Display panel, manufacturing method of display panel and electronic equipment

Abstract

According to the display panel, the manufacturing method of the display panel and the electronic equipment provided by the invention, the filling unit embedded into the concave structure of the auxiliary conductive unit is arranged to be basically flush with the side, away from the substrate, of the auxiliary conductive unit, so that the climbing difficulty of the first electrode covering the junction of the auxiliary conductive unit and the filling unit can be reduced; therefore, the risk of breakage of the first electrode is reduced, and the risk of uneven light emission of the light-emitting device due to the protrusion of the filling unit can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices. In the preparation process of traditional display panels, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A record relevant contents of the non-fine metal mask technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising: substrate; a first conductive layer located on one side of the substrate; a first insulating layer located at a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer; at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; a filling unit at least partially located in the recessed structure; a difference between a first distance from a side of the filling unit away from the substrate to the substrate and a second distance from a side of the first conductive portion away from the substrate to the substrate being less than 0.01 micrometers; A first electrode of at least one light emitting device, wherein the first electrode is located at a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

[0005] In some possible implementations, the first conductive portion includes a first sub-region surrounding the first through hole and a second sub-region surrounding the first sub-region, and a third distance from the first sub-region to the substrate from a side away from the substrate is greater than a fourth distance from the second sub-region to the substrate from a side away from the substrate.

[0006] In some possible implementations, the difference between the third distance and the fourth distance is in the range of 0.005 micrometers; In a direction away from the first through hole, a width of the first sub-region ranges from 0.5 micrometers to 1.5 micrometers.

[0007] In some possible implementations, the first electrode includes a third sub-region and a fourth sub-region, the orthographic projections of the first sub-region and the filling unit on the substrate are located within the orthographic projection of the third sub-region on the substrate, and the fourth sub-region surrounds the third sub-region; A fifth distance from the side of the third sub-region away from the substrate to the substrate is greater than a sixth distance from the side of the fourth sub-region away from the substrate to the substrate; a difference range between the fifth distance and the sixth distance is 0.005 micrometers.

[0008] In some possible implementations, the material of the filling unit includes a positive organic glue; and the material of the auxiliary conductive unit includes indium tin oxide.

[0009] In some possible implementations, an orthographic projection of the filling unit on the substrate is located within an orthographic projection of the recessed structure on the substrate.

[0010] In some possible implementations, the display panel further includes: a pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer comprising at least one pixel opening, the pixel opening exposing at least a portion of the first electrode; The orthographic projection of the first through hole on the substrate is located within the orthographic projection of the pixel opening on the substrate.

[0011] In some possible implementations, a geometric center of an orthographic projection of the recessed structure on the substrate coincides with a geometric center of an orthographic projection of the pixel opening on the substrate.

[0012] In some possible implementations, the display panel further includes: An isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure enclosing at least one isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the corresponding isolation opening on the substrate; A light-emitting functional layer and a second electrode of the light-emitting device are stacked in a direction away from the substrate, wherein the light-emitting functional layer and the second electrode are located in the isolation opening and on a side of the first electrode away from the substrate; The isolation structure has conductivity, and the second electrode contacts the isolation structure.

[0013] In some possible implementations, the display panel further includes a packaging unit located on a side of the light-emitting device away from the substrate, and at least a portion of the packaging unit is located in the isolation opening; adjacent packaging units are arranged at intervals.

[0014] In some possible implementations, the display panel further includes a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; the material of the encapsulation unit and the second encapsulation layer includes an inorganic material; and the material of the first encapsulation layer includes an organic material. In some possible implementations, the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, and an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate; Under the same etching conditions, the etching resistance of the supporting portion is weaker than that of the shielding portion.

[0015] In some possible implementations, the isolation structure further includes a receiving portion located between the supporting portion and the substrate; an orthographic projection of the receiving portion on the substrate is located within an orthographic projection of the shielding portion on the substrate; The material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium; the material of the receiving portion includes molybdenum.

[0016] Another object of the present application is to provide a display panel, the display panel comprising: substrate; a first conductive layer located on one side of the substrate; a first insulating layer located at a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer; at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; A filling unit at least partially located in the recessed structure; an angle between a side of the filling unit away from the substrate and a plane where the first conductive portion is located is less than or equal to 5°; A first electrode of at least one light emitting device, wherein the first electrode is located at a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

[0017] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising: providing a substrate; forming a first conductive layer on one side of the substrate; forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises at least one first through hole exposing the first conductive layer; forming at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; forming a filling unit at least partially located in the recessed structure; a difference between a first distance from a side of the filling unit away from the substrate to the substrate and a second distance from a side of the first conductive portion away from the substrate to the substrate is less than 0.01 micrometers; A first electrode of at least one light emitting device is formed, wherein the first electrode is located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

