Inter-chip data transmission processing method based on photoelectric hybrid architecture

Abstract

The invention relates to the field of photoelectric hybrid computing, and discloses an inter-chip data transmission processing method based on a photoelectric hybrid architecture, which comprises the following steps of: converting an electric signal into an optical signal through a high-speed SerDes interface by virtue of cooperative work of an electric chip and an optical chip, and performing high-speed data processing and computing by utilizing an optical device in the optical chip, the processed optical signal is converted into an electric signal through a photoelectric converter, and the electric signal is returned to an electric chip for subsequent calculation; through the photoelectric hybrid architecture, the electric chip focuses on complex calculation tasks, and the optical chip is responsible for high-speed data transmission and primary processing, so that the data transmission efficiency and the calculation performance are remarkably improved, and the power consumption of the system is reduced. The method can effectively improve the performance in a large-scale parallel computing task, has lower energy consumption and higher transmission efficiency, and is particularly suitable for the fields of high-performance computing, deep learning and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic hybrid computing, and particularly to an inter-chip data transmission and processing method based on an optoelectronic hybrid architecture. Background Art

[0002] With the continuous growth of computing requirements, especially in the fields of artificial intelligence, big data processing, and scientific computing, the requirements for computing power and data transmission speed are getting higher and higher. Traditional computing architectures usually rely on microelectronic designs based on electrical signals, especially accelerator card architectures such as GPUs and ASICs, and use stream processors, tensor processing units, etc. for large-scale parallel computing. However, with the expansion of the computing scale and the increase in the complexity of processing tasks, the data transmission method based on electrical signals gradually exposes a series of bottlenecks.

[0003] First of all, there are significant losses in data transmission based on electrical signals. During high-frequency data transmission, electrical signals are affected by factors such as resistance, parasitic capacitance, and signal attenuation, resulting in a decline in signal quality, which in turn affects the overall performance and stability of the system. Especially when dealing with large-scale parallel computing, the transmission bandwidth and transmission distance of electrical signals are limited, and bottlenecks are easily generated, unable to meet the requirements of high-speed and large-capacity data transmission.

[0004] Secondly, the power consumption problem in traditional electrical chip architectures is also becoming increasingly prominent. When electrical chips execute a large number of computing tasks, they need to frequently transmit data between various microprocessors. With the increase in task complexity, the frequency of data transmission and frequent computing operations have made chip power consumption and heat dissipation urgent problems to be solved. With the increase in chip integration and computing power, the problems of power consumption and heat dissipation have become more serious, restricting the further improvement of computing performance.

[0005] In addition, although accelerator card architectures such as GPUs and ASICs have strong parallel computing capabilities, there are still certain limitations in their collaborative work of data transmission and computing tasks. When electrical chips perform calculations, frequent electrical signal transmissions lead to a decrease in data transmission latency and computing efficiency. Especially in applications with high requirements for calculation results, the data transmission latency seriously affects the response speed of the overall system.

[0006] Therefore, there is an urgent need for a new architecture to solve these problems, especially in improving data transmission speed, reducing power consumption, and enhancing computing performance. Summary of the Invention

[0007] Aiming at the deficiencies of the prior art, the present invention provides an inter-chip data transmission and processing method based on an optoelectronic hybrid architecture, which solves the problems of bandwidth bottlenecks, signal losses, and high power consumption existing in the existing data transmission method based on electrical signals.

[0008] To achieve the above object, the present invention is implemented through the following technical solutions: A method for inter-chip data transmission and processing based on an optoelectronic hybrid architecture, comprising the following steps: The electrical chip transmits data to the optical chip through a high-speed SerDes interface; The output electrical signal of the electrical chip is converted into an optical signal through the transmission port of the optical chip, and the optical signal is processed and calculated by the optical devices inside the optical chip; The optical chip converts the processed optical signal into an electrical signal through an optoelectronic converter, and transmits it back to the electrical chip through the SerDes interface of the electrical chip for subsequent calculation and processing, completing optoelectronic collaborative computing.

[0009] Preferably, the SerDes interface of the electrical chip performs serial-to-parallel conversion on the electrical signal, and the optoelectronic converter of the optical chip is used to convert the electrical signal into an optical signal and convert the processed optical signal back into an electrical signal. The conversion process realizes the conversion of optoelectronic signals through an electro-optic modulation method.

