Dustproof welding device for semiconductor equipment rack plate accessory

Abstract

The invention belongs to the technical field of semiconductor equipment rack welding, and particularly relates to a dustproof welding device for a semiconductor equipment rack plate accessory. The dustproof welding device for the semiconductor equipment rack plate accessory comprises an air inlet piece, a plurality of sets of air grooves are formed in the air inlet piece, one ends of the air grooves extend to the side wall of the air inlet piece, and the other ends of the air grooves converge at the air inlet ends of positioning cylinders on the air inlet piece; the air inlet piece is matched with the plate accessory, and the positioning cylinder is matched with a screw hole in the plate accessory. According to the device, protective gas entering the welding cavity can form gas flow passing through a welding spot, so that smoke dust generated when a plate accessory is welded on a square pipe enters the gas inlet channel along with the gas flow and is guided by the gas exhaust assembly to be collected, the smoke dust cannot be diffused, and a clean shed does not need to be built on a semiconductor equipment site.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment frame welding, and particularly relates to a dust-proof welding device for semiconductor equipment frame plate accessories. Background Art

[0002] The frames of semiconductor equipment are mostly of a frame structure as shown in the publication (announcement) number CN221226174U. Since various components need to be installed in the frame, in addition to the welding of square tubes, various mounting plates with threaded holes such as support foot mounting plates, component mounting plates, and cylinder mounting seats need to be welded on the square tubes, that is, plate accessories.

[0003] The frames of semiconductor equipment are relatively large. As described in the publication (announcement) number CN117428295B, when choosing on-site welding, it is necessary to minimize the impact on the on-site cleanliness as much as possible, including but not limited to performing welding operations in a clean booth. For reducing the impact of welding on on-site cleanliness, essentially it is to inhibit the diffusion of welding-generated fumes at the site. However, there are few dust-proof welding devices that can inhibit the diffusion of welding-generated fumes during the welding of plate accessories and the frame, that is, square tubes. When fabricating the frame of semiconductor equipment on-site, it is necessary to build a clean booth large enough to accommodate the frame on-site. Summary of the Invention

[0004] The purpose of the present invention is to provide a dust-proof welding device for semiconductor equipment frame plate accessories to solve the technical problem that when the plate accessories are welded to the frame of semiconductor equipment currently, the fumes will spread around, affecting the on-site cleanliness.

[0005] To solve the above technical problems, the present invention provides a dust-proof welding device for semiconductor equipment frame plate accessories, including: an air intake piece, on which there are several groups of air grooves with one end extending to the side wall of the air intake piece and the other end converging to the air intake ends of the respective positioning cylinders thereon; the air intake piece is adapted to the plate accessory, and the positioning cylinder is adapted to the threaded hole on the plate accessory, so that when the pressing plate assembly holding the square tube presses the air extraction assembly placed on the plate accessory and extending into the air intake ends of the respective positioning cylinders together with the plate accessory and the air intake piece onto the square tube, the side wall of the air intake piece forms a welding groove with the plate accessories and the square tube on both sides thereof, and the plate accessory covers each air groove to form a corresponding air intake passage; the air extraction assembly is adapted to open the air intake passage corresponding to the welded welding groove for air extraction when the welding head in the welding assembly connected to the pressing plate assembly blows protective gas into the welding cavity formed by covering the welding groove and moves the welding head for welding, so that the protective gas entering the welding cavity forms an air flow passing through the welding point.

