Control method and device and electronic equipment

Abstract

The invention discloses a control method and device and electronic equipment, and the control method comprises the steps: responding to a condition that a first part meets a first condition, and controlling the electronic equipment to operate in a first mode; responding to the condition that the first component meets the second condition, and controlling the electronic equipment to operate in the second mode; the second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter value is used for limiting the temperature of the third component.

Description

Technical Field

[0001] The present disclosure relates to, but is not limited to, the field of computer technology, and in particular, to a control method, apparatus, and electronic device. Background Art

[0002] When an electronic device operates under high load or has problems such as poor heat dissipation, its temperature will rise. When the temperature of the electronic device exceeds the upper limit of the operating temperature of some components, it will affect the service life of these components and even cause serious damage to the components. Therefore, in order to improve the operating stability of the electronic device, corresponding upper limits of the operating temperature are set for the components with lower temperature resistance in the electronic device to ensure the safe operation of these components.

[0003] At the same time, when the operating temperatures of the components in the electronic device are close to the upper limit of the operating temperature, the duration and limit power of the Power turbo mode of the System-on-a-ChIP (SOC) in the device are restricted, resulting in the inability to further improve the system performance and a reduction in the user experience.

[0004] Therefore, how to increase the upper limit of the operating temperature of the electronic device has become an urgent problem to be solved. Summary of the Invention

[0005] In view of this, the present disclosure provides at least a control method, apparatus, and electronic device.

[0006] The technical solution of the present disclosure is implemented as follows:

[0007] On the one hand, the present disclosure provides a control method, which includes:

[0008] In response to the first component satisfying the first condition, controlling the electronic device to operate in the first mode;

[0009] In response to the first component satisfying the second condition, controlling the electronic device to operate in the second mode;

[0010] The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, where the third parameter is used to limit the temperature of the third component.

[0011] On the other hand, the present disclosure provides a control apparatus, which includes:

[0012] A first control module, configured to control the electronic device to operate in the first mode in response to the first component satisfying the first condition;

[0013] A second control module, configured to control the electronic device to operate in the second mode in response to the first component satisfying the second condition;

[0014] The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode. The third parameter is used to limit the temperature of the third component.

[0015] In another aspect, the present disclosure provides an electronic device, including:

[0016] A second component, a third component, and a processor;

[0017] The processor is configured to control the electronic device to operate in a first mode in response to the first component satisfying a first condition; and control the electronic device to operate in a second mode in response to the first component satisfying a second condition.

[0018] The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode. The third parameter is used to limit the temperature of the third component.

[0019] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and do not limit the technical solutions of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings herein are incorporated into the specification and form a part of this specification. These drawings illustrate embodiments consistent with the present disclosure and, together with the specification, are used to explain the technical solutions of the present disclosure.

[0021] Figure 1 A schematic diagram of the implementation process of a control method provided by the present disclosure;

[0022] Figure 2 A schematic diagram of the implementation process of an embodiment of the control method provided by the present disclosure;

[0023] Figure 3 A schematic diagram of the implementation process of an embodiment of calculating the temperature rise limit of the control method provided by the present disclosure;

[0024] Figure 4 A schematic diagram of the implementation process of an embodiment of constructing the mapping relationship between the temperature rise limit and the input voltage of the control method provided by the present disclosure;

[0025] Figure 5 A schematic diagram of the composition structure of a control device provided by the present disclosure;

[0026] Figure 6 A schematic diagram of the hardware entity of an electronic device provided by the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the technical solutions of the present disclosure will be further elaborated in detail below in conjunction with the accompanying drawings and embodiments. The described embodiments should not be construed as limitations on the present disclosure. All other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present disclosure.

[0028] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it can be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and they can be combined with each other without conflict.

[0029] The terms "first / second / third" involved are only used to distinguish similar objects and do not represent a specific order for the objects. It can be understood that "first / second / third" can be interchanged with a specific order or sequence when permitted, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present disclosure belongs. The terms used herein are only for the purpose of describing the present disclosure and are not intended to limit the present disclosure.

[0031] In the related art, in order to increase the upper limit of the operating temperature of an electronic device to improve the system performance of the device, the following two solutions have been proposed:

[0032] First, add heat dissipation components to enhance the heat dissipation ability of the electronic device. Due to the ever-increasing requirements for the miniaturized design of electronic devices, the space within the electronic device where heat dissipation components can be added is very limited. Therefore, this solution cannot achieve a satisfactory heat dissipation effect.

[0033] Second, use high-temperature-resistant components to replace components with lower temperature resistance to increase the upper limit of the operating temperature of each component within the electronic device, thereby increasing the upper limit of the operating temperature of the electronic device. For example, use high-temperature-resistant X6S capacitors or X7R capacitors to replace X5R capacitors with lower temperature resistance. Among them, the rated maximum operating temperature of the X6S capacitor is 105 degrees, the rated maximum operating temperature of the X7R capacitor is 125 degrees, and the rated maximum operating temperature of the X5R capacitor is 85 degrees. However, the price of high-temperature-resistant components is usually higher than that of components with lower temperature resistance. In the case where the number of components to be replaced is large, this will undoubtedly lead to a significant increase in the device cost.

[0034] Based on this, the present disclosure provides a control method. In this method, in response to the first component satisfying the first condition, the electronic device operates in the first mode; in response to the first component satisfying the second condition, the electronic device operates in the second mode; wherein, the second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter is used to limit the temperature of the third component. In this way, by reducing the second parameter value of the second component, the third parameter value for limiting the temperature of the third component is increased, so that when the first component satisfies the first condition, the electronic device can operate at a higher temperature, thereby improving the system performance of the electronic device; at the same time, by increasing the second parameter value of the second component, the third parameter value for limiting the temperature of the third component is reduced, so that when the first component satisfies the second condition, by limiting the operating temperature of the third component of the electronic device, the electronic device can operate at a lower temperature, improving the safety of the third component.

[0035] The method provided by the present disclosure can be executed by an electronic device. The electronic device can be various types of terminals such as a laptop computer, a tablet computer, a desktop computer, a set-top box, a mobile device (for example, a mobile phone, a portable music player, a personal digital assistant, a dedicated messaging device, a portable game device), etc., or can be implemented as a server. The server can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or can also be a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, Content Delivery Network (CDN), and big data and artificial intelligence platforms.

[0036] Next, the technical solutions in the embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present disclosure.

[0037] Figure 1 It is a schematic flowchart of the implementation of a control method provided by the present disclosure. As Figure 1 shown, the method includes the following steps S101 to step S102:

[0038] Step S101, in response to the first component satisfying the first condition, control the electronic device to operate in the first mode;

[0039] Step S102, in response to the first component satisfying the second condition, control the electronic device to operate in the second mode;

[0040] The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode. The third parameter is used to limit the temperature of the third component.

[0041] Here, the first component can be any component used to trigger the switching of the operating mode of the electronic device.

[0042] In some embodiments, the first component can be a built-in component of the electronic device. For example, the built-in graphics card, display component, memory, various sensors, communication module, audio component, vibration component, etc. of the electronic device. At this time, the first component can have different operating states. For example, the first component can have an idle state, a low-load state, and a high-load state, or the first component can have an operating state and a non-operating state, and so on. Here, in different operating states, the power consumption of the first component is different.

