High-protection water-cooling frequency converter structure

Abstract

The invention discloses a high-protection water-cooling frequency converter structure which comprises a case shell, a middle partition plate, a water-cooling plate, a rectifier module, an IGBT module, a power single board and a fan, the case shell and the middle partition plate are assembled to form a power cavity and a heat dissipation cavity which are independent and closed, the power cavity and the heat dissipation cavity are separated by the middle partition plate, and the water-cooling plate is arranged on the water-cooling plate. The middle partition plate is arranged in the heat dissipation cavity, the water cooling plate is arranged on the middle partition plate and located in the heat dissipation cavity, the rectification module and the IGBT module are located in the power cavity and fixed to the surface of the water cooling plate, the power single board is arranged in the power cavity, a bus capacitor is arranged on the power single board, and a body of the bus capacitor is arranged in the heat dissipation cavity. The problems of heat dissipation performance reduction, product failure and the like caused by entrance of foreign matters such as external dust can be avoided, and the heat dissipation performance and the reliability can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of frequency converters, and particularly to a highly protected water-cooled frequency converter structure. Background Art

[0002] Frequency converters are widely used. In a high-dust environment, frequency converters with air-cooled heat dissipation design usually have the problem that dust accumulates on the radiator, resulting in a reduction in heat dissipation performance, and even causing over-temperature warning faults in the power module. At the same time, ventilation and heat dissipation will also cause dust accumulation inside the power cavity. When the use environment contains metal dust or corrosiveness, it will cause corrosion and short circuits of the internal single-board circuits and electronic components, reducing the reliability of product use. Another improvement solution is to separate the heat dissipation cavity and the power cavity, and the power cavity is not ventilated to avoid the influence of dust. In this way, the power cavity is completely sealed, and heat is dissipated through the chassis shell radiation. As the power density of the product increases, the temperature of the internal cavity rises, causing internal components to fail and increasing the product failure rate.

[0003] Therefore, the prior art has defects and needs to be improved. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a highly protected water-cooled frequency converter structure. The power module is cooled by a water-cooled plate, and the highly protected chassis shell is isolated from the external environment, which can effectively control the problems of the internal cavity.

[0005] The technical solution of the present invention is as follows: The present invention provides a highly protected water-cooled frequency converter structure, including: a chassis shell, a middle partition board, a water-cooled plate, a rectifier module, an IGBT module, a power single board, and a fan. The chassis shell and the middle partition board are assembled to form independent and sealed power cavity and heat dissipation cavity. The middle partition board separates the power cavity and the heat dissipation cavity. The water-cooled plate is arranged on the middle partition board and located in the heat dissipation cavity. The rectifier module and the IGBT module are located in the power cavity and fixed on the surface of the water-cooled plate. The power single board is arranged in the power cavity, and a bus capacitor is provided on the power single board. The body of the bus capacitor is arranged in the heat dissipation cavity, and the connection terminals of the bus capacitor pass through the middle partition board and are arranged on the power single board. The fan is arranged at the lower part of the middle partition board, and a through hole is provided on the middle partition board corresponding to the fan. Ventilation holes are provided at the upper part of the middle partition board.

[0006] Further, the chassis shell includes a box body, an upper cover plate, an upper sealing plate of the heat dissipation cavity, and a lower sealing plate of the heat dissipation cavity. The middle partition board respectively forms a power cavity wiring sealing plate and a power cavity upper sealing plate at both ends corresponding to the power cavity. The box body, the upper cover plate, and the middle partition board are assembled to form the power cavity. The box body, the lower sealing plate of the heat dissipation cavity, the upper sealing plate of the heat dissipation cavity, and the middle partition board are assembled to form the heat dissipation cavity.

[0007] Furthermore, a protection coil is provided on the power cavity line sealing plate.

[0008] Furthermore, the solution further includes a radiator, which is disposed on the water cooling plate and located within the heat dissipation cavity, and a plurality of heat dissipation fins are formed on the radiator.

[0009] Furthermore, an insulating sleeve is sleeved on the body of the bus capacitor.

[0010] Adopting the above solution, the beneficial effects of the present invention are as follows: By dividing the interior of the frequency converter into a power cavity and a heat dissipation cavity that are isolated from the external environment, and dissipating heat through the water cooling plate, not only can it avoid problems such as a decrease in heat dissipation performance and product failure caused by foreign objects such as dust entering from the outside, but also it can ensure the air circulation and heat dissipation within the power cavity and the heat dissipation cavity, which can improve the heat dissipation performance and reliability of the product, and further increase the power density of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional schematic diagram of an embodiment of the present invention.

[0012] Figure 2 It is a three-dimensional exploded view of an embodiment of the present invention.

[0013] Figure 3 It is a three-dimensional view of the frequency converter of an embodiment of the present invention with the bottom plate and side plates of the box removed Figure 1 .