[0010] Preferably, the output signal of the high-speed SerDes interface is an electrical signal, the number of output channels matches the number of input channels of the optical chip, and the number of receiving channels matches the number of output channels of the optical chip.

[0011] Preferably, the optical chip can process multiple input optical signals, and convert each optical signal into an electrical signal through a corresponding optoelectronic converter for parallel computing and processing.

[0012] Preferably, the electrical signal is converted into an optical signal through an electro-optic modulation method, and is modulated and calculated by the optical devices inside the optical chip. The optical devices inside the optical chip include Mach-Zehnder modulators and resonant micro-rings.

[0013] Preferably, the electrical chip samples, performs data precision conversion, and arranges the electrical signal through the SerDes interface.

[0014] Preferably, after the optical chip converts the optical signal into an electrical signal through the optoelectronic converter, it performs signal level boosting and precision adjustment to ensure the quality of the output electrical signal.

[0015] The present invention also provides an inter-chip data transmission and processing system based on an optoelectronic hybrid architecture, comprising: An electrical chip, which transmits data to the optical chip through a high-speed SerDes interface, the output signal of the interface is an electrical signal, and the number of output channels matches the number of input channels of the optical chip; Optical chip, the optical chip includes a photoelectric converter, an optical device and a data processing module. The optical chip processes the electrical signal converted into an optical signal, and the processed optical signal is then converted into an electrical signal by the photoelectric converter and transmitted back to the electrical chip.

[0016] The present invention provides an inter-chip data transmission and processing method based on an optoelectronic hybrid architecture. It has the following beneficial effects: 1. By adopting an optoelectronic hybrid architecture, the data transmission between the electrical chip and the optical chip is carried out through optical signals, effectively avoiding the bandwidth bottleneck and signal loss problems in traditional electrical signal transmission. Optical signals have lower attenuation and higher bandwidth during transmission, so the data transmission efficiency is greatly improved, especially suitable for application scenarios of high-speed and large-scale data transmission.

[0017] 2. The optical chip of the present invention uses optoelectronic conversion technology for calculation and data processing. Optical signals have lower energy loss during transmission compared to electrical signals. Through optoelectronic collaborative computing, the optical chip is responsible for high-speed data transmission and part of the computing tasks, and the electrical chip focuses on complex calculations, reducing the power consumption of the electrical chip, and the overall system realizes low-power and high-performance operation.

[0018] 3. The optical computing module in the optical chip of the present invention has parallel processing capabilities and can execute a large number of computing tasks during high-speed optical signal processing. When the electrical chip processes electrical signals, it can further process data through efficient computing units. The collaborative work of the two significantly improves the overall computing performance, especially in large-scale parallel computing and complex task processing, and can provide higher computing power.

[0019] 4. The transmission speed of the optical signal of the present invention is much higher than that of the electrical signal. Especially when performing calculations and data processing inside the optical chip, it can reduce the delay and processing bottleneck due to electrical signal transmission. The optoelectronic hybrid architecture improves the system response speed by reducing the data conversion time and the delay during signal transmission, making real-time data processing and low-latency computing possible.

[0020] 5. The present invention can expand the number of electrical chips and optical chips according to requirements, and realize the collaborative work of multiple processing units through appropriate interfaces and connection methods. The system architecture is flexible, can be adjusted according to different computing tasks and load requirements, has high scalability, adapts to different scales of computing needs, and is suitable for high-demand scenarios such as large-scale data centers and artificial intelligence computing. Description of the Drawings

[0021] Figure 1 It is a schematic flowchart of the inter-chip data transmission and processing method of the optoelectronic hybrid architecture of the present invention; Figure 2This is a schematic diagram of the inter-chip data transmission and processing system of the optoelectronic hybrid architecture of the present invention. Detailed implementation manners

[0022] Next, in combination with the accompanying drawings of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0023] Please refer to the attached Figure 1 - attached Figure 2 The present invention provides an inter-chip data transmission and processing method based on an optoelectronic hybrid architecture, which is mainly applied to a multi-processor system, especially in high-performance computing and data transmission. By combining the advantages of electrical chips and optical chips, this method realizes efficient inter-chip data transmission and processing, improves computing power, reduces power consumption, and improves the efficiency and reliability of data transmission.

