Photodetector, electronic device, and optical element

Abstract

A light detector is provided. The light detector includes a light guide including a structure having a first portion having a size equal to or smaller than a wavelength of incident light and a second portion disposed below the first portion. A first material is disposed adjacent the first portion and has a different refractive index than the refractive index of the structure and a second material is disposed adjacent the second portion and has a different refractive index than the refractive index of the structure. The first photoelectric converter photoelectrically converts the light emitted through the light guide. The first portion is in contact with the second portion.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of Japanese Priority Patent Application JP2022-175800 filed on Nov. 1, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a light detector, an electronic device and an optical element. Background Art

[0003] A meta-optical element including a plurality of nanostructures and a peripheral material having a refractive index different from that of the plurality of nanostructures has been proposed (PTL 1). Citation list Patent Literature

[0004] PTL 1: Japanese Unexamined Patent Application Publication No. 2021-140152 Summary of the invention Technical issues

[0005] For devices that detect light, it is desirable to improve detection performance.

[0006] It is desirable to provide a light detector having good detection performance. Solutions to technical problems

[0007] A photodetector according to an embodiment of the present disclosure includes: a light guide having a structure including a first portion having a size equal to or smaller than a wavelength of incident light and a second portion disposed below the first portion, a first material disposed adjacent to the first portion and having a refractive index different from that of the structure, and a second material disposed adjacent to the second portion and having a refractive index different from that of the structure; and a first photoelectric conversion portion that performs photoelectric conversion on light incident via the light guide. The first portion is in contact with the second portion. An electronic device according to an embodiment of the present disclosure includes an optical system, and a photodetector that receives light transmitted through the optical system. The photodetector includes: a light guide having a structure of a first portion having a size equal to or smaller than the wavelength of incident light and a second portion disposed below the first portion, a first material disposed adjacent to the first portion and having a refractive index different from that of the structure, and a second material disposed adjacent to the second portion and having a refractive index different from that of the structure; and a photoelectric conversion portion that performs photoelectric conversion on light incident through the light guide. The first portion is in contact with the second portion. An optical element according to an embodiment of the present disclosure includes: a structure having a first portion having a size equal to or smaller than a wavelength of incident light and a second portion disposed below the first portion; a first material disposed adjacent to the first portion and having a refractive index different from that of the structure; and a second material disposed adjacent to the second portion and having a refractive index different from that of the structure. The first portion contacts the second portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] [ Figure 1 ] Figure 1 : is a block diagram showing an example of a schematic configuration of an imaging device as an example of a photodetector according to an embodiment of the present disclosure. [ Figure 2 ] Figure 2 is a diagram showing an example of arrangement of pixels of an imaging device according to an embodiment of the present disclosure. [ Figure 3 ] Figure 3 is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 4A ] Figure 4A is a diagram illustrating an example of a planar configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 4B ] Figure 4B is a diagram illustrating an example of a planar configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 4C ] Figure 4C is a diagram illustrating an example of a planar configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 5 ] Figure 5 is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to an embodiment of the present disclosure. [ Fig. 6A ] Fig. 6A is a diagram illustrating an example of a planar configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 6B ] Figure 6B is a diagram illustrating another example of the planar configuration of the imaging device according to the embodiment of the present disclosure. [ Fig. 7A ] Fig. 7A is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 7B ] Figure 7B is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 7C] Figure 7C is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Fig.7D ] Fig.7D is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Fig. 7E ] Fig. 7E is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 7F ] Figure 7F is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 7G ] Figure 7G is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 7H ] Figure 7H is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Fig.7I ] Fig.7I is a diagram illustrating an example of a method of manufacturing a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 8 ] Figure 8 1 is a diagram illustrating an example of a cross-sectional configuration of a light guide portion of an imaging device according to Modification 1 of the present disclosure. [ Fig. 9 ] Fig. 9 1 is a diagram illustrating an example of a cross-sectional configuration of a light guide portion of an imaging device according to Modification 1 of the present disclosure. [ Fig. 10A ] Fig. 10A It is an explanatory diagram of an example of a planar configuration of a light guide portion of an imaging device according to Modification 1 of the present disclosure. [ Fig. 10B ] Fig. 10B It is an explanatory diagram of another example of the planar configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig. 10C ] Fig. 10C It is an explanatory diagram of another example of the planar configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig.11A ] Fig.11A 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig. 11B ] Fig. 11B1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig. 12A ] Fig. 12A 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig. 12B ] Fig. 12B 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 1 of the present disclosure. [ Fig.13A ] Fig.13A : is a diagram showing an example of a cross-sectional configuration of a light guide portion of an imaging device according to Modification 2 of the present disclosure. [ Fig. 13B ] Fig. 13B 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 2 of the present disclosure. [ Fig.14 ] Fig.14 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 2 of the present disclosure. [ Fig.15 ] Fig.15 : is a diagram showing an example of a cross-sectional configuration of a light guide portion of an imaging device according to Modification 3 of the present disclosure. [ Fig.16 ] Fig.16 1 is a diagram showing another example of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 3 of the present disclosure. [ Fig.17 ] Fig.17 It is an explanatory diagram of an example of a planar configuration of a light guide portion of an imaging device according to Modification 3 of the present disclosure. [ Fig.18 ] Fig.18 : is a diagram showing an example of a cross-sectional configuration of an imaging device according to Modification 4 of the present disclosure. [ Fig.19 ] Fig.19 is a block diagram showing a configuration example of an electronic device including an imaging device. [ Fig. 20 ] Fig. 20 is a block diagram showing an example of a schematic configuration of a vehicle control system. [ Fig.21 ] Fig.21 1 is a diagram for explaining an example of the installation positions of the vehicle exterior information detection unit and the imaging unit. [ Fig. 22 ] Fig. 22 : is a diagram showing an example of a schematic configuration of an endoscopic surgery system. [ Fig.23 ] Fig.23is a block diagram showing an example of the functional configuration of a camera head and a camera control unit (CCU). DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that the description will be given in the following order. 1. Implementation Plan 2. Modifications 3. Application examples 4. Application examples <1. Implementation Plan>

[0010] Figure 1 1 is a block diagram showing an example of a schematic configuration of an imaging device as an example of a photodetector according to an embodiment of the present disclosure. A photodetector is a device capable of detecting incident light. An imaging device 1 as a photodetector can receive light transmitted through an optical system to generate a signal. The imaging device 1 (photodetector) includes a plurality of pixels P, each pixel P including a photoelectric conversion unit and configured to perform photoelectric conversion on incident light to generate a signal.

[0011] The photoelectric conversion section of each pixel P of the imaging device 1 is, for example, a photodiode, and is configured to be able to perform photoelectric conversion on light. The imaging device 1 includes a region (pixel section 100) as an imaging region, in which a plurality of pixels P are two-dimensionally arranged in a matrix manner. The pixel section 100 is a pixel array in which a plurality of pixels P are arranged, and can also be referred to as a light receiving region.

[0012] The imaging device 1 receives incident light (image light) from a subject via an optical system (not shown) including an optical lens. The imaging device 1 captures an image of the subject formed by the optical lens. The imaging device 1 can perform photoelectric conversion on the received light to generate a pixel signal. For example, the imaging device 1 is a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The imaging device 1 can be used in electronic devices such as digital cameras, video cameras, or mobile phones.

[0013] like Figure 1 In the example shown, the imaging device 1 includes, for example, a pixel driving section 111, a signal processing section 112, a control section 113, a processing section 114, etc. in the peripheral area of ​​the pixel section 100 (pixel array). In addition, the imaging device 1 is provided with a plurality of control lines L1 and a plurality of signal lines L2.

[0014] The imaging device 1 is provided with a control line L1, which is a signal line capable of transmitting a signal to control the pixel P. In the pixel portion 100, for example, a plurality of control lines L1 are wired for each pixel row composed of a plurality of pixels P arranged in a horizontal direction (row direction). The control line L1 is configured to transmit a control signal to read a signal from the pixel P. The control line L1 may be referred to as a pixel driving line that transmits a signal to drive the pixel P.

[0015] In addition, the imaging device 1 is provided with a signal line L2 which is a signal line capable of transmitting a signal from the pixel P. In the pixel section 100, for example, the signal line L2 is wired for each pixel column composed of a plurality of pixels P arranged in a vertical direction (column direction). The signal line L2 is a vertical signal line and is configured to transmit a signal output from the pixel P.

[0016] The pixel driving section 111 is composed of a shift register, an address decoder, etc. The pixel driving section 111 is configured to be able to drive each pixel P of the pixel section 100. The pixel driving section 111 generates a signal for controlling the pixel P and outputs the signal to each pixel P of the pixel section 100 via a control line L1.

[0017] For example, the pixel driving section 111 generates a signal for controlling a transfer transistor of the pixel P, a signal for controlling a reset transistor, and the like, and provides the signal to each pixel P through the control line L1. The pixel driving section 111 may perform control to read out a pixel signal from each pixel P. The pixel driving section 111 may also be referred to as a pixel control section configured to be able to control each pixel P.

