Security module circuit board aging detection method and system

Abstract

The invention relates to the technical field of electrical variable measurement, in particular to an aging detection method and system for a safety module circuit board, and the method comprises the steps: collecting voltage data of the safety module circuit board during each detection in an aging test process, dividing a rising edge and a falling edge, analyzing the difference between the rising edge and the falling edge of each extreme point, and determining the aging of the safety module circuit board. Obtaining a morphological symmetry difference value; step sections of the rising edges and the falling edges are extracted, voltage deviations of the step sections are analyzed, step jump coefficients are obtained by combining the sudden change degrees of the step sections, voltage waveform abnormal values in the detection processes are calculated, and the voltage waveform abnormal values in the detection processes are calculated by combining the fluctuation degrees of all the voltage waveform abnormal values in each detection process. The influence coefficient of the performance of the circuit board fluctuating along with the detection factors in each detection process is obtained, then the comprehensive performance fluctuation coefficient of each detection is obtained, the abnormal value of the aging state of the circuit board is obtained in combination with the abnormal value of the voltage waveform, and the aging state of the circuit board is judged. The circuit board aging detection precision is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electrical variable measurement, and in particular to a method and system for detecting aging of a circuit board of a safety module. Background Art

[0002] Security module circuit boards are components and circuits with integrated security functions, used to protect electronic devices and systems from electrical failures, environmental factors, and malicious attacks. As time goes by or environmental factors affect them, the materials and components on the circuit board gradually degrade, causing the performance of the security template circuit to degrade. Electrical testing of circuit board aging is a key step in evaluating its long-term reliability and performance degradation.

[0003] In actual use, circuit boards may face dynamic environmental changes, such as rapid changes in temperature or periodic changes in humidity, which will affect the performance of the circuit board. The existing patents have limitations in the test environment during the circuit board aging detection process, and the circuit board of the security module has a more stringent protection mechanism in design. The abnormal features extracted under aging failures may not be obvious, which leads to insufficient accuracy in the aging detection of the circuit board of the security module. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of this application is to provide a safety module circuit board aging detection method and system, and the technical solutions adopted are as follows: The present application embodiment provides a method for detecting aging of a circuit board of a security module, comprising the following steps: Collect voltage data of the safety module circuit board during each test during the aging test; The voltage data is fitted to obtain the voltage fitting curve of each test, the extreme points in the voltage fitting curve are analyzed to divide the rising edge and the falling edge, the distance relationship and the time difference between the rising edge and the falling edge of each extreme point are analyzed, and the morphological symmetry difference value on both sides of each extreme point is obtained; Analyze the voltage changes of each rising edge and falling edge, extract the step segments of each rising edge and each falling edge, analyze the voltage deviation between each step segment, and combine the mutation degree between the step segments to obtain the step jump coefficient of each rising edge and each falling edge respectively. Combine the morphological symmetry difference values ​​on both sides of all extreme points to obtain the voltage waveform abnormal value in each detection process; Analyze the fluctuation degree of all voltage waveform abnormal values ​​in each detection process, and combine the peak characteristics of the voltage waveform abnormal values ​​in each detection process to obtain the influence coefficient of the circuit board performance during each detection process with the fluctuation of the detection factors, and then obtain the comprehensive performance fluctuation coefficient of each detection; Combined with the change trend of the comprehensive performance fluctuation coefficient corresponding to all tests during the aging test and the voltage waveform abnormal value, the circuit board aging state abnormal value is obtained to determine the circuit board aging state.

[0005] Preferably, the method for obtaining the rising edge and the falling edge is: The curve segment corresponding to the minimum point on the left end and the maximum point on the right end in the voltage fitting curve is taken as the rising edge of the voltage waveform, and the curve segment corresponding to the maximum point on the left end and the minimum point on the right end is taken as the falling edge of the voltage waveform.

