Laminated film and method for manufacturing pattern member

Abstract

Provided are a laminated film and a method for manufacturing a pattern member, the laminated film comprising: a first layer that is a mask film and has a first surface for adhesion to an adherend and a second surface positioned on the opposite side from the first surface, the first surface being a mask film for adhesion to the adherend, and the second surface being a mask film for adhesion to the adherend; and a second layer that is laminated on the first surface of the first layer and can be peeled off from the first layer, the second layer being a layer that is removed after the first layer has formed thereon a pattern portion necessary for local coating, plating, or etching of the adherend and before the first layer is affixed to the adherend, the second layer being a layer that has been removed after the first layer has formed thereon a pattern portion necessary for local coating, plating, or etching of the adherend.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a laminated film and a pattern member. Background Art

[0002] Sometimes, a masking film is used for local painting, plating, etching, etc. of a member. For example, a masking film that has been subjected to blanking or the like is pasted on a member to mask non-painted portions, non-plated portions, non-etched portions, etc. of the member, and then painting, plating, etching, etc. are performed.

[0003] More specifically, a protective film for a plating mask is known, which is characterized in that when locally plating a connection terminal portion or the like of a flexible printed circuit board, it is used to mask non-plated portions, and a multilayer film having two or more layers including a layer (layer A) having a tensile elastic modulus of 1 to 250 kg / mm 2 and a layer (layer B) having a tensile elastic modulus of 200 to 700 kg / mm 2 is used as a support, and an adhesive layer is provided on the A-layer side of the support (for example, refer to Patent Document 1).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 11-140393 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In the case of forming a mask pattern by performing blanking or the like on a conventional masking film, foreign matters (for example, foreign matters from an adhesive) generated during mask pattern formation such as during blanking may adhere to the surface of the masking film. If foreign matters adhere to the surface of the masking film, the adherend to which the masking film is pasted may be contaminated, or the effect of the masking film may be reduced.

[0009] An object of the present disclosure is to provide a laminated film and a method for manufacturing a pattern member, the laminated film having a masking film that can suppress the adhesion of foreign matters from an adhesive when locally painting, plating, or etching an adherend, and the method for manufacturing a pattern member capable of manufacturing a pattern member that suppresses the adhesion of foreign matters from an adhesive when locally painting, plating, or etching an adherend.

[0010] Means for Solving the Problems

[0011] Specific methods for achieving the above problems are as follows.

[0012] <1>A laminated film, which comprises a first layer and a second layer. The first layer has a first surface and a second surface located on the side opposite to the first surface, and the first surface is for pasting onto an adherend. The first layer is a masking film. The second layer is laminated on the first surface of the first layer and can be peeled off from the first layer.

[0013] The second layer is a layer that is removed after a pattern portion required for locally coating, plating, or etching the adherend is formed on the first layer and before the first layer is pasted onto the adherend.

[0014] <2>The laminated film according to <1>, wherein the tensile elastic modulus of the first layer is 1000 MPa to 4000 MPa.

[0015] <3>The laminated film according to <1> or <2>, wherein the tensile elastic modulus of the second layer is 1000 MPa to 4000 MPa.

[0016] <4>The laminated film according to any one of <1> to <3>, wherein the first layer includes a base material layer and an adhesive layer located on the first surface side.

[0017] <5>The laminated film according to <4>, wherein the thickness of the base material layer is 30 μm to 70 μm.

[0018] <6>The laminated film according to <4> or <5>, wherein the thickness of the adhesive layer is 4 μm to 10 μm.

[0019] <7>The laminated film according to any one of <1> to <6>, wherein the adhesive force of the first layer is greater than or equal to 0.5 N / 25 mm.

[0020] <8>The laminated film according to any one of <1> to <7>, wherein the peel force of the second layer is greater than or equal to 1.0 N / 25 mm.

[0021] <9>The laminated film according to any one of <1> to <8>, wherein no other layer is disposed on the second surface of the first layer.

[0022] <10>A method for manufacturing a pattern member, which includes:

[0023] A step of forming a pattern portion required for locally coating, plating, or etching the adherend on the first layer and peeling off the second layer from the laminated film according to any one of <1> to <9>;

[0024] A step of pasting the first surface of the first layer formed with the pattern portion onto the adherend; and

[0025] A step of forming a pattern corresponding to the above-described pattern portion on the above-described adherend by painting, plating, or etching to obtain a patterned member having a pattern formed on the above-described adherend.