[0043] In some embodiments, the first component can be an external device that can be connected to the electronic device. In implementation, the external device can be various input and / or output (Input / Output, I / O) devices that can be connected to the electronic device. For example, the external display, keyboard, mouse, printer, speaker, camera, external storage device, etc. of the electronic device. At this time, the first component can have different connection states and operating states, that is, the first component can have a connected state and a non-connected state, as well as an idle state, a low-load operating state, a high-load operating state, or an operating state and a non-operating state. Here, in different connection states or operating states, the power consumption of the first component is different.

[0044] In this way, the first component satisfies the first condition or the second condition, which can mean that the first component is in different connection states and / or operating states.

[0045] In some embodiments, the first component satisfies the first condition, indicating that the first component is in a non-connected state; the first component satisfies the second condition, indicating that the first component is in a connected state. For example, in the case where the first component is an I / O device, when the I / O device is in a non-connected state, the I / O device satisfies the first condition; when the I / O device is in a connected state, the I / O device satisfies the second condition.

[0046] In some embodiments, the first component satisfies the first condition, indicating that the first component is in an idle state; the first component satisfies the second condition, indicating that the first component is in a low-load operating state or a high-load operating state. For example, in the case where the first component is a graphics card, when the graphics card is in an idle state, the graphics card satisfies the first condition; when the graphics card is in a low-load operating state or a high-load operating state, the graphics card satisfies the second condition.

[0047] The first mode and the second mode are different operating states of the electronic device; the first component meeting the first condition and meeting the second condition are respectively the triggering conditions for switching the electronic device to the first mode and the second mode.

[0048] In some embodiments, the first mode and the second mode are different performance modes corresponding to the electronic device. For example, the first mode is the high-performance mode or the best-performance mode corresponding to the electronic device, and the second mode is the normal-performance mode corresponding to the electronic device, etc. For example, compared with being in the second mode, when the electronic device is in the first mode, the processor of the electronic device has a longer working time and a higher limit power in the enhanced mode, thereby making the system performance of the electronic device higher.

[0049] In some embodiments, the first mode and the second mode can be different operating temperature modes corresponding to the electronic device. For example, the first mode is the high-temperature operating mode corresponding to the electronic device, and the second mode is the normal-temperature operating mode corresponding to the electronic device. For example, compared with being in the second mode, when the electronic device is in the first mode, the upper limit of the operating temperature corresponding to each component in the electronic device is higher.

[0050] In this way, when it is determined that the first component meets different conditions, the electronic device is switched to the corresponding mode.

[0051] The second component is a component that has different second parameter values when the electronic device operates in different modes (i.e., the first mode and the second mode), that is, the parameter value of the second parameter of the second component is adjusted in response to the electronic device entering different modes. In some embodiments, the second component can be a built-in component of the electronic device. For example, the second component can be a power-consuming component built in the electronic device. In some embodiments, the second component can be an external device of the electronic device. For example, the second component can be an I / O device connected to the electronic device.

[0052] The third component is a component that can adjust its third parameter value in response to the adjustment of the second parameter value of the second component, that is, a component that has different third parameter values when the electronic device operates in different modes (i.e., the first mode and the second mode).

[0053] In some embodiments, the third component is a component in the electronic device with a relatively low upper limit of operating temperature, and the third parameter is used to limit the maximum operating temperature of the third component. In this way, by adjusting the value of the second parameter of the second component, the maximum operating temperature of the third component is adjusted, thereby adjusting the overall operating temperature of the electronic device. For example, the value of the third parameter of the third component in the first mode is higher than that in the second mode, that is, relative to the second mode, in the first mode, the maximum operating temperature of the third component with a relatively low upper limit of operating temperature in the electronic device is increased, so that the electronic device can operate at a higher temperature, that is, the system performance of the electronic device is improved.

[0054] In the control method provided by the present disclosure, in response to the first component satisfying the first condition, the electronic device operates in the first mode; in response to the first component satisfying the second condition, the electronic device operates in the second mode; wherein, the value of the second parameter of the second component in the first mode is lower than the value of the second parameter of the second component in the first mode, and the value of the third parameter of the third component in the first mode is higher than the value of the third parameter of the third component in the second mode, and the third parameter is used to limit the temperature of the third component. In this way, by reducing the value of the second parameter of the second component to increase the value of the third parameter used to limit the temperature of the third component, so that when the first component satisfies the first condition, the electronic device can operate at a higher temperature, thereby improving the system performance of the electronic device; at the same time, by increasing the value of the second parameter of the second component to reduce the value of the third parameter used to limit the temperature of the third component, so that when the first component satisfies the second condition, by limiting the operating temperature of the third component of the electronic device, the electronic device operates at a lower temperature, improving the safety of the third component.

[0055] In some embodiments, the first component represents a component that can obtain electrical energy from the power supply module of the electronic device; the first condition represents that the total power corresponding to the first component connected to the electronic device is less than a specified power threshold; the second condition represents that the total power corresponding to the first component connected to the electronic device is not less than the power threshold;

[0056] In this way, the step of controlling the electronic device to operate in the first mode in response to the first component satisfying the first condition, that is, the above step S101, can be implemented as the following step S1011:

[0057] Step S1011, in response to the total power corresponding to the first component connected to the electronic device being less than a specified power threshold, control the electronic device to operate in the first mode;

[0058] The step of controlling the electronic device to operate in the second mode in response to the first component satisfying the second condition, that is, the above step S102, can be implemented as the following step S1021:

[0059] Step S1021, in response to the total power corresponding to the first component connected to the electronic device being not less than the power threshold, control the electronic device to operate in the second mode.

[0060] Here, the power module of the electronic device refers to any type of module that can supply power to other components of the electronic device. In some embodiments, the power module may be a battery in the electronic device (e.g., dry battery, lithium battery, solar battery, etc.). In some embodiments, the power module may be a power input interface in the electronic device connected to a power adapter. This power module can receive electrical energy from the power adapter and transmit the electrical energy to the electrical circuits inside the electronic device. In some embodiments, the power module may be a DC input interface or an AC input interface in the electronic device. In some embodiments, the power adapter corresponding to this power module may be an adapter of any interface type, e.g., round hole interface, Universal Serial Bus (USB) interface (e.g., Micro-USB interface, Type A interface, Type B interface, Type C interface, etc.).

[0061] The first component can be any type of component that can obtain electrical energy from the power module. As described above, the first component can be an internal component of the electronic device or an external device of the electronic device.

[0062] The total power corresponding to the first component connected to the electronic device refers to the total value of the highest power budgets corresponding to the first component connected to the electronic device.

[0063] For example, in the case where the first component includes an external device with 4 types of interfaces (e.g., an external device with a Type A interface (hereinafter referred to as "Type A device"), an external device with a Type B interface (hereinafter referred to as "Type B device"), an external device with a Type C interface (hereinafter referred to as "Type C device"), and an external device with a High Definition Multimedia Interface (HDMI) (hereinafter referred to as "HDMI device")), if all 4 types of external devices are in a connected state with respect to the electronic device, then the sum of the highest power budgets corresponding to these 4 types of external devices is taken as the total power corresponding to the first component; if some of these 4 types of external devices are in a connected state with respect to the electronic device, then the sum of the highest power budgets corresponding to these partial devices is taken as the total power corresponding to the first component.

