Grinding fluid conveying device and chemical mechanical grinding equipment

Abstract

The invention provides a grinding fluid conveying device and chemical mechanical grinding equipment, the grinding fluid conveying device comprises a conveying pipeline and a flow guide part arranged on the conveying pipeline, the edge part of the flow guide part is provided with a flange, the flange is provided with an opening, and the side, facing a fluid outlet, of the flow guide part is provided with a flow dividing part in a protruding mode; a flow guide channel is formed between the flow dividing piece and the flange, when the grinding fluid conveying pipeline conveys grinding fluid to the grinding pad, under flow dividing of the flow dividing piece, part of the grinding fluid directly flows to the opening from the flow dividing piece, and the other part of the grinding fluid flows into the flow guide channel and flows to the opening from the flow guide channel. According to the grinding fluid flow guiding device, the flow velocity of the grinding fluid is controlled by guiding the grinding fluid, so that the flow velocity of the grinding fluid is more stable, and then the grinding fluid flows to the grinding pad from the opening, so that the grinding fluid is more uniformly distributed on the grinding pad, the grinding fluid is conveniently and uniformly diffused on the grinding pad, and the diffusion efficiency of the grinding fluid is improved.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor manufacturing, and more specifically, relates to a polishing liquid delivery device and a chemical mechanical polishing equipment. Background Art

[0002] CMP (Chemical-Mechanical Planarization), also known as Chemical-Mechanical Polishing, is a technology in the semiconductor device manufacturing process. It uses chemical corrosion and mechanical force to planarize the silicon wafer or substrate material during the processing, precisely controlling the required thickness and flatness of the pattern. During the polishing process, the polishing liquid flows out from the orifice of the polishing liquid delivery pipe and falls near the center position of the polishing pad. Then, under the action of centrifugal force, the polishing liquid is dispersed onto the entire polishing pad. After the polishing step, the polishing pad conditioner cooperates with high-pressure water to condition and clean the polishing pad.

[0003] And after the polishing step, when cleaning the polishing disk, while the high-pressure water flushes the polishing pad, the polishing liquid on the polishing pad will be splashed onto other components in the polishing chamber, especially parts such as the high-pressure water side baffle, the polishing liquid delivery arm, and the upper side of the polishing head. As a result, the polishing liquid crystallizes at these positions, and the crystals falling onto the polishing pad will cause scratches on the wafer, affecting the wafer yield.

[0004] Currently, in the prior art, the landing point of the polishing liquid in the mainstream chemical mechanical polishing equipment is single, and it mainly relies on centrifugal force to disperse onto the entire polishing pad, resulting in low diffusion efficiency of the polishing liquid; and in the prior art, the chemical mechanical polishing equipment cannot effectively clean the polishing liquid delivery arm and the upper side of the polishing head. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a polishing liquid delivery device to solve the technical problem that the diffusion efficiency of the polishing liquid in the prior art still needs to be improved.

[0006] To achieve the above purpose, the first aspect of this application provides a polishing liquid delivery device including a delivery pipe for delivering the polishing liquid, and further includes: A flow guiding member, connected to the liquid outlet of the delivery pipe, and spaced from the liquid outlet. And a baffle is provided at the edge part of the flow guiding member, the baffle extends circumferentially along the flow guiding member, and an opening is provided on the baffle; A flow splitting member, protruding on the side of the flow guiding member facing the liquid outlet, the position of the flow splitting member corresponds to the position of the liquid outlet, and the flow splitting member is spaced from the baffle. A flow guiding channel is formed between the flow splitting member and the baffle, and the flow guiding channel is communicated with the opening Part of the abrasive liquid flows from the flow dividing member to the open end, and part of the abrasive liquid flows to the open end through the diversion channel; Part of the cleaning liquid flows from the flow dividing member to the open end, part of the cleaning liquid flows to the open end through the diversion channel to clean the diversion member and the flow dividing member, and part of the cleaning liquid cleans the conveying pipeline under the sputtering of the flow dividing member.

[0007] Optionally, the diversion member is arranged at an angle to the axial direction of the conveying pipeline, and the diversion member has opposite first and second ends. Along the axial direction of the conveying pipeline, the distance between the first end and the liquid outlet is smaller than the distance between the second end and the liquid outlet, and the open end is located at the second end.

