Device for depositing thin film on inner wall of slender pipe barrel part by laser ignition bipolar pulse arc ion plating process and method for depositing thin film

Abstract

The invention discloses a device for depositing a thin film on the inner wall of a slender pipe barrel part through a laser ignition bipolar pulse arc ion plating process and a method for depositing the thin film, and aims to solve the problems that pulse arc discharge in the slender pipe barrel part is difficult, and the uniformity and the adhesive force of ion plating are poor. According to the device for depositing the thin film on the inner wall of the long and thin pipe barrel part, an electric field auxiliary cylinder is transversely arranged on a second support, a plated pipe is arranged in the electric field auxiliary cylinder in a sleeved mode, a columnar cathode target material is arranged in the plated pipe in a sleeved mode, and a rotating magnet is arranged in the columnar cathode target material in a sleeved mode; and meanwhile, a direct-current bias power supply, a medium-frequency power supply and a positive and reverse bipolar power supply are further arranged, the negative output end of the positive and reverse bipolar power supply is connected with the columnar cathode target material, and the positive output end of the positive and reverse bipolar power supply is connected with the plated tube and is grounded. The bipolar power supply is used for deposition in the reverse pulse period, the ions bombard the coating in the forward pulse period, the behavior of the plasma is adjusted, and the density and uniformity of the plasma are enhanced.

Description

Technical Field

[0001] The present invention belongs to the field of surface treatment, and particularly relates to a device for depositing a film on the inner wall of a slender tube or barrel by a laser-induced bipolar pulsed arc ion plating technique, and a method for depositing a film on the inner wall of a tube or barrel using the same. Background Art

[0002] Slender pipelines are widely used in fields such as petrochemical industry and aerospace. Harsh application scenarios often expose pipelines to high temperature, high pressure, and strong corrosion environments. Therefore, new requirements are put forward for the anti-wear, anti-oxidation, and anti-crack propagation performance of the inner wall of slender tubes. Coating the inner wall of the tube is an effective means to improve the service life of slender tube parts. Currently, the most widely used method for coating the inner wall of the tube is the electroplating process, but the hexavalent chromium generated by this method causes serious environmental pollution.

[0003] However, traditional cathodic arc ion plating and magnetron sputtering technologies have bottlenecks in terms of uniformity and adhesion, and it is difficult to meet the requirements of high-end applications. Summary of the Invention

[0004] The purpose of the present invention is to solve the problems of difficult pulsed arc discharge in the slender tube or barrel, and poor uniformity and adhesion of ion plating, and to propose a device for depositing a film on the inner wall of a slender tube or barrel by a laser-induced bipolar pulsed arc ion plating process and a method for depositing a film.

[0005] The device for depositing a film on the inner wall of a slender tube or barrel by the laser-induced bipolar pulsed arc ion plating process of the present invention includes a vacuum chamber, a positive and negative bipolar power supply, a magnet, a tube to be plated, an electric field-assisted cylinder, a second shielding cover, a columnar cathode target, a second bracket, an intermediate frequency power supply, a third shielding cover, a laser emitter, a focusing lens, and a DC bias power supply. A second bracket is installed in the vacuum chamber, and the electric field-assisted cylinder is horizontally placed on the second bracket. A tube to be plated is sleeved inside the electric field-assisted cylinder, and a columnar cathode target is sleeved inside the tube to be plated. Both ends of the columnar cathode target are fixed by the third shielding cover and the second shielding cover. A rotating magnet is sleeved inside the columnar cathode target. The electric field-assisted cylinder, the tube to be plated, the columnar cathode target, and the magnet are coaxially arranged;

[0006] The laser beam emitted by the laser emitter is irradiated on the columnar cathode target through the focusing lens;

[0007] The negative output terminal of the DC bias power supply is connected to the tube to be plated, the positive output terminal of the DC bias power supply is grounded, the negative output terminal of the intermediate frequency power supply is connected to the columnar cathode target, the positive output terminal of the intermediate frequency power supply is connected to the electric field-assisted cylinder, the negative output terminal of the positive and negative bipolar power supply is connected to the columnar cathode target, and the positive output terminal of the positive and negative bipolar power supply is connected to the tube to be plated and grounded.