[0064] For another example, when the first component includes 4 built-in graphics cards of an electronic device, if all of the 4 built-in graphics cards are in a low-power operation state or a high-power operation state, the sum of the maximum power budgets corresponding to the 4 built-in graphics cards is used as the total power corresponding to the first component; if some of the 4 built-in graphics cards are in a low-power operation state or a high-power operation state, the sum of the maximum power budgets corresponding to these some graphics cards is used as the total power corresponding to the first component.

[0065] The power threshold is the total power corresponding to the first component that is pre-specified and used to trigger the electronic device to switch the operation mode. Here, the power threshold can be determined based on any suitable method. For example, the power threshold can be determined based on the sum of the maximum power budgets of all the first components that the electronic device can connect to. In implementation, the power threshold can be set to any value such as 1 / 2 or 1 / 3 of the sum of the maximum power budgets.

[0066] The first condition indicates that the total power corresponding to the first component connected to the electronic device is less than the specified power threshold, that is, when the total power corresponding to the first component connected to the electronic device is less than the specified power threshold, the electronic device is controlled to operate in the first mode.

[0067] Since a part of the electric energy provided by the power module is supplied to the first component connected to the electronic device and a part is supplied to the processor (e.g., SOC) of the electronic device, when the total power required by the first component connected to the electronic device is lower than the specified power threshold, more electric energy provided by the power module can be supplied to the processor, enabling the processor to operate at a higher limit power, thereby improving the system performance of the electronic device. At the same time, as described above, compared with the second mode, in the first mode, by reducing the second parameter value of the second component to increase the third parameter value for limiting the temperature of the third component, the electronic device can operate at a higher temperature. For example, the processor is allowed to operate at a higher temperature, thereby extending the working time of the processor in the enhanced mode and improving the processor performance.

[0068] The second condition indicates that the total power corresponding to the first component connected to the electronic device is not less than the power threshold, that is, when the total power corresponding to the first component connected to the electronic device is not less than the specified power threshold, the electronic device is controlled to operate in the second mode.

[0069] When the total power required for the first component connected to the electronic device is not less than the specified power threshold, the first component requires more electrical energy. Therefore, the electrical energy available for the processor is reduced, limiting the processing performance. At this time, as described above, in the second mode as compared to the first mode, by increasing the second parameter value of the second component to reduce the third parameter value for limiting the temperature of the third component, the electronic device operates at a lower temperature, thereby improving the safety of the third component.

[0070] In some embodiments, the second component represents the power module of the electronic device; the second parameter value represents the input voltage value corresponding to the power module; the input voltage value includes a first voltage value and a second voltage value higher than the first voltage value; the third parameter represents the over-temperature protection temperature, and the third parameter value includes a first temperature value and a second temperature value lower than the first temperature value;

[0071] Thus, controlling the electronic device to operate in the first mode, that is, the above step S101, can be implemented as the following step S1012:

[0072] Step S1012, controlling the power module to operate at the first voltage value and setting the third parameter to the first temperature value;

[0073] Controlling the electronic device to operate in the second mode, that is, the above step S102, can be implemented as the following step S1022:

[0074] Step S1022, controlling the power module to operate at the second voltage value and setting the third parameter to the second temperature value.

[0075] Here, the second component represents the power module of the electronic device; among them, the power module can be implemented as the power input interface in the electronic device that is connected to the power adapter; the power adapter can obtain electrical energy from the mains or other DC power sources or AC power sources, and convert the obtained electrical energy into direct current for the electronic device to use and then transmit it to the power module of the electronic device. The second parameter represents the input voltage value corresponding to the power module; among them, the input voltage value refers to the voltage value input from the power adapter to the power module. For example, when the interface between the power module and the power adapter is a Type C interface, the input voltage value is the input voltage value of the Type C interface.

[0076] The input voltage value includes a first voltage value and a second voltage value higher than the first voltage value. In some embodiments, both the first voltage value and the second voltage value are fixed voltage values, that is: when the electronic device operates in the first mode, the power supply module operates at a fixed first voltage value; when the electronic device operates in the second mode, the power supply module operates at a fixed second voltage value. In some embodiments, both the first voltage value and the second voltage value are non-fixed voltage values, that is, the first voltage value corresponds to a first value range, the second voltage value corresponds to a second value range, and the maximum value in the first value range is less than the minimum value in the second value range. Thus, when the electronic device operates in the first mode, the power supply module operates at a first voltage value within the first value range; when the electronic device operates in the second mode, the power supply module operates at a second voltage value within the second value range. In some embodiments, one of the first voltage value and the second voltage value is a fixed voltage value and the other is a non-fixed voltage value, and the first voltage value is lower than the second voltage value.

[0077] The third parameter characterizes the over-temperature protection temperature, that is, when the temperature of the third component reaches the temperature defined by the third parameter, over-temperature protection is performed on the third component to prevent the third component from being damaged due to overheating. In implementation, any over-temperature protection scheme can be adopted to perform over-temperature protection on the third component. For example, first, a temperature sensor is used to detect the operating temperature of the third component; then, a comparator is used to compare the operating temperature of the third component with a preset over-temperature protection temperature. When the operating temperature exceeds the over-temperature protection temperature, the comparator can output a corresponding signal to trigger the over-temperature protection mechanism, such as cutting off the power supply of the third component, reducing the operating frequency or voltage of the third component, starting a cooling fan, etc.

[0078] The third parameter includes a first temperature value and a second temperature value lower than the first temperature value. In some embodiments, both the first temperature value and the second temperature value are fixed temperature values, that is, when the electronic device operates in the first mode and the second mode, a fixed over-temperature protection temperature is set for the third component. In some embodiments, both the first temperature value and the second temperature value are non-fixed temperature values, that is, the first temperature value corresponds to a third value range, the second temperature value corresponds to a fourth value range, and the minimum value in the third value range is greater than the maximum value in the fourth value range. Thus, when the electronic device operates in the first mode, the over-temperature protection temperature value corresponding to the third component is determined within the third value range; when the electronic device operates in the second mode, the over-temperature protection temperature value corresponding to the third component is determined within the fourth value range. In some embodiments, one of the first temperature value and the second temperature value is a fixed temperature value and the other is a non-fixed temperature value, and the first temperature value is higher than the second temperature value.

[0079] In this way, the electronic device is controlled to operate in the first mode, that is, the power supply module is controlled to operate at a lower first voltage value, and the over-temperature protection temperature of the third component is set to a higher first temperature value.

[0080] For the third component, both a higher operating voltage and a higher operating temperature will shorten the lifespan of the third component. At the same time, both a lower operating voltage and a lower operating temperature will extend the lifespan of the third component. Therefore, when maintaining the third component at a specified lifespan value, the operating temperature of the third component can be increased by reducing the operating voltage. At the same time, as described above, when the electronic device operates in the first mode as compared to the second mode, the input voltage value of the power supply module is the lower first voltage value. Therefore, in the first mode, the operating voltage of the third component can be reduced, thereby enabling the third component to operate at a higher temperature and increasing the over-temperature protection temperature value of the third component, so that the electronic device can operate at a higher temperature.