[0008] Optionally, the flow dividing member includes: A first diversion surface, arranged at an angle to the diversion member; A second diversion surface, located at one end of the first diversion surface close to the open end and arranged at a first angle to the first diversion surface; A third diversion surface and a fourth diversion surface, symmetrically arranged on both sides of the first diversion surface with respect to the direction from the first end to the second end, and both the third diversion surface and the fourth diversion surface are arranged at a second angle to the first diversion surface.

[0009] Optionally, the first angle and the second angle are equal.

[0010] Optionally, the retaining edge includes: A first retaining edge, extending from one side of the circumferential direction of the diversion member along the direction from the first end to the second end; A second retaining edge, extending from the other side of the circumferential direction of the diversion member along the direction from the first end to the second end; The end walls of the first retaining edge and the second retaining edge close to the second end are spaced apart to form the open end.

[0011] Optionally, the flow channel includes: A first flow channel, formed between the first retaining edge and the third diversion surface; A second flow channel, formed between the second retaining edge and the fourth diversion surface; The first flow channel and the second flow channel are symmetrically arranged along the direction from the first end to the second end.

[0012] Optionally, A first blocking portion is convexly provided on one side of the portion of the first edge near the second end facing the conveying pipeline, and a second blocking portion is convexly provided on one side of the portion of the second edge near the second end facing the conveying pipeline. The sides of the first blocking portion and the second blocking portion facing the conveying pipeline are both arc-shaped curved surface structures.

[0013] Optionally, Along the axial direction of the conveying pipeline, the area of the conveying pipeline is smaller than the area of the flow guiding member.

[0014] Optionally, it further includes: A cover body sleeved on the outer side of the conveying pipeline; A connecting member, one end of which is connected to the cover body, and the other end opposite to the one end is connected to the flow guiding member.

[0015] The beneficial effect of the abrasive liquid conveying device provided by the present application is that: compared with the prior art, the abrasive liquid conveying device provided by the present application includes a conveying pipeline for conveying abrasive liquid and a flow guiding member arranged at the liquid outlet of the conveying pipeline. The edge portion of the flow guiding member is provided with an edge, and an opening is provided on the edge. A flow dividing member is convexly provided on the side of the flow guiding member facing the liquid outlet. A flow guiding channel is formed between the flow dividing member and the edge, and the flow guiding channel is communicated with the opening. When the abrasive liquid conveying pipeline conveys abrasive liquid to the abrasive pad at a flow rate of the first flow rate, under the diversion of the flow dividing member, part of the abrasive liquid directly flows from the flow dividing member to the opening, and then flows from the opening to the abrasive pad, and another part of the abrasive liquid flows into the flow guiding channel and flows from the flow guiding channel to the opening, so as to realize the diversion of the abrasive liquid to control the flow rate of the abrasive liquid, so that the flow rate of the abrasive liquid is more stable. Subsequently, the abrasive liquid then flows from the opening to the abrasive pad, so that the distribution of the abrasive liquid on the abrasive pad is more uniform, which is convenient for quickly spreading the abrasive liquid evenly on the abrasive pad, thereby improving the diffusion efficiency of the abrasive liquid.

[0016] At the same time, when the cleaning liquid conveying pipeline conveys the cleaning liquid, under the diversion of the flow dividing member, part of the cleaning liquid enters the opening from the flow dividing member, and part of the cleaning liquid enters the flow guiding channel from the flow dividing member and then enters the opening to clean the flow guiding member and the flow dividing member. Subsequently, the cleaning liquid flows out from the opening to clean the parts to be cleaned, such as the upper surface of the abrasive pad, the lower surface of the abrasive head, the circumferential side wall of the abrasive head, and the surface of the high-pressure water side baffle, so as to clean the abrasive liquid crystallization on the above parts. At the same time, under the sputtering of the flow dividing member, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out from the cleaning liquid conveying pipeline, so as to clean the abrasive liquid crystallization on one end of the conveying pipeline near the liquid outlet. At the same time, among the cleaning liquid sputtered by the flow dividing member, part of the cleaning liquid flows to the upper surface of the abrasive head to clean the abrasive liquid crystallization on the upper surface of the abrasive head.

[0017] Second aspect, the present application provides a chemical mechanical polishing apparatus, comprising: A polishing pad that rotates around a preset axis; A polishing head that rotates relative to the polishing pad and is used to press a target wafer onto the polishing pad to polish the target wafer; A polishing liquid delivery device for delivering a polishing liquid and a cleaning liquid to the polishing pad, and the polishing liquid delivery device is the polishing liquid delivery device described in any one of the above.

