Laminated ceramic electronic component

Abstract

Provided is a laminated ceramic electronic component (1) in which the surface of a laminated body (2) can be easily made more flat. The laminated ceramic electronic component (1) is provided with a laminated body (2). The laminated body (2) includes: a first internal electrode layer (10a) that is alternately laminated with the plurality of ceramic layers (4) and is exposed on a first end surface (62a); a second internal electrode layer (10b) that is alternately laminated with the plurality of ceramic layers (4) and is exposed on a second end surface (62b); and a first step layer (5a) that is disposed on the same plane as the second internal electrode layer (10b) and is exposed on the first end surface (62a). And a second step layer (5b) disposed on the same plane as the first internal electrode layer (10a) and exposed on the second end surface (62b), the distance in the longitudinal direction (L) between the first step layer (5a) and the second internal electrode layer (10b) located at a position closer to the first main surface (61a) becomes farther with respect to the distance in the longitudinal direction (L) between the first step layer (5a) and the second internal electrode layer (10b), and the distance in the longitudinal direction (L) between the first step layer (5a) and the second internal electrode layer (10b) is farther than the distance in the longitudinal direction (L) between the first step layer (5a) and the second internal electrode layer (10b). The distance between the second step layer (5b) and the first internal electrode layer (10a) in the longitudinal direction (L) becomes farther than the distance between the second step layer (5b) and the first internal electrode layer (10a) in the longitudinal direction (L), said second step layer (5b) being located at a position closer to the first main surface (61a).

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component, and more particularly to a multilayer ceramic capacitor. Background Art

[0002] Conventionally, as a multilayer ceramic electronic component, a multilayer ceramic capacitor has been known. Generally, a multilayer ceramic capacitor has a structure including a laminate and external electrodes provided on both end faces of the laminate, and has a desired capacitance corresponding to the number of stacked layers and the thickness of the dielectric layer. The laminate is a fired body in which a plurality of dielectric layers containing ceramics and internal electrode layers are alternately stacked.

[0003] In Patent Document 1 and the like, it is described that a step absorption layer is provided to eliminate steps caused by the internal electrode layer.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2006-286860 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, in practice, it mostly bends toward the first main surface or the second main surface. In addition, the degree of bending has a tendency that the side of the surface away from the bending direction becomes stronger. Therefore, if the step absorption layer is arranged on the same plane of each internal electrode layer as described in Patent Document 1, the step absorption layer is also arranged for a portion that is bent only to such an extent that it does not affect structural defects. Therefore, new structural defects may occur, and there is a problem that the cost corresponding to the step absorption layer becomes high. Thus, an object of the present invention is to control the cost and suppress structural defects by arranging an appropriate amount of the step absorption layer at an appropriate place.

[0009] Technical Means for Solving the Problems

[0010] The multilayer ceramic electronic component of the present invention includes a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated, and includes: a first main surface and a second main surface facing each other in the height direction; a first side surface and a second side surface facing each other in the width direction orthogonal to the height direction; a first end surface and a second end surface facing each other in the length direction orthogonal to the height direction and the width direction; a first internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the first end surface; a second internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the second end surface; a first stepped layer disposed on the same surface as the second internal electrode layer and exposed at the first end surface; and a second stepped layer disposed on the same surface as the first internal electrode layer and exposed at the second end surface. The first external electrode is provided on the first end surface, and the second external electrode is provided on the second end surface. Regarding the distance in the length direction between the first stepped layer and the second internal electrode layer, the distance in the length direction between the first stepped layer and the second internal electrode layer at a position closer to the first main surface becomes farther. Regarding the distance in the length direction between the second stepped layer and the first internal electrode layer, the distance in the length direction between the second stepped layer and the first internal electrode layer at a position closer to the first main surface becomes farther.

[0011] In addition, the multilayer ceramic electronic component of the present invention includes a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated, and includes: a first main surface and a second main surface opposite to each other in the height direction; a first side surface and a second side surface opposite to each other in the width direction orthogonal to the height direction; a first end surface and a second end surface opposite to each other in the length direction orthogonal to the height direction and the width direction; an end surface exposed electrode layer as an internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the first end surface and the second end surface; a side surface exposed electrode layer as an internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the first side surface and the second side surface; a side step layer, arranged on the same surface as the end surface exposed electrode layer, and exposed at the first side surface and the second side surface; and an end surface step layer, arranged on the same surface as the side surface exposed electrode layer, and exposed at the first end surface and the second end surface. The first external electrode is provided on the first end surface and the second end surface, and the second external electrode is provided on the first side surface and the second side surface. Regarding the width direction distance between the side step layer and the end surface exposed electrode layer, the width direction distance between the side step layer and the end surface exposed electrode layer located at a position closer to the first main surface becomes farther. Regarding the length direction distance between the end surface step layer and the side surface exposed electrode layer, the length direction distance between the end surface step layer and the side surface exposed electrode layer located at a position closer to the first main surface becomes farther.

[0012] Advantages of the Invention

[0013] According to the present invention, it is possible to provide a multilayer ceramic electronic component that can easily make the surface of the laminate flatter. Description of the Drawings

[0014] Figure 1 is a perspective view of the multilayer ceramic electronic component according to the first embodiment of the present invention.

[0015] Figure 2 is Figure 1 a cross-sectional view taken along line I-I of

[0016] Figure 3 is Figure 1 a cross-sectional view taken along line II-II of

[0017] Figure 4 is an LT cross-sectional view of the laminate in the first embodiment.

[0018] Figure 5 is an LT cross-sectional view of the laminate in the second embodiment.

[0019] Figure 6 is an LT cross-sectional view of the multilayer ceramic electronic component in the second embodiment.

[0020] Figure 7 It is a perspective view of the multilayer ceramic electronic component of the third embodiment.

[0021] Figure 8 is Figure 7 A cross-sectional view taken along line III-III.

[0022] Figure 9 is Figure 7 A cross-sectional view taken along line IV-IV.

[0023] Figure 10 is Figure 7 A cross-sectional view taken along line V-V, which is a diagram showing the planar structure of the end-face exposed electrode layer.

[0024] Figure 11 is Figure 7 A cross-sectional view taken along line V-V, which is a diagram showing the planar structure of the side-face exposed electrode layer. Detailed Embodiment

[0025] Hereinafter, an example of an embodiment of the multilayer ceramic electronic component 1 of the present invention will be described with reference to the drawings. In the following description, the case where the multilayer ceramic electronic component 1 is a multilayer ceramic capacitor will be taken as an example for description.

[0026] (First Embodiment)

[0027] The multilayer ceramic electronic component 1 of the first embodiment will be described.

[0028] (External Shape of Multilayer Ceramic Electronic Component)

[0029] Based on Figure 1 , the outline of the appearance of the multilayer ceramic electronic component 1 will be described. Figure 1 It is a perspective view showing the multilayer ceramic electronic component 1 of the present embodiment. The multilayer ceramic electronic component 1 includes a laminate 2 and external electrodes 20.

[0030] (Definition of Directions)

[0031] In the drawings, the L direction, the W direction, and the T direction are appropriately shown. The L direction is the length direction of the multilayer ceramic electronic component 1. The W direction is the width direction of the multilayer ceramic electronic component 1. The T direction is the height direction of the multilayer ceramic electronic component 1. Thus, Figure 2 the cross-section shown is called an LT cross-section, Figure 3 the cross-section shown is called a WT cross-section. The length direction L, the width direction W, and the height direction T may not necessarily be orthogonal to each other. The length direction L, the width direction W, and the height direction T may also be in a cross relationship.

[0032] (External Shape of Laminate)

[0033] The laminate 2 has a substantially rectangular parallelepiped shape. The laminate 2 has two main surfaces 61, two end surfaces 62, and two side surfaces 63. The main surfaces 61 are surfaces opposed in the height direction T. The end surfaces 62 are surfaces opposed in the length direction L. The side surfaces 63 are surfaces opposed in the width direction W. One of the two main surfaces 61 is defined as the first main surface 61a, and the other is defined as the second main surface 61b. One of the two end surfaces 62 is defined as the first end surface 62a, and the other is defined as the second end surface 62b. One of the two side surfaces 63 is defined as the first side surface 63a, and the other is defined as the second side surface 63b. In Figure 1 it, the first main surface 61a and the first side surface 63a are shown.

