Laminated ceramic electronic component

Abstract

Provided is a laminated ceramic electronic component (1) in which the surface of a laminated body (2) can be easily made more flat. The laminated ceramic electronic component (1) is provided with a laminated body (2). The laminated body (2) includes: a first internal electrode layer (10a) that is alternately laminated with the plurality of ceramic layers (4) and is exposed on a first end surface (62a); a second internal electrode layer (10b) that is alternately laminated with the plurality of ceramic layers (4) and is exposed on a second end surface (62b); and a first step layer (5a) that is disposed on the same plane as the second internal electrode layer (10b) and is exposed on the first end surface (62a). And a second step layer (5b) disposed on the same plane as the first internal electrode layer (10a) and exposed on the second end surface (62b), the thickness of the first step layer (5a) in the height direction (T) of the laminate (2) at a position closer to the first main surface (61a) becomes thicker, and the thickness of the second step layer (5b) in the height direction (T) of the laminate (2) at a position closer to the second main surface (61a) becomes thicker. The second step layer (5b) located at a position closer to the first main surface (61a) becomes thicker.

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component, and more particularly to a multilayer ceramic capacitor. Background Art

[0002] Conventionally, as a multilayer ceramic electronic component, a multilayer ceramic capacitor has been known. Generally, a multilayer ceramic capacitor has a structure including a laminate and external electrodes provided on both end faces of the laminate, and has a desired capacitance corresponding to the number of laminated sheets and the thickness of the dielectric layer. The laminate is a fired body in which a plurality of dielectric layers containing ceramics and internal electrode layers are alternately laminated.

[0003] In Patent Document 1 and the like, it is described that a step absorption layer is provided to eliminate steps caused by the internal electrode layer.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-286860 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, in practice, most of them are bent toward the first main surface or the second main surface. In addition, the degree of bending tends to be stronger on the side of the surface away from the bending direction. Therefore, if the step absorption layer is arranged on the same plane of each internal electrode layer as described in Patent Document 1, the step absorption layer is also arranged for a portion that is bent only to such an extent that it does not affect structural defects. Therefore, new structural defects may occur, and there is a problem that the cost corresponding to the step absorption layer becomes high. Thus, an object of the present invention is to control the cost and suppress structural defects by arranging an appropriate amount of the step absorption layer at an appropriate place.

[0009] Technical Means for Solving the Problems

[0010] The multilayer ceramic electronic component of the present invention includes a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated thereon, and includes: a first main surface and a second main surface opposing each other in the height direction; a first side surface and a second side surface opposing each other in the width direction orthogonal to the height direction; a first end surface and a second end surface opposing each other in the length direction orthogonal to the height direction and the width direction; a first internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the first end surface; a second internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the second end surface; a first step layer disposed on the same plane as the second internal electrode layer and exposed at the first end surface; and a second step layer disposed on the same plane as the first internal electrode layer and exposed at the second end surface. The first external electrode is provided on the first end surface, and the second external electrode is provided on the second end surface. Regarding the thickness of the laminate in the height direction of the first step layer, the first step layer located closer to the first main surface becomes thicker. Regarding the thickness of the laminate in the height direction of the second step layer, the second step layer located closer to the first main surface becomes thicker.

[0011] Furthermore, the multilayer ceramic electronic component of the present invention includes a laminate, a first external electrode, and a second external electrode. The laminate includes a plurality of ceramic layers laminated thereon, and includes: a first main surface and a second main surface opposing each other in the height direction; a first side surface and a second side surface opposing each other in the width direction orthogonal to the height direction; a first end surface and a second end surface opposing each other in the length direction orthogonal to the height direction and the width direction; an end surface exposed electrode layer as an internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the first end surface and the second end surface; a side surface exposed electrode layer as an internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the first side surface and the second side surface; a side surface step layer disposed on the same plane as the end surface exposed electrode layer and exposed at the first side surface and the second side surface; and an end surface step layer disposed on the same plane as the side surface exposed electrode layer and exposed at the first end surface and the second end surface. The first external electrode is provided on the first end surface and the second end surface, and the second external electrode is provided on the first side surface and the second side surface. Regarding the thickness of the laminate in the height direction of the side surface step layer, the side surface step layer located closer to the first main surface becomes thicker. Regarding the thickness of the laminate in the height direction of the end surface step layer, the end surface step layer located closer to the first main surface becomes thicker.

[0012] Advantages of the Invention

[0013] According to the present invention, a laminated ceramic electronic component capable of easily making the surface of a laminate flatter can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 FIG. 1 is a perspective view of a laminated ceramic electronic component according to a first embodiment of the present invention.

[0015] Figure 2 FIG. 2 is Figure 1 a cross-sectional view taken along line I-I of FIG. 1.

[0016] Figure 3 FIG. 3 is Figure 1 a cross-sectional view taken along line II-II of FIG. 1.

[0017] Figure 4 FIG. 4 is an LT cross-sectional view of a laminate in the first embodiment.

[0018] Figure 5 FIG. 5 is an LT cross-sectional view of a laminate in the second embodiment.

[0019] Figure 6 FIG. 6 is an LT cross-sectional view of a laminated ceramic electronic component in the second embodiment.

[0020] Figure 7 FIG. 7 is a perspective view of a laminated ceramic electronic component according to a third embodiment.

[0021] Figure 8 FIG. 8 is Figure 7 a cross-sectional view taken along line III-III of FIG. 7.

[0022] Figure 9 FIG. 9 is Figure 7 a cross-sectional view taken along line IV-IV of FIG. 7.

[0023] Figure 10 FIG. 10 is Figure 7 a cross-sectional view taken along line V-V of FIG. 7, showing a planar structure of an end-face exposed electrode layer.

[0024] Figure 11 FIG. 11 is Figure 7 a cross-sectional view taken along line V-V of FIG. 7, showing a planar structure of a side-face exposed electrode layer. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, an example of an embodiment of a laminated ceramic electronic component 1 of the present invention will be described with reference to the drawings. In the following description, the case where the laminated ceramic electronic component 1 is a laminated ceramic capacitor will be taken as an example for description.

[0026] (First Embodiment)

[0027] The laminated ceramic electronic component 1 according to the first embodiment will be described.

[0028] (External Shape of Multilayer Ceramic Electronic Component)

[0029] Based on Figure 1 , the outline of the appearance of the multilayer ceramic electronic component 1 will be described. Figure 1 is a perspective view showing the multilayer ceramic electronic component 1 of the present embodiment. The multilayer ceramic electronic component 1 includes a laminate 2 and external electrodes 20.

[0030] (Definition of Directions)

[0031] In the drawings, the L direction, W direction, and T direction are appropriately shown. The L direction is the length direction of the multilayer ceramic electronic component 1. The W direction is the width direction of the multilayer ceramic electronic component 1. The T direction is the height direction of the multilayer ceramic electronic component 1. Thus, Figure 2 the shown cross-section is called the LT cross-section, Figure 3 the shown cross-section is called the WT cross-section. The length direction L, width direction W, and height direction T may not necessarily be orthogonal to each other. The length direction L, width direction W, and height direction T may also be intersecting with each other.

[0032] (External Shape of the Laminate)

[0033] The laminate 2 has a substantially rectangular parallelepiped shape. The laminate 2 has two main surfaces 61, two end surfaces 62, and two side surfaces 63. The main surfaces 61 are the surfaces facing each other in the height direction T. The end surfaces 62 are the surfaces facing each other in the length direction L. The side surfaces 63 are the surfaces facing each other in the width direction W. One of the two main surfaces 61 is designated as the first main surface 61a, and the other is designated as the second main surface 61b. One of the two end surfaces 62 is designated as the first end surface 62a, and the other is designated as the second end surface 62b. One of the two side surfaces 63 is designated as the first side surface 63a, and the other is designated as the second side surface 63b. In Figure 1 the first main surface 61a and the first side surface 63a are shown.

[0034] At the edges and corners of the laminate 2, it is preferable to have rounded corners. An edge is a part where two surfaces of the laminate 2 intersect. A corner is a part where three surfaces of the laminate 2 intersect. In addition, the size of the laminate 2 is not particularly limited.

