Welding machine for processing novel semiconductor chip

Abstract

The invention relates to the technical field of semiconductors, in particular to a welding machine for processing a novel semiconductor chip, and aims to solve the problems that a welding gun is high in temperature during welding and needs to dissipate heat in time, the performance of the chip is easily affected if the heat is not timely treated, and the chip is damaged if the heat is serious. The welding machine for processing the novel semiconductor chip comprises an operation table and a workpiece table, a side plate is further arranged on the operation table, a driving box capable of moving up and down is arranged on the side plate, a welding gun is arranged at the front end of the driving box, and a cold air fan matched with the welding gun is arranged at the lower end of the driving box. When the driving box moves downwards, the welding gun can move downwards to weld a semiconductor chip and a wire; and when the driving box moves downwards, the cold air fan can move downwards and deflect downwards to blow air to the semiconductor chip for heat dissipation. During welding, the chip and the welding gun can be cooled, normal work of the welding gun is guaranteed, the risk of chip damage is reduced, and meanwhile welding spot solidification is accelerated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a soldering machine for processing new semiconductor chips. Background Art

[0002] A thermoelectric semiconductor chip is an electronic device that utilizes the thermoelectric effect of semiconductor materials to achieve the mutual conversion of thermal energy and electrical energy. It is mainly divided into two categories: thermoelectric refrigeration chips and thermoelectric power generation chips. With its unique advantages, the thermoelectric semiconductor chip demonstrates great application potential in multiple fields and will play a more important role in the future in new energy, environmental protection, high-end manufacturing and other fields. When soldering a semiconductor chip and a wire, since there are grains on the chip and the soldering gun has a high temperature during soldering, timely heat dissipation is required. If not handled in time, it is likely to affect the performance of the chip and even damage the chip severely. Therefore, a soldering machine for processing new semiconductor chips is designed to solve the problems mentioned above. Summary of the Invention

[0003] In view of the fact that the soldering gun has a high temperature during soldering and timely heat dissipation is required. If not handled in time, it is likely to affect the performance of the chip and even damage the chip severely, the present invention provides a soldering machine for processing new semiconductor chips, which can dissipate heat from the chip and the soldering gun during soldering, ensure the normal operation of the soldering gun, reduce the risk of chip damage and accelerate the solidification of the solder joint, effectively solving the problems mentioned in the above background art.

[0004] The technical solution adopted by the present invention to solve the above problems is as follows: A soldering machine for processing new semiconductor chips includes an operating table. A workpiece table is provided on the operating table, and a semiconductor chip and a wire are placed on the workpiece table. A side plate is also provided on the operating table. A driving box capable of moving up and down is provided on the side plate. A soldering gun is provided at the front end of the driving box, and a cold air fan matched with the soldering gun is provided at the lower end of the driving box. There is a structure that can make the soldering gun move downward to solder the semiconductor chip and the wire when the driving box moves downward, and there is a structure that can make the cold air fan move downward and deflect downward to blow air on the semiconductor chip for heat dissipation when the driving box moves downward.

[0005] The driving box is slidably connected to a vertical plate. The soldering gun is fixedly connected to the front end surface of the driving box. A U-shaped seat is fixedly connected to the lower end surface of the driving box, and the cold air fan is installed on the U-shaped seat and can flip downward when moving downward to a specified position.

[0006] The cold air fan is rotatably connected to the inner wall of the U-shaped seat. Cranks are coaxially fixedly connected to both sides of the cold air fan respectively, and first sliding pins are fixedly connected to the cranks respectively. L-shaped plates capable of moving back and forth are provided on both sides of the U-shaped seat respectively, and first key grooves are respectively formed on the L-shaped plates. With the cooperation of the first sliding pins and the first key grooves, the cold air fan can be flipped when the L-shaped plates move.

[0007] On the left and right sides of the front surface of the vertical plate, first guide plates are respectively fixedly connected. On the outer end faces of the two L-shaped plates, live pins are respectively fixedly connected. Long vertical slots and short inclined slots that are matched with the live pins are respectively formed on the first guide plates.

[0008] The workpiece table includes a rotatable cross base. On the outer end face of the cross base, four evenly distributed supporting seats are fixedly connected. On the upper surface of each supporting seat, a supporting plate is fixedly connected. A clamping mechanism is provided on the supporting plate. The semiconductor chip and the wire are respectively placed on the corresponding supporting plates. On the operating table, a loading area, a spraying area, a welding area, and an unloading area are respectively provided. When the cross base rotates to make the supporting plate reach the corresponding loading area and unloading area, the clamping mechanism can close and hide inside the inner wall of the supporting plate. When the cross base rotates to make the supporting plate reach the corresponding spraying area and welding area, the clamping mechanism can open to clamp and position the semiconductor chip.

[0009] On the lower surface of each supporting plate, a first driving frame capable of moving is respectively provided. On both sides of the lower surface of each supporting plate, a second driving frame is also respectively slidably connected. On the two side end faces of the first driving frame, square guide plates are respectively fixedly connected. On the second driving frame, short pins are respectively fixedly connected. Oblique key slots that are matched with the short pins are respectively formed on the square guide plates. The clamping mechanism includes a plurality of clamping rods, and the clamping rods are respectively installed on the corresponding first driving frame and second driving frame.

[0010] A plurality of square sleeves are slidably connected to the inner wall of the supporting plate. The clamping rods are respectively slidably connected to the inner wall of the corresponding square sleeve. Sleeve rods are respectively fixedly connected to the first driving frame and the second driving frame. The clamping rods are respectively sleeved on the outer surface of the corresponding sleeve rod. Second sliding pins are respectively fixedly connected to the two side end faces of the clamping rod. A plurality of second guide plates are fixedly connected to the lower surface of the supporting plate. Upper horizontal slots and lower inclined slots that are matched with the second sliding pins are respectively formed on the second guide plates.