[0018] In some possible implementations, the step of forming a filling unit at least partially located in the recessed structure includes: Disposing a filling material layer on a side of the first conductive layer away from the substrate, wherein the filling material layer is at least partially filled into the recessed structure; The filling material layer is exposed and developed to form a first filling portion and a second filling portion, wherein the orthographic projection of the recessed structure on the substrate is located within the orthographic projection of the first filling portion on the substrate, and the orthographic projection of the second filling portion on the substrate surrounds the orthographic projection of the first filling portion on the substrate; the central area of ​​the first filling portion is recessed toward the substrate relative to the edge area of ​​the first filling portion close to the second filling portion; the distance from one end of the second filling portion on a side away from the substrate close to the first filling portion to the substrate is greater than the distance from one end away from the first filling portion to the substrate; Baking the first filling part and the second filling part to make them at least partially leveled and solidified, so as to reduce the difference between the distance from different positions of the first filling part away from the substrate and the substrate and the distance from different positions of the second filling part away from the substrate and the substrate; The first filling portion and the second filling portion are thinned as a whole to remove the second filling portion, and the first filling portion located in the recessed structure is retained to form the filling unit.

[0019] In some possible implementations, the film material of the filling material layer includes a positive organic resin; and the step of performing an exposure and development process on the filling material layer includes: The filling material layer is exposed and developed using a halftone mask, wherein the second filling portion corresponds to an opaque area of ​​the halftone mask, the first filling portion corresponds to a partially translucent area of ​​the halftone mask, and the portion other than the first filling portion and the second filling portion corresponds to a fully translucent area of ​​the halftone mask.

[0020] In some possible implementations, the second conductive portion includes a first sub-region surrounding the first through hole and a second sub-region surrounding the first sub-region, and an orthographic projection of the first sub-region on the substrate is located within an orthographic projection of the filling unit on the substrate; The step of thinning the first filling portion and the second filling portion as a whole further includes: The second sub-region is subjected to an ashing process so that a third distance from a side of the first sub-region away from the substrate to the substrate is greater than a fourth distance from a side of the second sub-region away from the substrate to the substrate.

[0021] In some possible implementations, the step of thinning the first filling portion and the second filling portion as a whole includes: The first filling part and the second filling part are subjected to an overall oxygen ashing treatment.

[0022] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0023] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting a filling unit of a recessed structure embedded in an auxiliary conductive unit to be basically flush with a side of the auxiliary conductive unit away from a substrate, the climbing difficulty of a first electrode covering the junction of the auxiliary conductive unit and the filling unit can be reduced, thereby reducing the risk of the first electrode breaking, and can also reduce the risk of uneven light emission caused by the protrusion of the filling unit on the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a schematic diagram of an existing related display panel; Figure 2 One of the schematic diagrams of the display panel provided in this embodiment; Figure 3 A second schematic diagram of a display panel provided in this embodiment; Figure 4 A third schematic diagram of a display panel provided in this embodiment; Figure 5 A fourth schematic diagram of a display panel provided in this embodiment; Figure 6 A fifth schematic diagram of a display panel provided in this embodiment; Figure 7 A sixth schematic diagram of a display panel provided in this embodiment; Figure 8 A seventh schematic diagram of a display panel provided in this embodiment; Fig. 9 An eighth schematic diagram of a display panel provided in this embodiment; Fig.10 A ninth schematic diagram of a display panel provided in this embodiment; Fig.11 A schematic diagram of the position of the recessed structure provided in this embodiment; Fig.12 A tenth schematic diagram of a display panel provided in this embodiment; Fig.13 One of the schematic diagrams of the isolation structure provided in this embodiment; Fig.14 A second schematic diagram of the isolation structure provided in this embodiment; Fig.15 The eleventh schematic diagram of the display panel provided in this embodiment; Fig.16 A schematic diagram of a process of manufacturing a display panel provided in this embodiment; Fig.17 This is a schematic diagram of a manufacturing process of a display panel provided in this embodiment; Fig.18 The second schematic diagram of the manufacturing process of the display panel provided in this embodiment; Fig.19 The third schematic diagram of the manufacturing process of the display panel provided in this embodiment; Fig. 20 The fourth schematic diagram of the manufacturing process of the display panel provided in this embodiment.

