A bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft

Abstract

The present invention discloses a bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft, which is applied to aerospace equipment and includes: a heat dissipation and anti-vibration cover plate, wherein a plurality of bolt holes for installation are provided on the edges of the heat dissipation and anti-vibration cover plate, and the cover plate is connected to other equipment through the bolt holes; an edge opening groove is provided between two adjacent bolt holes; a spiderweb gradient structure is provided on the heat dissipation and anti-vibration cover plate, and the spiderweb gradient structure includes a spiderweb center wall provided at the center of the cover plate and gradient layered spiderweb walls radiating from the spiderweb center wall to the surrounding areas, and the gradient layered spiderweb walls present a gradient distribution in height. The heat dissipation and anti-vibration device of the present invention adopts the shape of a bionic spiderweb structure, maximizes the heat dissipation surface area while ensuring the strength of the anti-vibration structure, and improves the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation structures, and in particular to a bionic spiderweb-like lightweight heat dissipation and vibration-resistant device for aerospace equipment. Background Art

[0002] With the continuous development of integrated circuits and aerospace equipment, higher requirements are placed on heat dissipation and vibration resistance. Traditional heat dissipation structures often have problems such as heavy weight and poor stability. In the existing technology, the structures used for heat dissipation of integrated circuits and aerospace equipment mainly include traditional designs such as metal heat sinks and cooling fans. Metal heat sinks are usually installed on the heat dissipation surface of integrated circuits or aerospace equipment to increase the heat dissipation area and accelerate heat transfer. The cooling fan accelerates the dissipation of heat by the flow of air to the heat sink. Metal heat sinks are usually made of heavy metals such as aluminum or copper, so while meeting the heat dissipation requirements, they will increase the overall weight of the equipment. As a mechanical device, the stability and reliability of the cooling fan are limited and it is easily affected by the external environment. There are also problems such as lifespan and noise. These problems restrict the application of traditional heat dissipation structures in integrated circuits and aerospace equipment, so there is a need to seek new heat dissipation structure designs to overcome these problems.

[0003] Heat conduction plays a crucial role in heat dissipation. Traditional metal heat sinks have limited thermal conductivity, resulting in low heat dissipation efficiency and weight limitations. These issues restrict the practical application of traditional heat dissipation structures in meeting high power density, lightweight requirements, and high-temperature environments. Therefore, addressing the limitations of heat conduction requires the development of new heat dissipation structures that improve heat conduction efficiency while balancing multiple requirements such as lightweighting, high vibration resistance, and efficient heat dissipation.

[0004] In addition, space planes, launch vehicles, satellites, etc. will inevitably generate vibration excitation during launch. Common vibration excitation is mainly divided into two excitation modes: sinusoidal vibration and random vibration. When the vibration frequency is the same as the vibration frequency of the electrical control box, resonance will occur. The resonance phenomenon can easily damage the structure of the electrical control box, thereby causing damage to important instruments such as internal electronic components and circuit boards.

[0005] Traditional electrical control box covers are mostly solid aluminum rectangular covers. Although this type of cover can resist damage from vibration excitation and prevent the occurrence of resonance behavior, its structure is simple and its mass is redundant, which increases manufacturing costs, load-bearing mass and energy consumption. Summary of the Invention

[0006] In response to the challenges of the existing technology, the present invention aims to provide a bionic spiderweb-like lightweight heat dissipation and vibration resistance device for spacecraft, achieving a balance between lightweight design, high vibration resistance, efficient heat dissipation, and effective resistance to the effects of sinusoidal and random vibrations. By designing a novel heat dissipation and vibration resistance structure, the present invention aims to address the heavy weight, low stability, and limited heat dissipation efficiency of traditional heat dissipation and vibration resistance structures, thereby improving the practical application performance of heat dissipation and vibration resistance devices in integrated circuits and aerospace equipment, meeting the heat dissipation and vibration resistance requirements of high-power density, lightweight, and high-temperature environments.

[0007] To achieve the above-mentioned objectives, the present invention provides a bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft, which is applied to aerospace equipment. The heat dissipation and anti-vibration device comprises: a heat dissipation and anti-vibration cover plate; a plurality of bolt holes for installation are arranged on the edges of the heat dissipation and anti-vibration cover plate, which is connected to other equipment through the bolt holes; an edge opening groove is arranged between two adjacent bolt holes, and a spiderweb gradient structure is provided on the heat dissipation and anti-vibration cover plate, which comprises a spiderweb center wall arranged in the center of the cover plate and gradient layered spiderweb walls radiating from the spiderweb center wall to the surrounding areas, and the gradient layered spiderweb walls present a gradient distribution in height.