[0035] (Structure of the Laminate)

[0036] The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. Hereinafter, the structure of the laminate 2 will be described with reference to a cross-sectional view of the laminate 2.

[0037] (Internal Structure of the Laminate (LT Cross-Section))

[0038] Based on Figure 2 , the internal structure of the laminate 2 will be described.Figure 2 is Figure 1 a cross-sectional view taken along line I-I of the multilayer ceramic electronic component 1 shown in the figure. Figure 2 Shows the LT cross-section of the multilayer ceramic electronic component 1. The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. The plurality of ceramic layers 4 and the plurality of internal electrode layers 10 are stacked on top of each other in the height direction T.

[0039] (Inner layer part and outer layer part)

[0040] The laminate 2 is divided in the height direction T into an inner layer part 53 and two outer layer parts 54. The outer layer part 54 includes a first outer layer part 54a and a second outer layer part 54b. The first outer layer part 54a and the second outer layer part 54b are located at positions sandwiching the inner layer part 53 in the height direction T.

[0041] A part of the plurality of ceramic layers 4 and a plurality of internal electrode layers 10 are arranged in the inner layer part 53. In the inner layer part 53, the plurality of internal electrode layers 10 face each other with the ceramic layer 4 interposed therebetween. Therefore, in the inner layer part 53, a capacitance is formed. Therefore, the inner layer part 53 is a part that substantially functions as a capacitor in the laminate 2.

[0042] The first outer layer part 54a is a part of the outer layer part 54 located on the side of the first main surface 61a of the laminate 2. The second outer layer part 54b is a part of the outer layer part 54 located on the side of the second main surface 61b of the laminate 2. Specifically, the first outer layer part 54a is the part between the internal electrode layer 10 closest to the first main surface 61a among the plurality of internal electrode layers 10 and the first main surface 61a. The second outer layer part 54b is the part between the internal electrode layer 10 closest to the second main surface 61b among the plurality of internal electrode layers 10 and the second main surface 61b. In the first outer layer part 54a and the second outer layer part 54b, no internal electrode layer 10 is arranged. In the first outer layer part 54a and the second outer layer part 54b, the remaining ceramic layers 4 among the plurality of ceramic layers 4 except for the ceramic layers 4 for the inner layer part 53 are arranged. The first outer layer part 54a and the second outer layer part 54b function as a protective layer for the inner layer part 53.

[0043] (Ceramic layer)

[0044] The ceramic layer 4 can be classified into the ceramic layer 4 arranged in the inner layer part 53 and the ceramic layer 4 arranged in the outer layer part 54. The ceramic layer 4 arranged in the inner layer part 53 is designated as the inner ceramic layer 4a. The ceramic layer 4 arranged in the outer layer part 54 is designated as the outer ceramic layer 4b.

[0045] (Number of ceramic layers)

[0046] For example, the number of ceramic layers 4 stacked in the laminate 2 can be set to 5 or more and 2000 or less.

[0047] (Material of the ceramic layer)

[0048] As the material of the ceramic layer 4, for example, a dielectric ceramic containing main components such as BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 etc. can be used. In addition, materials in which sub-components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, etc. are added to these main components can also be used.

[0049] When the piezoelectric ceramic is used in the laminate 2, the laminated ceramic electronic component 1 functions as a ceramic piezoelectric element. As a specific example of the piezoelectric ceramic material, for example, PZT (lead zirconate titanate) - based ceramic materials, etc. can be cited.

[0050] When the semiconductor ceramic is used in the laminate 2, the laminated ceramic electronic component 1 functions as a thermistor element. As a specific example of the semiconductor ceramic material, for example, spinel - based ceramic materials, etc. can be cited.

[0051] When the magnetic ceramic is used in the laminate, the laminated ceramic electronic component 1 functions as an inductor element. In addition, when the laminated ceramic electronic component 1 functions as an inductor element, the internal electrode layer becomes a coil - shaped conductor. As a specific example of the magnetic ceramic material, for example, ferrite ceramic materials, etc. can be cited.

[0052] (Thickness of the ceramic layer)

[0053] For example, the thickness of the ceramic layer 4 can be set to 10 μm or less.

[0054] (Internal electrode layer)

[0055] The internal electrode layer 10 can be classified into a first internal electrode layer 10a and a second internal electrode layer 10b. The first internal electrode layer 10a is the internal electrode layer 10 connected to the first external electrode 20a. The second internal electrode layer 10b is the internal electrode layer 10 connected to the second external electrode 20b. The first internal electrode layer 10a extends from the first end face 62a toward the second end face 62b. The second internal electrode layer 10b extends from the second end face 62b toward the first end face 62a.

[0056] (Opposing portion and extending portion)

[0057] The first internal electrode layer 10a and the second internal electrode layer 10b each have an opposing portion 11 and an extending portion 12.

[0058] The opposed portion 11 is the portion where the first internal electrode layer 10a and the second internal electrode layer 10b oppose each other in the height direction T within the internal electrode layer 10. The extending portion 12 is the portion that extends from the opposed portion 11 to the first end face 62a or the second end face 62b of the laminate 2 within the internal electrode layer 10.

[0059] The opposed portion 11 of the first internal electrode layer 10a is designated as the first opposed portion 11a. The extending portion 12 of the first internal electrode layer 10a is designated as the first extending portion 12a. The first extending portion 12a is the portion that extends from the first opposed portion 11a to the first end face 62a of the laminate 2.

[0060] Similarly, the opposed portion 11 of the second internal electrode layer 10b is designated as the second opposed portion 11b. The extending portion 12 of the second internal electrode layer 10b is designated as the second extending portion 12b. The second extending portion 12b is the portion that extends from the second opposed portion 11b to the second end face 62b of the laminate 2.

[0061] (Number of layers of the internal electrode layer)

[0062] For example, the internal electrode layer 10 can be set to 10 or more layers and 2000 or less layers. The number of layers of the internal electrode layer 10 is the number of layers including the number of layers of the first internal electrode layer 10a and the number of layers of the second internal electrode layer 10b.

[0063] (Thickness of the internal electrode layer)

[0064] For example, the thickness of the internal electrode layer 10 can be set to 0.1 μm or more and 5.0 μm or less, preferably 0.2 μm or more and 2.0 μm or less. When the thickness of the internal electrode layer 10 is 0.5 μm or more, the plating film becomes easy to grow when forming the metal layer of the external electrode 20 by plating.

[0065] (Material of the internal electrode layer)

[0066] For example, the material of the internal electrode layer 10 can be set to metals such as Ni, Cu, Ag, Pd, and Au, alloys of Ni and Cu, alloys of Ag and Pd, etc. In addition, the material of the internal electrode layer 10 may also contain dielectric particles of the same compositional system as the ceramic contained in the ceramic layer 4.

[0067] (Electrode opposed portion)

[0068] An explanation will be given for the division in the length direction L of the laminate 2. The laminate 2 can be divided in the length direction L into an electrode opposed portion 50 and an L gap 51. The electrode opposed portion 50 in the division of the length direction L is designated as the L opposed portion 50a. In addition, the L gap 51 includes a first L gap 51a and a second L gap 51b.

[0069] The L opposed portion 50a corresponds to the portion where the first internal electrode layer 10a and the second internal electrode layer 10b are opposed in the height direction T. A capacitor is formed in the L opposed portion 50a.

[0070] (L gap)

[0071] The L gap 51 is the portion where the first internal electrode layer 10a and the second internal electrode layer 10b are not opposed in the height direction T in the length direction L of the laminate 2. Among the L gaps 51, the first L gap 51a is between the L opposed portion 50a and the first end face 62a. The second L gap 51b is between the L opposed portion 50a and the second end face 62b.

[0072] In the first L gap 51a, the first internal electrode layer 10a is disposed in the height direction T, but the second internal electrode layer 10b is not disposed. In the second L gap 51b, the second internal electrode layer 10b is disposed in the height direction T, but the first internal electrode layer 10a is not disposed.