[0014] Figure 4 It is a three-dimensional view of the frequency converter of an embodiment of the present invention with the bottom plate and side plates of the box removed Figure 2 . DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0016] Please refer to Figures 1 to 4, in this embodiment, the present invention provides a highly efficient protected water-cooled frequency converter structure, including: a chassis housing 8, a middle partition 9, a water-cooled plate 6, a rectifier module 3, an IGBT module 4, a power single board, and a fan 7. The chassis housing 8 and the middle partition 9 are assembled to form independent and sealed power cavities 2 and heat dissipation cavities 1, and the middle partition 9 separates the power cavity 2 and the heat dissipation cavity 1. The water-cooled plate 6 is disposed on the middle partition 9 and located within the heat dissipation cavity 1. The rectifier module 3 and the IGBT module 4 are located within the power cavity 2 and fixed on the surface of the water-cooled plate 6. The water-cooled plate 6 is externally connected to circulating cooling water for heat dissipation and temperature reduction, achieving effective heat dissipation. The power single board is disposed within the power cavity 2. A bus capacitor 5 is provided on the power single board. The body of the bus capacitor 5 is disposed within the heat dissipation cavity 1. The terminal of the bus capacitor 5 passes through the middle partition 9 and is disposed on the power single board. And an insulating sleeve is sleeved on the body of the bus capacitor 5, which can play an insulating role. The fan 7 is disposed at the lower part of the middle partition 9, and through holes are provided on the middle partition 9 corresponding to the position of the fan 7. Ventilation holes 10 are provided at the upper part of the middle partition 9. Through the fan 7 and the ventilation holes 10, air can flow within the power cavity 2 and the heat dissipation cavity 1. During operation, the cooled air within the heat dissipation cavity 1 is blown into the power cavity 2 by the fan 7 to cool components such as the power single board, copper bars, and rectifier module 3. The hot air then flows back to the heat dissipation cavity 1 through the ventilation holes 10, is cooled by heat exchange on the surface of the water-cooled plate 6 to become cold air, passes through the bus capacitor 5 and is then blown into the power cavity 2 by the fan 7 to achieve internal air circulation heat dissipation.

[0017] Further, the chassis housing 8 includes a box body 801, an upper cover plate 802, a heat dissipation cavity upper sealing plate 804, and a heat dissipation cavity lower sealing plate 803. The middle partition 9 respectively forms a power cavity wiring sealing plate 901 and a power cavity upper sealing plate 902 at both ends corresponding to the power cavity 2. The box body 801, the upper cover plate 802, and the middle partition 9 are assembled to form the power cavity 2. The box body 801, the heat dissipation cavity lower sealing plate 803, the heat dissipation cavity upper sealing plate 803, and the middle partition 9 are assembled to form the heat dissipation cavity.

[0018] Further, a coil protector 12 is provided on the power cavity wire sealing plate 901. External wiring is sealed through the coil protector 12 and then connected to the wiring terminal inside the frequency converter, ensuring the sealing of the internal space of the chassis.

[0019] Further, the solution further includes a radiator 11. The radiator 11 is disposed on the water-cooled plate 6 and located within the heat dissipation cavity 1. A plurality of heat dissipation fins are formed on the radiator 6, which can further improve the heat dissipation performance.

[0020] In summary, the beneficial effects of this solution are as follows: By dividing the interior of the frequency converter into a power cavity isolated from the external environment and a heat dissipation cavity, and dissipating heat through a water-cooled plate, not only can problems such as a decrease in heat dissipation performance and product failures caused by foreign objects such as dust entering from the outside be avoided, but also the air circulation for heat dissipation within the power cavity and the heat dissipation cavity can be ensured, improving the heat dissipation performance and reliability of the product, and enabling further improvement of the power density of the power module.

[0021] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high protection water-cooled inverter structure, characterized in that: include: A chassis shell, a middle partition, a water-cooled plate, a rectifier module, an IGBT module, a power board, and a fan. The chassis shell and the middle partition are assembled to form an independent and closed power cavity and a heat dissipation cavity. The middle partition separates the power cavity and the heat dissipation cavity. The water-cooled plate is arranged on the middle partition and located in the heat dissipation cavity. The rectifier module and the IGBT module are located in the power cavity and fixed on the surface of the water-cooled plate. The power board is arranged in the power cavity. A bus capacitor is arranged on the power board. The body of the bus capacitor is arranged in the heat dissipation cavity. The terminal of the bus capacitor passes through the middle partition and is arranged on the power board. The fan is arranged at the lower part of the middle partition, and the middle partition is provided with a through hole at the position corresponding to the fan, and the upper part of the middle partition is provided with a ventilation hole.

2. The high protection water-cooled inverter structure according to claim 1 is characterized in that: The chassis shell includes a box body, an upper cover plate, a heat dissipation cavity upper cover plate and a heat dissipation cavity lower cover plate. The middle partition plate is respectively formed with a power cavity wiring cover plate and a power cavity upper cover plate at both ends corresponding to the power cavity. The box body, the upper cover plate and the middle partition plate are assembled to form the power cavity. The box body, the heat dissipation cavity lower cover plate, the heat dissipation cavity upper cover plate and the middle partition plate are assembled to form the heat dissipation cavity.

3. The high protection water-cooled inverter structure according to claim 2 is characterized in that: A protective wire coil is arranged on the power cavity wire sealing plate.

4. The high protection water-cooled inverter structure according to claim 1 or 2, characterized in that: It also includes a radiator, which is arranged on the water-cooled plate and located in the heat dissipation cavity, and has a plurality of heat dissipation fins formed on the radiator.

5. The high protection water-cooled inverter structure according to claim 1 or 2, characterized in that: An insulating sleeve is sleeved on the body of the busbar capacitor.

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