[0034] At the ridges and corners of the laminate 2, it is preferable to have rounded corners. A ridge is a portion where two surfaces of the laminate 2 intersect. A corner is a portion where three surfaces of the laminate 2 intersect. In addition, the size of the laminate 2 is not particularly limited.

[0035] (Structure of the laminate)

[0036] The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. Hereinafter, the structure of the laminate 2 will be described with reference to a cross-sectional view of the laminate 2.

[0037] (Internal structure of the laminate (LT cross-section))

[0038] Based on Figure 2 it, the internal structure of the laminate 2 will be described. Figure 2 is Figure 1 a cross-sectional view taken along the line I-I of the laminated ceramic electronic component 1 shown. Figure 2 It shows the LT cross-section of the laminated ceramic electronic component 1. The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. The plurality of ceramic layers 4 and the plurality of internal electrode layers 10 are stacked on top of each other in the height direction T.

[0039] (Inner layer part and outer layer part)

[0040] The laminate 2 is divided in the height direction T into an inner layer part 53 and two outer layer parts 54. The outer layer parts 54 include a first outer layer part 54a and a second outer layer part 54b. The first outer layer part 54a and the second outer layer part 54b are located at positions sandwiching the inner layer part 53 in the height direction T.

[0041] A part of the plurality of ceramic layers 4 and the plurality of internal electrode layers 10 are arranged in the inner layer part 53. In the inner layer part 53, the plurality of internal electrode layers 10 are opposed to each other with the ceramic layers 4 interposed therebetween. Therefore, in the inner layer part 53, a capacitance is formed. Therefore, the inner layer part 53 is a part that substantially functions as a capacitor in the laminate 2.

[0042] The first outer layer portion 54a is the portion of the outer layer portion 54 located on the side of the first main surface 61a of the laminate 2. The second outer layer portion 54b is the portion of the outer layer portion 54 located on the side of the second main surface 61b of the laminate 2. Specifically, the first outer layer portion 54a is the portion between the inner electrode layer 10 closest to the first main surface 61a among the plurality of inner electrode layers 10 and the first main surface 61a. The second outer layer portion 54b is the portion between the inner electrode layer 10 closest to the second main surface 61b among the plurality of inner electrode layers 10 and the second main surface 61b. In the first outer layer portion 54a and the second outer layer portion 54b, no inner electrode layer 10 is disposed. In the first outer layer portion 54a and the second outer layer portion 54b, a plurality of the ceramic layers 4 other than the ceramic layers 4 for the inner layer portion 53 among the plurality of ceramic layers 4 are disposed. The first outer layer portion 54a and the second outer layer portion 54b function as protective layers for the inner layer portion 53.

[0043] (Ceramic layer)

[0044] The ceramic layer 4 can be classified into the ceramic layer 4 disposed in the inner layer portion 53 and the ceramic layer 4 disposed in the outer layer portion 54. The ceramic layer 4 disposed in the inner layer portion 53 is designated as the inner ceramic layer 4a. The ceramic layer 4 disposed in the outer layer portion 54 is designated as the outer ceramic layer 4b.

[0045] (Number of ceramic layers)

[0046] For example, the ceramic layers 4 laminated in the laminate 2 can be set to 5 or more layers and 2000 or less layers.

[0047] (Material of ceramic layer)

[0048] As the material of the ceramic layer 4, for example, a dielectric ceramic containing main components such as BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 etc. can be used. In addition, a material in which sub-components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, etc. are added to these main components can also be used.

[0049] When the piezoelectric ceramic is used in the laminate 2, the laminated ceramic electronic component 1 functions as a ceramic piezoelectric element. As a specific example of the piezoelectric ceramic material, for example, PZT (lead zirconate titanate) - based ceramic materials, etc. can be cited.

[0050] When the semiconductor ceramic is used in the laminate 2, the laminated ceramic electronic component 1 functions as a thermistor element. As a specific example of the semiconductor ceramic material, for example, spinel - based ceramic materials, etc. can be cited.

[0051] When a magnetic ceramic is used in the laminate, the multilayer ceramic electronic component 1 functions as an inductor element. Further, when the multilayer ceramic electronic component 1 functions as an inductor element, the internal electrode layer becomes a coil-shaped conductor. As a specific example of the magnetic ceramic material, for example, a ferrite ceramic material or the like can be cited.

[0052] (Thickness of the ceramic layer)

[0053] For example, the thickness of the ceramic layer 4 can be set to 10 μm or less.

[0054] (Internal electrode layer)

[0055] The internal electrode layer 10 can be classified into a first internal electrode layer 10a and a second internal electrode layer 10b. The first internal electrode layer 10a is the internal electrode layer 10 connected to the first external electrode 20a. The second internal electrode layer 10b is the internal electrode layer 10 connected to the second external electrode 20b. The first internal electrode layer 10a extends from the first end face 62a toward the second end face 62b. The second internal electrode layer 10b extends from the second end face 62b toward the first end face 62a.

[0056] (Opposing portion and extending portion)

[0057] The first internal electrode layer 10a and the second internal electrode layer 10b each have an opposing portion 11 and an extending portion 12.

[0058] The opposing portion 11 is a portion where the first internal electrode layer 10a and the second internal electrode layer 10b oppose each other in the height direction T in the internal electrode layer 10. The extending portion 12 is a portion that extends from the opposing portion 11 to the first end face 62a or the second end face 62b of the laminate 2 in the internal electrode layer 10.

[0059] The opposing portion 11 of the first internal electrode layer 10a is designated as a first opposing portion 11a. The extending portion 12 of the first internal electrode layer 10a is designated as a first extending portion 12a. The first extending portion 12a is a portion that extends from the first opposing portion 11a to the first end face 62a of the laminate 2.

[0060] Similarly, the opposing portion 11 of the second internal electrode layer 10b is designated as a second opposing portion 11b. The extending portion 12 of the second internal electrode layer 10b is designated as a second extending portion 12b. The second extending portion 12b is a portion that extends from the second opposing portion 11b to the second end face 62b of the laminate 2.

[0061] (Number of layers of the internal electrode layer)

[0062] For example, the number of the internal electrode layers 10 can be set to be 10 or more and 2000 or less. The number of the internal electrode layers 10 is the number including the number of the first internal electrode layer 10a and the number of the second internal electrode layer 10b.

[0063] (Thickness of the internal electrode layer)

[0064] For example, the thickness of the internal electrode layer 10 can be set to be 0.1 μm or more and 5.0 μm or less, preferably 0.2 μm or more and 2.0 μm or less. When the thickness of the internal electrode layer 10 is 0.5 μm or more, when forming the metal layer of the external electrode 20 by plating, the plating film becomes easy to grow.

[0065] (Material of the internal electrode layer)

[0066] For example, the material of the internal electrode layer 10 can be set to metals such as Ni, Cu, Ag, Pd, and Au, alloys of Ni and Cu, alloys of Ag and Pd, etc. In addition, the material of the internal electrode layer 10 may also contain dielectric particles of the same compositional system as the ceramic contained in the ceramic layer 4.

[0067] (Electrode facing portion)

[0068] A description will be given of the division in the length direction L of the laminate 2. The laminate 2 can be divided in the length direction L into an electrode facing portion 50 and an L gap 51. The electrode facing portion 50 in the division in the length direction L is designated as the L facing portion 50a. In addition, the L gap 51 includes a first L gap 51a and a second L gap 51b.

[0069] The L facing portion 50a corresponds to the portion where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the height direction T. A capacitor is formed in the L facing portion 50a.

[0070] (L gap)

[0071] The L gap 51 is the portion where the first internal electrode layer 10a and the second internal electrode layer 10b do not face each other in the height direction T in the length direction L of the laminate 2. Among the L gaps 51, the first L gap 51a is between the L facing portion 50a and the first end face 62a. The second L gap 51b is between the L facing portion 50a and the second end face 62b.