[0073] The first L gap 51a functions as an extraction portion of the first opposed portion 11a to the first end face 62a. The second L gap 51b functions as an extraction portion of the second opposed portion 11b to the second end face 62b.

[0074] For example, the length of the L gap 51 in the length direction L can be set to 10% or more and 30% or less of the length of the laminate 2 in the length direction L.

[0075] (External electrode)

[0076] The external electrode 20 includes a first external electrode 20a and a second external electrode 20b.

[0077] (The first external electrode)

[0078] The first external electrode 20a is the external electrode 20 disposed on the first end face 62a of the laminate 2. The first external electrode 20a is electrically connected to the first internal electrode layer 10a.

[0079] (The second external electrode)

[0080] The second external electrode 20b is the external electrode 20 disposed on the second end face 62b of the laminate 2. The second external electrode 20b is electrically connected to the second internal electrode layer 10b.

[0081] (External electrodes on each face)

[0082] The external electrode 20 extends from one end face 62 to a part of the two main faces 61 and a part of the two side faces 63.

[0083] (Layer structure of the external electrode)

[0084] Based on Figure 2 to describe the layer structure of the external electrode 20. The external electrode 20 includes a base layer 21 and a plating layer 23. The plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. These layers are arranged in the order of the base layer 21, the inner plating layer 23a, and the surface plating layer 23b starting from the end face 62 of the laminate 2.

[0085] (Base layer)

[0086] The base layer 21 is disposed on the end face 62 of the laminate 2 and covers the end face 62. The base layer 21 extends from the end face 62 to a part of the main face 61 and a part of the side face 63.

[0087] (Sintered layer)

[0088] The base layer 21 is configured as a sintered layer. The sintered layer contains a glass component and a metal. As the glass component, it contains at least one selected from B, Si, Ba, Mg, Al, Li, etc. As the metal, for example, it contains at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The sintered layer may also be a multi-layer.

[0089] (Plating layer)

[0090] The plating layer 23 on the base layer 21 will be described. As described above, in the present embodiment, the plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. When the plating layer 23 is a two-layer structure, preferably in the order of a Ni plating layer and a Sn plating layer from the lower layer. That is, the inner plating layer 23a becomes a Ni plating layer and the surface plating layer 23b becomes a Sn plating layer. When it is a three-layer structure, preferably in the order of a Sn plating layer, a Ni plating layer, and a Sn plating layer from the lower layer.

[0091] The Ni plating layer can prevent the base layer 21 from being eroded by the solder when mounting the multilayer ceramic electronic component 1. The Sn plating layer can improve the wettability of the solder when mounting the multilayer ceramic electronic component 1 and make the mounting easier. Therefore, by setting the surface plating layer 23b as a Sn plating layer, the wettability of the solder to the external electrode 20 can be improved. The thickness of each layer of the plating layer is preferably 3 μm or more and 9 μm or less.

[0092] (Internal structure of the laminate (WT section))

[0093] Based on Figure 3 , to describe the internal structure of the laminate 2. Figure 3 is Figure 1Cross-sectional view taken along line II-II of the multilayer ceramic electronic component 1 shown. The laminate 2 is divided in the width direction W into an electrode facing portion 50 and a W gap 52. The electrode facing portion 50 in the division in the width direction W is designated as the W facing portion 50b. Further, the W gap 52 includes a first W gap 52a and a second W gap 52b.

[0094] The W facing portion 50b is the portion where the internal electrode layers 10 face each other in the height direction T. The W gap 52 is the portion in the width direction W where neither the first internal electrode layer 10a nor the second internal electrode layer 10b is disposed in the height direction T.

[0095] Among the W gaps 52, the first W gap 52a is between the W facing portion 50b and the first side surface 63a in the width direction W of the laminate 2. The second W gap 52b is between the W facing portion 50b and the second side surface 63b.

[0096] The first W gap 52a and the second W gap 52b are arranged to sandwich the W facing portion 50b. The first W gap 52a and the second W gap 52b function as protective layers for the internal electrode layers 10.

[0097] For example, the length of the W gap 52 in the width direction W can be set to 20% or more and 30% or less of the length of the laminate 2 in the width direction W. Further, for example, the length of the W gap 52 in the width direction W can be set to 5 μm or more and 50 μm or less.

[0098] (Size of the multilayer ceramic electronic component)

[0099] The size of the multilayer ceramic electronic component 1 is not particularly limited. The size of the multilayer ceramic electronic component 1 can be set, for example, as follows. The dimension in the length direction L of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is designated as the L dimension. The L dimension is preferably 0.25 mm or more and 1.0 mm or less. The dimension in the height direction T of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is designated as the T dimension. The T dimension is preferably 0.125 mm or more and 0.5 mm or less. The dimension in the width direction W of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is designated as the W dimension. The W dimension is preferably 0.125 mm or more and 0.5 mm or less.

[0100] (Step layer)

[0101] In the multilayer ceramic electronic component 1 of the present embodiment, a step layer 5 is provided.

[0102] Preferably, the difference in the length in the height direction T of the laminate 2 in the electrode facing portion 50 and the L-gap 51 is small. However, in the inner layer portion 53, the lengths in the height direction T in the electrode facing portion 50 and the L-gap 51 are likely to be different. The laminated ceramic layer 4 and the internal electrode layer 10 are laminated in the electrode facing portion 50. In contrast, only the laminated ceramic layer 4 is laminated in the L-gap 51. The internal electrode layer 10 is not laminated in the L-gap 51. Therefore, the lengths in the height direction T in the electrode facing portion 50 and the L-gap 51 are likely to be different.

[0103] Then, in order to reduce the difference in the length in the height direction T between the electrode facing portion 50 and the L-gap 51, an additional ceramic layer 4 is disposed in the L-gap 51. This additional ceramic layer 4 is defined as the stepped layer 5. The stepped layer 5 preferably has the same composition as the ceramic layer 4. However, the composition of the ceramic layer 4 is not limited thereto.

[0104] (Configuration of the stepped layer)

[0105] Based on Figure 4 The configuration of the stepped layer 5 in the multilayer ceramic electronic component 1 of the present embodiment will be described. Figure 4 FIG. LT is a cross-sectional view of the laminate 2 included in the multilayer ceramic electronic component 1 of the present embodiment. Figure 4 Shows the cross-section of the laminate 2 at the position corresponding to Figure 1 the line I-I. The stepped layer 5 is disposed between the front end E in the length direction L of the internal electrode layer 10 and the end face 62. The stepped layer 5 includes a first stepped layer 5a and a second stepped layer 5b.

[0106] (First stepped layer)

[0107] The first stepped layer 5a is the stepped layer 5 disposed on the same plane as the second internal electrode layer 10b. The front end E on the first end face 62a side in the length direction L of the second internal electrode layer 10b is defined as the front end E1. The first stepped layer 5a is disposed in the length direction L between the front end E1 and the first end face 62a. Moreover, the first stepped layer 5a is exposed from the first end face 62a.

[0108] (Second stepped layer)

[0109] The second stepped layer 5b is the stepped layer 5 disposed on the same plane as the first internal electrode layer 10a. The front end E on the second end face 62b side in the length direction L of the first internal electrode layer 10a is defined as the front end E2. The second stepped layer 5b is disposed in the length direction L between the front end E2 and the second end face 62b. Moreover, the second stepped layer 5b is exposed from the second end face 62b.

[0110] As described above, a plurality of internal electrode layers 10 are laminated in the laminate 2. Further, the first stepped layer 5a and the second stepped layer 5b can be arranged for each internal electrode layer 10. Therefore, in one laminate 2, a plurality of first stepped layers 5a and second stepped layers 5b are arranged. Further, in Figure 4 two layers of the first stepped layer 5a and two layers of the second stepped layer 5b are respectively depicted. This is because Figure 4 is a schematic diagram for explanation. Therefore, Figure 4 it does not mean that the number of layers of the multilayer ceramic capacitor is limited to the number of layers depicted in Figure 4 .

[0111] (Thickness of the stepped layer)

[0112] The length in the height direction T of the stepped layer 5 is defined as the thickness of the stepped layer 5.

