Post-hole-filling grinding device for blind holes of high-density interconnected printed circuit board

Abstract

The invention belongs to the technical field of circuit board processing, and particularly relates to a high-density interconnected printed circuit board blind hole filling post-grinding device which comprises a grinding machine table, a linear moving seat is slidably mounted at the top of the grinding machine table, and a circuit board clamp is fixedly mounted at the top of the linear moving seat. The right side of the circuit board clamp is fixedly connected with an X-shaped mounting frame, and the right side of the X-shaped mounting frame is fixedly connected with a linear sliding plate. According to the circuit board grinding device, during first-time grinding, an electric push rod drives a motor base to move downwards, a grinding motor drives a grinding roller to rotate, so that the grinding roller grinds resin on a circuit board, the grinding face of the resin is close to the surface of the circuit board, then a circuit board clamp continues to move rightwards, and a second grinding module moves to the position above the circuit board; and then secondary grinding is achieved, the resin surface is smooth, the two grinding modules can automatically switch stations, the circuit board is fixed all the time in the process, deviation is avoided, and the machining quality is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to a blind hole filling and post-grinding device for a high-density interconnected printed circuit board. Background Art

[0002] Electronic products are becoming increasingly thinner and smaller. Directly stacking holes on blind holes is a design method to achieve high-density interconnection. To achieve stacking holes, the blind holes should be filled and the board surface should be flat. The main function of blind holes in circuit boards is to achieve conduction between two layers, and the filling effect is mainly to avoid affecting subsequent welding and high-order stacking hole processing. At the same time, since the board surface is mounted with components, the board surface must be flat, so the blind holes at the component mounting position are generally also filled.

[0003] Common methods for filling blind holes include electroplating, that is, filling the blind holes during the electroplating process through the action of special electroplating additives. However, during the electroplating process, it is easy to have holes filled, the holes are not filled fully, and the flatness of the board surface is poor. For example, the patent with authorization announcement number CN111295052B involves a blind hole filling process and a grinding device for a high-density interconnected printed circuit board. The process includes the following steps: step S1: plating a layer of copper on the inner wall of the blind hole; step S2: making a connecting plate for filling the holes, the position of the through holes on the connecting plate corresponds to the position of the blind holes; step S3: aligning and fixing the connecting plate on the circuit board; step S4: filling the through holes and blind holes with resin; step S5: drying and curing the resin; step S6: grinding to make the surface of the circuit board flat; step S7: surface copper plating on the surface of the circuit board. The above invention has the effects of full filling of blind holes, good filling quality and high board surface flatness. In the above technology, although the hole filling can be made fuller and the flatness can be improved, the fixing effect of the circuit board is not good, and the loading and unloading operations of the circuit board are hindered due to the fixing of the first grinding mechanism and the second grinding mechanism.

[0004] In view of this, the present invention designs a blind hole filling and post-grinding device for a high-density interconnected printed circuit board. Summary of the invention

[0005] The main purpose of the present disclosure is to provide a post-blind hole filling and grinding device for a high-density interconnected printed circuit board, so as to effectively solve the problems raised by the inventor in the above-mentioned background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows: A grinding device for blind via filling of a high-density interconnect printed circuit board, comprising a grinding machine table. A linear moving seat is slidably mounted on the top of the grinding machine table, and a circuit board clamp is fixedly mounted on the top of the linear moving seat. A right side of the circuit board clamp is fixedly connected to an X-shaped mounting frame, and a right side of the X-shaped mounting frame is fixedly connected to a linear slide plate. A rotating shaft is rotatably mounted at an upper end of the linear slide plate, and an angle switching disk is fixedly mounted at a top end of the rotating shaft. Two connecting frames arranged at a right angle are fixedly mounted on a side surface of the angle switching disk. The other ends of the two connecting frames are both fixedly mounted with positioning platforms, and grinding assemblies are mounted on the two positioning platforms. The grinding assemblies are divided into a first grinding module and a second grinding module; A propulsion assembly for driving the linear moving seat to move left and right; A circuit board fixing assembly for positioning a high-density interconnect printed circuit board, and the circuit board fixing assembly is matched with the propulsion assembly; An accompanying sliding assembly for driving the linear slide plate to move left and right; An angle adjusting assembly for driving the angle switching disk to rotate, and the angle adjusting assembly is matched with the propulsion assembly.