[0018] The signal processing unit 112 is configured to be able to perform signal processing on the input pixel signal. The signal processing unit 112 includes, for example, a load circuit unit, an analog-to-digital (AD) conversion unit, a horizontal selection switch, etc. The signal output from each pixel P selected and scanned by the pixel driving unit 111 is input to the signal processing unit 112 via the signal line L2. The signal processing unit 112 can perform signal processing such as correlated double sampling (CDS) and AD conversion on the signal of the pixel P. The signal of each pixel P transmitted through each signal line L2 is subjected to signal processing by the signal processing unit 112 and output to the processing unit 114.

[0019] The processing unit 114 is configured to be able to perform signal processing on the input signal. The processing unit 114 is composed of, for example, a circuit that performs various signal processing on the pixel signal. The processing unit 114 may include a processor and a memory. The processing unit 114 performs signal processing on the pixel signal input from the signal processing unit 112, and outputs the processed pixel signal. For example, the processing unit 114 may perform various types of signal processing such as noise reduction processing or grayscale correction processing.

[0020] The control section 113 is configured to control each section of the imaging device 1. The control section 113 can receive a clock signal provided from the outside, command data of an operation mode, etc., and output data such as internal information of the imaging device 1. The control section 113 includes a timing generator configured to generate various timing signals. The control section 113 drives peripheral circuits such as the pixel driving section 111 and / or the signal processing section 112 based on the various timing signals (pulse signals, clock signals, etc.) generated by the timing generator. It should be noted that the control section 113 and the processing section 114 can be integrally configured.

[0021] The pixel driving section 111 , the signal processing section 112 , the control section 113 , the processing section 114 and the like may be provided in one semiconductor substrate or may be provided in a plurality of semiconductor substrates respectively. The imaging device 1 may have a structure constituted by stacking a plurality of substrates (stacked structure).

[0022] Figure 2 1 is a diagram showing an example of the arrangement of pixels of an imaging device according to the embodiment. The pixel P of the imaging device 1 includes a color filter 25. In addition, as described later, the pixel P includes a light guide portion 50 formed using a structure 30. It should be noted that Figure 2 As shown, the incident direction of light from the subject is defined as the Z-axis direction; the left-right direction on the plane that is orthogonal to the Z-axis direction is defined as the X-axis direction; and the up-down direction on the plane that is orthogonal to the Z-axis and the X-axis is defined as the Y-axis direction. Figure 2 The direction of the arrow in can be used as a standard to indicate direction in some cases.

[0023] The color filter 25 is configured to selectively transmit light of a specific wavelength in the incident light. The plurality of pixels P provided in the pixel section 100 of the imaging device 1 include a plurality of pixels Pr, a plurality of pixels Pg, and a plurality of pixels Pb, each pixel Pr being provided with a color filter 25 that transmits light having a red (R) light wavelength, each pixel Pg being provided with a color filter 25 that transmits light having a green (G) light wavelength, and each pixel Pb being provided with a color filter 25 that transmits light having a blue (B) light wavelength.

[0024] In the pixel portion 100, as Figure 2 In the example shown, a plurality of pixels Pr, a plurality of pixels Pg, and a plurality of pixels Pb are repeatedly arranged. The pixels Pr, the pixels Pg, and the pixels Pb are arranged according to the Bayer array. The pixels Pr, the pixels Pg, and the pixels Pb generate pixel signals of the R component, the G component, and the B component, respectively. The imaging device 1 can obtain RGB pixel signals.

[0025] It should be noted that the color filter 25 provided for the pixel P of the pixel unit 100 is not limited to the color filter of the three primary color system (RGB), but may also be a color filter of a complementary color system such as cyan (Cy), magenta (Mg) or yellow (Ye). In the pixel P that receives white light (W) for photoelectric conversion, the color filter 25 may not be provided. In addition, a color filter corresponding to W (white) may be configured, that is, a filter that can transmit light beams of all wavelengths in the incident light. It should be noted that the color filter 25 may be omitted as needed. For example, depending on the characteristics of the light guide unit 50, the color filter 25 may not be provided in some or all of the pixels P of the imaging device 1.

[0026] Figure 3 is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to the embodiment. FIG. 4A to FIG. 4C Each of them is a diagram showing an example of a planar configuration of an imaging device according to the embodiment. Figure 3 As shown, the imaging device 1 includes, for example, a light guide portion 50, a transparent layer 20 ( Figure 3 In the figure, the transparent layer 20a and the transparent layer 20b), the color filter 25, the light receiving unit 10 and the multilayer wiring layer 90 are stacked in the Z-axis direction. Figure 3 In the illustrated example, the pixel P includes a photoelectric conversion portion 12 .

[0027] Figure 3 The light receiving section 10 shown includes a semiconductor substrate 11 having a first surface 11S1 and a second surface 11S2 opposite to each other. The semiconductor substrate 11 is composed of, for example, a silicon substrate. A color filter 25, a light guide 50, etc. are provided on the first surface 11S1 of the semiconductor substrate 11. A multilayer wiring layer 90 is provided on the second surface 11S2 of the semiconductor substrate 11. The light guide 50, the color filter 25, etc. are provided on the side where light from the optical system is incident, and the multilayer wiring layer 90 is provided on the side opposite to the side where light is incident. The imaging device 1 is a so-called back-illuminated imaging device.

[0028] In the light receiving section 10, a plurality of photoelectric conversion sections 12 are provided between a first surface 11S1 and a second surface 11S2 of a semiconductor substrate 11. For example, a plurality of photoelectric conversion sections 12 are embedded and formed in the semiconductor substrate 11. The photoelectric conversion section 12 is configured to be able to generate charges by photoelectric conversion. The photoelectric conversion section 12 is a photodiode (PD) and converts incident light into charges. The photoelectric conversion section 12 performs photoelectric conversion to generate charges corresponding to the amount of light received.

[0029] The multilayer wiring layer 90 has a configuration in which, for example, a plurality of wirings are stacked with an interlayer insulating layer (interlayer insulating film) therebetween. The wiring layer of the multilayer wiring layer 90 is formed using, for example, aluminum (Al), copper (Cu), etc. The wiring layer can be formed using polycrystalline silicon (Poly-Si). For example, the interlayer insulating layer is formed using silicon oxide (SiOx), silicon nitride (SiNx), silicon nitride oxide (SiOxNy), etc.

[0030] The semiconductor substrate 11 and the multilayer wiring layer 90 are provided with a readout circuit 18 (not shown) configured to be able to output a pixel signal based on the charge generated by the photoelectric conversion section 12. It should be noted that the above-mentioned pixel driving section 111, signal processing section 112, control section 113 and processing section 114 may be formed in a substrate different from the semiconductor substrate 11, or formed in the semiconductor substrate 11 and the multilayer wiring layer 90.

[0031] The readout circuit of the pixel P includes, for example, a transfer transistor, a floating diffusion (FD), a reset transistor, an amplifier transistor, etc. The readout circuit is configured to be able to read out a pixel signal based on the charge converted by the photoelectric converter 12 to the signal line L2 as the above-mentioned vertical signal line.

[0032] The pixel driving unit 111 (see Figure 1 ) controls the readout circuit of each pixel P so that each pixel P outputs a pixel signal to the signal line L2. The pixel driving unit 111 can perform control to read out the pixel signal of each pixel P to the signal line L2. It should be noted that the pixel driving unit 111 and the control unit 113 can also be collectively referred to as a pixel control unit.

[0033] Transparent layer 20( Figure 3 The transparent layer 20a and the transparent layer 20b in the embodiment transmit light and are formed of a low refractive index material such as silicon oxide (SiOx) or silicon nitride (SiNx). The transparent layer 20a and the transparent layer 20b may be respectively formed of another transparent material that transmits light.

[0034] The light guide portion 50 includes the structure 30 and is configured to guide incident light to the light receiving portion 10. Light from the object to be measured is incident on the light guide portion 50. Figure 3 As shown, the structure 30 is a fine (micro) structure and includes a first portion 31 and a second portion 32 disposed below the first portion 31. The first portion 31 is in contact with the second portion 32. It should be noted that the term "contact" used herein includes the case of direct contact and also includes the case of contact through a natural oxide film, etc. The term "the first portion 31 is in contact with the second portion 32" includes the case of contacting through a natural oxide film and also includes the case of contacting the first portion 31 and the second portion 32 through a thin natural oxide film. As shown in Figure 3In the example shown, the first portion 31 and the second portion 32 are arranged in contact with each other.

[0035] like Figure 3 In the example shown, the first portion 31 and the second portion 32 are continuously provided. In addition, the structure also includes a material (first member 41) provided adjacent to the first portion 31 and a material (second member 42) provided adjacent to the second portion 32. The light guide 50 has a stacked structure in which the first member 41 and the second member 42 are stacked.

[0036] The first portion 31 and the second portion 32 of the structure 30 are both fine structures, whose size is equal to or smaller than the predetermined wavelength of the incident light, and for example, whose size is equal to or smaller than the wavelength of visible light. It should be noted that the size of the first portion 31 and the second portion 32 can be respectively equal to or smaller than the wavelength of infrared light.

