High-strength and low-modulus epoxy composition and application thereof

Abstract

The invention relates to the technical field of epoxy molding compounds, in particular to a high-strength and low-modulus epoxy composition and application thereof. The composition is composed of epoxy resin, phenolic resin, an inorganic filler, a stress modifier and the like, and the stress modifier optimizes the interfacial compatibility of the material and reduces the viscosity of the system through the synergistic effect of core-shell double-layer nanoparticles and double-hydroxyl-terminated polyether modified silicone oil, and meanwhile, the stress dispersion and enhancement effects are achieved. The epoxy composition still has excellent processability in a high-filling state, is suitable for packaging semiconductors such as integrated circuits and discrete devices, remarkably improves the reliability of packaging pieces, prolongs the service life of the packaging pieces, and provides a new technical path for high-performance electronic packaging materials.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy molding compounds, and particularly relates to a high-strength and low-modulus epoxy composition and its application. Background Art

[0002] Due to its excellent mechanical properties, electrical insulation properties, and chemical stability, epoxy resin is widely used in fields such as electronic packaging materials, coatings, adhesives, and composite materials. However, with the development of electronic devices towards miniaturization and high performance, higher requirements are put forward for epoxy resin-based packaging materials, especially the comprehensive performance balance in terms of fluidity, mechanical properties, and packaging reliability. In a traditional epoxy resin system under a high filling state, the fluidity is likely to decrease due to the too high viscosity of the system, which in turn affects the molding performance during the packaging process. In addition, the internal stress problem of the cured material will also affect the reliability of the package, manifested as an increase in defects such as pores and delamination.

[0003] In the prior art, some studies have improved the fluidity and mechanical properties of epoxy resin by introducing modified fillers or adding flexible modifiers. For example, by adding silicone oil or polyether-based flexible modifiers, the viscosity of the epoxy resin system can be reduced to a certain extent, and the flexibility of the material can be improved. However, the addition of such modifiers often leads to insufficient rigid skeletons in the cured system, thus having an adverse impact on the mechanical strength and heat resistance of the material. In addition, the poor interfacial compatibility between traditional fillers and the matrix easily causes uneven dispersion, further reducing the comprehensive performance of the material.

[0004] The application of core-shell structured nanoparticles provides a new direction for the performance modification of epoxy resin. By adjusting the chemical structure and interfacial characteristics of the core and shell layers, core-shell particles can achieve good compatibility with the epoxy resin matrix, and at the same time play a dual role of filling and strengthening and stress buffering. However, there are still certain limitations in the existing core-shell particle preparation technologies. For example, insufficient regulation of the hydrophilicity and hydrophobicity of the shell layer may lead to poor dispersion of the particles in the matrix and weak interfacial bonding force, thus affecting the modification effect. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to propose a high-strength and low-modulus epoxy composition and its application, so as to provide a stress modifier suitable for epoxy resin to improve the fluidity, mechanical properties, and packaging reliability of the epoxy composition, while taking into account the balance between the system viscosity and the mechanical properties after curing.

[0006] For the above purposes, the present invention provides an epoxy composition with high strength and low modulus, which is obtained by mixing the following raw materials by weight, kneading, and then pulverizing after natural cooling: 75-90 parts of epoxy resin, 30-45 parts of phenolic resin, 750-900 parts of inorganic filler, 1-5 parts of colorant, 2-10 parts of coupling agent, 1-3 parts of mold release agent, 0.5-2 parts of ester wax, 10-15 parts of accelerator, 2-8 parts of flame retardant, and 3-7 parts of stress modifier.

[0007] Furthermore, the preparation steps of the stress modifier are as follows:

[0008] (1) Add an emulsifier to deionized water, heat up to 55-65 °C, stir for 20-40 min, then add sulfuric acid to adjust the pH to 2.2-2.8, heat up to 80-90 °C, add octamethylcyclotetrasiloxane and vinyltriethoxysilane, and keep stirring for 5-7 h to obtain an alkenylated polysiloxane emulsion;

[0009] (2) Add methyl methacrylate, triallyl isocyanurate, and 2-hydroxyethyl acrylate to the alkenylated polysiloxane emulsion, dropwise add an aqueous solution of ammonium persulfate with a concentration of 2-3 wt%, after the addition is complete, heat up to 70-80 °C, keep stirring for 2.5-3.5 h, and dry under vacuum to obtain core-shell double-layer nanoparticles;

[0010] (3) Add double-ended hydroxyl polyether modified silicone oil and core-shell double-layer nanoparticles to toluene, stir at 250-350 rpm for 20-40 min, then let it stand for 1.5-2.5 h, and dry under vacuum to obtain the stress modifier.