[0006] The beneficial effects of the present invention are as follows. After the pressing plate assembly of the dust-proof welding device for the semiconductor equipment rack board attachment holds the square tube, it can press the air intake piece, the board attachment, and the air extraction assembly placed at the position where the board attachment needs to be welded on the square tube onto the square tube, so that the board attachment covers the air slots on the air intake piece to form an air intake passage. At the same time, the side wall of the air intake piece forms a welding groove with the board attachment and the square tube. In this way, the welding head in the welding assembly can blow protective gas into the welding cavity formed by covering the welding groove, and when welding while moving the welding groove, at the air intake end of the positioning cylinder, that is, at the air intake passage, the air extraction assembly corresponding to the welded welding groove is opened and air is extracted, so that the protective gas entering the welding cavity forms an air flow passing through the welding point. Thus, the dust generated when the board attachment is welded to the square tube enters the air intake passage along with this air flow and is collected under the guidance of the air extraction assembly, and the dust will not spread, and there is no need to build a clean shed on the site of the semiconductor equipment anymore. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the specific embodiments or the prior description. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0008] Figure 1 is an exploded view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention; Figure 2 is a schematic structural view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention Figure 1 ; Figure 3 is a schematic structural view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention Figure 2 ; Figure 4 is Figure 3 an enlarged view of part A in Figure 5 is a schematic structural view when the board attachment of the present invention covers the air intake piece; Figure 6 is a schematic structural view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention Figure 3 ; Figure 7 is a schematic structural view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention Figure 4 ; Figure 8 is a schematic structural view of the dust-proof welding device for the semiconductor equipment rack board attachment of the present invention Figure 5 ; Figure 9Schematic structure of the dust-proof welding device for the semiconductor equipment frame board accessory of the present invention Figure 6 ; Figure 10 Schematic structure diagram of the cover part of the dust-proof welding device for the semiconductor equipment frame board accessory of the present invention forming a blowing gap; Figure 11 Schematic structure of the welding head of the dust-proof welding device for the semiconductor equipment frame board accessory of the present invention Figure 1 ; Figure 12 Schematic structure of the welding head of the dust-proof welding device for the semiconductor equipment frame board accessory of the present invention Figure 2 ; Figure 13 Schematic structure of the dust-proof welding device for the semiconductor equipment frame board accessory of the present invention Figure 7 ; In the figure: Air inlet piece 100, positioning cylinder 110, air groove 120, board accessory 200, screw hole 210, pressing plate assembly 300, U-shaped plate 310, side clamping screw 311, bottom plate 320, lower clamping screw 321, pressing plate arm 330, pressing plate screw 331, air extraction assembly 400, air extraction base plate 410, rotating seat 420, air extraction pipe 430, air extraction hole 431, rotating driving part 440, air extraction hose clamping table 451, air extraction hose 452, rotating buffer section 453, welding groove 500, air inlet channel 600, air extraction port 610, welding assembly 700, upper welding head guide rail 710, straight part upper guide groove 711, lower welding head guide rail 720, straight part lower guide groove 721, welding trolley guide rail 730, welding head straight part accommodation cavity 740, welding head head accommodation cavity 750, welding trolley 760, sealing ring 770, track limit clamp 780, welding head 800, welding cavity 810, straight part 820, straight part air flow guide groove 821, tail part 830, head part 840, cover part 850, cover part air flow guide groove 851, gap blowing hole 852, blowing gap 860, blowing cover 870, blowing joint 880. Detailed implementation manners

[0009] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0010] Embodiment As Figure 1 shown, the present invention provides a dust-proof welding device for semiconductor equipment frame board accessories, including: air inlet piece 100, combined with Figure 5, on which there are several groups of air grooves 120 with one end extending to the side wall of the intake fin 100 and the other end converging to the intake end of each positioning cylinder 110 thereon; combined with Figure 1 and Figure 2 , the intake fin 100 is adapted to the plate accessory 200, and the positioning cylinder 110 is adapted to the screw hole 210 on the plate accessory 200. When the pressing plate assembly 300 that holds the square tube presses the air extraction assembly 400 placed on the plate accessory 200 and extending into the intake end of each positioning cylinder 110, together with the plate accessory 200 and the intake fin 100, onto the square tube, and then combined with Figure 3 and Figure 4 , a welding groove 500 is formed between the side wall of the intake fin 100, the plate accessory 200 on both sides of it and the square tube. The plate accessory 200 covers each air groove 120 to form a corresponding intake passage 600; combined with Figure 2 and Figure 4 , the air extraction assembly 400 is adapted to open the intake passage 600 corresponding to the welding groove 500 being welded when the welding head 800 in the welding assembly 700 connected to the pressing plate assembly 300 blows protective gas into the welding cavity 810 formed by covering the welding groove 500 and moves for welding on the welding groove 500, so that the protective gas entering the welding cavity 810 forms an air flow passing through the welding point.

