Substrate, power supply device, and electronic apparatus

Abstract

The invention provides a substrate, a power supply device and electronic equipment, and relates to the technical field of electronics. The substrate comprises a core plate, a cavity is formed in the core plate, the cavity penetrates through a first surface and a second surface, opposite to each other, of the core plate in the first direction, a metal layer is formed on the side wall of the cavity, the cavity is filled with a magnetic material to form a magnetic area, and at least two inductors which are mutually coupled are arranged in the magnetic area. The power loop area can be reduced, and high-density miniaturization is further achieved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a substrate, a power supply device and an electronic device. Background Art

[0002] Usually, a power supply device for supplying power to the chip of the electronic device is provided in the electronic device, and the device usually includes a switch chip and an inductor. The charge and discharge of the inductor is controlled by the switch chip, so that the voltage provided by the battery can be converted into the supply voltage of the chip.

[0003] In current power supply devices, inductance is realized through magnetic vias formed on the substrate, and power return is realized through metal vias. However, as the power of the chip increases, multiple metal vias need to be set for power return, and due to process limitations, the distance between metal vias is generally large, which leads to a larger power loop area, which is not conducive to future high-density miniaturized design. Summary of the invention

[0004] The embodiments of the present application provide a substrate, a power supply device and an electronic device for reducing the power loop area and further achieving high density and miniaturization.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] The present application provides a substrate, including: a core board, a cavity in the core board, the cavity penetrating through a first surface and a second surface opposite to the core board along a first direction, a metal layer formed on the side wall of the cavity, the cavity is filled with magnetic material to form a magnetic region, and the magnetic region includes at least two inductors coupled to each other.

[0007] Based on the substrate provided by the present application, it is possible to facilitate the connection of the power supply to the power management unit through the voltage input terminal, and to connect the power management unit to each inductor in the substrate respectively to control the opening and closing of the path of each inductor, so that the voltage output terminal Vout supplies power to the load chip after the voltage conversion through the corresponding inductor. Among them, since the metal layer formed by the side plate of the cavity can be used for grounding and connected to the ground terminal of the power management unit, the power supply return (or power return) of the load chip is realized through the metal layer, thereby saving the space occupied by the power return circuit, reducing the loop area of ​​the voltage conversion circuit, and facilitating high-density miniaturization design. In addition, since at least two mutually coupled inductors are provided, the equivalent inductance can be increased in steady state, the efficiency of voltage regulation can be improved, and the equivalent inductance can be reduced in dynamic state, which can improve the dynamic response capability of voltage regulation and reduce the output voltage drop.

[0008] In some possible implementations, the metal layer is used to be connected to a ground terminal of the load chip and a ground terminal of the power management unit respectively, as a power supply return path.

[0009] In this way, the metal layer can be used as a power supply return path, thereby reducing the power supply loop area, which is conducive to high-density miniaturized design.

[0010] In some possible implementations, the inductor includes at least two metal vias formed in the magnetic material. The metal vias penetrate the magnetic material along a first direction. The metal vias are connected in series with each other, and the first and last ends of the series connection are the input and output ends of the inductor respectively.

[0011] In this way, a plurality of metal vias can be connected in series to form an inductor with relatively large inductance, thereby facilitating meeting the large inductance requirement of the voltage conversion circuit.

[0012] In some possible implementations, the metal via includes a first metal via, a second metal via and a third metal via, an end of the first metal via close to the second surface of the core board is interconnected with an end of the second metal via close to the second surface of the core board, an end of the second metal via close to the first surface of the core board is interconnected with an end of the third metal via close to the first surface of the core board, an end of the first metal via close to the first surface of the core board and an end of the third metal via close to the second surface of the core board are respectively the input end and the output end of the inductor.

[0013] In this way, a large inductance inductor can be formed by connecting three metal vias in series to meet the large inductance requirement in the voltage conversion circuit.

[0014] In some possible implementations, the first metal via and the second metal via are connected via a first metal trace, and the second metal via and the third metal via are connected via a second metal trace, so that the first metal via, the second metal via, and the third metal via are stably and reliably connected in series.

