Connecting assembly of micro-electro-mechanical system, scanning mirror and laser radar

Abstract

The invention discloses a connecting assembly of a micro-electro-mechanical system, a scanning mirror and a laser radar, and belongs to the technical field of micro-electro-mechanical systems. The connecting assembly of the micro electro mechanical system comprises two oppositely-arranged fixing piles and at least one connecting beam located between the fixing piles, and each connecting beam at least comprises a first bending part. According to the technical scheme, the fracture resistance can be improved, and movement in a large range is allowed.

Description

Technical Field

[0001] This application belongs to the technical field of microelectromechanical systems, and particularly relates to a connection component, a scanning mirror, and a lidar of a microelectromechanical system. Background Art

[0002] In microelectromechanical systems (Micro-Electro-Mechanical Systems, abbreviated as MEMS), some mechanical structures are designed to provide degrees of freedom of motion for other structures when mechanical deformation occurs, such as a T-shaped bar. Figure 1 For the structural schematic diagram of the T-shaped bar of the related art MEMS, as Figure 1 shown, the core structure of the T-shaped bar is a linear double-clamped beam, and the double-clamped beam provides a restoring force when deformed. Specifically, as Figure 2 shown, if the double-clamped beam is deformed when subjected to a tensile force in its plane, at this time, the restoring force provided by the double-clamped beam is related to its deformation amount, and the restoring coefficient between the two is non-linear. The non-linear term mainly comes from the increased tension of the horizontal bar due to elongation during deformation, thereby generating an additional restoring force.

[0003] The design of the T-shaped bar in the related art cannot meet the requirements of actual products. In addition, the above-mentioned connection component is usually fixedly connected to the substrate of the microelectromechanical system through fixing piles at both ends. In some cases, the above-mentioned fixing pile can be a bonding structure, which includes a bonding pad integrally provided with the connecting beam and a support column formed on the substrate of the microelectromechanical system. By bonding the above-mentioned bonding pad and the support column together, the connection component is fixedly connected to the substrate of the microelectromechanical system. However, after the connecting beam is deformed, large stresses will be introduced at the bonding interface, thereby affecting the bonding reliability and the uniformity of the bonding stiffness. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a connection component of a microelectromechanical system, a fixing pile of a microelectromechanical system, a spring, a spring component, a scanning mirror, and a lidar, which can better meet the requirements of actual products for the connection component.

[0005] In a first aspect, this application provides a connection component of a microelectromechanical system, including two relatively arranged fixing piles, and at least one connecting beam located between the two fixing piles. Each connecting beam includes at least a first bending portion.

[0006] In the embodiments of the present application, since the first bending portion is provided on the connecting component, when a large displacement occurs in the direction opposite to the protruding direction of the first bending portion, the tensile stress of the connecting beam will not increase rapidly, thereby avoiding breaking the connecting beam after rapidly reaching the fracture stress of silicon, improving its anti-breaking performance, and allowing movement within a large range. In addition, an even-order non-linear term can be introduced into its recovery coefficient to achieve controllable non-linearity.

[0007] In some embodiments, the above-mentioned connecting beam includes a first bending portion.

[0008] In some embodiments, the above-mentioned first bending portion extends from one fixed pile to another fixed pile.

[0009] In some embodiments, the above-mentioned connecting beam further includes a first straight segment and a second straight segment with the same length, and the one first bending portion connects the two fixed piles through the first straight segment and the second straight segment respectively.

[0010] In some embodiments, the above-mentioned connecting beam further includes a second bending portion and a third bending portion, and the one first bending portion connects the two fixed piles through the second bending portion and the third bending portion respectively.

[0011] In some embodiments, the above-mentioned second bending portion and the third bending portion have the same curvature, and the curvature of the second bending portion and the third bending portion is less than the curvature of the first bending portion.

[0012] In some embodiments, the bending directions of the above-mentioned second bending portion and the third bending portion are opposite to the bending direction of the first bending portion.

[0013] In some embodiments, the above-mentioned connecting beam is symmetrically arranged with respect to the central vertical plane of the connection line of the two fixed piles.

[0014] In some embodiments, the number of the above-mentioned connecting beams is two, and the two connecting beams are symmetrically arranged with respect to a central plane.

[0015] In some embodiments, the above-mentioned two connecting beams share fixed piles. Or, in some embodiments, each end fixed pile includes two sub-fixed piles, and each sub-fixed pile is used to support one connecting beam.

[0016] In some embodiments, it further includes a connecting rod connected to the middle of the above-mentioned first bending portion, and the above-mentioned first bending portion protrudes away from the connecting rod.

[0017] In some embodiments, the number of connection points between the above-mentioned connecting rod and each connecting beam is one or more.

[0018] In some embodiments, a mass block is further included, and the connecting beam is configured to support the mass block.

[0019] In some embodiments, the above-mentioned fixing pile includes a bonding pad integrally provided with the connecting beam, and a support column formed on the MEMS substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on a second bonding surface of the support column close to the bonding pad;

[0020] The cross-section of the above-mentioned columnar structure is any one of a long strip shape, a circular shape, an oval shape, and a polygonal shape.

[0021] In some embodiments, the above-mentioned plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction.

[0022] In the embodiments of the present application, since a first bending portion is provided on the connecting component, when the mass block undergoes a large displacement in a direction opposite to the protruding direction of the first bending portion, it still will not cause the tensile stress of the connecting beam to increase rapidly, thereby avoiding breaking the connecting beam after quickly reaching the fracture stress of silicon, improving its anti-breaking performance, and allowing the mass block to move within a large range. Further, cutting the bonding pad and / or the support column into a plurality of columnar structures can effectively reduce the damage to the stability of the bonding interface caused by the stress generated when the connecting beam structure undergoes tension.

[0023] In a second aspect, an embodiment of the present application further provides a fixing pile of a MEMS, including a bonding pad, and a support column provided on the MEMS substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on a second bonding surface of the support column close to the bonding pad.

[0024] In a third aspect, an embodiment of the present application further provides a T-shaped rod of a MEMS, including two relatively arranged fixing piles, and at least one connecting beam located between the fixing piles. The fixing pile includes a bonding pad integrally provided with the connecting beam, and a support column formed on the MEMS substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on a second bonding surface of the support column close to the bonding pad.

[0025] Due to a plurality of columnar structures formed on the bonding pads and / or the bonding surfaces of the support columns that are close to each other on the fixing posts of the T-shaped bar, when the connecting beam is stretched, the maximum stress borne by the bonding interface is effectively reduced, and at the same time, the tip diffusion phenomenon generated by the original cracks on the bonding interface under the action of torsional force is blocked, thereby preventing the further diffusion of cracks, and improving the bonding reliability and the uniformity of the bonding stiffness in the above two effects.

[0026] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction, the first direction being the extending direction of the connecting beam, and the second direction making a preset angle with the first direction.