[0011] Extension pins are respectively provided on the lower surface of the first driving frame. A disc cam is provided on the upper end of the operating table. A closed-loop slot that is matched with the extension pin is formed on the disc cam. The closed-loop slot includes a large-radius slot, a small-radius slot, and a variable-diameter slot. The large-radius slot is correspondingly arranged with the loading area and the unloading area. The small-radius slot is correspondingly arranged with the spraying area and the welding area.

[0012] An unloading mechanism is also respectively provided on the supporting plate. The unloading mechanism respectively includes a U-shaped push plate slidably connected to the supporting plate. Extension plates capable of moving up and down are respectively provided on the inner wall of the supporting seat. Live guide plates slidably connected to the supporting seat are respectively fixedly connected to the two side end faces of the extension plate. Long inclined slots are respectively formed on the live guide plates. Fixed pins that are matched with the long inclined slots are respectively fixedly connected to the two side end faces of the U-shaped push plate.

[0013] A first motor is provided on the upper surface of the operation table. A dial is provided at the output end of the first motor. A long rotating shaft is rotatably connected to the inner wall of the operation table. A grooved wheel that cooperates with the dial is fixedly connected to the lower end of the outer surface of the long rotating shaft. A cross seat is fixedly connected to the upper end of the outer surface of the long rotating shaft. A circular sleeve is sleeved on the middle part of the outer surface of the long rotating shaft. A long cam is coaxially fixedly connected to the upper end of the dial. A long pin that cooperates with the long cam is fixedly connected to the outer surface of the circular sleeve. A pressing plate extending towards the feeding area is fixedly connected to the upper surface of the circular sleeve. A tension spring is fixedly connected to the upper surface of the extension plate. The upper end of the tension spring is fixedly connected to the cross seat.

[0014] The present invention has the following advantages compared with the prior art: During use, when the drive box moves downward, the welding torch can be synchronously moved downward. When the welding torch moves downward to contact the semiconductor chip and the wire, the semiconductor chip can be welded, so that the wire is welded and fixed on the semiconductor chip. When the drive box moves downward, the cold air fan can also be moved downward, and the cold air fan can be deflected downward to align with the semiconductor chip. When the cold air fan blows air, the semiconductor chip can be blown for heat dissipation, thereby accelerating the heat dissipation of the semiconductor chip, reducing the risk of chip damage, and at the same time accelerating the solidification of the solder joint and improving the welding quality. In the normal state, that is, when the welding torch and the cold air fan are at the top position, the cold air fan can blow air to dissipate heat from the welding torch, cool down the welding torch, and ensure the normal operation of the welding torch. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is the first axonometric drawing of a welding machine for processing new semiconductor chips according to the present invention.

[0016] Figure 2 It is the second axonometric drawing of a welding machine for processing new semiconductor chips according to the present invention.

[0017] Figure 3 It is the installation schematic diagram of the drive box of a welding machine for processing new semiconductor chips according to the present invention.

[0018] Figure 4 It is the installation schematic diagram of the U-shaped seat of a welding machine for processing new semiconductor chips according to the present invention.

[0019] Figure 5 It is the installation schematic diagram of the cold air fan of a welding machine for processing new semiconductor chips according to the present invention.

[0020] Figure 6 It is the installation schematic diagram of the feeder of a welding machine for processing new semiconductor chips according to the present invention.

[0021] Figure 7 It is the installation schematic diagram of the disk cam of a welding machine for processing new semiconductor chips according to the present invention.

[0022] Figure 8 Schematic diagram of the installation of the cross base of a soldering machine for processing new semiconductor chips according to the present invention.

[0023] Figure 9 Schematic diagram of the installation of the round sleeve of a soldering machine for processing new semiconductor chips according to the present invention.

[0024] Figure 10 Schematic diagram of the installation of the pallet of a soldering machine for processing new semiconductor chips according to the present invention.

[0025] Figure 11 Schematic diagram of the installation of the movable splint of a soldering machine for processing new semiconductor chips according to the present invention.

[0026] Figure 12 Schematic diagram of the installation of the extension plate of a soldering machine for processing new semiconductor chips according to the present invention.

[0027] Figure 13 Schematic diagram of the installation of the movable guide plate of a soldering machine for processing new semiconductor chips according to the present invention.

[0028] Figure 14 Schematic diagram of the installation of the pallet of a soldering machine for processing new semiconductor chips according to the present invention.

[0029] Figure 15 Schematic diagram of the installation of the square sleeve of a soldering machine for processing new semiconductor chips according to the present invention.

[0030] Figure 16 Schematic diagram of the installation of the square guide plate of a soldering machine for processing new semiconductor chips according to the present invention.

[0031] Figure 17 Schematic diagram of the installation of the extension pin of a soldering machine for processing new semiconductor chips according to the present invention.