[0113] (Change in thickness)

[0114] Among the plurality of first stepped layers 5a, with respect to the thickness of the first stepped layer 5a, the first stepped layer 5a located closer to the first main surface 61a is thicker than the first stepped layer 5a located closer to the second main surface 61b.

[0115] The same applies to the second stepped layer 5b. Among the plurality of second stepped layers 5b, with respect to the thickness of the second stepped layer 5b, the second stepped layer 5b located closer to the first main surface 61a is thicker than the second stepped layer 5b located closer to the second main surface 61b.

[0116] In Figure 4 the thickness of the stepped layer 5 is represented as H. In Figure 4 , two of the first stepped layer 5a and two of the second stepped layer 5b are respectively shown. For the two first stepped layers 5a, the thickness of the first stepped layer 5a closer to the first main surface 61a is set as H2, and the thickness of the first stepped layer 5a closer to the second main surface 61b is set as H4. The thickness H2 is thicker than the thickness H4.

[0117] The same applies to the second stepped layer 5b. For the two second stepped layers 5b, the thickness of the second stepped layer 5b closer to the first main surface 61a is set as H1, and the thickness of the second stepped layer 5b closer to the second main surface 61b is set as H3. The thickness H1 is thicker than the thickness H3.

[0118] As described above, in the multilayer ceramic electronic component 1 of the present embodiment, the thickness in the height direction T of the ceramic layer 4 between the internal electrode layers 10 connected to the same external electrode 20 becomes thicker as it approaches the first main surface 61a.

[0119] When manufacturing the laminate 2, compared with the start of lamination, the end of lamination is more likely to cause bending of each layer due to the presence or absence of the internal electrode layer 10. In other words, at the end of lamination, the influence of the step caused by the presence or absence of the internal electrode layer 10 is greater. Here, the start of lamination corresponds to the second main surface 61b side. In addition, the end of lamination corresponds to the first main surface 61a side.

[0120] In the multilayer ceramic electronic component 1 of the present embodiment, a thicker step layer 5 is provided at the end of lamination. Thereby, the multilayer ceramic electronic component 1 can reduce the degree of bending of the laminate 2.

[0121] In addition, at the start of lamination, the step layer 5 can also not be formed. That is, in the height direction T of the laminate 2, the step layer 5 can also be locally formed in a part thereof. Thereby, the generation of steps in the laminate 2 can be more effectively suppressed.

[0122] (Comparison with the internal electrode layer)

[0123] Next, the relationship between the thickness H of the step layer 5 and the thickness of the internal electrode layer 10 will be described. In Figure 4 the thickness of the internal electrode layer 10 is represented as H. In the present embodiment, the thickness H of the step layer 5 is 20% or more and 120% or less of the thickness K of the internal electrode layer 10. Specifically, the thickness of the first step layer 5a is 20% or more and 120% or less of the thickness of the second internal electrode layer 10b. Similarly, the thickness of the second step layer 5b is 20% or more and 120% or less of the thickness of the first internal electrode layer 10a.

[0124] In Figure 4 the example shown, the thicknesses of the two first step layers 5a are the thickness H2 and the thickness H4. In addition, in Figure 4 the thickness of the second internal electrode layer 10b is shown as K2. The thicknesses H2 and H4 are 20% or more and 120% or less of the thickness K2.

[0125] The same applies to the second step layer 5b. Figure 4 The thicknesses of the two second step layers 5b shown in Figure 4 are the thickness H1 and the thickness H3. In addition, in

[0126] the thickness of the first internal electrode layer 10a is shown as K1. The thicknesses H1 and H3 are 20% or more and 120% or less of the thickness K1.

[0127] So far, the structure of the step layer 5 in the height direction T has been described. Next, the arrangement of the step layer 5 in the length direction L will be described.

[0128] (End face side)

[0129] The stepped layer 5 is exposed from the end face 62. Specifically, the first stepped layer 5a is exposed from the first end face 62a. In addition, the second stepped layer 5b is exposed from the second end face 62b.

[0130] (Inner electrode side)

[0131] One end of the stepped layer 5 on the side opposite to the end exposed from the end face 62 in the longitudinal direction L thereof is in contact with the front end E of the inner electrode layer 10 of the same layer as the stepped layer 5. The front end E of the inner electrode layer 10 refers to the end on the side opposite to the end exposed from the end face 62 in the longitudinal direction L of the inner electrode layer 10.

[0132] The front end E on the first end face 62a side of the second inner electrode layer 10b is defined as the front end E1. The first stepped layer 5a is in contact with the second inner electrode layer 10b at the front end E1 of the second inner electrode layer 10b.

[0133] Similarly, the front end E on the second end face 62b side of the first inner electrode layer 10a is defined as the front end E2. The second stepped layer 5b is in contact with the first inner electrode layer 10a at the front end E2 of the first inner electrode layer 10a.

[0134] (End portion in the L direction)

[0135] The end portion 47 in the L direction refers to a region that is 0 μm or more and 60 μm or less from the end in the L direction of the inner electrode layer 10 toward the end face 62 to which the inner electrode layer 10 is connected. That is, Figure 4 As shown, D1 is 0 μm or more and 60 μm or less.

[0136] Here, the thicknesses of the ceramic layer 4 and the stepped layer 5 between the first inner electrode layer 10a and the first inner electrode layer 10a on the side of the first main surface 61a adjacent thereto are set as D2. In addition, the thicknesses of the ceramic layer 4 and the stepped layer 5 between the first inner electrode layer 10a and the first inner electrode layer 10a on the side of the second main surface 61b adjacent thereto are set as D3. D2 is larger than D3. D2 gradually increases as it approaches the first main surface side.

[0137] (Coverage rate)

[0138] The coverage rate of the inner electrode layer 10 will be described. The coverage rate in the end portion 47 in the L direction of the inner electrode layer 10 is lower than the coverage rate in the opposed portion 11 of the inner electrode layer 10. Specifically, the coverage rate in the end portion 47 in the L direction of the first inner electrode layer 10a is lower than the coverage rate of the first opposed portion 11a of the first inner electrode layer 10a. In addition, the same applies to the second inner electrode layer 10b. The coverage rate in the end portion 47 in the L direction of the second inner electrode layer 10b is lower than the coverage rate of the second opposed portion 11b of the second inner electrode layer 10b.

[0139] (Additive concentration)

[0140] Further, in the L-direction end portion 47 of the internal electrode layer 10, the concentration of at least one additive selected from Ni, V, and Sn becomes lower when the internal electrode layer 10 is located closer to the second main surface 61b.

[0141] (Second Embodiment)

[0142] Based on Figure 5 and Figure 6 A second embodiment of the multilayer ceramic electronic component 1 of the present invention will be described. Figure 5 is an LT cross-sectional view of the laminate 2 in the second embodiment. Figure 5 corresponds to that in the first embodiment Figure 4 figure. Figure 6 is an LT cross-sectional view of a part of the multilayer ceramic electronic component 1 of the second embodiment. In the following description, the differences from the first embodiment will be mainly described.

[0143] In the first embodiment, as Figure 4 shown, the length in the height direction T of the stepped layer 5 varies according to the internal electrode layer 10. In contrast, in the second embodiment, as Figure 5 shown, the length in the length direction L of the stepped layer 5 varies according to the internal electrode layer 10.

[0144] (Distance between the stepped layer and the internal electrode layer)

[0145] The distance in the length direction L between the stepped layer 5 and the internal electrode layer 10 will be described. Of the two ends of the stepped layer 5 in the length direction L, the end on the side not exposed on the end face 62 is defined as the inner end Q of the stepped layer 5. Further, the distance in the length direction L between the front end E of the internal electrode layer 10 and the inner end Q of the stepped layer 5 disposed on the same layer as the internal electrode layer 10 is defined as J. This distance J becomes the distance in the length direction L between the stepped layer 5 and the internal electrode layer 10.

[0146] If the internal electrode layer 10 is located closer to the first main surface 61a, the distance J in the length direction L between the stepped layer 5 and the internal electrode layer 10 becomes farther.