[0072] In the first L gap 51a, in the height direction T, the first internal electrode layer 10a is disposed, but the second internal electrode layer 10b is not disposed. In the second L gap 51b, in the height direction T, the second internal electrode layer 10b is disposed, but the first internal electrode layer 10a is not disposed.

[0073] The first L-gap 51a functions as an extension of the first opposed portion 11a to the first end face 62a. The second L-gap 51b functions as an extension of the second opposed portion 11b to the second end face 62b.

[0074] For example, the length in the length direction L of the L-gap 51 can be set to 10% or more and 30% or less of the length in the length direction L of the laminate 2.

[0075] (External electrode)

[0076] The external electrode 20 includes a first external electrode 20a and a second external electrode 20b.

[0077] (First external electrode)

[0078] The first external electrode 20a is the external electrode 20 disposed on the first end face 62a of the laminate 2. The first external electrode 20a is electrically connected to the first internal electrode layer 10a.

[0079] (Second external electrode)

[0080] The second external electrode 20b is the external electrode 20 disposed on the second end face 62b of the laminate 2. The second external electrode 20b is electrically connected to the second internal electrode layer 10b.

[0081] (External electrode on each face)

[0082] The external electrode 20 extends from one end face 62 to a part of the two main faces 61 and a part of the two side faces 63.

[0083] (Layer structure of the external electrode)

[0084] Based on Figure 2 The layer structure of the external electrode 20 will be described. The external electrode 20 includes a base layer 21 and a plating layer 23. The plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. These layers are arranged in the order of the base layer 21, the inner plating layer 23a, and the surface plating layer 23b starting from the end face 62 of the laminate 2.

[0085] (Base layer)

[0086] The base layer 21 is disposed on the end face 62 of the laminate 2 and covers the end face 62. The base layer 21 extends from the end face 62 to a part of the main face 61 and a part of the side face 63.

[0087] (Sintered layer)

[0088] The base layer 21 is formed as a sintered layer. The sintered layer contains a glass component and a metal. As the glass component, it contains at least one selected from B, Si, Ba, Mg, Al, Li, etc. As the metal, for example, it contains at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The sintered layer may also be a multi-layer.

[0089] (Plated layer)

[0090] The plated layer 23 on the base layer 21 will be described. As described above, in the present embodiment, the plated layer 23 includes an inner plated layer 23a and a surface plated layer 23b. When the plated layer 23 is a two-layer structure, preferably in the order of a Ni plated layer and a Sn plated layer from the lower layer. That is, the inner plated layer 23a becomes a Ni plated layer, and the surface plated layer 23b becomes a Sn plated layer. When it is a three-layer structure, preferably in the order of a Sn plated layer, a Ni plated layer, and a Sn plated layer from the lower layer.

[0091] The Ni plated layer can prevent the base layer 21 from being eroded by the solder when mounting the multilayer ceramic electronic component 1. The Sn plated layer can improve the wettability of the solder when mounting the multilayer ceramic electronic component 1, making the mounting easier. Therefore, by setting the surface plated layer 23b as a Sn plated layer, the wettability of the solder to the external electrode 20 can be improved. The thickness of each layer of the plated layer is preferably 3 μm or more and 9 μm or less.

[0092] (Internal structure of the laminate (WT cross-section))

[0093] Based on Figure 3 , the internal structure of the laminate 2 will be described. Figure 3 It is Figure 1 The II-II line cross-sectional view of the multilayer ceramic electronic component 1 shown. The laminate 2 is divided in the width direction W into an electrode facing portion 50 and a W gap 52. The electrode facing portion 50 in the division of the width direction W is set as the W facing portion 50b. In addition, the W gap 52 includes a first W gap 52a and a second W gap 52b.

[0094] The W facing portion 50b is the portion where the internal electrode layers 10 face each other in the height direction T. The W gap 52 is the portion in the width direction W where neither the first internal electrode layer 10a nor the second internal electrode layer 10b is arranged in the height direction T.

[0095] Among the W gaps 52, the first W gap 52a is between the W facing portion 50b and the first side surface 63a in the width direction W of the laminate 2. The second W gap 52b is between the W facing portion 50b and the second side surface 63b.

[0096] The first W-gap 52a and the second W-gap 52b are configured to sandwich the W-opposing portion 50b. The first W-gap 52a and the second W-gap 52b function as a protective layer for the internal electrode layer 10.

[0097] For example, the length of the W-gap 52 in the width direction W can be set to 20% or more and 30% or less of the length of the laminate 2 in the width direction W. Further, for example, the length of the W-gap 52 in the width direction W can be set to 5 μm or more and 50 μm or less.

[0098] (Size of the multilayer ceramic electronic component)

[0099] The size of the multilayer ceramic electronic component 1 is not particularly limited. The size of the multilayer ceramic electronic component 1 can be set as follows, for example. The dimension in the length direction L of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrode 20 is defined as the L dimension. The L dimension is preferably 0.25 mm or more and 1.0 mm or less. The dimension in the height direction T of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrode 20 is defined as the T dimension. The T dimension is preferably 0.125 mm or more and 0.5 mm or less. The dimension in the width direction W of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrode 20 is defined as the W dimension. The W dimension is preferably 0.125 mm or more and 0.5 mm or less.

[0100] (Step layer)

[0101] In the multilayer ceramic electronic component 1 of the present embodiment, a step layer 5 is provided.

[0102] Preferably, the difference in the length in the height direction T of the laminate 2 between the electrode opposing portion 50 and the L-gap 51 is small. However, in the inner layer portion 53, the lengths in the height direction T of the electrode opposing portion 50 and the L-gap 51 are likely to be different. The multilayer ceramic layer 4 and the internal electrode layer 10 are laminated in the electrode opposing portion 50. In contrast, only the multilayer ceramic layer 4 is laminated in the L-gap 51. The internal electrode layer 10 is not laminated in the L-gap 51. Therefore, the lengths in the height direction T of the electrode opposing portion 50 and the L-gap 51 are likely to be different.

[0103] Then, in order to reduce the difference in the length in the height direction T between the electrode opposing portion 50 and the L-gap 51, an additional ceramic layer 4 is disposed in the L-gap 51. This additional ceramic layer 4 is defined as the step layer 5. The step layer 5 preferably has the same composition as the ceramic layer 4. However, the composition of the ceramic layer 4 is not limited thereto.

[0104] (Configuration of the step layer)

[0105] Based on Figure 4 The configuration of the step layer 5 in the multilayer ceramic electronic component 1 of the present embodiment will be described. Figure 4This is an LT cross-sectional view of the laminate 2 included in the multilayer ceramic electronic component 1 of the present embodiment. Figure 4 It shows Figure 1 a cross-section of the laminate 2 at the position of the line I-I corresponding to. The stepped layer 5 is disposed between the front end E in the longitudinal direction L of the internal electrode layer 10 and the end face 62. The stepped layer 5 includes a first stepped layer 5a and a second stepped layer 5b.

[0106] (First stepped layer)

[0107] The first stepped layer 5a is the stepped layer 5 disposed on the same plane as the second internal electrode layer 10b. The front end E on the side of the first end face 62a in the longitudinal direction L of the second internal electrode layer 10b is defined as the front end E1. The first stepped layer 5a is disposed in the longitudinal direction L between the front end E1 and the first end face 62a. Moreover, the first stepped layer 5a is exposed from the first end face 62a.

[0108] (Second stepped layer)

[0109] The second stepped layer 5b is the stepped layer 5 disposed on the same plane as the first internal electrode layer 10a. The front end E on the side of the second end face 62b in the longitudinal direction L of the first internal electrode layer 10a is defined as the front end E2. The second stepped layer 5b is disposed in the longitudinal direction L between the front end E2 and the second end face 62b. Moreover, the second stepped layer 5b is exposed from the second end face 62b.