[0032] Reference Numerals in the Figures: 1 - operating table, 2 - side plate, 3 - drive box, 4 - U-shaped seat, 5 - welding torch, 6 - cold air fan, 7 - L-shaped plate, 8 - live pin, 9 - crank, 10 - first sliding pin, 11 - first keyway, 12 - first guide plate, 13 - long vertical groove, 14 - short inclined groove, 15 - feeder, 16 - conveyor belt, 17 - soldering sprayer, 18 - first motor, 19 - dial, 20 - grooved pulley, 21 - long cam, 22 - long pin, 23 - round sleeve, 24 - long rotating shaft, 25 - pressing plate, 26 - cross-shaped seat, 27 - sleeve rod, 28 - bidirectional threaded rod, 29 - mounting seat, 30 - weak spring, 31 - support seat, 32 - support plate, 33 - movable clamping plate, 34 - fixed clamping plate, 35 - extension plate, 36 - tension spring, 37 - U-shaped push plate, 38 - movable guide plate, 39 - fixed pin, 40 - long inclined groove, 41 - extension pin, 42 - first drive frame, 43 - square guide plate, 44 - short pin, 45 - inclined keyway, 46 - second drive frame, 47 - square sleeve, 48 - clamping rod, 49 - second sliding pin, 50 - second guide plate, 51 - upper horizontal groove, 52 - lower inclined groove, 53 - disk cam, 54 - large radius groove, 55 - small radius groove, 56 - variable diameter groove, 57 - connecting rod. Detailed Embodiment

[0033] The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described in conjunction with the accompanying drawings, but the present invention is not limited to these embodiments.

[0034] As Figures 1 - 17 shown, the present invention provides a welding machine for processing new semiconductor chips, including an operating table 1. A workpiece table is provided on the operating table 1, and a semiconductor chip and a wire are placed on the workpiece table. A side plate 2 is also provided on the operating table 1. A drive box 3 capable of moving up and down is provided on the side plate 2. A welding torch 5 is provided at the front end of the drive box 3. A cold air fan 6 cooperating with the welding torch 5 is provided at the lower end of the drive box 3. There is a structure that can make the welding torch 5 move downward to weld the semiconductor chip and the wire when the drive box 3 moves downward, and a structure that can make the cold air fan 6 move downward and deflect downward to blow air on the semiconductor chip for heat dissipation when the drive box 3 moves downward.

[0035] As Figures 1 - 7As shown, the operating table 1 is used to support the entire device. The workpiece table is used to load semiconductor chips and wires. The side plate 2 is fixedly connected to the upper surface of the operating table 1. The side plate 2 is used to support components such as the drive box 3, the welding torch 5, and the cold air fan 6. When the drive box 3 moves downward, it can make the welding torch 5 move downward synchronously. When the welding torch 5 moves downward to contact the semiconductor chip and the wire, it can perform welding treatment on the semiconductor chip, thereby welding and fixing the wire on the semiconductor chip. When the drive box 3 moves downward, it can also make the cold air fan 6 move downward, and can also make the cold air fan 6 deflect downward to align with the semiconductor chip. When the cold air fan 6 blows air, it can blow air and dissipate heat from the semiconductor chip, thereby accelerating the heat dissipation of the semiconductor chip, reducing the risk of chip damage, and at the same time accelerating the solidification of the solder joint and improving the welding quality. Under normal conditions, that is, when the welding torch 5 and the cold air fan 6 are in the top position, the cold air fan 6 can blow air and dissipate heat from the welding torch 5, cool down the welding torch 5, and ensure the normal operation of the welding torch 5. The welding torch 5 and the cold air fan 6 are both prior arts and will not be elaborated here.

[0036] The drive box 3 is slidably connected to the vertical plate. The welding torch 5 is fixedly connected to the front surface of the drive box 3. A U-shaped seat 4 is fixedly connected to the lower surface of the drive box 3. The cold air fan 6 is installed on the U-shaped seat 4 and can turn downward when the cold air fan 6 moves downward to a specified position.

[0037] As Figures 3 - 5 shown, the drive box 3 can be slidably connected to the front surface of the vertical plate up and down. The welding torch 5 is fixedly connected to the front surface of the drive box 3. When the drive box 3 moves downward, it can drive the welding torch 5 to move downward synchronously. The U-shaped seat 4 is used to support and install the cold air fan 6. When the drive box 3 moves downward, it can drive the U-shaped seat 4, the cold air fan 6, the welding torch 5, etc. to move downward synchronously. And because the cold air fan 6 is independently installed on the U-shaped seat 4, when the cold air fan 6 moves downward to a specified position, it can turn downward, so that the cold air fan 6 aligns with the semiconductor chip.

[0038] The cold air fan 6 is rotatably connected to the inner wall of the U-shaped seat 4. Cranks 9 are coaxially fixedly connected to both sides of the cold air fan 6 respectively. First sliding pins 10 are fixedly connected to the cranks 9 respectively. L-shaped plates 7 that can move back and forth are provided on both sides of the U-shaped seat 4 respectively. First key grooves 11 are opened on the L-shaped plates 7 respectively. With the cooperation of the first sliding pins 10 and the first key grooves 11, the cold air fan 6 can be turned when the L-shaped plates 7 move.

[0039] As Figures 4 - 5As shown, an arched seat is fixedly connected to the rear end surface of the air cooler 6. A rotating shaft is fixedly connected to the inner walls of the arched seat and two cranks 9. The rotating shaft is rotatably connected to the inner wall of the U-shaped seat 4. It is equivalent to that the arched seat and the air cooler 6 are rotatably connected to the lower end inner wall of the U-shaped seat 4. That is, when the crank 9 rotates, the air cooler 6 can be flipped. The L-shaped plate 7 is slidably connected to the left and right end surfaces of the U-shaped seat 4 in the front and back directions. When the U-shaped seat 4 moves up and down, it can drive the rotating shaft, the L-shaped plate 7, the air cooler 6, the crank 9, etc. to move up and down synchronously, and the crank 9, the air cooler 6, etc. can also rotate on the U-shaped seat 4. When the air cooler 6 moves forward or backward, under the engagement of the first sliding pin 10 and the first keyway 11, the crank 9 can be swung forward or backward. When the crank 9 swings forward or backward, it can drive the air cooler 6 to flip.