[0011] Preferably, in step (1), the emulsifier is a mixture of emulsifier OP-10 and emulsifier Tween80 in a weight ratio of 2.5-3.5:1.

[0012] Preferably, in step (1), the weight ratio of the emulsifier, deionized water, octamethylcyclotetrasiloxane, and vinyltriethoxysilane is 0.15-0.35:30-80:3.5-5.5:0.2-1.

[0013] Preferably, in step (2), the weight ratio of methyl methacrylate, triallyl isocyanurate, 2-hydroxyethyl acrylate, alkenylated polysiloxane emulsion, and aqueous ammonium persulfate solution is 0.8-2.2:0.04-0.12:0.6-2.5:10-30:0.5-1.5.

[0014] Preferably, in step (3), the weight ratio of double-ended hydroxyl polyether modified silicone oil, core-shell double-layer nanoparticles, and toluene is 0.5-1.5:3-7:30-70.

[0015] Preferably, the epoxy resin is one or more of bisphenol A epoxy resin, linear phenolic epoxy resin, bisphenol F epoxy resin, biphenyl aralkyl epoxy resin, triphenylmethane epoxy resin, and naphthalene-based epoxy resin.

[0016] Preferably, the phenolic resin is linear phenolic resin.

[0017] Preferably, the inorganic filler is one or more of crystalline silica, alumina, boron nitride, silicon nitride, and aluminum nitride.

[0018] Preferably, the coupling agent is one or more of functional group-free silicone coupling agent, mercapto-based silicone coupling agent, amino-based silicone coupling agent, or epoxy-based silicone coupling agent.

[0019] Preferably, the colorant is carbon black.

[0020] Preferably, the release agent is one or more of brown polyethylene wax, natural palm wax, stearic acid, oxidized polyethylene wax, montanic acid ester, or polyamide wax.

[0021] Preferably, the ester wax is montanic acid polyol ester wax.

[0022] Preferably, the accelerator is one or more of imidazole-based curing accelerators, amine-based curing accelerators, organic phosphorus-based curing accelerators, and anhydride-based curing accelerators.

[0023] Preferably, the flame retardant is a filled halogen-free flame retardant.

[0024] The high-strength and low-modulus epoxy composition provided by the present invention can be used for the encapsulation of semiconductors such as integrated circuits and discrete devices.

[0025] Advantages of the present invention:

[0026] By introducing a modified stress modifier into the epoxy composition, the present invention significantly improves the fluidity, mechanical properties, and encapsulation reliability of the material. Through the synergistic effect of core-shell double-layer nanoparticles and bis-hydroxyl-terminated polyether modified silicone oil, the interfacial compatibility of the material is optimized, and the viscosity of the system is reduced, enabling the epoxy composition to maintain good processing performance even under high filling conditions. The core-shell particles form a stable interfacial bond with the matrix by regulating the chemical properties of the shell layer, and at the same time achieve stress dispersion and strengthening effects, thereby improving the heat resistance and mechanical strength of the material.

[0027] In addition, by optimizing the addition amount of the polyether-modified silicone oil, the present invention avoids the problem of insufficient rigid skeleton caused by excessive flexible phase, ensuring the dimensional stability and mechanical properties of the cured material. The reasonable design of the modifier enables the epoxy composition to exhibit excellent flexibility and heat resistance under high-temperature conditions, significantly reducing defects such as air holes and delamination caused by internal stress during the encapsulation process and improving the reliability of the encapsulated parts.

[0028] Compared with the prior art, by co-designing the combination of core-shell particles and flexible modifiers, the present invention not only achieves the balance between fluidity and mechanical properties, but also effectively improves the processing performance and service life of the material. This technical solution is applicable to the field of high-performance electronic packaging materials, providing a new technical path for solving problems such as poor fluidity, stress concentration, and insufficient reliability in traditional epoxy resin systems. Detailed implementation manners

[0029] To make the objectives, technical solutions, and advantages of the present invention clearer and more understandable, the following further details the present invention in conjunction with specific embodiments.

