Image acquisition module, three-dimensional imaging device and method

Abstract

The invention discloses an image acquisition module and a three-dimensional imaging device and method. The module comprises a first camera assembly, a second camera assembly, an infrared projector and a control circuit board connected with the first camera assembly, the second camera assembly and the infrared projector. Internal and external parameters of the first camera assembly and internal and external parameters of the second camera assembly are calibrated based on preset parameters, and the first camera assembly and the second camera assembly are arranged on the two sides of the infrared projector respectively; the first camera assembly is used for acquiring an infrared image of a to-be-imaged object; the second camera assembly is used for acquiring a visible light image of the to-be-imaged object; the infrared projector is used for projecting a preset light spot to an object to be imaged; the control circuit board is used for controlling the projection time sequence of the infrared projector and controlling the first camera assembly and the second camera assembly to acquire images at the same time. The cost is reduced by reducing the use number of cameras, and the positions of the two camera assemblies are fixed in advance, so that the three-dimensional imaging error or failure caused by the position offset of the cameras is reduced.

Description

Technical Field

[0001] The present invention relates to the field of three-dimensional imaging technology, and in particular to an image acquisition module, a three-dimensional imaging device and a method. Background Art

[0002] Binocular vision technology is based on the principle of parallax and obtains the three-dimensional geometric information of an object through multiple images. In the prior art, two cameras are usually used to simultaneously shoot the target object from different angles, or a single camera is used to shoot two images from different positions at different times. By matching and calculating the parallax of the two images, the three-dimensional outline and position of the target object can be restored, three-dimensional reconstruction can be achieved, and then a three-dimensional image of the target object can be obtained.

[0003] In actual applications, in order to achieve more complete depth information acquisition in business, some products will use infrared projectors to project light spot textures on the surface of the target object, and use binocular infrared cameras to capture these textures to reconstruct the 3D contour of the target object. Then, the image collected by the visible light camera is used as texture and mapped to the reconstructed 3D point cloud. This solution often requires "2 depth cameras + infrared projectors + visible light cameras" to form a complete 3D imaging module.

[0004] However, in this method, the visible light camera and the depth camera are in different positions. If any camera has a slight offset, it may cause errors or failure in three-dimensional imaging. At the same time, the module design of multiple cameras plus projectors has a relatively complex hardware structure, which will lead to high manufacturing and maintenance costs, and is not conducive to large-scale commercial promotion. Summary of the invention

[0005] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide an image acquisition module, a three-dimensional imaging device and a method, which can reduce the number of cameras used and only require two camera components to form a complete image acquisition module. At the same time, the positions of the two camera components are pre-fixed to reduce three-dimensional imaging errors or failures caused by camera position offsets, and can also reduce manufacturing and maintenance costs for large-scale commercial promotion.

[0006] In order to solve the above problems, the present invention is implemented according to the following scheme:

[0007] The present invention provides an image acquisition module, comprising: a first camera assembly, a second camera assembly, an infrared projector, and a control circuit board connected to the first camera assembly, the second camera assembly, and the infrared projector; internal and external parameters of the first camera assembly and the second camera assembly are calibrated based on preset parameters;

[0008] The first camera assembly is used to obtain an infrared image of the object to be imaged;

[0009] The second camera assembly is used to obtain a visible light image of the object to be imaged;

[0010] The infrared spot projector is used to project a preset light spot onto the object to be imaged;

[0011] The control circuit board is used to control the projection timing of the infrared projector and control the first camera component and the second camera component to acquire images simultaneously.

[0012] Compared with the prior art, the beneficial effects of an image acquisition module of the present invention are as follows: by reducing the number of cameras used, only two camera components are needed to form a complete image acquisition module. At the same time, the internal and external parameters of the two camera components are calibrated based on preset parameters, and the positions of the two camera components can be pre-fixed, thereby reducing three-dimensional imaging errors or failures caused by camera position offsets, and reducing manufacturing and maintenance costs, so as to promote large-scale commercialization.

[0013] Optionally, the first camera assembly includes a first camera and infrared-transmitting glass covering the front end of the first camera, and the first camera is connected to the control circuit board.