[0040] On the left and right sides of the front end surface of the vertical plate, first guiding plates 12 are respectively fixedly connected. On the outer end faces of the two L-shaped plates 7, live pins 8 are respectively fixedly connected. Long vertical grooves 13 and short inclined grooves 14 that are matched with the live pins 8 are respectively formed on the first guiding plates 12.

[0041] As Figure 3 or Figure 5 As shown, the first guiding plates 12 are used to limit and guide the live pins 8. Under the engagement of the live pins 8 with the long vertical grooves 13 and the short inclined grooves 14, when the live pins 8 are engaged with the long vertical grooves 13, the driving box 3, the U-shaped seat 4, the air cooler 6, the L-shaped plate 7, the live pins 8, etc. move down synchronously. The live pins 8 and the L-shaped plate 7 can move vertically downward, that is, the L-shaped plate 7 will not move forward or backward. That is, the corresponding air cooler 6 can maintain a horizontal downward movement without flipping. When the live pins 8 move downward to enter the inner wall of the short inclined grooves 14, at this time, the driving box 3, the U-shaped seat 4, the air cooler 6, the L-shaped plate 7, the live pins 8, etc. move down synchronously. Under the engagement of the live pins 8 with the short inclined grooves 14, the live pins 8 and the L-shaped plate 7 will move forward. When the L-shaped plate 7 moves forward, it can drive the air cooler 6 to flip, so that the air cooler 6 deflects downward by a specified angle to blow air and dissipate heat to the welding part of the semiconductor chip. Similarly, when the driving box 3, the U-shaped seat 4, the air cooler 6, the L-shaped plate 7, the live pins 8, etc. move up synchronously, under the engagement of the short inclined grooves 14, the long vertical grooves 13 and the live pins 8, the air cooler 6 can be flipped upward to the horizontal state, and then the air cooler 6 maintains the horizontal state and continues to move upward to reset, that is, blowing air and dissipating heat to the welding torch 5 under normal conditions.

[0042] The worktable includes a cross base 26 capable of rotating. Four evenly distributed brackets 31 are fixedly connected to the outer end surface of the cross base 26. Support plates 32 are fixedly connected to the upper surfaces of the brackets 31 respectively. A clamping mechanism is provided on the support plates 32. The semiconductor chip and the wire are respectively placed on the corresponding support plates 32. The operating table 1 is respectively provided with a loading area, a spraying area, a welding area and an unloading area. When the cross base 26 rotates to make the support plate 32 reach the corresponding loading area and unloading area, the clamping mechanism can be closed and hidden inside the inner wall of the support plate 32. When the cross base 26 rotates to make the support plate 32 reach the corresponding spraying area and welding area, the clamping mechanism can be opened to clamp and position the semiconductor chip.

[0043] Such as Figures 6 - 11As shown, the cross-shaped seat 26 is used to rotate and move components such as the support 31 and the support plate 32. The support plate 32 is used to support and fix the semiconductor chip and the wire. Through the set clamping mechanism, when the clamping mechanism is opened, the semiconductor chip can be positioned and clamped, so that the semiconductor chip is in the middle position of the support plate 32, so as to facilitate cooperation with the corresponding work when rotating to the designated area. The welding torch 5 is arranged in the welding area. The feeder 15 is arranged in the feeding area at the upper end of the operating table 1, the soldering flux sprayer 17 is arranged in the spray area, and the conveyor belt 16 is arranged in the discharging area. Under the mutual cooperation of the clamping mechanism and the rotation of the cross-shaped seat 26, when the cross-shaped seat 26 rotates to make the corresponding support plate 32 reach the loading area and the unloading area, the clamping mechanism is in the closed state at this time, that is, at the outer end and on the inner wall of the support plate 32. When loading or unloading the support plate 32, the clamping mechanism will not affect the corresponding work; when the cross-shaped seat 26 rotates to make the corresponding support plate 32 reach the spray area and the welding area, the clamping mechanism is in the open state and can position and clamp the semiconductor chip, making the spray or welding process more accurate; the feeder 15 contains a plurality of semiconductor chips to be welded. The bottom of the feeder 15 is provided with a pushing rod, and the lower end of the feeder 15 is provided with a discharge port. When the pushing rod moves forward, it can push the lowermost semiconductor chip, and the semiconductor chip moves out from the discharge port and reaches the support plate 32 in the feeding area, thus completing the loading of the support plate 32. The feeder 15 is a prior art and will not be elaborated; the soldering flux sprayer 17 can spray the soldering flux on the semiconductor chip in the spray area. The soldering flux can absorb and take away part of the heat during the heating process, making the temperature change of the welded material gentle, avoiding sudden temperature changes, thus delaying the thermal shock and making the welding material evenly heated. The soldering flux can also react with the oxide to generate a soluble compound, thus removing the oxide and making the metal surface reach the necessary cleanliness. It can not only improve the welding quality, but also effectively protect the welded base material and ensure the performance and reliability of the electronic product. The soldering flux is a prior art and will not be elaborated; when the cross-shaped seat 26 rotates to make the support plate 32 and the semiconductor chip reach the welding area, the semiconductor chip and the wire can be welded and fixed under the operation of the welding torch 5; when the cross-shaped seat 26 rotates to make the support plate 32 and the semiconductor chip reach the unloading area, the semiconductor chip can be pushed onto the conveyor belt 16 under the operation of the U-shaped push plate 37 and reach the designated position under the conveyance of the conveyor belt 16, thus completing the unloading.