[0008] The method for depositing a thin film by using the device for depositing a thin film on the inner wall of a slender tube or barrel part by applying a laser-induced bipolar pulse arc ion plating process is realized according to the following steps:

[0009] I. Glow cleaning the inner wall of the tube or barrel part:

[0010] The vacuum chamber is evacuated, and a working gas is introduced into the vacuum chamber. The negative output terminal of the DC bias power supply is connected to the tube to be plated, the positive output terminal of the DC bias power supply is grounded, the negative output terminal of the medium-frequency power supply is connected to the cylindrical cathode target, and the positive output terminal of the medium-frequency power supply is connected to the electric field-assisted cylinder. The voltage of the DC bias power supply is controlled to be -15 to -600 V, the voltage of the medium-frequency power supply is controlled to be -50 to -1000 V, and the duty cycle is 5% to 90%. The inner surface of the tube to be plated is glow-cleaned by the plasma generated by the self-hollow cathode discharge effect of the electric field-assisted cylinder, and the slender tube or barrel part after glow cleaning is obtained.

[0011] II. Arc cleaning the inner wall of the tube or barrel part:

[0012] The negative output terminals of the positive and negative bipolar power supply are connected to the cylindrical cathode target, the positive output terminals of the positive and negative bipolar power supply are connected to the tube to be plated, the current of the positive output terminal of the positive and negative bipolar power supply is 20 to 460 A, the voltage is 50 to 550 V, the current of the negative output terminal is 30 to 450 A, the voltage is -20 to -530 V, and the electric field-assisted cylinder is grounded for arc cleaning to obtain the slender tube or barrel part after arc cleaning.

[0013] III. Depositing on the inner wall of the tube or barrel part:

[0014] The negative output terminals of the positive and negative bipolar power supply are connected to the cylindrical cathode target, the positive output terminals of the positive and negative bipolar power supply are connected to the tube to be plated and grounded. The negative output terminals of the positive and negative bipolar power supply evaporate the cylindrical cathode target, and the forward voltage of the positive output terminals of the positive and negative bipolar power supply generates a reverse push electric field, so that ions are directionally transmitted to the tube to be plated to compact the film layer. At the same time, a laser emitter emits laser to irradiate the cylindrical cathode target to trigger a cathode arc. The current of the positive output terminal of the positive and negative bipolar power supply is controlled to be 10 to 460 A, the voltage is 50 to 600 V, the current of the negative output terminal is 20 to 480 A, the voltage is -20 to -610 V, and ion plating is carried out to complete the uniform deposition of a metal thin film on the inner wall of the slender tube or barrel part.

[0015] The present invention proposes a "laser-induced bipolar pulsed arc ion plating process", which precisely triggers a cathode arc in a narrow pipeline by laser and combines an auxiliary electric field to stabilize the movement of the arc spot; uses the negative voltage of a bipolar power supply to ionize the cathode arc target material, and its positive voltage accelerates the positive ions generated by the negative voltage, so that the ions are accelerated and deposited on the inner wall of the slender tube, increasing the density of the thin film. This method increases the pulsed current by dozens of times and increases the plasma pressure by hundreds of times. The experimental results show that the device for depositing a thin film on the inner wall of a slender tube by the laser-induced bipolar pulsed arc ion plating process of the present invention can achieve a uniform, dense and highly adhesive coating on the inner wall of a slender tube with an inner diameter of 40 mm, and has good industrial feasibility.

[0016] The device and method for rapidly and uniformly depositing a thin film on the inner wall of a slender tube by the laser-induced bipolar pulsed arc ion plating technology of the present invention have the following beneficial effects:

[0017] The present invention solves the problem of difficult pulsed arc discharge in a slender tube through a laser-induced process. The laser can concentrate sufficient energy on the cathode surface in a very short time, thereby precisely triggering the local vaporization of the cathode. At the moment of triggering, the laser can efficiently vaporize the cathode material and generate ions, generating a sheath layer to cause subsequent pulsed cathode arc discharge. The laser-induced coupling positive and negative pulse device can achieve precise triggering and ionization of a specific area through the laser, realizing selective area coating on the inner wall of the tube. In addition, by controlling the pulsed laser to trigger the arc to match the negative potential discharge process of the positive and negative power supplies, the movement of the arc spot under the condition of no DC arc stabilization is realized;

[0018] Due to the adjustable laser power of the present invention, the method of laser-induced bipolar pulsed arc ion plating can achieve the coating of various refractory metals;