[0026] Icons: 100-substrate; 110-array functional layer; 1116-first conductive layer; 1117-first insulating layer; 510-auxiliary conductive unit; 511-first conductive part; 512-second conductive part; 521-first sub-region; 522-second sub-region; 610-filling unit; 120-first electrode; 121-third sub-region; 122-fourth sub-region; 130-pixel defining layer; 131-pixel opening; 140-isolation structure; 141-support part; 142 - shielding part; 143- receiving part; 810- light-emitting device; 910- isolating opening; 150- light-emitting functional layer; 160- second electrode; 170- packaging unit; 180- first packaging layer; 190- second packaging layer; 401- cavity; 710- recessed structure; 010- half-tone mask; 011- first mask area; 012- second mask area; 013- third mask area; 6101- filling material layer; 611- first filling part; 612- second filling part. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invention product is usually placed when in use, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0031] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0032] In order to increase the pixel density of the display panel, it is necessary to reduce the spacing distance between the light emitting devices 810'. Figure 1 In some related display panels, the via hole of the first electrode 120' originally set between the pixel openings (ie, the via hole connecting the first electrode 120' and the first conductive layer 1116' in the array functional layer 110') is set at a corresponding position within the pixel opening.

[0033] In this case, in order to ensure the flatness of the first electrode 120' at the via hole, an auxiliary conductive unit 510' extending into the via hole is provided, and a filling unit 610' is provided in the recessed structure 710' formed by the auxiliary conductive unit 510' sinking into the via hole, and then the first electrode 120' is provided.

[0034] The inventors have found that in such a display panel, if the auxiliary conductive unit 510' protrudes too much in the direction away from the substrate 100', the corner of the edge thereof may be cut. If the first electrode 120' is too large, it will be difficult for the first electrode 120' to climb here, which may easily cause the first electrode 120' to break and affect the light-emitting effect. In addition, the protruding auxiliary conductive unit 510' will cause other film layers of the light-emitting device 810' located thereon to protrude away from the substrate 100', resulting in a circular uneven light spot for light output and heat dissipation.

[0035] In view of this, the present embodiment provides a solution that can reduce the risk of first electrode breakage on the display panel. The solution provided by the present embodiment is described in detail below.

[0036] See also Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 100 , a first conductive layer 1116 , a first insulating layer 1117 , an auxiliary conductive unit 510 , a filling unit 610 and a light emitting device 810 .

[0037] In this embodiment, the material of the substrate 100 may include a rigid material, such as glass; or the material of the substrate 100 may include a flexible material, such as polyimide (Pi).

[0038] An array function layer 110 may also be provided on one side of the substrate 100. The array function layer 110 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuits.

[0039] The first conductive layer 1116 is located on one side of the substrate 100. For example, the first conductive layer 1116 may be a conductive layer on a side of the array functional layer 110 away from the substrate 100.

[0040] The first insulating layer 1117 is located on a side of the first conductive layer 1116 away from the substrate 100, and the first insulating layer 1117 includes at least one first through hole exposing the first conductive layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0041] See also Figure 3 The auxiliary conductive unit 510 includes a first conductive part 511 and a second conductive part 512 connected to each other. The first conductive part 511 is located on a side of the first insulating layer 1117 away from the substrate 100, and the second conductive part 512 extends along the first insulating layer 1117 toward the side wall of the first through hole to form a recessed structure 710 in the first through hole and contacts the first conductive layer 1116.

[0042] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection of the auxiliary conductive unit 510 on the substrate 100. The auxiliary conductive unit 510 extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole to contact the first conductive layer 1116. In this case, the auxiliary conductive unit 510 is sunken into the first through hole to form a recessed structure 710.

[0043] At least part of the filling unit 610 is located in the recessed structure 710. In the present embodiment, the filling unit 610 is used to fill the recessed structure 710 formed by the auxiliary conductive unit 510 sinking into the first through hole, and the difference between the first distance H1 from the side of the filling unit 610 away from the substrate 100 to the substrate 100 and the second distance H2 from the side of the first conductive portion 511 away from the substrate 100 to the substrate 100 is less than 0.01 micrometers. That is, in the present embodiment, the side of the filling unit 610 away from the substrate 100 and the side of the first conductive portion 511 away from the substrate 100 are substantially flush, and the filling unit 610 and the auxiliary conductive unit 510 together form a relatively flat surface for setting the first electrode 120.

[0044] Optionally, see Figure 4 In some possible implementations, a side of the filling unit 610 away from the substrate 100 may be completely flush with a side of the first conductive portion 511 away from the substrate 100 .

[0045] For other possible implementations, see Figure 5 and Figure 6 The side of the filling unit 610 away from the substrate 100 may be a curved surface convex away from the substrate 100 or a curved surface concave toward the substrate 100 due to process errors. In this case, the maximum height difference between the side of the filling unit 610 away from the substrate 100 and the side of the first conductive portion 511 away from the substrate 100 (i.e., the distance to the substrate 100) is less than 0.01 microns.