[0007] Preferably, the grinding assembly includes an electric push rod, a motor seat, a grinding motor and a grinding roller. The electric push rod is fixedly mounted on the positioning platform, and an output end of the electric push rod faces downward and is fixedly connected to the motor seat. The grinding motor is fixedly mounted on the motor seat. The grinding roller is rotatably mounted on the motor seat through a shaft, and an output end of the grinding motor is fixedly connected to a shaft of the grinding roller. The thicknesses of surfaces of the two grinding rollers are different.

[0008] Preferably, a plurality of bag dust collectors are fixedly mounted on the positioning platform, and inlets of the bag dust collectors face downward.

[0009] Preferably, the propulsion assembly includes a linear chute, an X-axis one-way lead screw and a servo motor. The linear chute is opened on the top of the grinding machine table. The X-axis one-way lead screw is rotatably mounted in the linear chute, and the linear moving seat is threadedly mounted on the X-axis one-way lead screw. The servo motor is fixedly mounted on a side surface of the grinding machine table, and an output end of the servo motor is fixedly connected to the X-axis one-way lead screw. The linear moving seat is limited and slidably connected in the linear chute, and an upper end of the linear moving seat is located outside the linear chute.

[0010] Preferably, the circuit board fixing assembly includes a guide plate, a reciprocating guide rod, a clamping plate, a hemispherical protrusion, a compression spring, and an external force application bar. The circuit board fixture is of a groove structure, and two symmetrically arranged guide plates are fixedly installed inside the circuit board fixture. The reciprocating guide rods are slidably penetrated through both guide plates, and clamping plates are fixedly installed at the ends of the two reciprocating guide rods close to each other. The other ends of the reciprocating guide rods are fixedly connected with hemispherical protrusions. Compression springs are sleeved on the outer ends of the reciprocating guide rods, and the two ends of the compression springs are fixedly connected to the guide plates and the hemispherical protrusions respectively. Two parallel external force application bars are fixedly installed on the top of the grinding machine table, and the two ends of the external force application bar are arc-shaped. The spherical end of the hemispherical protrusion is in sliding contact with the inner side of the external force application bar.

[0011] Preferably, the accompanying sliding assembly includes a first guide rail, a second guide rail, a first slider, and a second slider. The first guide rail and the second guide rail are fixedly installed on the top of the grinding machine table, and both the first guide rail and the second guide rail are located between the two external force application bars. The first slider is slidably sleeved on the first guide rail, the second slider is slidably connected to the second guide rail, and the first slider and the second slider are respectively fixedly connected to the front and rear sides of the linear slide plate.

[0012] Preferably, the angle adjustment assembly includes an X-axis linear rack, a transverse worm, a worm gear, and a circular gear. A rail groove is opened at the top of the second guide rail, and a long opening is opened on one side of the rail groove. The second slider is slidably connected in the long opening. The X-axis linear rack is fixedly installed at the bottom of the rail groove. An installation cavity is opened inside the linear slide plate, and a transverse worm is rotatably installed on the side wall of the installation cavity. The transverse worm movably penetrates through the linear slide plate, the second slider and extends into the rail groove. The end of the transverse worm located in the rail groove is fixedly connected with a circular gear, and the circular gear meshes with the X-axis linear rack. The bottom end of the rotating shaft is rotatably installed on the inner bottom wall of the installation cavity, and a worm gear is fixedly installed on the part of the rotating shaft located inside the installation cavity. The transverse worm meshes with the worm gear.

[0013] Preferably, the heights of the X-shaped mounting frame, the angle switching disk, and the positioning table are all higher than that of the circuit board fixture.

[0014] Preferably, the overall structures of the first grinding module and the second grinding module are the same, except that: the grinding rollers of the first grinding module and the second grinding module are different, so that two grinding operations can be completed.