[0027] In some embodiments, the cross-section of the columnar structure is any one of a long strip shape, a circular shape, an oval shape, and a polygon shape.

[0028] In the embodiments of the present application, in addition to cutting the support column along the first direction and / or the second direction as described above, it can also be cut along any other direction. For the effects of preventing crack diffusion and reducing the maximum stress borne by the maximum stress-bearing area, cutting along any direction can achieve the same. Similarly, the shape of the cross-section of the columnar structure obtained by cutting can also be set according to requirements.

[0029] In a fourth aspect, the embodiments of the present application further provide a spring, including two relatively arranged fixing posts, and at least one connecting beam located between the fixing posts, each connecting beam including at least a first bending portion;

[0030] The above spring further includes a connecting rod, which is connected to the middle of the first bending portion, and the first bending portion protrudes away from the connecting rod.

[0031] In some embodiments, the above fixing post includes a bonding pad integrally provided with the connecting beam, and a support column formed on the microelectromechanical system substrate, the bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on the first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on the second bonding surface of the support column close to the bonding pad;

[0032] The cross-section of the columnar structure is any one of a long strip shape, a circular shape, an oval shape, and a polygon shape.

[0033] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction. Fifth aspect, an embodiment of the present application further provides a spring assembly, including a connecting rod, and connecting beams provided at both ends of the connecting rod. Fixed piles are provided at both ends of each connecting beam. Each connecting beam includes at least a first bending portion that protrudes away from the connecting rod. The spring provided by the embodiment of the present application also has the technical advantages of the connecting components provided in the above respective embodiments. It not only is not prone to breakage during large displacements, but also the recovery coefficient of the spring includes even-order terms, enabling the spring to have a wider application range. For example, it can be applied to the scanning mirror provided in the following embodiment. Additionally, an even-order non-linear term can be introduced into its recovery coefficient to achieve controllable non-linearity.

[0034] In some embodiments, the above fixed pile includes a bonding pad integrally provided with the connecting beam, and a support column formed on the microelectromechanical system substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on a second bonding surface of the support column close to the bonding pad;

[0035] The cross-section of the columnar structure is any one of a long strip shape, a circular shape, an oval shape, and a polygonal shape.

[0036] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction. Sixth aspect, an embodiment of the present application further provides a scanning mirror, including torsion springs formed in a matrix distribution on the microelectromechanical system. A coupling spring is provided between any two adjacent torsion springs. Both ends of the coupling spring are respectively connected to the two adjacent torsion springs and are stretched when the two adjacent torsion springs are twisted to provide a non-linear recovery torque;

[0037] Each torsion spring includes two oppositely arranged fixed piles, and a beam structure located between the fixed piles. A first connecting plate is provided on the beam structure. Both ends of the coupling spring in the stretching direction are respectively connected to the first connecting plates of the torsion springs. A reflecting mirror is formed on the surface of the first connecting plate;

[0038] An opening is formed at one end of the above-mentioned connecting plate close to the coupling spring. The coupling spring includes a connecting rod, and connecting beams arranged at both ends of the connecting rod. The connecting rod is connected to the first connecting plates on both sides of the opening through the connecting beams. The connecting beam at least includes a first bending part, and the first bending part protrudes in a direction away from the connecting rod.

[0039] In some embodiments, a driving component is further included, and the driving component is used to drive the torsion springs distributed in a determinant pattern to twist synchronously.

[0040] In some embodiments, the fixing post includes a bonding pad integrally provided with the connecting beam, and a support post formed on the microelectromechanical system substrate. The bonding pad and the support post are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support post, and / or a plurality of columnar structures are formed on a second bonding surface of the support post close to the bonding pad;

[0041] The cross-section of the columnar structure is any one of a strip shape, a circular shape, an oval shape, and a polygonal shape.

[0042] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction. In a seventh aspect, an embodiment of the present application further provides a lidar, including a light source, a light detector, a processor, and the above-mentioned scanning mirror. The laser beam emitted by the light source is reflected by the scanning mirror to a target area, and the light detector is configured to receive at least part of the reflected light in the target area and convert at least part of the reflected light into an electrical signal. The processor is used to obtain the laser point cloud of the target area based on the electrical signal.

[0043] The connection component, spring, spring component, scanning mirror, and lidar of the microelectromechanical system provided by the embodiments of the present application. Since the first bending part is provided on the connection component, when a large displacement occurs in a direction opposite to the protruding direction of the first bending part, it still will not cause the tensile stress of the connecting beam to increase rapidly, thereby avoiding breaking the connecting beam after quickly reaching the fracture stress of silicon, improving its anti-breaking performance, and allowing movement within a large range. In addition, an even-order nonlinear term can be introduced into its recovery coefficient to achieve controllable nonlinearity. And in the spring, scanning mirror, and lidar, the connection components in the above embodiments are all adopted, with the same design concept and corresponding technical effects, and the content recorded in the above respective embodiments can be referred to.

[0044] The additional aspects and advantages of the present application will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present application. Description of the Drawings

[0045] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0046] Figure 1 Schematic structural diagram of a T-shaped rod of related art MEMS;

[0047] Figure 2 is Figure 1 Schematic diagram of the T-shaped rod after being stressed in the illustrated embodiment;

[0048] Figure 3 Schematic simplified structural diagram of a T-shaped rod in the related art;

[0049] Figure 4 Schematic structural diagram of a connection component in some embodiments of the present application;

[0050] Figure 5 is Figure 4 Schematic diagram of the connection component after being stressed in the illustrated embodiment;

[0051] Figure 6 Schematic structural diagram of a connection component in some embodiments of the present application;

[0052] Figure 7 Schematic structural diagram of a connection component in some embodiments of the present application;

[0053] Figure 8 Schematic structural diagram of a connection component in some embodiments of the present application;

[0054] Figure 9 Schematic structural diagram of a connection component in some embodiments of the present application;

[0055] Figure 10 Schematic structural diagram of a connection component in some embodiments of the present application;

[0056] Figure 11 Schematic structural diagram of a connection component in some embodiments of the present application;

[0057] Figure 12 Schematic structural diagram of a connection component in some embodiments of the present application;

[0058] Figure 13 Schematic structural diagram of the way of arranging a mass block in some embodiments of the present application;

[0059] Figure 14 Schematic structural diagram of the way of arranging a mass block in some embodiments of the present application;

[0060] Figure 15 Schematic structural diagram of a fixing pile obtained by a bonding process in an embodiment of the present application;

[0061] Figure 16 For Figure 15 The force diagram of the cross-section of the fixing pile in the shown embodiment along the A-A direction;

[0062] Figure 17 The force diagram of the cross-section of the support column in the embodiment of the present application after removing the central region along the A-A direction;

[0063] Figure 18 The cross-sectional view of the defective fixing pile in the embodiment of the present application along the A-A direction;