[0037] The light guide 50 is an optical element (optical member) that guides (propagates) light. The light guide 50 (light guide member) propagates light to the photoelectric conversion unit 12 using the structure 30 as a fine structure. As described later, the light guide 50 according to the present embodiment also serves as a light splitting unit (spectrometer) and is configured to disperse incident light. The light guide 50 is provided for each pixel P or for each plurality of pixels P.

[0038] like Figure 3 As shown, the structure 30 is, for example, a columnar (pillar-shaped) structure. Figure 3 As schematically shown, the plurality of structures 30 are arranged side by side in the left-right direction (X-axis direction) on a plane. In each pixel P of the imaging device 1, the plurality of structures 30 may be arranged at intervals equal to or less than a predetermined wavelength of incident light, for example, at intervals equal to or less than the wavelength of visible light.

[0039] The first portions 31 of the plurality of structures 30 are arranged side by side in the left-right direction (X-axis direction) with the first member 41 interposed therebetween. It can also be said that the first portion 31 is provided in the first member 41 and is arranged to partially replace the first member 41. The second portions 32 of the plurality of structures 30 are arranged side by side in the left-right direction (X-axis direction) with the second member 42 interposed therebetween. It can also be said that the second portion 32 is provided in the second member 42 and is arranged to partially replace the second member 42.

[0040] The refractive index of the structure 30 is different from the refractive index of the surrounding material. Figure 3 In the example shown, the refractive index of the structure 30 is different from the refractive index of the first member 41 and the second member 42 which are the materials surrounding the structure 30. The refractive index of the first portion 31 of the structure 30 is different from the refractive index of the first member 41. In addition, the refractive index of the second portion 32 of the structure 30 is different from the refractive index of the second member 42.

[0041] For example, the refractive index of the first portion 31 of the structure 30 may be higher than that of the first member 41. The refractive index of the second member 32 of the structure 30 may be higher than that of the second member 42. The structure 30 may be made of a material having a higher refractive index than that of the first member 41 and the second member 42.

[0042] In addition, for example, the refractive index of the first portion 31 may be lower than that of the first member 41. The refractive index of the second portion 32 may be lower than that of the second member 42. The structure 30 may be composed of a material having a refractive index lower than that of the first member 41 and the second member 42.

[0043] As an example, the structure 30 is formed using silicon, a silicon compound (silicon nitride, silicon carbide, silicon oxynitride, etc.), etc. In addition, the structure 30 may also be formed using amorphous silicon (a-Si), polycrystalline silicon, germanium (Ge), etc.

[0044] The structure 30 may be composed of simple substances such as oxides, nitrides, oxynitrides, or composite materials such as titanium, hafnium, zirconium, tantalum, aluminum, niobium, indium, etc. In addition, the structure 30 may also be composed of organic substances such as siloxane. For example, the structure 30 may be composed of siloxane-based resins, styrene-based resins, acrylic-based resins, etc.

[0045] The first member 41 and the second member 42 may be composed of simple substances such as oxides, nitrides, oxynitrides, or composite materials of silicon, titanium, hafnium, zirconium, tantalum, aluminum, niobium, indium, etc. In addition, the first member 41 and the second member 42 may be composed of organic substances such as siloxane.

[0046] For example, the first member 41 and the second member 42 may be respectively made of a siloxane-based resin, a styrene-based resin, an acrylic-based resin, etc. The first member 41 and the second member 42 may be made of different materials or the same type of materials. It should be noted that the structure 30, the first member 41 and the second member 42 may be partially made of air (e.g., an air gap).

[0047] The light guide 50 causes a phase delay of the incident light due to the difference between the refractive index of the structure 30 and the refractive index of the surrounding material, which may affect the wavefront. The light guide 50 provides different phase delay amounts in response to the wavelength of the light, thereby adjusting the direction of light propagation, so that the incident light can be separated into light beams of corresponding wavelengths.

[0048] The size, shape, refractive index, etc. of each structure 30 are determined to allow light of each wavelength contained in the incident light to propagate in a desired direction. Figure 3 In the example shown, the size, shape, refractive index, etc. of each of the first portion 31 and the second portion 32 of the structure 30 may be adjusted.

[0049] The light guide portion 50 (beam splitter) is a beam splitting element capable of splitting light using metamaterial (metasurface) technology, and may also be referred to as a separator (color separator). The imaging device 1 may also be referred to as having a color separator structure.

[0050] The direction in which the light guide 50 propagates light of each wavelength is adjusted by the materials (optical constants) of the structure 30, the first member 41, the second member 42, etc., and the shape, height, arrangement interval (gap), etc. of the structure 30. The light guide 50 can also be called the region (spectral region) where the structure 30 disperses the incident light.

[0051] The light guide portion 50 is a light splitting portion configured to disperse incident light. The light guide portion 50 provides light beams of multiple wavelengths, for example, light beams of the first wavelength to the third wavelength having respective different phase delays. This enables the imaging device 1 to disperse the light incident on the light guide portion 50 into light of the first wavelength (for example, light of the red wavelength), light of the second wavelength (for example, light of the green wavelength), and light of the third wavelength (for example, light of the blue wavelength).

[0052] The light guide portion 50 of the pixel Pg is configured to propagate incident light having a green (G) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pg, and propagate incident light having a red (R) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pr. The light guide portion 50 of the pixel Pg also separates the incident light to guide the incident light having a red wavelength to the pixel Pr.

[0053] Furthermore, the light guide 50 of the pixel Pg is configured to propagate incident light having a blue (B) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pb. The light guide 50 of the pixel Pg also separates the incident light to guide the incident light having a blue wavelength to the pixel Pb.

[0054] The light guide portion 50 of the pixel Pr is configured to propagate incident light having a red (R) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pr, and propagate incident light having a green (G) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pg. The light guide portion 50 of the pixel Pr also separates the incident light to guide the incident light having a green wavelength to the pixel Pg.

[0055] Furthermore, the light guide 50 of the pixel Pr is configured to propagate incident light having a blue (B) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pb. The light guide 50 of the pixel Pr also separates the incident light to guide the incident light having a blue wavelength to the pixel Pb.

[0056] The light guide portion 50 of the pixel Pb is configured to propagate incident light having a blue (B) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pb, and propagate incident light having a green (G) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pg. The light guide portion 50 of the pixel Pb also separates the incident light to guide the incident light having a green wavelength to the pixel Pg.

[0057] Furthermore, the light guide 50 of the pixel Pb is configured to propagate incident light having a red (R) wavelength to the color filter 25 and the photoelectric converter 12 of the pixel Pr. The light guide 50 of the pixel Pb also separates the incident light to guide the incident light having a red wavelength to the pixel Pr.

[0058] Therefore, if Figure 4A As schematically shown by the arrows in , a plurality of pixels around the pixel Pr guide incident light having a red wavelength to the pixel Pr. The incident light having a red wavelength on the pixel Pr and the incident light having a red wavelength on each of the surrounding pixels of the pixel Pr can be focused on the color filter 25 of the pixel Pr and the photoelectric converter 12. The photoelectric converter 12 of the pixel Pr effectively receives the incident light having a red wavelength for photoelectric conversion, thereby being able to generate charges corresponding to the amount of received light.

[0059] like Figure 4B As schematically shown by the arrows in , a plurality of pixels around the pixel Pg guide incident light having a green wavelength to the pixel Pg. The incident light having a green wavelength on the pixel Pg and the incident light having a green wavelength on each of the surrounding pixels of the pixel Pg can be focused on the color filter 25 of the pixel Pg and the photoelectric converter 12. The photoelectric converter 12 of the pixel Pg effectively receives the incident light having a green wavelength for photoelectric conversion, thereby being able to generate a charge corresponding to the amount of received light.

[0060] In addition, if Figure 4C As schematically shown by the arrows in , a plurality of pixels around the pixel Pb guide incident light having a blue wavelength to the pixel Pb. The incident light having a blue wavelength on the pixel Pb and the incident light having a blue wavelength on each of the surrounding pixels of the pixel Pb can be focused on the color filter 25 of the pixel Pb and the photoelectric converter 12. The photoelectric converter 12 of the pixel Pb effectively receives the incident light having a blue wavelength for photoelectric conversion, thereby being able to generate a charge corresponding to the amount of received light.

[0061] In this way, the imaging device 1 can effectively receive more light into the pixel P, thereby improving the quantum efficiency (QE). It should be noted that, for example, the structure 30 of each light guide portion 50 of the above-mentioned pixel Pr, pixel Pg and pixel Pb can be formed to have different sizes, shapes, etc.

[0062] In the imaging device 1 according to the present embodiment, as described above, the light guide portion 50 is formed by using a layer in which the first portion 31 and the first member 41 are provided and a layer in which the second portion 32 and the second member 42 are provided. The light guide portion 50 is allowed to have a stacked structure, so that the shape of the structure 30 can be finely controlled. This allows the height of the imaging device 1 to be reduced, thereby being able to effectively suppress the degradation of the spectral characteristics in the case of oblique incident light. In addition, it is also possible to form a light guide portion 50 having a topological three-dimensional (3D) shape.

