High-density multilayer circuit board

Abstract

The invention discloses a high-density multilayer circuit board, which relates to the technical field of printed circuit boards and comprises a support base, a protective support frame, a multilayer PCB, a positioning movable frame, a transmission gear, a reset tension spring and a limiting movable pin, the bottom of the protective supporting frame is connected with two supporting bases, and the supporting bases are installed in the machine box through bolts. The top of the protection supporting frame is connected with a plurality of layers of PCBs, and the top of the protection supporting frame is connected with two positioning movable frames. When the multi-layer PCB is placed on the top of the protective supporting frame, the positioning movable frames move inwards under the action of continuous tension of the reset tension springs, the tops of the two positioning movable frames make close contact with the two opposite ends of the multi-layer PCB, and the effect of fixing the multi-layer PCB is achieved. The problems that a traditional high-density multi-layer circuit board is generally fixed in a traditional tapping bolt mode, when the high-density multi-layer circuit board needs to be repaired or replaced subsequently, bolts used for fixing must be detached one by one with the help of corresponding tools, and the whole process is tedious are solved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, in particular to a high-density multilayer circuit board. Background Art

[0002] PCB printed board is also called printed circuit board or printed circuit board; multi-layer circuit board refers to a printed board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and welding electronic components. It has the function of conducting the circuits of each layer and insulating them from each other. Printed circuit boards have been widely used in the production and manufacturing of electronic products.

[0003] For example, the Chinese patent "CN107889350B multilayer circuit board" includes a central substrate, an interlayer insulating layer arranged on at least one of the two working surfaces of the central substrate, a circuit layer arranged on the surface of the interlayer insulating layer, and a high dielectric layer. The high dielectric layer is arranged on the surface of the circuit layer and is electrically connected to the circuit layer. The high dielectric layer is combined on the interlayer insulating layer, and a decoupling capacitor is connected to the high dielectric layer; a high dielectric layer is arranged between the circuit layers, and when the semiconductor elements installed on the circuit board are turned on / off at high speed, the decoupling capacitor can provide a relatively stable power supply in time when the potential of the power line drops instantaneously, and can also reduce the noise of the semiconductor elements coupled to the power supply end. At the same time, the circuit board adopts multi-level noise reduction, which can effectively reduce the problem of functional degradation of a single-layer high dielectric layer and improve the decoupling ability of the circuit board; secondly, the use of multi-level high dielectric layers for noise reduction can effectively reduce the energy consumption of the circuit board.

[0004] At present, in the installation and application of high-density multi-layer circuit boards, the traditional hole-opening method is generally adopted, and the circuit boards are fixedly connected to the chassis by bolts. When the high-density multi-layer circuit boards need to be repaired or replaced later, this traditional method exposes many inconveniences. The bolts used for fixing must be removed one by one with the help of corresponding tools. The whole process is not only cumbersome and time-consuming, but the most important thing is that this installation method lacks effective protection measures for high-density multi-layer circuit boards. When the chassis is inevitably hit by external force, the strong impact force can easily damage the high-density multi-layer circuit boards, which seriously affects their normal use.

[0005] Application Contents

[0006] The present invention relates to a high-density multi-layer circuit board. When the multi-layer PCB is placed on the top of a protective support frame, the support column is accurately connected to a docking slot. Under the continuous tension of a reset tension spring, the positioning movable frame moves smoothly and stably inward along a movable hole, so that the top of the positioning movable frame can enter the annular groove just right. The top of the support column is also stably connected to the positioning groove. The tops of the two positioning movable frames are in close contact with the opposite ends of the multi-layer PCB, thereby achieving a fixing effect on the multi-layer PCB. The entire installation process is not only simple and efficient, but also greatly improves the stability and reliability of the multi-layer PCB during use.

[0007] In a first aspect of the present disclosure, a high-density multilayer circuit board is provided, which specifically includes: a supporting base, a protective support frame, a multilayer PCB board, a positioning movable frame, a transmission gear, a reset tension spring and a limit movable pin; the bottom of the protective support frame is connected to two supporting bases, and the supporting base is installed in a chassis by bolts; the top of the protective support frame is connected to the multilayer PCB board, and the top of the protective support frame is connected to two positioning movable frames, and the multilayer PCB board is in contact with the two positioning movable frames on two opposite sides; the end of the positioning movable frame is connected to a reset tension spring, and the reset tension spring is located at the bottom of the multilayer PCB board; the top of the protective support frame is installed with a transmission gear, and the transmission gear is connected to the two positioning movable frames; the top of the protective support frame is connected to a limit movable pin, and the limit movable pin is connected to one of the positioning movable frames.