[0024] As Figure 1 shown, the inter-chip data transmission and processing method based on the optoelectronic hybrid architecture may include the following steps: S1. The electrical chip transmits data to the optical chip through a high-speed SerDes interface; S2. Convert the output electrical signal of the electrical chip into an optical signal through the transmission port of the optical chip, and the optical signal is processed and calculated by the optical devices inside the optical chip; S3. The optical chip converts the processed optical signal into an electrical signal through an optoelectronic converter and transmits it back to the electrical chip through the SerDes interface of the electrical chip for subsequent calculation and processing; S4. The electrical chip performs subsequent calculation and processing to complete optoelectronic collaborative calculation.

[0025] Next, each step of the method of the present invention will be described in detail.

[0026] For step S1, in this embodiment, the electrical chip transmits data to the optical chip through a high-speed SerDes interface. The SerDes interface, that is, the Serializer / Deserializer, plays a crucial role in the present invention. It is responsible for converting the parallel data generated by the internal processing unit of the electrical chip into a serial format to meet the input requirements of the optical chip.

[0027] Specifically, the electrical chip first prepares the processed data and sends this data to the optical chip through the SerDes interface. Through serialization operations, SerDes converts the parallel data stream into a serial signal, which is then transmitted to the input port of the optical chip. For each signal transmitted, the SerDes interface can efficiently perform the serial-to-parallel and parallel-to-serial conversion of electrical signals, ensuring signal integrity during transmission, especially effectively reducing transmission losses during high-speed data transmission.

[0028] During the operation of the SerDes interface, the electrical signal at its output end is compatible with the signal level at the input end of the optical chip, ensuring a smooth connection between the electrical chip and the optical chip. The design of the SerDes interface allows the signal output by the electrical chip to adapt to the level requirements of the input port of the optical chip. This design can effectively avoid signal loss or errors caused by signal mismatch. Therefore, the entire data transmission process has low latency and high stability.

[0029] For example, assume that after a certain computing unit in the electrical chip finishes processing, the generated data exists in parallel form. Through the SerDes interface, these parallel data are converted into serial signals and then sent to the optical chip. At this time, each serial data stream represents the output data of the computing unit of the electrical chip, and the signals after the serial-to-parallel conversion can smoothly enter the optical chip for further processing.

[0030] In addition, the operating frequency and data bandwidth of the SerDes interface will be adjusted according to actual application requirements to ensure that it meets the performance requirements in different scenarios. For example, in some high-performance computing scenarios, the frequency and bandwidth requirements for data transmission are high, and the SerDes interface needs to provide a larger data throughput to adapt to more complex computing tasks.

[0031] In this way, the data transmission between the electrical chip and the optical chip can be efficiently carried out without significant signal loss, providing a guarantee for subsequent data processing. The SerDes interface not only realizes the conversion of data formats but also plays a role in signal matching and synchronization, ensuring the efficient transmission of the data stream in the optoelectronic hybrid computing architecture.

[0032] In the application scenario of the present invention, the introduction of the SerDes interface enables the electrical chip and the optical chip to be effectively connected through high-speed serial signals, greatly reducing interference and losses in electrical signal transmission, and at the same time providing high-quality signal input for the subsequent optoelectronic conversion process.

[0033] In summary, step S1 realizes efficient data transmission between the electrical chip and the optical chip through the SerDes interface. This process relies on high-frequency and low-latency signal transmission technology to ensure the integrity and reliability of the data stream, providing basic support for the data processing tasks of the entire optoelectronic hybrid architecture.

[0034] For step S2, in this embodiment, in step S2, the output electrical signal of the electrical chip is converted into an optical signal through the transmission port of the optical chip. Specifically, the electrical signal after being serialized by the SerDes interface will first enter the input port of the optical chip, and then the electrical signal is converted into an optical signal through an optoelectronic conversion device. The optoelectronic conversion device (such as an electro-optic modulator) is responsible for converting the input electrical signal into an optical signal with corresponding information. In this process, the conversion of the optical signal is based on the electro-optic effect. Specifically, characteristics such as the amplitude, phase, or frequency of the electrical signal are modulated onto the optical signal through electro-optic modulation technology.