[0110] As described above, a plurality of internal electrode layers 10 are laminated in the laminate 2. Moreover, the first stepped layer 5a and the second stepped layer 5b can be disposed for each internal electrode layer 10. Therefore, in one laminate 2, a plurality of first stepped layers 5a and second stepped layers 5b are disposed. In addition, in Figure 4 , two layers of the first stepped layer 5a and the second stepped layer 5b are respectively depicted. This is because Figure 4 is a schematic diagram for explanation. Therefore, Figure 4 it does not mean that the number of layers of the multilayer ceramic capacitor is limited to Figure 4 the number of layers depicted in.

[0111] (Thickness of the stepped layer)

[0112] The length in the height direction T of the stepped layer 5 is defined as the thickness of the stepped layer 5.

[0113] (Change in thickness)

[0114] Among the plurality of first stepped layers 5a, with respect to the thickness of the first stepped layer 5a, the first stepped layer 5a located closer to the first main surface 61a is thicker than the first stepped layer 5a located closer to the second main surface 61b.

[0115] The same applies to the second step layer 5b. Among the multiple second step layers 5b, regarding the thickness of the second step layer 5b, the second step layer 5b located closer to the first main surface 61a is thicker than the second step layer 5b located closer to the second main surface 61b.

[0116] In Figure 4 the thickness of the step layer 5 is denoted as H. In Figure 4 two of the first step layer 5a and the second step layer 5b are respectively shown. For the two first step layers 5a, the thickness of the first step layer 5a closer to the first main surface 61a is set as H2, and the thickness of the first step layer 5a closer to the second main surface 61b is set as H4. The thickness H2 is thicker than the thickness H4.

[0117] The same applies to the second step layer 5b. For the two second step layers 5b, the thickness of the second step layer 5b closer to the first main surface 61a is set as H1, and the thickness of the second step layer 5b closer to the second main surface 61b is set as H3. The thickness H1 is thicker than the thickness H3.

[0118] As described above, in the multilayer ceramic electronic component 1 of the present embodiment, the thickness in the height direction T of the ceramic layer 4 between the internal electrode layers 10 connected to the same external electrode 20 becomes thicker as it approaches the first main surface 61a.

[0119] When manufacturing the laminate 2, compared with the start of lamination, the end of lamination is more likely to generate bending of each layer caused by the presence or absence of the internal electrode layer 10. In other words, at the end of lamination, the influence of the step caused by the presence or absence of the internal electrode layer 10 is greater. Here, the start of lamination corresponds to the second main surface 61b side. In addition, the end of lamination corresponds to the first main surface 61a side.

[0120] In the multilayer ceramic electronic component 1 of the present embodiment, a thicker step layer 5 is provided at the end of lamination. Thereby, the multilayer ceramic electronic component 1 can reduce the degree of bending of the laminate 2.

[0121] In addition, at the start of lamination, the step layer 5 can also not be formed. That is, in the height direction T of the laminate 2, the step layer 5 can also be locally formed in a part thereof. Thereby, the generation of steps in the laminate 2 can be more effectively suppressed.

[0122] (Comparison with the internal electrode layer)

[0123] Next, the relationship between the thickness H of the step layer 5 and the thickness of the internal electrode layer 10 will be described. In Figure 4The thickness of the internal electrode layer 10 is represented as H. In the present embodiment, the thickness H of the step layer 5 is 20% or more and 120% or less of the thickness K of the internal electrode layer 10. Specifically, the thickness of the first step layer 5a is 20% or more and 120% or less of the thickness of the second internal electrode layer 10b. Similarly, the thickness of the second step layer 5b is 20% or more and 120% or less of the thickness of the first internal electrode layer 10a.

[0124] In Figure 4 the example shown, the thicknesses of the two first step layers 5a are the thickness H2 and the thickness H4. In addition, in Figure 4 K2 is used to indicate the thickness of the second internal electrode layer 10b. The thicknesses H2 and H4 are 20% or more and 120% or less of the thickness K2.

[0125] The same applies to the second step layer 5b. Figure 4 In Figure 4 the two second step layers 5b shown, the thicknesses are the thickness H1 and the thickness H3. In addition, in

[0126] (Configuration in the longitudinal direction)

[0127] So far, the structure of the step layer 5 in the height direction T has been described. Next, the configuration of the step layer 5 in the longitudinal direction L will be described.

[0128] (End face side)

[0129] The step layer 5 is exposed from the end face 62. Specifically, the first step layer 5a is exposed at the first end face 62a. In addition, the second step layer 5b is exposed at the second end face 62b.

[0130] (Internal electrode side)

[0131] One end of the step layer 5 in the longitudinal direction L, which is opposite to the end exposed from the end face 62, and the internal electrode layer 10 of the same layer as the step layer 5 are joined at the front end E of the internal electrode layer 10. The front end E of the internal electrode layer 10 refers to the end on the opposite side of the internal electrode layer 10 in the longitudinal direction L from the end exposed from the end face 62.

[0132] The front end E on the first end face 62a side of the second internal electrode layer 10b is set as the front end E1. The first step layer 5a is joined to the second internal electrode layer 10b at the front end E1 of the second internal electrode layer 10b.

[0133] Similarly, the front end E on the second end face 62b side of the first internal electrode layer 10a is defined as the front end E2. The second stepped layer 5b is in contact with the first internal electrode layer 10a at the front end E2 of the first internal electrode layer 10a.

[0134] (L-direction end portion)

[0135] The L-direction end portion 47 refers to a region that is 0 μm or more and 60 μm or less from the end in the L direction of the internal electrode layer 10 toward the end face 62 to which the internal electrode layer 10 is connected. That is, Figure 4 as shown, D1 is 0 μm or more and 60 μm or less.

[0136] Here, the thicknesses of the ceramic layer 4 and the stepped layer 5 between the first internal electrode layer 10a and the first internal electrode layer 10a on the adjacent first main face 61a side are set as D2. In addition, the thicknesses of the ceramic layer 4 and the stepped layer 5 between the first internal electrode layer 10a and the first internal electrode layer 10a on the adjacent second main face 61b side are set as D3. D2 is larger than D3. D2 gradually increases as it approaches the first main face side.

[0137] (Coverage rate)

[0138] The coverage rate of the internal electrode layer 10 will be described. The coverage rate in the L-direction end portion 47 of the internal electrode layer 10 is lower than the coverage rate in the opposed portion 11 of the internal electrode layer 10. Specifically, the coverage rate in the L-direction end portion 47 of the first internal electrode layer 10a is lower than the coverage rate of the first opposed portion 11a of the first internal electrode layer 10a. In addition, the same applies to the second internal electrode layer 10b. The coverage rate in the L-direction end portion 47 of the second internal electrode layer 10b is lower than the coverage rate of the second opposed portion 11b of the second internal electrode layer 10b.

[0139] (Second embodiment)

[0140] Based on Figure 5 and Figure 6 the second embodiment of the multilayer ceramic electronic component 1 of the present invention will be described. Figure 5 It is an LT cross-sectional view of the laminate 2 in the second embodiment. Figure 5 It corresponds to Figure 4 in the first embodiment. Figure 6 It is an LT cross-sectional view of a part of the multilayer ceramic electronic component 1 of the second embodiment. In the following description, the differences from the first embodiment will be mainly described.

[0141] In the first embodiment, as Figure 4 shown, the length in the height direction T of the stepped layer 5 varies according to the internal electrode layer 10. In contrast, in the second embodiment, as Figure 5As shown, the length of the stepped layer 5 in the length direction L varies according to the internal electrode layer 10.

[0142] (Distance between the stepped layer and the internal electrode layer)

[0143] The distance in the length direction L between the stepped layer 5 and the internal electrode layer 10 will be described. Among the two ends of the stepped layer 5 in the length direction L, the end on the side where it is not exposed at the end face 62 is defined as the inner end Q of the stepped layer 5. Moreover, the distance in the length direction L between the front end E of the internal electrode layer 10 and the inner end Q of the stepped layer 5 arranged on the same layer as the internal electrode layer 10 is defined as J. This distance J becomes the distance in the length direction L between the stepped layer 5 and the internal electrode layer 10.