[0015] In some possible implementations, the first metal trace is located on the surface of the magnetic material close to the second surface of the core plate, and the second metal trace is located on the surface of the magnetic material close to the first surface of the core plate. Thus, the magnetic material can be used to support the first metal trace and the second metal trace, thereby improving the reliability of the metal traces.

[0016] In some possible implementations, the inductor includes a metal via formed in the magnetic material, the metal via penetrates the magnetic material along a first direction, and two ends of the metal via are respectively an input end and an output end of the inductor.

[0017] In this way, a small inductor can be arranged in the magnetic region to meet the small inductance requirement of the voltage conversion circuit.

[0018] In some possible implementations, at least two inductors are anti-coupled in the magnetic region, so that different inductors can be driven in phase with the control signal to improve the steady-state inductance.

[0019] In some possible implementations, the magnetic region includes four inductors. Of course, a corresponding number of inductors may be provided according to actual power supply requirements.

[0020] In some possible implementations, the output ends of the inductors are connected to each other, so that the inductors can serve as voltage output ends to supply power to the load chip. Of course, the output ends of the inductors can also be used as independent voltage output ends.

[0021] In some possible implementations, multiple magnetic regions are included, and each magnetic region includes at least two mutually coupled inductors, so that voltage conversion can be performed as required through the inductors in the multiple magnetic regions to supply power to the load chip.

[0022] In some possible implementations, at least one dividing groove extending along the first direction is formed on the metal layer, and the dividing groove is used to divide the metal layer, thereby dividing the metal layer into multiple sections, making each power return path independent and reducing crosstalk between power paths.

[0023] The present application also provides a power supply device, including a power management unit, and any of the above substrates. The substrate includes a core board and an inductor, the core board has a cavity that runs through the core board along a first direction, the inductor is located in the cavity, and a metal layer is formed on the side wall of the cavity, the power management unit is located on one side of the core board and connected to the input end of the inductor and the metal layer, and the other side of the core board is used to connect the load chip through the output end of the inductor and the metal layer.

[0024] In some possible implementations, the cavity is filled with magnetic material to form a magnetic region; in the core board, power metal traces are arranged on both sides of the magnetic region along the second direction, and signal metal traces are arranged on both sides of the magnetic region along the third direction, wherein the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction, respectively. This can prevent the current in the power metal trace from causing crosstalk to the signal in the signal metal trace.

[0025] The above power supply device has the same technical effect as any of the above-mentioned substrates, which will not be described in detail here.

[0026] The present application also provides an electronic device, including a load chip, and any of the power supply devices described above, wherein the power supply device is connected to the load chip.

[0027] The above-mentioned electronic device has the same technical effect as any of the aforementioned substrates, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the structure of a vertical power supply system for a load chip provided in an embodiment of the present application;

[0031] Figure 3 A circuit diagram of a voltage conversion circuit provided in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of the structure of a power supply device provided in an embodiment of the present application;

[0033] Figure 5 One of the structural schematic diagrams of a magnetic region formed in a substrate provided in an embodiment of the present application;

[0034] Figure 6 The second structural schematic diagram of a magnetic region formed in a substrate provided in an embodiment of the present application;

[0035] Figure 7 This is a third schematic diagram of the structure within a magnetic region formed in a substrate provided in an embodiment of the present application.

[0036] Reference numerals:

[0037] 110-display module; 111-middle frame; 112-housing; 120-substrate; 121-load chip; 122-power management unit; 130-inductor; 131-first inductor; 132-second inductor; 133-third inductor; 134-fourth inductor; 135-fifth inductor; 136-sixth inductor; 137-seventh inductor; 138-eighth inductor; 210-core board; 211-wiring layer; 220-metal layer; 221-dividing groove; 230-magnetic material; 240-metal via; 241-first metal via; 242-second metal via; 243-third metal via; 250-metal routing. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In this document, "at least one (item)" refers to one or more, and "plurality" refers to two or more. The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects, rather than to describe a specific order of target objects.