[0063] When manufacturing the imaging device 1, the first member 41 and the second member 42 serve as etching stoppers, thereby improving the processing controllability of the structure 30. This also makes it possible to process the structure 30 into a non-tapered shape (e.g., a shape without an inclined portion). The designed cross-sectional structure can be processed.

[0064] Figure 5 An example of the cross-sectional configuration of the light guide portion in a region where the distance from the center of the pixel portion 100 (pixel array) of the imaging device 1 (i.e., image height) is high is shown. Fig. 6A and Figure 6B Examples of the planar configurations of the first portion 31 of the light guide portion 50 and the second portion 32 of the light guide portion 50 in the region where the image height is high are respectively shown.

[0065] Light from the optical lens is incident substantially vertically on the central portion of the pixel portion 100 of the imaging device 1. Figure 5 In the example shown by the white arrow in FIG. 1 , oblique incident light is supplied to the peripheral area outward from the central portion, that is, to the area away from the center of the pixel unit 100. Therefore, in the imaging device 1, as shown in FIG. Figure 5 and Fig. 6A and Figure 6B As shown, the positions of the first and second portions 31 and 32 of the light guide section 50 , the color filter 25 , the photoelectric converter 12 , etc. in each pixel P are configured to differ according to the distance from the center of the pixel section 100 (ie, image height).

[0066] like Figure 5 as well as Fig. 6A and Figure 6B As shown, the first portion 31 of the light guide portion 50 of the pixel P is arranged to be shifted toward the center of the pixel portion 100 relative to the second portion 32 of the light guide portion 50 of the pixel P. The second portion 32 of the light guide portion 50 of the pixel P can also be referred to as being shifted toward the end of the pixel portion 100 relative to the first portion 31 of the light guide portion 50 of the pixel P.

[0067] exist Figure 5In the example shown, the first portion 31 of the light guide 50 is arranged to be shifted leftward on the plane relative to the second portion 32 of the light guide 50. The second portion 32 of the light guide 50 may also be said to be shifted rightward on the plane relative to the first portion 31 of the light guide 50.

[0068] It should be noted that in the central area of ​​the pixel section 100 (pixel array), the pixels P are configured as described above. Figure 2 and Figure 3 In the pixel P at the center of the pixel portion 100, as shown in FIG. Figure 3 As shown, the center positions of the first portion 31 and the second portion 32 of the light guide portion 50 substantially coincide with each other. In addition, the center positions of the color filter 25 and the photoelectric conversion portion 12 substantially coincide with each other.

[0069] Therefore, in the imaging device 1, the positions of the first portion 31, the second portion 32, etc. of the light guide portion 50 can be adjusted according to the image height, so that pupil correction can be performed appropriately. This can suppress the reduction in the amount of light incident on the photoelectric conversion portion 12, thereby preventing the sensitivity to the incident light from being reduced. Even in the case of oblique incident light, the incident light can be appropriately transmitted to the photoelectric conversion portion 12.

[0070] 7A to 7I 1 and 2 are diagrams showing an example of a method for manufacturing a light guide portion of an imaging device according to an embodiment of the present invention. Fig. 7A As shown in FIG. 4 , a resist film 61 is formed on the second member 42 by photolithography and etching. Figure 7B As shown, a portion of the second member 42 is removed by dry etching. Then, as shown in FIG. Figure 7C As shown, a titanium oxide film (TiO film) is formed as the second portion 32 of the structure 30 .

[0071] Next, if Fig.7D As shown in FIG. 1 , the excess titanium oxide film is removed by chemical mechanical polishing (CMP). Fig. 7E As shown, the first member 41 is formed on the second member 42. Then, as shown in FIG. Figure 7F As shown, a resist film 62 is formed by photolithography and etching.

[0072] Next, if Figure 7G As shown in FIG. 4 , a portion of the first member 41 is removed by dry etching. Figure 7H As shown in FIG. 1 , a titanium oxide film (TiO film) is formed on the second member 42 as the first portion 31 of the structure 30. Then, as shown in FIG. Fig.7I As shown, the excess titanium oxide film is removed by CMP treatment. Figure 3 The light guide portion 50 shown, etc. It should be noted that the above manufacturing method is only exemplary, and other manufacturing methods can also be used. [Function and Effect]

[0073] The photodetector according to the present embodiment includes a light guide (light guide 50), the light guide includes a structure (structure 30), the structure 30 includes a first portion (first portion 31) having a size equal to or smaller than the wavelength of incident light and a second portion (second portion 32) disposed below the first portion. A first material (first member 41) is disposed adjacent to the first portion, and its refractive index is different from that of the structure, and a second material (second member 42) is disposed adjacent to the second portion, and its refractive index is different from that of the structure. A first photoelectric conversion portion (photoelectric converter 12) performs photoelectric conversion on light incident via the light guide. The first portion is in contact with the second portion.

[0074] The photodetector (imaging device 1) according to the present embodiment is provided with a light guide portion 50 including a structure 30 having a first portion 31 and a second portion 32 and a first member 41 and a second member 42. Allowing the light guide portion 50 to have a laminated structure makes it possible to control the shape of the structure 30, thereby suppressing a decrease in sensitivity to oblique incident light. In this way, a photodetector having good detection performance can be realized.

[0075] In this embodiment, the first part and the second part of the structure 30 are arranged to be in contact with each other. Therefore, the controllability of light can be improved. In addition, compared with the case where the first part and the second part are arranged separately, the number of manufacturing steps can be reduced, thereby preventing the manufacturing cost of the imaging device 1 from increasing.

[0076] Next, a modification of the present disclosure will be described. Hereinafter, components similar to those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be appropriately omitted. <2. Modifications> (2-1. Modification 1)

[0077] Figure 8 1 is a diagram showing an example of a cross-sectional structure of a light guide portion of an imaging device according to a modification example 1 of the present disclosure. The light guide portion 50 may be formed using a plurality of first portions 31a and second portions 32, and a plurality of first members 41 and second members 42. For example, Figure 8 In the illustrated example, the light guide portion 50 may have a configuration in which a layer provided with the first portion 31a and the first member 41a, a layer provided with the second portion 32 and the second member 42, and a layer provided with the first portion 31b and the first member 41b are stacked.

[0078] Fig. 9 An example of the cross-sectional configuration of the light guide portion 50 of the pixel P in the region where the image height is high is shown. Figure 10A-10(C) shows an example of the planar configuration of the first portion 31a of the light guide portion 50a, the second portion 32 of the light guide portion 50, and the first portion 31b of the light guide portion 50b in a region where the image height is high.

[0079] like Fig. 9 and Figures 10A-10C In the example shown, the first portion 31a, the second portion 32, and the first portion 31b can be arranged in a shifted manner according to the image height. The center position of the first portion 31a, the center position of the second portion 32, and the center position of the first portion 31b are different from each other in a manner corresponding to the incident direction from the subject. In this modification, the three layers of the light guide 50 can appropriately guide oblique incident light.

[0080] like Fig.11A As shown, the light guide portion 50 may be formed using first portions 31a to 31d, second portions 32a to 32c, first members 41a to 41d, and second members 42a to 42c. Fig. 11B As shown, in a region away from the center of the pixel portion 100, each of the first portions 31a to 31d and the second portions 32a to 32c may be arranged to be shifted in a manner corresponding to the direction of incident light. It should be noted that the first portions 31a to 31d and the second portions 32a to 32c of the structure 30 may have a tapered shape, such as Fig. 12A and / or Fig. 12B shown. (2-2. Modification 2)

[0081] The parts constituting the structure 30, for example, the first part 31 and the second part 32 may have different sizes (height (thickness), width, etc.). In addition, the material surrounding the structure 30, for example, the first member 41 and the second member 42 may have different sizes (thickness, width, etc.).

[0082] Fig.13A and Fig. 13B 1 and 2 are diagrams showing examples of the cross-sectional configuration of the light guide portion of the imaging device according to Modification 2. Fig.13A and / or Fig. 13B As shown, the first portion 31 and the second portion 32 may have different sizes. Fig.13A In the example shown, the size of the second portion 32 is smaller than the size of the first portion 31a. Fig. 13B In the example shown, the size of the second portion 32 is smaller than the size of each of the first portion 31 a and the first portion 31 b .

[0083] Fig.14 FIG. 2 is a diagram illustrating another example of the cross-sectional structure of the light guide portion of the imaging device according to Modification Example 2. Fig.14As shown, the light guide 50 may include a third portion 33 disposed below the second portion 32 and in contact with the second portion 32, and a third member 43 disposed adjacent to the third portion 33. The second portion 32 and the third portion 33 are in contact with each other. Here, the term "the second portion 32 and the third portion 33 are in contact with each other" includes the case where a natural oxide film is in between, and also includes the case where the second portion 32 and the third portion 33 are in contact with each other through a thin natural oxide film. Fig.14 In the example shown, the second portion 32 and the third portion 33 are arranged in contact with each other.