[0026] <11>An application of a laminated film. For the laminated film according to any one of <1> to <9>, a pattern portion required for locally painting, plating, or etching the above-described adherend is formed on the above-described first layer, and then the above-described second layer is removed before pasting the above-described first layer onto the above-described adherend.

[0027] <12>The application of the laminated film according to <11>, wherein the above-described first layer having the above-described pattern portion formed thereon is pasted onto the above-described adherend, and a pattern corresponding to the above-described pattern portion is formed on the above-described adherend by painting, plating, or etching to obtain a patterned member having a pattern formed on the above-described adherend.

[0028] Advantages of the Invention

[0029] According to one aspect of the present disclosure, it is possible to provide a laminated film and a method for manufacturing a patterned member. The laminated film includes a masking film and can suppress the adhesion of foreign substances from the adhesive when locally painting, plating, or etching an adherend. The method for manufacturing the patterned member can manufacture a patterned member that suppresses the adhesion of foreign substances from the adhesive when locally painting, plating, or etching an adherend. Brief Description of the Drawings

[0030] Figure 1 is a schematic configuration diagram of the laminated film of the present disclosure.

[0031] Figure 2 is a schematic diagram showing an example of the usage method of the laminated film of the present disclosure.

[0032] Figure 3 is a schematic configuration diagram of a laminated film as a comparison object.

[0033] Description of Reference Numerals

[0034] 1, 10 First layer (masking film); 2, 20 Second layer; 30 Third layer; 4, 60 Adherend; 5, 160 Patterned member; 6, 70 Processing portion; 11, 110 First layer having a die-cut portion; 12, 120 Semi-cut second layer; 3, 40, 50 Die-cut portions; 100, 200 Laminated film; 130 Third layer having a die-cut portion. Detailed Description of the Embodiments

[0035] Hereinafter, the embodiments for implementing the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, unless otherwise expressly stated, its constituent elements (including element steps, etc.) are not essential. The same applies to numerical values and their ranges, which do not limit the present invention. The configurations described in each embodiment can be appropriately combined.

[0036] In this disclosure, the numerical range represented by "~" includes the numerical values recited before and after "~" as the minimum value and the maximum value, respectively.

[0037] In the numerical ranges described stepwise in this disclosure, the upper limit value or the lower limit value described in one numerical range can also be replaced with the upper limit value or the lower limit value of other stepwise described numerical ranges. In addition, in the numerical ranges described in this disclosure, the upper limit value or the lower limit value of this numerical range can also be replaced with the value shown in the examples.

[0038] In this disclosure, the "second layer that can be peeled from the first layer" means that the first layer does not break, and the second layer can be peeled while maintaining its shape.

[0039] [Laminated film]

[0040] The laminated film of the present disclosure includes a first layer and a second layer. The first layer has a first surface and a second surface located on the side opposite to the first surface, and the first surface is used for pasting to an adherend. The second layer is laminated on the first surface of the first layer and can be peeled from the first layer. The first layer is a masking film, and the second layer is a layer that is removed after forming a pattern portion required for local painting, plating, or etching of the adherend on the first layer and before pasting the first layer to the adherend.

[0041] As the laminated film, there is also the following configuration: a first layer having a first surface and a second surface located on the side opposite to the first surface, which is used as a masking film; a second layer provided on the first surface and capable of being peeled from the first layer; and a third layer provided on the second surface and capable of being peeled from the first layer. In this case, when performing blanking processing or the like on the laminated film in the direction in which the second layer, the first layer, and the third layer are laminated, it is possible to suppress foreign matter generated during mask pattern formation during blanking processing or the like from adhering to the surface of the masking film (for example, the first surface and the second surface of the first layer). Thus, for example, when pasting the masking film after forming the mask pattern to the adherend after peeling the third layer, contamination of the adherend can be suppressed. In addition, it is possible to suppress a reduction in the masking effect caused by foreign matter adhering to the masking film.