[0064] Figure 19 The cross-sectional view of the bonded fixing pile after cutting the support column in the present application along the A-A direction;

[0065] Figure 20 The cross-sectional view of the bonded fixing pile after cutting the bonding pad in the present application along the A-A direction;

[0066] Figure 21 The cross-sectional view of the bonded defective fixing pile in the embodiment of the present application along the A-A direction;

[0067] Figure 22 The cross-sectional view of the columnar structure in some embodiments of the present application;

[0068] Figure 23 The cross-sectional view of the columnar structure in some embodiments of the present application;

[0069] Figure 24 The cross-sectional view of the columnar structure in some embodiments of the present application;

[0070] Figure 25 The cross-sectional view of another columnar structure in the embodiment of the present application;

[0071] Figure 26 The structural diagram of the spring (connection component) provided in some embodiments of the present application;

[0072] Figure 27 The structural diagram of the spring assembly (connection component) in some embodiments of the present application;

[0073] Figure 28 The structural diagram of the scanning mirror in some embodiments of the present application;

[0074] Figure 29 For Figure 17 The schematic diagram of the specific structure in the shown embodiment;

[0075] Figure 30 The structural diagram of the lidar in some embodiments of the present application;

[0076] Figure 31 This is a schematic structural diagram of a lidar in some embodiments of the present application. Detailed implementation manners

[0077] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as a limitation to the present application.

[0078] In various application scenarios and products of microelectromechanical systems, the T-shaped bar is a mechanical structure that is often used. It is equivalent to a spring and can provide degrees of freedom of motion for other structures when mechanical deformation occurs. The core structure of the T-shaped bar is a linear connecting beam, which provides a restoring force when deformed. For example, when applying the T-shaped bar to a scanning mirror, the degrees of freedom of motion provided by the connecting component can be utilized to enable the mirror to reciprocate within a certain area; or when applying the T-shaped bar to an accelerometer, a mass block is arranged on the connecting beam. When acceleration occurs, the mass block moves due to inertia, driving the connecting beam to deform, and the displacement of the mass block can be measured using the principle of piezoelectric effect or capacitance effect to determine the magnitude of the acceleration; or when applying the T-shaped bar to a gyroscope, a mass block is arranged on the connecting beam and driven to vibrate along the original driving axis. If rotation occurs, the Coriolis force will cause a small displacement on an induction axis perpendicular to the original driving axis, and the angular velocity during rotation can be obtained through calculation using the capacitance effect or piezoresistive effect. It should be noted that since the connecting beam connects between two fixed piles, that is, the connecting beam bears the clamping force from the two fixed piles, the connecting beam can also be called a double-clamped beam.

[0079] Figure 3 is a simplified structural schematic diagram of the T-shaped bar in the related art. As Figure 3 shown, the restoring force provided by the T-shaped bar is related to its deformation amount. The relationship between the restoring force F and the deformation amount x can be shown by the following formula:

[0080] F = kx + k 3 x 3

[0081] where the deformation amount x is also the displacement amount after it is subjected to the tensile force P. The linear term k and the non-linear term k in the above formula 3 are respectively:

[0082]

[0083]

[0084] Wherein, E is the elastic modulus, I is the moment of inertia of the cross-section of the connecting beam, A is the cross-sectional area of the connecting beam, and L is the length of the connecting beam.

[0085] Therefore, in the related art, due to the use of a straight connecting beam in the T-shaped rod, when a large displacement occurs, as the tensile stress of the horizontal rod rapidly increases, it is very easy to reach the fracture stress of silicon, thus breaking the connecting beam, which will limit the movement range of the T-shaped rod; in addition, due to the symmetry of the straight connecting beam, only odd-order terms k 3 exist in the non-linear terms of the restitution coefficient. However, in some applications, in order to achieve certain engineering effects, even-order non-linear terms are desired, such as in the application scenario of the above-mentioned scanning mirror.

[0086] In order to solve the limitation of the movement range of the connecting component, a connecting component with an "elbow" can be designed, for example Figure 4 as shown, on the basis of the original straight connecting beam, an "elbow" is added, which can accommodate the horizontal movement in the plane where the connecting component is located and reduce the tensile stress caused by large displacements, as Figure 5 shown. This design scheme can significantly increase the movement range of the connecting component and reduce the non-linear terms, but it may cause too much relaxation of the movement freedom of the structure in other directions, reducing its movement stiffness; moreover, the problem that there is a lack of even-order terms in the non-linear terms of the restitution coefficient has not been solved.

[0087] An embodiment of the present application provides a connecting component of a microelectromechanical system, which can be specifically referred to Figures 6 - 14 as shown, which respectively shows various forms of connecting components in the embodiment of the present application. In the connecting component of the microelectromechanical system provided in the embodiment of the present application, it includes two relatively arranged fixed piles 11, and at least one connecting beam 21 located between the fixed piles 11. Each connecting beam 21 includes at least one bending part, that is, at least includes a first bending part 22 as Figure 6 shown.

[0088] In some cases, the above-mentioned connecting component may only include the first bending part 22.

[0089] Specifically, it can be as Figure 6 shown, wherein the first bending part 22 extends from one fixed pile 11 to another fixed pile 11, that is, the first bending part 22 covers the entire area where the connecting beam is located. In some embodiments, the curvature of the first bending part 22 may be the same at any position, that is, it can be equivalent to an arc.

[0090] In Figure 6 the shown embodiment, the connecting beam 21 is symmetric with respect to the mid-plane of the line connecting the two fixed piles 11, that is, the left and right parts are symmetrically arranged.

[0091] The structure of the connection component provided by the embodiment of the present application. Since the first bending portion 22 is provided, when a large displacement occurs in the direction opposite to the protruding direction of the first bending portion 22, it still will not cause a rapid increase in the tensile stress of the connection beam, thereby avoiding breaking the connection beam after quickly reaching the fracture stress of silicon, improving its anti-breaking performance, and allowing movement within a large range.

[0092] In addition, this design can also increase the second-order non-linear term in its recovery coefficient, so as to meet the requirements of certain applications. Specifically, for the shape of the left half of the connection beam 21, that is, the section where 0 < x < L / 2, it can be described as:

[0093]

[0094] For the right half where L / 2 < x < L, it also has a symmetric shape, where a 1 , a 2 and a 3 are set constants, which are related to the initial shape of the connection beam.

[0095] From this, the relationship between the restoring force F and the deformation amount x can be deduced as shown in the following formula:

[0096] F = kx + k 2 x 2 + k 3 x 3

[0097] where,

[0098]

[0099]

[0100]

[0101] In the above formula, In addition, as described above, E is the elastic modulus, I is the moment of inertia of the cross-section of the connection beam, A is the cross-sectional area of the connection beam, and L is the length of the connection beam.