[0015] The steps of the blind via filling process for high density interconnect printed circuit boards are as follows: Copper is plated on the inner wall of the blind holes of the circuit board; a connecting plate for filling the holes is made, through holes are formed in the connecting plate, the connecting plate is placed on the circuit board, and the through holes are aligned with the blind holes; the through holes and the blind holes are filled with liquid resin by screen printing; the circuit board is dried by a vacuum drying device to cure the liquid resin; the connecting plate is removed, and the resin is polished by the first polishing module of the blind hole filling and grinding device for high-density interconnect printed circuit boards to make the polished surface of the resin close to the surface of the circuit board, and then the remaining resin is polished to the surface of the circuit board by the second polishing module to make it flat; the flat surface of the circuit board is plated with copper.

[0016] During drying by a vacuum dryer, the bubbles generated during the filling of the liquid resin can be discharged in time, preventing the bubbles from remaining in the blind holes, and thus effectively avoiding the situation of incomplete filling of the blind holes.

[0017] In view of this, compared with the prior art, the beneficial effects of the present invention are as follows: (1). In the present application, the circuit board is placed in the circuit board fixture. At this time, the distance between the two clamping plates is the largest, and the circuit board is located between the two clamping plates. When the servo motor works, the X-axis single lead screw rotates, causing the linear moving seat to slide along the linear chute, and the circuit board fixture moves to the right. The hemispherical protrusion is squeezed by the external force application bar, the compression spring is compressed, and the two reciprocating guide rods move towards each other, causing the two clamping plates to move together and fix the circuit board, so that the circuit board to be polished can be automatically fixed. When the hemispherical protrusion disengages from the external force application bar, the fixation is automatically released, making the loading and unloading operations of the circuit board more convenient and the fixation effect better, preparing for the subsequent grinding process.

[0018] (2). In the present application, during the rightward movement of the circuit board fixture, the X-shaped mounting frame pushes the linear slide plate, and the circular gear rolls along the X-axis linear rack, causing the transverse worm to drive the worm wheel to rotate. Subsequently, the rotating shaft drives the angle switching disk to rotate until a positioning table moves above the circuit board fixture. There is a first grinding module on this positioning table. During the first grinding, the electric push rod drives the motor seat to move downward, and the grinding motor drives the grinding roller to rotate, so that the grinding roller grinds the resin on the circuit board to make the polished surface of the resin close to the surface of the circuit board. Then the circuit board fixture continues to move to the right, causing the second grinding module to move above the circuit board, thereby realizing the second grinding, making the resin surface flat, enabling the two grinding modules to automatically switch positions, and the circuit board being fixed throughout this process, avoiding deviation and ensuring the processing quality.

[0019] (3). In the present application, during grinding, the cloth bag vacuum cleaner works to recover the dust during processing, providing a good working environment.

[0020] (4) In this application, after the processing is completed, the circuit board fixture resets and moves leftward until the hemispherical protrusion disengages from the external force application strip, and the circuit board is released from fixation. At this time, both positioning platforms move away from the circuit board fixture, leaving no obstruction above the circuit board, thereby facilitating material taking and placing.

[0021] (5) In this application, drying is carried out through a vacuum dryer, and the bubbles generated during the filling of the liquid resin can be discharged in a timely manner, avoiding the bubbles remaining in the blind holes, and thus effectively avoiding the situation of incomplete filling of the blind holes. Through secondary grinding, the flatness of the circuit board surface is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The following shows a top view of the structure of the grinding device for blind holes of a high-density interconnect printed circuit board provided by the present invention after blind hole filling; Figure 2 The following shows Figure 1 a schematic structural diagram of the angle switching disk and the positioning platform in Figure 3 The following shows Figure 1 a schematic structural diagram of the circuit board fixture in Figure 4 The following shows Figure 3 a schematic diagram after the two clamping plates move away from each other in Figure 5 The following shows a schematic structural diagram of the grinding assembly; Figure 6 The following shows Figure 1 a schematic diagram after the linear moving seat moves to the right in Figure 7 The following shows Figure 1 an enlarged schematic diagram of part A in Figure 8 The following shows a side sectional view of the linear slide plate; Figure 9 The following shows a three-dimensional diagram of the structure of the linear moving seat.