[0042] On the other hand, in a laminated film in which a second layer, a first layer, and a third layer are laminated, the second layer and the first layer, and the third layer and the second layer are respectively pasted through an adhesive layer. When performing blanking processing or the like on the laminated film as described above, a mask pattern is formed on the first layer by peeling off the third layer or the second layer together with the blanked portion. At this time, the adhesive of the adhesive layer exposed at the blanking portion of the laminated film may overflow to the mask pattern portion. For example, in the case of performing blanking processing on the first layer and the third layer from the third layer side, at the blanking portion, the adhesive layer between the first layer and the third layer is exposed, and the adhesive of this adhesive layer may overflow to the mask pattern portion. When the adhesive overflows to the mask pattern portion, foreign substances from the adhesive may adhere to the adherend during coating, plating, or etching.

[0043] The laminated film of the present disclosure includes a first layer for pasting to an adherend and a second layer that can be peeled off from the first layer. The first layer is a masking film, and the second layer is a layer that is removed after forming a pattern portion required for local coating, plating, or etching of the adherend on the first layer and before pasting the first layer to the adherend. By performing blanking processing on the laminated film of the present disclosure from the first layer side and peeling off the second layer, a pattern portion required for local coating, plating, or etching of the adherend is formed on the first layer. Furthermore, in the laminated film of the present disclosure, since the third layer is not provided, the adhesive does not overflow from the adhesive layer between the first layer and the third layer at the blanking portion. Therefore, it is possible to suppress the adhesion of foreign substances from the adhesive to the adherend during coating, plating, or etching. By using the laminated film of the present disclosure, a pattern member with suppressed foreign substance adhesion can be manufactured.

[0044] The laminated film may be a laminated film in which at least a pattern portion is formed on the first layer through blanking processing or the like, or a laminated film in which pattern portions are formed on the first layer and the second layer respectively through blanking processing or the like. In addition, the laminated film may be a laminated film in which the first layer is blanked and the second layer is semi-cut. In the case where the second layer is semi-cut, it may be configured such that the blanked portion of the first layer is also peeled off when the second layer is peeled off from the laminated film.

[0045] The laminated film may be a film wound using a roller member or the like.

[0046] (First layer)

[0047] The laminated film of the present disclosure includes a first layer as a masking film, and the first layer has a first surface and a second surface located on the opposite side of the first surface. The first surface is the surface for pasting to the adherend.

[0048] The first surface and the second surface may also be the main surfaces of the first layer respectively.

[0049] The main surface of the first layer refers to a pair of surfaces with the largest area among the surfaces of the first layer.

[0050] In the laminated film of the present disclosure, it is preferable that no other layer is disposed on the second surface of the first layer. For example, it is preferable to expose the second surface, and it is preferable to expose the entire surface of the second surface.

[0051] From the viewpoints of ensuring the strength of the first layer and suppressing deformation, wrinkle generation, etc. when the second layer is peeled off, the tensile elastic modulus of the first layer is preferably 1000 MPa to 4000 MPa, more preferably 2000 MPa to 4000 MPa, and further preferably 3000 MPa to 4000 MPa.

[0052] In the present disclosure, the tensile elastic modulus of each layer is a value measured at 25 °C based on JIS K 7161 (2014).

[0053] The material of the first layer is not particularly limited, and examples thereof include polymer materials such as polyethylene, polypropylene, polystyrene, polyethylene terephthalate, and polybutylene terephthalate. Among them, polyethylene terephthalate, polybutylene terephthalate, etc. are preferable.

[0054] The thickness of the first layer is preferably 20 μm to 80 μm, more preferably 35 μm to 70 μm, and further preferably 40 μm to 60 μm.

[0055] When the thickness of the first layer is greater than or equal to 20 μm, it has a tendency to appropriately maintain its shape when peeling off other layers. When the thickness of the first layer is less than or equal to 80 μm, it has a tendency to suppress liquid accumulation at the edge portion of the pattern portion during coating, a decrease in the coating film thickness accuracy, a decrease in the plating quality due to bubble retention during plating treatment, and infiltration of the treatment liquid from the edge portion of the pattern portion due to insufficient follow-up of the unevenness of the adherend surface.

[0056] Furthermore, when the thickness of the first layer is greater than or equal to 35 μm, it is not easy to generate shape deformation of the blanking portion when forming the blanking portion in the first layer, and the positional accuracy of the blanking portion is excellent when the first layer is adhered to the adherend.

[0057] The thickness of each layer is obtained, for example, by observing the cross section of each layer using a laser microscope and taking the arithmetic average of the thicknesses at any three measured locations.

[0058] The first layer may have an adhesive layer on the first surface side adhered to the adherend. For example, it may have a structure including a base material layer and an adhesive layer.