[0081] The electronic device is controlled to operate in the second mode, that is, the power supply module is controlled to operate at a higher second voltage value, and the over-temperature protection temperature of the third component is set to a lower second temperature value.

[0082] As described above, compared with the first mode, when the electronic device operates in the second mode, the input voltage value of the power supply module is the higher second voltage value. Therefore, the operating voltage value of the third component is higher in the second mode. In this way, in order to maintain the third component at a specified lifespan, the operating temperature of the third component needs to be reduced, that is, the operating temperature of the third component is restricted by a lower over-temperature protection temperature (i.e., the second temperature value), thereby improving the safety of the third component.

[0083] In some embodiments, the third component represents a capacitor on the power input path corresponding to the power supply module.

[0084] Here, in order to filter the input voltage of the power supply module, suppress noise, and store energy, a capacitor needs to be provided on the power input path of the power supply module.

[0085] The capacitor can be any type of capacitor adapted to the input voltage of the power supply module. For example, when the input voltage of the power supply module is 20V, a capacitor with a withstand voltage of 25V needs to be selected for the capacitor on the power input path of the power supply module.

[0086] The capacitor has a corresponding upper limit of operating temperature. For example, in the case of an X5R capacitor, the upper limit of the operating temperature of the X5R capacitor is 85 degrees. Additionally, due to the capacitor life requirement, the actual operating temperature of the capacitor should be lower than the upper limit of the operating temperature. For example, the actual operating temperature of the X5R capacitor needs to be limited below 57 degrees, otherwise, the life of the X5R capacitor will not meet the design requirements. Thus, when an electronic device needs to improve system performance, for example, when the processor of the electronic device operates in an enhanced mode, it will cause the temperature of the electronic device to rise. If it exceeds the actual upper limit of the operating temperature of the capacitor, over-temperature protection will be triggered.

[0087] In the embodiments of the present disclosure, when a first component connected to an electronic device meets a first condition, the electronic device is controlled to operate in a first mode, that is, the power module of the electronic device is controlled to operate at a lower first voltage value. In this way, the voltage value of the capacitor corresponding to the power module decreases, and further, the capacitor can operate at a higher temperature and maintain the capacitor life, creating conditions for improving the system performance of the electronic device. For example, the processor of the electronic device can be in an enhanced mode at a higher power and for a longer time.

[0088] In some embodiments, after adjusting the input voltage value of the power module of the electronic device to the first voltage value, the limit power and / or the duration of the electronic device's processor in the enhanced mode can also be adjusted according to the adjustment method of the input voltage. For example, in the case of lowering the input voltage value, the limit power and / or the duration of the processor in the enhanced mode can be increased; for another example, in the case of raising the input voltage value, the limit power and / or the duration of the processor in the enhanced mode can be decreased.

[0089] In some embodiments, before controlling the power module to operate at the first voltage value in the above step S1012, the method further includes the following steps S1013 to step S1015:

[0090] Step S1013, obtaining the first operating temperature of the capacitor.

[0091] Here, the first operating temperature is the current operating temperature of the capacitor. In implementation, any suitable method can be used to obtain the first operating temperature. For example, an infrared thermometer can be used to obtain the surface temperature of the capacitor and use this surface temperature as the first operating temperature; for another example, a temperature sensor (such as a thermistor) can be used to obtain the internal or surface temperature of the capacitor and use this temperature as the first operating temperature.

[0092] Step S1014, determining the first temperature rise limit corresponding to the electronic device based on the first operating temperature.

[0093] Here, after determining the first operating temperature of the capacitor, a first temperature rise limit of the electronic device is determined based on the first operating temperature.

[0094] The first temperature rise limit refers to the maximum value by which the overall temperature of the electronic device can rise based on the first operating temperature. In some embodiments, the first temperature rise limit may be the difference between the first operating temperature and the upper limit of the operating temperature or the rated operating temperature of the capacitor. In some embodiments, the first operating temperature and the upper limit of the operating temperature or the rated operating temperature of the capacitor may be weighted and calculated respectively, and the difference between the weighted first operating temperature and the weighted upper limit of the operating temperature or the rated operating temperature is used as the first temperature rise limit. In some embodiments, the first temperature rise limit may also be the temperature rise value obtained by subtracting a specified constant from the above difference.

[0095] In some embodiments, step S1014 may be implemented as the following steps S10141 to step S10142:

[0096] Step S10141, obtain the second operating temperature of the processor of the electronic device.

[0097] Here, the second operating temperature is the current operating temperature of the processor of the electronic device. During implementation, any suitable method may be used to obtain the second operating temperature. For example, an infrared thermometer may be used to obtain the surface temperature of the processor and use this surface temperature as the second operating temperature; alternatively, a temperature sensor (such as a thermistor) may be used to obtain the internal or surface temperature of the processor and use this temperature as the second operating temperature.

[0098] Step S10142, determine the first temperature rise limit based on the first operating temperature and the second operating temperature.

[0099] Here, after determining the first operating temperature and the second operating temperature, the first temperature rise limit of the electronic device is determined based on the upper limit of the operating temperature or the rated operating temperature of the capacitor and the upper limit of the operating temperature or the rated operating temperature of the processor.

[0100] During implementation, first, based on the first operating temperature of the capacitor and the upper limit of the operating temperature or the rated operating temperature of the capacitor, determine the temperature rise limit of the capacitor; at the same time, based on the second operating temperature of the processor and the upper limit of the operating temperature or the rated operating temperature of the processor, determine the temperature rise limit of the processor; finally, compare the temperature rise limits of the capacitor and the processor, and use the smaller of the two temperature rise limits as the first temperature rise limit of the electronic device.

[0101] In the embodiments of the present disclosure, by calculating the temperature rise limits of the capacitor and the processor, and taking the smaller one of the temperature rise limits as the first temperature rise limit of the electronic device, the temperature rise value of the electronic device in subsequent operations is not greater than any one of the temperature rise limits of the capacitor and the processor, thereby improving the operating safety of the capacitor and the processor.

[0102] Step S1015: Determine a target voltage value based on the first temperature rise limit, the preset lifespan of the capacitor, and the first mapping relationship; wherein, the first voltage value includes the target voltage value; the first mapping relationship represents the mapping relationship between the temperature rise limit corresponding to the electronic device and the input voltage value under the condition of maintaining the lifespan of the capacitor greater than the preset lifespan.

[0103] Here, the first mapping relationship refers to the mapping relationship between the temperature rise limit and the input voltage value established in advance under the condition of maintaining the lifespan of the capacitor greater than the preset lifespan. In some embodiments, the first mapping relationship can be stored in the form of a table, text, or any other form. In some embodiments, the first mapping relationship can be stored in a preset database, and multiple first mapping relationships are stored in the database, and the multiple first mapping relationships respectively represent the mapping relationships between the temperature rise limits corresponding to the electronic device and the input voltage values under the condition of maintaining different preset lifespans of different types of capacitors. For example, when the first mapping relationship is stored in the form of a table, the first table in the database can represent the mapping relationship between the temperature rise limit corresponding to the electronic device and the input voltage value under the condition of maintaining the lifespan of the X5R capacitor greater than 2 years; the second table in the database can represent the mapping relationship between the temperature rise limit corresponding to the electronic device and the input voltage value under the condition of maintaining the lifespan of the X5R capacitor greater than 4 years; and so on.