[0018] The beneficial effects of the chemical mechanical polishing apparatus provided by the present application are as follows: Compared with the prior art, the chemical mechanical polishing apparatus provided by the present application includes the above-mentioned polishing liquid delivery device. The polishing liquid delivery device includes a delivery pipeline for delivering the polishing liquid and a diversion member provided at the liquid outlet of the delivery pipeline. A baffle is provided at the edge portion of the diversion member, and an opening is provided on the baffle. A diversion member protrudes from the side of the diversion member facing the liquid outlet. A diversion channel is formed between the diversion member and the baffle, and the diversion channel is communicated with the opening. When the polishing liquid delivery pipeline delivers the polishing liquid to the polishing pad at a flow rate of the first flow rate, under the diversion of the diversion member, part of the polishing liquid directly flows from the diversion member to the opening, and then flows from the opening to the polishing pad, and another part of the polishing liquid flows into the diversion channel and flows from the diversion channel to the opening, so as to realize the diversion of the polishing liquid to control the flow rate of the polishing liquid, so that the flow rate of the polishing liquid is more stable. Subsequently, the polishing liquid flows from the opening to the polishing pad, so that the distribution of the polishing liquid on the polishing pad is more uniform, which is convenient for quickly diffusing the polishing liquid evenly on the polishing pad, thereby improving the diffusion efficiency of the polishing liquid.

[0019] At the same time, when the cleaning liquid delivery pipeline delivers the cleaning liquid, under the diversion of the diversion member, part of the cleaning liquid enters the opening from the diversion member, and part of the cleaning liquid enters the diversion channel from the diversion member and then enters the opening to clean the diversion member and the diversion member. Subsequently, the cleaning liquid flows out from the opening to clean the parts to be cleaned, such as the upper surface of the polishing pad, the lower surface of the polishing head, the side wall of the circumference of the polishing head, and the surface of the high-pressure water side baffle, so as to clean the crystallization of the polishing liquid on the above parts. At the same time, under the sputtering of the diversion member, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out of the cleaning liquid delivery pipeline, so as to clean the crystallization of the polishing liquid on one end of the delivery pipeline close to the liquid outlet. At the same time, among the cleaning liquid sputtered by the diversion member, part of the cleaning liquid flows to the upper surface of the polishing head to clean the crystallization of the polishing liquid on the upper surface of the polishing head. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 Schematic structural diagram of the chemical mechanical polishing equipment provided by the embodiment of the present application; Figure 2 Schematic structural diagram of the polishing liquid delivery device provided by the embodiment of the present application; Figure 3 Schematic structural diagram of the polishing liquid delivery device from another perspective provided by the embodiment of the present application; Figure 4 Schematic structural diagram of the polishing liquid delivery device provided by another embodiment of the present application; Figure 5 Cross-sectional view of the polishing liquid delivery device provided by the embodiment of the present application.

[0022] Among them, the reference numerals in the figures: 10, delivery pipeline; 11, polishing liquid delivery pipeline; 12, cleaning liquid delivery pipeline; 20, flow guiding member; 21, open end; 22, flow guiding channel; 221, first flow channel; 222, second flow channel; 30, flow splitting member; 31, first flow guiding surface; 32, second flow guiding surface; 33, third flow guiding surface; 34, fourth flow guiding surface; 40, edge stop; 41, first edge stop; 411, first blocking portion; 42, second edge stop; 421, second blocking portion; 50, polishing pad; 60, cover body; 70, connecting member; 80, polishing head; 90, polishing table. Detailed implementation manners

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0026] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0027] Please refer to Figures 1 to 5 together, and now an abrasive liquid delivery device and a chemical mechanical polishing equipment provided by an embodiment of the present application will be described.

[0028] The first aspect of the present application is to provide an abrasive liquid delivery device, including a delivery pipeline 10 for delivering abrasive liquid, a diversion member 20, and a flow splitting member 30.

[0029] Please refer to Figures 1 to 3 together, the diversion member 20 is connected to the liquid outlet of the delivery pipeline 10 and is spaced from the liquid outlet, and a baffle 40 is provided at the edge portion of the diversion member 20. The baffle 40 extends along the circumferential direction of the diversion member 20, and an opening 21 is provided on the baffle 40.