[0059] When the first layer has a base material layer and an adhesive layer, examples of the material of the base material layer include the same materials as those of the aforementioned first layer.

[0060] The thickness of the base material layer is preferably 20 μm to 70 μm, more preferably 30 μm to 70 μm, and further preferably 35 μm to 60 μm.

[0061] The thickness of the adhesive layer is preferably 1 μm to 20 μm, more preferably 4 μm to 10 μm, and further preferably 4 μm to 5.5 μm.

[0062] When the thickness of the base material layer is greater than or equal to 30 μm, it is not easy to generate shape deformation of the blanking part when forming the blanking part in the first layer, and the position accuracy of the blanking part is excellent when the first layer is pasted on the adherend.

[0063] When the thickness of the adhesive layer is 4 μm to 5.5 μm, the adhesion between the first layer and the adherend is excellent, and it is not easy to occur infiltration at the edge part of the plating and roughness of the plating surface when the adherend is plated.

[0064] As the adhesive used in the adhesive layer, examples thereof include commonly used acrylic adhesives, natural rubber adhesives, synthetic rubber adhesives, silicone adhesives, and mixed adhesives thereof. The adhesive layer may contain components other than the adhesive, and may also contain crosslinking agents, tackifiers, etc.

[0065] As a method for forming the adhesive layer, for example, there can be mentioned a method of coating an adhesive composition whose viscosity has been adjusted by dissolving an adhesive in an organic solvent on the base material layer, and then drying the coated adhesive composition. As other methods, there can be mentioned a method of coating a molten adhesive on the base material layer, a method of coating an adhesive dispersed in water on the base material layer, etc.

[0066] (Second layer)

[0067] The laminated film of the present disclosure includes a second layer provided on the first surface and capable of being peeled off from the first layer. The second layer is a layer that is removed after forming a pattern portion required for local painting, plating, or etching of the adherend on the first layer and before pasting the first layer on the adherend.

[0068] The tensile elastic modulus of the second layer is preferably 1000 MPa to 4000 MPa, more preferably 2000 MPa to 4000 MPa, and further preferably 3000 MPa to 4000 MPa.

[0069] The tensile elastic modulus of the second layer is greater than or equal to 1000 MPa, thereby suppressing the second layer from being too soft. As a result, it is possible to suppress the occurrence of burrs (for example, a phenomenon where the first layer is stretched by the second layer during blanking, referring to rounded corners at the corners, etc.) at the blanking end of the first layer. By suppressing the occurrence of burrs, the adhesion between the first layer and the adherend is excellent, and when plating the adherend, infiltration at the edge of the plating and roughness of the plating surface are less likely to occur.

[0070] The material of the second layer is not particularly limited, and examples thereof include polymer materials such as polyethylene, polypropylene, polystyrene, polyethylene terephthalate, and polybutylene terephthalate. Among them, polyethylene terephthalate, polybutylene terephthalate, etc. are preferred. In the second layer, a release treatment can be performed on the surface opposite to the first surface of the first layer.

[0071] The thickness of the second layer is preferably 40 μm to 100 μm, more preferably 40 μm to 75 μm.

[0072] The adhesive force of the first layer is preferably greater than or equal to 0.5 N / 25 mm, more preferably greater than or equal to 0.7 N / 25 mm, and further preferably greater than or equal to 0.8 N / 25 mm.

[0073] From the viewpoint of ease of peeling after forming a pattern portion on the adherend, the adhesive force of the first layer is preferably less than or equal to 2.0 N / 25 mm, more preferably less than or equal to 1.5 N / 25 mm. From the viewpoint of suppressing residual glue in the first layer after peeling the second layer, it is further preferably less than or equal to 1.0 N / 25 mm.

[0074] Since the adhesive force of the first layer is greater than or equal to 0.7 N / 25 mm, the adhesion between the first layer and the adherend is excellent, and when plating the adherend, infiltration at the edge of the plating and roughness of the plating surface are less likely to occur.

[0075] In the present disclosure, the adhesive force of the first layer refers to the maximum value of the peeling strength when a laminate (for example, a laminate formed by pasting the surface on the adhesive layer side of the first layer with a width of 25 mm to the adherend (material: stainless steel plate)) prepared by pasting the first layer with a width of 25 mm to the adherend (material: stainless steel plate) is peeled between the adherend and the first layer by pulling the adherend in a direction perpendicular to the interface with the first layer at a pulling speed of 200 mm / min and a temperature of 23 °C using a tensile testing machine.