[0011] The intake fin 100 can be a thin sheet made of the same material as the square tube and the plate accessory 200. When the welding head 800 forms a weld pool in the welding groove 500, it is sufficient to burn to the square tube and the plate accessory 200. The air grooves 120 can be obtained by, for example, milling.

[0012] After the pressing plate assembly 300 of the dust-proof welding device for the plate accessory of the semiconductor equipment rack holds the square tube, it can press the intake fin 100, the plate accessory 200 and the air extraction assembly 400 placed at the position where the plate accessory 200 needs to be welded on the square tube onto the square tube, so that the plate accessory 200 covers the air grooves 120 on the intake fin 100 to form the intake passage 600. At the same time, the side wall of the intake fin 100 forms a welding groove 500 with the plate accessory 200 and the square tube. In this way, when the welding head 800 in the welding assembly 700 blows protective gas into the welding cavity 810 formed by covering the welding groove 500 and moves for welding on the welding groove 500, with the cooperation of the air extraction assembly 400 at the intake end of the positioning cylinder 110, that is, at the intake passage 600, opening the intake passage 600 corresponding to the welding groove 500 being welded and extracting air, the protective gas entering the welding cavity 810 forms an air flow passing through the welding point. As a result, the dust generated when the plate accessory 200 is welded to the square tube enters the intake passage 600 along with this air flow and is collected under the guidance of the air extraction assembly 400. The dust will not spread, and there is no need to build a clean shed on the site of the semiconductor equipment.

[0013] Combined with Figure 1 andFigure 5 One end of each of the air grooves 120 is evenly distributed on the side wall of the air inlet piece 100, and each group of air grooves 120 is arc-shaped, so that the other ends of each group of air grooves 120 are circularly distributed at the gathering points of each group; the air inlet ends of the positioning cylinders 110 are connected to one end of the corresponding group of air grooves 120 at the gathering point to form corresponding air extraction ports 610, and each air extraction port 610 corresponds to each air inlet channel 600.

[0014] In at least one embodiment, as Figure 1 and Figure 5 shown, the plate accessory 200 is a rectangular plate, on which there are four screw holes 210, and the air inlet piece 100 adapted thereto is also a rectangular piece, on which there are four groups of air grooves 120, and the four groups of air grooves 120 gather at four gathering points, and the air inlet ends of the four positioning cylinders 110 are connected to one end of the corresponding group of air grooves 120 at the gathering point. As Figure 5 shown, the four screw holes 210 of the plate accessory 200 respectively pass through the corresponding positioning cylinders 110, and the plate accessory 200 can cover each air groove 120 to form a corresponding air inlet channel 600.

[0015] As Figure 5 shown, the side wall of the air inlet piece 100 is provided with a groove, combined with Figure 5 and Figure 10 , to form a retracted welding groove 500 with the plate accessory 200 and the square pipe on both sides of the side wall; as Figure 3 and Figure 4 shown, the welding assembly 700 may include: an upper welding head guide rail 710, a lower welding head guide rail 720 and a welding trolley guide rail 730, all of which are connected to the pressing plate assembly 300; combined with Figure 8 and Figure 7 , the upper welding head guide rail 710 and the lower welding head guide rail 720 surround the welding groove 500, referring to Figure 6 , and the inner wall of the upper welding head guide rail 710 is sealed when it abuts against the plate accessory 200, and the bottom surface of the lower welding head guide rail 720 is sealed when it abuts against the square pipe. The upper welding head guide rail 710 and the lower welding head guide rail 720 are spaced apart to form a welding head straight part accommodating cavity 740 and a welding head head accommodating cavity 750; the inner wall of the upper welding head guide rail 710 and the bottom surface of the lower welding head guide rail 720 can be sealed by abutting through, for example, setting a sealing gasket; returning to Figure 3 and Figure 4 , a welding head 800, which is connected to a welding trolley 760 on the welding trolley guide rail 730 and extends into the welding head head accommodating cavity 750 through the welding head straight part accommodating cavity 740 to cover a section of the welding groove 500 to form the welding cavity 810, and blows protective gas into the welding cavity 810.