[0102] According to the relationship formula between the restoring force F and the deformation amount x above, it can be seen that the recovery coefficient includes a second-order non-linear term related to the shape of the connection beam. This second-order non-linear term indicates that the restoring force of the connection beam with the first bending portion is asymmetric during deformation, which is useful in some application scenarios, such as the above-mentioned scanning mirror. In the technical solution provided by the embodiment of the present application, a controllable non-linear term can be achieved.

[0103] Further, the embodiments of the present application also provide the following Figures 7 - 12 The shown embodiments, in which different-shaped connecting beams are provided in the following respective embodiments, enabling a 1 , a 2 and a 3 to take different values, and further enabling k 1 , k 2 and k 3 to obtain more numerical values, expanding the parameter range of the implementation solutions provided by the embodiments of the present application and having a wider application scenario.

[0104] In some embodiments, for example Figure 7 as shown, for the case where each connecting beam includes a bending part, that is, the first bending part, it may further include two straight segments, and the lengths of the two straight segments may be the same. Specifically, as Figure 7 shown, it further includes a first straight segment 23 and a second straight segment 24, and the one first bending part 22 is respectively connected to two fixed piles 11 through the first straight segment 23 and the second straight segment 24.

[0105] In some embodiments, for example Figure 8 as shown, for the case where each connecting beam includes a first bending part 22, it may further include two bending parts, that is, a second bending part 25 and a third bending part 26, and the one first bending part 22 is respectively connected to two fixed piles 11 through the second bending part 25 and the third bending part 26.

[0106] In addition, the specific lengths and curvatures of the two second bending parts 25 and third bending parts 26 are not limited.

[0107] In some embodiments, the curvatures of the second bending part 25 and the third bending part 26 may be the same. In addition, the curvatures of the second bending part 25 and the third bending part 26 may be less than, equal to, or greater than the curvature of the first bending part 22, which can be determined specifically according to the application scenario and requirements, and the embodiments of the present application do not limit this.

[0108] In some embodiments, the bending directions of the second bending part 25 and the third bending part 26 may be the same as or opposite to the bending direction of the first bending part 22.

[0109] In some embodiments, the lengths of the second bending part 25 and the third bending part 26 may be set to half of the length of the first bending part 22.

[0110] In some embodiments, the connecting beam may simultaneously include a connected first bending portion 22, a second bending portion 25, a third bending portion 26, a first straight segment 23, and a second straight segment 24. The connecting beam may be connected to two fixed piles 11 through the second bending portion 25 and the third bending portion 26. At this time, in the direction from one fixed pile 11 to the other fixed pile 11, the first bending portion 22, the first straight segment 23, and the second straight segment 24 are located between the second bending portion 25 and the third bending portion 26.

[0111] Of course, the connecting beam may also be connected to two fixed piles 11 through the first straight segment 23 and the second straight segment 24. At this time, in the direction from one fixed pile 11 to the other fixed pile 11, the first bending portion 22, the second bending portion 25, and the third bending portion 26 are located between the first straight segment 23 and the second straight segment 24.

[0112] For the setting manner of the connecting beam provided in each embodiment of the present application, the connecting beam may be symmetrically arranged with respect to the central plane of the connection line between the two fixed piles, which can simplify the calculation formula of the restoring force and the deformation amount of the connecting beam.

[0113] Different from only setting one connecting beam 21 as described above, in the embodiments of the present application, more connecting beams 21 may also be set. For example, two connecting beams 21 may be set. Figure 9 FIG. is a schematic structural diagram of setting two connecting beams in the embodiments of the present application. As Figure 9 shown, the number of the connecting beams 21 is two, and the two connecting beams 21 are symmetrically arranged with respect to a central plane (see the dotted line shown in the figure). For the above situation of the two connecting beams 21, they may share the fixed piles 11, that is, still include two fixed piles 11 arranged at both ends.

[0114] Or in some cases, as Figure 10 shown, each fixed pile 11 at each end may be set to include two sub-fixed piles 12, and each sub-fixed pile 12 is used to support one connecting beam 21.

[0115] In some embodiments, in order to enable the connecting component to provide degrees of freedom of motion for other structures, the connecting rod may be set to facilitate its connection with other structures. Specifically, as Figure 11 shown, on the basis of the connecting component provided in the above embodiment, a connecting rod 27 is further provided. The connecting rod 27 is connected to the middle of the first bending portion 22 described above, so that when the mechanical deformation occurs by using the connecting component and provides degrees of freedom of motion for other structures, it can be connected to other structures, and other structures can be driven through the connecting rod 27, or be driven by other structures.

[0116] For the connection mode of the connecting rod 27 and each connecting beam 21, it can be realized through one connection point or more connection points. For example Figure 12 As shown, the connecting rod 27 is connected to the connecting beam 21 through two connection points.

[0117] In some embodiments, according to the requirements of some specific application scenarios, instead of setting a connecting rod to connect with other structures, a mass block can be directly set on the connecting beam. For example, in the case of making an accelerometer and a gyroscope using the connecting component, a mass block can be directly set on the connecting beam to calculate the acceleration or angular velocity directly according to the movement of the mass block set on the connecting beam when measuring the acceleration or angular velocity. Specifically, as Figure 13 shown, a mass block 28 is added to the structure of the connecting component. It shows that in the case of setting one connecting beam 21, the connecting beam is configured to support the above-mentioned mass block 28, thus realizing the requirement of setting a basic "motion representation component" inside an accelerometer or a gyroscope. By using the principle of piezoelectric effect or capacitance effect, the magnitude of the acceleration can be calculated according to the displacement of the above-mentioned mass block 28; by using the principle of capacitance effect or piezoresistive effect, the angular velocity during rotation can be calculated according to the tiny displacement of the mass block 28 on the sensing axis.

[0118] Setting the mass block in the above embodiments is suitable for applying the above-mentioned connecting component to the application of an accelerometer or a gyroscope, and also has corresponding technical effects. Specifically, since the first bending portion 22 is provided on the connecting component, when the mass block 28 has a large displacement in the direction opposite to the protruding direction of the first bending portion 22, it still will not cause the tensile stress of the connecting beam to increase rapidly, thereby avoiding breaking the connecting beam after quickly reaching the fracture stress of silicon, improving its anti-breaking performance, and allowing the mass block 28 to move within a large range.

[0119] In addition to the above Figure 13 shown case where the connecting component includes one connecting beam and a mass block is set, it can also be as Figure 14 shown. In the case where the connecting component includes two connecting beams 21, a mass block 28 is set, and the mass block 28 is connected to the two connecting beams 21 at the same time.

[0120] In some embodiments, for the structure of the fixing post 11 at each end of the connecting component, it includes a bonding pad integrally provided with the connecting beam and a support post formed on the microelectromechanical system substrate. The bonding pad and the support post are bonded into an integral structure, and a plurality of columnar structures are formed on the first bonding surface of the bonding pad close to the support post, and / or a plurality of columnar structures are formed on the second bonding surface of the support post close to the bonding pad.