[0040] "Connected", "connected" and similar words are used to express the intercommunication or interaction between different components, which may include direct connection or indirect connection through other components, which may be electrical connection or mechanical connection. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, including a series of steps or units. Methods, systems, products or devices are not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. "Up", "down", "left", "right" and the like are only used relative to the orientation of the components in the drawings. These directional terms are relative concepts. They are used for description and clarification relative to the description, which may change accordingly according to the change of the orientation of the components in the drawings.

[0041] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0042] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

[0043] The embodiment of the present application provides an electronic device, which includes terminal devices such as mobile phones, tablet computers, car computers, smart wearable products, and information and communications technology (ICT) devices such as servers, routers, switches, access network equipment (such as base stations). The embodiment of the present application does not impose any special restrictions on the specific form of the above-mentioned electronic devices. For the convenience of explanation, the following description is made by taking the electronic device as an example of a mobile phone. Figure 1 As shown, the electronic device includes a display module 110 , a middle frame 111 and a housing 112 .

[0044] The display module 110 is used to display images. In some embodiments of the present application, the display module 110 includes a liquid crystal display (LCD) module and a backlight unit (BLU). Alternatively, in other embodiments of the present application, the display module 110 may be an organic light emitting diode (OLED) display screen.

[0045] The middle frame 111 is located between the display module 110 and the housing 112, and the side of the middle frame 111 facing the display module 110 is used to carry the display module 110. In addition, the above-mentioned electronic device also includes a printed circuit board (PCB). The side surface of the middle frame 111 facing the housing 112 is used to carry electronic devices such as PCB, camera, and battery. Among them, the camera and battery are not shown in the figure. The housing 112 is connected to the middle frame 111 to form a accommodating cavity for accommodating the above-mentioned PCB, camera, battery and other electronic devices. Thereby, it is possible to prevent external water vapor and dust from invading the accommodating cavity and affecting the performance of the above-mentioned electronic devices.

[0046] In addition, the electronic device may also include Figure 2The substrate 120, the load chip 121 and the power management unit 122 are shown. The load chip 121 can be connected to the top of the PCB through multiple pins, such as micro pads or copper pillars. One side of the substrate 120 can be connected to the bottom of the PCB through multiple pins, and the other side of the substrate 120 is connected to the power management unit 122 through multiple pins. Therefore, the load chip 121 can realize signal transmission with the PCB, and the power management unit 122 can supply power to the load chip 121 through the substrate 120 and the PCB. In this way, the load chip 121 and the power management unit 122 and the substrate 120 for supplying power to the load chip 121 can be respectively located on both sides of the PCB, thereby separating the heat generated by the power management unit 122 and the substrate 120 from the heat generated by the load chip 121, thereby improving the heat dissipation effect.

[0047] It should be noted that the above description is based on the example of flip-mounting the load chip 121 on the top of the PCB. In other embodiments of the present application, the load chip 121 can also be connected to the PCB through a wire bonding process.

[0048] In some embodiments of the present application, the load chip 121 may be a system on chip (SoC), a central processing unit (CPU), a graphics processing unit (GPU), or a neural network processing unit (NPU), etc.

[0049] In order to supply power to the load chip 121, the electronic device may further include: Figure 3 The voltage conversion circuit shown. The voltage conversion circuit may include at least two inductors (in the figure, four inductors, namely, inductor L1, inductor L2, inductor L3 and inductor L4, are used as examples), switches for controlling each inductor path (in the figure, switches S1-S8 are used as examples), and a capacitor Co. The inductor has the functions of energy storage and filtering. Among them, the switch for controlling each inductor path may be a switch tube, and each switch tube may be integrated into the above-mentioned power management unit 122.