[0023] ICON: 1 - Grinding machine table; 101 - Linear moving seat; 102 - Linear chute; 103 - X-axis one-way lead screw; 104 - Servo motor; 105 - First guide rail; 106 - Second guide rail; 107 - X-axis linear rack; 2 - Circuit board fixture; 201 - Guide plate; 202 - Reciprocating guide rod; 203 - Clamping plate; 204 - Hemispherical protrusion; 205 - Compression spring; 206 - External force application strip; 3 - X-shaped mounting frame; 4 - Angle switching disk; 401 - Rotating shaft; 402 - Connecting frame; 403 - Linear slide plate; 404 - First slider; 405 - Second slider; 406 - Transverse worm; 407 - Worm gear; 408 - Circular gear; 5 - Positioning table; 501 - Electric push rod; 502 - Grinding motor; 503 - Grinding roller; 504 - Bag dust collector. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0025] Please refer to Figures 1-9 , the present invention provides the following embodiments: A grinding device for blind vias of high - density interconnect printed circuit boards after filling, comprising a grinding machine table 1. A linear moving seat 101 is slidably installed on the top of the grinding machine table 1, and a circuit board fixture 2 is fixedly installed on the top of the linear moving seat 101. A right - hand side of the circuit board fixture 2 is fixedly connected to an X - shaped mounting frame 3, and a right - hand side of the X - shaped mounting frame 3 is fixedly connected to a linear slide plate 403. A rotating shaft 401 is rotatably installed at an upper end of the linear slide plate 403, and an angle switching disk 4 is fixedly installed at a top end of the rotating shaft 401. Two connecting frames 402 arranged at a right - angle are fixedly installed on a side surface of the angle switching disk 4. The other ends of the two connecting frames 402 are both fixedly installed with positioning tables 5. Grinding assemblies are installed on both positioning tables 5, and the grinding assemblies are divided into a first grinding module and a second grinding module; A propulsion assembly for driving the linear moving seat 101 to move left and right; A circuit board fixing assembly for positioning high - density interconnect printed circuit boards, and the circuit board fixing assembly cooperates with the propulsion assembly; An accompanying sliding assembly for driving the linear slide plate 403 to move left and right; An angle adjustment assembly for driving the angle switching disk 4 to rotate, and the angle adjustment assembly cooperates with the propulsion assembly.

[0026] Specifically, the grinding assembly includes an electric push rod 501, a motor seat, a grinding motor 502 and a grinding roller 503. The electric push rod 501 is fixedly installed on the positioning table 5, and an output end of the electric push rod 501 faces downward and is fixedly connected to the motor seat. The grinding motor 502 is fixedly installed on the motor seat. The grinding roller 503 is rotatably installed on the motor seat through a shaft, and an output end of the grinding motor 502 is fixedly connected to a shaft of the grinding roller 503. The thicknesses of the surfaces of the two grinding rollers 503 are different. A plurality of bag dust collectors 504 are fixedly installed on the positioning table 5, and inlets of the bag dust collectors 504 face downward. The heights of the X - shaped mounting frame 3, the angle switching disk 4 and the positioning table 5 are all higher than those of the circuit board fixture 2.

[0027] Specifically, the advancing component includes a linear chute 102, an X-axis one-way lead screw 103, and a servo motor 104. The linear chute 102 is provided at the top of the grinding machine table 1. The X-axis one-way lead screw 103 is rotatably installed in the linear chute 102, and the linear moving seat 101 is threadedly installed on the X-axis one-way lead screw 103. The servo motor 104 is fixedly installed on the side of the grinding machine table 1, and the output end of the servo motor 104 is fixedly connected to the X-axis one-way lead screw 103. The linear moving seat 101 is limited and slidably connected in the linear chute 102, and the upper end of the linear moving seat 101 is located outside the linear chute 102.