[0030] The flow splitting member 30 protrudes from the side of the diversion member 20 facing the liquid outlet. The position of the flow splitting member 30 corresponds to the position of the liquid outlet, and the flow splitting member 30 is spaced from the baffle 40. A diversion channel 22 is formed between the flow splitting member 30 and the baffle 40, and the diversion channel 22 communicates with the opening 21.

[0031] Specifically, an abrasive liquid delivery pipeline 11 and a cleaning liquid delivery pipeline 12 are provided in the delivery pipeline 10. When the abrasive liquid delivery pipeline 11 delivers abrasive liquid to the polishing pad 50, under the flow splitting of the flow splitting member 30, part of the abrasive liquid directly flows from the flow splitting member 30 to the opening 21, then flows from the opening 21 to the polishing pad 50, and another part of the abrasive liquid flows into the diversion channel 22 and then flows from the diversion channel 22 to the opening 21, thereby realizing the diversion of the abrasive liquid to control the flow rate of the abrasive liquid. Subsequently, the abrasive liquid then flows from the opening 21 to the polishing pad 50, so that the distribution of the abrasive liquid on the polishing pad 50 is more uniform, thereby improving the diffusion efficiency of the abrasive liquid on the polishing pad 50.

[0032] When the cleaning liquid delivery pipe 12 delivers the cleaning liquid, under the diversion of the diverter 30, part of the cleaning liquid enters the open end 21 through the diverter 30, and part of the cleaning liquid enters the diversion channel 22 through the diverter 30 and then enters the open end 21 to clean the deflector 20 and the diverter 30. Subsequently, the cleaning liquid flows out from the open end 21 to clean the parts to be cleaned, such as the upper surface of the polishing pad 50, the lower surface of the polishing head 80, the circumferential side wall of the polishing head 80, and the surface of the high-pressure water side baffle 40, so as to clean the abrasive liquid crystallization on the above parts. At the same time, under the sputtering of the diverter 30, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out from the cleaning liquid delivery pipe 12, so as to clean the abrasive liquid crystallization on the delivery pipe 10 near the liquid outlet.

[0033] At the same time, in the cleaning liquid sputtered by the diverter 30, part of the cleaning liquid is sputtered onto the upper surface of the polishing head 80 to clean the abrasive liquid crystallization on the upper surface of the polishing head 80.

[0034] In this application, the flow rate of the abrasive liquid is 300 ml / min and the flow rate of the cleaning liquid is 1000 ml / min.

[0035] Compared with the prior art, for the abrasive liquid delivery device provided in this application, at the liquid outlet of the delivery pipe 10, there is a deflector 20. A baffle 40 is provided at the edge of the deflector 20, and an open end 21 is provided on the baffle 40. A diverter 30 protrudes from the side of the deflector 20 facing the liquid outlet. A diversion channel 22 is formed between the diverter 30 and the baffle 40, and the diversion channel 22 is communicated with the open end 21. When the abrasive liquid delivery pipe 11 delivers the abrasive liquid to the polishing pad 50 at the flow rate of the first flow rate, under the diversion of the diverter 30, part of the abrasive liquid directly flows from the diverter 30 to the open end 21 and then from the open end 21 to the polishing pad 50, and another part of the abrasive liquid flows into the diversion channel 22 and flows from the diversion channel 22 to the open end 21, so as to realize the diversion of the abrasive liquid to control the flow rate of the abrasive liquid, so that the flow rate of the abrasive liquid is more stable. Subsequently, the abrasive liquid then flows from the open end 21 to the polishing pad 50, so that the distribution of the abrasive liquid on the polishing pad 50 is more uniform, which is convenient for quickly and evenly diffusing the abrasive liquid on the polishing pad 50, thereby improving the diffusion efficiency of the abrasive liquid.

[0036] Meanwhile, when the cleaning liquid delivery pipe 12 delivers the cleaning liquid, under the diversion of the diverging member 30, part of the cleaning liquid enters the open end 21 from the diverging member 30, and part of the cleaning liquid enters the diversion channel 22 from the diverging member 30 and then enters the open end 21 to clean the diversion member 20 and the diverging member 30. Subsequently, the cleaning liquid flows out from the open end 21 to clean the parts to be cleaned, such as the upper surface of the polishing pad 50, the lower surface of the polishing head 80, the circumferential side wall of the polishing head 80, and the surface of the high-pressure water side baffle 40, so as to clean the polishing liquid crystallization on the above parts. At the same time, under the sputtering of the diverging member 30, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out from the cleaning liquid delivery pipe 12, so as to clean the polishing liquid crystallization on one end of the delivery pipe 10 near the liquid outlet. Among the cleaning liquid sputtered by the diverging member 30, part of the cleaning liquid is sputtered onto the upper surface of the polishing head 80 to clean the polishing liquid crystallization on the upper surface of the polishing head 80.