[0084] The first part 31, the second part 32 and the third part 33 may have different sizes (thickness, width, etc.). The first part 31, the second part 32 and the third part 33 may be arranged to be shifted according to the image height. For example, the first member 41, the second member 42 and the third member 43 may be formed using different materials. (2-3. Modification 3)

[0085] Fig.15 1 is a diagram showing an example of a cross-sectional configuration of a light guide portion of an imaging device according to Modification 3. Fig.15 In the example shown in FIG. 16 , the first portion 31 and the second portion 32 may have different widths. For example, the first portion 31 and the second portion 32 may be formed to have different sizes, shapes, etc. In this case, the degradation of the spectral characteristics when the oblique incident light is applied may be effectively suppressed.

[0086] The first parts 31a and 31b and the second part 32 may have a cross shape, a quadrangle shape, etc. Fig.17 The shape of the structure 30 can be appropriately deformed, for example, it can be a quadrangle in a plan view. The shape of the structure 30 can be a polygon, an ellipse, a cross or other shapes. (2-4. Modification 4)

[0087] Fig.18 4 is a diagram showing an example of a cross-sectional configuration of an imaging device according to Modification 4. Fig.18 As shown, the imaging device 1 may include a lens section 26. The lens section 26 guides incident light from above to the light guide section 50. The lens section 26 is an optical member, also referred to as an on-chip lens. The lens section 26 is disposed above the light guide section 50, for example, for each pixel P or each plurality of pixels P. Light from a subject is incident on the lens section 26 via an optical system such as an imaging lens. The photoelectric conversion section 12 may perform photoelectric conversion on light incident via the lens section 26, the light guide section 50, and the color filter 25.

[0088] It should be noted that a light guide portion formed using a structure can be provided above the photoelectric conversion portion 12 to replace the color filter 25 or to supplement the color filter 25. Similar to the structure 30 of the light guide portion 50, for example, these structures are columnar fine structures. It should be noted that the shape of the structure can be appropriately deformed and can be a polygon or other shape. <3. Application Examples>

[0089] For example, the above-described imaging device 1 and the like are applicable to any type of electronic equipment having an imaging function, including a camera system such as a digital camera or a video camera, and a mobile phone and the like. Fig.19 The schematic structure of the electronic device 1000 is shown.

[0090] For example, the electronic device 1000 includes a lens group 1001, an imaging device 1, a digital signal processor (DSP) circuit 1002, a frame memory 1003, a display section 1004, a recording section 1005, an operation section 1006, and a power supply section 1007. They are connected to each other via a bus 1008.

[0091] The lens group 1001 receives incident light (image light) from a subject and forms an image on an imaging surface of the imaging device 1. The imaging device 1 converts the amount of incident light formed as an image on the imaging surface by the lens group 1001 into an electrical signal in units of pixels, and supplies the electrical signal to the DSP circuit 1002 as a pixel signal.

[0092] The DSP circuit 1002 is a signal processing circuit that processes a signal supplied from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signal from the imaging device 1. The frame memory 1003 temporarily stores the image data processed by the DSP circuit 1002 in units of frames.

[0093] For example, the display portion 1004 includes a panel type display device such as a liquid crystal panel or an organic electroluminescent (EL) panel, and records image data of moving images or still images captured by the imaging device 1 on a recording medium such as a semiconductor memory or a hard disk.

[0094] The operation section 1006 outputs operation signals for various functions of the electronic device 1000 according to user operations. The power supply section 1007 appropriately supplies various power supplies for the operation of these power supply targets to the DSP circuit 1002, frame memory 1003, display section 1004, recording section 1005 and operation section 1006. <4. Application Examples> (Application example of mobile object)

[0095] The technology according to the present disclosure (the present technology) is applicable to various products. For example, the technology according to the present disclosure can be implemented as a device installed on any type of mobile body selected such as an automobile, an electric car, a hybrid electric car, a motorcycle, a bicycle, a personal mobile device, an airplane, an unmanned aerial vehicle, a ship, and a robot.

[0096] Fig. 20 : is a block diagram showing an example of a schematic configuration of a vehicle control system as an example of a moving body control system to which the technology according to the embodiment of the present disclosure can be applied.

[0097] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Fig. 20 In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown as the functional configuration of the integrated control unit 12050.

[0098] The drive system control unit 12010 controls the operation of devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for the following devices: a drive force generating device such as an internal combustion engine or a drive motor for generating a drive force for the vehicle; a drive force transmitting mechanism for transmitting the drive force to the wheels; a steering mechanism for adjusting the steering angle of the vehicle; and a braking device for generating a braking force for the vehicle, etc.

[0099] The body system control unit 12020 controls the operation of various devices provided to the vehicle body according to various programs. For example, the body system control unit 12020 is used as a control device for a keyless entry system, a smart key system, a power window device, or various lights such as a headlight, a taillight, a brake light, a turn signal light, or a fog light. In this case, radio waves transmitted from a portable device as a substitute for a key or signals of various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls the door lock device, the power window device, and lights of the vehicle.

[0100] The vehicle exterior information detection unit 12030 detects information about the exterior of the vehicle having the vehicle control system 12000. For example, the vehicle exterior information detection unit 12030 is connected to the imaging unit 12031. The vehicle exterior information detection unit 12030 instructs the imaging unit 12031 to provide an image of the exterior of the vehicle, and then receives the image from the imaging unit 12031. On the basis of the received image, the vehicle exterior information detection unit 12030 processes the received image to detect objects such as people, vehicles, obstacles, signs, or symbols on the road surface, or processes the received image to detect the distance to these objects.

[0101] The imaging unit 12031 is an optical sensor for receiving light and outputting an electrical signal corresponding to the amount of light received. The imaging unit 12031 may output the electrical signal as an image, or may output the electrical signal as information about the measured distance. In addition, the light received by the imaging unit 12031 may be visible light, or may be invisible light such as infrared rays.

[0102] The in-vehicle information detection unit 12040 detects information about the interior of the vehicle. For example, the in-vehicle information detection unit 12040 is connected to a driver state detection unit 12041 that detects the driver's state. The driver state detection unit 12041 includes, for example, a camera that images the driver. Based on the detection information input from the driver state detection unit 12041, the in-vehicle information detection unit 12040 can calculate the driver's fatigue level or the driver's concentration level, or can determine whether the driver is dozing off.

[0103] The microcomputer 12051 can calculate the control target value of the driving force generating device, the steering mechanism or the braking device based on the information about the inside or outside of the vehicle (the information is obtained by the outside information detection unit 12030 or the inside information detection unit 12040), and can output the control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform the coordinated control aimed at realizing the functions of the advanced driver assistance system (ADAS), which includes: collision avoidance or collision mitigation of the vehicle, following driving based on the vehicle-to-vehicle distance, vehicle speed maintenance driving, vehicle collision warning or vehicle lane departure warning, etc.

[0104] In addition, the microcomputer 12051 can perform collaborative control with the intention of achieving automatic driving (for example, operating the vehicle without input from the driver, etc.) by controlling a drive force generating device, a steering mechanism, or a braking device, etc. based on information about the interior or exterior of the vehicle (the information is obtained by the exterior information detection unit 12030 or the interior information detection unit 12040).

[0105] In addition, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information about the outside of the vehicle, which is obtained by the vehicle exterior information detection unit 12030. For example, the microcomputer 12051 can perform cooperative control aimed at preventing glare by controlling the headlights to change from high beam to low beam according to the position of the preceding vehicle or the oncoming vehicle detected by the vehicle exterior information detection unit 12030.

[0106] The sound / image output unit 12052 transmits an output signal of at least one of sound and image to an output device that can visually or auditorily notify the vehicle's passengers or the outside of the vehicle of information. Fig. 20 In the example of FIG. 1 , an audio speaker 12061, a display portion 12062, and an instrument panel 12063 are shown as output devices. For example, the display portion 12062 may include at least one of an in-vehicle display and a head-up display.

[0107] Fig.21 12031 is a diagram showing an example of the installation position of the imaging unit 12031.

[0108] exist Fig.21 In the figure, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104 and 12105.

[0109] The imaging units 12101, 12102, 12103, 12104 and 12105 are, for example, disposed at positions on the front nose, side mirrors, rear bumper and rear door of the vehicle 12100 and at positions on the upper portion of the windshield inside the vehicle. The imaging unit 12101 disposed on the front nose and the imaging unit 12105 disposed on the upper portion of the windshield inside the vehicle mainly obtain images in front of the vehicle 12100. The imaging units 12102 and 12103 disposed on the side mirrors mainly obtain images on the sides of the vehicle 12100. The imaging unit 12104 disposed on the rear bumper or rear door mainly obtains images behind the vehicle 12100. The imaging unit 12105 disposed on the upper portion of the windshield inside the vehicle is mainly used to detect vehicles ahead, pedestrians, obstacles, signals, traffic signs or lanes, etc.