[0147] Specifically, with respect to the distance J in the length direction L between the first stepped layer 5a and the second internal electrode layer 10b, the distance J in the length direction L between the first stepped layer 5a located closer to the first main surface 61a and the second internal electrode layer 10b becomes farther.

[0148] Similarly, with respect to the distance J in the longitudinal direction L between the second stepped layer 5b and the first internal electrode layer 10a, the distance J in the longitudinal direction between the second stepped layer 5b and the first internal electrode layer 10a at a position closer to the first main surface 61a becomes farther.

[0149] In Figure 5 two of the first stepped layer 5a and the second stepped layer 5b are respectively shown.

[0150] Regarding the two first stepped layers 5a, for the first stepped layer 5a on the side closer to the first main surface 61a, the distance J in the longitudinal direction L between the first stepped layer 5a and the second internal electrode layer 10b is defined as distance J2, and for the first stepped layer 5a on the side closer to the second main surface 61b, the distance J in the longitudinal direction L between the first stepped layer 5a and the second internal electrode layer 10b is defined as distance J4. The distance of distance J2 is farther than the distance of distance J4.

[0151] The same applies to the second stepped layer 5b. Regarding the two second stepped layers 5b, for the second stepped layer 5b on the side closer to the first main surface 61a, the distance J in the longitudinal direction L between the second stepped layer 5b and the first internal electrode layer 10a is defined as distance J1, and for the second stepped layer 5b on the side closer to the second main surface 61b, the distance J in the longitudinal direction L between the second stepped layer 5b and the first internal electrode layer 10a is defined as distance J3. The distance of distance J1 is farther than the distance of distance J3.

[0152] As described above, in the multilayer ceramic electronic component 1 of the present embodiment, the length of the stepped layer 5 becomes shorter as it approaches the first main surface 61a.

[0153] When manufacturing the laminate 2, compared with the start of lamination, bending of each layer caused by the presence or absence of the internal electrode layer 10 is more likely to occur on the side where lamination ends. In other words, on the side where lamination ends, the influence of the steps caused by the presence or absence of the internal electrode layer 10 becomes greater.

[0154] In addition, on the side where lamination ends, bending of each layer starts closer to the end face side.

[0155] In the multilayer ceramic electronic component 1 of the present embodiment, the length of the stepped layer 5 from the end face 62 becomes shorter on the side where lamination ends.

[0156] Thereby, the multilayer ceramic electronic component 1 can reduce the degree of bending of the laminate 2.

[0157] In addition, in the height direction T, overlap between the internal electrode layer 10 and the stepped layer 5 can be suppressed, improving the reliability of the multilayer ceramic electronic component 1.

[0158] (Ratio of the length of the clearance with L)

[0159] The ratio of the length in the length direction L of the step layer 5 to the length of the L-gap 51 is described.

[0160] In Figure 5 , the length in the length direction L of the step layer 5 is denoted by S. In addition, the length in the length direction L of the L-gap 51 is denoted by D5. The length S of the step layer 5 is 20% or more of the length D5 of the L-gap 51.

[0161] Specifically, the length S in the length direction L of the first step layer 5a is 20% or more of the distance in the length direction L between the front end E1 of the second internal electrode layer 10b and the first end face 62a, that is, the length D5 in the length direction L of the first L-gap 51a.

[0162] Similarly, the length S in the length direction L of the second step layer 5b is 20% or more of the distance in the length direction L between the front end E2 of the first internal electrode layer 10a and the second end face 62b, that is, the length D5 in the length direction L of the second L-gap 51b.

[0163] In Figure 5 , two of the first step layer 5a and two of the second step layer 5b are respectively shown.

[0164] Regarding the two first step layers 5a, for the first step layer 5a closer to the first main surface 61a, the length S in the length direction L is set as the length S2, and for the first step layer 5a closer to the second main surface 61b, the length S in the length direction L is set as the length S4. Both the length S2 and the length S4 are 20% or more of the length D5 in the length direction L of the first L-gap 51a.

[0165] The same applies to the second step layer 5b. Regarding the two second step layers 5b, for the second step layer 5b closer to the first main surface 61a, the length S in the length direction L is set as the length S1, and for the second step layer 5b closer to the second main surface 61b, the length S in the length direction L is set as the length S3. Both the length S1 and the length S3 are 20% or more of the length D5 in the length direction L of the second L-gap 51b.

[0166] (Bending portion)

[0167] Based on Figure 6 , the bending portion 40 of the internal electrode layer 10 is described. Figure 6 is an LT cross-sectional view of a part of the multilayer ceramic electronic component 1 of the second embodiment. Figure 6 Shows the first L-gap 51a etc. of the multilayer ceramic electronic component 1.

[0168] In the second embodiment, the internal electrode layer 10 has a bent portion 40. The bent portion 40 refers to a portion where the internal electrode layer 10 is bent toward the second main surface 61b in the extended portion 12 of the internal electrode layer 10.

[0169] In Figure 6 , the bent portion 40 of the first internal electrode layer 10a is shown. In Figure 6 , five bent portions 40 are shown. The reference numerals 41 to 45 are sequentially assigned to the five bent portions 40 in the direction from the first main surface 61a to the second main surface 61b.

[0170] (starting point of bending)

[0171] The starting point of the bending of the bent portion 40 is set as point F, and the ending point of the bending of the bent portion 40 is set as point G. The starting point of bending is the point where the internal electrode layer 10a starts to bend toward the second main surface 61b in the extended portion 12. In Figure 6 , for each bent portion 40, the point F as the starting point of bending is denoted as points F1 to F5.

[0172] (ending point of bending)

[0173] The ending point of bending is the point where the bent portion 40 of the internal electrode layer 10 contacts the end surface 62. In the structure shown in Figure 6 , the ending point of bending becomes the point where the first internal electrode layer 10a contacts the first end surface 62a. In Figure 6 , for each bent portion 40, the point G as the ending point of bending is denoted as points G1 to G5.

[0174] (length of bent portion)

[0175] The length M of the bent portion 40 will be described. The length M of the bent portion 40 is the distance in the length direction L between the starting point G and the ending point G of the bending.

[0176] In Figure 6 , for each bent portion 40, the length M of the bent portion 40 is denoted as lengths M1 to M5. The closer the internal electrode layer 10 is to the second main surface 61b, the shorter the length M of the bent portion 40 becomes. That is, the lengths M become shorter in the order of lengths M1 to M5.

[0177] (height of bent portion)

[0178] The height N of the bent portion 40 will be described. The height N of the bent portion 40 is the distance in the height direction T between the starting point G and the ending point G of the bending.

[0179] In Figure 6In this case, for each bent portion 40, the height N of the bent portion 40 is expressed as heights N1 to N5. The closer the internal electrode layer 10 is to the second main surface 61b, the lower the height N of the bent portion 40 becomes. That is, the height N decreases in the order of height N1 to height N5.

[0180] (Third Embodiment)

[0181] Based on Figures 7 to 11 A third embodiment of the multilayer ceramic electronic component 1 of the present invention will be described. In the following description, the differences from the first embodiment and the second embodiment will be mainly described.

[0182] In the first embodiment and the second embodiment, the case where the multilayer ceramic electronic component 1 is a two-terminal multilayer ceramic capacitor has been described. However, the multilayer ceramic electronic component 1 is not limited to a two-terminal multilayer ceramic capacitor. The multilayer ceramic electronic component 1 can also be a multi-terminal multilayer ceramic capacitor having three or more terminals. In the third embodiment, the case where the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor will be described.

[0183] (Outline of Multilayer Ceramic Electronic Component)

[0184] Based on Figure 7 , the outline of the structure of the multilayer ceramic electronic component 1 will be described.

[0185] Figure 7 is a perspective view showing the multilayer ceramic electronic component 1 of the present embodiment. As Figure 7 shown, in the multilayer ceramic electronic component 1 of the third embodiment, external electrodes 20 are also formed on two side surfaces 63 in addition to two end surfaces 62. The external electrode 20 formed on the side surface 63 is defined as a side external electrode 30. The side external electrode 30 includes a first side external electrode 30a and a second side external electrode 30b. The first side external electrode 30a is formed on the first side surface 63a. The second side external electrode 30b is formed on the second side surface 63b.