[0008] Furthermore, the gradient layered spider web wall is made of aluminum alloy plates. The spider web gradient structure includes multiple layers of aluminum alloy plates. The multiple layers of aluminum alloy plates are gradient distributed in height. Each layer of spider web aluminum alloy plates includes trapezoidal reinforcing ribs with a height gradient.

[0009] Furthermore, the height of the short side boundary of the heat dissipation and vibration-resistant cover is Greater than the height h at the center of the spider web o .

[0010] Furthermore, the central wall of the spider web is a cylindrical wall with a radius of 2-3 mm and a thickness of 0.5-1 mm.

[0011] Furthermore, the wall thickness of each gradient layered spider web is 0.5-2 mm, the thickness of the trapezoidal reinforcement rib is 0.5-2 mm, and the thickness of the edge opening groove is 1-2 mm.

[0012] Furthermore, the heat dissipation and anti-vibration cover plate is made of aluminum alloy.

[0013] Furthermore, the wall thickness is smallest near the center of the spider web, and as the spider web gradient extends toward the edge, the spider web wall thickness increases step by step.

[0014] Furthermore, the minimum wall thickness near the center of the spider web is 0.5mm, and the wall thickness increases by 0.25mm at each level, and the wall thickness no longer increases when it reaches 2mm.

[0015] Furthermore, the gradient layered spider web wall has an uneven thickness structure, the outermost side is connected to the edge of the heat dissipation structure, and the outermost thickness is the same as the thickness of the heat dissipation structure, and the innermost side is connected to the center wall of the spider web, and the innermost thickness is the same as the thickness of the center wall of the spider web; the distance between each layer of the spider web is arranged in an arithmetic progression, and the closer to the center of the spider web, the smaller the distance between two adjacent gradient layered spider web walls.

[0016] The present invention adopts a bionic spider web structure design, which can greatly reduce the weight of the heat dissipation structure while ensuring resistance to sinusoidal vibration excitation and random vibration excitation, and can effectively improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic structural diagram of a bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the traditional heat dissipation and vibration resistance structure in the aerospace field;

[0019] Figure 3 A partially enlarged schematic diagram of the bionic spiderweb-like structure of a spacecraft's lightweight heat dissipation and anti-vibration device;

[0020] Figure 4 It is a schematic diagram of the side structure;

[0021] Figure 5 Shows a schematic diagram of the open slot structure;

[0022] Figure 6 Shown Figure 5 Schematic diagram of the enlarged structure of the middle opening slot;

[0023] Figure 7 To correspond to Figure 4 A cross-sectional side view of the heat dissipation and anti-vibration cover;

[0024] Figure 8 Schematic diagram of temperature distribution of the cover plate in the prior art. Figure 8 a shows the overall calculation area, including the air domain, solid cover and heat source, the heat dissipation methods include heat convection and heat conduction, and the corresponding location distribution. Figure 8 b shows the location of the heat source where the only heat dissipation method is heat conduction, and the temperature distribution around the heat source;

[0025] Figure 9 This is a schematic diagram of the temperature distribution of the bionic spider web heat dissipation structure according to the present invention. Figure 9 a shows the overall calculation area, including the air domain, the bionic spider web heat dissipation structure and the heat source. The heat dissipation methods include heat convection and heat conduction. Here, the heat source and the air domain are Figure 8 consistent with the corresponding position distribution, Figure 9 b shows the position distribution of the heat source in the bionic spider web heat dissipation structure, where the heat dissipation method is heat conduction only, and the temperature distribution around the heat source;

[0026] Explanation of the accompanying drawings: 1. bolt hole, 2. edge opening groove, 3. gradient layered spider web wall, 4. spider web center wall, 5. layered spider web reinforcement rib. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0030] The following combination Figure 1 , Figure 3-Figure 7 、 Figure 9 The specific embodiments of the present invention are described in detail. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0031] The present invention provides a bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft. The heat dissipation and anti-vibration device includes a cover plate and a box used in conjunction with the cover plate. The box can be an electrical control box, which can ensure stable and efficient heat dissipation during space launch and normal operation to meet the heat dissipation requirements of high power density, high vibration resistance, lightweight and high temperature environment.