[0016] As Figure 6 and Figure 4As shown, on the sides of the upper welding head guide rail 710 and the lower welding head guide rail 720 that form one side of the welding head straight part accommodating cavity 740, there are respectively a straight part upper guide groove 711 and a straight part lower guide groove 721; as Figure 11 shown, the welding head 800 may include: a straight part 820, combined with Figure 4 and Figure 9 , which is inserted into the sealing rings 770 filled in the straight part upper guide groove 711 and the straight part lower guide groove 721, and the sealing rings 770 cover both walls of the straight part 820 along the circumferential direction of the welding head straight part accommodating cavity 740; returning to Figure 11 , a tail part 830, which is connected to one end of the straight part 820, combined with Figure 10 , and is connected to the welding carriage 760; returning to Figure 11 , a head part 840, which is connected to the other end of the straight part 820, referring to Figure 9 and Figure 4 , extends into the welding head head accommodating cavity 750 and is suitable for welding the welding groove 500, as Figure 9 shown, and on both sides along the circumferential direction of the welding head straight part accommodating cavity 740, there are cover parts 850 connected, forming the welding cavity 810 that covers a section of the welding groove 500; the straight part 820, the tail part 830 and the head part 840 of the welding head 800, which are the parts performing welding, may be, for example, flat welding torches; as Figure 10 shown, there are blowing gaps 860 left between the upper wall surface of the cover part 850 and the upper welding head guide rail 710, the front wall surface and the plate attachment 200 and the air inlet piece 100, and the lower wall surface and the square pipe, combined with Figure 11 , Figure 12 and Figure 9 , and on the rear wall surface where the cover part 850 fits with the upper welding head guide rail 710 and the lower welding head guide rail 720, there is a cover part air flow guide groove 851, combined with Figure 11 and Figure 12 , the cover part air flow guide groove 851 is communicated with the left and right parts of the straight part air flow guide grooves 821 opened on the upper and lower wall surfaces of the straight part 820, combined with Figure 9 , and the middle part of the straight part air flow guide groove 821 extends to the welding cavity 810; combined with Figure 11 and Figure 12 , on the wall surfaces of the cover part 850 located in the blowing gaps 860, there are gap blowing holes 852, combined with Figure 9 , and the gap blowing holes 852 face the welding cavity 810; as Figure 9 shown, the other end of the straight part air flow guide groove 821 extends out of the welding head straight part accommodating cavity 740 and is covered by the blowing hood 870 inside.

[0017] As Figure 11 and Figure 9 shown, the tail part 830 may be provided with a blowing joint 880 for supplying air to the gap blowing holes 852.

[0018] As Figure 6 and Figure 9 shown, by respectively providing a straight upper guide groove 711 and a straight lower guide groove 721 on the upper welding head guide rail 710 and the lower welding head guide rail 720, a sealing ring 770 can be filled into the straight upper guide groove 711 and the straight lower guide groove 721. The sealing ring 770 can also travel in a circle in the straight upper guide groove 711 and the straight lower guide groove 721. The two walls of the straight part 820 inserted in the sealing ring 770 along the circumferential direction of the welding head straight part accommodating cavity 740 can be sealed with the sealing ring 770. The straight part air flow guide grooves 821 in the upper and lower wall surfaces of the straight part 820 where the straight part air flow guide grooves 821 are provided can be attached to the corresponding sealing ring 770, the upper welding head guide rail 710, and the lower welding head guide rail 720. The covered straight part air flow guide grooves 821 can direct the protective gas blown by the blowing hood 870 to the hood part air flow guide groove 851 and the welding cavity 810. The protective gas in the hood part air flow guide groove 851 will also merge into the welding cavity 810. The protective gas blown by the blowing joint 880 is blown out through the gap blow holes 852 and will also merge into the welding cavity 810 from both sides.