[0028] Specifically, the circuit board fixing component includes a guide plate 201, a reciprocating guide rod 202, a clamping plate 203, a hemispherical protrusion 204, a compression spring 205, and an external force application bar 206. The circuit board fixture 2 has a groove structure, and two symmetrically arranged guide plates 201 are fixedly installed in the circuit board fixture 2. The reciprocating guide rods 202 are slidably penetrated through both guide plates 201, and clamping plates 203 are fixedly installed at one ends of the two reciprocating guide rods 202 close to each other. The other ends of the reciprocating guide rods 202 are fixedly connected with hemispherical protrusions 204. Compression springs 205 are sleeved on the outer ends of the reciprocating guide rods 202, and both ends of the compression springs 205 are respectively fixedly connected to the guide plate 201 and the hemispherical protrusion 204. Two parallel external force application bars 206 are fixedly installed at the top of the grinding machine table 1, and both ends of the external force application bar 206 are arc-shaped. The spherical end of the hemispherical protrusion 204 is slidably in contact with the inner side of the external force application bar 206.

[0029] Specifically, the accompanying sliding component includes a first guide rail 105, a second guide rail 106, a first slider 404, and a second slider 405. The first guide rail 105 and the second guide rail 106 are fixedly installed at the top of the grinding machine table 1, and both the first guide rail 105 and the second guide rail 106 are located between the two external force application bars 206. The first slider 404 is slidably sleeved on the first guide rail 105, the second slider 405 is slidably connected to the second guide rail 106, and the first slider 404 and the second slider 405 are respectively fixedly connected to the front and rear sides of the linear slide plate 403.

[0030] Specifically, the angle adjustment component includes an X-axis linear rack 107, a transverse worm 406, a worm gear 407, and a circular gear 408. A rail groove is formed at the top of the second guide rail 106, and a long opening is formed on one side of the rail groove. The second slider 405 is slidably connected in the long opening. The X-axis linear rack 107 is fixedly installed at the bottom of the rail groove. An installation cavity is formed inside the linear slide plate 403, and the transverse worm 406 is rotatably installed on the side wall of the installation cavity. The transverse worm 406 movably penetrates through the linear slide plate 403, the second slider 405, and extends into the rail groove. One end of the transverse worm 406 located in the rail groove is fixedly connected to the circular gear 408, and the circular gear 408 meshes with the X-axis linear rack 107. The bottom end of the rotating shaft 401 is rotatably installed on the inner bottom wall of the installation cavity, and the part of the rotating shaft 401 located inside the installation cavity is fixedly installed with the worm gear 407. The transverse worm 406 meshes with the worm gear 407.

[0031] Specifically, the overall structures of the first grinding module and the second grinding module are the same. The difference lies in that the grinding rollers 503 of the first grinding module and the second grinding module are different, enabling two grinding operations to be completed, that is, the coarseness of the surfaces of the two grinding rollers 503 is different. The first grinding: the first grinding roller 503 is for rough grinding, used to grind the grinding surface of the resin to be close to the surface of the circuit board; the second grinding: the second grinding roller 503 is for fine grinding, used to grind the surface of the circuit board flat.

[0032] The steps of the blind via filling process for high-density interconnect printed circuit boards are as follows: Copper plating is performed on the inner walls of the blind vias of the circuit board; a connecting plate for via filling is fabricated, through holes are formed on the connecting plate, the connecting plate is placed on the circuit board, and the through holes are aligned with the blind vias; liquid resin is filled into the through holes and blind vias by screen printing; the circuit board is dried by a vacuum drying device to cure the liquid resin (the resin is epoxy resin); the connecting plate is removed, and the resin is ground by the first grinding module of the blind via filling post-grinding device for high-density interconnect printed circuit boards to make the grinding surface of the resin close to the surface of the circuit board, and then the remaining resin is ground to the surface of the circuit board by the second grinding module to make it flat; copper plating treatment is performed on the flat surface of the circuit board.

[0033] By drying with a vacuum dryer, the bubbles generated during the filling of the liquid resin can be discharged in a timely manner, avoiding the bubbles remaining in the blind vias, and thus effectively avoiding the situation of incomplete filling of the blind vias.