[0046] The first electrode 120 of at least one light-emitting device 810 is located on a side of the corresponding auxiliary conductive unit 510 and the filling unit 610 away from the substrate 100, and at least a portion of the first electrode 120 is in contact with the auxiliary conductive unit 510. That is, the first electrode 120 is electrically connected to the trace in the first conductive layer 1116 through the auxiliary conductive unit 510.

[0047] Based on the above design, in the display panel provided in this embodiment, by setting the filling unit 610 of the recessed structure 710 embedded in the auxiliary conductive unit 510 to be basically flush with the side of the auxiliary conductive unit 510 away from the substrate 100, the climbing difficulty of the first electrode 120 covering the junction of the auxiliary conductive unit 510 and the filling unit 610 can be reduced, thereby reducing the risk of the first electrode 120 breaking, and can also reduce the risk of uneven light emission caused by the protrusion of the filling unit 610 due to the light-emitting device 810.

[0048] In some possible implementations, the material of the filling unit 610 includes a positive organic resin. Thus, in the exposure and development process of manufacturing the filling unit 610, the formation range, thickness and morphology of the filling unit 610 can be controlled by controlling the exposure amount and exposure area.

[0049] Optionally, in this embodiment, the material of the auxiliary conductive unit 510 includes indium tin oxide.

[0050] For some possible implementations, see Figure 7 , the first conductive portion 511 includes a first sub-region 521 surrounding the first through hole and a second sub-region 522 surrounding the first sub-region 521, and a third distance H21 from the side of the first sub-region 521 away from the substrate 100 to the substrate 100 is greater than a fourth distance H22 from the side of the second sub-region 522 away from the substrate 100 to the substrate 100. For example, the first sub-region 521 and the second sub-region 522 form a step with a height difference.

[0051] Optionally, the difference between the third distance H21 and the fourth distance H22 is less than 0.005 micrometers, that is, the height difference between the steps formed by the first sub-region 521 and the second sub-region 522 is less than 0.005 micrometers.

[0052] In this case, a difference between a first distance H1 from a side of the filling unit away from the substrate 100 to the substrate 100 and a third distance H21 from a side of the first sub-region 521 away from the substrate 100 to the substrate 100 is less than 0.01 micrometers.

[0053] Optionally, in a direction away from the first through hole, a width W1 of the first sub-region 521 ranges from 0.5 micrometers to 1.5 micrometers.

[0054] Optionally, the height difference between the first sub-region 521 and the second sub-region 522 may be formed by simultaneously thinning the auxiliary conductive unit 510 when ashing and thinning is performed on the filling unit 610 .

[0055] In some possible implementations, the orthographic projection of the filling unit 610 on the substrate 100 is located within the orthographic projection of the recessed structure 710 on the substrate 100. That is, in a direction parallel to the substrate 100, the filling unit 610 does not exceed the recessed structure 710.

[0056] For other possible implementations, see Figure 8 Due to process errors, part of the filling unit 610 may remain outside the recessed structure 710 , so that the filling unit 610 may exceed the recessed structure 710 in a direction parallel to the substrate 100 .

[0057] For some possible implementations, see Fig. 9 The first electrode 120 includes a third sub-region 121 and a fourth sub-region 122 , the orthographic projections of the first sub-region 521 and the filling unit 610 on the substrate 100 are located within the orthographic projection of the third sub-region 121 on the substrate 100 , and the fourth sub-region 122 surrounds the third sub-region 121 .

[0058] A fifth distance H31 from the side of the third sub-region 121 away from the substrate 100 to the substrate 100 is greater than a sixth distance H32 from the side of the fourth sub-region 122 away from the substrate 100 to the substrate 100. Optionally, the difference between the fifth distance H31 and the sixth distance H32 is in the range of 0.005 micrometers.

[0059] That is, due to the height difference between the first sub-region 521 and the second sub-region 522 , the first electrode 120 covering the first sub-region 521 and the second sub-region 522 also has a certain height difference, thereby forming the third sub-region 121 and the fourth sub-region 122 .

[0060] For some possible implementations, see Fig.10 The display panel provided in this embodiment further includes a pixel defining layer 130 . The pixel defining layer 130 is located on a side of the first electrode 120 away from the substrate 100 . The pixel defining layer 130 includes at least one pixel opening 131 . The pixel opening 131 exposes at least a portion of the first electrode 120 .

[0061] See also Fig.11 , the orthographic projection of the recessed structure 710 on the substrate 100 is located within the orthographic projection of the pixel opening 131 on the substrate 100. Optionally, the geometric center of the orthographic projection of the recessed structure 710 on the substrate 100 coincides with the geometric center of the orthographic projection of the pixel opening on the substrate 100. In this way, the spacing between the light-emitting devices 810 is reduced, and the pixel density of the display panel is improved.

[0062] For some possible implementations, see again Figure 2 The display panel provided in this embodiment may further include an isolation structure 140 .