[0110] By the way, Fig.21An example of the shooting range of the imaging units 12101 to 12104 is shown. Imaging range 12111 represents the imaging range of the imaging unit 12101 provided to the front nose. Imaging ranges 12112 and 12113 respectively represent the imaging ranges of the imaging units 12102 and 12103 provided to the side mirrors. Imaging range 12114 represents the imaging range of the imaging unit 12104 provided to the rear bumper or the rear door. For example, by superimposing the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 viewed from above is obtained.

[0111] At least one of the imaging units 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0112] For example, the microcomputer 12051 can determine the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the time change of the distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting the nearest three-dimensional object as the leading vehicle, in particular, the three-dimensional object exists on the driving path of the vehicle 12100 and travels in substantially the same direction as the vehicle 12100 at a predetermined speed (e.g., equal to or greater than 0 km / h). In addition, the microcomputer 12051 can set the following distance to be maintained between the vehicle in front and the leading vehicle, and perform automatic braking control (including following stop control) or automatic acceleration control (including following start control), etc. Therefore, cooperative control such as automatic driving intended for making the vehicle travel autonomously without relying on the operation of the driver can be performed.

[0113] For example, the microcomputer 12051 can classify the three-dimensional object data about the three-dimensional object into three-dimensional object data of two-wheeled vehicles, standard-sized vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data to automatically avoid obstacles. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that can be visually identified by the driver of the vehicle 12100 and obstacles that are difficult for the driver of the vehicle 12100 to visually identify. Then, the microcomputer 12051 determines a collision risk representing the risk of collision with each obstacle. When the collision risk is equal to or higher than the set value and therefore there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display unit 12062, and performs forced deceleration or evasive steering through the drive system control unit 12010. The microcomputer 12051 can thereby assist driving to avoid collision.

[0114] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 may identify a pedestrian by determining whether there is a pedestrian in the captured images of the imaging units 12101 to 12104. For example, such identification of pedestrians is performed by a program that extracts feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras and a program that determines whether it is a pedestrian by performing pattern matching processing on a series of feature points representing the outline of an object. When the microcomputer 12051 determines that there is a pedestrian in the captured images of the imaging units 12101 to 12104 and thus identifies the pedestrian, the sound / image output unit 12052 controls the display unit 12062 so that a square contour line for emphasis is displayed in a manner superimposed on the identified pedestrian. The sound / image output unit 12052 may also control the display unit 12062 so that an icon or the like representing a pedestrian is displayed at a desired position.

[0115] The description of the mobile body control system to which the technology according to the embodiment of the present disclosure can be applied has been given above. For example, the technology according to the embodiment of the present disclosure is applicable to the imaging unit 12031 and the like in the above-mentioned configuration. Specifically, the imaging device 1 and the like can be applied to the imaging unit 12031. Applying the technology according to the embodiment of the present disclosure to the imaging unit 12031 can obtain an image with high definition, thereby making it possible to perform high-precision control using the image in the mobile body control system. (Application example of endoscopic surgery system)

[0116] The technology according to the embodiment of the present disclosure (the present technology) is applicable to various products. For example, the technology according to the embodiment of the present disclosure can be applied to an endoscopic surgery system.

[0117] Fig. 22 : is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to an embodiment of the present disclosure (the present technology) can be applied.

[0118] exist Fig. 22 , a state is shown in which an operator (doctor) 11131 is using an endoscopic surgery system 11000 to perform surgery on a patient 11132 on a bed 11133. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as a pneumoperitoneum tube 11111 and an energy device 11112, a support arm device 11120 supporting the endoscope 11100 thereon, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0119] The endoscope 11100 includes a lens barrel 11101, a region of a predetermined length from the distal end of the lens barrel is inserted into the body cavity of a patient 11132, and a camera head 11102, the camera head being connected to the proximal end of the lens barrel 11101. In the example shown, the endoscope 11100 configured as a rigid endoscope having a rigid lens barrel 11101 is shown. However, the endoscope 11100 may also be configured as a flexible endoscope having a flexible lens barrel 11101.

[0120] The lens barrel 11101 has an opening at its distal end in which an objective lens is mounted. The light source device 11203 is connected to the endoscope 11100 so that the light generated by the light source device 11203 is introduced into the distal end of the lens barrel 11101 through a light guide extending into the interior of the lens barrel 11101, and irradiated through the objective lens onto an observation target in the body cavity of the patient 11132. It should be noted that the endoscope 11100 may be a straight-view endoscope or may be an oblique-view endoscope or a side-view endoscope.

[0121] The optical system and the imaging element are arranged inside the camera head 11102 so that the reflected light (observation light) from the observation target is gathered on the imaging element through the optical system. The observation light is photoelectrically converted by the imaging element to generate an electric signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is transmitted to the CCU 11201 as raw data.

[0122] The CCU 11201 includes a central processing unit (CPU), a graphics processing unit (GPU), etc., and centrally controls the operations of the endoscope 11100 and the display device 11202. Further, for example, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing such as development processing (demosaic processing) on ​​the image signal to display an image based on the image signal.

[0123] The display device 11202 displays thereon an image based on an image signal that has been image-processed by the CCU 11201 under the control of the CCU 11201 .

[0124] For example, the light source device 11203 includes a light source such as a light emitting diode (LED) and provides the endoscope 11100 with illumination light for imaging the surgical area.

[0125] The input device 11204 is an input interface of the endoscopic surgery system 11000. The user can input various information or instructions to the endoscopic surgery system 11000 through the input device 11204. For example, the user may input instructions to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) of the endoscope 11100.

[0126] The treatment tool control device 11205 controls the driving of the energy device 11112 to burn or cut tissue, seal blood vessels, etc. The pneumoperitoneum device 11206 supplies gas into the body cavity of the patient 11132 through the pneumoperitoneum tube 11111 to expand the body cavity in order to ensure the field of view of the endoscope 11100 and to ensure the working space of the operator. The recorder 11207 is a device capable of recording various information related to the operation. The printer 11208 is a device capable of printing various information related to the operation in various forms such as text, images, or graphics.

[0127] It should be noted that the light source device 11203 that provides irradiation light when imaging the surgical area to the endoscope 11100 can be composed of a white light source, for example, a white light source composed of an LED, a laser light source, or a combination thereof. In the case where the white light source is composed of a combination of red, green, and blue (RGB) laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance of the captured image can be adjusted by the light source device 11203. Further, in this case, if the laser beams from the respective RGB laser light sources are irradiated on the observation target in a time-division manner, the driving of the imaging element of the camera head 11102 is controlled synchronously with the irradiation timing. Then, images corresponding to the R, G, and B colors, respectively, can also be captured in a time-division manner. According to this method, a color image can be obtained even if a color filter is not configured for the imaging element.

[0128] In addition, the drive of the light source device 11203 can be controlled so as to change the intensity of the light to be output at predetermined intervals. By controlling the drive of the imaging element of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and synthesize the images, it is possible to create an image with a high dynamic range without underexposed shadows and overexposed highlights.

[0129] In addition, the light source device 11203 can be configured to provide light of a predetermined wavelength band corresponding to special light observation. For example, in special light observation, by utilizing the wavelength dependence of light absorption of body tissue, a narrow band of light is irradiated compared to the irradiation light (i.e., white light) during ordinary observation, and narrow band observation (narrow band imaging) is performed on predetermined tissues such as blood vessels in the surface layer of the mucosa with high contrast. Alternatively, in special light observation, fluorescence observation for obtaining an image from fluorescence generated by irradiating excitation light can be performed. In fluorescence observation, fluorescence observation (autofluorescence observation) of body tissue can be performed by irradiating excitation light on body tissue, or a fluorescent image can be obtained by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating excitation light corresponding to the fluorescence wavelength of the reagent on the body tissue. The light source device 11203 can be configured to provide such narrow band light and / or excitation light suitable for special light observation as described above.

[0130] Fig.23 It shows Fig. 22 A block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown.

[0131] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected by a transmission cable 11400 so as to communicate with each other.

[0132] The lens unit 11401 is an optical system provided at a connection position with the lens barrel 11101. Observation light entering from the distal end of the lens barrel 11101 is guided to the camera head 11102 and introduced into the lens unit 11401. The lens unit 11401 is composed of a combination of a plurality of lenses including a zoom lens and a focus lens.

[0133] The number of imaging elements included in the imaging unit 11402 can be one (single-board type) or multiple (multi-board type). For example, when the imaging unit 11402 is configured as a multi-board type, image signals corresponding to each R, G and B are generated by the imaging element, and the image signals can be synthesized to obtain a color image. The imaging unit 11402 can also be configured to have a pair of imaging elements for acquiring a right-eye image signal and a left-eye image signal corresponding to a three-dimensional (3D) display. If a 3D display is performed, then the operator 11131 can more accurately grasp the depth of the living tissue in the surgical area. It should be noted that when the imaging unit 11402 is configured as a stereoscopic type, a plurality of lens unit 11401 systems are set corresponding to each imaging element.