[0035] Exemplarily, when the electrical signal transmitted by the electrical chip enters the optical chip, the electrical signal may be a continuous electrical signal stream formed after serializing a high-frequency parallel data stream. At this time, the electro-optic modulator (such as a Mach-Zehnder modulator (MZM)) will apply modulation to this electrical signal to convert the electrical signal into an optical signal. The optical signal plays a key role in this step because it can carry more data and has lower transmission loss, which is particularly suitable for long-distance transmission and applications with high bandwidth requirements.

[0036] Inside the optical chip, the specific process of converting the electrical signal into an optical signal through the electro-optic modulator can be described as follows: First, the electrical signal stream passes through the electro-optic material (such as lithium niobate or other suitable materials) in the modulator. The modulator converts the electrical signal into a changing light intensity and transports it to the inside of the optical chip through an optical fiber or other appropriate transmission medium. These optical signals will be further modulated and processed by the optical devices inside the optical chip. For example, the optical signals may go through steps such as optical filtering, gain adjustment, and signal routing to prepare for subsequent computing tasks.

[0037] Technically, electro-optic modulation affects the transmission properties of optical signals by changing the electric field. In this conversion process, the modulator embeds the modulation information (such as current, frequency, amplitude, etc.) of the electrical signal into the optical signal to form an optical signal corresponding to the input electrical signal. For example, assuming that the electrical signal output by the electrical chip represents a digital information stream, the modulated optical signal can transmit this information and be processed inside the optical chip.

[0038] In addition, the generation and transmission of optical signals have many advantages, the most prominent of which is the low-loss characteristic of optical signals. Compared with electrical signals, optical signals have less attenuation during long-distance transmission and are not easily affected by electromagnetic interference. Therefore, during this process, the conversion of optical signals not only ensures the stability and high bandwidth of data transmission, but also greatly reduces data loss caused by problems such as impedance mismatch, power loss, and noise in electrical signal transmission.

[0039] The optoelectronic conversion device in the present invention adopts an efficient electro-optic modulation technology, which can maintain a high signal quality while ensuring the conversion rate. After the modulator converts the electrical signal into an optical signal, these optical signals are transmitted within the optical chip and participate in various calculation processes, ultimately forming a data stream suitable for subsequent calculations. After the processing is completed, the optical signal can be converted into an electrical signal through the corresponding optoelectronic conversion device and returned to the electrical chip for further calculation and entry into the next processing stage.

[0040] Through the above process, the optical signal not only serves as a carrier for data transmission, but also undergoes further operations through optical calculations and processing within the optical chip. The high parallelism and low power consumption characteristics of the optical chip enable it to provide a more efficient solution than pure electrical signal transmission when processing a large amount of data.

[0041] In summary, step S2 solves the bandwidth and signal loss problems in electrical signal transmission by converting the electrical signal into an optical signal. The core of this step lies in the application of electro-optic modulation technology. By converting the electrical signal into an optical signal, it provides an efficient and low-loss transmission method for subsequent data processing. This process not only improves the transmission efficiency, but also reduces the delay and energy consumption caused by the signal transmission distance between the electrical chip and the optical chip, significantly optimizing the overall performance of the system.

[0042] For step S3, in this embodiment, in step S3, the optical chip converts the processed optical signal into an electrical signal through an optoelectronic converter and transmits it back to the electrical chip through the SerDes interface of the electrical chip for subsequent calculation and processing. Specifically, after the calculation and processing within the optical chip, the optical signal already carries the calculated information. In order for the electrical chip to further process this information, the optical signal needs to be converted into an electrical signal through an optoelectronic converter.

[0043] The role of the optoelectronic converter is to convert the optical signal into an electrical signal. This conversion process relies on the photoelectric effect, in which the optical signal interacts with the semiconductor material to generate an electron flow, thereby forming an electrical signal. Common optoelectronic conversion devices include photodiodes, photodetectors, etc. In the present invention, the optoelectronic converter is used to convert the optical signal into an electrical signal, providing the original electrical signal input for subsequent data processing by the electrical chip.