[0037] In an embodiment of the present application, please refer to FIG. Figure 2 and Figure 3 , the shape of the diversion member 20 is circular. In other embodiments of the present application, the shape of the diversion member 20 can also be other shapes, such as square, as long as it can achieve the diversion of the polishing liquid and the cleaning liquid. For the convenience of description, in the present application, the shape of the diversion member 20 is taken as an example of a circle for description.

[0038] In the application, the diversion member 20 is arranged at an angle with the axial direction of the delivery pipe 10, and the diversion member 20 has opposite first and second ends. Along the axial direction of the delivery pipe 10, the distance between the first end and the liquid outlet is less than the distance between the second end and the liquid outlet, and the open end 21 is located at the second end.

[0039] Specifically, please refer to FIG. Figure 2 and Figure 3 , the first end is the high end of the diversion member 20, and the second end is the low end of the diversion member 20. When the polishing liquid flows from the diversion channel 22 on the diverging member 30 to the open end 21, by arranging the diversion member 20 at an angle with the axial direction of the delivery pipe 10, under the action of gravity, the polishing liquid flows from the diversion channel 22 into the open end 21 located at the second end of the diversion member 20 and flows from the open end 21 to the polishing pad 50, so that the diversion member 20 controls the angle of the polishing liquid flowing to the polishing pad 50.

[0040] When part of the cleaning liquid flows from the diversion channel 22 on the diverging member 30 to the open end 21, by arranging the diversion member 20 at an angle with the axial direction of the delivery pipe 10, the diversion member 20 controls the angle of the cleaning liquid flowing to the polishing pad 50.

[0041] In the present application, the diverging member 30 includes a first diversion surface 31, a second diversion surface 32, a third diversion surface 33, and a fourth diversion surface 34.

[0042] Specifically, please refer to FIG. Figure 2 and Figure 3 , the first flow guiding surface 31 is arranged at an angle with the flow guiding member 20. The second flow guiding surface 32 is located at one end of the first flow guiding surface 31 close to the opening 21 and is arranged at a first angle with the first flow guiding surface 31. The third flow guiding surface 33 and the fourth flow guiding surface 34 are symmetrically arranged on both sides of the first flow guiding surface 31 with respect to the direction from the first end to the second end, and both the third flow guiding surface and the fourth flow guiding surface 34 are arranged at a second angle with the first flow guiding surface 31.

[0043] After the grinding fluid or the cleaning fluid enters the flow dividing member 30 from the liquid outlet, part of the grinding fluid or the cleaning fluid enters the opening 21 along the first flow guiding surface 31 and the second flow guiding surface 32, and part of the grinding fluid or the cleaning fluid enters the flow guiding channel 22 from the first flow guiding surface 31, the third flow guiding surface 33 or the fourth flow guiding surface 34. At the same time, when the cleaning fluid flows to the first flow guiding surface 31, the first flow guiding surface 31 is also used to sputter the first cleaning fluid so that the cleaning fluid can clean the grinding fluid crystal on the conveying pipe 10 near the liquid outlet.

[0044] In an embodiment of the present application, the first angle and the second angle are equal and both are 90 degrees.

[0045] In some other embodiments of the present application, the first angle and the second angle are equal and both are obtuse angles, such as 135 degrees, and when the first angle and the second angle are other obtuse angles, it is necessary to be able to divide the grinding fluid or the cleaning fluid.

[0046] In an embodiment of the present application, the plane where the first flow guiding surface 31 is located is perpendicular to the axial direction of the conveying pipe 10.

[0047] In other embodiments of the present application, please refer to Figure 4 , the plane where the first flow guiding surface 31 is located is arranged at an angle with the axial direction of the conveying pipe 10, and the distance between the side of the first flow guiding surface 31 close to the second end and the liquid outlet is less than the distance between the side of the first flow guiding surface 31 close to the first end and the liquid outlet.