[0034] The specific implementation of this embodiment is as follows: After removing the connecting plate, grinding is carried out. The circuit board is placed in the circuit board fixture 2 (initially, the hemispherical protrusion 204 does not contact the external force application strip 206). At this time, the distance between the two clamping plates 203 is the largest, and the circuit board is located between the two clamping plates 203. The servo motor 104 operates, and the X-axis single lead screw 103 rotates, causing the linear moving seat 101 to slide along the linear chute 102. The circuit board fixture 2 then moves to the right, and the hemispherical protrusion 204 is squeezed by the external force application strip 206. The compression spring 205 is compressed, and the two reciprocating guide rods 202 move towards each other, causing the two clamping plates 203 to move together and fix the circuit board, as Figure 1 shown. Thus, the circuit board to be polished can be automatically fixed. When the hemispherical protrusion 204 disengages from the external force application strip 206, the fixation is automatically released, making the loading and unloading operations of the circuit board more convenient and having a good fixation effect, preparing for subsequent grinding processing. During the rightward movement of the circuit board fixture 2, the X-shaped mounting frame 3 pushes the linear sliding plate 403, and the circular gear 408 rolls along the X-axis linear rack 107, causing the transverse worm 406 to drive the worm wheel 407 to rotate. Subsequently, the rotating shaft 401 drives the angle switching disk 4 to rotate until a positioning table 5 moves above the circuit board fixture 2, as Figure 6 shown. There is a first grinding module on this positioning table 5. During the first grinding, the electric push rod 501 drives the motor base to move downward, and the grinding motor 502 drives the grinding roller 503 to rotate, so that the grinding roller 503 grinds the resin on the circuit board, making the grinding surface of the resin close to the surface of the circuit board. Thereafter, the circuit board fixture continues to move to the right, causing the second grinding module to move above the circuit board, thereby achieving the second grinding and making the resin surface flat. The two grinding modules can automatically switch positions, and the circuit board is always fixed during this process, avoiding deviation and ensuring the processing quality. During grinding, the cloth bag vacuum cleaner 404 operates to recover the dust during processing, providing a good working environment. After processing, the circuit board fixture 2 resets and moves to the left until the hemispherical protrusion 204 disengages from the external force application strip 206, and the circuit board is released from fixation. At this time, both positioning tables 5 move away from the circuit board fixture 2, leaving no obstruction above the circuit board, thus facilitating material taking and placing.

[0035] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0036] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A post-blind hole filling and grinding device for a high-density interconnect printed circuit board, characterized in that: The invention comprises a grinding machine table (1), wherein a linear movable seat (101) is slidably mounted on the top of the grinding machine table (1), and a circuit board fixture (2) is fixedly mounted on the top of the linear movable seat (101), an X-shaped mounting frame (3) is fixedly connected to the right side of the circuit board fixture (2), and a linear slide plate (403) is fixedly connected to the right side of the X-shaped mounting frame (3), a rotating shaft (401) is rotatably mounted on the upper end of the linear slide plate (403), and an angle switching disk (4) is fixedly mounted on the top of the rotating shaft (401), two connecting frames (402) arranged at 90 degrees are fixedly mounted on the side of the angle switching disk (4), and a positioning table (5) is fixedly mounted on the other end of each of the two connecting frames (402), and a grinding assembly is mounted on each of the two positioning tables (5), and the grinding assembly is divided into a first grinding module and a second grinding module; A propulsion assembly, the propulsion assembly being used to drive the linear moving seat (101) to move left and right; A circuit board fixing assembly, the circuit board fixing assembly is used to position a high-density interconnected printed circuit board, and the circuit board fixing assembly cooperates with the pushing assembly; An accompanying sliding assembly, the accompanying sliding assembly being used to drive the linear slide plate (403) to move left and right; An angle adjustment component, the angle adjustment component is used to drive the angle switching disk (4) to rotate, and the angle adjustment component cooperates with the propulsion component.

2. The device for post-filling blind vias of a high-density interconnect printed circuit board according to claim 1, characterized in that: The grinding assembly comprises an electric push rod (501), a motor seat, a grinding motor (502) and a grinding roller (503); the electric push rod (501) is fixedly mounted on the positioning platform (5), and the output end of the electric push rod (501) faces downward and is fixedly connected to the motor seat; the grinding motor (502) is fixedly mounted on the motor seat; the grinding roller (503) is rotatably mounted on the motor seat via an axis, and the output end of the grinding motor (502) is fixedly connected to the axis of the grinding roller (503); and the surfaces of the two grinding rollers (503) have different degrees of coarseness.