[0121] In this embodiment, the cross-section of the columnar structure can be any one of a long strip, a circle, an ellipse, and a polygon. Among them, the shape of the cross-section does not affect the strength and stability of the bonding interface between the bonding pad and the support column.

[0122] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction.

[0123] For the specific structure of the fixing pile 11 in the embodiments of the present application, reference can be made to the following Figures 15 - 25 illustrated embodiments. The application scenario of the fixing pile 11 can be applied to the connecting component, or to other situations where fixing piles need to be provided.

[0124] The connecting component of the microelectromechanical system involved in the embodiments of the present application, as described in the above Figures 1 - 14 illustrated embodiments, includes two oppositely arranged fixing piles 11 and at least one connecting beam 21 located between the fixing piles. The connecting beam 21 is fixed to the substrate of the microelectromechanical system through the fixing piles 11. In some embodiments, the fixing piles 11 can be directly formed on the substrate of the microelectromechanical system, that is, the above-mentioned connecting component is obtained through processes such as etching. Or in some embodiments, the above-mentioned fixing piles 11 can be obtained through a bonding process.

[0125] Figure 15 FIG. is a schematic structural diagram of the fixing pile obtained by the bonding process in the embodiments of the present application. As Figure 15 illustrated, for the fixing pile 11 of the connecting component, the fixing pile 11 can include a bonding pad 111 integrally provided with the connecting beam 21 and a support column 112 formed on the substrate of the microelectromechanical system, and the bonding pad 111 and the support column 112 are bonded into an integral structure. During the movement or deformation of the above-mentioned connecting component, the forces applied to the connecting component include a tensile force in the plane where the connecting beam 21 is located, or a torsional torque force with the connecting beam 21 as the axis. The above two forces may introduce relatively large stresses at the bonding interface between the bonding pad 111 and the support column 112, and the stresses will concentrate on the connection area 113 between the connecting beam 21 and the fixing pile 11, specifically as Figure 16 illustrated.

[0126] In addition, for the bonding interface, it may be affected by various types of manufacturing defects, resulting in cracks on the bonding surface. For the sharp crack tips, a relatively large stress concentration factor may be generated, leading to the disintegration of the bond; or even in the case where there are no cracks initially, cracks may also be generated after the connection component has been working for a period of time due to the above-mentioned stress concentration, thereby affecting the performance of the connection component. Some related solutions may be to increase the safety margin by expanding the bonding plane area, but this will result in an increase in the bonding area and sacrifice the usable area on the MEMS chip. In the embodiments of the present application, the crack problem is solved by setting columnar structures on the bonding interfaces of the bonding pads 111 and / or the above-mentioned support columns 112. For example, a plurality of columnar structures may be formed on the first bonding surface of the bonding pad 111 close to the support column 113, and / or a plurality of columnar structures may be formed on the second bonding surface of the support column 112 close to the bonding pad 111 to solve the above problems.

[0127] Specifically, in the embodiments of the present application, since the forces applied to the connection component include tensile forces in the plane where the connection beam is located, or torsional torque forces about the connection beam as the axis will introduce relatively large stresses at the bonding interfaces of the bonding pads 111 and the support columns 112, as Figure 15 and Figure 16 shown, a maximum stress-bearing area is formed in the central area of the bonding interface of the connection area 113 adjacent to both ends of the connection beam 21. This situation causes most of the loads to be concentrated at the connection area 113, easily resulting in the disintegration of the bond at the central area of the bonding interface. In an embodiment of setting columnar structures on the bonding interface in the embodiments of the present application, the area on the second bonding surface of the support column 112 closest to both ends of the connection beam 21 can be cut off, thereby forming columnar structures as Figure 17 shown. For example, Figure 17 shown, when this central area is cut off, the support column 112 will change from one columnar structure to two columnar structures, and the maximum stress will be more evenly distributed to the two bonding areas 114, thereby reducing the maximum stress to be borne on the bonding interface and improving the stability of the bonding interface. If the second bonding surface of the support column is divided into more columnar structures, the stress can be further dispersed. The above Figure 17 takes the second bonding surface of the support column 112 as an example. If columnar structures are formed on the first bonding surface of the bonding pad 111, the same effect can also be achieved.

[0128] In addition, when there are defects on the bonding interface of the fixing pile 11, for example, Figure 18As shown, a crack 115 is formed between the bonding pad 111 and the support pillar 112 due to defects. When the bonding interface is subjected to external stress, the stress at the sharp ends of the crack 115 will concentrate and continuously damage the adjacent bonding structure. Since there is no structure on the bonding interface to prevent the diffusion of the sharp front end of the crack 115, the crack 115 will continuously expand until the overall bonding failure of the bonding interface formed by the bonding pad 111 and the support pillar 112 occurs.

[0129] In this embodiment, any bonding surface where the bonding pad 111 and / or the support pillar 112 form a bond can be cut, and the crack problem can be solved by setting columnar structures on the bonding surfaces of the bonding pad 111 and / or the support pillar 112.

[0130] Specifically, in order to form the above columnar structures, multiple columnar structures can be formed on the bonding surfaces of at least one of the bonding pad 111 and the above support pillar 112. For example, multiple columnar structures are formed only on the first bonding surface of the above bonding pad 111 close to the above support pillar 112, or only on the second bonding surface of the above support pillar 111 close to the above bonding pad 112, or multiple columnar structures are formed simultaneously on the first bonding surface of the bonding pad 111 and the second bonding surface of the support pillar 112.

[0131] In some embodiments, when multiple columnar structures are provided only on one of the bonding pad 111 and the above support pillar 112, the other of the bonding pad 111 and the above support pillar 112 is provided with multiple receiving grooves, and the multiple columnar structures are in one-to-one plug-in fit with the multiple receiving grooves.

[0132] When both the bonding pad 111 and the support pillar 112 are provided with multiple columnar structures, the multiple columnar structures of the bonding pad 111 and the multiple columnar structures of the support pillar 112 are in plug-in fit to achieve bonding.

[0133] Among them, forming multiple columnar structures on the first bonding surface of the bonding pad 111 can be as Figure 19 shown, and forming multiple columnar structures on the second bonding surface of the support pillar 112 can be as Figure 20 shown. For the case of forming multiple columnar structures simultaneously on the first bonding surface of the bonding pad 111 and the second bonding surface of the support pillar 112, the columnar structures on the two bonding surfaces need to be arranged correspondingly. For the case of only setting columnar structures on the first bonding surface of the support pillar 112, it has the advantage of not affecting the structural strength of the bonding pad 111 at both ends of the connecting beam. At the same time, it does not require strict alignment as when forming multiple columnar structures simultaneously on the first bonding surface of the bonding pad 111 and the second bonding surface of the support pillar 112, reducing the bonding difficulty.