[0030] Double-ended hydroxyl polyether-modified silicone oil: Haiduo Silicon Materials, H-3667;

[0031] o-Cresol epoxy resin: Nan Ya, NPCN-701;

[0032] Linear phenolic resin: Minghe Chemical Industry Co., Ltd., MEHC-7800M;

[0033] Crystalline silica: Lianrui, DC1270;

[0034] Accelerator: Jiangsu Kangle New Materials, 2MZ;

[0035] Carbon black: Mitsubishi Chemical Corporation, MA-600;

[0036] Oxidized polyethylene wax: Clariant Germany GmbH, Licowax E PED;

[0037] Montanic acid polyol ester wax: Clariant Germany GmbH, LICOWAX E PWD;

[0038] Coupling agent: Chenguang, CG-O187;

[0039] Flame retardant: Yuxing, TL01-1.

[0040] Example 1:

[0041] The raw materials used in Example 1 are shown in Table 1;

[0042] Table 1 Raw material ratio of Example 1

[0043] Raw materials Dosage / g Raw materials Dosage / g o-Cresol epoxy resin 75 Oxidized polyethylene wax 1 Linear phenolic resin 30 Montanic acid polyol ester wax 0.5 Crystalline silica 750 Accelerator 10 Carbon black 1 Flame retardant 2 Coupling agent 2 Stress modifier 3

[0044] Weigh and mix according to the raw material dosages in Table 1, then knead at 100 °C for 5 min on a rubber kneader, and pulverize after natural cooling to obtain a high-strength and low-modulus epoxy composition.

[0045] The preparation method of the stress modifier is as follows:

[0046] (1) Add 0.15 g of emulsifier OP-10 / emulsifier Tween 80 (weight ratio 2.5:1) to 30 g of deionized water, heat up to 55 °C, stir for 20 min, then add sulfuric acid to adjust the pH to 2.2, heat up to 80 °C, add 3.5 g of octamethylcyclotetrasiloxane and 0.2 g of vinyltriethoxysilane, and keep stirring for 5 h to obtain an alkenylated polysiloxane emulsion;

[0047] (2) Add 0.8 g of methyl methacrylate, 0.04 g of triallyl isocyanurate, and 0.6 g of 2-hydroxyethyl acrylate to 10 g of the alkenylated polysiloxane emulsion, dropwise add 0.5 g of an aqueous ammonium persulfate solution with a concentration of 2 wt%, after the addition is complete, heat up to 70 °C, keep stirring for 2.5 h, and dry under vacuum to obtain core-shell double-layer nanoparticles;

[0048] (3) Add 0.5 g of double-end hydroxy polyether modified silicone oil and 3 g of core-shell double-layer nanoparticles to 30 g of toluene, stir at 250 rpm for 20 min, then let stand for 1.5 h, and dry under vacuum to obtain the stress modifier.

[0049] Example 2:

[0050] The raw materials used in Example 2 are shown in Table 2;

[0051] Table 2 Raw material ratio of Example 2

[0052] Raw materials Dosage / g Raw materials Dosage / g o-Cresol epoxy resin 88 Oxidized polyethylene wax 2 Linear phenolic resin 37 Montanic acid polyol ester wax 1 Crystalline silica 840 Accelerator 12 Carbon black 3 Flame retardant 6 Coupling agent 6 Stress modifier 5

[0053] Weigh and mix according to the raw material dosages in Table 2, then knead at 100 °C for 5 min on a rubber kneader, and pulverize after natural cooling to obtain a high-strength and low-modulus epoxy composition.