3. The device for post-filling blind vias of a high-density interconnect printed circuit board according to claim 2, characterized in that: A plurality of bag vacuum cleaners (504) are fixedly mounted on the positioning platform (5), and the inlets of the bag vacuum cleaners (504) face downwards.

4. The device for post-filling blind vias of a high density interconnect printed circuit board according to claim 2, characterized in that: The propulsion assembly comprises a linear slide (102), an X-axis one-way screw (103), and a servo motor (104); the linear slide (102) is provided on the top of the grinding machine table (1); the X-axis one-way screw (103) is rotatably mounted in the linear slide (102); and the linear moving seat (101) is threadedly mounted on the X-axis one-way screw (103); the servo motor (104) is fixedly mounted on the side of the grinding machine table (1); and the output end of the servo motor (104) is fixedly connected to the X-axis one-way screw (103); the linear moving seat (101) is limitedly slidably connected in the linear slide (102); and the upper end of the linear moving seat (101) is located outside the linear slide (102).

5. The device for post-filling blind vias of a high density interconnect printed circuit board according to claim 4, characterized in that: The circuit board fixing assembly comprises a guide plate (201), a reciprocating guide rod (202), a clamping plate (203), a hemispherical protrusion (204), a compression spring (205) and an external force applying strip (206); the circuit board fixture (2) is a groove structure, and two symmetrically arranged guide plates (201) are fixedly installed in the circuit board fixture (2); the reciprocating guide rod (202) is slidably installed on the two guide plates (201), and the clamping plate (203) is fixedly installed on the ends of the two reciprocating guide rods (202) that are close to each other. The other end of the return guide rod (202) is fixedly connected to a hemispherical protrusion (204), the outer end of the return guide rod (202) is sleeved with a compression spring (205), and the two ends of the compression spring (205) are respectively fixedly connected to the guide plate (201) and the hemispherical protrusion (204), and the top of the grinding machine table (1) is fixedly installed with two parallel external force application strips (206), and the two ends of the external force application strips (206) are arc-shaped, and the spherical end of the hemispherical protrusion (204) slides and contacts with the inner side of the external force application strip (206).

6. The device for post-filling blind vias of a high-density interconnect printed circuit board according to claim 5, characterized in that: The accompanying sliding assembly comprises a first guide rail (105), a second guide rail (106), a first slider (404), and a second slider (405); the first guide rail (105) and the second guide rail (106) are fixedly mounted on the top of the grinding machine table (1), and the first guide rail (105) and the second guide rail (106) are both located between two external force application bars (206); the first slider (404) is slidably mounted on the first guide rail (105), and the second slider (405) is slidably connected to the second guide rail (106); and the first slider (404) and the second slider (405) are respectively fixedly connected to the front and rear sides of the linear slide plate (403).

7. The device for post-filling and grinding blind vias of a high density interconnect printed circuit board according to claim 6, characterized in that: The angle adjustment assembly comprises an X-axis linear rack (107), a transverse worm (406), a worm wheel (407) and a circular gear (408); a track groove is provided at the top of the second guide rail (106), and a long opening is provided on one side of the track groove; the second slider (405) is slidably connected in the long opening; the X-axis linear rack (107) is fixedly installed at the bottom of the track groove; an installation cavity is provided inside the linear slide plate (403), and a transverse worm (406) is rotatably installed on the side wall of the installation cavity, and the transverse worm (406) is rotatably installed on the side wall of the installation cavity. The rod (406) movably passes through the linear slide plate (403) and the second slider (405) and extends into the track groove; one end of the transverse worm (406) located in the track groove is fixedly connected to a circular gear (408), and the circular gear (408) is meshed with the X-axis linear rack (107); the bottom end of the rotating shaft (401) is rotatably mounted on the inner bottom wall of the installation cavity, and a worm wheel (407) is fixedly mounted on the part of the rotating shaft (401) located in the installation cavity, and the transverse worm (406) is meshed with the worm wheel (407).

8. The device for post-filling blind vias of a high-density interconnect printed circuit board according to claim 7, characterized in that: The heights of the X-shaped mounting frame (3), the angle switching plate (4) and the positioning platform (5) are all higher than the circuit board fixture (2).

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