Infrared space camera low-temperature heat dissipation plate and preparation method thereof

Abstract

The invention discloses an infrared space camera low-temperature heat dissipation plate and a preparation method thereof, belongs to the technical field of space optical equipment manufacturing, and solves the problem that a medium-temperature curing adhesive film forming route of a traditional normal-temperature heat dissipation plate cannot meet the strict requirement of a low-temperature heat pipe for the temperature and is difficult to be suitable for preparation of the low-temperature heat dissipation plate. The method comprises the following steps that S1, gaps between the low-temperature heat pipe fins are filled; s2, manufacturing an occupying tool and carrying out pretreatment; s3, medium-temperature curing forming is carried out, and the occupied tool is taken out after curing; s4, bonding the low-temperature heat pipe at normal temperature; and S5, bonding the top skin at normal temperature. The space infrared camera is applicable to a plurality of application fields of forestry monitoring, agricultural investigation, meteorology, ocean observation, disaster prevention, landform observation, military imaging reconnaissance and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of space optical equipment manufacturing, and particularly relates to a cryogenic heat dissipation plate for an infrared space camera and a preparation technology thereof. Background Art

[0002] Space infrared cameras are extremely sensitive to temperature. During operation, the components inside the camera continuously generate heat. If this heat cannot be dissipated in a timely and effective manner, the temperature of the camera will gradually increase. Excessive temperature will interfere with the detection accuracy of the infrared band of the camera, resulting in a decline in imaging quality and inability to meet the actual application requirements. To ensure the stable operation of the camera in a complex space environment and maintain its suitable operating temperature, an efficient heat dissipation device is required.

[0003] The cryogenic heat dissipation plate usually consists of multiple components such as cryogenic heat pipes, metal inserts, aluminum plates, perforated aluminum honeycomb cores, adhesive films, expansion adhesives, adhesives, etc., as Figure 1 , Figure 2 shown. Among them, the top and bottom skins are 0.3mm thick aluminum skins with phosphoric acid anodization. This material has good electrical conductivity, thermal conductivity, and corrosion resistance, and can effectively protect the internal structure of the heat dissipation plate in the space environment and assist in heat conduction. The cryogenic heat pipe, as the core component of the heat dissipation plate, plays a key role in the heat dissipation process. It can quickly transfer heat to various parts of the heat dissipation plate to achieve efficient heat dissipation. However, the operating environment of the cryogenic heat pipe has strict restrictions, and its operating temperature is not allowed to be higher than 35°C, which poses extremely high requirements for the preparation process of the heat dissipation plate.

[0004] Currently, in the preparation process of the heat dissipation plate, the adhesive film cured at room temperature has not been widely used and is not technically mature enough. The traditional forming route of the medium-temperature cured adhesive film for the room-temperature heat dissipation plate is difficult to be applicable to the preparation of the cryogenic heat dissipation plate because it cannot meet the strict temperature requirements of the cryogenic heat pipe. Therefore, it is urgent to develop a new preparation process for the cryogenic heat dissipation plate that can meet the operating temperature requirements of the cryogenic heat pipe, which is of great significance for improving the performance and application value of space infrared cameras. Summary of the Invention

[0005] The present invention provides a cryogenic heat dissipation plate for an infrared space camera and a preparation method thereof, aiming to solve the problem that the traditional forming route of the medium-temperature cured adhesive film for the room-temperature heat dissipation plate is difficult to be applicable to the preparation of the cryogenic heat dissipation plate because it cannot meet the strict temperature requirements of the cryogenic heat pipe.

[0006] The preparation method of a cryogenic heat dissipation plate for an infrared space camera provided by the present invention includes the following steps:

[0007] S1: Fill the gaps between the fins of the cryogenic heat pipe.

[0008] S2: Fabricate a placeholder tooling and perform pre-treatment;

[0009] S3: Cure at medium temperature and form. After curing, remove the placeholder tooling;

[0010] S4: Bond the low-temperature heat pipe at room temperature;

[0011] S5: Bond the top skin at room temperature.