[0054] The preparation method of the stress modifier is as follows:

[0055] (1) Add 0.25 g of emulsifier OP-10 / emulsifier Tween 80 (weight ratio 3:1) to 50 g of deionized water, heat up to 60 °C, stir for 30 min, then add sulfuric acid to adjust the pH to 2.5, heat up to 85 °C, add 4.5 g of octamethylcyclotetrasiloxane and 0.5 g of vinyltriethoxysilane, and keep stirring for 6 h to obtain an alkenylated polysiloxane emulsion;

[0056] (2) Add 1.5 g of methyl methacrylate, 0.08 g of triallyl isocyanurate, and 1.5 g of 2-hydroxyethyl acrylate to 20 g of vinylated polysiloxane emulsion. Dropwise add 0.8 g of aqueous ammonium persulfate solution with a concentration of 2.5 wt%. After the addition is complete, raise the temperature to 75 °C, keep stirring for 3 h, and then conduct vacuum drying to obtain core-shell double-layer nanoparticles;

[0057] (3) Add 1 g of double-ended hydroxyl polyether modified silicone oil and 5 g of core-shell double-layer nanoparticles to 50 g of toluene. Stir at 300 rpm for 30 min, then let it stand for 2 h, and conduct vacuum drying to obtain a stress modifier.

[0058] Example 3:

[0059] The raw materials used in Example 3 are shown in Table 3;

[0060] Table 3 Raw material ratio of Example 3

[0061] Raw materials Dosage / g Raw materials Dosage / g o-Cresol epoxy resin 90 Oxidized polyethylene wax 3 Linear phenolic resin 45 Montanic acid polyol ester wax 2 Crystalline silica 900 Accelerator 15 Carbon black 5 Flame retardant 8 Coupling agent 10 Stress modifier 7

[0062] Weigh and mix according to the raw material dosages in Table 3, and then conduct mixing on a rubber mill at 100 °C for 5 min. After natural cooling, pulverize to obtain a high-strength and low-modulus epoxy composition.

[0063] The preparation method of the stress modifier is as follows:

[0064] (1) Add 0.35 g of emulsifier OP-10 / Tween 80 (weight ratio 3.5:1) to 80 g of deionized water. Raise the temperature to 65 °C, stir for 40 min, then add sulfuric acid to adjust the pH to 2.8. Raise the temperature to 90 °C, add 5.5 g of octamethylcyclotetrasiloxane and 1 g of vinyltriethoxysilane, and keep stirring for 7 h to obtain a vinylated polysiloxane emulsion;

[0065] (2) Add 2.2 g of methyl methacrylate, 0.12 g of triallyl isocyanurate, and 2.5 g of 2-hydroxyethyl acrylate to 30 g of vinylated polysiloxane emulsion. Dropwise add 1.5 g of aqueous ammonium persulfate solution with a concentration of 3 wt%. After the addition is complete, raise the temperature to 80 °C, keep stirring for 3.5 h, and then conduct vacuum drying to obtain core-shell double-layer nanoparticles;

[0066] (3) Add 1.5 g of double-ended hydroxyl polyether modified silicone oil and 7 g of core-shell double-layer nanoparticles to 70 g of toluene. Stir at 350 rpm for 40 min, then let it stand for 2.5 h, and conduct vacuum drying to obtain a stress modifier.

[0067] Comparative Example 1:

[0068] The difference between Comparative Example 1 and Example 1 is that: in step (3), polyether modified silicone oil is not added;

[0069] Comparative Example 2:

[0070] The difference between Comparative Example 2 and Example 2 is that: the addition amount of polyether-modified silicone oil in step (3) is 0.1 g;

[0071] Comparative Example 3:

[0072] The difference between Comparative Example 3 and Example 2 is that: the addition amount of polyether-modified silicone oil in step (3) is 10 g;

[0073] Comparative Example 4:

[0074] The difference between Comparative Example 4 and Example 2 is that: hydroxyethyl acrylate in step (2) is replaced by methyl methacrylate;

[0075] Performance test:

[0076] Spiral flow length (SF): A spiral die is used to measure the spiral flow length. Under the conditions of a molding press temperature of 175 °C, an injection clamping pressure of 6.9 MPa, and a curing time of 120 s, the measured spiral flow length, with the unit of cm;

[0077] Gelation time (GT): Pour the epoxy molding compound powder onto the center of an electric hot plate at 175 ± 2 °C, and immediately use a tongue depressor to flatten the powder. The flattened area is controlled within 5 cm 2 . Starting from the time when the powder melts, use a tongue depressor to knead the melt at a frequency of 1 time per second. When the melt changes from a fluid state to a gel state, it is judged as the end point, and the time used is read. Operate three times in the same way (the difference between the three measured values is not more than 2 s), and the gelation time is the average of the three times;