[0076] The peeling force of the second layer is preferably greater than or equal to 0.5 N / 25 mm, more preferably greater than or equal to 1.0 N / 25 mm, and further preferably greater than or equal to 1.5 N / 25 mm.

[0077] The peel strength of the second layer is preferably less than or equal to 4.0 N / 25 mm, more preferably less than or equal to 3.5 N / 25 mm, and still more preferably less than or equal to 3.0 N / 25 mm.

[0078] The peel strength of the second layer is greater than or equal to 1.0 N / 25 mm, so that the adhesion between the first layer and the second layer is excellent. After forming the pattern portion on the first layer, the punched portion of the first layer can be easily removed.

[0079] In the present disclosure, the peel strength of the second layer means the maximum value of the peel strength when a laminated film with a width of 25 mm is prepared, and using a tensile testing machine, the first layer is stretched in a direction of 180° with respect to the interface with the second layer at a tensile speed of 200 mm / min and a temperature of 23°C to peel between the first layer and the second layer.

[0080] The adhesion of the first layer and the peel strength of the second layer can be appropriately adjusted by, for example, providing an adhesive layer on the first layer and adjusting the composition and thickness of each adhesive layer, or by performing a release treatment on the surface of the second layer opposite to the first surface of the first layer.

[0081] [Method for manufacturing a pattern member]

[0082] Hereinafter, a method for manufacturing a pattern member of the present disclosure will be described. In the method for manufacturing a pattern member of the present disclosure, it includes: forming a pattern portion required for local painting, plating, or etching of the adherend on the first layer, and peeling the second layer from the laminated film of the present disclosure; pasting the first surface of the first layer on which the pattern portion is formed to the adherend; and forming a pattern corresponding to the pattern portion on the adherend by painting, plating, or etching to obtain a pattern member having a pattern formed on the adherend.

[0083] Thus, a pattern member having a pattern corresponding to the pattern portion can be manufactured. Furthermore, by using the laminated film of the present disclosure, a pattern member with reduced foreign matter adhesion can be obtained.

[0084] In the manufacturing method of the present disclosure, the laminated film can be subjected to blanking processing or the like in the direction in which the first layer and the second layer are laminated. The second layer can be peeled from the first layer after blanking processing, or the second layer can be semi-cut by performing blanking processing from the first layer side. When peeling the second layer from the laminated film, the punched portion of the first layer is also peeled. Through these treatments, a first layer having a pattern portion required for local painting, plating, or etching of the adherend can be obtained.

[0085] Next, the first surface of the first layer on which the pattern portion is formed is pasted to the adherend.

[0086] As the material of the adherend, specifically, metal plates such as copper, aluminum, iron, stainless steel, and brass, metal bars, metal foils, etc. can be cited; resin plates and resin sheets such as polyethylene, polypropylene, polycarbonate, vinyl chloride, polyimide, epoxy resin, and phenolic resin; printed circuit boards, etc.

[0087] Finally, a pattern corresponding to the pattern portion is formed on the adherend by coating, plating, or etching. After the pattern is formed, the first layer is peeled off from the pattern member, thereby obtaining a patterned pattern member.

[0088] Hereinafter, Figure 1 and Figure 2 will be used to describe the specific configuration of the laminated film of the present disclosure. Figure 1 is a schematic configuration diagram of the laminated film of the present disclosure, Figure 2 and

[0089] is a schematic diagram showing an example of the usage method of the laminated film of the present disclosure. Figure 1 and Figure 2 As shown in (a) of

[0090] and Figure 2 , the laminated film 100 includes a first layer 1 and a second layer 2 as a masking film. An adhesive layer is provided on the first surface of the first layer 1, and the surface of the first layer 1 on the adhesive layer side is adhered to the second layer 2. Figure 2 In (b) of

[0091] , blanking is performed from the first layer 1 side, and the second layer 2 is semi-cut. As shown in (c) of Figure 2 , by peeling the semi-cut second layer 12 from the first layer 11 having a blanking portion, the blanked portion 3 in the first layer 1 and the semi-cut second layer 12 are peeled off from the first layer 11. Thus, a first layer 11 having a blanking portion is obtained.

[0092] Next, as shown in (d) of Figure 2 , an adherend 4 is adhered to the first surface of the first layer 11 having a blanking portion.