[0186] In the multilayer ceramic electronic component 1 of the present embodiment, in addition to two end surfaces 62, the connection between the internal electrode layer 10 and the external electrode 20 can also be made on two side surfaces 63.

[0187] (LT Cross-Sectional Layer)

[0188] Based on Figure 8 , the LT cross-section of the multilayer ceramic electronic component 1 will be described. Figure 8 is Figure 7 a cross-sectional view taken along line III-III.

[0189] As Figure 8As shown, in the laminate 2, a plurality of end-face exposed electrode layers 10c and a plurality of side-face exposed electrode layers 10d are laminated with the inner ceramic layer 4a therebetween. The end-face exposed electrode layer 10c is connected to the first external electrode 20a at the first end face 62a. In addition, the end-face exposed electrode layer 10c is connected to the second external electrode 20b at the second end face 62b.

[0190] On the other hand, the side-face exposed electrode layer 10d is not connected to the external electrode 20 at any end face 62.

[0191] In the three-terminal multilayer ceramic capacitor, the end-face exposed electrode layer 10c functions as a through electrode. In addition, the side-face exposed electrode layer 10d functions as a ground electrode.

[0192] (WT cross-sectional layer)

[0193] Based on Figure 9 , the WT cross-section of the multilayer ceramic electronic component 1 will be described. Figure 9 is Figure 7 the IV-IV line cross-sectional view.

[0194] As Figure 9 shown, the side-face exposed electrode layer 10d is connected to the first side external electrode 30a at the first side face 63a. In addition, the side-face exposed electrode layer 10d is connected to the second side external electrode 30b at the second side face 63b.

[0195] On the other hand, the end-face exposed electrode layer 10c is not connected to the external electrode 20 at any side face 63.

[0196] (Planar structure of the internal electrode layer)

[0197] Based on Figure 10 and Figure 11 , the planar structures of the end-face exposed electrode layer 10c and the side-face exposed electrode layer 10d will be described. Here, the planar structure means the structure when observing the internal electrode layer 10 in the height direction T of the multilayer ceramic electronic component 1.

[0198] (End-face exposed electrode layer)

[0199] Based on Figure 10 , the end-face exposed electrode layer 10c will be described. Figure 10 is Figure 7 the V-V line cross-sectional view. Figure 10 The planar structure of the end-face exposed electrode layer 10c is shown.

[0200] At the portion of the end-face exposed electrode layer 10c exposed at the first end face 62a, a first end-face extension portion 12c is provided. In addition, at the portion of the end-face exposed electrode layer 10c exposed at the second end face 62b, a second end-face extension portion 12d is provided.

[0201] The opposing portion 11 of the end face exposed electrode layer 10c is connected to the first end face 62a via the first end face extension portion 12c. In addition, the opposing portion 11 of the end face exposed electrode layer 10c is connected to the second end face 62b via the second end face extension portion 12d.

[0202] In Figure 10 , the end face exposed electrode layer 10c is illustrated as a rectangular shape, but the widths in the width direction W of the opposing portion 11 and the end face vertical portions, that is, the first end face extension portion 12c and the second end face extension portion 12d, may also be the same.

[0203] (Side face exposed electrode layer)

[0204] Based on Figure 11 the side face exposed electrode layer 10d will be described. Figure 11 is Figure 7 a sectional view taken along the V-V line of Figure 11 shows the planar structure of the side face exposed electrode layer 10d.

[0205] A first side face extension portion 12e is provided in the portion of the side face exposed electrode layer 10d that is exposed on the first side face 63a. In addition, a second side face extension portion 12f is provided in the portion of the side face exposed electrode layer 10d that is exposed on the second side face 63b. The opposing portion 11 of the side face exposed electrode layer 10d is connected to the first side face 63a via the first side face extension portion 12e. In addition, the opposing portion 11 of the side face exposed electrode layer 10d is connected to the second side face 63b via the second side face extension portion 12f.

[0206] (Definition of regions)

[0207] In the end face exposed electrode layer 10c, the region corresponding to the region where the first side face extension portion 12e is provided in the side face exposed electrode layer 10d is defined as the third W gap 52c. In addition, similarly, in the end face exposed electrode layer 10c, the region corresponding to the region where the second side face extension portion 12f is provided in the side face exposed electrode layer 10d is defined as the fourth W gap 52d.

[0208] In addition, in the side face exposed electrode layer 10d, the region corresponding to the region where the first end face extension portion 12c is provided in the end face exposed electrode layer 10c is defined as the third L gap 51c. In addition, similarly, in the side face exposed electrode layer 10d, the region corresponding to the region where the second end face extension portion 12d is provided in the end face exposed electrode layer 10c is defined as the fourth L gap 51d.

[0209] In the longitudinal direction L of the laminate 2, the extended region 55 provided with the first side surface extension 12e is defined as the first L extended region 55c. Similarly, in the longitudinal direction L of the laminate 2, the extended region 55 provided with the second side surface extension 12f is defined as the second L extended region 55d.

[0210] In addition, in the width direction W of the laminate 2, the extended region 55 provided with the first end surface extension 12c is defined as the first W extended region 55a. Similarly, in the width direction W of the laminate 2, the extended region 55 provided with the second end surface extension 12d is defined as the second W extended region 55b.

[0211] (Step layer)

[0212] Even if the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor, the step layer 5 is arranged in the same manner as in the case of the two-terminal multilayer ceramic capacitor. By appropriately arranging the step layer 5, it is possible to suppress the non-uniformity of the thickness in the height direction T of the laminate 2 caused by the first end surface extension 12c, the second end surface extension 12d, the first side surface extension 12e, and the second side surface extension 12f.

[0213] (End surface step layer)

[0214] In the present embodiment, the step layer 5 includes an end surface step layer 5c and a side surface step layer 5d.

[0215] The end surface step layer 5c can be used to eliminate the steps caused by the first end surface extension 12c and the second end surface extension 12d of the end surface exposed electrode layer 10c.

[0216] The side surface exposed electrode layer 10d does not have electrodes at positions corresponding to the first end surface extension 12c and the second end surface extension 12d. Thus, in the same layer as the side surface exposed electrode layer 10d, the end surface step layer 5c is arranged at positions corresponding to the first end surface extension 12c and the second end surface extension 12d. Thereby, the non-uniformity in the height direction T of the laminate 2 can be suppressed.

[0217] In the same layer as the side surface exposed electrode layer 10d, the regions where the end surface step layer 5c is preferably arranged are the following two. One is Figure 11 the overlapping part of the third L gap 51c and the first W extended region 55a in

[0218] The end surface step layer 5c arranged in this part reduces the height non-uniformity caused by the absence of the first end surface extension 12c in the side surface exposed electrode layer 10d. Figure 11The overlapping portion of the 4L gap 51d and the 2W extended region 55b. The end face step layer 5c disposed in this portion reduces the height non-uniformity caused by the side exposed electrode layer 10d not having the second end face extension 12d.

[0219] (Side step layer)

[0220] Next, the side step layer 5d will be described.

[0221] The side step layer 5d can be used to eliminate the steps caused by the first side extension 12e and the second side extension 12f of the side exposed electrode layer 10d.

[0222] The end face exposed electrode layer 10c does not have electrodes at positions corresponding to the first side extension 12e and positions corresponding to the second side extension 12f.

[0223] Therefore, in the same layer as the end face exposed electrode layer 10c, the side step layer 5d is disposed at positions corresponding to the first side extension 12e and positions corresponding to the second side extension 12f. Thereby, the non-uniformity in the height direction T of the stacked body 2 can be suppressed.

[0224] In the same layer as the end face exposed electrode layer 10c, the regions where the side step layer 5d is preferably disposed are the following two. One is Figure 10 The overlapping portion of the 3W gap 52c and the 1L extended region 55c. The side step layer 5d disposed in this portion reduces the height non-uniformity caused by the end face exposed electrode layer 10c not having the first side extension 12e.