[0104] The first mapping relationship can be established by any suitable method. In some embodiments, the first mapping relationship can be determined according to the historical monitoring values of the temperature rise limit, input voltage, and preset lifespan of the capacitor of the electronic device. In some embodiments, the first mapping relationship between the temperature rise limit, input voltage, and preset lifespan of the electronic device can be determined by testing.

[0105] In this way, based on the first temperature rise limit, the preset lifespan of the capacitor, and the first mapping relationship, the target voltage value corresponding to the power supply module can be determined; wherein, the first voltage value includes the target voltage value, that is, the target voltage value is determined from the value range of the first voltage value.

[0106] In some embodiments, after adjusting the input voltage value of the power module of the electronic device to the first voltage value, the limit power and / or the duration of the processor of the electronic device in the enhanced mode can also be adjusted according to the adjustment method of the input voltage and the first temperature rise limit of the electronic device. For example, in the case of lowering the input voltage value, the limit power of the processor in the enhanced mode and / or the duration can be increased according to the mapping relationship between the temperature rise limit and the increase value of the limit power, and / or the mapping relationship between the temperature rise limit and the extension value of the duration; for another example, in the case of raising the input voltage value, the limit power of the processor in the enhanced mode and / or the duration can be decreased according to the mapping relationship between the temperature rise limit and the decrease value of the limit power, and / or the mapping relationship between the temperature rise limit and the shortening value of the duration.

[0107] In some embodiments, the first mapping relationship includes the mapping relationship between the third voltage value and the second temperature rise limit; the method further includes the following steps S1017 to step S10110:

[0108] Step S1017, when the input voltage of the electronic device is the third voltage value, obtain the third operating temperature of the capacitor.

[0109] Here, set the input voltage of the power module of the electronic device to the third voltage value, and detect the capacitor temperature; after the capacitor temperature is stable, use this stable temperature as the third operating temperature of the capacitor.

[0110] Step S1018, based on the third operating temperature, determine the second temperature rise limit corresponding to the electronic device.

[0111] Here, after determining the third operating temperature of the capacitor, the second temperature rise limit can be determined in a manner corresponding to the determination of the first temperature rise limit described in combination with the above steps S10141 to S10142.

[0112] Step S1019, based on the third voltage value and the second temperature rise limit, determine the first lifespan of the capacitor at the third voltage value.

[0113] Here, based on the third voltage value and the second temperature rise limit, the first lifespan of the capacitor at the third voltage value can be determined by any suitable method. In some embodiments, in combination with the historical monitoring values of the input voltage value, the temperature rise limit, and the capacitor service life of the electronic device, the first lifespan of the capacitor at the third voltage value can be determined by the staff according to work experience. In some embodiments, a preset lifespan calculation rule can be used to determine the first lifespan of the capacitor at the third voltage value.

[0114] In some embodiments, the first lifespan of the capacitor at the third voltage value can be determined using the following lifespan calculation rules:

[0115] First, based on the second temperature rise limit, determine the temperature rise multiplier; in implementation, the temperature rise multiplier DD can be determined using the following formula (1):

[0116]

[0117] where T gap represents the second temperature rise limit.

[0118] Then, based on the third voltage value, determine the voltage multiplier; in implementation, the voltage multiplier DV can be determined using the following formula (2):

[0119]

[0120] where V dc represents the third voltage value;

[0121] Finally, based on the voltage multiplier and the temperature rise multiplier, determine the first lifespan. In implementation, the first lifespan LN of the capacitor can be determined using the following formula (3):

[0122]

[0123] In this way, based on the third voltage value and the second temperature rise limit, using the above formulas (1), (2), and (3), the first lifespan of the capacitor at the third voltage value can be calculated.

[0124] Step S10110, in the case where the first lifespan is not less than the preset lifespan, establish a first mapping relationship among the third voltage value, the second temperature rise limit, and the first lifespan.

[0125] Here, after calculating the first lifespan of the capacitor, if the first lifespan is not less than the preset lifespan, establish a first mapping relationship among the third voltage value, the second temperature rise limit, and the first lifespan; if the first lifespan is less than the preset lifespan, do not establish this first mapping relationship.

[0126] In this way, for each voltage value within the possible value range of the input voltage of the power supply module, the corresponding lifespan information can be calculated using the above embodiments, and it can be determined whether the first mapping relationship can be established according to the calculation results.

[0127] In some embodiments, before setting the third parameter value of the third component to the first temperature value in the above step S1012, the method further includes the following step S1016:

[0128] Step S1016: Determine a target temperature value based on the first temperature rise limit and the second mapping relationship. Here, the first temperature value includes the target temperature value, and the second mapping relationship represents the mapping relationship between a preset temperature rise limit and the temperature rise value of the over-temperature protection temperature corresponding to the capacitor.

[0129] Here, the second mapping relationship refers to the mapping relationship established in advance between the temperature rise limit and the temperature rise value of the over-temperature protection temperature corresponding to the capacitor. In some embodiments, the second mapping relationship can be stored in the form of a table, text, or any other form.

[0130] In some embodiments, the second mapping relationship can be a linear mapping relationship between the temperature rise limit and the temperature rise value of the over-temperature protection temperature corresponding to the capacitor. For example, in the second mapping relationship, the numerical value of the temperature rise limit is equal to the temperature rise value of the over-temperature protection temperature. For example, when the temperature rise limit is 10 degrees, the temperature rise value of the over-temperature protection temperature is also 10 degrees.

[0131] In some embodiments, the second mapping relationship can be a non-linear mapping relationship between the temperature rise limit and the temperature rise value of the over-temperature protection temperature corresponding to the capacitor. For example, as the numerical value of the temperature rise limit increases, the growth rate of the temperature rise value of the over-temperature protection temperature corresponding to the capacitor gradually decreases.

[0132] In the embodiments of the present disclosure, by establishing the second mapping relationship in advance, after determining the temperature rise limit of the electronic device, the over-temperature protection temperature of the capacitor can be quickly determined and reset.

[0133] Next, Figure 2 , taking the electronic device as a BOX device and the first component as an external I / O device connected to the BOX device as an example, an embodiment of the control method provided by the present disclosure will be described. As Figure 2 shown, this embodiment includes the following steps S201 to S206:

[0134] Step S201: Detect the I / O device connected to the BOX device; then, execute step S202;

[0135] Step S202: Determine whether the total power of the I / O device connected to the BOX device is less than the power threshold; if not, execute step S201; if so, execute step S203;

[0136] Here, the total power of the I / O device refers to the sum of the maximum power budgets corresponding to the I / O devices connected to the BOX device. The power threshold can be a preset power value.

[0137] Step S203: Start the high-performance mode of the BOX device; then, execute step S204;

[0138] In this embodiment, the first mode of the electronic device is the high-performance mode of the BOX device.