[0048] In this embodiment, when the cleaning fluid flows to the first flow guiding surface 31, by arranging the plane where the first flow guiding surface 31 is located at an angle with the axial direction of the conveying pipe 10, part of the cleaning fluid can be sputtered onto the side wall of the end of the conveying pipe 10 close to the liquid outlet.

[0049] In the present application, please refer to Figure 2 and Figure 3 , the retaining edge 40 includes a first retaining edge 41 and a second retaining edge 42.

[0050] The first side edge 41 extends from one circumferential side of the flow guiding member 20 in the direction from the first end to the second end. The second side edge 42 extends from the other circumferential side of the flow guiding member 20 in the direction from the first end to the second end.

[0051] Moreover, the first side edge 41 and the second side edge 42 are integrally provided at the end portion of the first end, and the end walls of the first side edge 41 and the second side edge 42 near the second end are spaced apart to form an opening 21.

[0052] After the grinding fluid or the cleaning fluid enters the flow guiding channel 22 from the flow dividing member 30, the first side edge 41 and the second side edge 42 cooperate with the flow dividing member 30 to guide the grinding fluid and the cleaning fluid in the flow guiding channel 22.

[0053] In this application, the flow guiding channel 22 includes a first flow channel 221 and a second flow channel 222.

[0054] The first flow channel 221 is formed between the first side edge 41 and the third flow guiding surface 33, and the second flow channel 222 is formed between the second side edge 42 and the fourth flow guiding surface 34. The first flow channel 221 and the second flow channel 222 are symmetrically arranged in the direction from the first end to the second end.

[0055] Under the action of the flow dividing member 30, part of the grinding fluid or the cleaning fluid enters the first flow channel 221 from the first flow guiding surface 31 and the third flow guiding surface 33, and then flows from the first flow channel 221 to the opening 21. And part of the grinding fluid or the cleaning fluid enters the second flow channel 222 from the first flow guiding surface 31 and the fourth flow guiding surface 34, and then flows from the second flow channel 222 to the opening 21.

[0056] By symmetrically arranging the first flow channel 221 and the second flow channel 222, the flow rates of the grinding fluid entering the first flow channel 221 and the grinding fluid entering the second flow channel 222 are made the same, so that the flow rates of the grinding fluid flowing to the opening 21 in the first flow channel 221 and the second flow channel 222 are the same, to control the flow rate of the grinding fluid flowing to the grinding pad 50 and ensure that the grinding fluid flows evenly to the grinding pad 50.

[0057] In this application, a first shielding portion 411 is convexly provided on one side of the portion of the first side edge 41 near the second end facing the conveying pipe 10, and a second shielding portion 421 is convexly provided on one side of the portion of the second side edge 42 near the second end facing the conveying pipe 10. The sides of the first shielding portion 411 and the second shielding portion 421 facing the conveying pipe 10 are both arc-shaped curved surface structures. The side wall of the first shielding portion 411 near one end of the opening 21 coincides with the side wall of the first side edge 41 near one end of the opening 21, and the side wall of the second shielding portion 421 near one end of the opening 21 coincides with the side wall of the second side edge 42 near one end of the opening 21.

[0058] Since the deflector 20 is arranged at an angle to the axial direction of the conveying pipeline 10, when the axial direction of the conveying pipeline 10 coincides with the vertical direction, the opening 21 at the second end of the deflector 20 is located at the lowest end. When the abrasive liquid flows from the first flow channel 221 and the second flow channel 222 to the opening 21, in order to prevent the abrasive liquid from overflowing from the deflector 20 at the first flow channel 221 and the second flow channel 222 respectively at the ends of the first baffle 41 and the second baffle 42 close to the opening 21, therefore, a first shielding portion 411 protrudes from the side of the first baffle 41 close to the second end towards the conveying pipeline 10, and a second shielding portion 421 protrudes from the side of the second baffle 42 close to the second end towards the conveying pipeline 10, so as to improve the shielding ability of the positions of the first baffle 41 and the second baffle 42 close to the second end for the abrasive liquid.

[0059] In one embodiment of the present application, please refer to FIG. Figure 2 and Figure 5 , along the axial direction of the conveying pipeline 10, the area of the conveying pipeline 10 is smaller than the area of the deflector 20, that is, the diameter of the deflector 20 is larger than the diameter of the conveying pipeline 10.