[0006] Preferably, the method for obtaining the morphological symmetry difference values ​​on both sides of each extreme point is: For each extreme point, take the vertical line where the extreme point is located as the symmetry axis, flip the first falling edge adjacent to the left side of the symmetry axis around the symmetry axis to obtain a flip line segment, and calculate the DTW distance between the obtained flip line segment and the first rising edge on the right side; The absolute value of the difference in time length between the rising edge and the falling edge adjacent to each other on both sides of the extreme point is calculated, and the product of the absolute value and the DTW distance is used as the morphological symmetry difference value on both sides of the extreme point.

[0007] Preferably, the step of extracting each rising edge and each falling edge further comprises: taking the line segments corresponding to the continuous data points with a slope of 0 in each rising edge and falling edge as the step segments corresponding to the rising edge and falling edge.

[0008] Preferably, the calculation method for the step jump coefficient of any rising edge is: ,in, is the step jump coefficient of any rising edge, B represents the product of the average value of the time length corresponding to all step segments of any rising edge and the cumulative sum of the voltage differences between all adjacent step segments, represents a logarithmic function with base 2, and C represents the cumulative sum of the absolute values ​​of the slopes between the last data in each step segment of any rising edge and the first data in the next adjacent step segment; If there is no step segment between the rising edge and the falling edge, the step jump coefficient is recorded as 0.

[0009] Preferably, the method for obtaining the voltage waveform abnormal value in each detection process is: The mean of the morphological symmetry difference values ​​on both sides of all extreme points in each detection process and the mean of the step jump coefficients of all rising edges and falling edges are obtained, and the sum of the two means is taken as the voltage waveform abnormal value in each detection process.

[0010] Preferably, the method for obtaining the influence coefficient of the circuit board performance during each test process as the test factors fluctuate is: Peak extraction is performed on all voltage waveform abnormal values ​​during each detection process, and the kurtosis of the peak position is calculated. The product of the kurtosis and the corresponding amplitude of the peak is used as the influence coefficient of the circuit board performance during each detection process with the fluctuation of the detection factors, where the detection factors include temperature and humidity.

[0011] Preferably, the method for obtaining the comprehensive performance fluctuation coefficient of each detection is: The Shannon entropy of all voltage waveform abnormal values ​​in each detection process is calculated, and the product of the average value of the influence coefficient obtained in each detection and the Shannon entropy is used as the comprehensive performance fluctuation coefficient of each detection.

[0012] Preferably, the method for obtaining the abnormal value of the circuit board aging state is: The comprehensive performance fluctuation coefficient obtained in all the detection processes is fitted, and the average slope value of the fitting curve at all points is calculated, which is recorded as the slope mean. The product of the slope mean and the average value of the voltage waveform anomaly values ​​in all the detection processes is taken as the circuit board aging state anomaly value.

[0013] An embodiment of the present application also provides a security module circuit board aging detection system, including a memory, a processor, and a computer program stored in the memory and running on the processor, and when the processor executes the computer program, the steps of any one of the above-mentioned security module circuit board aging detection methods are implemented.

[0014] From the above, it can be seen that the security module circuit board aging detection method and system provided by the present application have at least the following beneficial effects: The present application performs aging detection through a cyclic temperature and humidity durability test method, which has the advantage of being able to more realistically evaluate its performance stability under long-term use and various environmental conditions; further in-depth analysis of the waveform abnormality characteristics of the voltage data during each detection process, combined with the degree to which the performance is affected by temperature and humidity changes and the magnitude of performance changes over time, calculates the circuit board aging state abnormality value, and performs aging detection and evaluation on the circuit board, which has the advantage of being able to accurately obtain the key electrical change characteristics corresponding to the aging of the circuit board, thereby improving the accuracy of aging detection of the safety module circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1A flowchart of the steps of a safety module circuit board aging detection method provided in this application; Figure 2 A schematic diagram of the process of obtaining the morphological symmetry difference values ​​on both sides of the extreme point provided in this application. DETAILED DESCRIPTION

[0017] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined invention purpose, the following is a detailed description of a safety module circuit board aging detection method and system proposed in the present application, its specific implementation method, structure, features and effects, in combination with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0018] Unless otherwise specified and limited, terms such as "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such articles or devices. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the article or device including the element. In addition, the term "and\or" used herein includes any and all combinations of one or more related listed items. All technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application.