[0032] There is a certain connection between resistance to sinusoidal vibration excitation and random vibration excitation and heat dissipation. In engineering design, the cover structure needs to meet the requirements of resistance to various excitations, including forces from vibration excitation and heat dissipation. However, there is a contradiction between the two requirements of vibration resistance and heat dissipation. In order to balance this contradiction, the shape of the bionic spider web structure of the present invention maximizes the heat dissipation surface area while ensuring the strength of the anti-vibration structure, thereby improving the heat dissipation efficiency. By designing the gap size and distribution of the bionic spider web structure so that air can flow smoothly, heat dissipation is promoted, and the impact of vibration excitation on the structure is reduced. By optimizing the value ranges of these parameters, the spider web structure can meet the requirements of resistance to various excitations and effectively improve the heat dissipation efficiency, thereby resolving the contradiction between vibration resistance and heat dissipation.

[0033] like Figure 1 As shown, the bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft according to the present invention includes: a heat dissipation and anti-vibration cover plate; a plurality of bolt holes 1 for installation are arranged on the edges of the cover plate, and are connected to other equipment (such as an electronic control box) through the bolt holes; an edge opening groove 2 is arranged between two adjacent bolt holes, and a spiderweb gradient structure is provided on the cover plate, and the spiderweb gradient structure includes a spiderweb center wall 4 arranged in the center of the cover plate and a gradient layered spiderweb wall 3 radiating from the spiderweb center wall 4 to the surrounding areas, the gradient layered spiderweb wall presents a gradient distribution in height, and the cover plate is also provided with a layered spiderweb reinforcement rib 5.

[0034] Figure 2 A schematic diagram of a cover plate of a traditional structure is shown, which is a flat plate structure without a bionic spider web design.

[0035] Figure 3 A partially enlarged bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft is shown, wherein the gradient layered spiderweb wall 3 is made of aluminum alloy plates, and the spiderweb gradient structure includes multiple layers of aluminum alloy plates, which are gradient distributed in height, and each layer of spiderweb aluminum alloy plates includes trapezoidal reinforcing ribs with a height gradient.

[0036] The gradient distribution of the spider web wall 3 can reduce redundant mass and enhance the structural specific stiffness at the center of the spider web where the vibration excitation is maximum. Based on the structural theory F=kd, when the load is constant, the greater the stiffness, the smaller the displacement. Therefore, the gradient distribution of the spider web wall 3 can effectively reduce the maximum amplitude at the center.

[0037] Optional, such as Figure 4 As shown in the side view of the heat dissipation and anti-vibration cover, it can be seen that the height of the short side boundary of the cover is Greater than the height at the center of the web The angle of the spider web gradient structure, the slope from the thickness of the central spider web core to the thickness of the outermost spider web boundary is:

[0038] ;

[0039] in, is the gradient slope from the center of the spider web to the short side boundary of the rectangle, is the height of the short side boundary of the cover plate, is the height of the spider web center, is the length from the center of the spider web to the short side of the rectangle.

[0040] The heat dissipation analysis of the heat dissipation and anti-vibration cover is as follows:

[0041] Heat dissipation by convection:

[0042] Imagine a heat source surface with a surface temperature of The temperature of the surrounding fluid is . Heat transfer coefficient Describes the rate of heat transfer from the heat source surface to the fluid, while the temperature difference - Describes the driving force of heat transfer. The heat transfer rate can be expressed as follows:

[0043] ;

[0044] in, is the surface area of ​​the heat source. It is affected by factors such as fluid flow state, flow rate, fluid properties, etc. In the present invention, the fluid flow state, flow rate, and fluid properties are all kept constant, so heat dissipation is only related to the heat transfer surface area.

[0045] Heat dissipation by heat conduction:

[0046] For one-dimensional heat conduction in steady state, it can be expressed in the following form:

[0047] ;

[0048] in, is the heat transfer cross-sectional area. Thermal conductivity It depends on the material. If the material is fixed, assuming the thermal conductivity Keeping the same, heat transfer is related to thermal surface area.