[0008] Furthermore, a support column is provided on the top of the protective support frame, and a docking groove is provided on the edge of the multi-layer PCB board, and the support column is connected to the docking groove provided on the multi-layer PCB board.

[0009] Furthermore, a ring groove is provided on the top of the support column, the top of the positioning movable frame is connected to the ring groove provided on the support column, the positioning movable frame contacts the top side of the multi-layer PCB board, a positioning groove is provided on the top of the positioning movable frame, and the top of the support column is connected to the positioning groove provided on the positioning movable frame.

[0010] Furthermore, a movable hole is provided inside the protective support frame, and a guide strip is provided at the bottom of the positioning movable frame. The guide strip is slidably connected to the movable hole provided in the protective support frame, and the sliding cooperation between the guide strip and the movable hole plays a guiding effect on the movement of the positioning movable frame.

[0011] Furthermore, the transmission gear is rotatably connected to the protective support frame, a rack is provided at the bottom of the positioning movable frame, and the transmission gear is meshed with the racks provided on the two positioning movable frames. When one of the positioning movable frames is moved, the positioning movable frame drives the transmission gear to rotate, and the transmission gear drives the other positioning movable frame to move synchronously, thereby ensuring the synchronization of the inward and outward movements of the two positioning movable frames.

[0012] Furthermore, a force-bearing hole is provided at the end of the guide strip, and two ends of the reset spring are respectively connected to the force-bearing holes provided on the two guide strips. When the multi-layer PCB is placed on the top of the protective support frame, the support column is located in the docking slot, and the positioning movable frame moves inward along the movable hole under the tension of the reset spring, so that the top of the positioning movable frame is in the annular groove, and the top of the support column is in the positioning slot. The two positioning movable frames are in contact with the top sides of the opposite ends of the multi-layer PCB, which has the effect of fixing the multi-layer PCB. When the multi-layer PCB needs to be repaired and replaced, the positioning movable frame is pulled in the opposite direction, the reset spring is gradually stretched, and the transmission gear drives the two positioning movable frames to move outward synchronously, the top of the positioning movable frame is separated from the annular groove, the top of the support column is separated from the positioning slot, and the opposite ends of the multi-layer PCB are separated from the two positioning movable frames, so that the multi-layer PCB can be disassembled from the top of the protective support frame.

[0013] Furthermore, a guide hole is provided on the top of the protective support frame, and a limit hole is provided inside the guide strip plate. The limit hole corresponds to the position of the guide hole. The limit movable pin slides through the guide hole provided in the protective support frame, and the end of the limit movable pin is inserted into the limit hole provided in the guide strip plate.

[0014] Furthermore, a positioning spring is mounted on the outside of the limiting movable pin, one end of the positioning spring is in contact with the limiting movable pin, and the other end of the positioning spring is in contact with the protective support frame. When the positioning movable frame moves to the innermost end to fix the multi-layer PCB board, the limiting movable pin moves inward along the guide hole under the thrust of the positioning spring, so that the end of the limiting movable pin is inserted into the limiting hole. The positioning movable frame is fixed by the limiting movable pin. When the positioning movable frame needs to be moved in the opposite direction, the limiting movable pin is pulled first, the positioning spring is contracted under force, and the end of the limiting movable pin is separated from the limiting hole, so that the locking state of the positioning movable frame can be released.

[0015] Furthermore, a guide vertical rod is provided inside the support base, a connecting hole is provided at the end of the protective support frame, and the guide vertical rod slides through the connecting hole provided in the protective support frame.

[0016] Furthermore, the guide vertical rod provided on the support base is externally mounted with two force release springs, which are located on opposite sides of the protection support frame, one end of the force release spring is in contact with the protection support frame, and the other end of the force release spring is in contact with the support base, and through the sliding cooperation between the guide vertical rod and the connecting hole, it has a guiding effect on the movement of the protection support frame, and through the force release spring, it has an elastic reset effect on the protection support frame. When the chassis is hit by external force, the protection support frame moves up and down to release force, and the force release spring buffers the force applied by the protection support frame, thereby having a flexible protection effect on the multi-layer PCB board.