[0014] Optionally, the second camera assembly includes a second camera and a perspective sheet covering the front end of the second camera, and the second camera is connected to the control circuit board.

[0015] Optionally, both the first camera and the second camera are visible light cameras.

[0016] A three-dimensional imaging device is also provided, comprising the above-mentioned image acquisition module and an image processing device connected to the image acquisition module;

[0017] The image processing device is used to receive a three-dimensional imaging instruction and generate a control instruction according to the three-dimensional imaging instruction; the image acquisition module acquires an infrared image and a visible light image of the object to be imaged according to the control instruction;

[0018] The image processing device processes the infrared image and the visible light image to obtain a three-dimensional image of the object to be imaged.

[0019] Optionally, the image processing device includes a processor and a memory, the memory stores at least one instruction, at least one program, code set or instruction set, and the at least one instruction, at least one program, code set or instruction set is loaded and executed by the processor.

[0020] A three-dimensional imaging method is also provided, which is applied to the three-dimensional imaging device, comprising:

[0021] The image processing device generates a control instruction according to the three-dimensional imaging instruction and sends it to the control circuit board;

[0022] The control circuit board controls the infrared projector to project a preset light spot onto the object to be imaged according to the control instruction, and then controls the first camera component to acquire an infrared image of the object to be imaged and the second camera component to acquire a visible light image of the object to be imaged after a preset time interval.

[0023] The image processing device corrects the infrared image and the visible light image;

[0024] Determine a pixel disparity set based on the corrected infrared image and the visible light image;

[0025] Obtaining a depth image according to the pixel disparity set, the internal and external parameters of the first camera assembly, the internal and external parameters of the second camera assembly, and the corrected infrared image;

[0026] A three-dimensional image of the object to be imaged is obtained according to the depth image and the internal and external parameters of the second camera assembly.

[0027] Optionally, the infrared image and the visible light image respectively include multiple rows of pixels with the same number of rows, and each row of pixels includes the same number of pixel points; each row of pixels of the corrected infrared image is aligned with each row of pixels of the corrected visible light image; and the pixel disparity set includes the pixel disparity of the corrected infrared image and the corrected visible light image at each pixel point;

[0028] Based on the corrected infrared image and visible light image, a pixel disparity set is determined, including:

[0029] The corrected infrared image is used as the reference image, and the corrected visible light image is used as the matching image;

[0030] For each target pixel in the reference image, matching is performed with the to-be-matched pixel in the same row as the target pixel in the matching image;

[0031] Calculating the similarity between the target pixel and the pixel to be matched, and determining the pixel to be matched with the maximum similarity as the best matching point;

[0032] Taking the horizontal coordinate difference between the target pixel point and the best matching point as the pixel disparity of the target pixel point;

[0033] All pixel points of the reference image are traversed to determine the pixel disparity at each pixel point.

[0034] Optionally, obtaining a depth image according to the pixel parallax set, the internal and external parameters of the first camera assembly, the internal and external parameters of the second camera assembly, and the corrected infrared image includes:

[0035] Determine a baseline distance between the first camera assembly and the second camera assembly, and a focal length parameter of the first camera assembly according to the internal and external parameters of the first camera assembly and the internal and external parameters of the second camera assembly;

[0036] Determine a depth value of each pixel according to the baseline distance, the focal length parameter and the pixel disparity set;

[0037] The depth image is obtained according to the depth value of each pixel and the corrected infrared image.

[0038] Optionally, obtaining a three-dimensional image of the object to be imaged according to the depth image and the internal and external parameters of the second camera assembly includes:

[0039] Determine the two-dimensional coordinates of each pixel in the depth image;

[0040] Converting the two-dimensional coordinates of each pixel in the depth image into a three-dimensional point cloud according to the internal and external parameters of the second camera assembly and the depth value of each pixel in the depth image;

[0041] The three-dimensional point cloud is subjected to surface reconstruction to obtain a three-dimensional image of the object to be imaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A cross-sectional view of the image acquisition module of the present invention;

[0043] Figure 2 is a schematic diagram of a control circuit of the present invention;

[0044] Figure 3 is a schematic diagram of a camera control circuit of the present invention;

[0045] Figure 4 It is a schematic diagram of the control circuit of the projector of the present invention;

[0046] Figure 5 It is a schematic diagram of the communication circuit of the present invention.