[0019] Combined with Figure 1 , the air extraction assembly 400 may include: an air extraction base plate 410, on which a rotating seat 420 corresponding to each positioning cylinder 110 is provided; an air extraction pipe 430 is provided on each of the rotating seats 420, and the air extraction pipe 430 is in transmission connection with a rotation driving member 440 beside the rotating seat 420; the rotation driving member 440 can be, for example, a motor; combined with Figure 4 and Figure 13 , one end of the air extraction pipe 430 extends into the positioning cylinder 110. It should be noted that, in order to reduce the interference of the thread lines of the screw holes 210 in the plate accessory 200 on other line segments, Figure 13 the plate accessory 200 is hidden in Figure 1 and abuts against the air inlet piece 100, and the outer wall of the air extraction pipe 430 abuts against the air extraction port 610 of the air inlet channel 600 of the corresponding group of air grooves 120; as Figure 13 shown, a suction hole 431 is provided at one end of the air extraction pipe 430 extending into the positioning cylinder 110. Combined with Figure 1 , when welding the welding groove 500 by moving the head 840, when the protective gas is blown into the welding cavity 810 from the gap blow holes 852 and the straight part air flow guide grooves 821, return to Figure 13 , the air extraction pipe 430 is driven to rotate by the rotation driving member 440. Return to

[0020] , so that the suction hole 431 is communicated with the suction port 610 corresponding to the welded welding groove 500 for air extraction, so as to form an air flow passing through the welding point for the protective gas entering the welding cavity 810.The amount and concentration of the protective gas entering the welding chamber 810 through the blowing hood 870 and the blowing joint 880 can be adapted to the air extraction volume of the exhaust pipe 430, so that the concentration of the protective gas flow passing through the welding point is sufficient to protect the welding, and the flow rate is also sufficient to carry away the welding-generated dust. Thanks to the fact that the welding-generated dust is carried away by forming a protective gas flow, this semiconductor device frame plate accessory dust-proof welding device no longer needs to form a fully enclosed structure outside the welding groove 500 to prevent the dust from overflowing. As a result, the welding trolley 760 no longer needs to consider the adaptation to the enclosed structure, and the welding of the welding groove 500 at the corner can also ensure that the dust does not spread outwards. Therefore, dust-proof welding is also carried out at the corner.

[0021] As Figure 13 shown, the size of the exhaust hole 431 can be such that it can communicate with two exhaust ports 610 simultaneously. Taking this Figure 13 orientation as an example, when the head 840 welds in the welding groove 500 from top to bottom, when the welding point is in the current air inlet channel 600, the exhaust port 610 corresponding to the next air inlet channel 600 has already communicated with the exhaust hole 431, and the protective gas flow can be formed in both the current air inlet channel 600 and the next air inlet channel 600. When welding continuously, the protective gas flow can also be maintained to carry away the welding-generated dust.

[0022] As Figure 1 shown, an exhaust hose clamping platform 451 can be provided on the exhaust substrate 410, so that a rotating buffer section 453 is left between the exhaust hose 452 connected to each exhaust pipe 430 and the exhaust pipe 430. The exhaust hose 452 can be externally connected to a buffer tank and an air extractor to achieve air extraction.

[0023] As Figure 2 、 Figure 7 and Figure 8 shown, the pressing plate assembly 300 can include: a U-shaped plate 310 with side clamping screws 311 provided on its two arms; a bottom plate 320 adapted to be connected to the U-shaped plate 310, with a lower clamping screw 321 provided on the bottom plate 320; a pressing plate arm 330 provided on the U-shaped plate 310, with a pressing plate screw 331 provided on the pressing plate arm 330, adapted to press the exhaust substrate 410 together with the plate accessory 200 and the air inlet piece 100 onto the square tube when the exhaust substrate 410 is placed on the plate accessory 200; the upper welding head guide rail 710, the lower welding head guide rail 720 and the welding trolley guide rail 730 are connected to the U-shaped plate 310. When connecting, as Figure 7 and Figure 8 shown, a folding rod connection can be adopted to leave space for the welding trolley 760 and the welding head 800. As Figure 7 shown, the folding rod can adopt a detachable form of threaded connection, so that when facing square tubes of different specifications, the connection point can be finely adjusted, and then it is convenient to adjust the landing point of the lower welding head guide rail 720. Refer toFigure 7 and Figure 6 , so that the lower welding head guide rail 720 can have a larger contact area with the square tube, forming more welding head head accommodating cavities 750, where the cover part 850 of the head 840 forms a welding cavity 810 in these welding head head accommodating cavities 750, enabling more welding grooves 500 to be dust-proof welded.