[0019] The specific scheme of a safety module circuit board aging detection method and system provided by the present application is described in detail below with reference to the accompanying drawings.

[0020] See also Figure 1 , which shows a flowchart of a method for detecting aging of a circuit board of a security module provided by an embodiment of the present application, including the following steps: Step 1: Collect voltage data of the safety module circuit board during each test during the aging test.

[0021] The safety module circuit board is the core component that integrates safety functions and circuit connections. Its performance and reliability directly affect the stable operation of the equipment. In actual applications, the circuit board may be affected by many factors, such as temperature and humidity, which will cause the aging of the circuit board. The circuit board is prone to line abnormalities. Especially in extreme environments, the performance of the components in the circuit board will decline significantly, such as the increase in resistance or the decrease in capacitance, which affects the signal transmission function of the circuit. Therefore, the electrical performance test can better reflect the aging status of the safety module circuit board.

[0022] In order to more comprehensively reflect the operating status of the circuit board in different environments, this application conducts a durability environmental stress test on the security module circuit board, places the circuit board in different temperature and humidity environments, and monitors its electrical performance. In the humidity test, the detection environment temperature is set to , and the humidity range is 10% to 90%. The ambient humidity is adjusted by increasing or decreasing 10% each time. Cyclic tests are performed within this humidity range, and each temperature change from the lowest to the highest and then to the lowest is considered a humidity cycle test. During the temperature test, in this embodiment, the ambient humidity is set to 50% and the temperature range is to , each time by increasing or decreasing To adjust the ambient temperature, a cycle test is performed within the temperature range, and each temperature cycle test from the lowest to the highest and then to the lowest is regarded as a temperature cycle test. It should be noted that in this embodiment, the temperature cycle test and the humidity cycle test are performed alternately. In this embodiment, for the convenience of description and understanding, each temperature cycle test and each humidity cycle test are recorded as one test.

[0023] Furthermore, the detection time length after each temperature or humidity adjustment is set to 2 minutes. In this embodiment, the entire detection time of the temperature test and the humidity test is set to 48 hours. The voltage waveform data of the safety module circuit board during each detection process is collected by an oscilloscope, and the data collection frequency is 1000HZ.

[0024] Step 2: Fit the voltage data to obtain the voltage fitting curve of each detection, analyze the extreme points in the voltage fitting curve to divide the rising edge and the falling edge, analyze the distance relationship and time difference between the rising edge and the falling edge of each extreme point, and obtain the morphological symmetry difference value on both sides of each extreme point.

[0025] After the safety module circuit board ages, its internal components are prone to expansion, contraction, poor welding and uneven coating, which affects its working stability. Since different components on the safety module circuit board have different sensitivities to temperature and humidity, and in order to be able to observe possible faults and problems of the circuit board in a shorter period of time, this embodiment adopts a cyclic temperature and humidity durability method for monitoring, so as to observe the performance changes of various components on the circuit board under different environmental conditions and improve the test efficiency. In addition, in each test process, in order to simulate the operation under actual working conditions, a certain workload is applied to the safety module circuit board, and combined with the temperature and humidity cycle change detection, the change characteristics of the voltage data during each test process are analyzed.

[0026] Taking any one of the tests as an example, after the aging of the safety module circuit board, there will be performance degradation of the filter capacitor and resistor components and imbalance of the drive circuit, which will lead to abnormal waveform in the output voltage, specifically manifested as asymmetric characteristics and step-like fluctuation characteristics. The asymmetric characteristics are reflected by the asymmetry of the rising edge and the falling edge of the voltage waveform data, and the time difference between the rising edge and the falling edge. Therefore, in order to analyze this feature, the following processing is first performed.