[0044] The lower end surface of the support plate 32 is respectively provided with movable first driving frames 42. The two sides of the lower end surface of the support plate 32 are respectively slidably connected with second driving frames 46. Square guide plates 43 are respectively fixed on the two side end faces of the first driving frames 42. Short pins 44 are respectively fixed on the second driving frames 46. Oblique key grooves 45 matching with the short pins 44 are respectively opened on the square guide plates 43; the clamping mechanism includes a plurality of clamping rods 48, and the clamping rods 48 are respectively installed on the corresponding first driving frames 42 and second driving frames 46.

[0045] As Figures 14 - 16 shown, the first driving frame 42 and the second driving frame 46 are respectively slidably connected to the inner wall of the pallet 32. The installation and shape of the square guide plate 43, the short pin 44, and the inclined key groove 45 are as Figure 16 shown. Support seats are respectively fixed on the outer surfaces of the short pins 44, and the support seats are respectively fixed on the corresponding second driving frames 46. It is equivalent to the short pins 44 being fixed on the second driving frames 46. When the first driving frame 42 moves inward, through the engagement of the inclined key groove 45 and the short pins 44, the second driving frame 46 can be driven to move inward. Similarly, when the first driving frame 42 moves outward, the second driving frame 46 can be driven to move outward, that is, the clamping rods 48 can be synchronously moved inward to close to open the clamping mechanism or moved outward to spread to close the clamping mechanism.

[0046] A plurality of square sleeves 47 are slidably connected to the inner wall of the pallet 32. The clamping rods 48 are respectively slidably connected to the inner walls of the corresponding square sleeves 47. Sleeve rods 27 are respectively fixed on the first driving frame 42 and the second driving frame 46. The clamping rods 48 are respectively sleeved on the outer surfaces of the corresponding sleeve rods 27. Second sliding pins 49 are respectively fixed on both end faces of the clamping rods 48. A plurality of second guide plates 50 are fixed on the lower surface of the pallet 32. Upper horizontal grooves 51 and lower inclined grooves 52 that are matched with the second sliding pins 49 are respectively formed on the second guide plates 50.

[0047] As Figure 16 shown, the square sleeves 47 can slide inward or outward on the inner wall of the pallet 32. The clamping rods 48 can be slidably connected up and down on the inner walls of the square sleeves 47, and the clamping rods 48 can also be slidably connected up and down on the outer surfaces of the sleeve rods 27. When the first driving frame 42 and the second driving frame 46 move inward or outward, the sleeve rods 27, the clamping rods 48, the square sleeves 47, etc. can be driven to move inward or outward synchronously, and the clamping rods 48 can also move up and down on the inner walls of the square sleeves 47 and the outer surfaces of the sleeve rods 27, and the two do not affect each other; the installation and shape of the second guide plates 50 and the second sliding pins 49 are as Figure 16As described above, when the second sliding pin 49 engages with the inner wall of the upper horizontal groove 51, when the first driving frame 42, the second driving frame 46, the sleeve rod 27, the clamping rod 48, etc. move inward or outward, the clamping rod 48 can move inward or outward at the uppermost position; when the second sliding pin 49 engages with the inner wall of the lower inclined groove 52, when the first driving frame 42, the second driving frame 46, the sleeve rod 27, the clamping rod 48, etc. move inward, the clamping rod 48 can move upward while moving inward, and can move downward while moving outward when moving outward; therefore, when the first driving frame 42 and the second driving frame 46 move inward, they can drive the clamping rod 48 to move inward and close, that is, the clamping mechanism is opened. At this time, the clamping rod 48 can move upward to the top position, that is, higher than the upper end surface of the support plate 32. At this time, the clamping rod 48 can calibrate, position and clamp the semiconductor chip; when the first driving frame 42, the second driving frame 46, the clamping rod 48, etc. move outward synchronously, the clamping rod 48 can spread outward, that is, the clamping mechanism is closed, and no longer clamps and fixes the semiconductor chip, and the clamping rod 48 can move downward into the inner wall of the support plate 32, that is, the upper end surface of the clamping rod 48 is lower than the upper end surface of the support plate 32, which is convenient for loading and unloading the semiconductor chip.

[0048] Extension pins 41 are respectively provided on the lower end surface of the first driving frame 42. A disk cam 53 is provided on the upper end of the operating table 1. A closed-loop groove matching with the extension pins 41 is opened on the disk cam 53. The closed-loop groove includes a large-radius groove 54, a small-radius groove 55 and a variable-diameter groove 56. The large-radius groove 54 is correspondingly arranged opposite to the loading area and the unloading area, and the small-radius groove 55 is correspondingly arranged opposite to the spraying area and the welding area.

[0049] As Figure 14 Or Figure 17As shown, a plurality of support columns are fixedly connected to the lower end surface of the disc cam 53, and the support columns are fixedly connected to the upper end surface of the operating table 1, which is equivalent to the disc cam 53 being fixedly connected to the upper end of the operating table 1; it is fixedly connected to the lower end surface of the first driving frame 42 through the extension pin 41 and meshes with the closed-loop groove. When the cross seat 26 rotates, it can drive the supporting plate 32, the first driving frame 42, and the extension pin 41 to move circumferentially. When the extension pin 41 moves circumferentially, it can move on the inner wall of the closed-loop groove; that is, when the extension pin 41 meshes with the large-radius groove 54, the extension pin 41 and the first driving frame 42 can be in the outermost end, that is, the corresponding clamping rod 48 is in the outermost end and the clamping mechanism is in the closed state. When the extension pin 41 meshes with the small-radius groove 55, the extension pin 41 and the first driving frame 42 can be in the innermost end, the corresponding clamping rod 48 is in the innermost end, and the clamping mechanism is in the open state, that is, the clamping mechanism can be in the closed state when in the loading area and the unloading area, and in the open state when in the spraying area and the welding area; when the extension pin 41 moves circumferentially on the inner wall of the variable-diameter groove 56, the corresponding extension pin 41, the first driving frame 42, and the clamping rod 48 can move inward or outward; therefore, under the engagement of the extension pin 41 and the closed-loop groove, when the cross seat 26 moves circumferentially, it can drive the supporting plate 32, the semiconductor chip, the clamping mechanism, etc. to move synchronously in a circle. When the supporting plate 32 and the clamping mechanism move to the corresponding loading area and unloading area, the clamping mechanism can be in the closed state, and when the supporting plate 32 and the clamping mechanism move to the corresponding spraying area and welding area, the clamping mechanism can be in the open state.