[0012] Furthermore, a preferred solution is provided: S1 includes:

[0013] At room temperature, bond the cured foam glue in the shape of a gap with the low-temperature heat pipe to fill the gap between the fins of the low-temperature heat pipe.

[0014] Furthermore, a preferred solution is provided: S2 includes: fabricate a 1:1 placeholder tooling according to the outer contour of the low-temperature heat pipe, wrap the placeholder tooling with a non-porous high-temperature isolation film, and then paste an uncured expansion glue on the side of the placeholder tooling.

[0015] Furthermore, a preferred solution is provided: the expansion glue is J-78D or J-310D.

[0016] Furthermore, a preferred solution is provided: S3 includes: sequentially place the bottom skin, the uncured glue film, the perforated aluminum honeycomb core, the pre-treated placeholder tooling, and the uncured glue film, heat at 100 °C for 3 hours and apply pressure, the pressure range is 0.05 - 0.1 MPa, and remove the placeholder tooling after the first medium-temperature curing is completed.

[0017] Furthermore, a preferred solution is provided: the glue film used in S3 is J-78B or J310A.

[0018] Furthermore, a preferred solution is provided: S4 includes: apply a room-temperature curing adhesive on both sides of the low-temperature heat pipe after being treated by S1, and install it into the gap after the placeholder tooling is removed, and cure at room temperature for 24 hours.

[0019] Furthermore, a preferred solution is provided: S5 includes: apply a room-temperature adhesive on the bonding surface of the top skin and the cured glue film surface at the top, apply pressure and cure at room temperature for 24 hours, and the pressure range is 0.05 - 0.1 MPa.

[0020] Furthermore, a preferred solution is provided: the adhesive used is J-133.

[0021] The present invention also proposes an infrared space camera low-temperature heat dissipation plate, and the infrared space camera low-temperature heat dissipation plate is prepared by using the preparation method of the infrared space camera low-temperature heat dissipation plate according to any one or a combination of multiple above-mentioned solutions.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] In the prior art, the forming route of the medium-temperature curing adhesive film for the normal-temperature heat dissipation plate cannot meet the requirement that the operating environment of the low-temperature heat pipe is not higher than 35°C, and there is no adhesive film cured at normal temperature in China. The present invention adopts an innovative process of "medium-temperature + normal-temperature" batch curing, breaking through the limitations of the existing process, and can successfully prepare a heat dissipation plate meeting the requirements for use in low-temperature environments, greatly expanding the application scenarios of the heat dissipation plate, especially in the field of space infrared cameras sensitive to temperature.

[0024] The present invention selects a specific adhesive system, that is, J-78B adhesive film, J-310A adhesive film, J-78D expanding adhesive, and J-310D expanding adhesive are used for medium-temperature curing, and J-133 adhesive is used for normal-temperature curing. These adhesives cooperate with each other to exert the best performance at different curing stages, ensuring the firm bonding between the components of the heat dissipation plate and providing a reliable guarantee for the overall performance of the heat dissipation plate.

[0025] In the link of processing the gaps between the fins of the low-temperature heat pipe, the present invention fills the gaps with cured foaming adhesive at normal temperature, creating good conditions for subsequent bonding and enhancing the connection stability between the low-temperature heat pipe and other components; in the pre-treatment step of the placeholder tooling, a non-porous high-temperature isolation film is used to wrap the placeholder tooling and paste the expanding adhesive, which not only facilitates subsequent operations but also ensures the correct position and shape of the expanding adhesive in the product; the steps of first medium-temperature curing and forming, normal-temperature bonding of the low-temperature heat pipe, and normal-temperature bonding of the top skin are reasonable in sequence and clear in parameters, and the steps cooperate closely with each other, ensuring the high efficiency of the entire preparation process and the stability of the product quality.

[0026] For the low-temperature heat dissipation plate prepared by the method described in the present invention, the connection between components is stable and the structural integrity is good. This enables the heat dissipation plate to efficiently dissipate the heat generated by the components of the space camera in a low-temperature environment, effectively maintaining the temperature stability of the camera itself, improving the working performance and reliability of the camera, and reducing the risk of camera failure caused by temperature problems.