[0063] The isolation structure 140 is located on a side of the pixel defining layer 130 away from the substrate 100 . The isolation structure 140 encloses at least one isolation opening 910 . The orthographic projection of the pixel opening on the substrate 100 is located within the orthographic projection of the corresponding isolation opening 910 on the substrate 100 .

[0064] The light emitting device 810 may further include a light emitting functional layer 150 and a second electrode 160 stacked in a direction away from the substrate 100 . The light emitting functional layer 150 and the second electrode 160 are located in the isolation opening 910 and on a side of the first electrode 120 away from the substrate 100 .

[0065] Optionally, the isolation structure 140 is conductive, and the second electrode 160 is in contact with the isolation structure 140 .

[0066] Optionally, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 110, and the second electrode 160 can be connected to the common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0067] In some possible implementations, the display panel provided in this embodiment further includes a packaging unit 170 located on a side of the light-emitting device 810 away from the substrate 100 , and at least a portion of the packaging unit 170 is located in the isolation opening 910 .

[0068] Optionally, adjacent encapsulation units 170 are arranged at intervals.

[0069] Optionally, see Fig.12 The display panel provided in this embodiment further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 100.

[0070] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials; and the material of the first encapsulation layer 180 includes organic materials.

[0071] For some possible implementations, see Fig.13 The isolation structure 140 includes a supporting portion 141 and a shielding portion 142 located on a side of the supporting portion 141 away from the substrate 100 , and an orthographic projection of the supporting portion 141 on the substrate 100 is located within an orthographic projection of the shielding portion 142 on the substrate 100 .

[0072] Optionally, the etching resistance of the support portion 141 is weaker than the etching resistance of the shielding portion 142 .

[0073] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0074] For some possible implementations, see Fig.14 The isolation structure 140 further includes a receiving portion 143 located between the supporting portion 141 and the substrate 100 .

[0075] Optionally, the orthographic projection of the receiving portion 143 on the substrate 100 is located within the orthographic projection of the shielding portion 142 on the substrate 100 .

[0076] Optionally, the material of the receiving portion 143 includes molybdenum.

[0077] See also Fig.15 This embodiment also provides a display panel, which may include a substrate 100, a first conductive layer 1116, a first insulating layer 1117, an auxiliary conductive unit 510, a filling unit 610 and a light emitting device 810.

[0078] In this embodiment, the material of the substrate 100 may include a rigid material, such as glass; or the material of the substrate 100 may include a flexible material, such as polyimide (Pi).

[0079] An array function layer 110 may also be provided on one side of the substrate 100. The array function layer 110 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structure provides signals or voltages for the circuits.

[0080] The first conductive layer 1116 is located on one side of the substrate 100. For example, the first conductive layer 1116 may be a conductive layer on a side of the array functional layer 110 away from the substrate 100.

[0081] The first insulating layer 1117 is located on a side of the first conductive layer 1116 away from the substrate 100, and the first insulating layer 1117 includes at least one first through hole exposing the first conductive layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0082] See also Figure 3The auxiliary conductive unit 510 includes a first conductive part 511 and a second conductive part 512 connected to each other. The first conductive part 511 is located on a side of the first insulating layer 1117 away from the substrate 100, and the second conductive part 512 extends along the first insulating layer 1117 toward the side wall of the first through hole to form a recessed structure 710 in the first through hole and contacts the first conductive layer 1116.

[0083] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection of the auxiliary conductive unit 510 on the substrate 100. The auxiliary conductive unit 510 extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole to contact the first conductive layer 1116. In this case, the auxiliary conductive unit 510 is sunken into the first through hole to form a recessed structure 710.

[0084] At least part of the filling unit 610 is located in the recessed structure 710. In this embodiment, the angle between the side of the filling unit 610 away from the substrate 100 and the plane where the first conductive portion 511 is located is Less than or equal to 5° The first electrode 120 of at least one light emitting device 810 is located on a side of the corresponding auxiliary conductive unit 510 and the filling unit 610 away from the substrate 100 , and at least a portion of the first electrode 120 contacts the auxiliary conductive unit 510 .

[0085] Based on the above design, in the display panel provided in this embodiment, by reducing the angle of the edge of the filling unit 610, the climbing difficulty of the first electrode 120 covering the junction of the auxiliary conductive unit 510 and the filling unit 610 can be reduced, thereby reducing the risk of breakage of the first electrode 120, and can also reduce the risk of uneven light emission caused by the protrusion of the filling unit 610 due to the light-emitting device 810.

[0086] See also Fig.16 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0087] Step S110 , providing a substrate 100 .

[0088] Step S120 , forming a first conductive layer 1116 on one side of the substrate 100 .