[0019] The device and method of laser-induced bipolar pulsed arc ion plating proposed by the present invention. Compared with the traditional mechanical contact arc ignition, since the non-contact pulsed laser is arranged outside the vacuum chamber. The surface of the cylindrical cathode arc target material is ignited by high-energy incident laser, breaking the limitation of the size of the cathode arc target material, so that this method can be applied to smaller target material sizes to achieve coating;

[0020] The present invention solves the problems of poor coating uniformity and adhesion on the inner wall of slender tubes by depositing during the reverse pulse using a bipolar power supply and bombarding the coating with ions during the forward pulse stage. The bipolar pulse power supply is a special power supply design that can apply positive and negative alternating pulse voltages to the electrodes. Through bipolar pulses, the behavior of the plasma can be adjusted, enhancing the density and uniformity of the plasma and making the deposition process more stable. Bipolar pulses can periodically change the direction and intensity of ion bombardment, enhancing the bombardment effect of ions on the substrate and the deposited thin film, thereby improving the density and adhesion of the thin film. Compared with a unipolar pulse source, bipolar pulses can reduce the stress accumulation inside the thin film and lower the risk of film cracking or peeling. Description of the Drawings

[0021] Figure 1 Fig. is the overall structural schematic diagram of the device for depositing a thin film on the inner wall of a slender tube part by the laser-induced bipolar pulse arc ion plating process in the present invention; wherein 1 - motor, 2 - first gear, 3 - second gear, 4 - base, 5 - first shield, 6 - flange, 7 - vacuum chamber, 8 - positive and negative bipolar power supply, 9 - magnet, 10 - tube to be plated, 11 - electric field-assisted cylinder, 12 - second shield, 13 - cylindrical cathode target, 14 - first bracket, 15 - second bracket, 16 - intermediate frequency power supply, 17 - third shield, 18 - laser emitter, 19 - focusing lens, 20 - observation window, 21 - first ground wire, 22 - second ground wire, 23 - third ground wire, 24 - DC bias power supply, 25 - connecting rod;

[0022] Figure 2 Fig. is the indentation morphology diagram of the TiN thin film deposited on the inner wall of the slender tube part in Example 1;

[0023] Figure 3 Fig. is the scratch morphology diagram of the TiN thin film deposited on the inner wall of the slender tube part in Example 1;

[0024] Figure 4 Fig. is the cross-sectional electron microscope image of the TiN thin film deposited on the inner wall of the slender tube part in Example 2;

[0025] Figure 5 Fig. is the voltage-current waveform diagram of the negative output terminal of the positive and negative bipolar power supply in Example 2;

[0026] Figure 6 Fig. is the voltage waveform diagram of the intermediate frequency power supply in Example 2. Detailed Embodiments

[0027] Specific Embodiment 1: The device for depositing a thin film on the inner wall of an elongated tube by a laser-induced bipolar pulse arc ion plating process in this embodiment includes a vacuum chamber 7, a positive and negative bipolar power supply 8, a magnet 9, a tube to be plated 10, an electric field-assisted cylinder 11, a second shield 12, a columnar cathode target 13, a second bracket 15, an intermediate frequency power supply 16, a third shield 17, a laser emitter 18, a focusing lens 19, and a DC bias power supply 24. A second bracket 15 is installed in the vacuum chamber 7, and the electric field-assisted cylinder 11 is horizontally placed on the second bracket 15. The tube to be plated 10 is sleeved inside the electric field-assisted cylinder 11, and the columnar cathode target 13 is sleeved inside the tube to be plated 10. Both ends of the columnar cathode target 13 are fixed by the third shield 17 and the second shield 12. A rotating magnet 9 is sleeved inside the columnar cathode target 13. The electric field-assisted cylinder 11, the tube to be plated 10, the columnar cathode target 13, and the magnet 9 are coaxially arranged;

[0028] The laser beam emitted by the laser emitter 18 is irradiated on the columnar cathode target 13 through the focusing lens 19;

[0029] The negative output terminal of the DC bias power supply 24 is connected to the tube to be plated 10, the positive output terminal of the DC bias power supply 24 is grounded, the negative output terminal of the intermediate frequency power supply 16 is connected to the columnar cathode target 13, the positive output terminal of the intermediate frequency power supply 16 is connected to the electric field-assisted cylinder 11, the negative output terminal of the positive and negative bipolar power supply 8 is connected to the columnar cathode target 13, and the positive output terminal of the positive and negative bipolar power supply 8 is connected to the tube to be plated 10 and grounded.