[0049] In summary, the heat transfer effect is closely related to the surface area, and the surface area is affected by the slope. The slope design is a comprehensive consideration of many factors. In this invention, the directional electric control box cover is the main body, the edge height and center thickness are fixed, the center thickness adopts the minimum thickness allowed by machining (0.5mm), and the edge thickness is fixed to 3mm. It can meet the value requirements, preferably 1 / 4 to 1 / 3 of the total length of the structure, It is the height of the outermost structure, so the gradient spider web can be designed as a triangle in the example, or a right-angled trapezoid; If it is too small, the inner side specific stiffness is insufficient, and excessive deformation may occur, causing the structure to bend, become unstable, and collapse; if If it is too large, the overall structural mass will be too small, which will lead to an excessively large overall characteristic frequency.

[0050] This example is a thin plate. In this example, the slope is:

[0051] ;

[0052] The preferred slope range is 0.04-0.05, within which the comprehensive effects of anti-vibration and heat dissipation are optimal.

[0053] Optionally, the central wall of the spider web is a cylindrical wall with a radius of 2-3 mm and a thickness of 0.5-1 mm.

[0054] Optionally, the wall thickness of each layer of spider web is 0.5-2 mm.

[0055] Preferably, the wall thickness of the spider web closest to the center of the spider web is 0.5mm. As the spider web gradient extends toward the edge, the spider web wall thickness increases step by step, with the wall thickness increasing by 0.25mm at each level, and finally reaching a wall thickness of 2mm, at which point the wall thickness no longer increases. This design can adjust the thickness of the spider web wall according to the heat distribution in different areas, thereby achieving more effective heat dissipation. In terms of heat dissipation principles, this design can optimize the heat conduction path, allowing heat to be transferred to the external environment more quickly, thereby improving the heat dissipation effect. Because the center of the spider web structure is most severely subjected to vibration loads under actual aerospace conditions, the longitudinal gradient near the center of the spider web is reduced due to actual production and processing requirements, and the number of spider web layers is increased. At the same time, the wall thickness of each layer of the spider web is increased in a step-by-step gradient manner to control the specific stiffness of the structure at the center of the spider web and prevent excessive deformation due to vibration excitation.

[0056] Optionally, the thickness of the trapezoidal reinforcement rib is 0.5-2 mm.

[0057] Optionally, the edge opening groove has a thickness of 1-2 mm.

[0058] Figure 5 and Figure 6The open slot structure is shown. Its primary function is to reduce weight. Vibration excitation at the edges of the structure is relatively small, so redundant mass is not required. The slot should also avoid the connecting bolt hole diameter to prevent shear failure. Based on the equation P=F / S, where P represents pressure, F represents the force applied to the object, and S represents the object's area under load, the bolt shear stress is equal to the bolt pull-out load at the edge cross-sectional area. Therefore, the slot design requires increased bolt hole wall thickness. For an M4 bolt, for example, a 1mm slot thickness is sufficient for strength; for an M6 bolt, a 2mm slot thickness is sufficient for strength.

[0059] Optional, hexagonal bolt hole diameter is M4-M6.

[0060] Optionally, the cover plate structure is made of aluminum alloy.

[0061] The heat dissipation and vibration-resistant cover is typically connected to a processor or other integrated circuit device via bolt holes. The internal heat source can be a central processing unit (CPU), a graphics processing unit (GPU), or even a power amplifier. In the background art, a cooling fan accelerates heat dissipation by moving air across the heat sink. Typically, the cooling fan is located on top of the heat sink, helping to accelerate heat dissipation by moving air across the surface of the heat sink. The present invention can be used in conjunction with a cooling fan, which is located on top of the heat sink.

[0062] The spiderweb gradient structure, under the action of the fan, can provide auxiliary airflow guidance, helping the hot air in the center to flow or diffuse quickly, thereby further enhancing the heat dissipation effect. Specifically, the design of the spiderweb gradient structure can guide the airflow generated by the fan so that it flows more concentratedly across the surface of the heat sink. By controlling the flow direction and speed of the airflow, the spiderweb gradient structure can more effectively remove the hot air and accelerate the dissipation of heat. The spiderweb gradient structure itself has a large surface area, which can increase the contact area between the hot air and the heat sink surface, which is conducive to heat dissipation.