[0134] In addition, the imaging unit 11402 may not necessarily be disposed on the camera head 11102. For example, the imaging unit 11402 may be disposed just behind the objective lens inside the lens barrel 11101.

[0135] The driving unit 11403 is composed of an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. Therefore, the magnification and focus of the image captured by the imaging unit 11402 can be appropriately adjusted.

[0136] The communication unit 11404 is constituted by a communication device for sending and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal acquired from the imaging unit 11402 to the CCU 11201 as raw data via the transmission cable 11400.

[0137] In addition, the communication unit 11404 receives a control signal for driving the camera head 11102 from the CCU 11201, and provides the control signal to the camera head control unit 11405. For example, the control signal includes information related to imaging conditions, such as information specifying a frame rate of a captured image, information specifying an exposure value when capturing an image, and / or information specifying a magnification and a focus of a captured image.

[0138] It should be noted that imaging conditions such as frame rate, exposure value, magnification or focus may be specified by the user or may be automatically set based on the acquired image signal by the control unit 11413 of the CCU 11201. In the latter case, an automatic exposure (AE) function, an automatic focus (AF) function, and an automatic white balance (AWB) function are provided in the endoscope 11100.

[0139] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 through the communication unit 11404 .

[0140] The communication unit 11411 is constituted by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted thereto from the camera head 11102 through the transmission cable 11400.

[0141] Furthermore, the communication unit 11411 transmits a control signal for driving the camera head 11102 to the camera head 11102. The image signal and the control signal may be transmitted through electrical communication, optical communication, or the like.

[0142] The image processing unit 11412 performs various image processing on the image signal in the form of raw data transmitted thereto from the camera head 11102 .

[0143] The control unit 11413 performs various control processes related to image capturing of the operation area and the like through the endoscope 11100 and display of the captured image and the like. For example, the control unit 11413 creates a control signal for driving the camera head 11102.

[0144] In addition, the control unit 11413 controls the display device 11202 to display a captured image in which the surgical area, etc., is photographed based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 can use various image recognition technologies to recognize various objects in the captured image. For example, the control unit 11413 can recognize surgical tools such as surgical forceps, specific living body areas, bleeding, fog when the energy device 11112 is used, etc. by detecting the shape, color, etc. of the edge of the object contained in the captured image. When the control unit 11413 controls the display device 11202 to display the captured image, it can use the recognition result to display various surgical support information in an overlapping manner with the image of the surgical area. In the case where the surgical support information is displayed in an overlapping manner and presented to the operator 11131, the burden of the operator 11131 can be reduced and the operator 11131 can reliably perform the operation.

[0145] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 to each other is an electric signal cable for electric signal communication, an optical fiber for optical communication, or a composite cable for electric communication and optical communication.

[0146] Here, although in the illustrated example, communication is performed by wired communication using the transmission cable 11400, communication between the camera head 11102 and the CCU 11201 may be performed by wireless communication.

[0147] An example of an endoscopic surgical system to which the technology according to an embodiment of the present disclosure can be applied has been described above. The technology according to an embodiment of the present disclosure is applicable to, for example, the imaging unit 11402 in the camera head 11102 of the endoscope 11100 provided in the above-mentioned configuration. Applying the technology according to an embodiment of the present disclosure to the imaging unit 11402 enables the imaging unit 11402 to have high sensitivity, thereby enabling the provision of the endoscope 11100 with high definition.

[0148] Although the present disclosure has been described above with reference to the embodiments, variations, applicable examples, and application examples, the present technology is not limited to the above embodiments, etc. and can be variously modified in many ways. For example, although the above variations have been described as variations of the above embodiments, the configurations of the variations can be appropriately combined.

[0149] In the above-mentioned embodiments, etc., the imaging device is exemplified and described; however, for example, it is sufficient that the photodetector of the present disclosure receives incident light and converts the light into electric charge. The output signal may be a signal of image information or a signal of distance measurement information. The photodetector (imaging device) is suitable for image sensors, distance measurement sensors, etc.

[0150] The light detector according to the present disclosure can also be used as a distance measurement sensor capable of realizing distance measurement of the time of flight (TOF) method. The light detector (imaging device) can also be used as a sensor capable of detecting events, for example, an event-driven sensor (also referred to as an event vision sensor (EVS), event-driven sensor (EDS), dynamic vision sensor (DVS), etc.).

[0151] The light guide portion 50 as an optical element may be configured as a lens portion that focuses light by design of the structure 30. In addition, the light guide portion 50 may be configured as a color filter portion that selectively transmits light of a specific wavelength region in the incident light. The photodetector and the optical element (light guide portion 50) according to the present disclosure may be applied to various devices.

[0152] The photodetector of the embodiment of the present disclosure includes: a light guide having a structure including a first part having a size equal to or smaller than the wavelength of incident light and a second part arranged below the first part, a first material arranged adjacent to the first part and having a refractive index different from that of the structure, and a second material arranged adjacent to the second part and having a refractive index different from that of the structure; and a first photoelectric conversion part for photoelectrically converting light incident via the light guide. The first part is in contact with the second part. Therefore, the shape of the structure can be controlled, thereby suppressing the reduction in sensitivity to oblique incident light. In this way, a photodetector with good detection performance can be realized.

[0153] The optical element of the embodiment of the present disclosure includes: a structure having a first part having a size equal to or smaller than the wavelength of the incident light and a second part arranged below the first part; a first material arranged adjacent to the first part and having a refractive index different from that of the structure; and a second material arranged adjacent to the second part and having a refractive index different from that of the structure. The first part is in contact with the second part. It should be noted that the term "contact" here includes the case of direct contact and also includes the case of contact through a natural oxide film, etc. According to the optical element of the present disclosure, the shape of the structure can be controlled. In addition, the characteristics of oblique incident light can also be improved.