[0024] As Figure 6 shown, a track limit clip 780 can be provided on the welding trolley guide rail 730. Combined with Figure 7 , sometimes when the specification of the square tube is small, part of the intake fin 100 will have no square tube below it, and this part will not be welded. Setting the track limit clip 780 can be an insurance measure to limit the movement range of the welding trolley 760, preventing welding in areas where a protective gas flow cannot be formed and generating soot.

[0025] The working principle of the dust-proof welding device for the semiconductor equipment frame plate accessory will be described as a whole below. Refer to Figure 2 , first select the position on the frame where the plate accessory 200 needs to be welded. After installing the U-shaped plate 310 and the bottom plate 320 in the corresponding positions, clamp the square tube through the side clamping screw 311 and the lower clamping screw 321. At this time, the upper welding head guide rail 710, the lower welding head guide rail 720 and the welding trolley guide rail 730 also surround the position where the plate accessory 200 needs to be welded. The welding trolley 760 is on the welding trolley guide rail 730, and the welding head 800 also extends into the welding head head accommodating cavity 750 through the welding head straight part accommodating cavity 740. Place the intake fin 100, the plate accessory 200 and the air extraction substrate 410 at the position where the plate accessory 200 needs to be welded. The plate accessory 200 also abuts against the upper welding head guide rail 710, and the air extraction pipe 430 also extends into the positioning cylinder 110. Then, press the air extraction substrate 410 together with the plate accessory 200 and the intake fin 100 onto the square tube through the pressing plate screw 331. Refer to Figure 9 and Figure 13, first, for example, blow protective gas into the welding chamber 810 through the gas blowing joint 880 and the gas blowing hood 870. By slowly rotating the suction pipe 430 through the rotation driving member 440, the suction hole 431 is adjusted to the position where the protective gas is blown out, that is, the position of the suction port 610 of the air inlet passage 600 corresponding to a section of the welding groove 500 covered by the current welding chamber 810. Subsequently, the amount and concentration of the protective gas entering the welding chamber 810 through the gas blowing hood 870 and the gas blowing joint 880 are adapted to the suction volume of the suction pipe 430. Then, start the welding trolley 760, the welding head 800, and the rotation driving member 440 to move and weld the welding groove 500. The molten pool formed in the welding groove 500 burns the square pipe and the plate attachment 200 together. When welding, the protective gas entering the welding chamber 810 forms an air flow passing through the welding point, taking away the welding fumes. After welding the plate attachment 200 at this position is completed, remove this semiconductor device frame plate attachment dust-proof welding device, and then perform the same operation on the next position where the plate attachment 200 needs to be welded.

[0026] In summary, after the pressing plate assembly 300 of this semiconductor device frame plate attachment dust-proof welding device holds the square pipe, it can press the air inlet piece 100, the plate attachment 200, and the suction assembly 400 placed at the position where the plate attachment 200 needs to be welded on the square pipe, so that the plate attachment 200 covers the air groove 120 on the air inlet piece 100 to form the air inlet passage 600. At the same time, the side wall of the air inlet piece 100 and the plate attachment 200 and the square pipe form the welding groove 500. In this way, when the welding head 800 in the welding assembly 700 blows protective gas into the welding chamber 810 formed by covering the welding groove 500 and moves and welds the welding groove 500, at the air inlet end of the positioning cylinder 110, that is, at the air inlet passage 600, the suction assembly 400 opens the air inlet passage 600 corresponding to the welded welding groove 500 and cooperates with the suction, so that the protective gas entering the welding chamber 810 forms an air flow passing through the welding point. Thus, the welding fumes generated when the plate attachment 200 is welded to the square pipe enter the air inlet passage 600 along with this air flow and are collected under the guidance of the suction assembly 400, and the welding fumes will not diffuse, and there is no need to build a clean shed on the semiconductor device site.