[0060] By setting the area of the deflector 20 to be larger than the area of the conveying pipeline 10, when the cleaning liquid flows to the flow dividing member 30 on the deflector 20, the cleaning liquid sputtered by the flow dividing member 30 flows to one end of the conveying pipeline 10 close to the liquid outlet under the guiding of the baffle 40.

[0061] In one embodiment of the present application, the abrasive liquid conveying device further includes a cover body 60 and a connecting member 70.

[0062] Specifically, the cover body 60 is sleeved on the outer side of the conveying pipeline 10 and is arranged at an interval from the liquid outlet, and the diameter of the cover body 60 is larger than the diameter of the conveying pipeline 10 and larger than the diameter of the deflector 20. One end of the connecting member 70 is connected to the cover body 60, and the other end opposite to one end is connected to the deflector 20.

[0063] The number of the connecting members 70 is two. Among the two connecting members 70, one end of one connecting member 70 is connected to the first baffle 41, and the other end is connected to the cover body 60. The other connecting member 70 has one end connected to the second baffle 42 and the other end connected to the cover body 60, so as to connect the deflector 20 to the cover body 60.

[0064] When the cleaning liquid conveying pipeline 12 conveys the cleaning liquid, under the sputtering of the flow dividing member 30, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out of the cleaning liquid conveying pipeline 12, and under the guiding action of the baffle 40, the cleaning liquid flows to one end of the conveying pipeline 10 close to the liquid outlet and the cover body 60, so as to clean the crystallization of the abrasive liquid on one end of the conveying pipeline 10 close to the liquid outlet and the cover body 60.

[0065] In a second aspect, the present application provides a chemical mechanical polishing apparatus, including a polishing pad 50, a polishing head 80, and a polishing liquid delivery device.

[0066] Please refer to Figure 1 , the polishing pad 50 rotates around a preset axis driven by a polishing table 90. The polishing head 80 rotates relative to the polishing pad 50 and is used to press a target wafer onto the polishing pad 50 to polish the target wafer. The polishing liquid delivery device is used to deliver the polishing liquid and the cleaning liquid onto the polishing pad 50, and the polishing liquid delivery device is the polishing liquid delivery device of any one of the above.

[0067] Compared with the prior art, the chemical mechanical polishing apparatus provided by the present application includes the above-mentioned polishing liquid delivery device. In the polishing liquid delivery device, a flow guiding member 20 is provided at the liquid outlet of the delivery pipe 10. A retaining edge 40 is provided at the edge portion of the flow guiding member 20, and an opening 21 is provided on the retaining edge 40. A flow dividing member 30 protrudes from the side of the flow guiding member 20 facing the liquid outlet. A flow guiding channel 22 is formed between the flow dividing member 30 and the retaining edge 40, and the flow guiding channel 22 communicates with the opening 21. When the polishing liquid delivery pipe 11 delivers the polishing liquid to the polishing pad 50 at a flow rate of a first flow rate, under the flow division of the flow dividing member 30, part of the polishing liquid directly flows from the flow dividing member 30 to the opening 21, and then flows from the opening 21 to the polishing pad 50, and another part of the polishing liquid flows into the flow guiding channel 22 and flows from the flow guiding channel 22 to the opening 21, so as to realize the diversion of the polishing liquid to control the flow rate of the polishing liquid, so that the flow rate of the polishing liquid is more stable. Subsequently, the polishing liquid flows from the opening 21 to the polishing pad 50, so that the distribution of the polishing liquid on the polishing pad 50 is more uniform, facilitating the rapid and uniform diffusion of the polishing liquid on the polishing pad 50, thereby improving the diffusion efficiency of the polishing liquid.

[0068] At the same time, when the cleaning liquid delivery pipe 12 delivers the cleaning liquid, under the flow division of the flow dividing member 30, part of the cleaning liquid enters the opening 21 from the flow dividing member 30, and part of the cleaning liquid enters the opening 21 after entering the flow guiding channel 22 from the flow dividing member 30, so as to clean the flow guiding member 20 and the flow dividing member 30. Subsequently, the cleaning liquid flows out from the opening 21 to clean the parts to be cleaned, such as the upper surface of the polishing pad 50, the lower surface of the polishing head 80, the circumferential side wall of the polishing head 80, and the surface of the high-pressure water side baffle 40, so as to clean the polishing liquid crystallization on the above parts. At the same time, under the sputtering of the flow dividing member 30, the flow direction of part of the cleaning liquid is opposite to the flow direction of the cleaning liquid flowing out from the cleaning liquid delivery pipe 12, so as to clean the polishing liquid crystallization at one end of the delivery pipe 10 near the liquid outlet. Among the cleaning liquid sputtered by the flow dividing member 30, part of the cleaning liquid is sputtered onto the upper surface of the polishing head 80 to clean the polishing liquid crystallization on the upper surface of the polishing head 80.