[0089] In step S130 , a first insulating layer 1117 is formed on a side of the first conductive layer 1116 away from the substrate 100 , wherein the first insulating layer 1117 includes at least one first through hole exposing the first conductive layer 1116 .

[0090] In step S140, at least one auxiliary conductive unit 510 is formed. The auxiliary conductive unit 510 includes a first conductive part 511 and a second conductive part 512 connected to each other. The first conductive part 511 is located on a side of the first insulating layer 1117 away from the substrate 100. The second conductive part 512 extends along the first insulating layer 1117 toward the side wall of the first through hole to form a recessed structure 710 in the first through hole and contacts the first conductive layer 1116.

[0091] Step S150, forming a filling unit 610 at least partially located in the recessed structure 710; the difference between a first distance H1 from the side of the filling unit 610 away from the substrate 100 to the substrate 100 and a second distance H2 from the side of the first conductive portion 511 away from the substrate 100 to the substrate 100 is less than 0.01 microns.

[0092] Step S160 , forming a first electrode 120 of at least one light emitting device 810 , the first electrode 120 is located on a side of the corresponding auxiliary conductive unit 510 and the filling unit 610 away from the substrate 100 , and at least a portion of the first electrode 120 is in contact with the auxiliary conductive unit 510 .

[0093] In some possible implementations, step S140 may include the following sub-steps.

[0094] In step S141 , a filling material layer 6101 is disposed on a side of the first conductive layer 1116 away from the substrate 100 .

[0095] See also Fig.17 In step S141 , a filling material layer 6101 that covers the entire structure may be provided first. The filling material layer 6101 may have a certain fluidity during the provision process, and at least a portion of the filling material layer 6101 may be filled into the recessed structure 710 .

[0096] Step S142, the filling material layer 6101 is exposed and developed to form a first filling portion 611 and a second filling portion 612, the orthographic projection of the recessed structure 710 on the substrate 100 is located within the orthographic projection of the first filling portion 611 on the substrate 100, the orthographic projection of the second filling portion 612 on the substrate 100 surrounds the orthographic projection of the first filling portion 611 on the substrate 100, and the center area of ​​the first filling portion 611 is recessed toward the substrate 100 relative to the edge area of ​​the first filling portion 611 close to the second filling portion 612. On the side of the second filling portion 612 away from the substrate 100, the distance from the end close to the first filling portion 611 to the substrate 100 is greater than the distance from the end away from the first filling portion 611 to the substrate 100.

[0097] For example, in one possible implementation, see Fig.18The film material of the filling material layer 6101 includes a positive organic resin. In step S142, the filling material layer 6101 can be exposed and developed using the halftone mask 010. The second filling portion 612 corresponds to the opaque area of ​​the halftone mask 010, the first filling portion 611 corresponds to the partially transparent area of ​​the halftone mask 010, and the portion other than the first filling portion 611 and the second filling portion 612 corresponds to the fully transparent area of ​​the halftone mask 010.

[0098] For example, the half-tone mask 010 may include a first mask area 011, a second mask area 012, and a third mask area 013. The second mask area 012 surrounds the first mask area 011, and the third mask area 013 surrounds the second mask area 012. The first mask area 011 is a semi-transparent area, the second mask area 012 is a non-transparent area, and the third mask area 013 is a fully transparent area. When the filling material layer 6101 is exposed, the orthographic projection of the recessed structure 710 on the substrate 100 is located within the orthographic projection of the first mask area 011 on the substrate 100.

[0099] Thus, in the development operation after the exposure process, the filling material layer 6101 corresponding to the third mask area 013 is removed. The filling material layer 6101 corresponding to the second mask area 012 is retained to form a second filling portion 612. The filling material layer 6101 corresponding to the first mask area 011 is partially removed to form a first filling portion 611. Among them, the filling material layer 6101 after exposure and development is generally arc-shaped and convex in a direction away from the substrate 100 compared to the first conductive portion 511 of the auxiliary conductive unit 510, and the top part that should have been convex is concave toward the substrate 100 to form the first filling portion 611, and the second filling portion 612 is formed around the concave part.

[0100] Optionally, the transmittance of the halftone mask 010 corresponding to the first filling portion 611 ranges from 20% to 30%. For example, the transmittance of the halftone mask 010 corresponding to the first filling portion 611 is 25%.

[0101] Step S143 , baking the first filling portion 611 and the second filling portion 612 , so that the first filling portion 611 and the second filling portion 612 are at least partially leveled and solidified.

[0102] See also Fig.19 In step S143, during the baking process of the first filling portion 611 and the second filling portion 612, the fluidity of the first filling portion 611 and the second filling portion 612 will be increased first, so that the first filling portion 611 and the second filling portion 612 will be at least partially leveled, and the height difference between the first filling portion 611 and the second filling portion 612 will be reduced. Subsequently, the first filling portion 611 and the second filling portion 612 will gradually solidify.