[0139] Step S204: Obtain the operating temperature of the BOX device and calculate the temperature rise limit of the BOX device; then, execute Step S205;

[0140] Here, obtain the operating temperature of the processor of the BOX device and the operating temperature of the capacitor corresponding to the power supply module, and calculate the temperature rise limit of the BOX device.

[0141] Step S205: Based on the temperature rise limit of the BOX device, query the mapping relationship table between the temperature rise limit and the input voltage to determine the target voltage value; query the mapping relationship table between the temperature rise limit and the temperature rise value of the over-temperature protection temperature to determine the target temperature rise value of the over-temperature protection temperature; then, execute Step S206;

[0142] In this embodiment, the first mapping relationship is the mapping relationship table between the temperature rise limit and the input voltage, and the second mapping relationship is the mapping relationship table between the temperature rise limit and the temperature rise value of the over-temperature protection temperature.

[0143] Step S206: Adjust the input voltage of the power supply module of the BOX device to the target voltage value, and increase the over-temperature protection temperature of the capacitor on the power input path of the power supply module by the target temperature rise value.

[0144] Here, the processor of the BOX device sends a control signal to the adapter corresponding to the power supply module, so that the adapter adjusts the output DC voltage to the target voltage value based on this control signal.

[0145] Next, in combination with Figure 3 , an embodiment of calculating the temperature rise limit of the BOX device in the above embodiment will be described. As Figure 3 shown, this embodiment includes the following steps S301 to S303:

[0146] Step S301: Obtain the operating temperature of the processor of the BOX device and the operating temperature of the capacitor on the power input path of the power supply module; then, execute Step S302;

[0147] Step S302: Calculate the first difference between the operating temperature of the processor and the rated operating temperature, and the second difference between the operating temperature of the capacitor and the rated operating temperature; then, execute Step S303;

[0148] Step S303: Take the smaller of the first difference and the second difference as the temperature rise limit of the BOX device.

[0149] Next, in combination with Figure 4 , an embodiment of constructing the mapping relationship table between the temperature rise limit and the input voltage in the above embodiment will be described. AsFigure 4 As shown, this embodiment includes the following steps S401 to S406:

[0150] Step S401, set the input voltage of the power module in the BOX device to the fourth voltage value; then, execute Step S402;

[0151] Step S402, obtain the operating temperatures of the processor and the capacitor; then, execute Step S403;

[0152] Step S403, calculate the temperature rise limit of the BOX device based on the operating temperatures of the processor and the capacitor; then, execute Step S404;

[0153] Here, to calculate the temperature rise limit of the BOX device based on the operating temperatures of the processor and the capacitor, the implementation method described above can be adopted, which will not be elaborated here.

[0154] Step S404, calculate the temperature rise multiplier of the BOX device based on the calculated temperature rise limit; calculate the voltage multiplier of the BOX device based on the fourth voltage value; then, execute Step S405;

[0155] Here, the temperature rise constant and voltage constant of the BOX device can be calculated respectively using the formulas (1) and (2) described above.

[0156] Step S405, calculate the predicted life of the capacitor based on the calculated temperature rise multiplier and voltage multiplier; then, execute Step S406;

[0157] Here, the predicted life of the capacitor can be calculated using the formula (3) described above.

[0158] Step S406, when the predicted life of the capacitor is greater than the specified life threshold, establish a mapping relationship table among the fourth voltage value, the calculated temperature rise limit, and the predicted life.

[0159] Here, the calculated temperature rise multiplier and voltage multiplier can also be added to the mapping relationship table at the same time.

[0160] For X5R capacitors and X6S capacitors, the mapping relationship tables among the temperature rise limit, input voltage, and predicted life are established respectively using the methods shown in the above embodiments. Tables 1 to 3 below exemplarily show some of the mapping relationships between the temperature rise limit and the input voltage.

[0161] When the life of the X5R capacitor is limited to be greater than 2 years, for each input voltage, measure the operating temperature of the X5R capacitor, and calculate the temperature rise limit, temperature rise constant, voltage constant, and life based on the input voltage and the operating temperature, so as to obtain the mapping relationship between the input voltage and the temperature rise limit, as shown in Table 1.

[0162]

[0163] Table 1: Mapping relationship between temperature rise limit and input voltage when the life of X5R capacitor is greater than 2 years

[0164] Under the condition that the life of the X5R capacitor is limited to be greater than 3 years, for each input voltage, the operating temperature of the X5R capacitor is measured, and based on the input voltage and the operating temperature, the temperature rise limit, temperature rise constant, voltage constant, and life are calculated, so as to obtain the mapping relationship between the input voltage and the temperature rise limit, as shown in Table 2.

[0165]

[0166] Table 2: Mapping relationship between temperature rise limit and input voltage when the life of X5R capacitor is greater than 3 years

[0167] Under the condition that the life of the X6S capacitor is limited to be greater than 2 years, for each input voltage, the operating temperature of the X6S capacitor is measured, and based on the input voltage and the operating temperature, the temperature rise limit, temperature rise constant, voltage constant, and life are calculated, so as to obtain the mapping relationship between the input voltage and the temperature rise limit, as shown in Table 3.

[0168]

[0169] Table 3: Mapping relationship between temperature rise limit and input voltage when the life of X6S capacitor is greater than 2 years

[0170] For the BOX device, the control method provided by the present disclosure is adopted. Based on the change in the connection status of the I / O device on the BOX device, the input voltage of the power module in the BOX device is adjusted, and the overtemperature protection temperature of the capacitor corresponding to the power module is adjusted accordingly. Some test results are shown in Table 4 below.

[0171]

[0172]

[0173] Table 4: Test results for the BOX device

[0174] Here, the operating modes of the BOX device are divided into the best performance mode, the high performance mode, and the normal performance mode according to the device performance. In Table 4, for example, when it is detected that I / O devices are connected to the Type A interface, Type C interface, and HDMI interface of the BOX device, the power consumption budget of the I / O devices is relatively high. Therefore, it is necessary to configure a relatively high maximum system power consumption (i.e., set the maximum system power consumption to 43W). As a result, the processor of the BOX device does not have the condition to be in the enhanced mode at a relatively high power for a long time. Therefore, the BOX device is set to the normal mode, the operating voltage is set to 20V, the over-temperature protection temperature of the capacitor is 55 degrees, the limit power of the processor in the enhanced mode is set to 20W (i.e., PL2 = 20W), and the duration is 8s. For another example, when it is detected that no I / O devices are connected to the Type A interface, Type C interface, and HDMI interface of the BOX device, the power consumption budget of the I / O devices is relatively low. Therefore, most of the electrical energy provided by the power supply module can be supplied to the processor of the BOX device, creating conditions for the processor to be in the enhanced mode for a long time at a high power. Therefore, the BOX device is set to the best performance mode, the operating voltage is set to 9V, the over-temperature protection temperature of the capacitor is 80 degrees, and at the same time, the limit power of the processor in the enhanced mode is set to 25W (i.e., PL2 = 25W), and the enhanced duration is extended to 30s.