[0030] In this embodiment, the first bracket 14 is fixed in the electric field-assisted cylinder 11 to support the tube to be plated 10. The second bracket 15 is connected to the electric field-assisted cylinder 11 and its height is adjustable, aiming to ensure that the tube to be plated 10, the electric field-assisted cylinder 11, and the columnar cathode target 13 are coaxially placed.

[0031] Specific Embodiment 2: The difference between this embodiment and Specific Embodiment 1 is that a first bracket 14 is provided inside the electric field-assisted cylinder 11, and the tube to be plated 10 is supported and fixed by the first bracket 14.

[0032] Specific Embodiment 3: The difference between this embodiment and Specific Embodiment 1 or 2 is that the magnet 9 is cylindrical, and the length of the magnet 9 is half of that of the tube to be plated 10.

[0033] Specific Embodiment 4: The difference between this embodiment and any one of Specific Embodiments 1 to 3 is that the material of the columnar cathode target 13 is Cr, Ti, Ta, Al, Fe, TiAl alloy, CrTa alloy, or CrAl alloy.

[0034] Specific Embodiment 5: The method for depositing a thin film using the device for depositing a thin film on the inner wall of an elongated tube by a laser-induced bipolar pulse arc ion plating process in this embodiment is implemented according to the following steps:

[0035] 1. Glow cleaning of the inner wall of the tube:

[0036] The vacuum chamber 7 is evacuated, and the working gas is introduced into the vacuum chamber 7. The negative output terminal of the DC bias power supply 24 is connected to the tube to be plated 10, the positive output terminal of the DC bias power supply 24 is grounded, the negative output terminal of the medium-frequency power supply 16 is connected to the cylindrical cathode target 13, and the positive output terminal of the medium-frequency power supply 16 is connected to the electric field-assisted cylinder 11. The voltage of the DC bias power supply 24 is controlled to be -15 to -600 V, the voltage of the medium-frequency power supply 16 is controlled to be -50 to -1000 V, and the duty cycle is 5% to 90%. The inner surface of the tube to be plated 10 is subjected to glow cleaning by the plasma generated by the self-hollow cathode discharge effect of the electric field-assisted cylinder 11, and the slender tube after glow cleaning is obtained;

[0037] 2. Arc cleaning of the inner wall of the tube:

[0038] The negative output terminal of the positive and negative bipolar power supply 8 is connected to the cylindrical cathode target 13, the positive output terminal of the positive and negative bipolar power supply 8 is connected to the tube to be plated 10, the current at the positive output terminal of the positive and negative bipolar power supply 8 is 20 to 460 A, the voltage is 50 to 550 V, the current at the negative output terminal is 30 to 450 A, the voltage is -20 to -530 V, and the electric field-assisted cylinder 11 is grounded for arc cleaning to obtain the slender tube after arc cleaning;

[0039] 3. Deposition on the inner wall of the tube:

[0040] The negative output terminal of the positive and negative bipolar power supply 8 is connected to the cylindrical cathode target 13, the positive output terminal of the positive and negative bipolar power supply 8 is connected to the tube to be plated 10 and grounded. The negative output terminal of the positive and negative bipolar power supply 8 evaporates the cylindrical cathode target 13, and the forward voltage at the positive output terminal of the positive and negative bipolar power supply 8 generates a reverse-pushing electric field, so that ions are directionally transmitted to the tube to be plated 10 to compact the film layer; meanwhile, the laser emitter 18 emits laser irradiation onto the cylindrical cathode target 13 to trigger a cathode arc; the current at the positive output terminal of the positive and negative bipolar power supply 8 is controlled to be 10 to 460 A, the voltage is 50 to 600 V, the current at the negative output terminal is 20 to 480 A, the voltage is -20 to -610 V, and ion plating is carried out to complete the uniform deposition of the metal film on the inner wall of the slender tube.

[0041] Specific Embodiment 6: The difference between this embodiment and Specific Embodiment 5 is that the working gas in step 1 is argon, helium, oxygen, nitrogen, hydrogen, Ar+O 2 、Ar+N 2 、Ar+H 2 、O 2 +N 2 、O 2 +CH 4, Ar + He or Ar + Xe.

[0042] Embodiment 7: The difference between this embodiment and Embodiment 6 or 7 is that in Step 1, working gas is introduced into the vacuum chamber 7, and the air pressure in the vacuum chamber 7 is controlled to be 1 - 50 Pa.