[0044] For example, optical signals can be converted by photodiodes. After receiving an optical signal, the internal semiconductor material of the photodiode generates an electric current due to the interaction between photons and electrons. This electric current represents the electrical signal form of the original optical signal and is transmitted back to the electrical chip through the SerDes interface of the electrical chip to enter the subsequent calculation process. The efficiency and accuracy of converting optical signals into electrical signals directly affect the quality of data transmission. Therefore, the design of the optical-to-electrical converter is crucial.

[0045] In this embodiment, to ensure the quality of the transmitted signal, the electrical signal after optical-to-electrical conversion undergoes certain signal processing before entering the electrical chip. Generally, the electrical signal after optical-to-electrical conversion may have a certain accuracy error, or the signal level may not meet the input requirements of the electrical chip. Therefore, this electrical signal needs to undergo signal level boosting and accuracy adjustment. Signal level boosting is to increase the amplitude of the signal to a level suitable for processing by the electrical chip, while accuracy adjustment is to ensure that the electrical signal does not cause calculation errors due to excessive errors.

[0046] For example, the electrical signal after optical-to-electrical conversion may experience certain signal attenuation or errors due to the characteristics of the optical-to-electrical converter or the influence of external noise. In this case, the SerDes interface of the electrical chip needs to perform accuracy conversion on this signal to ensure the stability and correctness of the electrical signal. Accuracy conversion can reduce the errors caused by noise or distortion during the conversion process by sampling and quantifying the signal.

[0047] During the process of transmitting back to the electrical chip, the electrical signal not only needs to ensure that its level and accuracy meet the requirements, but also must consider the bandwidth and rate of data transmission. For example, in some high-parallel computing applications, the bandwidth requirement for data transmission is high. At this time, the SerDes interface of the electrical chip needs to provide sufficient bandwidth to ensure that the signal can be transmitted at a high speed, and at the same time, minimize the delay to avoid affecting the efficiency of subsequent calculations due to slow transmission.

[0048] It should be noted that some additional signal processing operations may also be involved in the process of converting optical signals back into electrical signals, depending on the requirements of the electrical chip for the input signal. These operations include signal level boosting of the signal, preprocessing of the data, and fine-tuning of the accuracy, all of which need to be fully considered and implemented during the transmission process.

[0049] In summary, the core of step S3 lies in converting the optical signal into an electrical signal through an optical-electric converter to ensure that the electrical chip can receive the electrical signal in a suitable format. This process requires ensuring signal quality, including level adjustment, precision conversion, etc., and finally achieving error-free transmission of the electrical signal and providing necessary data support for the calculation of the electrical chip. This step is a key link in the optical-electric hybrid computing architecture, ensuring the reliability and accuracy of the signal when it is transmitted from the optical chip to the electrical chip, and thus supporting subsequent data calculation tasks.

[0050] For step S4, in this embodiment, in step S4, the electrical chip performs subsequent calculation processing to complete optical-electric collaborative computing. Specifically, in this step, after receiving the electrical signal returned from the optical chip, the electrical chip uses its internal processing unit to further calculate and process the data. The computing unit of the electrical chip usually consists of multiple stream processors or other types of parallel processing units, which can efficiently process a large amount of parallel data.

[0051] The computing modules in the electrical chip, such as stream processors (e.g., CUDA cores of GPUs) or tensor processing units (TPUs), will receive the input electrical signal and preprocess, analyze, and calculate the data. The task of these computing modules is to convert the signal returned from the optical chip into a result that can be used for subsequent tasks. This process involves various computing operations, including addition, multiplication, data sorting, matrix operations, etc., depending on the application scenario and computing requirements.

[0052] For example, assume that the electrical chip needs to perform an image processing task in a certain application. In this case, the computing module of the electrical chip will process the electrical signal returned from the optical chip, such as performing edge detection, image segmentation, feature extraction, etc. Each task relies on the powerful parallel computing ability of the electrical chip, that is, multiple computing units operate on the input data simultaneously, thereby accelerating the overall processing process.