[0027] Since the voltage collected by the oscilloscope is discrete data, the present application first uses polynomial fitting technology to process the voltage data to obtain the voltage fitting curve corresponding to this detection. Although there may be step fluctuations in the details of the rising edge or falling edge of the voltage waveform, its overall change still shows a sine wave style, and then all extreme points in the voltage fitting curve are obtained, and the curve segment corresponding to the left end point of the voltage fitting curve is the minimum point and the right end point is the maximum point as the rising edge of the voltage waveform, and the curve segment corresponding to the left end point of the voltage fitting curve is the maximum point and the right end point is the minimum point as the falling edge of the voltage waveform. Then, asymmetric features are performed based on the divided rising and falling edges. Taking a certain maximum point as an example, the vertical line where it is located is used as the axis of symmetry, and the first falling edge adjacent to the left side of the axis of symmetry is flipped around the axis of symmetry to obtain a flip line segment, and then the DTW distance between the flip line segment and the first rising edge on the right is calculated, and the DTW distance reflects the waveform style difference characteristics on both sides of the extreme point. The absolute value of the difference between the time lengths of the rising edge and the falling edge on both sides of the maximum point is further calculated, and the product of the absolute value and the DTW distance is taken as the morphological symmetry difference value on both sides of the maximum point, which reflects the local asymmetric characteristics of the voltage waveform data.

[0028] Correspondingly, for the minimum point, the vertical line where the minimum point is located is also used as the symmetry axis, and the same calculation steps as above in this embodiment are adopted to obtain the morphological symmetry difference value corresponding to the minimum point.

[0029] Specifically, the schematic diagram of the process of obtaining the morphological symmetry difference value on both sides of the extreme point is as follows: Figure 2 shown.

[0030] Step 3: Analyze the voltage changes at each rising edge and falling edge, extract the step segments of each rising edge and each falling edge, analyze the voltage deviation between each step segment, and obtain the step jump coefficient of each rising edge and each falling edge respectively in combination with the mutation degree between the step segments. Combined with the morphological symmetry difference values ​​on both sides of all extreme points, the voltage waveform abnormality in each detection process is obtained.

[0031] In addition, when the circuit board ages, there are certain stepped fluctuation characteristics in its voltage data at its rising edge and falling edge. If the width of each step is larger, the height difference between steps is larger, and the jump is steeper, it indicates that the component aging degree is more serious. Therefore, for analyzing this characteristic, the following processing is carried out. Taking a rising edge of the voltage data as an example, if there is a step change, there are continuous data points with a slope of 0 corresponding to the defect, and then the line segments corresponding to all continuous data points with a slope of 0 are obtained as the step segments of this rising edge. First, calculate the average value of the corresponding time lengths of all step segments of this rising edge, then calculate the cumulative sum of the voltage differences between all adjacent step segments, and obtain the cumulative result of the absolute value of the slope between the last data in each step segment and the first data in the next step segment. The calculation method of the step jump coefficient for any rising edge is: , where is the step jump coefficient of any rising edge, B represents the product between the average value of the corresponding time lengths of all step segments of any rising edge and the cumulative sum of the voltage differences between all adjacent step segments, C represents the cumulative sum of the absolute values of the slopes between the last data in each step segment of any rising edge and the first data in the adjacent next step segment, represents the logarithmic function with base 2. Since the slopes obtained during the stepped fluctuation process may be extremely large, mapping is performed through the logarithmic function. The larger the obtained step jump coefficient, the more significant the stepped fluctuation appears in the voltage waveform data, and the more likely the performance of the component is affected by aging. If there is no step jump, that is, there is no step segment, the step jump coefficient is recorded as 0.