[0154] It should be noted that the effects described herein are merely exemplary and are not limited to the description, and other effects may also be included. In addition, the present disclosure may also have the following configurations. (1) A light detector comprising: a light guide including a structure having a first portion and a second portion, a first material and a second material, the first portion having a size equal to or smaller than a wavelength of incident light, the second portion being disposed below the first portion, the first material being disposed adjacent to the first portion and having a refractive index different from that of the structure, and the second material being disposed adjacent to the second portion and having a refractive index different from that of the structure; and A first photoelectric conversion portion performs photoelectric conversion on light incident via the light guiding portion, wherein the first portion is in contact with the second portion. (2) The photodetector according to (1), wherein the first material is in contact with the second material. (3) The photodetector according to (1) or (2), wherein the first material and the second material are composed of materials different from each other. (4) The photodetector according to any one of (1) to (3), wherein the first material and the second material are different in thickness from each other in a stacking direction of the first material and the second material. (5) The photodetector according to any one of (1) to (4), wherein the first portion and the second portion are provided continuously. (6) The photodetector according to any one of (1) to (5), wherein the first portion and the second portion have different sizes from each other. (7) The photodetector according to any one of (1) to (6), further comprising a light receiving portion having a plurality of the first photoelectric conversion portions, wherein a distance from a center of the first portion to a center of the second portion differs depending on a distance from the center of the light receiving portion. (8) The photodetector according to any one of (1) to (7), wherein The structure includes a third portion disposed below the second portion, and The light guide includes a third material disposed adjacent to the third portion and having a refractive index different from a refractive index of the third portion. (9) The photodetector according to (8), wherein the second portion and the third portion have different sizes from each other. (10) The photodetector according to (8) or (9) further includes a light receiving portion having a plurality of the first photoelectric conversion portions, wherein a distance from a center of the second portion to a center of the third portion differs depending on a distance from the center of the light receiving portion. (11) The photodetector according to any one of (1) to (10), wherein the light guiding portion is provided above the first photoelectric conversion portion and disperses incident light. (12) The photodetector according to any one of (1) to (11) further includes a second photoelectric conversion unit, which is arranged adjacent to the first photoelectric conversion unit and performs photoelectric conversion on light incident through the light guiding unit, wherein the light guiding unit guides light of a first wavelength in the incident light to the side of the first photoelectric conversion unit and guides light of a second wavelength to the side of the second photoelectric conversion unit. (13) The photodetector according to (12) further includes a third photoelectric conversion unit, which is arranged adjacent to the first photoelectric conversion unit and performs photoelectric conversion on light incident through the light guide unit, wherein the light guide unit guides light of a third wavelength in the incident light to the third photoelectric conversion unit side. (14) The photodetector according to any one of (1) to (13), wherein the sizes of the first portion and the second portion are respectively equal to or smaller than the wavelength of visible light. (15) The photodetector according to any one of (1) to (14) further includes a lens which is arranged above the light guide portion and on which light is incident, wherein the first photoelectric conversion portion performs photoelectric conversion on light that passes through the lens and the light guide portion. (16) The photodetector according to any one of (1) to (15), further comprising a color filter provided between the light guiding portion and the first photoelectric converter, wherein the first photoelectric converter performs photoelectric conversion on light transmitted through the color filter. (17) An electronic device comprising Optical systems; and a light detector that receives light transmitted through the optical system, The light detector includes a light guide including a structure having a first portion and a second portion, a first material and a second material, the first portion having a size equal to or smaller than a wavelength of incident light, the second portion being disposed below the first portion, the first material being disposed adjacent to the first portion and having a refractive index different from that of the structure, and the second material being disposed adjacent to the second portion and having a refractive index different from that of the structure; and A photoelectric conversion unit performs photoelectric conversion on light incident via the light guiding unit, wherein the first portion is in contact with the second portion. (18) An optical element, comprising: A structure comprising a first portion and a second portion, wherein a size of the first portion is equal to or smaller than a wavelength of incident light, and the second portion is disposed below the first portion; a first material disposed adjacent to the first portion and having a refractive index different than that of the structure; and A second material is disposed adjacent to the second portion and has a refractive index different than a refractive index of the structure, wherein the first portion is in contact with the second portion. (19) A light detector comprising: A light guide comprising: A structure comprising a first portion and a second portion; First material; and Second material, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, wherein the second portion is disposed below the first portion, wherein the first material is disposed adjacent to the first portion and has a refractive index different from a refractive index of the structure, and wherein the second material is disposed adjacent to the second portion and has a refractive index different from a refractive index of the structure, and a first photoelectric converter that performs photoelectric conversion on light incident through the light guide, Wherein the first portion is in contact with the second portion. (20) The photodetector according to (19), wherein the first material is in contact with the second material. (twenty one) The photodetector according to (19) or (20), wherein the first material and the second material are made of materials different from each other. (twenty two) The photodetector according to (19) to (21), wherein the first material and the second material are different in thickness from each other in a stacking direction of the first material and the second material. (twenty three) The photodetector according to (19) to (22), wherein the first portion and the second portion are provided continuously. (twenty four) The photodetector according to (19) to (23), wherein the first portion and the second portion have different sizes from each other. (25) The optical detector according to (19) to (24), further comprising: an optical receiver comprising a plurality of said first photoelectric converters, Wherein a distance from a center of the first portion to a center of the second portion is different depending on a distance from a center of the light receiver. (26) A photodetector according to (19) to (25), wherein the structure includes a third portion disposed below the second portion, and the light guide includes a third material disposed adjacent to the third portion and having a refractive index different from that of the third portion. (27) The photodetector according to (26), wherein the second portion and the third portion have different sizes from each other. (28) The optical detector according to (26) or (27), further comprising: an optical receiver comprising a plurality of said first photoelectric converters, Wherein a distance from a center of the second portion to a center of the third portion is different depending on a distance from a center of the light receiver. (29) The photodetector according to (19) to (28), wherein the light receiver is provided above the first photoelectric converter and disperses incident light. (30) The optical detector according to (19) to (29), further comprising: a second photoelectric converter disposed adjacent to the first photoelectric converter and performing photoelectric conversion on light incident through the light guide, The light guide guides incident light of a first wavelength to the first photoelectric converter and guides incident light of a second wavelength to the second photoelectric converter. (31) The optical detector according to (30) further comprises: a third photoelectric converter disposed adjacent to the first photoelectric converter and performing photoelectric conversion on the light incident through the light guide, The light guide guides incident light of a third wavelength to the third photoelectric converter. (32) The photodetector according to (19) to (31), wherein the sizes of the first portion and the second portion are respectively equal to or smaller than the wavelength of visible light. (33) The optical detector according to (19) to (32), further comprising: a lens disposed above the light guide and on which incident light is incident, The first photoelectric converter performs photoelectric conversion on the light passing through the lens and the light guide. (34) The optical detector according to (19) to (33), further comprising: a color filter disposed between the light guide and the first photoelectric converter, The first photoelectric converter performs photoelectric conversion on the incident light passing through the color filter. (35) An electronic device comprising: Optical systems; and a light detector that receives light transmitted through the optical system, Wherein the light detector comprises: A light guide comprising: A structure comprising a first portion and a second portion; First material; and Second material, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, wherein the second portion is disposed below the first portion, wherein the first material is disposed adjacent to the first portion and has a refractive index different from that of the structure, and wherein the second material is disposed adjacent to the second portion and has a refractive index different from a refractive index of the structure, and a photoelectric converter that performs photoelectric conversion on light incident through the light guide, Wherein the first portion is in contact with the second portion. (36) An optical element comprising A structure comprising a first part and a second part, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, and wherein the second part is arranged below the first part; a first material disposed adjacent to the first portion and having a refractive index different than that of the structure; and a second material disposed adjacent to the second portion and having a refractive index different from the refractive index of the structure, Wherein the first portion is in contact with the second portion. (37) An optical element according to (36), wherein the first material is in contact with the second material. (38) An optical element according to (36) or (37), wherein the first material and the second material are made of materials different from each other.

[0155] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may be made depending on design requirements and other factors as long as they are within the scope of the appended claims or the equivalents thereof. [reference numerals list]

[0156] 1 Imaging device 10 Light receiving unit 12 Photoelectric conversion unit 20 Transparent Layer 25 Color Filters 30 Structure 31 Part 1 32 Part 2 41 First Component 42 Second component 50 Light guide 100 Pixels

Claims

1. A light detector, include: A light guide comprising: A structure comprising a first portion and a second portion; First material; and Second material, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, wherein the second portion is disposed below the first portion, wherein the first material is disposed adjacent to the first portion and has a refractive index different from a refractive index of the structure, and wherein the second material is disposed adjacent to the second portion and has a refractive index different from a refractive index of the structure, and a first photoelectric converter that performs photoelectric conversion on light incident through the light guide, Wherein the first portion is in contact with the second portion. The light detector of claim 1 , wherein the first material is in contact with the second material. 3 . The photodetector according to claim 1 , wherein the first material and the second material are composed of materials different from each other. 4 . The photodetector according to claim 1 , wherein the first material and the second material have thicknesses different from each other in a stacking direction of the first material and the second material. The light detector according to claim 1 , wherein the first portion and the second portion are disposed continuously. The light detector of claim 1 , wherein the first portion and the second portion have different sizes from each other.

7. The light detector according to claim 1, further comprising: include: an optical receiver comprising a plurality of said first photoelectric converters, Wherein a distance from a center of the first portion to a center of the second portion is different depending on a distance from a center of the light receiver.

8. The photodetector according to claim 1, in, The structure includes a third portion disposed below the second portion, and the light guide includes a third material disposed adjacent to the third portion and having a refractive index different than a refractive index of the third portion.

9. The light detector of claim 8, wherein the second portion and the third portion have different sizes from each other.

10. The light detector according to claim 8, further comprising: include: an optical receiver comprising a plurality of said first photoelectric converters, Wherein a distance from a center of the second portion to a center of the third portion is different depending on a distance from a center of the light receiver.

11. The light detector according to claim 1, in, The light receiver is disposed above the first photoelectric converter and disperses incident light.

12. The light detector according to claim 1, further comprising: include: a second photoelectric converter disposed adjacent to the first photoelectric converter and performing photoelectric conversion on light incident through the light guide, The light guide guides incident light of a first wavelength to the first photoelectric converter and guides incident light of a second wavelength to the second photoelectric converter.

13. The light detector according to claim 12, further comprising: include: a third photoelectric converter disposed adjacent to the first photoelectric converter and performing photoelectric conversion on the light incident through the light guide, The light guide guides incident light of a third wavelength to the third photoelectric converter.

14. The light detector of claim 1, wherein sizes of the first portion and the second portion are respectively equal to or smaller than a wavelength of visible light.

15. The light detector according to claim 1, further comprising: include: a lens disposed above the light guide and on which incident light is incident, The first photoelectric converter performs photoelectric conversion on the light passing through the lens and the light guide.

16. The light detector according to claim 1, further comprising: include: a color filter disposed between the light guide and the first photoelectric converter, The first photoelectric converter performs photoelectric conversion on the incident light passing through the color filter.

17. An electronic device, wherein include: Optical system; as well as a light detector that receives light transmitted through the optical system, Wherein the light detector comprises: A light guide comprising: A structure comprising a first portion and a second portion; First material; and Second material, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, wherein the second part is arranged below the first part, wherein the first material is disposed adjacent to the first portion and has a refractive index different from that of the structure, and wherein the second material is disposed adjacent to the second portion and has a refractive index different from a refractive index of the structure, and a photoelectric converter that performs photoelectric conversion on light incident through the light guide, Wherein the first portion is in contact with the second portion.

18. An optical element comprising A structure comprising a first part and a second part, wherein the size of the first portion is equal to or smaller than the wavelength of the incident light, and wherein the second part is arranged below the first part; a first material disposed adjacent to the first portion and having a refractive index different than a refractive index of the structure; as well as a second material disposed adjacent to the second portion and having a refractive index different from the refractive index of the structure, Wherein the first portion is in contact with the second portion. The optical element of claim 18 , wherein the first material is in contact with the second material.

20. The optical element according to claim 18, wherein the first material and the second material are composed of materials different from each other.

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