[0144] If the internal electrode layer 10 is located closer to the first main surface 61a, the distance J in the length direction L between the stepped layer 5 and the internal electrode layer 10 becomes farther.

[0145] Specifically, for the distance J in the length direction L between the first stepped layer 5a and the second internal electrode layer 10b, the distance J in the length direction L between the first stepped layer 5a located closer to the first main surface 61a and the second internal electrode layer 10b becomes farther.

[0146] Similarly, for the distance J in the length direction L between the second stepped layer 5b and the first internal electrode layer 10a, the distance in the length direction L between the second stepped layer 5b located closer to the first main surface 61a and the first internal electrode layer 10a becomes farther.

[0147] In Figure 5 two of the first stepped layer 5a and the second stepped layer 5b are respectively shown.

[0148] Regarding the two first stepped layers 5a, for the first stepped layer 5a closer to the first main surface 61a, the distance J in the length direction L between the first stepped layer 5a and the second internal electrode layer 10b is defined as the distance J2, and for the first stepped layer 5a closer to the second main surface 61b, the distance J in the length direction L between the first stepped layer 5a and the second internal electrode layer 10b is defined as the distance J4. The distance of J2 is farther than the distance of J4.

[0149] The same applies to the second stepped layer 5b. Regarding the two second stepped layers 5b, for the second stepped layer 5b closer to the first main surface 61a, the distance J in the length direction L between the second stepped layer 5b and the first internal electrode layer 10a is defined as the distance J1, and for the second stepped layer 5b closer to the second main surface 61b, the distance J in the length direction L between the second stepped layer 5b and the first internal electrode layer 10a is defined as the distance J3. The distance of J1 is farther than the distance of J3.

[0150] As described above, in the multilayer ceramic electronic component 1 of the present embodiment, the length of the stepped layer 5 becomes shorter as it approaches the first main surface 61a.

[0151] When manufacturing the laminate 2, compared with the start of lamination, the end of lamination is more likely to cause bending of each layer due to the presence or absence of the internal electrode layer 10. In other words, at the end of lamination, the influence of the steps due to the presence or absence of the internal electrode layer 10 becomes larger.

[0152] In addition, the bending of each layer starts on the end face side closer to the end of lamination.

[0153] In the multilayer ceramic electronic component 1 of the present embodiment, the length of the stepped layer 5 from the end face 62 becomes shorter at the end of lamination.

[0154] Thereby, the multilayer ceramic electronic component 1 can reduce the degree of bending of the laminate 2.

[0155] In addition, in the height direction T, it is possible to suppress the overlap of the internal electrode layer 10 and the stepped layer 5, improving the reliability of the multilayer ceramic electronic component 1.

[0156] (Ratio to the length of the L gap)

[0157] The ratio of the length of the stepped layer 5 to the length in the length direction L of the L gap 51 will be described.

[0158] In Figure 5 , the length in the length direction L of the stepped layer 5 is denoted by S. In addition, the length in the length direction L of the L gap 51 is denoted by D5. The length S of the stepped layer 5 is 20% or more of the length D5 of the L gap 51.

[0159] Specifically, the length S in the length direction L of the first stepped layer 5a is 20% or more of the distance in the length direction L between the front end E1 of the second internal electrode layer 10b and the first end face 62a, that is, the length D5 in the length direction L of the first L gap 51a.

[0160] Similarly, the length S in the length direction L of the second stepped layer 5b is 20% or more of the distance in the length direction L between the front end E2 of the first internal electrode layer 10a and the second end face 62b, that is, the length D5 in the length direction L of the second L gap 51b.

[0161] In Figure 5 , two of the first stepped layer 5a and the second stepped layer 5b are shown respectively.

[0162] Regarding the two first stepped layers 5a, for the first stepped layer 5a closer to the first main surface 61a, the length S in the length direction L is set to the length S2, and for the first stepped layer 5a closer to the second main surface 61b, the length S in the length direction L is set to the length S4. Both the length S2 and the length S4 are 20% or more of the length D5 in the length direction L of the first L gap 51a.

[0163] The same applies to the second stepped layer 5b. Regarding the two second stepped layers 5b, for the second stepped layer 5b closer to the first main surface 61a, the length S in the length direction L is set to the length S1, and for the second stepped layer 5b closer to the second main surface 61b, the length S in the length direction L is set to the length S3. Both the length S1 and the length S3 are 20% or more of the length D5 in the length direction L of the second L gap 51b.

[0164] (Bending portion)

[0165] Based on Figure 6 , the bending portion 40 of the internal electrode layer 10 will be described. Figure 6 is an LT cross-sectional view that is part of the multilayer ceramic electronic component 1 of the second embodiment. Figure 6 Shows the first L gap 51a etc. of the multilayer ceramic electronic component 1.

[0166] The internal electrode layer 10 in the second embodiment has a bending portion 40. The bending portion 40 refers to the portion where the internal electrode layer 10 bends in the direction of the second main surface 61b in the extension portion 12 of the internal electrode layer 10.

[0167] In Figure 6 , the bending portion 40 of the first internal electrode layer 10a is shown. In Figure 6 , five bending portions 40 are shown. The reference numerals 41 to 45 are sequentially assigned to the five bending portions 40 in the direction from the first main surface 61a to the second main surface 61b.

[0168] (Starting point of bending)

[0169] The starting point of the bending of the bending portion 40 is set as point F, and the ending point of the bending of the bending portion 40 is set as point G. The starting point of bending is the point where the internal electrode layer 10a starts to bend in the direction of the second main surface 61b in the extension portion 12. In Figure 6 , for each bending portion 40, the point F as the starting point of bending is represented as points F1 to F5.

[0170] (Ending point of bending)

[0171] The ending point of bending is the point where the bending portion 40 of the internal electrode layer 10 is in contact with the end face 62. In Figure 6In the structure shown, the end point of the bend becomes the point where the first internal electrode layer 10a contacts the first end face 62a. In Figure 6 for each bending portion 40, the point G that is the end point of the bend is denoted as points G1 to G5.

[0172] (Length of the bending portion)

[0173] The length M of the bending portion 40 is described. The length M of the bending portion 40 is the distance in the length direction L between the start point G and the end point G of the bend.

[0174] In Figure 6 for each bending portion 40, the length M of the bending portion 40 is denoted as lengths M1 to M5. The closer the internal electrode layer 10 is to the second main face 61b, the shorter the length M of the bending portion 40 becomes. That is, the lengths M become shorter in the order of lengths M1 to M5.

[0175] (Height of the bending portion)

[0176] The height N of the bending portion 40 is described. The height N of the bending portion 40 is the distance in the height direction T between the start point G and the end point G of the bend.

[0177] In Figure 6 for each bending portion 40, the height N of the bending portion 40 is denoted as heights N1 to N5. The closer the internal electrode layer 10 is to the second main face 61b, the lower the height N of the bending portion 40 becomes. That is, the heights N become lower in the order of heights N1 to N5.

[0178] (Third Embodiment)

[0179] Based on Figures 7 to 11 the third embodiment of the multilayer ceramic electronic component 1 of the present invention is described. In the following description, the differences from the first embodiment and the second embodiment are mainly described.

[0180] In the first embodiment and the second embodiment, the case where the multilayer ceramic electronic component 1 is a two-terminal multilayer ceramic capacitor has been described. However, the multilayer ceramic electronic component 1 is not limited to a two-terminal multilayer ceramic capacitor. The multilayer ceramic electronic component 1 can also be a multi-terminal multilayer ceramic capacitor having three or more terminals. In the third embodiment, the case where the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor is described.

[0181] (Outline of the Multilayer Ceramic Electronic Component)

[0182] Based on Figure 7 the outline of the structure of the multilayer ceramic electronic component 1 is described.