[0050] The supporting plate 32 is also respectively provided with a blanking mechanism. The blanking mechanisms respectively include a U-shaped pushing plate 37 slidably connected to the supporting plate 32. The inner walls of the supporting seats 31 are respectively provided with extension plates 35 that can move up and down. The two side end faces of the extension plates 35 are respectively fixedly connected with movable guide plates 38 slidably connected to the supporting seats 31. Long inclined slots 40 are respectively formed in the movable guide plates 38, and fixed pins 39 that cooperate with the long inclined slots 40 are respectively fixedly connected to the two side end faces of the U-shaped pushing plate 37.

[0051] As Figures 11 - 13 shown, the U-shaped pushing plate 37 can slide left and right or back and forth on the inner wall of the supporting plate 32, that is, slide inward or outward. The movable guide plates 38 can be slidably connected up and down on the inner walls of the supporting seats 31. When the extension plates 35 move up and down, they can drive the movable guide plates 38 to move up and down; the installation and shape of the movable guide plates 38, the long inclined slots 40, and the fixed pins 39 are as Figure 13 shown. When the extension plate 35 moves downward, it can drive the corresponding movable guide plate 38 to move downward. When the movable guide plate 38 moves downward, through the engagement of the long inclined slot 40 and the fixed pin 39, the fixed pin 39 and the U-shaped pushing plate 37 can be moved outward. When the U-shaped pushing plate 37 moves outward, it can drive the semiconductor chip to move outward. When in the unloading area, the U-shaped pushing plate 37 moving outward can push the semiconductor chip onto the conveyor belt 16.

[0052] A first motor 18 is provided on the upper surface of the operation table 1. A dial 19 is provided at the output end of the first motor 18. A long rotating shaft 24 is rotatably connected to the inner wall of the operation table 1. A sheave 20 that cooperates with the dial 19 is fixedly connected to the lower end of the outer surface of the long rotating shaft 24. A cross seat 26 is fixedly connected to the upper end of the outer surface of the long rotating shaft 24. A circular sleeve 23 is sleeved on the middle part of the outer surface of the long rotating shaft 24. A long cam 21 is coaxially fixedly connected to the upper end of the dial 19. A long pin 22 that cooperates with the long cam 21 is fixedly connected to the outer surface of the circular sleeve 23. A pressing plate 25 extending towards the blanking area is fixedly connected to the upper surface of the circular sleeve 23. A tension spring 36 is fixedly connected to the upper surface of the extension plate 35. The upper end of the tension spring 36 is fixedly connected to the cross seat 26.