[0103] Optionally, in step S143, the filling material layer 6101 may be baked at a baking temperature of 220 degrees Celsius to 250 degrees Celsius for 55 minutes to 65 minutes.

[0104] In step S144 , the first filling portion 611 and the second filling portion 612 are thinned as a whole to remove the second filling portion 612 , and the first filling portion 611 located in the recessed structure 710 is retained to form a filling unit 610 .

[0105] Optionally, in step S144, the first filling portion 611 and the second filling portion 612 may be subjected to an oxygen ashing (Ash) treatment as a whole, and the first filling portion 611 and the second filling portion 612 may be thinned at the same time. By controlling the ashing time, the second filling portion 612 may be completely removed, and only the first filling portion 611 located in the recessed structure 710 may be retained to form a filling unit 610, thereby forming Figure 4 The structure shown.

[0106] Optionally, see Fig. 20 The first conductive portion 511 includes a first sub-region 521 surrounding the first through hole and a second sub-region 522 surrounding the first sub-region 521 , and the orthographic projection of the first sub-region 521 on the substrate 100 is located within the orthographic projection of the filling unit 610 on the substrate 100 .

[0107] In step S144, while the first filling portion 611 and the second filling portion 612 are thinned as a whole, the second sub-region 522 of the auxiliary conductive unit 510 is also ashed, so that the third distance H21 from the side of the first sub-region 521 away from the substrate 100 to the substrate 100 is greater than the fourth distance H22 from the side of the second sub-region 522 away from the substrate 100 to the substrate 100, forming Figure 7 The structure shown.

[0108] That is, during the ashing process in step S144, the exposed auxiliary conductive unit 510 will be slightly thinned due to the ashing process to a certain extent, resulting in a certain height difference between the portion covered by the second filling portion 612 and the portion not covered by the second filling portion 612 in the second conductive portion 512 of the auxiliary conductive unit 510, forming Figure 7 A first sub-region 521 and a second sub-region 522 are shown.

[0109] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0110] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0111] In summary, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the filling unit of the recessed structure embedded in the auxiliary conductive unit to be basically flush with the side of the auxiliary conductive unit away from the substrate, the climbing difficulty of the first electrode covering the junction of the auxiliary conductive unit and the filling unit can be reduced, thereby reducing the risk of the first electrode breaking, and can also reduce the risk of uneven light output due to the protrusion of the filling unit caused by the light-emitting device.

[0112] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0113] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; a first conductive layer located on one side of the substrate; a first insulating layer located at a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer; at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; a filling unit at least partially located in the recessed structure; a difference between a first distance from a side of the filling unit away from the substrate to the substrate and a second distance from a side of the first conductive portion away from the substrate to the substrate being less than 0.01 micrometers; A first electrode of at least one light emitting device, wherein the first electrode is located at a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

2. The display panel according to claim 1, characterized in that: The first conductive portion includes a first sub-region surrounding the first through hole and a second sub-region surrounding the first sub-region, and a third distance from the first sub-region away from the substrate to the substrate is greater than a fourth distance from the second sub-region away from the substrate to the substrate.

3. The display panel according to claim 2, characterized in that: The difference between the third distance and the fourth distance is in the range of 0.005 micrometers; In a direction away from the first through hole, a width of the first sub-region ranges from 0.5 micrometers to 1.5 micrometers.

4. The display panel according to claim 2, characterized in that: The first electrode includes a third sub-region and a fourth sub-region, the orthographic projections of the first sub-region and the filling unit on the substrate are located within the orthographic projection of the third sub-region on the substrate, and the fourth sub-region surrounds the third sub-region; A fifth distance from the side of the third sub-region away from the substrate to the substrate is greater than a sixth distance from the side of the fourth sub-region away from the substrate to the substrate; a difference range between the fifth distance and the sixth distance is 0.005 micrometers.

5. The display panel according to claim 1, characterized in that: The material of the filling unit includes positive organic glue; the material of the auxiliary conductive unit includes indium tin oxide.

6. The display panel according to claim 1, characterized in that: The orthographic projection of the filling unit on the substrate is located within the orthographic projection of the recessed structure on the substrate.

7. The display panel according to claim 1, characterized in that: The display panel further includes: a pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer comprising at least one pixel opening, the pixel opening exposing at least a portion of the first electrode; The orthographic projection of the first through hole on the substrate is located within the orthographic projection of the pixel opening on the substrate.

8. The display panel according to claim 7, characterized in that: The geometric center of the orthographic projection of the recessed structure on the substrate coincides with the geometric center of the orthographic projection of the pixel opening on the substrate.