[0183] Figure 7 is a perspective view showing the multilayer ceramic electronic component 1 of the present embodiment. As Figure 7 shown, in the multilayer ceramic electronic component 1 of the third embodiment, external electrodes 20 are formed not only on two end faces 62 but also on two side faces 63. The external electrode 20 formed on the side face 63 is defined as a side external electrode 30. The side external electrode 30 includes a first side external electrode 30a and a second side external electrode 30b. The first side external electrode 30a is formed on the first side face 63a. The second side external electrode 30b is formed on the second side face 63b.

[0184] In the multilayer ceramic electronic component 1 of the present embodiment, connections between the internal electrode layer 10 and the external electrode 20 can be made not only on two end faces 62 but also on two side faces 63.

[0185] (LT cross-sectional layer)

[0186] Based on Figure 8 , the LT cross-section of the multilayer ceramic electronic component 1 will be described. Figure 8 is Figure 7 a cross-sectional view taken along line III-III of

[0187] As Figure 8 shown, in the laminate 2, a plurality of end-face exposed electrode layers 10c and a plurality of side-face exposed electrode layers 10d are laminated with an inner ceramic layer 4a interposed therebetween. The end-face exposed electrode layer 10c is connected to the first external electrode 20a at the first end face 62a. In addition, the end-face exposed electrode layer 10c is connected to the second external electrode 20b at the second end face 62b.

[0188] On the other hand, the side-face exposed electrode layer 10d is not connected to the external electrode 20 at any of the end faces 62.

[0189] In a three-terminal multilayer ceramic capacitor, the end-face exposed electrode layer 10c functions as a through electrode. In addition, the side-face exposed electrode layer 10d functions as a ground electrode.

[0190] (WT cross-sectional layer)

[0191] Based on Figure 9 , the WT cross-section of the multilayer ceramic electronic component 1 will be described. Figure 9 is Figure 7 a cross-sectional view taken along line IV-IV of

[0192] As Figure 9 shown, the side-face exposed electrode layer 10d is connected to the first side external electrode 30a at the first side face 63a. In addition, the side-face exposed electrode layer 10d is connected to the second side external electrode 30b at the second side face 63b.

[0193] On the other hand, the end face exposed electrode layer 10c is not connected to the external electrode 20 on any of the side faces 63.

[0194] (Planar structure of the internal electrode layer)

[0195] Based on Figure 10 and Figure 11 The planar structures of the end face exposed electrode layer 10c and the side face exposed electrode layer 10d will be described. Here, the planar structure refers to the structure when observing the internal electrode layer 10 in the height direction T of the multilayer ceramic electronic component 1.

[0196] (End face exposed electrode layer)

[0197] Based on Figure 10 The end face exposed electrode layer 10c will be described. Figure 10 is Figure 7 the V-V line cross-sectional view of. Figure 10 Shows the planar structure of the end face exposed electrode layer 10c.

[0198] A first end face extension part 12c is provided at the part of the end face exposed electrode layer 10c exposed on the first end face 62a. In addition, a second end face extension part 12d is provided at the part of the end face exposed electrode layer 10c exposed on the second end face 62b.

[0199] The opposed part 11 of the end face exposed electrode layer 10c is connected to the first end face 62a via the first end face extension part 12c. In addition, the opposed part 11 of the end face exposed electrode layer 10c is connected to the second end face 62b via the second end face extension part 12d.

[0200] In Figure 10 the end face exposed electrode layer 10c is illustrated as a rectangular shape, but the widths in the width direction W of the opposed part 11 and the end face vertical parts, that is, the first end face extension part 12c and the second end face extension part 12d, may also be the same.

[0201] (Side face exposed electrode layer)

[0202] Based on Figure 11 The side face exposed electrode layer 10d will be described. Figure 11 is Figure 7 the V-V line cross-sectional view of. Figure 11 Shows the planar structure of the side face exposed electrode layer 10d.

[0203] A first side extension portion 12e is provided at a portion of the electrode layer 10d exposed on the first side surface 63a that is exposed on the side surface. In addition, a second side extension portion 12f is provided at a portion of the electrode layer 10d exposed on the second side surface 63b that is exposed on the side surface. The opposing portion 11 of the electrode layer 10d exposed on the side surface is connected to the first side surface 63a via the first side extension portion 12e. In addition, the opposing portion 11 of the electrode layer 10d exposed on the side surface is connected to the second side surface 63b via the second side extension portion 12f.

[0204] (Definition of regions)

[0205] In the end-face exposed electrode layer 10c, a region corresponding to the region where the first side extension portion 12e is provided in the side-face exposed electrode layer 10d is defined as a third W gap 52c. In addition, similarly, in the end-face exposed electrode layer 10c, a region corresponding to the region where the second side extension portion 12f is provided in the side-face exposed electrode layer 10d is defined as a fourth W gap 52d.

[0206] In addition, in the side-face exposed electrode layer 10d, a region corresponding to the region where the first end-face extension portion 12c is provided in the end-face exposed electrode layer 10c is defined as a third L gap 51c. In addition, similarly, in the side-face exposed electrode layer 10d, a region corresponding to the region where the second end-face extension portion 12d is provided in the end-face exposed electrode layer 10c is defined as a fourth L gap 51d.

[0207] In the length direction L of the laminate 2, the extended region 55 where the first side extension portion 12e is provided is defined as a first L extended region 55c. In addition, similarly, in the length direction L of the laminate 2, the extended region 55 where the second side extension portion 12f is provided is defined as a second L extended region 55d.

[0208] In addition, in the width direction W of the laminate 2, the extended region 55 where the first end-face extension portion 12c is provided is defined as a first W extended region 55a. In addition, similarly, in the width direction W of the laminate 2, the extended region 55 where the second end-face extension portion 12d is provided is defined as a second W extended region 55b.

[0209] (Step layer)

[0210] Even if the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor, the step layer 5 is arranged in the same manner as in the case of a two-terminal multilayer ceramic capacitor. By appropriately arranging the step layer 5, it is possible to suppress the non-uniformity of the thickness in the height direction T of the laminate 2 caused by the first end-face extension portion 12c, the second end-face extension portion 12d, the first side extension portion 12e, and the second side extension portion 12f.

[0211] (End-face step layer)

[0212] In this embodiment, the stepped layer 5 includes an end-face stepped layer 5c and a side-face stepped layer 5d.

[0213] The end-face stepped layer 5c can be used to eliminate the steps caused by the first end-face extension 12c and the second end-face extension 12d of the end-face exposed electrode layer 10c.

[0214] The side-face exposed electrode layer 10d does not have electrodes at positions corresponding to the first end-face extension 12c and the second end-face extension 12d. Thus, in the same layer as the side-face exposed electrode layer 10d, the end-face stepped layer 5c is disposed at positions corresponding to the first end-face extension 12c and the second end-face extension 12d. Thereby, the non-uniformity in the height direction T of the stacked body 2 can be suppressed.

[0215] In the same layer as the side-face exposed electrode layer 10d, the regions where it is preferable to dispose the end-face stepped layer 5c are the following two. One is Figure 11 the overlapping part of the third L-gap 51c and the first W-extension region 55a. The end-face stepped layer 5c disposed in this part reduces the height non-uniformity caused by the side-face exposed electrode layer 10d not having the first end-face extension 12c.

[0216] The other is Figure 11 the overlapping part of the fourth L-gap 51d and the second W-extension region 55b. The end-face stepped layer 5c disposed in this part reduces the height non-uniformity caused by the side-face exposed electrode layer 10d not having the second end-face extension 12d.

[0217] (Side-face stepped layer)

[0218] Next, the side-face stepped layer 5d will be described.

[0219] The side-face stepped layer 5d can be used to eliminate the steps caused by the first side-face extension 12e and the second side-face extension 12f of the side-face exposed electrode layer 10d.

[0220] The end-face exposed electrode layer 10c does not have electrodes at positions corresponding to the first side-face extension 12e and the second side-face extension 12f.

[0221] Thus, in the same layer as the end-face exposed electrode layer 10c, the side-face stepped layer 5d is disposed at positions corresponding to the first side-face extension 12e and the second side-face extension 12f. Thereby, the non-uniformity in the height direction T of the stacked body 2 can be suppressed.