[0027] In the embodiments provided in the present application, it should be understood that the disclosed system and device can be implemented in other ways. The above-described embodiments are only illustrative. For example, the division of the mechanism is only a logical function division, and there may be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0028] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0029] Taking the above-mentioned ideal embodiment of the present invention as an inspiration, through the above description, those skilled in the relevant art can, without departing from the technical idea of the present invention, make various changes and modifications. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A dust-proof welding device for a semiconductor equipment rack plate accessory, characterized in that: include: An air intake plate (100) having a plurality of groups of air grooves (120) each extending at one end to the side wall of the air intake plate (100) and converging at the other end to the air intake end of each positioning cylinder (110) thereon; The air intake sheet (100) is adapted to the plate attachment (200), and the positioning cylinder (110) is adapted to the screw hole (210) on the plate attachment (200), so that when the pressure plate assembly (300) holding the square tube presses the air extraction assembly (400) placed on the plate attachment (200) and extending into the air intake end of each positioning cylinder (110) together with the plate attachment (200) and the air intake sheet (100) onto the square tube, the side wall of the air intake sheet (100) forms a welding groove (500) with the plate attachment (200) and the square tube on both sides thereof, and the plate attachment (200) covers each gas groove (120) to form a corresponding air intake duct (600); The exhaust assembly (400) is suitable for blowing protective gas into a welding cavity (810) formed by covering the welding groove (500) when a welding head (800) in a welding assembly (700) connected to a pressure plate assembly (300) is used, and when the welding groove (500) is moved for welding, an air inlet (600) corresponding to the welded welding groove (500) is opened for exhaust, so that the protective gas entering the welding cavity (810) forms an airflow passing through the welding point.

2. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 1, characterized in that: One end of each of the air grooves (120) is evenly distributed on the side wall of the air inlet plate (100), and each group of air grooves (120) is arc-shaped, so that the other end of each group of air grooves (120) is distributed in a circular shape at the gathering point of each group; The air inlet end of each positioning cylinder (110) is connected to one end of the corresponding group of air grooves (120) at a gathering point to form a corresponding air extraction port (610), and each air extraction port (610) corresponds to each air inlet duct (600).

3. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 2, characterized in that: The side wall of the air inlet plate (100) is provided with a groove to form an inwardly contracted welding groove (500) with the plate attachments (200) and the square tube on both sides of the side wall; The welding assembly (700) comprises: An upper welding head guide rail (710), a lower welding head guide rail (720), and a welding trolley guide rail (730) all connected to the pressing plate assembly (300); The upper welding head guide rail (710) and the lower welding head guide rail (720) surround the welding groove (500), and the inner wall of the upper welding head guide rail (710) is sealed when it abuts against the plate attachment (200), and the bottom surface of the lower welding head guide rail (720) is sealed when it abuts against the square tube, and the upper welding head guide rail (710) and the lower welding head guide rail (720) are spaced apart to form a welding head straight portion accommodating cavity (740) and a welding head portion accommodating cavity (750); A welding head (800) is connected to a welding trolley (760) on a welding trolley guide rail (730), and extends into a welding head head accommodating cavity (750) through a welding head straight portion accommodating cavity (740) to cover a section of a welding groove (500) to form the welding cavity (810), and to blow a protective gas into the welding cavity (810).