9. The display panel according to claim 7, characterized in that: The display panel further includes: An isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure enclosing at least one isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the corresponding isolation opening on the substrate; A light-emitting functional layer and a second electrode of the light-emitting device are stacked in a direction away from the substrate, wherein the light-emitting functional layer and the second electrode are located in the isolation opening and on a side of the first electrode away from the substrate; The isolation structure has conductivity, and the second electrode contacts the isolation structure.

10. The display panel according to claim 9, characterized in that: The display panel further comprises a packaging unit located at a side of the light emitting device away from the substrate, at least a portion of the packaging unit is located in the isolation opening; adjacent packaging units are arranged at intervals.

11. The display panel according to claim 10, characterized in that: The display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; the materials of the encapsulation unit and the second encapsulation layer comprise inorganic materials; and the material of the first encapsulation layer comprises organic materials.

12. The display panel according to claim 9, characterized in that: The isolation structure comprises a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, wherein an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate; Under the same etching conditions, the etching resistance of the supporting portion is weaker than that of the shielding portion.

13. The display panel according to claim 12, characterized in that: The isolation structure further includes a receiving portion located between the supporting portion and the substrate; the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; The material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium; the material of the receiving portion includes molybdenum.

14. A display panel, characterized in that: The display panel comprises: substrate; a first conductive layer located on one side of the substrate; a first insulating layer located at a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer; at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; A filling unit at least partially located in the recessed structure; an angle between a side of the filling unit away from the substrate and a plane where the first conductive portion is located is less than or equal to 5°; A first electrode of at least one light emitting device, wherein the first electrode is located at a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

15. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; forming a first conductive layer on one side of the substrate; forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises at least one first through hole exposing the first conductive layer; forming at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first conductive portion and a second conductive portion connected to each other, the first conductive portion being located on a side of the first insulating layer away from the substrate, and the second conductive portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; forming a filling unit at least partially located in the recessed structure; a difference between a first distance from a side of the filling unit away from the substrate to the substrate and a second distance from a side of the first conductive portion away from the substrate to the substrate is less than 0.01 micrometers; A first electrode of at least one light emitting device is formed, wherein the first electrode is located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, and at least a portion of the first electrode is in contact with the auxiliary conductive unit.

16. The method according to claim 15, characterized in that The step of forming a filling unit at least partially located in the recessed structure comprises: Disposing a filling material layer on a side of the first conductive layer away from the substrate, wherein the filling material layer is at least partially filled into the recessed structure; The filling material layer is exposed and developed to form a first filling portion and a second filling portion, wherein the orthographic projection of the recessed structure on the substrate is located within the orthographic projection of the first filling portion on the substrate, and the orthographic projection of the second filling portion on the substrate surrounds the orthographic projection of the first filling portion on the substrate; the central area of ​​the first filling portion is recessed toward the substrate relative to the edge area of ​​the first filling portion close to the second filling portion; the distance from one end of the second filling portion on a side away from the substrate close to the first filling portion to the substrate is greater than the distance from one end away from the first filling portion to the substrate; Baking the first filling part and the second filling part to make them at least partially leveled and solidified, so as to reduce the difference between the distance from different positions of the first filling part away from the substrate and the substrate and the distance from different positions of the second filling part away from the substrate and the substrate; The first filling portion and the second filling portion are thinned as a whole to remove the second filling portion, and the first filling portion located in the recessed structure is retained to form the filling unit.

17. The method according to claim 16, characterized in that The film material of the filling material layer includes a positive organic resin; the step of exposing and developing the filling material layer includes: The filling material layer is exposed and developed using a halftone mask, wherein the second filling portion corresponds to an opaque area of ​​the halftone mask, the first filling portion corresponds to a partially translucent area of ​​the halftone mask, and the portion other than the first filling portion and the second filling portion corresponds to a fully translucent area of ​​the halftone mask.

18. The method according to claim 16, characterized in that The second conductive portion includes a first sub-region surrounding the first through hole and a second sub-region surrounding the first sub-region, and an orthographic projection of the first sub-region on the substrate is located within an orthographic projection of the filling unit on the substrate; The step of thinning the first filling portion and the second filling portion as a whole further includes: The second sub-region is subjected to an ashing process so that a third distance from a side of the first sub-region away from the substrate to the substrate is greater than a fourth distance from a side of the second sub-region away from the substrate to the substrate.

19. The method according to claim 16, characterized in that The step of thinning the first filling portion and the second filling portion as a whole comprises: The first filling part and the second filling part are subjected to an overall oxygen ashing treatment.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 14, or the electronic device comprises a display panel manufactured by the method for manufacturing a display panel according to any one of claims 15 to 19.

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