[0050] The power supply can be connected in parallel with the input end of each inductor through the voltage input terminal Vin, and the output end of each inductor can be connected to the voltage output terminal Vout. The input end of each inductor and the voltage input terminal Vin can be controlled by a corresponding switch, so that the voltage provided by the power supply is converted into a voltage through the corresponding inductor, such as a voltage reduction process, so as to be output from the voltage output terminal Vout and provide a stable power supply voltage to the load chip 121 through the capacitor.

[0051] In this case, the voltage conversion circuit can be integrated into the substrate 120 , and the switches for controlling the inductor paths can be integrated into a power management unit 122 , thereby forming a power supply device to supply power to the load chip 121 .

[0052] The structure of the substrate 120 in the power supply device will be described in detail below by way of example.

[0053] In some embodiments of the present application, Figure 4 As shown, the substrate 120 may include a core plate 210, in which a cavity is provided, and a metal layer 220 is formed on the side wall of the cavity. A magnetic material 230 is filled in the cavity to form a magnetic region. The magnetic region includes at least two inductors 130 coupled to each other. The cavity passes through the first surface (such as the upper surface of the core plate 210 in the figure) and the second surface (such as the lower surface of the core plate 210 in the figure) of the core plate 210 along a first direction (such as the vertical direction in the figure).

[0054] The output end of each inductor 130 can be used as a voltage output end Vout, and the input end of the power management unit 122 disposed on one side of the substrate 120 can be used as a voltage input end Vin, and the output end can be respectively connected to the input end of each inductor 130. The metal layer 220 formed on the cavity side plate can be used for grounding (i.e., connected to the ground end GND disposed on the core board 210 through a lead), and connected to the ground end of the power management unit 122.

[0055] For example, the core board 210 may be made of resin material, and of course other insulating materials may also be used without limitation.

[0056] In this way, it is convenient for the power supply to be connected to the power management unit 122 through the voltage input terminal Vin, and to be connected to each inductor 130 in the substrate 120 through the power management unit 122, so as to control the opening and closing of the path of each inductor 130, so that the voltage output terminal Vout can supply power to the load chip 121 after the voltage conversion through the corresponding inductor 130. Among them, since the metal layer 220 is formed on the side wall of the cavity, it can be used for grounding and connected to the ground terminal of the power management unit 122, so that the power supply return (or power return) of the load chip 121 is realized through the metal layer 220, thereby saving the space occupied by the power return circuit, reducing the loop area of ​​the voltage conversion circuit, and facilitating high-density miniaturization design. In addition, since at least two mutually coupled inductors 130 are provided, the equivalent inductance can be increased in steady state, the efficiency of voltage regulation can be improved, and the equivalent inductance can be reduced in dynamic state, the dynamic response capability of voltage regulation can be improved, and the output voltage drop can be reduced. In addition, the metal layer can also play a good shielding effect in the magnetic region, thereby reducing the internal interference of the substrate.

[0057] For example, Figure 4 As shown, the input end of the power management unit 122 can be used as the voltage input terminal Vin, and connected to the voltage input terminal Vin set at the other end of the core board 210 through a lead passing through the core board 210, so as to facilitate the connection of the power supply to the power management unit 122 through the voltage input terminal Vin set on the core board 210.

[0058] Optionally, wiring layers 211 may be respectively provided on both sides of the core board 210 for providing corresponding voltage input terminal Vin, voltage output terminal Vout, ground terminal GND and leads corresponding to each terminal.

[0059] As an example, in the embodiment of the present application, continue as follows Figure 4 As shown, the inductor 130 in the magnetic region of the core board 210 can be at least two metal vias 240 formed in the magnetic material 230. The metal vias 240 can penetrate the magnetic material 230 along the first direction. In addition, the metal vias 240 are connected in series with each other, so that the first and last ends of the series connection serve as the input end and the output end of the inductor 130 respectively.

[0060] The number of metal vias 240 used to form an inductor 130 can be set according to the required inductance. When a larger inductance is required, a larger number of metal vias 240 are set, and when a smaller inductance is required, a smaller number of metal vias 240 are set.