[0032] So far, through the above process of this embodiment, the step jump coefficients of all rising edges can be obtained. Correspondingly, for each falling edge, repeat the above process of this embodiment to obtain the step segments of each falling edge and calculate the step jump coefficients of each falling edge.

[0033] Through the above analysis, the asymmetry characteristics and stepped fluctuation characteristics in the output voltage are obtained. The two comprehensively reflect the abnormal characteristics of the waveform of the safety module circuit board due to aging. Furthermore, for each detection, obtain the average value of the morphological symmetry difference values on both sides of all extreme points during each detection process, and the average value of the step jump coefficients of all rising edges and falling edges. Take the sum of the two average values as the voltage waveform anomaly value during each detection process. The larger the voltage waveform anomaly value, the more significant the asymmetry characteristics and stepped fluctuation characteristics of the voltage waveform during the detection process.

[0034] Step 4: Analyze the fluctuation degree of all voltage waveform anomaly values during each detection process, and combine the peak characteristics of the voltage waveform anomaly values during each detection process to respectively obtain the influence coefficients of the circuit board performance fluctuating with the detection factors during each detection process, and then obtain the comprehensive performance fluctuation coefficient for each detection.

[0035] Furthermore, when performing aging tests on circuit boards, it is crucial to conduct cyclic temperature and humidity durability tests. This test method helps evaluate the reliability and stability of circuit boards by simulating various temperature and humidity environments that circuit boards may encounter during actual use. Therefore, the abnormal characteristics of voltage data obtained under various temperature and humidity test environments can reflect the aging characteristics that may occur in circuit boards. In low humidity environments, the moisture in the air is reduced, and static electricity is more likely to accumulate. Electrostatic discharge may damage sensitive components on circuit boards, causing component performance degradation or even failure. High humidity environments can easily lead to oxidation and corrosion of metal parts such as solder joints and wires on circuit boards, affecting the reliability of circuit board connections. In addition, under low temperature conditions, the strength of solder joints in circuit boards will decrease, which may lead to desoldering and short circuits. Under high temperature environments, the conductive properties of electronic devices will be significantly reduced, current transmission will be poor, and resistance values ​​will change, affecting the overall performance of the circuit. It can be seen that under extreme ambient humidity and extreme ambient temperature conditions, the abnormal characteristics exhibited by circuit boards during aging are more significant.

[0036] In this embodiment, the detection factors include temperature and humidity. Specifically, taking the temperature cycle test as an example, for each temperature cycle test, the performance of the circuit board in the normal state is less affected by the change of ambient temperature, while the performance difference of the circuit board in the aging state under temperature fluctuation is larger. Therefore, during each temperature cycle detection process, the obtained voltage waveform abnormal value may fluctuate accordingly with the rise and fall of temperature. Then, the Shannon entropy of all voltage waveform abnormal values ​​in the temperature cycle test is first calculated, and this value reflects the degree of fluctuation of the performance of the circuit board with temperature change. In addition, there is a state where the ambient temperature is relatively high during the cycle process, resulting in a peak value in the voltage waveform abnormal values ​​arranged in ascending order of time. The larger the amplitude of the obtained peak, the sharper the peak, indicating that the temperature has a higher degree of influence on the performance of the circuit board. Then, the findpeaks algorithm is used to extract the peaks of all voltage waveform abnormal values, and the kurtosis of the peak position is calculated. The product of the kurtosis and the corresponding amplitude of the peak is used as the influence coefficient of the circuit board performance with temperature fluctuation during the detection process. This value reflects the degree of fluctuation of the circuit board performance when the temperature cycle changes.

[0037] According to the above process of this embodiment, the influence coefficient of the circuit board performance with humidity fluctuation during the detection process can be obtained during the humidity cycle test. For each cycle, the product of the mean value of the influence coefficient in each cycle and the Shannon entropy is used as the comprehensive performance fluctuation coefficient of each cycle. This value reflects the comprehensive influence degree of the circuit board performance by the change of ambient temperature and humidity.