[0078] Flash length (Flash): It is measured on a molding press with the help of a flash metal mold. The mold temperature is 175 ± 2 °C, and the transfer pressure is 70 kg ± 2 kg / cm 2 . Take 20 ± 2 g of the sample powder, pour it into the plastic sealing machine cavity for molding. After opening the mold 120 seconds after molding, move the mold to the operating table, and use the FLASH mold to measure the length of the flash overflowing from different grooves, with the unit expressed in mm;

[0079] Pudding mold: This method is used to simulate the magnitude of the force when the epoxy molding compound peels off the Cu metal surface. A spline is pressed by a molding press (the bottom diameter of the black glue = 3.5 mm, the bottom area = 9.621 mm 2 ), and the molding conditions are: the metal mold temperature is 175 ± 2 °C, the injection pressure is 70 ± 2 kg / cm 2 , and the curing time is 120 s. After molding, place the metal part of the sample on the push crystal machine platform for direct testing and record the data;

[0080] Flexural Strength and Modulus: Splines were pressed by a molding press (the spline dimensions were 80 mm in length, 10 mm in width, and 4 mm in height), and the molding conditions were as follows: the temperature of the metal mold was 175 ± 2 °C, the injection pressure was 70 ± 2 kg / cm 2 , and the curing time was 120 s. The flexural strength and modulus of the formed splines were measured on a universal tensile testing machine using the three-point bending test method;

[0081] Reliability Testing: First, the required devices were encapsulated using a molding press, and then the encapsulated frame was placed in a thermostatic and humidistatic chamber at 60 °C and 60% humidity for 40 h. After taking out the frame, ultrasonic scanning microscopy was used to analyze the delamination situation, and the results are shown in Table 4.

[0082] Table 4 Performance Test Results

[0083]

[0084]

[0085] Data Analysis:

[0086] From the data of Examples 1 - 3 in Table 4, it can be seen that after adding the stress modifier to the epoxy composition prepared by the present invention, the appearance, mechanical strength, toughness, and encapsulation reliability of the system are significantly improved. This is due to the synergistic effect of the core-shell double-layer nanoparticles and polyether-modified silicone oil in the stress modifier, which effectively reduces the viscosity of the system and improves the powder dispersion, thereby improving the flexibility of the material at high temperatures and ultimately enhancing the overall performance of the material.

[0087] From the data of Example 2 and Comparative Example 1 in Table 4, it can be seen that introducing a stress modifier without polyether-modified silicone oil treatment into the epoxy composition will lead to an increase in the viscosity of the epoxy composition system, a decrease in fluidity, a decrease in mechanical strength under high-temperature conditions, and an increase in the pore ratio in the encapsulated device. This may be because the surface chemical properties of the unmodified stress modifier are not sufficient to form good interfacial compatibility with the epoxy resin matrix, resulting in poor dispersion, and thus the performance of the system such as appearance, mechanical strength, and toughness is poor.

[0088] From the data of Example 2 and Comparative Example 2 in Table 4, it can be seen that when the addition amount of polyether-modified silicone oil is reduced, the modification effect of the stress modifier is insufficient, the interfacial activity of the core-shell double-layer structure is not enough, and the viscosity of the system cannot be effectively reduced, thus having a limited improvement effect on the overall performance of the system.

[0089] From the data of Example 2 and Comparative Example 3 in Table 4, it can be seen that if the addition amount of polyether-modified silicone oil continues to increase, it will lead to too low viscosity of the system, affecting the structural stability of the epoxy composition, and further reducing the mechanical strength and heat resistance of the material. This may be because excessive polyether-modified silicone oil forms too many flexible phases in the system, resulting in insufficient rigid framework of the system and a decrease in mechanical properties.

[0090] From the data of Example 2 and Comparative Example 4 in Table 4, it can be seen that when preparing core-shell double-layer particles, after replacing hydroxyethyl acrylate with methyl methacrylate, both the fluidity and mechanical properties of the epoxy composition decrease. This is because hydroxyethyl acrylate can adjust the hydrophilicity and hydrophobicity of the shell surface, enabling the hydrophilic end of the double-ended hydroxyl polyether-modified silicone oil to adsorb on the shell surface, thereby achieving better interfacial compatibility and dispersibility, and enhancing the effect of the stress modifier in the epoxy composition. However, the introduction of methyl methacrylate may lead to too strong rigidity of the shell structure, reducing the interfacial compatibility and flexibility, and ultimately affecting the comprehensive properties of the material.