[0017] The present invention provides a high-density multi-layer circuit board, which has the following beneficial effects:

[0018] When the present invention is in use, accurate guidance of the movement of the positioning movable frame is achieved through the sliding cooperation between the guide strip and the movable hole; when one of the positioning movable frames is moved, the positioning movable frame will drive the transmission gear to rotate, and then drive the other positioning movable frame to move synchronously, ensuring that the movement of the two positioning movable frames in the inner and outer directions remains synchronized; at the same time, the elastic force of the reset tension spring can be used to achieve the elastic reset effect of the positioning movable frame.

[0019] In addition, when the multi-layer PCB is placed on the top of the protective support frame, the support column is accurately connected to the docking slot, and the positioning movable frame moves smoothly and stably inward along the movable hole under the continuous tension of the reset tension spring, so that the top of the positioning movable frame can enter the ring groove just right, and the top of the support column is also firmly connected to the positioning groove. The tops of the two positioning movable frames are in close contact with the opposite ends of the multi-layer PCB, achieving the fixing effect of the multi-layer PCB; the entire installation process is not only simple and efficient, but also greatly improves the stability and reliability of the multi-layer PCB during use; when the multi-layer PCB needs to be repaired or replaced, the operator only needs to lightly Gently pull the positioning movable frame in the opposite direction. As the pulling action proceeds, the reset tension spring gradually stretches and accumulates strength. Through the transmission gear transmission mechanism, the two positioning movable frames will move outward synchronously and smoothly, and the top of the positioning movable frame will gradually disengage from the ring groove, and the top of the support column will also slowly move out of the positioning groove. The two ends of the multi-layer PCB board are successfully separated from the positioning movable frame, and the operator can easily remove the multi-layer PCB board from the top of the protective support frame. The whole process is not only easy to operate, time-saving and labor-saving, but also greatly facilitates subsequent manual maintenance work. Whether it is regular inspection and cleaning, or replacement of damaged parts, it can proceed more smoothly.

[0020] In addition, the elastic reset of the limit movable pin is achieved by the positioning spring. When the positioning movable frame moves to the innermost end and fixes the multi-layer PCB board, the limit movable pin moves inward along the guide hole under the action of the positioning spring thrust, and its end is inserted into the limit hole, thereby fixing the positioning movable frame and ensuring the stable state of the multi-layer PCB board; when moving the positioning movable frame in the reverse direction, the limit movable pin is pulled first to contract the positioning spring, and the end of the limit movable pin is separated from the limit hole, the positioning movable frame is unlocked, and the positioning movable frame can be moved in the reverse direction.

[0021] In addition, through the close sliding fit between the guide vertical rod and the connecting hole, the movement of the protective support frame can be guided stably and accurately, and the force release spring plays a key elastic reset effect during the movement of the protective support frame; when the chassis is inevitably hit by external force, the protective support frame will effectively release the force by moving up and down, and the force release spring will buffer the force applied by the protective support frame, which has a good flexible protection effect on the multi-layer PCB board, and can greatly reduce the possibility of damage to the multi-layer PCB board due to external force collision, thereby significantly extending the service life of the multi-layer PCB board.

[0022] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0024] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0025] In the attached picture:

[0026] Figure 1 The overall top axis side structure schematic diagram of the present application is shown;

[0027] Figure 2 The overall bottom shaft side structure schematic diagram of the present application is shown;

[0028] Figure 3 A schematic diagram of the axial structure of the protective support frame and the multi-layer PCB board of the present application in a separated state is shown;

[0029] Figure 4 It shows a schematic diagram of the shaft side structure of the present application in a state where the support base and the force release spring are separated;

[0030] Figure 5 A schematic diagram of the connecting shaft side structure of the protection support frame and the positioning movable frame of the present application is shown;

[0031] Figure 6 It shows a schematic diagram of the shaft side structure of the protection support frame and the positioning movable frame of the present application in a separated state;

[0032] Figure 7 A schematic diagram of the axial structure of the protective support frame of the present application is shown;

[0033] Figure 8 A schematic diagram of the axial structure of the positioning movable frame of the present application is shown.