[0061] For example, Figure 4 As shown, an inductor 130 may include a first metal via 241, a second metal via 242, and a third metal via 243. An end of the first metal via 241 close to the second surface of the core board 210 (i.e., the lower end of the first metal via 241 in the figure) and an end of the second metal via 242 close to the second surface of the core board 210 (i.e., the lower end of the second metal via 242 in the figure) are connected to each other. An end of the second metal via 242 close to the first surface of the core board 210 (i.e., the upper end of the second metal via 242 in the figure) and an end of the third metal via 243 close to the first surface of the core board 210 (i.e., the upper end of the third metal via 243 in the figure) are connected to each other. Thus, the upper end of the first metal via 241 is the input end of the inductor 130, and the lower end of the third metal via 243 is the output end of the inductor 130.

[0062] In this way, a high-inductance inductor can be formed by connecting three metal vias 240 in series to meet the high-inductance requirement in the voltage conversion circuit.

[0063] For example, Figure 4As shown, the lower end of the first metal via 241 and the lower end of the second metal via 242 can be connected through a first metal wire, and the upper end of the second metal via 242 and the upper end of the third metal via 243 can be connected through a second metal wire. This facilitates the first metal via 241, the second metal via 242, and the third metal via 243 to be stably and reliably connected in series.

[0064] Optionally, the first metal trace can be arranged on a side surface of the magnetic material 230 close to the second surface of the core plate 210 (i.e., the lower surface of the magnetic material 230 in the figure). The second metal trace can be arranged on a side surface of the magnetic material 230 close to the first surface of the core plate 210 (i.e., the upper surface of the magnetic material 230 in the figure). Thus, the magnetic material 230 can be used to support the first metal trace and the second metal trace, thereby improving the reliability of the metal traces.

[0065] Optionally, among the inductors 130 disposed in the magnetic region, at least two inductors 130 may be disposed to form an anti-coupling, so that different inductors 130 may be driven in phase with the control signal to achieve an improvement in steady-state inductance. The anti-coupling relationship between the two inductors 130 may be based on the end connected to the power management unit 122 (such as a switch tube) as the same-name end as a reference.

[0066] For example, the magnetic region includes four inductors, namely, the first inductor 131, the second inductor 132, the third inductor 133 and the fourth inductor 134, and each inductor is composed of three metal vias 240. Figure 5 As shown, the magnetic region surrounded by the metal layer 220 includes a magnetic material 230 , metal vias 240 constituting each inductor, and a metal trace 250 connecting the metal vias 240 in an inductor.

[0067] Among them, anti-coupling is formed between the inductors. The first inductor 131 is driven by a driving signal with a phase of 0°, the second inductor 132 is driven by a signal with a phase of 180°, the third inductor 133 is driven by a signal with a phase of 90°, and the fourth inductor 134 is driven by a signal with a phase of 270°. In this way, the steady-state inductance can be improved, which is beneficial to the improvement of efficiency, while the dynamic inductance is reduced, and the dynamic response capability is improved.

[0068] Optionally, the metal layer 220 formed on the sidewall of the cavity may also be formed with at least one dividing groove 221 extending along the first direction, so as to divide the metal layer 220 into multiple sections, so that each power return path is independent and the crosstalk between power paths is reduced.

[0069] For example, combined with Figure 5As shown, the magnetic region includes four inductors, namely, the first inductor 131, the second inductor 132, the third inductor 133 and the fourth inductor 134, and each inductor is composed of three metal vias 240. Figure 6 As shown, four dividing grooves 221 extending along the first direction are formed on the metal layer 220 .

[0070] As another example, in the embodiment of the present application, Figure 4 As shown, the inductor 130 in the magnetic region of the core board 210 can also be a metal via 240 formed in the magnetic material 230. The metal via 240 can penetrate the magnetic material 230 along the first direction. In addition, the two ends of the metal via 240 serve as the input end and the output end of the inductor 130, respectively. In this way, a small inductance inductor can be set in the magnetic region to meet the small inductance requirement of the voltage conversion circuit.