[0047] Explanation of the reference numerals: 1. first camera assembly; 101. first camera; 102. infrared transmitting glass; 2. second camera assembly; 201. second camera; 202. perspective sheet; 3. infrared projector; 4. control circuit board; 401. control circuit; 402. camera control circuit; 403. projector control circuit; 404. communication circuit; 5. image processing device. DETAILED DESCRIPTION

[0048] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0049] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] See also Figure 1 As shown, the present invention provides an image acquisition module, including: a first camera assembly 1, a second camera assembly 2, an infrared projector 3, and a control circuit board 4 connected to the first camera assembly 1, the second camera assembly 2, and the infrared projector 3; the internal and external parameters of the first camera assembly 1 and the internal and external parameters of the second camera assembly 2 are calibrated based on preset parameters; the first camera assembly 1 includes a first camera 101 and an infrared transmission glass 102 covering the front end of the first camera 101, and the first camera 101 is connected to the control circuit board 4. The second camera assembly 2 includes a second camera 201 and a perspective sheet 202 covering the front end of the second camera 201, and the second camera 201 is connected to the control circuit board 4. The first camera 101 and the second camera 201 are both visible light cameras; the first camera assembly 1 and the second camera assembly 2 are respectively arranged on both sides of the infrared projector 3, so that the infrared light projected by the infrared projector 3 is within the shooting range of the first camera assembly 1 and the second camera assembly 2; the first camera assembly 1 is horizontally arranged relative to the infrared projector 3, and the second camera assembly 2 is tilted relative to the infrared projector 3, so that the shooting angle of the first camera assembly 1 is different from the shooting angle of the second camera assembly 2, so as to achieve the image of the object to be imaged at different angles at the same time.

[0051] Among them, the first camera component 1 is used to obtain an infrared image of the object to be imaged, specifically, the infrared transmission glass 102 filters visible light and allows infrared light to pass through, so that the first camera 101 can take an infrared image of the object to be imaged; the second camera component 2 is used to obtain a visible light image of the object to be imaged, specifically, the perspective film 202 allows visible light to pass through, so that the second camera 201 can take a visible light image of the object to be imaged; the infrared projector 3 is used to project a preset light spot onto the object to be imaged; the control circuit board 4 is used to control the projection timing of the infrared projector 3, and control the first camera component 1 and the second camera component 2 to obtain images at the same time, specifically, control the first camera 101 and the second camera 201 to obtain images.

[0052] The present invention does not require three cameras (two depth cameras and one visible light camera) as generally required in the prior art, but only requires two visible light cameras to achieve the same technical effect as the prior art. Through the infrared projector 3 and the infrared transmission glass 102, the first camera 101 (visible light camera) can also obtain an infrared image, and through the perspective film 202, the second camera 201 (visible light camera) can also obtain a visible light image including the surface texture of the object to be imaged, so as to determine the depth value of each pixel point according to the infrared image and the visible light image, and then obtain the depth image of the object to be imaged, that is, the three-dimensional image of the object to be imaged.

[0053] At the same time, the present invention calibrates the internal and external parameters of the first camera component 1 and the internal and external parameters of the second camera component 2 according to preset parameters, and realizes the setting of the relative position and posture (external parameters) between the first camera component 1 and the second camera component 2, the shooting parameters (internal parameters) of the first camera component 1, and the shooting parameters (internal parameters) of the second camera component 2, so that the shooting angle of the first camera component 1 and the shooting angle of the second camera component 2 are different. When realizing the shooting of the image to be imaged at different angles at the same time, the three-dimensional imaging error or failure caused by the relative movement between the depth camera and the visible light camera in the prior art can be avoided.