[0053] In addition, the electrical chip is not only responsible for performing calculations but also includes tasks such as storing the returned data and cache management. For example, in multiple iterative computing tasks, the electrical chip needs to store the intermediate data in the cache according to the calculation results for quick reading and use in subsequent operations. Through effective cache management, the electrical chip can optimize the computing efficiency, reduce the time to access external memory, and thus improve the overall performance.

[0054] In this embodiment, in order to cope with different computing requirements, the electronic chip can be configured with multiple computing units. For example, for some highly complex computing tasks, it may be necessary to use a GPU for parallel computing; while for some low-power and high-efficiency computing scenarios, the electronic chip may call a dedicated tensor processing unit (TPU) to accelerate specific algorithm processing. By flexibly scheduling between the computing modules in the electronic chip, the system can select the best computing resources for different tasks.

[0055] In the optoelectronic hybrid architecture, the computing tasks of the electronic chip are the result of collaborative work with the data processing of the optical chip. In the optical chip, after data is transmitted and processed by optical signals, some efficient data operations have been completed, but further processing still depends on the computing units of the electronic chip. After the data stream processed by the optical chip is transmitted to the electronic chip, operations such as structural adjustment and format conversion are usually performed to adapt to the processing requirements within the electronic chip. This process reflects the advantages of optoelectronic collaborative computing, that is, high-speed data transmission and preliminary processing are performed by the optical chip, and then complex computing tasks are performed by the electronic chip to maximize computing efficiency.

[0056] In actual operation, the electronic chip can optimize the computing process through various scheduling strategies. For example, in a multi-core computing unit, computing tasks can be distributed to different processors through a load balancing algorithm to ensure the full utilization of computing resources and minimize computing time. At the same time, the electronic chip can also adopt parallel computing and pipeline technologies so that multiple computing tasks can be performed simultaneously, thereby further improving processing efficiency.

[0057] All in all, the core of step S4 is that after receiving the data returned by the optical chip, the electronic chip uses its powerful computing ability to complete the final stage of optoelectronic collaborative computing. In this process, the computing units in the electronic chip need to process, adjust, store the transmitted data, and finally output the results. Through this collaborative computing, the advantages of the electronic chip and the optical chip are effectively combined, thereby improving the performance of the entire computing system and achieving efficient and low-power computing tasks.

[0058] Generally speaking, the present invention combines the conversion and processing of electrical signals and optical signals, and realizes efficient data transmission and computing by using the collaborative work between the optical chip and the electrical chip. First, the electrical chip converts parallel data into serial electrical signals through a high-speed SerDes interface and transmits them to the optical chip; subsequently, the optical chip converts the electrical signals into optical signals through an electro-optic modulator for high-speed processing and computing; the processed optical signals are converted back into electrical signals through a photoelectric converter and transmitted back to the electrical chip for further computing and processing. Finally, the entire computing process is completed through the computing module of the electrical chip, thereby improving the computing performance, reducing the power consumption, and optimizing the data transmission efficiency in large-scale parallel computing tasks. This method maximizes the processing capacity and energy efficiency of the system while ensuring high bandwidth and low latency through optoelectronic collaborative computing.

[0059] As Figure 2 shown, correspondingly, the present invention also provides an inter-chip data transmission and processing system based on an optoelectronic hybrid architecture, including an electrical chip and an optical chip.

[0060] In this embodiment, the inter-chip data transmission and processing system based on the optoelectronic hybrid architecture provided by the present invention includes two parts: an electrical chip and an optical chip, and they realize data transmission through a high-speed SerDes interface. The structure and working mode of the system are as follows: For the electrical chip part, the electrical chip is equipped with a high-speed SerDes interface, which is used to convert parallel data into serial electrical signals and transmit the data to the optical chip through this interface. The output signal of the interface is an electrical signal, and the number of output channels matches the number of input channels of the optical chip to ensure the compatibility of data transmission and the effective transmission of signals. The computing module of the electrical chip is responsible for generating and processing data. These data are serially-parallel converted through the SerDes interface and then transmitted to the optical chip through appropriate electrical signals for further processing.