[0034] Reference numerals list

[0035] 1. Support base; 101. Guide vertical rod;

[0036] 2. Protective support frame; 201. Connecting hole; 202. Support column; 2021. Ring groove; 203. Movable hole; 204. Guide hole;

[0037] 3. Release spring;

[0038] 4. Multi-layer PCB board; 401, docking slot;

[0039] 5. Positioning movable frame; 501. Guide strip plate; 5011. Force hole; 5012. Limit hole; 502. Positioning groove; 503. Rack;

[0040] 6. Transmission gear;

[0041] 7. Reset tension spring;

[0042] 8. Limiting movable pin;

[0043] 9. Positioning spring. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Example 1: Please refer to Figures 1 to 8 :

[0046] The present invention proposes a high-density multilayer circuit board, comprising: a support base 1, a protective support frame 2, a multilayer PCB board 4, a positioning movable frame 5, a transmission gear 6, a reset tension spring 7 and a limit movable pin 8; the bottom of the protective support frame 2 is connected to two support bases 1, and the support base 1 is installed in the chassis by bolts; the top of the protective support frame 2 is connected to the multilayer PCB board 4, and the top of the protective support frame 2 is connected to two positioning movable frames 5, and the multilayer PCB board 4 contacts the two positioning movable frames 5 on opposite sides; the end of the positioning movable frame 5 is connected to a reset tension spring 7, and the reset tension spring 7 is located at the bottom of the multilayer PCB board 4; the top of the protective support frame 2 is installed with a transmission gear 6, and the transmission gear 6 is connected to the two positioning movable frames 5; the top of the protective support frame 2 is connected to a limit movable pin 8, and the limit movable pin 8 is connected to one of the positioning movable frames 5; the top of the protective support frame 2 is provided with a support column 202, and the edge of the multilayer PCB board 4 is provided with a docking groove 401, and the support column 202 is connected to the docking groove 401 provided on the multilayer PCB board 4; the top of the support column 202 The top of the positioning movable frame 5 is connected to the ring groove 2021 provided on the support column 202, the positioning movable frame 5 contacts the top side of the multi-layer PCB board 4, the top of the positioning movable frame 5 is provided with a positioning groove 502, and the top of the support column 202 is connected to the positioning groove 502 provided on the positioning movable frame 5; the protective support frame 2 is provided with a movable hole 203, and the bottom of the positioning movable frame 5 is provided with a guide strip 501, which is slidably connected to the movable hole 203 provided on the protective support frame 2. , through the sliding cooperation between the guide strip plate 501 and the movable hole 203, the positioning movable frame 5 is guided to move; the transmission gear 6 is rotatably connected to the protective support frame 2, and a rack 503 is provided at the bottom of the positioning movable frame 5. The transmission gear 6 is meshed with the racks 503 provided on the two positioning movable frames 5. When one of the positioning movable frames 5 is moved, the positioning movable frame 5 drives the transmission gear 6 to rotate, and the transmission gear 6 drives the other positioning movable frame 5 to move synchronously, thereby ensuring the synchronization of the inward and outward movements of the two positioning movable frames 5.

[0047] In the disclosed embodiment, a force-bearing hole 5011 is provided at the end of the guide strip 501, and the two ends of the return tension spring 7 are respectively connected to the force-bearing holes 5011 provided on the two guide strips 501;

[0048] By adopting the above technical solution, the reset tension spring 7 plays an elastic reset effect on the positioning movable frame 5. When the multi-layer PCB board 4 is placed on the top of the protective support frame 2, the support column 202 is located in the docking slot 401, and the positioning movable frame 5 is affected by the tension of the reset tension spring 7 and moves inward along the movable hole 203, so that the top of the positioning movable frame 5 is in the annular groove 2021, and the top of the support column 202 is in the positioning groove 502. The two positioning movable frames 5 are in contact with the top sides of the opposite ends of the multi-layer PCB board 4, which plays a fixing effect on the multi-layer PCB board 4, so that the multi-layer PCB board 4 is easier to install and fix; when the multi-layer PCB board 4 needs to be repaired and replaced, the positioning movable frame 5 is pulled in the opposite direction, the reset tension spring 7 is gradually stretched, and the transmission gear 6 drives the two positioning movable frames 5 to move outward synchronously, the top of the positioning movable frame 5 is separated from the ring groove 2021, and the top of the support column 202 is separated from the positioning groove 502. The two opposite ends of the multi-layer PCB board 4 are separated from the two positioning movable frames 5, and the multi-layer PCB board 4 can be disassembled from the top of the protective support frame 2, which is easier to operate and saves time, and is convenient for later manual maintenance.