[0054] The present invention also provides a three-dimensional imaging device, including the above-mentioned image acquisition module and an image processing device 5 connected to the image acquisition module; the image processing device 5 is used to receive three-dimensional imaging instructions and generate control instructions according to the three-dimensional imaging instructions; the image acquisition module acquires the infrared image and visible light image of the object to be imaged according to the control instructions; the image processing device 5 processes the infrared image and the visible light image to obtain a three-dimensional image of the object to be imaged.

[0055] The image processing device 5 includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, code set or instruction set, and the at least one instruction, at least one program, code set or instruction set is loaded and executed by the processor to obtain a three-dimensional image of the object to be imaged.

[0056] The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0057] The memory can be used to store the computer program or module, and the processor can realize various functions of acquiring a three-dimensional image of the object to be imaged by running or executing the computer program or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc.; the data storage area can store data created according to the use of the mobile phone, etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0058] See also Figure 2-5 As shown, the control circuit board 4 includes a control circuit 401, a camera control circuit 402, a projector control circuit 403 and a communication circuit 404. The control circuit 401 is connected to the camera control circuit 402, the projector control circuit 403 and the communication circuit 404. The camera control circuit 402 is connected to the first camera 101 and the second camera 201. The projector control circuit 403 is connected to the infrared projector 3. The communication circuit 404 is connected to the image processing device 5.

[0059] After receiving the three-dimensional imaging instruction, the image processing device 5 sends it to the control circuit 401 through the communication circuit 404. The control circuit 401 generates a first camera 101 control signal HK_TRG1 and a second camera 201 control signal HK_TRG2 sent to the camera control circuit 402 according to the three-dimensional imaging instruction, and generates a projector control signal IC_CS and DIM sent to the projector control circuit 403.

[0060] The camera control circuit 402 generates a signal HK_TRG1_OUT for controlling the working sequence of the first camera 101 and a signal HK_TRG2_OUT for controlling the second camera 201 according to the control signal HK_TRG1 of the first camera 101 and the control signal HK_TRG2 of the second camera 201 respectively; the projector control circuit 403 generates signals LD0+, LD1+, and LD2+ for controlling the working sequence of the infrared projector 3 according to the projector control signals IC_CS and DIM; wherein the signal HK_TRG1_OUT for controlling the working sequence of the first camera 101 T and the signal HK_TRG2_OUT for controlling the second camera 201, including the command information of the signals LD0+, LD1+, and LD2+ delayed from the working timing of the infrared projector 3, so as to ensure that the first camera 101 and the second camera 201 acquire the infrared image and the visible light image of the object to be imaged only after the infrared projector 3 projects the infrared light spot to the object to be imaged, so as to avoid the first camera 101 and the second camera 201 acquiring the image of the object to be imaged before the infrared light spot emitted by the infrared projector 3 is projected to the object to be imaged, resulting in the failure to successfully acquire the infrared image and the visible light image of the object to be imaged.

[0061] The present invention also provides a three-dimensional imaging method, which is applied to the above-mentioned three-dimensional imaging device, comprising:

[0062] First, the image processing device 5 generates a control instruction sent to the control circuit board 4 according to the three-dimensional imaging instruction; the control circuit board 4 controls the infrared projector 3 to project a preset light spot to the object to be imaged according to the control instruction, and after a preset time interval is reached, controls the first camera component 1 to obtain an infrared image of the object to be imaged, and the second camera component 2 to obtain a visible light image of the object to be imaged, that is, controls the working time of the first camera 101 and the second camera 201 to be delayed than the working time of the infrared projector 3, so as to ensure that the infrared image and the visible light image of the object to be imaged are obtained by the first camera 101 and the second camera 201 after the infrared projector 3 projects the infrared light spot to the object to be imaged, so as to avoid the first camera 101 and the second camera 201 obtaining the image of the object to be imaged before the infrared light spot emitted by the infrared projector 3 is projected to the object to be imaged, resulting in failure to successfully obtain the infrared image and the visible light image of the object to be imaged.