[0053] As Figures 8 - 12 shown, the first motor 18 is fixed on the operation table 1. When the first motor 18 is started, it can drive the dial 19 to rotate. When the dial 19 rotates, through the engagement with the sheave 20, the sheave 20 can be intermittently rotated; the long rotating shaft 24 is rotatably connected to the inner wall of the operation table 1, and the limit sheave 20, cross seat 26, etc. can only rotate on the operation table 1; the circular sleeve 23 is sleeved on the outer surface of the long rotating shaft 24, so that the circular sleeve 23 can move up and down on the long rotating shaft 24 and can also rotate with the long rotating shaft 24. The circular sleeve 23 and the disk cam 53 are in a spline connection, that is, the circular sleeve 23 can slide up and down on the inner wall of the disk cam 53, and under the spline connection, the rotation of the circular sleeve 23 and the long pin 22 can also be limited; the installation and shape of the long cam 21 and the long pin 22 are as Figure 8 or Figure 9 shown. When the long cam 21 rotates, it can drive the long pin 22 to intermittently move up and down. When the long pin 22 intermittently moves up and down, it can drive the circular sleeve 23 and the pressing plate 25 to intermittently move up and down; the tension spring 36 always has an upward pulling force on the extension plate 35, so that the extension plate 35 is in the uppermost position under normal conditions and the U-shaped push plate 37 is in the innermost position under normal conditions; when the cross seat 26, the support plate 32, the extension plate 35, etc. move circumferentially, that is, the support plate 32 and the extension plate 35 rotate and move to the position of the blanking area. At this time, when the pressing plate 25 moves downward, it can contact and drive the extension plate 35 to move downward. When the extension plate 35 moves downward, it can drive the U-shaped push plate 37 to move outward, so as to push the semiconductor chip onto the conveyor belt 16. When the pressing plate 25 moves upward to reset, the corresponding extension plate 35 will move upward to reset under the pulling force of the tension spring 36, that is, the corresponding U-shaped push plate 37 can move inward to reset to the initial position; as Figure 2As shown, connecting rods 57 are respectively fixedly connected to the left and right ends of the outer surface of the long cam 21. The upper ends of the connecting rods 57 are fixedly connected to the two side end faces of the driving box 3. When the long cam 21 moves downward, it can drive the connecting rods 57 and the driving box 3 to move up and down, so as to drive the welding torch 5 to move downward to the specified position. The driving box 3 can also be driven up and down by a lead screw nut or a driving telescopic rod, and the driving method can be selected according to requirements; when the first motor 18 is started, it can drive the dial 19 and the long cam 21 to rotate synchronously. When the dial 19 rotates, it can drive the Geneva wheel 20 and the cross seat 26 to rotate intermittently, that is, the corresponding support plate 32 and the semiconductor chip can rotate and move intermittently, so that the semiconductor chip on the support plate 32 stops intermittently for a period of time after reaching the corresponding area, providing working time for welding, loading, unloading or spraying. When the long cam 21 rotates, it can drive the circular sleeve 23 to move up and down intermittently, and the circular sleeve 23 can drive the pressing plate 25, the connecting rod 57, the welding torch 5, etc. to move up and down synchronously and intermittently, that is, it can make the U-shaped push plate 37 move outward to push the semiconductor chip onto the conveyor belt 16. When the welding torch 5 moves downward, it can perform welding treatment on the semiconductor chip. Therefore, through the mutual cooperation of the dial 19, the Geneva wheel 20, the long cam 21 and the long pin 22, after the semiconductor chip rotates to the specified area, the corresponding welding torch 5 can move downward to perform welding work on the semiconductor chip, and the corresponding U-shaped push plate 37 can move outward to push the welded semiconductor chip onto the conveyor belt 16. The feeder 15 can push the semiconductor chip to make the semiconductor chip reach the support plate 32 in the loading area, and the soldering flux sprayer 17 can spray the soldering flux on the semiconductor chip in the spraying area; such as Figure 11As shown in the figure, two fixed clamping plates 34 are fixedly connected to the middle of the inner end face of the support plate 32. Mounting seats 29 are fixedly connected to both sides of the inner end face of the support plate 32. A rotatable bidirectional threaded rod 28 is arranged inside the two mounting seats 29. Two movable clamping plates 33 that are slidably connected to the support plate 32 are threadedly connected to the outer surface of the bidirectional threaded rod 28. The movable clamping plates 33 can slide left and right or front and back on the inner end face of the support plate 32. With the cooperation of the movable clamping plates 33 and the fixed clamping plates 34, the wire can be fixed. By placing the wire between the movable clamping plates 33 and the fixed clamping plates 34, the wire can be fixed under the action of friction. A motor is arranged inside the mounting seat 29, and the function of the motor is to provide a rotational force for the bidirectional threaded rod 28. Two threads with the same pitch and different helix directions are respectively arranged at both ends of the outer surface of the bidirectional threaded rod 28. When the bidirectional threaded rod 28 rotates, it can drive the movable clamping plates 33 to move synchronously inward or outward, adjust the specific position of the movable clamping plates 33 according to the model of the wire, and has a self-locking function under the threaded connection between the bidirectional threaded rod 28 and the movable clamping plates 33, that is, when the bidirectional threaded rod 28 does not rotate, the corresponding movable clamping plate 33 is in a fixed state; a weak spring 30 can also be arranged inside the mounting seat 29 to replace the bidirectional threaded rod 28. One end of the weak spring 30 is fixedly connected to the mounting seat 29, and the other end is fixedly connected to the movable clamping plate 33. The weak spring 30 always has an inward driving force on the movable clamping plate 33, and the movable clamping plate 33 can clamp and fix the wire when the wire is placed. It is selected and set according to needs and will not be elaborated here; whether the weak spring 30 or the bidirectional threaded rod 28 is set, it does not affect the wire moving between the fixed clamping plate 34 and the movable clamping plate 33. That is, when in the blanking area, when the semiconductor chip moves outward to the conveyor belt, it can pull the wire to move synchronously. Since the wire is light and the clamping force between the fixed clamping plate 34 and the movable clamping plate 33 is very small, when rotating and moving, the wire can be driven to move synchronously under the clamping of the fixed clamping plate 34 and the movable clamping plate 33; after the support plate 32 moves to the feeding area, the wire can be placed manually or put by a manipulator.

[0054] When the present invention is in use, when the driving box 3 moves downward, the welding torch 5 can move downward synchronously. When the welding torch 5 moves downward to contact the semiconductor chip and the wire, the semiconductor chip can be welded, so that the wire is welded and fixed on the semiconductor chip. When the driving box 3 moves downward, the cold air fan 6 can also move downward, and the cold air fan 6 can also deflect downward to align with the semiconductor chip. When the cold air fan 6 blows air, it can blow air to dissipate heat from the semiconductor chip, thereby accelerating the heat dissipation of the semiconductor chip, reducing the risk of chip damage, and at the same time accelerating the solidification of the solder joint and improving the welding quality; in the normal state, that is, when the welding torch 5 and the cold air fan 6 are in the top position, the cold air fan 6 can blow air to dissipate heat from the welding torch 5, cool down the welding torch 5, and ensure the normal operation of the welding torch 5.

Claims

1. A welding machine for processing a new type of semiconductor chip, comprising an operating table (1), characterized in that: The operating table (1) is provided with a workpiece table, on which semiconductor chips and wires are placed. The operating table (1) is also provided with a side panel (2), on which a drive box (3) capable of moving up and down is provided. A welding gun (5) is provided at the front end of the drive box (3), and a cooling fan (6) matched with the welding gun (5) is provided at the lower end of the drive box (3). When the drive box (3) moves downward, the welding gun (5) can be moved downward to weld the semiconductor chips and wires. When the drive box (3) moves downward, the cooling fan (6) can be moved downward and deflected downward to blow air to dissipate heat to the semiconductor chips.

2. A bonding machine for processing new semiconductor chips as claimed in claim 1, characterized in that: The drive box (3) is slidably connected to the vertical plate, the welding gun (5) is fixedly connected to the front end surface of the drive box (3), the lower end surface of the drive box (3) is fixedly connected to a U-shaped seat (4), and the cooling fan (6) is installed on the U-shaped seat (4) and can be flipped downward when the cooling fan (6) moves downward to a specified position.