[0091] In summary, by optimizing the preparation method of the stress modifier and its component ratio, the present invention realizes a balanced improvement in the performance of the epoxy composition, showing significant advantages in fluidity, mechanical strength, and encapsulation reliability.

[0092] Those of ordinary skill in the art should understand that: the discussion of any above embodiment is only exemplary and is not intended to imply that the scope of the present invention is limited to these examples; under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above, which are not provided in detail for the sake of brevity.

Claims

1. A high-strength, low-modulus epoxy composition, characterized in that: The following raw materials are mixed, naturally cooled and then crushed to obtain the product, by weight: 75-90 parts of epoxy resin, 30-45 parts of phenolic resin, 750-900 parts of inorganic filler, 1-5 parts of colorant, 2-10 parts of coupling agent, 1-3 parts of release agent, 0.5-2 parts of ester wax, 10-15 parts of accelerator, 2-8 parts of flame retardant and 3-7 parts of stress modifier; The preparation steps of the stress modifier are as follows: (1) adding an emulsifier to deionized water, heating the water to 55-65° C., stirring the water for 20-40 min, adding sulfuric acid to adjust the pH to 2.2-2.8, heating the water to 80-90° C., adding octamethylcyclotetrasiloxane and vinyltriethoxysilane, and stirring the water for 5-7 h to obtain an olefinated polysiloxane emulsion; (2) adding methyl methacrylate, triallyl isocyanurate and hydroxyethyl acrylate to the olefinated polysiloxane emulsion, adding a 2-3 wt % aqueous solution of ammonium persulfate dropwise, heating to 70-80° C. after the addition is complete, stirring at this temperature for 2.5-3.5 h, and vacuum drying to obtain core-shell double-layer nanoparticles; (3) adding the double-terminal hydroxyl polyether modified silicone oil and the core-shell double-layer nanoparticles into toluene, stirring at 250-350 rpm for 20-40 min, standing for 1.5-2.5 h, and vacuum drying to obtain a stress modifier; In the step (1), the weight ratio of the emulsifier, deionized water, octamethylcyclotetrasiloxane and vinyltriethoxysilane is 0.15-0.35:30-80:3.5-5.5:0.2-1; In the step (2), the weight ratio of methyl methacrylate, triallyl isocyanurate, hydroxyethyl acrylate, olefinic polysiloxane emulsion and aqueous ammonium persulfate solution is 0.8-2.2:0.04-0.12:0.6-2.5:10-30:0.5-1.5; In the step (3), the weight ratio of the double-terminal hydroxyl polyether modified silicone oil, the core-shell double-layer nanoparticles and toluene is 0.5-1.5:3-7:30-70.

2. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The emulsifier in step (1) is a mixture of emulsifier OP-10 and emulsifier Tween 80 in a weight ratio of 2.5-3.5:

1.

3. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The epoxy resin is one or more of bisphenol A epoxy resin, linear phenolic epoxy resin, bisphenol F epoxy resin, biphenyl aralkyl epoxy resin, trisphenol methane epoxy resin, and naphthalene epoxy resin.

4. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The phenolic resin is a linear phenolic resin.

5. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The inorganic filler is one or more of crystalline silica, alumina, boron nitride, silicon nitride and aluminum nitride.

6. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The coupling agent is one or more of a non-functional siloxane coupling agent, a mercapto-type siloxane coupling agent, an amino-type siloxane coupling agent or an epoxy-type siloxane coupling agent.

7. The high-strength, low-modulus epoxy composition according to claim 1, characterized in that The colorant is carbon black, the release agent is one or more of brown polyethylene wax, natural palm wax, stearic acid, oxidized polyethylene wax, montanic acid ester or polyamide wax, the ester wax is montanic acid polyol ester wax, the accelerator is one or more of imidazole curing accelerator, amine curing accelerator, organic phosphorus curing accelerator, acid anhydride curing accelerator, and the flame retardant is a filled halogen-free flame retardant.

8. An application of a high-strength, low-modulus epoxy composition, characterized in that: Used in semiconductor packaging.

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