4. The semiconductor equipment rack plate accessory dust-proof welding device according to claim 3, characterized in that: A straight portion upper guide groove (711) and a straight portion lower guide groove (721) are respectively formed on one side of the upper welding head guide rail (710) and the lower welding head guide rail (720) to form a welding head straight portion accommodating cavity (740); The welding head (800) comprises: A straight portion (820) is inserted into a sealing ring (770) that is filled and wrapped around the upper guide groove (711) and the lower guide groove (721) of the straight portion, and the sealing ring (770) covers two walls of the straight portion (820) along the circumferential direction of the welding head straight portion accommodating cavity (740); A tail portion (830) connected to one end of the straight portion (820) and connected to the welding carriage (760); A head (840) connected to the other end of the straight portion (820) and extending into the welding head head accommodating cavity (750) and suitable for welding the welding groove (500), and a cover portion (850) is connected to both sides along the circumferential direction of the welding head straight portion accommodating cavity (740) to form the welding cavity (810) that covers a section of the welding groove (500); An air blowing gap (860) is left between the upper wall surface of the hood portion (850) and the upper welding head guide rail (710), the front wall surface and the plate attachment (200) and the air inlet plate (100), and the lower wall surface and the square tube. A hood portion airflow guide groove (851) is provided on the rear wall surface where the hood portion (850) is in contact with the upper welding head guide rail (710) and the lower welding head guide rail (720). The hood portion airflow guide groove (851) is connected to the left and right parts of the straight portion airflow guide groove (821) provided on the upper and lower wall surfaces of the straight portion (820), and the middle part of the straight portion airflow guide groove (821) extends to the welding cavity (810). The wall surface of the cover portion (850) located in the blowing gap (860) is provided with gap blowing holes (852), and the gap blowing holes (852) face the welding cavity (810); The other end of the straight portion airflow guide groove (821) extends out of the welding head straight portion accommodating cavity (740) and is covered by the air blowing cover (870).

5. The semiconductor equipment rack plate accessory dust-proof welding device according to claim 4, characterized in that: The tail portion (830) is provided with a blowing joint (880) for supplying air to the gap blowing hole (852).

6. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 4, characterized in that: The air extraction component (400) comprises: An air extraction base plate (410) on which a rotating seat (420) corresponding to each positioning cylinder (110) is provided; The rotating seat (420) is provided with an air extraction pipe (430), and the air extraction pipe (430) is drivingly connected to a rotating driving member (440) beside the rotating seat (420); One end of the air extraction pipe (430) extends into the positioning cylinder (110) and abuts against the air intake plate (100), and the outer wall of the air extraction pipe (430) abuts against the air extraction port (610) of the air intake channel (600) of the corresponding group of air grooves (120); An exhaust hole (431) is formed at one end of the exhaust pipe (430) extending into the positioning tube (110) so that the head (840) can be moved to weld the welding groove (500). When the protective gas is blown into the welding cavity (810) from the gap blowing hole (852) and the straight air flow guide groove (821), the exhaust pipe (430) is driven to rotate by the rotating driving member (440) so that the exhaust hole (431) is connected to the exhaust port (610) corresponding to the welding groove (500) to be welded, so as to exhaust gas, so that the protective gas entering the welding cavity (810) forms an airflow passing through the welding point.

7. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 6, characterized in that: An exhaust hose clamp (451) is provided on the exhaust base plate (410) so that an exhaust hose (452) connected to each exhaust pipe (430) leaves a rotation buffer section (453) between the exhaust hose clamp (451) and the exhaust pipe (430).

8. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 6, characterized in that: The pressing plate assembly (300) comprises: A shaped plate (310) with side clamping screws (311) disposed on its two arms; A bottom plate (320) adapted to be connected to the shaped plate (310), wherein a lower clamping screw (321) is provided on the bottom plate (320); A pressure plate arm (330) is arranged on the shaped plate (310), and a pressure plate screw (331) is provided on the pressure plate arm (330) and is suitable for pressing the air extraction base plate (410) together with the plate attachment (200) and the air intake sheet (100) onto the square tube when the air extraction base plate (410) is placed on the plate attachment (200); The upper welding head guide rail (710), the lower welding head guide rail (720) and the welding trolley guide rail (730) are connected to the shaped plate (310).

9. The dust-proof welding device for semiconductor equipment frame plate accessories according to claim 6, characterized in that: The welding trolley guide rail (730) is provided with a track limiting clamp (780).

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