[0043] Embodiment 8: The difference between this embodiment and one of Embodiments 6 to 7 is that in Step 1, the glow cleaning time is 10 min - 100 min.

[0044] Embodiment 9: The difference between this embodiment and one of Embodiments 6 to 7 is that in Step 2, the arc cleaning time is 5 min - 60 min.

[0045] Embodiment 10: The difference between this embodiment and one of Embodiments 6 to 9 is that in Step 3, the ion plating time is 10 min - 200 min.

[0046] Example 1: The device for depositing a film on the inner wall of a slender tube by the laser - ignited bipolar pulse arc ion plating process in this example includes a vacuum chamber 7, a positive and negative bipolar power supply 8, a magnet 9, a tube to be plated 10, an electric - field - assisted cylinder 11, a second shielding cover 12, a cylindrical cathode target 13, a second bracket 15, an intermediate - frequency power supply 16, a third shielding cover 17, a laser emitter 18, a focusing lens 19, and a DC bias power supply 24. A second bracket 15 is installed in the vacuum chamber 7. The electric - field - assisted cylinder 11 is horizontally placed on the second bracket 15. A tube to be plated 10 is sleeved inside the electric - field - assisted cylinder 11. The tube to be plated 10 is supported by a first bracket 14. A cylindrical cathode target 13 is sleeved inside the tube to be plated 10. Both ends of the cylindrical cathode target 13 are fixed by the third shielding cover 17 and the second shielding cover 12 respectively. A flange 6 is provided at the end of the third shielding cover 17. The flange 6 is connected to a base 4 through a first shielding cover 5. A second gear 3 is provided on the base 4. The motor 1 drives the first gear 2 to rotate. The second gear 3 meshes with the first gear 2. The second gear 3 is connected to the magnet 9 through a connecting rod 25. A magnet 9 is sleeved inside the cylindrical cathode target 13. The electric - field - assisted cylinder 11, the tube to be plated 10, the cylindrical cathode target 13, and the magnet 9 are coaxially arranged;

[0047] The laser beam emitted by the laser emitter 18 is irradiated on the cylindrical cathode target 13 through the focusing lens 19, and the laser moves along the axial direction of the cylindrical cathode target 13;

[0048] The negative output terminal of the DC bias power supply 24 is connected to the tube to be plated 10, the positive output terminal of the DC bias power supply 24 is grounded (the second ground wire 22), the negative output terminal of the intermediate frequency power supply 16 is connected to the columnar cathode target 13, the positive output terminal of the intermediate frequency power supply 16 is connected to the electric field-assisted cylinder 11, the negative output terminal of the positive and reverse bipolar power supply 8 is connected to the columnar cathode target 13, the positive output terminal of the positive and reverse bipolar power supply 8 is connected to the tube to be plated 10 and grounded (the third ground wire 23), and the electric field-assisted cylinder 11 is connected to the first ground wire 21.

[0049] Application Example 1: The method for depositing a thin film using the device for depositing a thin film on the inner wall of the slender tube member in Application Example 1 is realized according to the following steps:

[0050] I. Glow cleaning the inner wall of the tube member:

[0051] The vacuum chamber 7 is evacuated, argon gas is introduced into the vacuum chamber 7, the air pressure in the vacuum chamber 7 is 5 Pa, the negative output terminal of the DC bias power supply 24 is connected to the tube to be plated 10, the positive output terminal of the DC bias power supply 24 is grounded, the negative output terminal of the intermediate frequency power supply 16 is connected to the columnar cathode target 13, the positive output terminal of the intermediate frequency power supply 16 is connected to the electric field-assisted cylinder 11, the voltage of the DC bias power supply 24 is controlled to be -100 V, the voltage of the intermediate frequency power supply 16 is controlled to be -230 V, the duty cycle is 25%, and the inner surface of the tube to be plated 10 is glow-cleaned for 20 min by the plasma generated by the self-hollow cathode discharge effect of the electric field-assisted cylinder 11, and the slender tube member after glow cleaning is obtained;

[0052] II. Arc cleaning the inner wall of the tube member:

[0053] Maintain the air pressure in the vacuum chamber 7 at 5 Pa, connect the negative output terminal of the positive and reverse bipolar power supply 8 to the columnar cathode target 13, connect the positive output terminal of the positive and reverse bipolar power supply 8 to the tube to be plated 10, the current at the positive output terminal of the positive and reverse bipolar power supply 8 is 50 A, the voltage is 120 V, the current at the negative output terminal is 150 A, the voltage is -200 V, and the electric field-assisted cylinder 11 is grounded, and arc cleaning is carried out for 18 min to obtain the slender tube member after arc cleaning;

[0054] III. Depositing on the inner wall of the tube member:

[0055] The air pressure in the vacuum chamber 7 is 5 Pa, the working gas is nitrogen, the columnar cathode target 13 is a Ti target. Connect the negative output terminal of the positive and negative bipolar power supply 8 to the columnar cathode target 13, connect the positive output terminal of the positive and negative bipolar power supply 8 to the tube to be plated 10 and ground it. The negative output terminal evaporates the columnar cathode target, and the forward voltage at the positive output terminal generates a reverse thrust electric field, enabling the ions to be directionally transported to the tube to be plated 10 to compact the film layer. At the same time, the pulse power of the laser emitter 18 is 250 W, and the laser emission frequency of the laser emitter 18 matches the rotation frequency of the motor 1 to maintain the stability of the arc spot. Control the current at the positive output terminal of the positive and negative bipolar power supply 8 to be 55 A, the voltage to be 65 V, the current at the negative output terminal to be 75 A, and the voltage to be -100 V, and perform ion plating for 50 min to complete the uniform deposition of the metal film on the inner wall of the slender tube.

[0056] In this embodiment, the slender tube is made of 304 stainless steel with an inner diameter of 40 mm and a length of 400 mm.

[0057] In step three of this embodiment, the positive output terminal and the negative output terminal of the positive and negative bipolar power supply output positive voltage and negative voltage respectively. When the positive output terminal outputs 65 V, the voltage at the negative output terminal is 0 V; when the negative output terminal outputs -100 V, the positive output terminal outputs 0 V.

[0058] Figure 2 It is the indentation morphology diagram of the TiN film deposited on the inner wall of the slender tube in this embodiment; the indentation of the TiN film deposited on the inner wall of the slender tube is a complete circular indentation, and there is no large-area film shedding area at the edge of the circular indentation, indicating that the TiN film deposited on the inner wall is tightly structured with the substrate and the connection is reliable.

[0059] Figure 3 It is the scratch morphology diagram of the TiN film deposited on the inner wall of the slender tube in this embodiment; the scratch is relatively smooth, the surface is relatively uniform, and there is no large-area cracking and falling of the film layer, and it has relatively good adhesion.

[0060] Application Example 2: The method for depositing a film using the device for depositing a film on the inner wall of the slender tube in Application Example 1 of this embodiment is realized according to the following steps:

[0061] I. Glow cleaning the inner wall of the tube:

[0062] The vacuum chamber 7 is evacuated, and argon gas is introduced into the vacuum chamber 7. The air pressure in the vacuum chamber 7 is 5 Pa. The negative output terminal of the DC bias power supply 24 is connected to the tube to be plated 10, and the positive output terminal of the DC bias power supply 24 is grounded. The negative output terminal of the medium-frequency power supply 16 is connected to the cylindrical cathode target 13, and the positive output terminal of the medium-frequency power supply 16 is connected to the electric field-assisted cylinder 11. The voltage of the DC bias power supply 24 is controlled to be -120 V, and the voltage of the medium-frequency power supply 16 is controlled to be -180 V, with a duty cycle of 35%. The inner surface of the tube to be plated 10 is subjected to glow cleaning for 30 min by the plasma generated by the self-hollow cathode discharge effect of the electric field-assisted cylinder 11, and the slender tube barrel part after glow cleaning is obtained;

[0063] II. Arcing cleaning the inner wall of the tube barrel part:

[0064] Maintain the air pressure in the vacuum chamber 7 at 5 Pa. Connect the negative output terminal of the positive and negative bipolar power supply 8 to the cylindrical cathode target 13, and connect the positive output terminal of the positive and negative bipolar power supply 8 to the tube to be plated 10. The current at the positive output terminal of the positive and negative bipolar power supply 8 is 100 A, and the voltage is 155 V. The current at the negative output terminal is 120 A, and the voltage is -220 V. The electric field-assisted cylinder 11 is grounded, and arcing cleaning is carried out for 23 min to obtain the slender tube barrel part after arcing cleaning;

[0065] III. Deposition on the inner wall of the tube barrel part:

[0066] The air pressure in the vacuum chamber 7 is 5 Pa, the working gas is nitrogen, and the cylindrical cathode target 13 is a Ti target. Connect the negative output terminal of the positive and negative bipolar power supply 8 to the cylindrical cathode target 13, connect the positive output terminal of the positive and negative bipolar power supply 8 to the tube to be plated 10 and ground it. The negative output terminal evaporates the target material, and the positive voltage at the positive output terminal generates a reverse push electric field, so that ions are directionally transmitted to the tube to be plated 10 to compact the film layer. At the same time, the pulse power of the laser emitter 18 is 500 W, and the laser emission frequency of the laser emitter 18 matches the rotation frequency of the motor 1 to maintain the stability of the arc spot. Control the current at the positive output terminal of the positive and negative bipolar power supply 8 to be 55 A and the voltage to be 100 V, and the current at the negative output terminal to be 55 A and the voltage to be -600 V, and carry out ion plating for 55 min to complete the uniform deposition of the metal film on the inner wall of the slender tube barrel part.

[0067] In this embodiment, the slender tube barrel part is made of 304 stainless steel with an inner diameter of 40 mm and a length of 400 mm.

[0068] Figure 4 This is the cross-sectional electron microscope image of the TiN film deposited on the inner wall of the slender tube barrel part in this embodiment. Figure 4 (a)(b)(c)(d) are the films deposited on the inner walls of different parts of the slender tube barrel part by the laser-induced bipolar pulse arc ion plating technology, indicating that the overall uniformity of the film thickness deposited by the laser-induced bipolar pulse arc ion plating technology on the inner wall of the slender tube barrel part is good.

[0069] Figure 5 This is the voltage and current waveform diagram of the negative output terminal of the bidirectional pulse hollow cathode discharge power supply in this embodiment. The negative pulse voltage is -600V, the positive pulse voltage is 100V, the frequencies of both are 120Hz, and the pulse width of the negative pulse voltage is 10μs.

[0070] The pulse width of the positive pulse voltage is 15μs.

[0071] Figure 6 This is the voltage waveform diagram of the intermediate frequency power supply in this embodiment. The voltage is -180V and the pulse width is 5μs.

Claims

1. A device for depositing a thin film on the inner wall of a slender tube by laser-ignited bipolar pulse arc ion plating process, characterized in that The device for depositing a thin film on the inner wall of a slender tube member by a laser-ignited bipolar pulse arc ion plating process comprises a vacuum chamber (7), a forward and reverse bipolar power supply (8), a magnet (9), a plated tube (10), an electric field auxiliary cylinder (11), a second shielding cover (12), a columnar cathode target (13), a second bracket (15), an intermediate frequency power supply (16), a third shielding cover (17), a laser emitter (18), a focusing lens (19) and a DC bias power supply (24). The second bracket is installed in the vacuum chamber (7). (15), the electric field auxiliary cylinder (11) is horizontally placed on the second bracket (15), a plated tube (10) is sleeved in the electric field auxiliary cylinder (11), a columnar cathode target (13) is sleeved in the plated tube (10), two ends of the columnar cathode target (13) are fixed by a third shielding cover (17) and a second shielding cover (12), a rotating magnet (9) is sleeved in the columnar cathode target (13), and the electric field auxiliary cylinder (11), the plated tube (10), the columnar cathode target (13) and the magnet (9) are coaxially arranged; The laser beam emitted by the laser emitter (18) is irradiated onto the columnar cathode target (13) via a focusing lens (19); The negative output end of the DC bias power supply (24) is connected to the plated tube (10), the positive output end of the DC bias power supply (24) is grounded, the negative output end of the intermediate frequency power supply (16) is connected to the columnar cathode target (13), the positive output end of the intermediate frequency power supply (16) is connected to the electric field auxiliary cylinder (11), the negative output end of the positive and reverse bipolar power supply (8) is connected to the columnar cathode target (13), and the positive output end of the positive and reverse bipolar power supply (8) is connected to the plated tube (10) and is grounded.

2. The device for depositing a thin film on the inner wall of a slender tube by laser-ignited bipolar pulse arc ion plating process according to claim 1, characterized in that A first bracket (14) is arranged inside the electric field auxiliary cylinder (11), and the plated tube (10) is supported and fixed by the first bracket (14).