[0134] Further, in this embodiment, a columnar structure is obtained by cutting the bonding pad 111 or the support pillar 112. For example, when cutting the support pillar 112, the second bonding surface of the support pillar 112 can be first cut into a plurality of columnar structures, and then bonded to the bonding pad 111. When there are defects in the bonding interface of the fixing post 11 at this time, for example Figure 21 As shown, the sharp front end of the crack 115 will damage the bonding interface of the adjacent columnar structures. Since there are gaps between these columnar structures, the sharp front end of the crack 115 cannot continue to spread when encountering the gaps, thereby greatly improving the bonding stiffness uniformity of the bonding interface and being able to well prevent the spread of defects at the bonding interface, and greatly improving the reliability of the bonding interface. Figure 21 Therefore, taking the formation of columnar structures on the second bonding surface of the support pillar 112 as an example for illustration, the same technical effects can also be obtained on the first bonding surface of the bonding pad 111.

[0135] In some embodiments, the above-mentioned plurality of columnar structures can be obtained by cutting the first bonding surface of the bonding pad 111 or the second bonding surface of the support pillar 112 along the first direction. At this time, the cross-sectional view of the columnar structure is as shown in Figure 22 As shown, the direction pointed by the arrow is the extending direction of the connecting beam; the above-mentioned plurality of columnar structures can also be obtained by cutting the first bonding surface of the bonding pad 111 or the second bonding surface of the support pillar 112 along the second direction. At this time, the cross-sectional view of the columnar structure is as shown in Figure 23 As shown, the direction pointed by the arrow is the direction perpendicular to the extending direction of the connecting beam; the above-mentioned plurality of columnar structures can also be obtained by cutting the first bonding surface of the bonding pad 111 or the second bonding surface of the support pillar 112 along the first direction and the second direction. At this time, the cross-sectional view of the columnar structure is as shown in Figure 24 As shown. The above-mentioned first direction can be the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction, such as 45°, 60°, 90°, etc., and can be designed according to actual needs.

[0136] In some embodiments, the cross-section of the above-mentioned columnar structure is any one of a long strip, a circle, an ellipse, and a polygon. As shown in the above Figure 24 In the illustrated embodiment, the cross-section of the columnar structure therein is a quadrilateral, while Figure 25 In the illustrated embodiment, the cross-section of the columnar structure is a circle. The above illustrations are all for exemplary illustration.

[0137] In the above embodiments of the present application, the fixing post used on the connecting component is mainly taken as an example for illustration. Those skilled in the art can understand that for other situations where fixing posts are used on microelectromechanical systems, the same technical problems will also be faced, and the aboveFigures 16 - 25 It is solved by the fixed pile disclosed in the illustrated embodiment, and the same technical effects are achieved.

[0138] In the connection component provided in the above embodiment, its function can be equivalent to a tension spring, which can provide a tensile restoring force when being stretched. Then, according to the structure of the connection component in the above embodiment, it also has the function of a torsion spring, that is, when the connection beam in the connection component is stressed and distorted, a corresponding torsional restoring force will also be provided. Figure 26 It is a schematic structural diagram of a spring provided by an embodiment of the present application, as Figure 26 shown. The spring includes two relatively arranged fixed piles 31, and at least one connection beam 32 located between the fixed piles 31. Each connection beam 32 includes at least a first bending part 33; in addition, the spring further includes a connecting rod 34, and the connecting rod 34 is connected to the middle of the first bending part 33, and the first bending part 33 protrudes in a direction away from the connecting rod 34.

[0139] As Figure 26 shown, for the spring made by using the connection component as above, on the one hand, it can improve the tensile restoring force. For example, when it is subjected to a tensile force P acting along the plane where the connection beam is located, it can provide a tensile restoring force, and when it is subjected to a torsional force and is distorted around the connection line of the two fixed piles 31, it can provide a torsional restoring force. Usually, the force on the connection component is the resultant force of the above-mentioned tensile force and torsional force. At this time, the connection component acts as a spring, and it can provide both a tensile restoring force and a torsional restoring force. The spring provided by the embodiment of the present application also has the technical advantages of the connection component provided in each of the above embodiments. It is not easy to break at large displacements, and the recovery coefficient of this spring also includes even-order non-linear terms, making this spring have a wider application range, such as it can be applied to a scanning mirror. In this embodiment Figure 26 The illustration of the connection component in the spring is only an example, and for its specific design structure, referring to the relevant description in any of the above Figures 6 - 14 embodiments of the connection component is acceptable.

[0140] In some embodiments, the structure of the fixed pile 31 of the spring includes a bonding pad integrally provided with the connection beam, and a support column formed on the microelectromechanical system substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on the first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on the second bonding surface of the support column close to the bonding pad.

[0141] In this embodiment, the cross-section of the columnar structure can be any one of a strip shape, a circular shape, an oval shape, and a polygon. Among them, the shape of the cross-section does not affect the strength and stability of the bonding interface between the bonding pad and the support column.

[0142] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction.

[0143] For the specific structure of the fixing pile 31, reference may be made to the above Figures 15 - 25 illustrated embodiments. In some embodiments, in addition to using the above-mentioned separately provided connecting components as springs, two connecting component structures may also be connected to be used as a spring component. Specifically, Figure 27 FIG. is a schematic structural diagram of a spring component in an embodiment of the present application. As Figure 27 shown, the spring component includes a connecting rod 41 and connecting beams 42 provided at both ends of the connecting rod 41. Fixing piles 43 are provided at both ends of each connecting beam 42, and can be fixed to other structures of the MEMS system. Each connecting beam 42 includes at least a first bending portion 44 that protrudes away from the connecting rod 41. The spring component provided in the embodiment of the present application, like the spring in the above embodiment, also has the technical advantages of the connecting components provided in the above various embodiments. It not only is not prone to breakage during large displacements, but also the recovery coefficient of the spring component includes even-order non-linear terms, making the spring component have a wider application range. For example, it can be applied to a scanning mirror. In this embodiment Figure 27 the illustration of the two connecting components in the spring component is only an example. For its specific design structure, reference to the relevant description in any of the above Figures 6 - 14 embodiments of the connecting components is acceptable.

[0144] In some embodiments, the structure of the above-mentioned fixing pile 43 includes a bonding pad integrally provided with the connecting beam and a support column formed on the MEMS system substrate. The bonding pad and the support column are bonded into an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the support column, and / or a plurality of columnar structures are formed on a second bonding surface of the support column close to the bonding pad.

[0145] In this embodiment, the cross-section of the columnar structure can be any one of a long strip shape, a circular shape, an oval shape, and a polygon. Among them, the shape of the cross-section does not affect the strength and stability of the bonding interface between the bonding pad and the support column.

[0146] In some embodiments, the plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction. The first direction is the extending direction of the connecting beam, and the second direction forms a preset angle with the first direction.

[0147] For the specific structure of the fixed pile 43, reference may be made to the above Figures 15 - 25 illustrated embodiment.