[0063] The present invention provides a bionic spider web-like lightweight heat dissipation and anti-vibration device for spacecraft. The heat dissipation and anti-vibration structure includes: bolt holes at the four corners and the center of the edge, grooves at the four edges, gradient layered spider web walls, interlayer reinforcement ribs, and spider web center wall; the gradient layered spider web wall is a structure with uneven thickness. The outermost side is connected to the edge of the heat dissipation structure and has the same thickness as the heat dissipation structure. The innermost side is connected to the spider web center wall and has the same thickness as the spider web center wall. Figure 7 As shown, The box plot indicates uniform thickness on the outermost side; The box diagram shows the wall thickness between the innermost and central circular holes of the web. The thickness decreases layer by layer as indicated by the arrows. The distances between each layer of the web follow an arithmetic progression, with the web layers becoming denser as they get closer to the center.

[0064] The heat dissipation and anti-vibration structure of the present invention is based on a directional electric control box cover, with fixed edge height and center thickness. The center thickness is designed to be the minimum thickness allowed by machining (0.5mm), while the edge thickness is fixed to 3mm. It can meet the value requirements, generally 1 / 4 to 1 / 3 of the total length of the structure. When the value is 1 / 4, at 0-1 / 4L, the spacing between each spider web layer is the highest precision of machining 1mm to process the wall thickness, and at the same time The thickness at the point is consistent with the thickness at 1 / 4L to ensure the slope is consistent and perform an arithmetic design, that is:

[0065] ;

[0066] Similarly, when When it is equal to 1 / 4 to 1 / 3, the arithmetic progression changes to:

[0067] ;

[0068] The areas greater than 1 / 3L to the edge of the structure are all designed with an arithmetic sequence at 1 / 3L.

[0069] There are trapezoidal reinforcing ribs between each layer of spider web wall, and the slope of the hypotenuse is the same as the slope of the height difference between the thickness of the two adjacent layers of spider web wall.

[0070] The anti-vibration principle of the present invention is to enhance the local specific stiffness of the structure where the vibration excitation load is large, and reduce the redundant mass where the vibration excitation load is weak. It can be seen that enhancing the local specific stiffness will increase the structural characteristic frequency and avoid the occurrence of resonance. Refers to the circular frequency, Refers to the elastic modulus, Refers to mass. At the same time, based on the structural theory F=kd, when the load is constant, the greater the stiffness, the smaller the displacement. Therefore, the gradient distribution of the spider web can effectively reduce the maximum amplitude at the center.

[0071] The structural design of the present invention can significantly reduce the weight of the heat dissipation structure while ensuring resistance to sinusoidal vibration excitation and random vibration excitation.

[0072] In the specific embodiment of the present invention, the bionic spiderweb structure has dimensions of 276*200*3mm and a total weight of 0.248kg. For comparison, the original rectangular solid heat dissipation structure has the same cover dimensions of 276*200*3mm and a weight of 0.446kg.

[0073] like Figure 8As shown in FIG, for the original rectangular solid heat dissipation structure, the temperature distribution of the traditional solid heat dissipation structure under the condition of heat consumption of 20W, in which structural heat transfer and air heat transfer are taken into account. Figure 8 a shows the overall calculation area, including the air domain, solid cover and heat source, the heat dissipation methods include heat convection and heat conduction, and the corresponding location distribution. Figure 8 b shows the position of the heat source where the only heat dissipation method is heat conduction, as well as the temperature distribution around the heat source and the heat dissipation effect. It can be seen that the cover plate of the present invention has a better heat dissipation effect.

[0074] like Figure 9 The temperature distribution of the bionic spiderweb-like heat dissipation structure according to the present invention is shown in the heat conduction simulation, with a heat dissipation of 20W. Both structural and air heat transfer are considered. Compared to the original structure, the heat dissipation structure of the present invention maintains the same heat dissipation efficiency while reducing weight by over 30% compared to traditional solid heat dissipation structures, effectively lowering the device's operating temperature. Figure 9 a shows the overall calculation area, including the air domain, bionic spider web heat dissipation structure and heat source. The heat dissipation methods include heat convection and heat conduction. The heat source and air domain are Figure 8 Consistent in. Figure 9 Figure b shows the heat source, which dissipates heat only through heat conduction, and its position distribution in the bionic spiderweb-like heat dissipation structure, as well as the temperature distribution around the heat source, demonstrating its heat dissipation effect. It can be seen that the heat dissipation structure of the present invention has a better heat dissipation effect.