[0093] The laminate including the first layer 11 having a blanking portion and the adherend 4 is coated, plated, or etched. After coating, plating, or etching, the first layer 11 having a blanking portion is peeled off from the laminate. Thus, as shown in (e) of Figure 3 , for the adherend 4, a treatment of coating, plating, or etching is performed on the portion opposite to the blanking portion of the first layer 11, and a patterned member 5 having a treatment portion 6 is obtained. Figure 3 is a schematic diagram showing an example of the usage method of the laminated film as a comparison object.

[0094] As shown Figure 3 in (a) of Figure 3 , the laminated film 200 as a comparison object sequentially includes a third layer 30, a first layer 10 as a masking film, and a second layer 20. The first layer 10 may include an adhesive layer, and the surface of the first layer 10 on the adhesive layer side is adhered to the second layer 20. The third layer 30 may include an adhesive layer, and the surface of the third layer 30 on the adhesive layer side is adhered to the first layer 10.

[0095] In Figure 3 (b) of Figure 3 , the third layer 30 and the first layer 10 are die-cut from the third layer 30 side, and after the second layer 20 is semi-cut, the second layer 20 is peeled off from the first layer 10. Thus, the die-cut portions 40, 50 in the first layer 10 and the third layer 30 and the semi-cut second layer 120 are peeled off from the laminated film 200. Thus, a laminated film including a first layer 110 having a die-cut portion and a third layer 130 having a die-cut portion is obtained.

[0096] Next, as shown Figure 3 in (c) of Figure 3 , an adherend 60 is adhered to the second surface of the first layer 110 having a die-cut portion.

[0097] Then, by peeling off the third layer 130 having a die-cut portion from the first layer 110 having a die-cut portion, as shown Figure 3 in (d) of Figure 3 , a laminate including the first layer 110 having a die-cut portion and the adherend 60 is obtained.

[0098] The laminate including the first layer 110 having a die-cut portion and the adherend 60 is painted, plated, or etched. After painting, plating, or etching, the first layer 110 having a die-cut portion is peeled off from the laminate. Thus, as shown Figure 3 in (e) of Figure 3 , for the adherend 60, a process of painting, plating, or etching is performed on the portion opposite to the die-cut portion of the first layer 110, and a pattern member 160 having a processed portion 70 is obtained.

[0099] In the laminated film as a comparison object, the adhesive of the adhesive layer exposed at the die-cut portion may overflow to the mask pattern portion. Specifically, at the die-cut portion, the adhesive layer between the first layer 110 and the third layer 130 is exposed, and the adhesive of this adhesive layer may overflow to the mask pattern portion. When the adhesive overflows to the mask pattern portion, foreign substances from the adhesive adhere to the adherend during painting, plating, or etching.

[0100] On the other hand, in the laminated film of the present disclosure, punching is performed on the laminated film of the present disclosure from the first layer side, and the second layer is peeled off, thereby forming a pattern portion required for locally coating, plating, or etching an adherend on the first layer. Further, in the laminated film of the present disclosure, since the third layer is not provided, the adhesive does not overflow from the adhesive layer between the first layer and the third layer at the punching portion. Therefore, foreign matter from the adhesive can be suppressed from adhering to the adherend during coating, plating, or etching. By using the laminated film of the present disclosure, a pattern member with suppressed foreign matter adhesion can be manufactured.

[0101] [Examples]

[0102] Next, the present invention will be specifically described by way of examples, but the scope of the present invention is not limited to these examples.

[0103] [Comparative Example 1]

[0104] (Production of laminated film)

[0105] A masking film (first layer) having a base material layer (material: polypropylene, PP) and an adhesive layer shown in Table 1 was produced, a second layer (material: polypropylene, PP) shown in Table 1 was prepared, and a third layer having a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced.

[0106] The adhesive layer of the masking film and the adhesive layer of the third layer were respectively produced by coating an adhesive composition diluted with the following components on the base material layer and drying. Then, the surface of the third layer having the adhesive layer formed thereon was pasted on the side of the first layer where the adhesive layer was not formed under the conditions of 25 °C and 0.40 MPa, and the second layer was pasted on the side of the first layer where the adhesive layer was formed under the conditions of 25 °C and 0.40 MPa, thereby producing a laminated film in which the third layer, the first layer, and the second layer were arranged in sequence.