[0071] Optionally, among the inductors 130 disposed in the magnetic region, at least two inductors 130 may be disposed to form anti-coupling, so that different inductors 130 may be driven in staggered phases in coordination with the control signal, thereby achieving an improvement in steady-state inductance.

[0072] For example, the magnetic region includes four inductors, and each inductor is formed by a metal via 240. Figure 7 As shown, the magnetic region surrounded by the metal layer 220 includes the magnetic material 230 , the fifth inductor 135 , the sixth inductor 136 , the seventh inductor 137 and the eighth inductor 138 .

[0073] The fifth inductor 135 is driven by a driving signal with a phase of 0°, the sixth inductor 136 is driven by a signal with a phase of 90°, the seventh inductor 137 is driven by a signal with a phase of 180°, and the eighth inductor 138 is driven by a signal with a phase of 270°. Thus, the steady-state inductance can be improved, which is beneficial to improving efficiency, while the dynamic inductance is reduced, improving the dynamic response capability.

[0074] Optionally, the metal layer 220 formed on the side wall of the cavity may also be formed with at least one dividing groove 221 extending along the first direction ( Figure 7 ), thereby dividing the metal layer 220 into multiple sections, so that each power return path is independent and the crosstalk between the power paths is reduced.

[0075] Alternatively, if Figure 4 As shown, one magnetic region may include four inductors 130. Of course, a corresponding number of inductors 130 may be arranged in the magnetic region according to actual needs.

[0076] In the embodiment of the present application, multiple magnetic regions may be formed in the core board 210, and each magnetic region may include at least two mutually coupled inductors 130. Thus, voltage conversion is performed as required through the inductors 130 in the multiple magnetic regions to supply power to the load chip 121.

[0077] For example, Figure 4 As shown, the core board 210 includes two magnetic regions, namely, a magnetic region A and a magnetic region B. The magnetic region A includes an inductor 130 formed by three metal vias 240 , and the magnetic region B includes an inductor 130 formed by one metal via 240 .

[0078] For example, in practical applications, the output ends of the inductors 130 in the magnetic region can be connected to each other according to actual needs to serve as the voltage output terminal Vout to output voltage. Alternatively, the output ends of the inductors 130 in the magnetic region can be independently used as the voltage output terminal Vout to output voltage.

[0079] For example, Figure 4 As shown, the output ends of the four inductors 130 in the magnetic region A are connected to each other to serve as a voltage output terminal Vout to output voltage. The output ends of the four inductors 130 in the magnetic region B are independently used as voltage output terminals Vout to output voltage.

[0080] In an embodiment of the present application, a power supply device is further provided, which may include a power management unit 122 and the above-mentioned substrate 120. The power management unit 122 may be integrated with Figure 3 The switch (switch tube) in the voltage conversion circuit shown. The power management unit 122 can be set on one side of the core board 210 in the substrate 120, and connected to the input end of the inductor 130 integrated with the core board 210, the voltage input terminal Vin on the core board 210, and the metal layer 220. The other side of the core board 210 is used to connect the load chip 121 through the set voltage output terminal Vout (i.e., the output end of the inductor 130) and the ground terminal connected to the metal layer 220 to form a load loop and supply power to the load chip 121. Among them, the voltage output terminal and the ground terminal of the power supply device can be directly connected to the load chip 121, or indirectly connected to the load chip 121 through the PCB. In actual work, the voltage provided by the power supply can enter the voltage input terminal Vin of the power supply device through the PCB, so that the power management unit 122 can control the path of the corresponding inductor 130 to make the inductor 130 convert the voltage, so that the converted voltage output from the voltage output terminal Vout is stably supplied to the load chip 121 through the PCB.

[0081] In some possible implementations, a signal metal trace for transmitting a signal may be further provided in the core board 210 of the substrate 120, and the power management unit 122 may be connected to the signal metal trace. Thus, the load chip 121 may be connected to the signal metal trace through the PCB, so as to transmit a voltage control signal to the power management unit 122 to control the opening and closing of each inductor 130 path.