[0038] Step 5: Combine the change trend of the comprehensive performance fluctuation coefficient corresponding to all detections during the aging test, and combine the voltage waveform outliers to obtain the circuit board aging state outliers, so as to judge the circuit board aging state.

[0039] The aging detection of the circuit board of the security module usually takes a long time. As the temperature and humidity durability test continues, the aging of its circuit board becomes more and more serious, the degree of influence of performance on the environment becomes greater and greater, and the obtained comprehensive performance fluctuation coefficient will gradually increase, and the increasing amplitude will become larger and larger as the test progresses, thereby reflecting the aging speed of the circuit board. Therefore, in this embodiment, the least squares method is used to fit the comprehensive performance fluctuation coefficients obtained during all detection processes, and the average value of the slope values at all points of the obtained fitting curve is calculated, denoted as the slope mean value. The product of the slope mean value and the mean value of the voltage waveform outliers during all detection processes during the aging test is used as the circuit board aging state outlier. This value reflects that the adaptability of the circuit board during the test process is worse during long-term use.

[0040] In this embodiment, by analyzing the voltage anomaly characteristics in the cyclic temperature and humidity durability test, combining the degree of influence of performance on temperature and humidity changes and the change range of performance over time, the circuit board aging state outlier is calculated. Based on this, the circuit board is aged detected and evaluated. The higher the obtained circuit board aging state outlier, the more unstable the performance of the security module circuit board and the worse the adaptability for long-term use. For quantitative evaluation, this embodiment uses the tanh function to normalize the obtained circuit board aging state outlier, and sets its aging detection and evaluation interval as follows. If the normalization result is less than 0.5, it means that the circuit board has not aged and the performance is good; if the normalization result is greater than or equal to 0.5, it means that the circuit board has aged and the adaptability for long-term use is poor, and corresponding measures need to be taken for maintenance.

[0041] Based on the same inventive concept as the above method, the embodiment of the present application also provides a security module circuit board aging detection system, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any one of the above security module circuit board aging detection methods.

[0042] It can be understood that the above sequence of embodiments of the present application is only for description and does not represent the superiority or inferiority of the embodiments. And the above describes specific embodiments of this specification. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0043] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other, and the differences between each embodiment and other embodiments are emphasized.

[0044] The above content is only the implementation mode of this application and is not intended to limit the scope of this application. Any equivalent structure or equivalent process transformation made by using the content of this application's specification and drawings, or directly or indirectly applied to other related technical fields, shall be equally included in the protection scope of this application.

Claims

1. A method for detecting aging of a circuit board of a safety module, characterized in that: The following steps are involved: Collect voltage data of the safety module circuit board during each test during the aging test; The voltage data is fitted to obtain the voltage fitting curve of each test, the extreme points in the voltage fitting curve are analyzed to divide the rising edge and the falling edge, the distance relationship and the time difference between the rising edge and the falling edge of each extreme point are analyzed, and the morphological symmetry difference value on both sides of each extreme point is obtained; Analyze the voltage changes of each rising edge and falling edge, extract the step segments of each rising edge and each falling edge, analyze the voltage deviation between each step segment, and combine the mutation degree between the step segments to obtain the step jump coefficient of each rising edge and each falling edge respectively. Combine the morphological symmetry difference values ​​on both sides of all extreme points to obtain the voltage waveform abnormal value in each detection process; Analyze the fluctuation degree of all voltage waveform abnormal values ​​in each detection process, and combine the peak characteristics of the voltage waveform abnormal values ​​in each detection process to obtain the influence coefficient of the circuit board performance during each detection process with the fluctuation of the detection factors, and then obtain the comprehensive performance fluctuation coefficient of each detection; Combined with the change trend of the comprehensive performance fluctuation coefficient corresponding to all tests during the aging test and the voltage waveform abnormal value, the circuit board aging state abnormal value is obtained to determine the circuit board aging state.