3. The device for depositing a thin film on the inner wall of a slender tube by laser-ignited bipolar pulse arc ion plating process according to claim 1, characterized in that The magnet (9) is cylindrical, and the length of the magnet (9) is half of the plated tube (10).

4. The device for depositing a thin film on the inner wall of a slender tube by laser-ignited bipolar pulse arc ion plating process according to claim 1, characterized in that The material of the columnar cathode target (13) is Cr, Ti, Ta, Al, Fe, TiAl alloy, CrTa alloy or CrAl alloy.

5. A method for depositing a thin film by using the device for depositing a thin film on the inner wall of a slender tube by using the laser-ignited bipolar pulse arc ion plating process as claimed in claim 1, characterized in that The method for depositing a thin film is implemented according to the following steps:

1. Glow cleaning the inner wall of tube parts: The vacuum chamber (7) is evacuated, and working gas is introduced into the vacuum chamber (7). The negative output end of the DC bias power supply (24) is connected to the plated tube (10), the positive output end of the DC bias power supply (24) is grounded, the negative output end of the intermediate frequency power supply (16) is connected to the columnar cathode target (13), and the positive output end of the intermediate frequency power supply (16) is connected to the electric field auxiliary cylinder (11). The voltage of the DC bias power supply (24) is controlled to be -15 to -600V, the voltage of the intermediate frequency power supply (16) is controlled to be -50 to -1000V, and the duty cycle is 5% to 90%. The inner surface of the plated tube (10) is glow cleaned by plasma generated by the self-hollow cathode discharge effect of the electric field auxiliary cylinder (11), and a slender tube member after glow cleaning is obtained; 2. Arc cleaning the inner wall of tube parts: The negative output end of the positive and reverse bipolar power supply (8) is connected to the columnar cathode target (13), the positive output end of the positive and reverse bipolar power supply (8) is connected to the plated tube (10), the positive output end of the positive and reverse bipolar power supply (8) has a current of 20 to 460A and a voltage of 50 to 550V, the negative output end has a current of 30 to 450A and a voltage of -20 to -530V, the electric field auxiliary cylinder (11) is grounded, arc cleaning is performed, and a slender tube member after arc cleaning is obtained; 3. Deposition on the inner wall of tube and barrel: The negative output end of the positive and reverse bipolar power supply (8) is connected to the columnar cathode target (13), the positive output end of the positive and reverse bipolar power supply (8) is connected to the plated tube (10) and grounded, the negative output end of the positive and reverse bipolar power supply (8) evaporates the columnar cathode target (13), the positive voltage of the positive output end of the positive and reverse bipolar power supply (8) generates a reverse thrust electric field, so that ions are transmitted to the plated tube (10) in a direction to compact the film layer; at the same time, the laser emitter (18) emits laser to irradiate the columnar cathode target (13) to trigger a cathode arc; the positive output end of the positive and reverse bipolar power supply (8) is controlled to have a current of 10 to 460A and a voltage of 50 to 600V, and the negative output end is controlled to have a current of 20 to 480A and a voltage of -20 to -610V, to perform ion plating, and to complete the uniform deposition of a metal film on the inner wall of a slender tube.

6. The method for depositing a thin film on the inner wall of a slender tube by using a laser-ignited bipolar pulse arc ion plating process according to claim 5, characterized in that The working gas in step 1 is argon, helium, oxygen, nitrogen, hydrogen, Ar+O2, Ar+N2, Ar+H2, O2+N2, O2+CH4, Ar+He or Ar+Xe.

7. The method for depositing a thin film on the inner wall of a slender tube by using a laser-ignited bipolar pulse arc ion plating process according to claim 5, characterized in that In step 1, working gas is introduced into the vacuum chamber (7), and the gas pressure of the vacuum chamber (7) is controlled to be 1-50 Pa.

8. The method for depositing a thin film on the inner wall of a slender tube by using a laser-ignited bipolar pulse arc ion plating process according to claim 5, characterized in that The glow cleaning time in step 1 is 10 minutes to 100 minutes.

9. The method for depositing a thin film on the inner wall of a slender tube by using a laser-ignited bipolar pulse arc ion plating process according to claim 5, characterized in that The arc cleaning time in step 2 is 5 minutes to 60 minutes.

10. The method for depositing a thin film on the inner wall of a slender tube by using a laser-ignited bipolar pulse arc ion plating process according to claim 5, characterized in that The time of ion plating in step 3 is 10 minutes to 200 minutes.

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