[0063] Next, the image processing device 5 corrects the infrared image and the visible light image; wherein the infrared image and the visible light image respectively include a plurality of rows of pixels having the same number of rows, and each row of pixels includes the same number of pixel points; each row of pixels of the corrected infrared image is aligned with each row of pixels of the corrected visible light image; after correcting the infrared image and the visible light image, a pixel disparity set is determined based on the corrected infrared image and the visible light image, and the pixel disparity set includes the pixel disparity of the corrected infrared image and the corrected visible light image at each pixel point;

[0064] In one embodiment of the present invention, determining a pixel disparity set based on the corrected infrared image and the visible light image includes:

[0065] First, the corrected infrared image is used as the reference image, and the corrected visible light image is used as the matching image; for each target pixel in the reference image, the pixel to be matched in the same row as the target pixel in the matching image is matched; then the similarity between the target pixel and the pixel to be matched is calculated, and the pixel to be matched with the maximum similarity is determined as the best matching point; the difference in the lateral coordinates between the target pixel and the best matching point is used as the pixel disparity of the target pixel; finally, all the pixels of the reference image are traversed to determine the pixel disparity at each pixel.

[0066] Assume that both the infrared image (reference image) and the visible light image (matching image) include i rows of pixels, each row of pixels includes j pixels. For the i-th row and j-th pixel point P in the infrared image (reference image), 基(i,j) , taking each pixel as a target pixel, selecting j pixels in the ith row in the visible light image (matching image) as pixels to be matched, and calculating the similarity between the target pixel and the pixel to be matched, taking the pixel to be matched with the largest similarity value to the target pixel as the best matching point, repeating the above operation for the remaining pixels of the infrared image (reference image), determining the best matching point corresponding to each pixel, and determining the pixel disparity of each pixel according to the pixel and its corresponding best matching point, wherein the best matching point corresponding to each pixel is different.

[0067] After obtaining the pixel disparity set to determine the pixel disparity between each pixel of the infrared image (reference image) and the visible light image (matching image), the depth value of each pixel in the infrared image can be determined according to the pixel disparity. Therefore, according to the pixel disparity set, the internal and external parameters of the first camera assembly 1, the internal and external parameters of the second camera assembly 2 and the corrected infrared image, a depth image is obtained, including:

[0068] First, according to the internal and external parameters of the first camera component 1 and the internal and external parameters of the second camera component 2, the baseline distance between the first camera component 1 and the second camera component 2, and the focal length parameter of the first camera component 1 are determined; wherein the baseline distance is determined based on the position and posture (external parameters) between the first camera component 1 and the second camera component 2, and the focal length parameter is determined based on the shooting parameters (internal parameters) of the first camera component 1.

[0069] Then, the depth value of each pixel is determined according to the baseline distance, the focal length parameter and the pixel parallax set; specifically, the depth value of each pixel in the infrared image (reference image), which is the physical distance between each pixel in the infrared image (reference image) and the first camera 101. According to the physical distance, the depth image of the object to be imaged can be obtained, that is, the depth image is obtained according to the depth value of each pixel and the corrected infrared image.

[0070] Finally, a three-dimensional image of the object to be imaged is obtained according to the depth image and the internal and external parameters of the second camera component 2, including: determining the two-dimensional coordinates of each pixel in the depth image; converting the two-dimensional coordinates of each pixel in the depth image into a three-dimensional point cloud according to the internal and external parameters of the second camera component 2 and the depth value of each pixel in the depth image; and performing surface reconstruction on the three-dimensional point cloud to obtain a three-dimensional image of the object to be imaged.

[0071] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An image acquisition module, characterized in that: include: A first camera assembly, a second camera assembly, an infrared projector, and a control circuit board connected to the first camera assembly, the second camera assembly, and the infrared projector; internal and external parameters of the first camera assembly and the second camera assembly are calibrated based on preset parameters, and the first camera assembly and the second camera assembly are respectively arranged on both sides of the infrared projector; The first camera assembly is used to obtain an infrared image of the object to be imaged; The second camera assembly is used to obtain a visible light image of the object to be imaged; The infrared spot projector is used to project a preset light spot onto the object to be imaged; The control circuit board is used to control the projection timing of the infrared projector and control the first camera component and the second camera component to acquire images simultaneously.