2. A method for detecting aging of a circuit board of a safety module according to claim 1, characterized in that: The method for obtaining the rising edge and the falling edge is: The curve segment corresponding to the minimum point on the left end and the maximum point on the right end in the voltage fitting curve is taken as the rising edge of the voltage waveform, and the curve segment corresponding to the maximum point on the left end and the minimum point on the right end is taken as the falling edge of the voltage waveform.

3. A method for detecting aging of a safety module circuit board according to claim 1, characterized in that: The method for obtaining the morphological symmetry difference values ​​on both sides of each extreme point is: For each extreme point, take the vertical line where the extreme point is located as the symmetry axis, flip the first falling edge adjacent to the left side of the symmetry axis around the symmetry axis to obtain a flip line segment, and calculate the DTW distance between the obtained flip line segment and the first rising edge on the right side; The absolute value of the difference in time length between the rising edge and the falling edge adjacent to each other on both sides of the extreme point is calculated, and the product of the absolute value and the DTW distance is used as the morphological symmetry difference value on both sides of the extreme point.

4. A method for detecting aging of a safety module circuit board as claimed in claim 1, characterized in that: The step segments of each rising edge and each falling edge are further extracted, which further includes: taking the line segments corresponding to the continuous data points with a slope of 0 in each rising edge and falling edge as the step segments of the corresponding rising edge and falling edge.

5. A method for detecting aging of a safety module circuit board according to claim 1, characterized in that: The calculation method for the step jump coefficient of any rising edge is: ,in, is the step jump coefficient of any rising edge, B represents the product of the average value of the time length corresponding to all step segments of any rising edge and the cumulative sum of the voltage differences between all adjacent step segments, represents a logarithmic function with base 2, and C represents the cumulative sum of the absolute values ​​of the slopes between the last data in each step segment of any rising edge and the first data in the next adjacent step segment; If there is no step segment between the rising edge and the falling edge, the step jump coefficient is recorded as 0.

6. A method for detecting aging of a safety module circuit board according to claim 1, characterized in that: The method for obtaining the voltage waveform abnormal value in each detection process is as follows: The mean of the morphological symmetry difference values ​​on both sides of all extreme points in each detection process and the mean of the step jump coefficients of all rising edges and falling edges are obtained, and the sum of the two means is taken as the voltage waveform abnormal value in each detection process.

7. A method for detecting aging of a safety module circuit board as claimed in claim 1, characterized in that: The method for obtaining the influence coefficient of the circuit board performance during each test as the test factors fluctuate is as follows: Peak extraction is performed on all voltage waveform abnormal values ​​during each detection process, and the kurtosis of the peak position is calculated. The product of the kurtosis and the corresponding amplitude of the peak is used as the influence coefficient of the circuit board performance during each detection process with the fluctuation of the detection factors, where the detection factors include temperature and humidity.

8. A method for detecting aging of a circuit board of a security module according to claim 1, characterized in that: The method for obtaining the comprehensive performance fluctuation coefficient of each test is: The Shannon entropy of all voltage waveform abnormal values ​​in each detection process is calculated, and the product of the average value of the influence coefficient obtained in each detection and the Shannon entropy is used as the comprehensive performance fluctuation coefficient of each detection.

9. A method for detecting aging of a circuit board of a security module according to claim 1, characterized in that: The method for obtaining the abnormal value of the circuit board aging state is: The comprehensive performance fluctuation coefficient obtained in all the detection processes is fitted, and the average slope value of the fitting curve at all points is calculated, which is recorded as the slope mean. The product of the slope mean and the average value of the voltage waveform anomaly values ​​in all the detection processes is taken as the circuit board aging state anomaly value.

10. A safety module circuit board aging detection system, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the computer program, the steps of a security module circuit board aging detection method as described in any one of claims 1 to 9 are implemented.

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