[0069] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A grinding liquid delivery device, comprising a delivery pipeline for delivering grinding liquid and cleaning liquid, characterized in that: Also includes: A flow guide is connected to the liquid outlet of the delivery pipe and is spaced apart from the liquid outlet. The edge of the flow guide is provided with a rib, the rib extends along the circumference of the flow guide, and an opening is provided on the rib; a flow divider, convexly arranged on a side of the flow guide member facing the liquid outlet, the position of the flow divider corresponds to the position of the liquid outlet, the flow divider and the retaining edge are spaced apart, a flow guide channel is formed between the flow divider and the retaining edge, and the flow guide channel is communicated with the open port; Part of the grinding liquid flows from the diverter to the opening, and part of the grinding liquid flows to the opening through the guide channel; Part of the cleaning liquid flows from the diverter to the open port, part of the cleaning liquid flows from the guide channel to the open port to clean the guide and the diverter, and part of the cleaning liquid cleans the delivery pipeline under the sputtering of the diverter.

2. The polishing liquid delivery device according to claim 1, characterized in that: The guide member is arranged at an angle with respect to the axial direction of the conveying pipeline, and has a first end and a second end opposite to each other. Along the axial direction of the conveying pipeline, the distance between the first end and the liquid outlet is smaller than the distance between the second end and the liquid outlet, and the opening is located at the second end.

3. The polishing liquid delivery device according to claim 2, characterized in that: The flow divider comprises: a first flow guide surface, arranged at an angle to the flow guide member; A second flow guiding surface is located at an end of the first flow guiding surface close to the opening and is arranged at a first angle with the first flow guiding surface; The third guide surface and the fourth guide surface are symmetrically arranged on both sides of the first guide surface with respect to the direction from the first end to the second end, and the third guide surface and the fourth guide surface are arranged at a second angle with the first guide surface.

4. The polishing liquid delivery device according to claim 3, characterized in that: The first angle and the second angle are equal.

5. The polishing liquid delivery device according to claim 4, characterized in that: The ribs include: A first rib extending from one side of the guide member in a circumferential direction along a direction from the first end to the second end; A second rib extending from the other side of the guide member in the circumferential direction in a direction from the first end to the second end; The first rib and the second rib are spaced apart from each other near the end wall of the second end to form the opening.

6. The polishing liquid delivery device according to claim 5, characterized in that: The diversion channel comprises: A first flow channel is formed between the first rib and the third guide surface; A second flow channel is formed between the second rib and the fourth guide surface; The first flow channel and the second flow channel are symmetrically arranged along a direction from the first end to the second end.

7. The polishing liquid delivery device according to claim 6, characterized in that: A first shielding portion is protrudingly provided at a portion of the first rib close to the second end toward the side of the conveying pipe, and a second shielding portion is protrudingly provided at a portion of the second rib close to the second end toward the side of the conveying pipe. The first shielding portion and the second shielding portion are both arc-shaped curved surface structures on the side facing the conveying pipe.

8. The polishing liquid delivery device according to claim 1 or 7, characterized in that: Along the axial direction of the conveying pipeline, the cross-sectional area of ​​the conveying pipeline is smaller than the area of ​​the flow guide member.

9. The polishing liquid delivery device according to claim 1, characterized in that: Also includes: A cover body, sleeved on the outer side of the conveying pipeline; A connecting member has one end connected to the cover body and the other end opposite to the one end connected to the flow guide member.

10. A chemical mechanical polishing device, characterized in that: include: A grinding pad, which rotates around a preset axis; A grinding head rotates relative to the grinding pad and is used to press the target wafer onto the grinding pad to grind the target wafer; A grinding liquid delivery device is used to deliver grinding liquid and cleaning liquid to the grinding pad, and the grinding liquid delivery device is the grinding liquid delivery device according to any one of claims 1-9.

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