[0049] Embodiment 2, on the basis of embodiment 1, a guide hole 204 is provided on the top of the protective support frame 2, a limit hole 5012 is provided inside the guide strip 501, the limit hole 5012 corresponds to the position of the guide hole 204, the limit movable pin 8 slides through the guide hole 204 provided on the protective support frame 2, the end of the limit movable pin 8 is inserted into the limit hole 5012 provided on the guide strip 501, and a positioning spring 9 is sleeved on the outside of the limit movable pin 8, one end of the positioning spring 9 is in contact with the limit movable pin 8, and the other end of the positioning spring 9 is in contact with the protective support frame 2;

[0050] By adopting the above technical solution, the positioning spring 9 plays an elastic reset effect on the limit movable pin 8. When the positioning movable frame 5 moves to the innermost end to fix the multi-layer PCB board 4, the limit movable pin 8 is affected by the thrust of the positioning spring 9 and moves inward along the guide hole 204, so that the end of the limit movable pin 8 is inserted into the limit hole 5012. The limit movable pin 8 plays a fixing effect on the positioning movable frame 5, and the stability of the state of the multi-layer PCB board 4 is guaranteed; when it is necessary to move the positioning movable frame 5 in the reverse direction, the limit movable pin 8 is pulled first, the positioning spring 9 is forced to shrink, the end of the limit movable pin 8 is separated from the limit hole 5012, the positioning movable frame 5 is unlocked, and the positioning movable frame 5 can be moved in the reverse direction.

[0051] Embodiment 3, on the basis of Embodiment 1 and Embodiment 2, a guide vertical rod 101 is provided inside the support base 1, a connecting hole 201 is provided at the end of the protection support frame 2, the guide vertical rod 101 slides through the connecting hole 201 provided on the protection support frame 2, and two force release springs 3 are sleeved on the outside of the guide vertical rod 101 provided on the support base 1, and the two force release springs 3 are located on opposite sides of the protection support frame 2, one end of the force release spring 3 is in contact with the protection support frame 2, and the other end of the force release spring 3 is in contact with the support base 1;

[0052] By adopting the above technical scheme, the sliding cooperation between the guide vertical rod 101 and the connecting hole 201 is used to guide the movement of the protection support frame 2, and the force release spring 3 is used to elastically reset the protection support frame 2. When the chassis is hit by external force, the protection support frame 2 moves up and down to release force, and the force release spring 3 buffers the force applied by the protection support frame 2, thereby playing a flexible protection effect on the multi-layer PCB board 4, effectively preventing the multi-layer PCB board 4 from being damaged by external force collision, and extending the service life of the multi-layer PCB board 4.

[0053] The working principle of this embodiment is as follows: first, when the multi-layer PCB board 4 is placed on the top of the protective support frame 2, the support column 202 is located in the docking slot 401, and the positioning movable frame 5 is affected by the tension of the reset tension spring 7 and moves inward along the movable hole 203, so that the top of the positioning movable frame 5 is in the annular groove 2021, and the top of the support column 202 is in the positioning slot 502, and the two positioning movable frames 5 are in contact with the top sides of the opposite ends of the multi-layer PCB board 4, which plays a role in fixing the multi-layer PCB board 4; when the positioning movable frame 5 moves to the innermost end to fix the multi-layer PCB board 4, the limiting movable pin 8 is affected by the thrust of the positioning spring 9 and moves inward along the guide hole 204, so that the end of the limiting movable pin 8 is inserted into the limiting hole 5012, and the limiting movable pin 8 plays a role in fixing the positioning movable frame 5, thereby ensuring the stability of the state of the multi-layer PCB board 4; when the chassis is hit by external force, the protective support frame 2 moves up and down to release the force, and the release spring 3 exerts the force on the protective support frame 2. The force is buffered, which plays a flexible protective effect on the multi-layer PCB board 4, effectively avoiding the multi-layer PCB board 4 from being damaged by external force collision, and extending the service life of the multi-layer PCB board 4; when the multi-layer PCB board 4 needs to be repaired and replaced, the positioning movable frame 5 is pulled in the opposite direction, the reset tension spring 7 is gradually stretched, and the transmission gear 6 drives the two positioning movable frames 5 to move outward synchronously, the top of the positioning movable frame 5 is separated from the annular groove 2021, and the top of the support column 202 is separated from the positioning groove 502, and the two opposite ends of the multi-layer PCB board 4 are separated from the two positioning movable frames 5, and the multi-layer PCB board 4 can be disassembled from the top of the protective support frame 2, which is more convenient and time-saving, and is convenient for later manual maintenance; before the positioning movable frame 5 needs to be moved in the opposite direction, the limiting movable pin 8 is pulled first, the positioning spring 9 is contracted by force, and the end of the limiting movable pin 8 is separated from the limiting hole 5012, the positioning movable frame 5 is unlocked, and the positioning movable frame 5 can be moved in the opposite direction.