[0107] It should be noted that in Comparative Example 1 and the following examples, an adhesive composition containing the following components was used to form the first layer adhesive layer and the third layer adhesive layer, respectively.

[0108] - Components of the adhesive composition for forming the adhesive layer of the first layer -

[0109] · Acrylic adhesive: 100 parts by mass of HTR-280 (Nagase ChemteX Corporation)

[0110] · Crosslinking agent: 5 parts by mass of Melan X66 (Resonac Corporation)

[0111] · Tackifier: 25 parts by mass of YS Polyster U130 (Yasuhara Chemical Co., Ltd.)

[0112] - Components of the adhesive composition for forming the adhesive layer of the third layer -

[0113] · Acrylic adhesive: AS - 460 (Lion Specialty Chemicals Co., Ltd.) 100 parts by mass

[0114] · Cross - linker: DURANATE TKA75E (Asahi Kasei Chemicals Corporation) 6 parts by mass

[0115] [Example 1]

[0116] Produce a masking film (first layer) having a substrate layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1, and prepare a second layer (material: polypropylene, PP) shown in Table 1.

[0117] The adhesive layer of the masking film is produced by coating and drying the diluted adhesive composition on the substrate layer. The second layer is pasted on the side of the first layer where the adhesive layer is formed under the conditions of 25°C and 0.40 MPa, thereby producing a laminated film in which the first layer and the second layer are arranged in sequence.

[0118] [Example 2]

[0119] Produce a masking film (first layer) having a substrate layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1, and prepare a second layer (material: polyethylene terephthalate, PET) shown in Table 1.

[0120] Produce a laminated film in which the first layer and the second layer are arranged in sequence in the same manner as in Example 1.

[0121] [Example 3]

[0122] Produce a masking film (first layer) having a substrate layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1, and prepare a second layer (material: polyethylene terephthalate, PET) shown in Table 1.

[0123] Produce a laminated film in which the first layer and the second layer are arranged in sequence in the same manner as in Example 1. Note that, except for changing the thickness of the adhesive layer of the first layer from 6 μm to 5 μm, it is the same as Example 2.

[0124] [Example 4]

[0125] Produce a masking film (first layer) having a substrate layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1, and prepare a second layer (material: polyethylene terephthalate, PET) shown in Table 1.

[0126] A laminated film having a first layer and a second layer arranged in sequence was produced in the same manner as in Example 1. It should be noted that it is the same as Example 3 except that the thickness of the base material layer of the first layer was changed from 50 μm to 38 μm.

[0127] [Example 5]

[0128] A masking film (first layer) having a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared.

[0129] A laminated film having a first layer and a second layer arranged in sequence was produced in the same manner as in Example 1. It should be noted that it is the same as Example 4 except that the thickness of the adhesive layer of the first layer was changed from 5 μm to 6 μm.

[0130] [Example 6]

[0131] A masking film (first layer) having a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared.

[0132] A laminated film having a first layer and a second layer arranged in sequence was produced in the same manner as in Example 1. It should be noted that it is the same as Example 4 except that the thickness of the adhesive layer of the first layer was changed from 5 μm to 3 μm.

[0133] Regarding the laminated films produced in Comparative Example 1 and each example, the following characteristics were evaluated. The evaluation results are shown in Table 1.

[0134] [Position accuracy of the punching part during pasting]

[0135] On the laminated film (length 10 mm × width 50 mm) obtained in Comparative Example 1, by punching from the third layer side, punching parts with a length of 10 mm × width of 10 mm and a spacing (center - to - center distance) between punching parts of 30 mm were formed on the masking film (first layer). Then, after applying tension to the laminated film, the second layer was peeled off to obtain a peeled laminated film having a third layer and a first layer. Then, the surface on the adhesive layer side of the first layer was pasted onto an adherend (material: copper plate).

[0136] On the other hand, on the laminated film (length 10 m × width 50 mm) obtained in each example, by punching from the masking film (first layer) side, punching parts with a length of 10 mm × width of 10 mm and a spacing (center - to - center distance) between punching parts of 30 mm were formed. Then, after applying tension to the laminated film, the second layer was peeled off, and the surface on the adhesive layer side of the first layer on which the punching parts were formed was pasted onto an adherend (material: copper plate).

[0137] Confirm the position of the punching part after pasting the first layer on the adherend, and evaluate it according to the following evaluation criteria.