[0075] On the other hand, according to the frequency requirements of the enclosure envelope conditions in the aerospace field: the components meet the strength requirements under sinusoidal vibration, and the next-order frequency under random vibration is greater than 30Hz and no resonance occurs.

[0076] In this invention, a bionic spider web is installed on one side of the flat plate structure. The proposed bionic spider web-like box cover structure reduces weight by over 30% compared to traditional solid cover structures. Under sinusoidal vibration, the maximum stress does not exceed the material's strength limit. Testing has shown that under random vibration, the first-order eigenfrequency is above 30Hz, and resonance does not occur, demonstrating excellent vibration resistance. The bionic spider web form enhances localized specific stiffness, while the spider web gradient reduces excess redundant mass.

[0077] By using Comsol modeling and simulation software, sinusoidal vibration and random vibration finite element simulations as well as heat dissipation finite element simulations were performed on the designed structure. Comparison was made between the vibration resistance design requirements of aerospace industry-grade electrical control box covers and the requirements of traditional solid heat dissipation structures. While meeting the vibration resistance and heat dissipation requirements, the overall mass of the cover was reduced by more than 30%. The present invention can be used for, but is not limited to, electrical control box cover structures for aerospace planes, launch vehicles, satellites, and the like in the aerospace field.

[0078] Throughout this specification, reference to terms such as "embodiment" and "example" indicates that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, those skilled in the art may combine or integrate different embodiments or examples described in this specification, as well as features therein, without creating any inconsistency.

[0079] Although the above content has shown and described the embodiments of the present invention, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can perform update operations such as changes, modifications, replacements and variations on the above embodiments within the scope of the present invention.

Claims

1. A bionic spider web-like lightweight heat dissipation and anti-vibration device for spacecraft, characterized in that: The heat dissipation and anti-vibration device is used in aerospace equipment and includes: a heat dissipation and anti-vibration cover plate, with a plurality of bolt holes for installation provided on the edges of the heat dissipation and anti-vibration cover plate, and connected to other equipment through the bolt holes; an edge opening groove is provided between two adjacent bolt holes; the heat dissipation and anti-vibration cover plate is provided with a spider web gradient structure, the spider web gradient structure includes a spider web center wall provided at the center of the cover plate and gradient layered spider web walls radiating from the spider web center wall to the surrounding areas, and the gradient layered spider web walls have a gradient distribution in height; Among them, the gradient layered spider web wall is a structure with uneven thickness. The outermost side is connected to the edge of the heat dissipation structure, and the outermost thickness is the same as the thickness of the heat dissipation structure. The innermost side is connected to the central wall of the spider web, and the innermost thickness is the same as the thickness of the central wall of the spider web. The distance between each layer of the spider web is arranged in an arithmetic progression. The closer to the center of the spider web, the smaller the distance between two adjacent gradient layered spider web walls.

2. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 1 is characterized in that: The gradient layered spider web wall is made of aluminum alloy plates. The spider web gradient structure includes multiple layers of aluminum alloy plates. The multiple layers of aluminum alloy plates are gradient distributed in height. Trapezoidal reinforcing ribs with a height gradient are included between each layer of spider web aluminum alloy plates.

3. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 2 is characterized in that: The height of the short side boundary of the heat dissipation and vibration-resistant cover plate Greater than the height h at the center of the spider web o .

4. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 3 is characterized in that: The central wall of the spider web is a cylindrical wall with a radius of 2-3 mm and a thickness of 0.5-1 mm.

5. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 3 is characterized in that: The wall thickness of each gradient layered spider web is 0.5-2mm, and the thickness of the trapezoidal reinforcement rib is 0.5-2mm.

6. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 5 is characterized in that: The edge opening groove has a thickness of 1-2 mm.

7. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 3 is characterized in that: The material of the heat dissipation and anti-vibration cover plate is aluminum alloy.

8. The bionic spiderweb-like lightweight heat dissipation and anti-vibration device for spacecraft according to any one of claims 1 to 3, characterized in that: The wall thickness is smallest near the center of the spider web, and increases step by step as the spider web gradient extends toward the edge.

9. The bionic spiderweb-like spacecraft lightweight heat dissipation and anti-vibration device according to claim 8, characterized in that: The minimum wall thickness near the center of the spider web is 0.5mm, and the wall thickness increases by 0.25mm at each level, and the wall thickness no longer increases when it reaches 2mm.

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