[0054] In this article, there are a few points to note:

[0055] 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0056] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0057] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. High-density multi-layer circuit boards, including: A support base (1), a protective support frame (2), a multi-layer PCB board (4), a positioning movable frame (5), a transmission gear (6), a reset tension spring (7) and a limit movable pin (8); characterized in that the bottom of the protective support frame (2) is connected to two support bases (1), and the support base (1) is installed in the chassis by bolts; the top of the protective support frame (2) is connected to the multi-layer PCB board (4), and the top of the protective support frame (2) is connected to two positioning movable frames (5), and the multi-layer PCB board (4) contacts the two positioning movable frames (5) on two opposite sides; the end of the positioning movable frame (5) is connected to a reset tension spring (7), and the reset tension spring (7) is located at the bottom of the multi-layer PCB board (4); the top of the protective support frame (2) is installed with a transmission gear (6), and the transmission gear (6) is connected to the two positioning movable frames (5); the top of the protective support frame (2) is connected to a limit movable pin (8), and the limit movable pin (8) is connected to one of the positioning movable frames (5).

2. The high-density multi-layer circuit board according to claim 1, characterized in that: A support column (202) is provided at the top of the protective support frame (2), a docking groove (401) is provided at the edge of the multi-layer PCB board (4), and the support column (202) is connected to the docking groove (401) provided on the multi-layer PCB board (4).

3. The high-density multi-layer circuit board according to claim 2, characterized in that: The top of the support column (202) is provided with an annular groove (2021), the top of the positioning movable frame (5) is connected to the annular groove (2021) provided on the support column (202), the positioning movable frame (5) is in contact with the top side of the multi-layer PCB board (4), the top of the positioning movable frame (5) is provided with a positioning groove (502), and the top of the support column (202) is connected to the positioning groove (502) provided on the positioning movable frame (5).

4. The high-density multi-layer circuit board according to claim 1, characterized in that: The protective support frame (2) is provided with a movable hole (203) inside, and the bottom of the positioning movable frame (5) is provided with a guide strip (501), and the guide strip (501) is slidably connected to the movable hole (203) provided in the protective support frame (2).

5. The high-density multi-layer circuit board according to claim 1, characterized in that: The transmission gear (6) is rotatably connected to the protection support frame (2); a rack (503) is provided at the bottom of the positioning movable frame (5); and the transmission gear (6) meshes with the racks (503) provided on the two positioning movable frames (5).

6. The high-density multi-layer circuit board according to claim 4, characterized in that: The end of the guide strip (501) is provided with a force-bearing hole (5011), and the two ends of the return tension spring (7) are respectively connected to the force-bearing holes (5011) provided on the two guide strips (501).

7. The high-density multi-layer circuit board according to claim 4, characterized in that: The top of the protective support frame (2) is provided with a guide hole (204), and a limit hole (5012) is provided inside the guide strip (501). The limit hole (5012) corresponds to the position of the guide hole (204). The limit movable pin (8) slides through the guide hole (204) provided on the protective support frame (2), and the end of the limit movable pin (8) is inserted into the limit hole (5012) provided on the guide strip (501).

8. The high-density multi-layer circuit board according to claim 1, characterized in that: A positioning spring (9) is sleeved on the outside of the limiting movable pin (8), one end of the positioning spring (9) contacts the limiting movable pin (8), and the other end of the positioning spring (9) contacts the protective support frame (2).

9. The high-density multi-layer circuit board according to claim 1, characterized in that: A guide vertical rod (101) is provided inside the support base (1), a connecting hole (201) is provided at the end of the protection support frame (2), and the guide vertical rod (101) slides through the connecting hole (201) provided on the protection support frame (2).

10. The high-density multi-layer circuit board according to claim 9, characterized in that: The guide vertical rod (101) provided on the support base (1) is externally sleeved with two force release springs (3), the two force release springs (3) are located on opposite sides of the protection support frame (2), one end of the force release spring (3) is in contact with the protection support frame (2), and the other end of the force release spring (3) is in contact with the support base (1).

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