[0027] The low-temperature heat dissipation plate and its preparation method proposed by the present invention are applicable to multiple application fields of space infrared cameras, such as forestry monitoring, agricultural survey, meteorology, ocean observation, disaster prevention, topographic and geomorphic observation, and military imaging reconnaissance. Brief Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 Schematic cross-sectional view of the low-temperature heat dissipation plate described in the background art of the present invention;

[0030] Figure 2 Partial enlarged view of the low-temperature heat dissipation plate described in the background art of the present invention;

[0031] Figure 3 Schematic cross-sectional view of the low-temperature heat pipe described in the first specific embodiment of the present invention;

[0032] Figure 4 Schematic cross-sectional view of the placeholder tooling described in the first specific embodiment of the present invention;

[0033] Figure 5 Schematic view of the first medium-temperature curing described in the first specific embodiment of the present invention;

[0034] Figure 6 Schematic view of curing at room temperature and bonding the low-temperature heat pipe described in the first specific embodiment of the present invention;

[0035] Figure 7 Schematic view of curing at room temperature and bonding the top skin described in the first specific embodiment of the present invention. Specific Embodiment

[0036] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.

[0037] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0038] It should also be understood that the terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification of the present application and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0039] The following clearly and completely describes the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0040] Many specific details are set forth in the following description in order to provide a thorough understanding of the present application, but the present application may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0041] Embodiment 1: Refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 to illustrate this embodiment.

[0042] This embodiment proposes a preparation method for a cryogenic heat dissipation plate of an infrared space camera, including:

[0043] S1: Fill the gaps between the cryogenic heat pipe fins; specifically: at room temperature, bond the cured foam rubber in the shape of the gap with the cryogenic heat pipe to fill the gaps between the cryogenic heat pipe fins.

[0044] S2: Make a placeholder tooling and perform pretreatment; specifically: make a 1:1 placeholder tooling according to the outer contour of the cryogenic heat pipe, wrap the placeholder tooling with a non-porous high-temperature isolation film, and then paste an uncured expansion adhesive on the side of the placeholder tooling. The expansion adhesive is J-78D or J-310D.

[0045] S3: Medium-temperature curing and forming, and take out the placeholder tooling after curing; specifically: place the bottom skin, uncured adhesive film, perforated aluminum honeycomb core, pretreated placeholder tooling, and uncured adhesive film in sequence, heat at 100 °C for 3 hours and apply pressure. The pressure range is 0.05 - 0.1 MPa. After the first medium-temperature curing, take out the placeholder tooling. The adhesive film used is J-78B or J310A.

[0046] S4: Bond the cryogenic heat pipe at room temperature; specifically: apply a room-temperature curing adhesive on both sides of the cryogenic heat pipe after being treated in S1, and install it into the gap after the placeholder tooling is taken out, and cure at room temperature for 24 hours.

[0047] S5: Bond the top skin at room temperature, specifically: apply a room-temperature adhesive on the bonding surface of the top skin and the cured adhesive film surface at the top. The adhesive is J-133, apply pressure and cure at room temperature for 24 hours. The pressure range is 0.05 - 0.1 MPa.

[0048] The method described in this embodiment will be further described below:

[0049] The first step: Treatment of the gap of the low-temperature heat pipe fin:

[0050] As Figure 3 shown:

[0051] The middle circle of the low-temperature heat pipe is the main body part of the heat pipe, and the sheet-like structures on the upper and lower sides are the fins of the low-temperature heat pipe. There is a gap between the fins. Before using the low-temperature heat pipe, it is necessary to bond the foaming glue in the shape of the cured gap to the low-temperature heat pipe at room temperature to fill the gap and prepare for the subsequent bonding surface.

[0052] The second step: Pretreatment of the placeholder tooling:

[0053] As Figure 4 shown:

[0054] First, make a 1:1 placeholder tooling for the low-temperature heat pipe according to the outer contour of the low-temperature heat pipe. The placeholder tooling is made of metal material. Then, wrap the placeholder tooling with a non-porous high-temperature isolation film. Next, paste the uncured expansion glue on the side of the placeholder tooling. After the first medium-temperature curing is completed, the placeholder tooling needs to be taken out, and the cured expansion glue will remain in the product.