[0148] In the embodiments of the present application, a scanning mirror using the spring assemblies provided in the above various embodiments is further provided. Figure 28 As shown in the structural schematic diagram of a scanning mirror in the embodiments of the present application, as Figure 28 shown, the scanning mirror therein includes torsion springs 51 distributed in a MEMS matrix. A coupling spring 61 (i.e., the above-mentioned connection assembly) is arranged between any two adjacent torsion springs 51. Both ends of the coupling spring 61 are respectively connected to two adjacent torsion springs 51 and are stretched when the two adjacent torsion springs 51 are twisted, so as to provide a non-linear restoring torque;

[0149] For the above structure formed by both ends of the coupling spring 61 being respectively connected to two adjacent torsion springs 51, specifically, it may be as Figure 29 shown, as Figure 29 shown, each torsion spring 51 includes two oppositely arranged fixing components 52, and a beam structure 53 located between the fixing components 52. A first connecting plate 54 is arranged on the beam structure 53. Both ends of the coupling spring 61 in the stretching direction are respectively connected to the first connecting plate 54 of the torsion spring 51 (the first connecting plate 54 defines the above-mentioned fixed pile 11), and a reflecting mirror 55 is formed on the surface of the first connecting plate 54;

[0150] An opening 56 is formed at one end of the first connecting plate 54 close to the coupling spring 61. The coupling spring 61 includes a connecting rod 62 and connecting beams 63 arranged at both ends of the connecting rod 62. The connecting rod 62 is connected to the first connecting plate 54 on both sides of the opening 56 through the connecting beams 63. The connecting beam 63 at least includes a first bending portion 64, and the first bending portion 64 protrudes in a direction away from the connecting rod 62. In the scanning mirror provided in the embodiments of the present application, since a coupling spring is arranged between two adjacent torsion springs, that is, a plurality of spring assemblies connected to each other are formed, and each coupling spring 61 is equivalent to a controllable non-linear spring. At this time, other driving components can be used to drive the torsion spring to twist and drive the reflecting mirror to twist, and then the non-linear restoring force provided by the coupling spring 61 is used for restoration, so as to periodically complete the above actions, realize scanning the light reflected by all reflecting mirrors within a set area, and achieve the effect of an overall scanning mirror. Further, the coupling spring 61 in the embodiments of the present application includes two connection assembly structures in the above embodiments. Specifically, at least a first bending portion 64 is included in the connecting beam 63 of the coupling spring 61, which is equivalent to the connection assembly in the above various embodiments. Specifically, reference may be made to the implementation manners and technical effects in the Figures 6 - 14 illustrated embodiments above.

[0151] In some embodiments, Figure 29 the middle part of the connecting rod 62 in Figure 29 can also be supported by structures similar to the beam structure 52 and the fixing pile 53, and the technical solutions provided by

[0152] In the embodiments of the present application, multiple torsion springs 51 formed on the MEMS can be provided and are arranged in an array, that is, they can include multiple rows and columns of torsion springs 51, and a mirror 55 is provided on the surface of the first connecting plate 54 of each torsion spring 51, so that a large-area scanning mirror can be formed by the above-mentioned multiple small-area mirrors 55.

[0153] In some embodiments, the above-mentioned fixing member 52 can have the same structure as the fixing pile 11, and reference can be made to Figures 15 - 25 the embodiments shown and will not be elaborated here.

[0154] In some embodiments, a driving component can also be provided, and the driving component is used to drive the torsion springs arranged in an array to twist synchronously. When the torsion springs arranged in an array twist synchronously, it is equivalent to driving a large-area scanning mirror to flip, so as to realize that the light reflected by it can be scanned within a set area. In the embodiments of the present application, the working principle and the setting position of the driving component are not limited, and it can include various forms of driving components. For example, it can be independently arranged on the MEMS substrate, or can be arranged on the MEMS substrate and the first connecting plate, and in order to save space and reserve space for the mirror on the first connecting plate, others can be integrally located below the first connecting plate.

[0155] In addition, the above-mentioned driving component can include multiple driving units, each driving unit is correspondingly arranged with a torsion spring and is used to drive the corresponding torsion spring to twist. According to different working principles, the driving unit includes but is not limited to any one of an electrostatic driving unit, a thermoelectric driving unit, a capacitive driving unit or a piezoelectric driving unit. By arranging any one of the above driving units on the MEMS, the technical effect of driving the torsion spring to twist can be achieved. In the embodiments of the present application, the size of the coupling spring can be made smaller, and more space can be reserved to accommodate the first connecting plate, so as to increase the area of the mirror on the first connecting plate and improve the effective reflection area of the MEMS scanning mirror.

[0156] In addition, in some embodiments, in order to expand the area of each mirror and ultimately expand the area of the formed scanning mirror, the first connecting plate may be extended in the column direction so that the coupling spring is located in the gap formed by the first connecting plate. At this time, most of the area on the surface of the entire MEMS system is occupied by the finally formed scanning mirror, so as to further increase the effective reflection area of the MEMS scanning mirror and improve the uniformity of the reflected light.

[0157] Alternatively, further, for Figure 28 the torsion springs 51 on different columns in Figure 29 it can be connected to the torsion springs 51 on the adjacent columns and in the same row, that is, in the embodiment shown in

[0158] any one of the first connecting plates 54 is connected to the first connecting plates 54 of the other torsion springs 51 in the same row on the adjacent columns, and only the fixing member 52 needs to be avoided. This implementation can further increase the area of the mirror on the first connecting plate 54, so as to further increase the effective reflection area of the MEMS scanning mirror and improve the uniformity of the reflected light.

[0159] In the embodiments of the present application, a lidar is also disclosed, and the lidar can implement functions of optical detection and ranging. Figure 30 It is a schematic structural diagram of a lidar in the embodiments of the present application. As Figure 30 shown, in this lidar, it includes a light source 91, a photodetector 92, and the above-mentioned scanning mirror 93. The laser beam emitted by the light source 91 is reflected by the above-mentioned scanning mirror 93 to the target area M, and the photodetector 92 is configured to receive at least part of the reflected light from the target area M and convert the at least part of the reflected light into an electrical signal. Further, a processor may be provided, and the processor is configured to obtain the laser point cloud of the target area based on the electrical signal output by the photodetector 92, and the functions of optical detection and ranging can be implemented based on the above-mentioned laser point cloud.