3. A bonding machine for processing new semiconductor chips as claimed in claim 2, characterized in that: The cooling fan (6) is rotatably connected to the inner wall of the U-shaped seat (4); cranks (9) are coaxially fixedly connected to the two sides of the cooling fan (6); first sliding pins (10) are fixedly connected to the cranks (9); L-shaped plates (7) that can move forward and backward are respectively provided on the two sides of the U-shaped seat (4); first key grooves (11) are respectively provided on the L-shaped plates (7); and when the first sliding pin (10) and the first key groove (11) cooperate, the cooling fan (6) can be turned over when the L-shaped plates (7) move.

4. A bonding machine for processing new semiconductor chips as claimed in claim 3, characterized in that: First guide plates (12) are fixedly connected to the left and right sides of the front end surface of the vertical plate, respectively. Live pins (8) are fixedly connected to the outer end surfaces of the two L-shaped plates (7), and the first guide plate (12) is provided with a long vertical groove (13) and a short oblique groove (14) that match the live pin (8).

5. A bonding machine for processing new semiconductor chips as claimed in claim 1, characterized in that: The workpiece table comprises a rotatable cross seat (26), four evenly distributed brackets (31) are fixedly connected to the outer end surface of the cross seat (26), and brackets (32) are respectively fixedly connected to the upper end surfaces of the brackets (31). The brackets (32) are provided with clamping mechanisms, and semiconductor chips and wires are respectively placed on corresponding brackets (32); the operating table (1) is divided into a loading area, a spraying area, a welding area and a unloading area. When the cross seat (26) rotates to make the bracket (32) reach the corresponding loading area and unloading area, the clamping mechanism can be closed and hidden in the inner wall of the bracket (32); when the cross seat (26) rotates to make the bracket (32) reach the corresponding spraying area and welding area, the clamping mechanism can be opened to clamp and position the semiconductor chip.

6. A bonding machine for processing new semiconductor chips as claimed in claim 5, characterized in that: The lower end surface of the support plate (32) is provided with a movable first drive frame (42), and the two sides of the lower end surface of the support plate (32) are slidably connected to the second drive frame (46), and the two side end surfaces of the first drive frame (42) are respectively fixedly connected to the square guide plates (43), and the second drive frame (46) is respectively fixedly connected to the short pins (44), and the square guide plates (43) are respectively provided with oblique key grooves (45) matching with the short pins (44); the clamping mechanism includes a plurality of clamping rods (48), and the clamping rods (48) are respectively installed on the corresponding first drive frame (42) and the second drive frame (46).

7. A bonding machine for processing new semiconductor chips as claimed in claim 6, characterized in that: The inner wall of the support plate (32) is slidably connected to a plurality of square sleeves (47), the clamping rods (48) are slidably connected to the inner walls of the corresponding square sleeves (47), the first drive frame (42) and the second drive frame (46) are respectively fixedly connected to sleeve rods (27), the clamping rods (48) are respectively sleeved on the outer surfaces of the corresponding sleeve rods (27), the end surfaces of both sides of the clamping rods (48) are respectively fixedly connected to second sliding pins (49), the lower end surface of the support plate (32) is fixedly connected to a plurality of second guide plates (50), and the second guide plates (50) are respectively provided with upper transverse grooves (51) and lower inclined grooves (52) that match the second sliding pins (49).

8. A bonding machine for processing new semiconductor chips as claimed in claim 6, characterized in that: The lower end surface of the first drive frame (42) is respectively provided with an extension pin (41), and the upper end of the operating table (1) is provided with a disc cam (53). The disc cam (53) is provided with a closed-loop groove that matches the extension pin (41), and the closed-loop groove includes a large-radius groove (54), a small-radius groove (55) and a diameter-changing groove (56). The large-radius groove (54) is arranged corresponding to the loading area and the unloading area, and the small-radius groove (55) is arranged corresponding to the spraying area and the welding area.

9. A bonding machine for processing new semiconductor chips as claimed in claim 5, characterized in that: The support plates (32) are also provided with feeding mechanisms, which include U-shaped push plates (37) slidably connected to the support plates (32). The inner walls of the support seats (31) are provided with extension plates (35) that can move up and down. The end surfaces of both sides of the extension plates (35) are respectively fixed with movable guide plates (38) slidably connected to the support seats (31). The movable guide plates (38) are respectively provided with long oblique grooves (40). The end surfaces of both sides of the U-shaped push plates (37) are respectively fixed with fixed pins (39) that match the long oblique grooves (40).

10. A bonding machine for processing new semiconductor chips as claimed in claim 9, characterized in that: The upper surface of the operating table (1) is provided with a first motor (18), and the output end of the first motor (18) is provided with a dial (19). The inner wall of the operating table (1) is rotatably connected to a long rotating shaft (24), and the lower end of the outer surface of the long rotating shaft (24) is fixedly connected to a groove wheel (20) that matches the dial (19). A cross seat (26) is fixedly connected to the upper end of the outer surface of the long rotating shaft (24), and a circular sleeve (23) is sleeved on the middle part of the outer surface of the long rotating shaft (24). A long cam (21) is coaxially fixedly connected to the upper end of the dial (19), and a long pin (22) that matches the long cam (21) is fixedly connected to the outer surface of the circular sleeve (23); a pressing plate (25) extending toward the lower material area is fixedly connected to the upper surface of the circular sleeve (23), and a tension spring (36) is fixedly connected to the upper surface of the extension plate (35), and the upper end of the tension spring (36) is fixedly connected to the cross seat (26).

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