[0055] The third step: First medium-temperature curing and forming:

[0056] As Figure 5 shown:

[0057] Prepare the pretreated placeholder tooling, bottom skin, uncured adhesive film, and aluminum honeycomb core.

[0058] Place the bottom skin, uncured adhesive film, perforated aluminum honeycomb core, pretreated placeholder tooling, and uncured adhesive film in sequence from bottom to top, and perform the first medium-temperature curing at 100 °C for 3 h under pressure. After the curing is completed, take out the placeholder tooling.

[0059] The fourth step: Bonding the low-temperature heat pipe at room temperature:

[0060] As Figure 6 shown:

[0061] Apply room-temperature curing adhesive to both sides of the low-temperature heat pipe processed in the first step, and then install it into the gap after the placeholder tooling is taken out, and cure it at room temperature for 24 h.

[0062] The fifth step: Bonding the top skin at room temperature:

[0063] As Figure 7 shown:

[0064] Apply room-temperature adhesive on the bonding surface of the top skin and the cured film surface at the top end, apply pressure, and cure at room temperature for 24 hours to bond the top skin.

[0065] Embodiment 2:

[0066] This embodiment provides an infrared space camera cryogenic heat sink, which is prepared by using the preparation method of the infrared space camera cryogenic heat sink described in Embodiment 1.

[0067] Those skilled in the art can understand that the above are only the preferred embodiments of the present invention. The features described in each embodiment and / or claim of the present disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in the present disclosure. It is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0068] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they know the basic creative concept. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0069] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure rather than to limit their protection scope. Although the present disclosure has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that after reading the present disclosure, they can still make various changes, modifications, or equivalent replacements to the specific embodiments of the invention. However, these changes, modifications, or equivalent replacements are all within the protection scope of the claims pending for disclosure.

Claims

1. A method for preparing a low-temperature heat dissipation plate for an infrared space camera, characterized in that: The method comprises: S1: Fill the gaps between the low-temperature heat pipe fins; S2: Make placeholder tooling and perform preprocessing; S3: Medium temperature curing and molding, after curing, the placeholder tooling is taken out; S4: Bonding low temperature heat pipe at room temperature; S5: Bonding the top skin at room temperature.

2. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 1, characterized in that: The S1 includes: Under normal temperature conditions, the solidified gap-shaped foam adhesive is bonded to the low-temperature heat pipe to fill the gap between the fins of the low-temperature heat pipe.

3. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 1, characterized in that: The S2 includes: making a 1:1 placeholder tooling according to the outer contour of the low-temperature heat pipe, wrapping the placeholder tooling with a non-porous high-temperature isolation film, and then pasting a layer of uncured expansion glue on the side of the placeholder tooling.

4. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 3, characterized in that: The expansion glue is J-78D or J-310D.

5. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 3, characterized in that: The S3 comprises: placing the bottom skin, uncured adhesive film, porous aluminum honeycomb core, pre-treated placeholder tooling, and uncured adhesive film in sequence, heating at 100° C. for 3 hours and pressurizing in the range of 0.05-0.1 MPa, and taking out the placeholder tooling after completing the first medium-temperature curing.

6. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 5, characterized in that: The film used in S3 is J-78B or J310A.

7. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 1, characterized in that: The S4 includes: applying a room temperature curing adhesive on both sides of the low-temperature heat pipe treated by S1, inserting it into the gap after the placeholder tooling is taken out, and curing it at room temperature for 24 hours.

8. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 1, characterized in that: The S5 comprises: applying a room temperature adhesive to the top skin adhesive joint surface and the top cured adhesive film surface, pressurizing and curing at room temperature for 24 hours, wherein the pressurization range is 0.05-0.1 MPa.

9. The method for preparing a low-temperature heat dissipation plate for an infrared space camera according to claim 8 or 9, characterized in that: The adhesive used is J-133.

10. A low temperature heat dissipation plate for an infrared space camera, characterized in that: The low-temperature heat dissipation plate is manufactured by the method for manufacturing a low-temperature heat dissipation plate for an infrared space camera according to any one of claims 1 to 9.

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