[0225] The other is Figure 10 The overlapping portion of the 4W gap 52d and the 2L extended region 55d. The side step layer 5d disposed in this portion reduces the height non-uniformity caused by the end face exposed electrode layer 10c not having the second side extension 12f.

[0226] In addition, the end face step layer 5c and the side step layer 5d can be disposed in the same form as the first step layer 5a and the second step layer 5b described in the first embodiment and the second embodiment.

[0227] Furthermore, in the first embodiment and the second embodiment, the form of the step layer 5 and the like have been described by taking the vicinity of the end face 62 as an example. The form of the step layer 5 described based on this end face 62 is applicable not only to the end face step layer 5c of the third embodiment but also to the side step layer 5d.

[0228] In addition, a side step layer 5d can be provided in the same layer as the side exposed electrode layer 10d. When the side step layer 5d is provided in the same layer as the side exposed electrode layer 10d, the distance between the electrode layer 10 and the step layer 5 can be set to the distance in the length direction L of the adjacent side extension portions 12e and 12f and the side step layer 5d. In addition, the distance between the electrode layer 10 and the step layer 5 can be set to the distance in the width direction W of the opposing portion 11 of the adjacent side exposed electrode layer 10d and the side step layer 5d.

[0229] Similarly, an end face step layer 5c can be provided in the same layer as the end face exposed electrode layer 10c. When the end face step layer 5c is provided in the same layer as the end face exposed electrode layer 10c, the distance between the electrode layer 10 and the step layer 5 can be set to the distance in the length direction L of the adjacent opposing portion 11 of the end face exposed electrode layer 10c and the end face step layer 5c. In addition, the distance between the electrode layer 10 and the step layer 5 can be set to the distance in the width direction W of the adjacent end face extension portions 12c and 12d and the end face step layer 5c.

[0230] (Combination of Embodiments)

[0231] The above-described embodiments can also be combined.

[0232] In the first embodiment, the thickness in the height direction T of the step layer 5 was mainly described. On the other hand, in the second embodiment, the length in the length direction T of the step layer 5 was mainly described. For example, it is also possible to make the thickness in the height direction T of the step layer 5 as in the first embodiment and make the length in the length direction T of the step layer 5 as in the second embodiment.

[0233] In addition, as described above, in the third embodiment, the step layer 5 of the first embodiment or the second embodiment can be applied to at least one of the end face exposed electrode layer 10c and the side exposed electrode layer 10d. In addition, in the third embodiment, the step layer 5 of the first embodiment can be applied to one of the end face exposed electrode layer 10c and the side exposed electrode layer 10d, and the step layer 5 of the second embodiment can be applied to the remaining other one. In addition, in the third embodiment, the step layer 5 combining the first embodiment and the second embodiment can be applied to at least one of the end face exposed electrode layer 10c and the side exposed electrode layer 10d.

[0234] In this way, the above-described embodiments can be combined in various ways.

[0235] (Manufacturing Method of Multilayer Ceramic Electronic Component)

[0236] The manufacturing method of the multilayer ceramic electronic component 1 will be described.

[0237] (Fabrication of laminated block)

[0238] Prepare a green ceramic sheet, an electrode paste for the internal electrode layer 10, and a step paste for the step layer 5.

[0239] (Coating of paste)

[0240] Apply the electrode paste and the step paste on the green ceramic sheet in a desired pattern. The application of each paste to the green ceramic sheet can be performed, for example, by methods such as screen printing or gravure printing. Using an arbitrary printing method, print the electrode paste and the step paste on the green ceramic sheet in a given pattern. Thus, a green ceramic sheet for the inner layer portion 53 printed with the paste is obtained. Regarding the control of the thickness of the step layer, it can be made thinner by reducing the amount of the applied step paste.

[0241] (Lamination)

[0242] Stack a given number of green ceramic sheets on which the pattern of the internal electrode layer 10 is not printed. Thus, a portion corresponding to the outer layer portion 54 is fabricated. On it, stack the green ceramic sheets for the inner layer portion 53 coated with the paste in sequence. Thus, a portion corresponding to the inner layer portion 53 is laminated. Further, on it, stack a given number of green ceramic sheets for another outer layer portion 54. Thus, a laminated sheet is fabricated. Press the laminated sheet in the height direction by methods such as isostatic pressing to fabricate a laminated block.

[0243] (Fabrication of laminated chip)

[0244] Cut the laminated block into a given size to cut out laminated chips. At this time, the corners and edges of the laminated chips can also be rounded by barrel polishing or the like.

[0245] (Firing)

[0246] Next, fire the laminated chips to fabricate a laminate 2. The firing temperature also depends on the materials of the ceramic layer 4 and the internal electrode layer 10, but is preferably 900 °C or higher and 1400 °C or lower.

[0247] (External electrode)

[0248] Next, form an external electrode 20.

[0249] (Base layer)

[0250] Apply a conductive paste that becomes the base layer 21 on the two end faces 62 of the laminate 2 to form the base layer 21.

[0251] In addition, in order to form the sintered layer, a conductive paste containing a glass component and a metal is applied by means of impregnation or the like. After that, a sintering process is performed to form the base layer 21. The temperature of the sintering process is preferably 500°C or higher and 900°C or lower. In addition, the time of the sintering process is preferably 30 minutes or longer and 2 hours or shorter. In addition, the atmosphere of the sintering process is preferably a reducing atmosphere containing, for example, H 2 O and H 2 .

[0252] Next, a plating layer 23 is formed on the surface of the base layer 21. In the present embodiment, a Ni plating layer is formed on the sintered layer. This Ni plating layer becomes the inner plating layer 23a. Next, a Sn plating layer is formed on the Ni plating layer. This Sn plating layer becomes the surface plating layer 23b. For example, by means of barrel plating, the Ni plating layer and the Sn plating layer are formed in sequence. In this way, the multilayer ceramic electronic component 1 can be obtained.

[0253] In addition, in the case of manufacturing a three-terminal multilayer ceramic capacitor, external electrodes 20 are formed not only on the two end faces 62 of the laminate 2 but also on the two side faces 63.

[0254] (Method for measuring thickness)

[0255] As a method for measuring the length, thickness, etc. of the ceramic layer 4, the internal electrode layer 10, etc., for example, a method of observing the cross-section of the laminate 2 exposed by polishing using a scanning electron microscope can be cited. In addition, each value can be set as the average value of the measured values at a plurality of places corresponding to the part to be measured.

[0256] In addition, the length of each part of the laminate 2, etc. can be measured using a micrometer or an optical microscope. The stepped layer becomes thicker as it approaches the first main surface. At this time, the thickness increases as it approaches the first main surface between the first internal electrode layer and the first internal electrode layer closest to the first main surface side.

[0257] (Method for measuring coverage rate)

[0258] For example, the coverage rate can be measured as follows.

[0259] Inside the internal electrode layer 10, there is a part containing voids without metal. In the internal electrode layer 10, the proportion of metal is defined as the coverage rate. However, when the internal electrode layer 10 and the ceramic layer 4 are laminated, sometimes the ceramic material fills a part of the voids in the internal electrode layer 10. Therefore, the definition of the coverage rate is set as metal / (metal + (void or ceramic material)).

[0260] That is, the entire internal electrode layer 10 is set to the sum of (i) a metal, (ii) a portion that is an unfilled ceramic material and exists as a cavity, and (iii) a portion in which the cavity is filled with a ceramic material. Further, the ratio of the metal (i) to the entire internal electrode layer 10 is defined as the coverage ratio.

[0261] Specifically, the coverage ratio can be measured by the following method.

[0262] First, laminate 2 is polished to expose the cross-section at the location where the coverage ratio is to be measured. Then, the exposed cross-section is observed using an optical microscope or the like, and the area of the metal within a given range is determined. Based on the determined area, the coverage ratio is calculated. Additionally, the coverage ratio can also be taken as the average of values determined at multiple locations.

[0263] The embodiments of the present invention have been described above, but the present invention is not limited to the foregoing embodiments, and various modifications and variations can be made.

[0264] <1>

[0265] A multilayer ceramic electronic component includes a laminate, a first external electrode, and a second external electrode.