2. The image acquisition module according to claim 1, characterized in that: The first camera assembly includes a first camera and infrared transmission glass covering the front end of the first camera, and the first camera is connected to the control circuit board.

3. An image acquisition module according to claim 2, characterized in that: The second camera assembly includes a second camera and a perspective sheet covering the front end of the second camera, and the second camera is connected to the control circuit board.

4. The image acquisition module according to claim 3, characterized in that: The first camera and the second camera are both visible light cameras.

5. A three-dimensional imaging device, characterized in that: The device comprises the image acquisition module as described in claims 1 to 4 above, and an image processing device connected to the image acquisition module; The image processing device is used to receive a three-dimensional imaging instruction and generate a control instruction according to the three-dimensional imaging instruction; the image acquisition module acquires an infrared image and a visible light image of the object to be imaged according to the control instruction; The image processing device processes the infrared image and the visible light image to obtain a three-dimensional image of the object to be imaged.

6. A three-dimensional imaging device according to claim 5, characterized in that: The image processing device comprises a processor and a memory, wherein at least one instruction, at least one program, a code set or an instruction set is stored in the memory, and the at least one instruction, at least one program, a code set or an instruction set is loaded and executed by the processor.

7. A three-dimensional imaging method, applied to a three-dimensional imaging device as described in claims 5-6, characterized in that: include: The image processing device generates a control instruction according to the three-dimensional imaging instruction and sends it to the control circuit board; The control circuit board controls the infrared projector to project a preset light spot onto the object to be imaged according to the control instruction, and then controls the first camera component to acquire an infrared image of the object to be imaged and the second camera component to acquire a visible light image of the object to be imaged after a preset time interval. The image processing device corrects the infrared image and the visible light image; Determine a pixel disparity set based on the corrected infrared image and the visible light image; Obtaining a depth image according to the pixel disparity set, the internal and external parameters of the first camera assembly, the internal and external parameters of the second camera assembly, and the corrected infrared image; A three-dimensional image of the object to be imaged is obtained according to the depth image and the internal and external parameters of the second camera assembly.

8. A three-dimensional imaging method according to claim 7, characterized in that: The infrared image and the visible light image respectively include a plurality of rows of pixels having the same number of rows, and each row of pixels includes the same number of pixel points; each row of pixels of the corrected infrared image is aligned with each row of pixels of the corrected visible light image; The pixel disparity set includes the pixel disparity of the corrected infrared image and the corrected visible light image at each pixel point; Based on the corrected infrared image and visible light image, a pixel disparity set is determined, including: The corrected infrared image is used as the reference image, and the corrected visible light image is used as the matching image; For each target pixel in the reference image, matching is performed with the to-be-matched pixel in the same row as the target pixel in the matching image; Calculating the similarity between the target pixel and the pixel to be matched, and determining the pixel to be matched with the maximum similarity as the best matching point; Taking the horizontal coordinate difference between the target pixel point and the best matching point as the pixel disparity of the target pixel point; All pixel points of the reference image are traversed to determine the pixel disparity at each pixel point.

9. A three-dimensional imaging method according to claim 8, characterized in that: A depth image is obtained according to the pixel disparity set, the internal and external parameters of the first camera assembly, the internal and external parameters of the second camera assembly, and the corrected infrared image, including: Determine a baseline distance between the first camera assembly and the second camera assembly, and a focal length parameter of the first camera assembly according to the internal and external parameters of the first camera assembly and the internal and external parameters of the second camera assembly; Determine a depth value of each pixel according to the baseline distance, the focal length parameter and the pixel disparity set; The depth image is obtained according to the depth value of each pixel and the corrected infrared image.

10. A three-dimensional imaging method according to claim 9, characterized in that: Obtaining a three-dimensional image of the object to be imaged according to the depth image and the internal and external parameters of the second camera assembly, including: Determine the two-dimensional coordinates of each pixel in the depth image; Converting the two-dimensional coordinates of each pixel in the depth image into a three-dimensional point cloud according to the internal and external parameters of the second camera assembly and the depth value of each pixel in the depth image; The three-dimensional point cloud is subjected to surface reconstruction to obtain a three-dimensional image of the object to be imaged.

Images