[0222] In the same layer as the end-face exposed electrode layer 10c, the regions where it is preferable to dispose the side-face stepped layer 5d are the following two. One is Figure 10The overlapping part of the 3rd W gap 52c and the 1st L extension region 55c in it. The side step layer 5d disposed in this part reduces the height non-uniformity caused by the end face exposed electrode layer 10c not having the 1st side extension part 12e.

[0223] Another is Figure 10 The overlapping part of the 4th W gap 52d and the 2nd L extension region 55d in it. The side step layer 5d disposed in this part reduces the height non-uniformity caused by the end face exposed electrode layer 10c not having the 2nd side extension part 12f.

[0224] In addition, the end face step layer 5c and the side step layer 5d can be disposed in the same form as the 1st step layer 5a and the 2nd step layer 5b described in the 1st embodiment and the 2nd embodiment.

[0225] Furthermore, in the 1st embodiment and the 2nd embodiment, the form of the step layer 5 and the like are described taking the vicinity of the end face 62 as an example. The form of the step layer 5 described based on this end face 62 is applicable not only to the end face step layer 5c of the 3rd embodiment but also to the side step layer 5d.

[0226] In addition, the side step layer 5d can be provided in the same layer as the side exposed electrode layer 10d. When the side step layer 5d is provided in the same layer as the side exposed electrode layer 10d, the distance between the electrode layer 10 and the step layer 5 can be set as the distance in the length direction L between the adjacent side extension parts 12e, 12f and the side step layer 5d. In addition, the distance between the electrode layer 10 and the step layer 5 can be set as the distance in the width direction W between the opposing part 11 of the adjacent side exposed electrode layer 10d and the side step layer 5d.

[0227] Similarly, the end face step layer 5c can be provided in the same layer as the end face exposed electrode layer 10c. When the end face step layer 5c is provided in the same layer as the end face exposed electrode layer 10c, the distance between the electrode layer 10 and the step layer 5 can be set as the distance in the length direction L between the opposing part 11 of the adjacent end face exposed electrode layer 10c and the end face step layer 5c. In addition, the distance between the electrode layer 10 and the step layer 5 can be set as the distance in the width direction W between the end face extension parts 12c, 12d and the end face step layer 5c.

[0228] (Combination of embodiments)

[0229] The above-described respective embodiments can also be combined.

[0230] In the first embodiment, the thickness in the height direction T of the stepped layer 5 was mainly described. On the other hand, in the second embodiment, the length in the length direction T of the stepped layer 5 was mainly described. For example, it is also possible to make the thickness in the height direction T of the stepped layer 5 as in the first embodiment and make the length in the length direction T of the stepped layer 5 as in the second embodiment.

[0231] In addition, as described above, in the third embodiment, the stepped layer 5 of the first embodiment or the second embodiment may be applied to at least any one of the end face exposed electrode layer 10c and the side face exposed electrode layer 10d. Further, in the third embodiment, the stepped layer 5 of the first embodiment may be applied to one of the end face exposed electrode layer 10c and the side face exposed electrode layer 10d, and the stepped layer 5 of the second embodiment may be applied to the remaining other. Further, in the third embodiment, the stepped layer 5 combining the first embodiment and the second embodiment may be applied to at least any one of the end face exposed electrode layer 10c and the side face exposed electrode layer 10d.

[0232] In this way, the above-described respective embodiments can be combined in various ways.

[0233] (Manufacturing method of multilayer ceramic electronic component)

[0234] The manufacturing method of the multilayer ceramic electronic component 1 will be described.

[0235] (Production of stacked block)

[0236] Prepare a ceramic green sheet, an electrode paste for the internal electrode layer 10, and a stepped paste for the stepped layer 5.

[0237] (Coating of paste)

[0238] The electrode paste and the stepped paste are coated on the ceramic green sheet in a desired pattern. The coating of each paste on the ceramic green sheet can be performed, for example, by methods such as screen printing and gravure printing. Using an arbitrary printing method, the electrode paste and the stepped paste are printed on the ceramic green sheet in a given pattern. Thereby, a ceramic green sheet for the inner layer portion 53 on which the paste is printed is obtained. It is possible to control the change in the distance in the length direction between the stepped layer and the internal electrode layer by changing the coating position of the stepped paste.

[0239] (Lamination)

[0240] Stack a given number of green ceramic sheets without printing the pattern of the internal electrode layer 10. Thus, the part corresponding to the outer layer portion 54 is fabricated. On top of this, stack the green ceramic sheets for the inner layer portion 53 coated with paste in sequence. Thus, the part corresponding to the inner layer portion 53 is stacked. Further, stack a given number of green ceramic sheets for another outer layer portion 54 on top of this. Thus, a stacked sheet is fabricated. Press the stacked sheet in the height direction by methods such as isostatic pressing to fabricate a stacked block.

[0241] (Fabrication of stacked chips)

[0242] Cut the stacked block into a given size to cut out stacked chips. At this time, the corners and edges of the stacked chips can also be rounded by methods such as barrel polishing.

[0243] (Firing)

[0244] Next, fire the stacked chips to fabricate a stacked body 2. The firing temperature also depends on the materials of the ceramic layer 4 and the internal electrode layer 10, but it is preferably 900 °C or higher and 1400 °C or lower.

[0245] (External electrodes)

[0246] Next, form the external electrodes 20.

[0247] (Base layer)

[0248] Apply a conductive paste that becomes the base layer 21 to both end faces 62 of the stacked body 2 to form the base layer 21.

[0249] In addition, to form a sintered layer, apply a conductive paste containing a glass component and a metal by methods such as dipping. After that, perform a sintering process to form the base layer 21. The temperature of the sintering process is preferably 500 °C or higher and 900 °C or lower. In addition, the time of the sintering process is preferably 30 minutes or longer and 2 hours or shorter. In addition, the atmosphere of the sintering process is preferably a reducing atmosphere containing, for example, H 2 O, H 2 .

[0250] Next, form a plating layer 23 on the surface of the base layer 21. In the present embodiment, a Ni plating layer is formed on the sintered layer. This Ni plating layer becomes the inner plating layer 23a. Next, form a Sn plating layer on the Ni plating layer. This Sn plating layer becomes the surface plating layer 23b. For example, by the barrel plating method, the Ni plating layer and the Sn plating layer are formed in sequence. In this way, the multilayer ceramic electronic component 1 can be obtained.

[0251] In addition, when manufacturing a three-terminal multilayer ceramic capacitor, in addition to both end faces 62 of the stacked body 2, external electrodes 20 are also formed on both side faces 63.

[0252] (Method for Measuring Thickness)

[0253] As a method for measuring the length, thickness, etc. of the ceramic layer 4, the internal electrode layer 10, etc., for example, a method of observing a cross-section of the laminate 2 exposed by polishing using a scanning electron microscope can be cited. In addition, each value can be set to the average of the measured values at a plurality of places corresponding to the part to be measured.

[0254] In addition, the length of each part of the laminate 2, etc. can be measured using a micrometer or an optical microscope. The stepped layer becomes thicker as it approaches the first main surface. At this time, the thickness increases as it approaches the first main surface between the first internal electrode layer and the first internal electrode layer closest to the first main surface side.

[0255] (Method for Measuring Coverage Rate)

[0256] For example, the coverage rate can be measured as follows.

[0257] Inside the internal electrode layer 10, there are parts containing voids where there is no metal. In the internal electrode layer 10, the proportion of the metal is defined as the coverage rate. However, when the internal electrode layer 10 and the ceramic layer 4 are laminated, sometimes the ceramic material fills a part of the voids in the internal electrode layer 10. Therefore, the definition of the coverage rate is set as metal / (metal + (void or ceramic material)).

[0258] That is, the entire internal electrode layer 10 is set to the sum of (i) metal, (ii) the part that does not contain ceramic material and exists as a void, and (iii) the part where the void is filled with ceramic material. And the proportion of (i) metal in the entire internal electrode layer 10 is defined as the coverage rate.

[0259] Specifically, the coverage rate can be measured using the following method.