[0266] The laminate includes a plurality of ceramic layers laminated, and includes:

[0267] A first main surface and a second main surface that face each other in the height direction;

[0268] A first side surface and a second side surface that face each other in the width direction orthogonal to the height direction;

[0269] A first end surface and a second end surface that face each other in the length direction orthogonal to the height direction and the width direction;

[0270] A first internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the first end surface;

[0271] A second internal electrode layer, laminated alternately with the plurality of ceramic layers, and exposed at the second end surface;

[0272] A first stepped layer, disposed on the same plane as the second internal electrode layer, and exposed at the first end surface; and

[0273] A second stepped layer, disposed on the same plane as the first internal electrode layer, and exposed at the second end surface.

[0274] The first external electrode is provided at the first end surface.

[0275] The second external electrode is provided at the second end surface.

[0276] Regarding the thickness in the height direction of the laminate of the first stepped layer, the first stepped layer located closer to the first main surface becomes thicker.

[0277] Regarding the thickness in the height direction of the laminate of the second stepped layer, the second stepped layer located closer to the first main surface becomes thicker.

[0278] <2>

[0279] The multilayer ceramic electronic component according to <1>, wherein

[0280] The thickness of the first stepped layer is 20% or more and 120% or less of the thickness of the second internal electrode layer.

[0281] The thickness of the second stepped layer is 20% or more and 120% or less of the thickness of the first internal electrode layer.

[0282] <3>

[0283] The multilayer ceramic electronic component according to <1> or <2>, wherein

[0284] The first internal electrode layer and the second stepped layer are in contact with each other.

[0285] The second internal electrode layer and the first stepped layer are in contact with each other.

[0286] <4>

[0287] The multilayer ceramic electronic component according to any one of <1> to <3>, wherein

[0288] When a region of 0 μm or more and 60 μm or less in the direction from the front end in the length direction of the first internal electrode layer to the first end face and a region of 0 μm or more and 60 μm or less in the direction from the front end in the length direction of the second internal electrode layer to the second end face are defined as the L-direction end portions,

[0289] The coverage rate of the L-direction end portion is lower than the coverage rate of the opposing portion of the first internal electrode layer.

[0290] The coverage rate of the L-direction end portion is lower than the coverage rate of the opposing portion of the second internal electrode layer.

[0291] <5>

[0292] The multilayer ceramic electronic component according to <4>, wherein

[0293] In the L-direction end portion, regarding the concentration of at least one additive selected from Ni, V, and Sn, one of the internal electrode layers located closer to the second main surface becomes lower.

[0294] <6>

[0295] A multilayer ceramic electronic component includes a laminate, a first external electrode, and a second external electrode.

[0296] The laminate includes a plurality of ceramic layers laminated thereon and includes:

[0297] a first main surface and a second main surface that face each other in the height direction;

[0298] a first side surface and a second side surface that face each other in the width direction orthogonal to the height direction;

[0299] a first end surface and a second end surface that face each other in the length direction orthogonal to the height direction and the width direction;

[0300] an end surface exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and exposed at the first end surface and the second end surface;

[0301] a side surface exposed electrode layer as an internal electrode layer, which is laminated alternately with the plurality of ceramic layers and exposed at the first side surface and the second side surface;

[0302] a side surface step layer, which is disposed on the same surface as the end surface exposed electrode layer and exposed at the first side surface and the second side surface; and

[0303] an end surface step layer, which is disposed on the same surface as the side surface exposed electrode layer and exposed at the first end surface and the second end surface,

[0304] The first external electrode is provided on the first end surface and the second end surface,

[0305] The second external electrode is provided on the first side surface and the second side surface,

[0306] Regarding the thickness of the laminate in the height direction of the side surface step layer, the side surface step layer located closer to the first main surface becomes thicker,

[0307] Regarding the thickness of the laminate in the height direction of the end surface step layer, the end surface step layer located closer to the first main surface becomes thicker.

[0308] Description of Reference Numerals

[0309] 1 Multilayer ceramic electronic component

[0310] 2 Laminate

[0311] 4 Ceramic layer

[0312] 5 Step layer

[0313] 10 Inner electrode layer

[0314] 11 Opposing portion

[0315] 12 Extension portion

[0316] 20 Outer electrode

[0317] 21 Base layer

[0318] 23 Plated layer

[0319] 30 Side outer electrode

[0320] 40 Bending portion

[0321] 41 - 45 First bending portion - Fifth bending portion

[0322] 47 End portion in the L direction

[0323] 50 Electrode opposing portion

[0324] 51 L gap

[0325] 52 W gap

[0326] 53 Inner layer portion

[0327] 54 Outer layer portion

[0328] 55 Extension region

[0329] 61 Main surface

[0330] 62 End face

[0331] 63 Side face

[0332] T Height direction

[0333] L Length direction

[0334] W Width direction.

Claims

1. A multilayer ceramic electronic component comprising a laminate, a first external electrode, and a second external electrode, wherein the laminate includes a plurality of ceramic layers laminated thereon and includes: a first main surface and a second main surface opposite to each other in the height direction; a first side surface and a second side surface opposite to each other in the width direction orthogonal to the height direction; a first end surface and a second end surface opposite to each other in the length direction orthogonal to the height direction and the width direction; a first internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the first end surface; a second internal electrode layer laminated alternately with the plurality of ceramic layers and exposed at the second end surface; a first stepped layer disposed on the same plane as the second internal electrode layer and exposed at the first end surface; and a second stepped layer disposed on the same plane as the first internal electrode layer and exposed at the second end surface, wherein the first external electrode is provided on the first end surface, the second external electrode is provided on the second end surface, with respect to the thickness of the laminate in the height direction of the first stepped layer, the first stepped layer at a position closer to the first main surface becomes thicker, with respect to the thickness of the laminate in the height direction of the second stepped layer, the second stepped layer at a position closer to the first main surface becomes thicker.

2. The multilayer ceramic electronic component according to claim 1, wherein the thickness of the first stepped layer is 20% or more and 120% or less of the thickness of the second internal electrode layer, the thickness of the second stepped layer is 20% or more and 120% or less of the thickness of the first internal electrode layer.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein the first internal electrode layer and the second stepped layer are in contact with each other, the second internal electrode layer and the first stepped layer are in contact with each other.

4. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein when a region of 0 μm or more and 60 μm or less in the direction from the front end in the length direction of the first internal electrode layer to the first end surface and a region of 0 μm or more and 60 μm or less in the direction from the front end in the length direction of the second internal electrode layer to the second end surface are defined as the L-direction end portions, the coverage rate of the L-direction end portions is lower than the coverage rate of the opposing portion of the first internal electrode layer, the coverage rate of the L-direction end portions is lower than the coverage rate of the opposing portion of the second internal electrode layer.

5. The multilayer ceramic electronic component according to claim 4, wherein in the L-direction end portions, with respect to the concentration of at least one additive selected from Ni, V, and Sn, one of the internal electrode layers at a position closer to the second main surface becomes lower.

6. A multilayer ceramic electronic component comprising a laminate, a first external electrode, and a second external electrode, wherein the laminate includes a plurality of ceramic layers laminated thereon and includes: a first main surface and a second main surface opposite to each other in the height direction; a first side surface and a second side surface opposite to each other in the width direction orthogonal to the height direction; a first end surface and a second end surface opposite to each other in the length direction orthogonal to the height direction and the width direction; The end-face exposed electrode layer as the internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first end face and the second end face; The side-face exposed electrode layer as the internal electrode layer is alternately laminated with the plurality of ceramic layers and is exposed at the first side face and the second side face; The side-step layer is disposed on the same plane as the end-face exposed electrode layer and is exposed at the first side face and the second side face; and The end-step layer is disposed on the same plane as the side-face exposed electrode layer and is exposed at the first end face and the second end face, The first external electrode is provided at the first end face and the second end face, The second external electrode is provided at the first side face and the second side face, Regarding the thickness of the laminate in the height direction of the side-step layer, the side-step layer located closer to the first main surface becomes thicker, Regarding the thickness of the laminate in the height direction of the end-step layer, the end-step layer located closer to the first main surface becomes thicker.

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