[0082] For example, the lead of the voltage input terminal Vin provided in the core board 210 can be used as a power metal trace, and can be provided on both sides of the magnetic region in the core board 210 along the second direction, while the above-mentioned signal metal trace can be provided on both sides of the magnetic region in the core board 210 along the third direction. The second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction, respectively. Thus, the current in the lead of the voltage input terminal Vin (i.e., the power metal trace) can be prevented from interfering with the signal in the signal metal trace, thereby improving the stability of the voltage conversion power supply to the load chip 121.

[0083] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A substrate, It is characterized in that include: A core board, wherein the core board has a cavity, wherein the cavity penetrates through a first surface and a second surface opposite to the core board along a first direction, a metal layer is formed on a side wall of the cavity, and a magnetic material is filled in the cavity to form a magnetic region, wherein the magnetic region includes at least two inductors coupled to each other.

2. The substrate according to claim 1, It is characterized in that The metal layer is used to be connected to the ground terminal of the load chip and the ground terminal of the power management unit respectively, serving as a power supply return path.

3. The substrate according to claim 1 or 2, It is characterized in that The inductor includes at least two metal vias formed in the magnetic material, the metal vias penetrate the magnetic material along the first direction, the metal vias are connected in series with each other, and the first and last ends of the series connection are the input end and the output end of the inductor respectively.

4. The substrate according to claim 3, It is characterized in that The metal vias include a first metal via, a second metal via and a third metal via, wherein one end of the first metal via close to the second surface of the core board is connected to one end of the second metal via close to the second surface of the core board, one end of the second metal via close to the first surface of the core board is connected to one end of the third metal via close to the first surface of the core board, and one end of the first metal via close to the first surface of the core board and one end of the third metal via close to the second surface of the core board are respectively the input end and the output end of the inductor.

5. The substrate according to claim 4, It is characterized in that The first metal via and the second metal via are connected through a first metal wiring, and the second metal via and the third metal via are connected through a second metal wiring.

6. The substrate according to claim 5, It is characterized in that The first metal trace is located on a surface of the magnetic material close to the second surface of the core board, and the second metal trace is located on a surface of the magnetic material close to the first surface of the core board.

7. The substrate according to claim 1 or 2, It is characterized in that The inductor includes a metal via formed in the magnetic material, the metal via penetrates the magnetic material along the first direction, and two ends of the metal via are respectively an input end and an output end of the inductor.

8. The substrate according to any one of claims 1 to 7, It is characterized in that There are at least two inductors in the magnetic region that form anti-coupling.

9. The substrate according to any one of claims 1 to 8, It is characterized in that The magnetic region includes four inductors.

10. The substrate according to any one of claims 1 to 9, It is characterized in that The output ends of the inductors are connected to each other.

11. The substrate according to any one of claims 1 to 10, It is characterized in that It comprises a plurality of magnetic regions, each of which comprises at least two inductors coupled to each other.

12. The substrate according to any one of claims 1 to 11, It is characterized in that At least one dividing groove extending along the first direction is formed on the metal layer, and the dividing groove is used to divide the metal layer.

13. A power supply device, It is characterized in that It includes a power management unit, and a substrate as described in any one of claims 1 to 12, wherein the substrate includes a core board and an inductor, the core board has a cavity that passes through the core board along a first direction, the inductor is located in the cavity, and a metal layer is formed on the side wall of the cavity, the power management unit is located on one side of the core board and connected to the input end of the inductor and the metal layer, and the other side of the core board is used to connect a load chip through the output end of the inductor and the metal layer.

14. The power supply device according to claim 13, It is characterized in that The cavity is filled with magnetic material to form a magnetic region; in the core board, power metal routing is arranged on both sides of the magnetic region along the second direction, and signal metal routing is arranged on both sides of the magnetic region along the third direction, wherein the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction respectively.

15. An electronic device, It is characterized in that It comprises a load chip and a power supply device as claimed in claim 13 or 14, wherein the power supply device is connected to the load chip.

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