[0260] First, polish the laminate 2 to expose the cross-section of the part where the coverage rate is to be measured. Then, observe the exposed cross-section using an optical microscope, etc., and obtain the area of the metal within a given range. Based on the obtained area, calculate the coverage rate. In addition, the coverage rate can also be the average of the values obtained at a plurality of places.

[0261] The embodiments of the present invention have been described above, but the present invention is not limited to the foregoing embodiments, and various changes and modifications can be made.

[0262] Explanation of Reference Numerals

[0263] 1 Multilayer ceramic electronic component

[0264] 2 Laminate

[0265] 4 Ceramic layer

[0266] 5-step layer

[0267] 10 internal electrode layer

[0268] 11 opposing part

[0269] 12 extension part

[0270] 20 external electrode

[0271] 21 base layer

[0272] 23 plating layer

[0273] 30 side external electrode

[0274] 40 bending part

[0275] 41 - 45 First bending part - Fifth bending part

[0276] 47 L-direction end

[0277] 50 electrode opposing part

[0278] 51 L gap

[0279] 52 W gap

[0280] 53 inner layer part

[0281] 54 outer layer part

[0282] 55 extension area

[0283] 61 main surface

[0284] 62 end face

[0285] 63 side face

[0286] T height direction

[0287] L length direction

[0288] W width direction.

Claims

1. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode, wherein the laminate includes a plurality of ceramic layers laminated, and includes: a first main surface and a second main surface that are opposite in the height direction; a first side surface and a second side surface that are opposite in the width direction orthogonal to the height direction; a first end surface and a second end surface that are opposite in the length direction orthogonal to the height direction and the width direction; a first internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the first end surface; a second internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the second end surface; a first step layer, disposed on the same plane as the second internal electrode layer, and exposed at the first end surface; and a second step layer, disposed on the same plane as the first internal electrode layer, and exposed at the second end surface, wherein the first external electrode is provided on the first end surface, the second external electrode is provided on the second end surface, with respect to the distance in the length direction between the first step layer and the second internal electrode layer, the distance in the length direction between the first step layer and the second internal electrode layer at a position closer to the first main surface becomes farther; with respect to the distance in the length direction between the second step layer and the first internal electrode layer, the distance in the length direction between the second step layer and the first internal electrode layer at a position closer to the first main surface becomes farther.

2. The multilayer ceramic electronic component according to claim 1, wherein the length in the length direction of the first step layer is 20% or more of the distance in the length direction between the second internal electrode layer and the first end surface, the length in the length direction of the second step layer is 20% or more of the distance in the length direction between the first internal electrode layer and the second end surface.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein the first internal electrode layer has: an opposed portion where the first internal electrode layer and the second internal electrode layer are opposed; and an extended portion extending from the opposed portion toward the first end surface, wherein the extended portion has a bent portion bent in the direction of the second main surface, with respect to the length in the length direction of the laminate of the bent portion, the length in the length direction of the laminate of the bent portion at a position closer to the second main surface becomes shorter.

4. The multilayer ceramic electronic component according to claim 3, wherein when the height in the height direction of the laminate of the bent portion is defined by the distance in the height direction of the laminate between the starting point of bending and the ending point of bending of the bent portion, with respect to the height in the height direction of the laminate of the bent portion, the height in the height direction of the laminate of the bent portion at a position closer to the second main surface becomes lower.

5. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode, wherein the laminate includes a plurality of ceramic layers laminated, and includes: a first main surface and a second main surface that are opposite in the height direction; a first side surface and a second side surface that are opposite in the width direction orthogonal to the height direction; A first end face and a second end face that are opposite to each other in a length direction orthogonal to the height direction and the width direction; An end-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first end face and the second end face; A side-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first side face and the second side face; and A side-step layer is disposed on the same plane as the side-face exposed electrode layer and is exposed at the first side face and the second side face, The first external electrode is provided on the first end face and the second end face, The second external electrode is provided on the first side face and the second side face, Regarding the distance in the width direction between the side-step layer and the side-face exposed electrode layer, the distance in the width direction between the side-step layer and the side-face exposed electrode layer at a position closer to the first main face becomes farther.

6. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode, The laminate includes a plurality of ceramic layers laminated and includes: A first main face and a second main face that are opposite to each other in the height direction; A first side face and a second side face that are opposite to each other in a width direction orthogonal to the height direction; A first end face and a second end face that are opposite to each other in a length direction orthogonal to the height direction and the width direction; An end-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first end face and the second end face; A side-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first side face and the second side face; and A side-step layer is disposed on the same plane as the side-face exposed electrode layer and is exposed at the first side face and the second side face, The first external electrode is provided on the first end face and the second end face, The second external electrode is provided on the first side face and the second side face, Regarding the distance in the length direction between the side-step layer and the side-face exposed electrode layer, the distance in the length direction between the side-step layer and the side-face exposed electrode layer at a position closer to the first main face becomes farther.

7. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode, The laminate includes a plurality of ceramic layers laminated and includes: A first main face and a second main face that are opposite to each other in the height direction; A first side face and a second side face that are opposite to each other in a width direction orthogonal to the height direction; A first end face and a second end face that are opposite to each other in a length direction orthogonal to the height direction and the width direction; An end-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first end face and the second end face; A side-face exposed electrode layer serving as an internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first side face and the second side face; and An end-step layer is disposed on the same plane as the side-face exposed electrode layer and is exposed at the first end face and the second end face, The first external electrode is provided on the first end face and the second end face. The second external electrode is provided on the first side face and the second side face. Regarding the distance in the length direction between the end face step layer and the side face exposed electrode layer, the distance in the length direction between the end face step layer and the side face exposed electrode layer at a position closer to the first main face becomes farther.

8. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated, and includes: A first main face and a second main face that are opposite in the height direction; A first side face and a second side face that are opposite in the width direction orthogonal to the height direction; A first end face and a second end face that are opposite in the length direction orthogonal to the height direction and the width direction; An end face exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed on the first end face and the second end face; A side face exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed on the first side face and the second side face; And A side face step layer, which is arranged on the same plane as the end face exposed electrode layer and is exposed on the first side face and the second side face. The first external electrode is provided on the first end face and the second end face. The second external electrode is provided on the first side face and the second side face. Regarding the distance in the width direction between the side face step layer and the end face exposed electrode layer, the distance in the width direction between the side face step layer and the end face exposed electrode layer at a position closer to the first main face becomes farther.

9. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated, and includes: A first main face and a second main face that are opposite in the height direction; A first side face and a second side face that are opposite in the width direction orthogonal to the height direction; A first end face and a second end face that are opposite in the length direction orthogonal to the height direction and the width direction; An end face exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed on the first end face and the second end face; A side face exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed on the first side face and the second side face; And An end face step layer, which is arranged on the same plane as the end face exposed electrode layer and is exposed on the first end face and the second end face. The first external electrode is provided on the first end face and the second end face. The second external electrode is provided on the first side face and the second side face. Regarding the distance in the width direction between the end face step layer and the end face exposed electrode layer, the distance in the width direction between the end face step layer and the end face exposed electrode layer at a position closer to the first main face becomes farther.

10. A multilayer ceramic electronic component, comprising a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated thereon, and includes: a first main surface and a second main surface that face each other in the height direction; a first side surface and a second side surface that face each other in the width direction orthogonal to the height direction; a first end surface and a second end surface that face each other in the length direction orthogonal to the height direction and the width direction; an end surface exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed at the first end surface and the second end surface; a side surface exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and is exposed at the first side surface and the second side surface; and an end surface step layer, which is disposed on the same surface as the end surface exposed electrode layer and is exposed at the first end surface and the second end surface, the first external electrode is provided on the first end surface and the second end surface, the second external electrode is provided on the first side surface and the second side surface, Regarding the distance in the length direction between the end surface step layer and the end surface exposed electrode layer, the distance in the length direction between the end surface step layer and the end surface exposed electrode layer at a position closer to the first main surface becomes farther.

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