[0061] For the optical chip part, the optical chip includes three main modules: a photoelectric converter, optical devices, and a data processing module. The photoelectric converter is used to convert the electrical signals output by the electrical chip into optical signals. This conversion uses electro-optic modulator technology to convert electrical signals into data suitable for optical signal transmission. Optical devices (such as Mach-Zehnder modulators, resonant micro-rings, etc.) modulate and compute the optical signals. These optical devices can perform necessary computing tasks on the optical signals, such as filtering, encryption, modulation, etc. The data processing module performs more complex operations on the optical signals according to application requirements, including the combination, distribution of optical signals, and further data computing.

[0062] After being processed by the optical chip, the optical signals are converted into electrical signals through the photoelectric converter and transmitted back to the electrical chip through the output port of the optical chip. After receiving the converted electrical signals, the electrical chip uses its computing module again for subsequent processing, and finally completes the computing task.

[0063] The key feature of this system is that the electrical chip and the optical chip are connected through a high-speed SerDes interface to ensure efficient data transmission. The optical chip converts electrical signals into optical signals through an optoelectronic converter for processing and then converts them back into electrical signals to complete the optoelectronic collaborative computing task. Through this optoelectronic hybrid architecture, the system can effectively improve the efficiency of data transmission, reduce power consumption, and enhance computing performance. Especially in large-scale parallel computing tasks, it can significantly improve the processing ability and computing speed.

[0064] The system of the present invention realizes the collaborative work of the electrical chip and the optical chip, solves the loss problem in traditional electrical signal transmission through optoelectronic conversion technology, and at the same time accelerates the computing process through the optical computing module. While ensuring accurate data transmission, the entire system can greatly reduce power consumption and improve energy efficiency, and is particularly suitable for application scenarios that require high bandwidth and large computing volume, such as high-performance computing, deep learning and other fields.

[0065] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for processing inter-chip data transmission based on an optoelectronic hybrid architecture, characterized in that: The following steps are involved: The electrical chip transmits data with the optical chip through a high-speed SerDes interface; The output electrical signal of the electrical chip is converted into an optical signal through the transmission port of the optical chip, and the optical signal is processed and calculated by the optical device inside the optical chip; The optical chip converts the processed optical signal into an electrical signal through a photoelectric converter, and transmits it back to the electrical chip through the SerDes interface of the electrical chip for subsequent calculation and processing, completing the photoelectric collaborative calculation.

2. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: The SerDes interface of the electrical chip performs serial-to-parallel conversion on the electrical signal, and the photoelectric converter of the optical chip is used to convert the electrical signal into an optical signal, and convert the processed optical signal back into an electrical signal. The conversion of the photoelectric signal is achieved through electro-optical modulation during the conversion process.

3. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: The output signal of the high-speed SerDes interface is an electrical signal, the number of output channels matches the number of input channels of the optical chip, and the number of receiving channels matches the number of output channels of the optical chip.

4. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: The optical chip can process multiple input optical signals and convert each optical signal into an electrical signal through a corresponding photoelectric converter for parallel computing.

5. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: The electrical signal is converted into an optical signal by electro-optical modulation, and is modulated and processed by optical devices inside the optical chip. The optical devices inside the optical chip include a Mach-Zehnder modulator and a resonant microring.

6. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: The electrical chip performs sampling, data precision conversion and arrangement operations on the electrical signal through a SerDes interface.

7. The inter-chip data transmission processing method based on the optoelectronic hybrid architecture according to claim 1, characterized in that: After the optical chip converts the optical signal into an electrical signal through a photoelectric converter, the signal level is raised and the accuracy is adjusted to ensure the quality of the output electrical signal.

8. An inter-chip data transmission processing system based on an optoelectronic hybrid architecture, used to execute the inter-chip data transmission processing method based on an optoelectronic hybrid architecture according to any one of claims 1 to 7, characterized in that: include: An electrical chip, wherein the electrical chip performs data transmission with the optical chip via a high-speed SerDes interface, wherein the output signal of the interface is an electrical signal, and the number of output channels matches the number of input channels of the optical chip; An optical chip includes a photoelectric converter, an optical device and a data processing module. The optical chip converts electrical signals into optical signals for processing. The processed optical signals are then converted into electrical signals through the photoelectric converter and transmitted back to the electrical chip.

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