[0175] As can be seen from the above embodiments, for the control method provided by the present disclosure, on the one hand, by reducing the input voltage of the power supply module in the BOX device (for example, the Type C DC input voltage), the upper limit of the operating temperature of the capacitor corresponding to the power supply module is increased, thereby achieving the effect of improving the performance of the BOX device. Compared with the method of using high-temperature-resistant devices or increasing the heat dissipation solution in the related art, the present disclosure does not require additional hardware costs and can better adapt to the small-size system design. On the other hand, by reducing the input voltage of the power supply module, the system power consumption of the BOX device in the shutdown state can be significantly reduced, better meeting the power consumption requirements. For example, when the input voltage of the power supply module is 20V, the system power consumption of the BOX device in the shutdown state is 0.34W, while when the input voltage of the power supply module is 9V, the system power consumption of the BOX device in the shutdown state can be reduced to 0.153W. On the one hand, by reducing the input voltage of the power supply module, the conversion efficiency of the power supply module of the BOX device in the light load state can be improved. On the other hand, when the input voltage of the power supply module is relatively low, the ripple voltage in the voltage is lower. For example, when the input voltage is 20V, the ripple voltage is 1V, and when the input power supply is 9V, the ripple voltage is reduced to 0.45V. Here, the lower ripple voltage can reduce the piezoelectric effect of the capacitor, and the lower piezoelectric effect can significantly reduce the electronic noise.

[0176] Based on the foregoing embodiments, the present disclosure provides a control device, which includes each unit included therein and each module included in each unit, and can be implemented by a processor in an electronic device; of course, it can also be implemented by specific logic circuits; during implementation, the processor can be a central processing unit (CPU), a microprocessor unit (MPU), a digital signal processor (DSP), a field programmable gate array (FPGA), etc.

[0177] Figure 5 FIG. is a schematic structural diagram of a control device provided by the present disclosure, as Figure 5 shown, the control device 500 includes: a first control module 510 and a second control module 520, wherein:

[0178] The first control module 510 is configured to control the electronic device to operate in a first mode in response to a first component satisfying a first condition;

[0179] The second control module 520 is configured to control the electronic device to operate in a second mode in response to the first component satisfying a second condition;

[0180] The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, and the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter is used to limit the temperature of the third component.

[0181] In some embodiments, the first component represents a component capable of obtaining electrical energy from the power supply module of the electronic device; the first condition represents that the total power corresponding to the first component connected to the electronic device is less than a specified power threshold; the second condition represents that the total power corresponding to the first component connected to the electronic device is not less than the power threshold;

[0182] The first control module 510 is configured to control the electronic device to operate in a first mode in response to the total power corresponding to the first component connected to the electronic device being less than a specified power threshold;

[0183] The second control module 520 is configured to control the electronic device to operate in a second mode in response to the total power corresponding to the first component connected to the electronic device not being less than the power threshold.

[0184] In some embodiments, the second component characterizes the power supply module of the electronic device; the second parameter value characterizes the input voltage value corresponding to the power supply module; the input voltage value includes a first voltage value and a second voltage value higher than the first voltage value; the third parameter characterizes the over-temperature protection temperature, and the third parameter value includes a first temperature value and a second temperature value lower than the first temperature value;

[0185] The first control module 510 is configured to control the power supply module to operate at the first voltage value and set the third parameter to the first temperature value;

[0186] The second control module 520 is configured to control the power supply module to operate at the second voltage value and set the third parameter to the second temperature value.

[0187] In some embodiments, the third component characterizes a capacitor on the power input path corresponding to the power supply module.

[0188] In some embodiments, the apparatus 500 further includes:

[0189] A first acquisition module, configured to acquire a first operating temperature of the capacitor;

[0190] A first determination module, configured to determine a first temperature rise limit corresponding to the electronic device based on the first operating temperature;

[0191] A second determination module, configured to determine a target voltage value based on the first temperature rise limit, a preset lifetime of the capacitor, and a first mapping relationship;

[0192] Wherein, the first voltage value includes the target voltage value; the first mapping relationship characterizes the mapping relationship between the temperature rise limit corresponding to the electronic device and the input voltage value under the condition of maintaining the lifetime of the capacitor greater than the preset lifetime.

[0193] In some embodiments, the apparatus 500 further includes:

[0194] A third determination module, configured to determine a target temperature value based on the first temperature rise limit and a second mapping relationship;

[0195] Wherein, the first temperature value includes the target temperature value; the second mapping relationship characterizes the mapping relationship between a preset temperature rise limit and the temperature rise value corresponding to the over-temperature protection temperature of the capacitor.

[0196] In some embodiments, the first determination module is configured to:

[0197] Acquire a second operating temperature of the processor of the electronic device;

[0198] Determine the first temperature rise limit based on the first operating temperature and the second operating temperature.

[0199] In some embodiments, the first mapping relationship includes a mapping relationship between a third voltage value and a second temperature rise limit;

[0200] The first acquisition module is configured to acquire a third operating temperature of the capacitor when the input voltage of the electronic device is the third voltage value;

[0201] The first determination module is configured to determine a second temperature rise limit corresponding to the electronic device based on the third operating temperature;

[0202] The apparatus 500 further includes:

[0203] A fourth determination module; the fourth determination module is configured to determine a first lifespan of the capacitor at the third voltage value based on the third voltage value and the second temperature rise limit;

[0204] The mapping module is configured to establish a first mapping relationship among the third voltage value, the second temperature rise limit, and the first lifespan when the first lifespan is not less than the preset lifespan.

[0205] The description of the above apparatus embodiments is similar to the description of the above method embodiments and has similar beneficial effects to the method embodiments. In some embodiments, the functions or modules included in the apparatus provided by the present disclosure may be used to execute the methods described in the above method embodiments. For the technical details not disclosed in the apparatus embodiments of the present disclosure, please refer to the description of the method embodiments of the present disclosure for understanding.

[0206] Based on the foregoing embodiments, the present disclosure provides an electronic device. Figure 6 A schematic diagram of the hardware entity of an electronic device provided by the present disclosure is shown as Figure 6 As shown, the electronic device 600 includes: a second component 610, a third component 620, and a processor 630; wherein,

[0207] The processor 630 is configured to control the electronic device to operate in a first mode in response to the first component satisfying a first condition, and control the electronic device to operate in a second mode in response to the first component satisfying a second condition;

[0208] The second parameter value of the second component 610 in the first mode is lower than the second parameter value of the second component 610 in the first mode, and the third parameter value of the third component 620 in the first mode is higher than the third parameter value of the third component 630 in the second mode. The third parameter is used to limit the temperature of the third component 630.

[0209] The description of the above embodiments of the electronic device is similar to the description of the above method embodiments, and has beneficial effects similar to those of the method embodiments. In some embodiments, the functions or components included in the electronic device provided by the embodiments of the present disclosure can be used to execute the methods described in the above method embodiments. For the technical details not disclosed in the embodiments of the device of the present disclosure, please refer to the description of the method embodiments of the present disclosure for understanding.

[0210] It should be noted that in the embodiments of the present disclosure, if the above control method is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiments of the present disclosure, in essence, or the part that contributes to the related technology can be embodied in the form of a software product. The software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present disclosure. The foregoing storage medium includes: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disc that can store program codes. In this way, the embodiments of the present disclosure are not limited to any specific hardware, software, or firmware, or any combination of hardware, software, and firmware.

[0211] The embodiments of the present disclosure provide a computer device, including a memory and a processor. The memory stores a computer program that can run on the processor, and when the processor executes the program, it implements some or all of the steps in the above method.