[0138] [Evaluation Criteria]

[0139] A: No shape deformation of the punching part is observed, and the first layer as the masking film can be pasted at the target position.

[0140] B: Shape deformation of the punching part is observed, or the pasting position deviates from the target position.

[0141] [Adhesive Spillage]

[0142] On the laminated film (length 10 mm × width 50 mm) obtained in Comparative Example 1, by punching from the third layer side, punching parts with a length of 10 mm × width of 10 mm and a spacing between punching parts (center-to-center distance) of 30 mm are formed on the masking film (first layer). Then, peel off the second layer, observe the surface on the third layer side of the first layer, and evaluate the adhesive spillage according to the following criteria.

[0143] On the other hand, on the laminated film (length 10 m × width 50 mm) obtained in each example, by punching from the masking film (first layer) side, punching parts with a length of 10 mm × width of 10 mm and a spacing between punching parts (center-to-center distance) of 30 mm are formed. Then, peel off the second layer, observe the surface (second surface) of the first layer opposite to the side where the second layer is disposed, and evaluate the adhesive spillage according to the following criteria.

[0144] A: No adhesive spillage is confirmed at the punching part.

[0145] B: Adhesive spillage is confirmed at the punching part.

[0146] [Measurement of Peel Force and Adhesive Force]

[0147] Prepare a laminated film with a width of 25 mm. Using a tensile testing machine, under the conditions of a tensile speed of 200 mm / min and a temperature of 23 °C, stretch the first layer in a direction of 180° relative to the interface with the second layer, and thus measure the maximum value of the peel strength when peeling the first layer from the second layer. Take this value as the peel force.

[0148] Regarding the adhesive force, use a laminate formed by pasting the surface on the adhesive layer side of the first layer to an adherend (material: stainless steel plate) under the conditions of 23 °C and a line pressure of 5880 N / m. Using a tensile testing machine, under the conditions of a tensile speed of 200 mm / min and a temperature of 23 °C, stretch the adherend in a direction of 90° relative to the interface with the first layer, and thus measure the maximum value of the peel strength when peeling the adherend from the first layer. Take this value as the adhesive force.

[0149] [Table 1]

[0150]

[0151] In Examples 1 to 6, the positional accuracy of the punching portion when pasted on the adherend is excellent, and the overflow of the adhesive is suppressed.

[0152] The entire disclosure of Japanese Patent Application 2023-209486 filed on December 12, 2023 is incorporated herein by reference.

[0153] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard were specifically and separately indicated to be incorporated by reference.

Claims

1. A laminate film comprising a first layer and a second layer, The first layer has a first surface and a second surface located on a side opposite to the first surface, and the first surface is used to be attached to an adherend. The second layer is laminated on the first surface of the first layer and can be peeled off from the first layer. The first layer is a masking film, The second layer is a layer that is removed after the first layer forms a pattern portion required for partial coating, plating, or etching of the adherend and before the first layer is attached to the adherend. 2 . The laminated film according to claim 1 , wherein the tensile elastic modulus of the first layer is 1000 MPa to 4000 MPa. 3 . The laminated film according to claim 1 , wherein the second layer has a tensile elastic modulus of 1000 MPa to 4000 MPa. 4 . The laminated film according to claim 1 , wherein the first layer comprises a base material layer and an adhesive layer located on the first surface side. The laminated film according to claim 4 , wherein the base layer has a thickness of 30 μm to 70 μm. The laminated film according to claim 4 , wherein the adhesive layer has a thickness of 4 μm to 10 μm. 7 . The laminated film according to claim 1 , wherein the adhesive force of the first layer is greater than or equal to 0.5 N / 25 mm. 8 . The laminated film according to claim 1 , wherein the peeling force of the second layer is greater than or equal to 1.0 N / 25 mm. 9 . The laminated film according to claim 1 , wherein no other layer is arranged on the second surface of the first layer.

10. A method for manufacturing a pattern component, comprising: For the laminated film according to any one of claims 1 to 9, a step of forming a pattern portion required for partial coating, plating or etching of the adherend on the first layer, and peeling the second layer from the laminated film; A step of attaching the first surface of the first layer having the pattern portion formed thereon to an adherend; and A step of forming a pattern corresponding to the pattern portion on the adherend by coating, plating or etching to obtain a pattern member having a pattern formed on the adherend.

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