33, the primary heat sources 34 can be kept away from the secondary heat sources 36 to distinguish the heat dissipation areas exclusively for the primary heat sources 34. Therefore, the primary heat sources 34 can have more space to dissipate heat, so as to avoid the heat generated by the primary heat sources 34 and the secondary heat sources 36 being concentrated in one place and difficult to dissipate. In this way, the heat dissipation efficiency of the primary heat sources 34 in the server 30 can be improved.

[0051] In this embodiment, the server 30 may further include two flow limiting plates 38. The two flow limiting plates 38 are disposed between the fluid inlet 312 and the secondary heat sources 36. Specifically, one of the two flow limiting plates 38 is disposed on the housing 31 near the fluid inlet 312, and the other of the two flow limiting plates 38 is disposed on the front surface 331 of the circuit board 33. The material of the flow limiting plates 38 is, for example, metal.

[0052] Each flow limiting plate 38 has a plurality of flow limiting holes 381. The flow limiting holes 381 are used to limit the flow rate of the cooling fluid flowing through the secondary heat sources 36. In this way, part of the cooling fluid can be changed to flow through the primary heat sources 34. Since the heat removal capacity required by the primary heat sources 34 is higher than the heat removal capacity required by the secondary heat sources 36, the flow limiting plates 38 can be provided to allocate more flow of cooling fluid to flow through the primary heat sources 34, thereby improving the heat removal capacity of the primary heat sources 34.

[0053] In this embodiment, the server 30 may further include a plurality of guide members 39. These guide members 39 are, for example, stoppers, and are disposed on the front surface 331 of the circuit board 33. By providing these guide members 39, the flow path of the cooling fluid can be blocked and changed to guide the cooling fluid to flow toward the secondary heat sources 36. In this way, the heat dissipation of the secondary heat sources 36 can be more accurate.

[0054] In this embodiment, the server 30 includes a tray 32, and the tray 32 carries a circuit board 33, but the present invention is not limited thereto. In other embodiments, the server may not include a tray, and the circuit board is, for example, disposed on a side panel.

[0055] In this embodiment, the number of the main heat source 34, the auxiliary heat source 35, the secondary heat source 36, the first clearance port 321, 321A, the second clearance port 3711 and the radiator 37 is multiple, but not limited to this. In other embodiments, the number of the main heat source, the auxiliary heat source, the secondary heat source, the first clearance port, the second clearance port and the radiator can also be only one.

[0056] In this embodiment, the number of heat pipes 373 of each heat sink 37 is multiple, but not limited thereto. In other embodiments, the number of heat pipes 373 may be only one.

[0057] In this embodiment, each heat sink 37 includes a heat pipe 373, but the present invention is not limited thereto. In other embodiments, the heat pipe may also be replaced by a temperature-averaging plate.

[0058] In this embodiment, each heat sink 37 has a plurality of protrusions 3712, but the present invention is not limited thereto. In other embodiments, the number of protrusions may be only one, as long as the number of protrusions corresponds to the number of auxiliary heat sources.

[0059] In this embodiment, the number of the first heat conducting member 374 and the second heat conducting member 375 is plural, but not limited thereto. In other embodiments, the number of the first heat conducting member and the second heat conducting member may be only one.

[0060] In this embodiment, there are two flow limiting plates 38, and one of the two flow limiting plates 38 is disposed at the housing 31 near the fluid inlet 312, and the other of the two flow limiting plates 38 is disposed at the front surface 331 of the circuit board 33, but the present invention is not limited thereto. In other embodiments, there may be only one flow limiting plate, and the flow limiting plate may be disposed at the housing near the fluid inlet or at the front surface of the circuit board, or there may be more than three flow limiting plates.

[0061] According to the electronic device of the above embodiment, since the main heat sources and the secondary heat sources are respectively arranged on the back and the front of the circuit board, the main heat sources can be kept away from the secondary heat sources to distinguish the heat dissipation areas exclusively for the main heat sources. Therefore, the main heat sources can have more space to dissipate heat to avoid the heat generated by the main heat sources and the secondary heat sources being concentrated in one place and difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0062] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the scope of the patent application attached to this specification.

Claims

1. An electronic device, characterized in that: include: an immersion tank; as well as At least one server, including: A housing, vertically disposed in the immersion tank, and having a side plate; A circuit board is disposed on the side plate and has a front side and a back side opposite to each other, wherein the back side faces the side plate; at least one main heat source, disposed on the back side; at least one primary heat source, disposed on the front surface, and having a heat value lower than that of the at least one primary heat source; and At least one radiator is disposed on the side plate and thermally coupled to the at least one main heat source.

2. The electronic device according to claim 1, characterized in that: The at least one server further comprises a tray, which is arranged in the housing and carries the circuit board.

3. The electronic device according to claim 2, characterized in that: The tray has at least one first clearance hole, and the at least one main heat source is disposed through the at least one first clearance hole.

4. The electronic device according to claim 3, characterized in that: The at least one radiator comprises a heat-conducting substrate, a fin and at least one heat pipe, wherein the fin and the at least one heat pipe are arranged on the heat-conducting substrate, and the heat-conducting substrate has a second clearance opening, wherein the second clearance opening corresponds to the at least one first clearance hole, and the at least one main heat source is arranged through the second clearance opening and thermally coupled to the at least one heat pipe.

5. The electronic device according to claim 4, characterized in that: The at least one server further comprises at least one auxiliary heat source, the at least one auxiliary heat source is arranged on the back surface, and the heat conductive substrate has at least one protrusion, and the at least one auxiliary heat source is thermally coupled to the at least one protrusion.

6. The electronic device according to claim 5, characterized in that: The at least one heat sink further comprises at least one first heat conductor and at least one second heat conductor, wherein the at least one first heat conductor is thermally coupled between the at least one main heat source and the at least one heat pipe, and the at least one second heat conductor is thermally coupled between the at least one auxiliary heat source and the at least one protrusion.

7. The electronic device according to claim 1, characterized in that: The shell further has a fluid inlet and a fluid outlet. The fluid inlet is used for a cooling fluid to flow into the shell, and the fluid outlet is used for the cooling fluid to flow out of the shell.

8. The electronic device according to claim 7, characterized in that: The at least one server further comprises a flow limiting plate, which is arranged between the fluid inlet and the at least one primary heat source and has a plurality of flow limiting holes, and the flow limiting holes are used to limit the flow of the cooling fluid passing through the at least one primary heat source.

9. The electronic device according to claim 7, characterized in that: The immersion tank has a bottom, the fluid inlet is close to the bottom, and the fluid outlet is far from the bottom.

10. The electronic device according to claim 1, characterized in that: The at least one server further comprises at least one guide member, and the at least one guide member is arranged on the front side to guide a cooling fluid to flow toward the at least one primary heat source.

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