[0212] The embodiments of the present disclosure provide a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements some or all of the steps in the above method. The computer-readable storage medium can be transient or non-transient.

[0213] The embodiments of the present disclosure provide a computer program, including computer-readable code. When the computer-readable code runs in a computer device, the processor in the computer device executes to implement some or all of the steps in the above method.

[0214] Embodiments of the present disclosure provide a computer program product. The computer program product includes a non-transitory computer-readable storage medium storing a computer program. When the computer program is read and executed by a computer, some or all of the steps in the above method are implemented. The computer program product can be specifically implemented in the form of hardware, software, or a combination thereof. In some embodiments, the computer program product is specifically embodied as a computer storage medium. In other embodiments, the computer program product is specifically embodied as a software product, such as a Software Development Kit (SDK), etc.

[0215] It should be noted here that: the descriptions of the above embodiments tend to emphasize the differences between the embodiments, and their similarities can be referred to each other. The descriptions of the above embodiments of the device, storage medium, computer program, and computer program product are similar to the descriptions of the above method embodiments and have similar beneficial effects to the method embodiments. For the technical details not disclosed in the embodiments of the device, storage medium, computer program, and computer program product of the present disclosure, please refer to the descriptions of the method embodiments of the present disclosure for understanding.

[0216] It should be understood that the term "one embodiment" or "an embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present disclosure. Therefore, the appearances of the phrase "in one embodiment" or "in an embodiment" throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in various embodiments of the present disclosure, the magnitudes of the sequence numbers of the above steps / processes do not mean the order of execution. The order of execution of each step / process should be determined by its function and internal logic and should not constitute any limitation to the implementation process of the embodiments of the present disclosure. The sequence numbers of the above embodiments of the present disclosure are only for description and do not represent the advantages or disadvantages of the embodiments.

[0217] It should be noted that in this document, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0218] In several embodiments provided by the present disclosure, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined, or can be integrated into another system, or some features can be ignored, or not executed. In addition, the couplings, direct couplings, or communication connections between the components shown or discussed with each other can be through some interfaces. The indirect couplings or communication connections of devices or units can be electrical, mechanical, or other forms.

[0219] The units described above as separate components may or may not be physically separated. The components shown as units may or may not be physical units. They can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0220] In addition, each functional unit in the embodiments of the present disclosure can be all integrated in a processing unit, or each unit can be separately used as a unit, or two or more units can be integrated in a unit. The above-mentioned integrated units can be implemented in the form of hardware, or in the form of a combination of hardware and software functional units.

[0221] Those of ordinary skill in the art can understand that all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions. The foregoing program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps including the above method embodiments. The foregoing storage medium includes various media that can store program codes, such as removable storage devices, read-only memory (ROM), magnetic disks, or optical discs.

[0222] Alternatively, if the above-mentioned integrated units of the present disclosure are implemented in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present disclosure, in essence, or the part that contributes to the related technology can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present disclosure. The foregoing storage medium includes various media that can store program codes, such as removable storage devices, ROM, magnetic disks, or optical discs.

[0223] As described above, it is only the implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure.

Claims

1. A control method, comprising: In response to the first component satisfying the first condition, controlling the electronic device to operate in the first mode; In response to the first component satisfying a second condition, controlling the electronic device to operate in a second mode; The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter is used to limit the temperature of the third component.

2. The method according to claim 1, wherein the first component represents a component that can obtain electrical energy from a power module of the electronic device; the first condition represents that a total power corresponding to the first component connected to the electronic device is less than a specified power threshold; the second condition represents that a total power corresponding to the first component connected to the electronic device is not less than the power threshold; In response to the first component satisfying the first condition, controlling the electronic device to operate in the first mode comprises: In response to a total power corresponding to a first component connected to the electronic device being less than a specified power threshold, controlling the electronic device to operate in a first mode; In response to the first component satisfying the second condition, controlling the electronic device to operate in the second mode comprises: In response to a total power corresponding to a first component connected to the electronic device being not less than the power threshold, the electronic device is controlled to operate in a second mode.

3. The method according to claim 1 or 2, wherein the second component represents a power module of the electronic device; the second parameter value represents an input voltage value corresponding to the power module; the input voltage value includes a first voltage value and a second voltage value higher than the first voltage value; The third parameter represents the over-temperature protection temperature, and the third parameter value includes a first temperature value and a second temperature value lower than the first temperature value; The control electronic device operates in a first mode, including: Controlling the power module to operate at the first voltage value, and setting the third parameter to the first temperature value; The control electronic device operates in the second mode, including: The power module is controlled to operate at the second voltage value, and the third parameter is set to a second temperature value. 4 . The method according to claim 3 , wherein the third component represents a capacitor on a power input path corresponding to the power module.

5. The method according to claim 4, before controlling the power module to operate at the first voltage value, further comprising: Acquiring a first operating temperature of the capacitor; Determining a first temperature rise limit corresponding to the electronic device based on the first operating temperature; Determining a target voltage value based on the first temperature rise limit, the preset life of the capacitor and a first mapping relationship; Wherein, the first voltage value includes the target voltage value; The first mapping relationship represents a mapping relationship between a temperature rise limit and an input voltage value corresponding to the electronic device while maintaining a life of the capacitor greater than the preset life.

6. The method according to claim 5, before setting the third parameter value of the third component to the first temperature value, further comprising: Determine a target temperature value based on the first temperature rise limit and the second mapping relationship; The first temperature value includes the target temperature value; and the second mapping relationship represents a mapping relationship between a preset temperature rise limit and a temperature rise value of an over-temperature protection temperature corresponding to the capacitor.

7. The method according to claim 5, wherein determining the first temperature rise limit corresponding to the electronic device based on the operating temperature of the capacitor comprises: Acquiring a second operating temperature of a processor of the electronic device; The first temperature rise limit is determined based on the first operating temperature and the second operating temperature.

8. The method according to claim 5, wherein the first mapping relationship comprises a mapping relationship between a third voltage value and a second temperature rise limit; the method further comprises: When the input voltage of the electronic device is a third voltage value, obtaining a third operating temperature of the capacitor; Based on the third operating temperature, determining a second temperature rise limit corresponding to the electronic device; Determining a first life of the capacitor at the third voltage value based on the third voltage value and the second temperature rise limit; When the first lifespan is not less than the preset lifespan, a first mapping relationship among the third voltage value, the second temperature rise limit and the first lifespan is established.

9. A control device comprising A first control module, configured to control the electronic device to operate in a first mode in response to the first component satisfying a first condition; a second control module, configured to control the electronic device to operate in a second mode in response to the first component satisfying a second condition; The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter is used to limit the temperature of the third component.

10. An electronic device, comprising: A second component, a third component, and a processor; The processor is used to control the electronic device to operate in a first mode in response to the first component satisfying a first condition; In response to the first component satisfying a second condition, controlling the electronic device to operate in a second mode; The second parameter value of the second component in the first mode is lower than the second parameter value of the second component in the first mode, the third parameter value of the third component in the first mode is higher than the third parameter value of the third component in the second mode, and the third parameter is used to limit the temperature of the third component.

Images