Low-silver Ag-Cu-Zn-Ga-In brazing filler metal and preparation method thereof
By designing low-silver Ag-Cu-Zn-Ga-In solder and its preparation method, the existing low-silver cadmium-free silver solder is solved and the lack of performance stability in the brazing process is achieved, and good wetting performance, spreading performance and high mechanical strength on a variety of materials are achieved.
CN120115879APending Publication Date: 2025-06-10CHANGSHU HUAYIN FILLER METALS
Patent Information
- Application Number
- CN202510337593.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-06-10
Smart Images
Figure BDA0005322195530000061
Abstract
The invention discloses a low-silver Ag-Cu-Zn-Ga-In brazing filler metal and a preparation method thereof, and belongs to the technical field of brazing materials, and the low-silver Ag-Cu-Zn-Ga-In brazing filler metal comprises the following components in percentage by weight: less than 15% of Ag, 48.32%-58.18% of Cu, 0.043%-0.082% of Ga, 0.115%-0.137% of In, 0.018%-0.035% of Hf, 0.005%-0.013% of Pd and the balance of Zn. By means of the mode, the low-silver Ag-Cu-Zn-Ga-In brazing filler metal prepared in the embodiment is good in wettability and spreading performance on red copper, H62 brass, Q235 steel and 304 stainless steel, the difference is not obvious, the performance is stable, the mechanical strength of a brazed joint is high, and the application requirements for the good wettability, the good spreading performance and the high strength can be met.
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Citation Information
Patent Citations
Low-silver cadmium-free silver solder
CN109894771A