[0160] Figure 31 It is a schematic structural diagram of another lidar in the embodiments of the present application. As Figure 31As shown, the lidar also includes a light source 91, a light detector 92, and a scanning mirror 93. The difference is that, different from the paraxial technical solution adopted above Figure 13 in, in Figure 14 the shown embodiment, a coaxial technical solution is adopted. Specifically, it further includes a beam splitter 94, so that the laser beam emitted by the light source 91 passes through the beam splitter 94 and the scanning mirror 93 in sequence, and then is reflected by the scanning mirror 93 to the target area M for scanning the target area M. At least part of the reflected light from the target area M can pass through the scanning mirror 93 to the beam splitter 94 again, and the beam splitter 94 guides the reflected light to the light detector 92, so that the light detector 92 can convert the reflected light into an electrical signal; further, when a processor is also provided in this system, the processor can be configured to obtain the laser point cloud of the target area based on the electrical signal output by the light detector, and then realize the functions of optical ranging and detection. For the light source 91, the light detector 92, and the beam splitter 94 in this embodiment, they can also form a laser transceiver module to realize the emission and detection of laser.

[0161] The lidar in the embodiment of the present application, due to the use of the scanning mirror in the above embodiment, also has corresponding technical effects and advantages, and the above lidar can be applied to vehicles. The solution in which the scanning mirror is composed of multiple small-area reflectors is more conducive to improving its anti-vibration ability during vehicle operation.

[0162] In addition, in the lidar of the embodiment of the present application, through the synchronous torsion of each reflector in the scanning mirror, it is possible to reflect the laser beam to the target area M and then perform scanning. However, this scanning method is along a set direction. In order to expand the area of the target area M, it is also hoped that it can perform scanning in the vertical direction, that is, for an XY coordinate system in the target area M, the technical solution of the embodiment of the present application can realize scanning along the X axis, but cannot realize scanning along the Y axis. Therefore, in some embodiments, a driving component can be added. The driving component can be set to directly drive the scanning mirror as a whole to move back and forth reciprocally to realize scanning along the Y axis. The above driving component can be a driving motor, and the driving motor directly uses the output shaft to drive the scanning mirror to perform reciprocating motion, so as to finally realize that the reflected light of the scanning mirror scans along the Y axis. In this case, it is usually required that the output shaft of the driving motor can turn in time and switch between forward rotation and reverse rotation; alternatively, in an alternative technical solution, a motion adjustment part can be additionally added. The motion adjustment component can convert the continuous circular motion of the output shaft of the driving motor into a periodic reciprocating motion, and then the motion adjustment component drives the scanning mirror to perform periodic reciprocating motion, so as to finally realize that the reflected light of the scanning mirror scans along the Y axis.

[0163] For a scanning mirror, the scanning frequency for driving each small-area mirror inside the scanning mirror to achieve scanning provided by the above embodiments of the present application can be relatively high, that is, rapid scanning along the X-axis within the target area M can be achieved; while the scanning frequency for driving the entire scanning mirror by a driving motor to achieve scanning can be relatively low, that is, slow scanning along the Y-axis within the target area M can be achieved.

[0164] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and do not limit the number of objects. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0165] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0166] In the description of the present application, the "first feature", "second feature" may include one or more of such features.

[0167] In the description of the present application, the meaning of "a plurality" is two or more.

[0168] In the description of the present application, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include that the first and second features are not in direct contact but are in contact through additional features therebetween.

[0169] In the description of the present application, the first feature being "above", "above the" and "on the" second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature.

[0170] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0171] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A connection component of a micro-electromechanical system, characterized in that: The invention comprises two fixing piles arranged opposite to each other and at least one connecting beam located between the fixing piles, and each of the connecting beams comprises at least a first curved portion.

2. The connection assembly according to claim 1, characterized in that: The first curved portion continues from one fixing pile to another fixing pile.

3. The connection assembly according to claim 1, characterized in that: The connecting beam further comprises a first straight line segment and a second straight line segment of the same length, and the connecting beam connects the two fixing piles via the first straight line segment and the second straight line segment respectively.

4. The connection assembly according to claim 1, characterized in that: The connecting beam further includes a second curved portion and a third curved portion, and the connecting beam is connected to the two fixing piles via the second curved portion and the third curved portion respectively.

5. The connection assembly according to claim 4, characterized in that: The second curved portion and the third curved portion have the same curvature, and the curvatures of the second curved portion and the third curved portion are smaller than the curvature of the first curved portion; And / or, the bending direction of the second curved portion and the third curved portion is opposite to the bending direction of the first curved portion.

6. The connection assembly according to any one of claims 1 to 5, characterized in that: The number of the connecting beams is two, and the two connecting beams are symmetrically arranged relative to a central plane; the two connecting beams share a fixed pile; Alternatively, each end fixing pile includes two sub-fixing piles, and each sub-fixing pile is used to support one connecting beam.

7. The connection assembly according to any one of claims 1 to 5, characterized in that: It also includes a connecting rod connected to the first curved portion, and the first curved portion protrudes in a direction away from the connecting rod.

8. The connection assembly according to claim 7, characterized in that: Both ends of the connecting rod are connected to the connecting beam.

9. The connection assembly according to any one of claims 1 to 5, characterized in that: A mass block is also included, and the connecting beam is configured to support the mass block.

10. The connection assembly according to any one of claims 1 to 5, characterized in that: The fixing pile includes a bonding pad integrally arranged with the connecting beam, and a supporting column formed on a micro-electromechanical system substrate, wherein the bonding pad and the supporting column are bonded to form an integral structure, and a plurality of columnar structures are formed on a first bonding surface of the bonding pad close to the supporting column, and / or a plurality of columnar structures are formed on a second bonding surface of the supporting column close to the bonding pad.

11. The connection assembly according to claim 10, characterized in that The plurality of columnar structures are obtained by cutting along a first direction, and / or the plurality of columnar structures are obtained by cutting along a second direction, the first direction being an extension direction of the connecting beam, and the second direction being at a preset angle to the first direction.

12. A scanning mirror, characterized in that: The invention comprises torsion springs distributed in a determinant manner formed on a micro-electromechanical system, wherein a connecting component is provided between any two adjacent torsion springs, the two adjacent torsion springs are connected by the connecting component, and the connecting component is stretched when the two adjacent torsion springs are twisted to provide a nonlinear restoring torque; Each of the torsion springs comprises two oppositely arranged fixing parts, and a beam structure located between the fixing parts, a first connecting plate is arranged on the beam structure, two ends of the connecting assembly in the stretched direction are respectively connected to the first connecting plates of the torsion spring, and a reflector is formed on the surface of the first connecting plate; An opening is formed on one end of the first connecting plate close to the connecting assembly, the connecting assembly is a connecting assembly according to any one of claims 1 to 11, the connecting assembly comprises a connecting rod, and the connecting rod is connected to the first connecting plates on both sides of the opening through the connecting beam; A driving component is used to drive the torsion springs distributed in a determinant to twist synchronously.

13. A laser radar, comprising a light source, a light detector, a processor and the scanning mirror according to claim 12, wherein the laser beam emitted by the light source is reflected to a target area by the scanning mirror, and the light detector is configured to receive at least part of the reflected light from the target area and convert the at least part of the reflected light into an electrical signal, and the processor is used to obtain a laser point cloud of the target area based on the electrical signal.

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