Component automatic detection method

Abstract

The invention provides an automatic component detection method which comprises the following steps: preparing an ultrasonic detection head: immersing the ultrasonic detection head of an ultrasonic detector into water in a film container, the bottom of the film container being a high-permeability film; the component is placed on a moving station, the moving station conveys the component to the position below a spraying assembly, the spraying assembly sprays water mist to the top face of the component, and a pretreated component is obtained; the pretreatment component is detected, specifically, the pretreatment component is conveyed to the position below an ultrasonic detection head through the moving station, the top face of the pretreatment component abuts against a high-permeability membrane so that the detection end of the ultrasonic detection head can be opposite to the position of the pretreatment component, an ultrasonic detector conducts ultrasonic detection on the pretreatment component, and a detected component is obtained; and component drying: the detected component is conveyed to a drying assembly, the drying assembly is started, and the detected component is dried. The component detection method is high in automation degree and high in component detection efficiency.

Description

Technical Field

[0001] This application relates to the technical field of component performance detection, and particularly to an automatic component detection method. Background Art

[0002] Currently, in the reliability screening work of electronic components in the aerospace field, ultrasonic detectors are the designated non-destructive detection means for internal defects of components. During the detection process, manual operations such as device placement, movement, and detection are required. The entire reliability screening process of the device is mainly completed manually, with a low degree of automation, which affects the overall screening efficiency and results in high labor costs. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose an automatic component detection method to solve the problems of low automation and low detection efficiency in the current internal defect detection method of components.

[0004] Based on the above purpose, this application provides an automatic component detection method, including:

[0005] Ultrasonic detection head preparation: Immerse the ultrasonic detection head of the ultrasonic detector in the water of the thin film container, where the bottom of the thin film container is a high-permeability film;

[0006] Component pretreatment: Place the component on the moving station, and the moving station transports the component to below the spraying assembly. The spraying assembly sprays water mist on the top surface of the component to obtain a pre-treated component;

[0007] Pre-treated component detection: The moving station transports the pre-treated component to below the ultrasonic detection head and presses the top surface of the pre-treated component against the high-permeability film so that the detection end of the ultrasonic detection head is opposite to the position of the pre-treated component. The ultrasonic detector performs ultrasonic detection on the pre-treated component to obtain a post-detection component;

[0008] Component drying: Transport the post-detection component to the drying assembly, start the drying assembly, and dry the post-detection component.

[0009] Optionally, placing the component on the moving station includes: The feeding assembly places the component on the moving station. The feeding assembly includes a first slide rail, a first slider, and a first vacuum suction nozzle. Part of the first slide rail is located above the moving station. The first slider is slidably connected to the first slide rail, and the first vacuum suction nozzle is installed on the first slider. The first vacuum suction nozzle adsorbs the component and transports it to the moving station through the first slider and the first slide rail.

[0010] Optionally, the first vacuum suction nozzle adsorbs the component and transports it to the moving station through the first slider and the first slide rail, including: the first vacuum suction nozzle transports the adsorbed component to the card slot of the moving station, wherein the card slot penetrates through the moving station.

[0011] Optionally, the spraying assembly sprays water mist on the top surface of the component, including: pressurizing the water tank to make water flow through the water spraying pipe to the nozzle, and the nozzle is located above the component and sprays water mist on the top of the component. Optionally, abutting the top surface of the pre-treated component against the high-transparency film includes: the lifting assembly controls the component to rise so that the top surface of the component abuts against the high-transparency film, wherein the lifting assembly is a lift. After the component moves to below the ultrasonic detection head, the output shaft of the lift penetrates through the card slot to make the top surface of the component abut against the high-transparency film.

[0012] Optionally, transporting the post-tested component to the drying assembly includes: the discharging assembly removes the component from the moving station, wherein the discharging assembly includes a second vacuum suction nozzle, a second slider and a second slide rail. The second slide rail is installed on the installation platform and part of the second slide rail is located above the moving station. The second slider is slidably connected to the first slide rail. The second vacuum suction nozzle is installed on the second slider. The second vacuum suction nozzle adsorbs the component after detection and removes the component from the moving station through the second slider and the second slide rail.

[0013] Optionally, the second vacuum suction nozzle adsorbs the component after detection and removes the component from the moving station through the second slider and the second slide rail, including: the second vacuum suction nozzle adsorbs the component after detection and removes it from the moving station and places it in the tray.

[0014] Optionally, transporting the post-tested component to the drying assembly further includes: the tray slides into the drying assembly through the third slide rail.

[0015] Optionally, the ultrasonic detector performs ultrasonic detection on the pre-treated component, including: the ultrasonic detection head emits ultrasonic waves and pulsed lasers to the component and receives the ultrasonic waves returned from the component. One side of the ultrasonic detection head is provided with a pulsed laser, and the pulsed laser emits pulsed lasers. The ultrasonic detection head is provided with a through hole for the pulsed laser to pass through.

[0016] Optionally, the base of the ultrasonic detector is hollow and internally provided with a reflecting lens. The output end of the pulsed laser is connected to a collimator through an optical fiber so that the output end of the collimator emits pulsed lasers to penetrate through the base and pass through the through hole through the reflecting lens.

[0017] Optionally, a Peltier element is provided on one side of the inner wall of the thin film container to lower the water temperature.

[0018] Optionally, the ultrasonic detection head includes an ultrasonic transducer and a detection head body. The detection head body is hollow, the ultrasonic transducer is installed in the detection head body, a through hole is provided through the ultrasonic transducer, and the ultrasonic transducer is used to transmit ultrasonic waves and receive the ultrasonic waves returned from the component, and convert them into ultrasonic signals.

[0019] Optionally, the ultrasonic detection head further includes a lens, which is installed in the detection head body and below the ultrasonic transducer, and is used to adjust the spot size of the pulsed laser emitted by the pulsed laser.

[0020] Based on the same inventive concept, the present disclosure also provides an electronic device, including a memory, a processor, and a computer program stored on the memory and running on the processor. The characteristic is that when the processor executes the program, the above-mentioned method is implemented.

[0021] Based on the same inventive concept, the present disclosure also provides a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to cause a computer to execute the above-mentioned method.

[0022] As can be seen from the above, the present application provides a method for automatically detecting components. After placing the components on the moving station, the moving station drives the components to rotate under the spraying assembly. The spraying assembly sprays water mist on the top surface of the components to wet the top surface of the components. The moving station drives the components to move under the ultrasonic detection head. The components abut against the high-transparency film, and the high-transparency film flattens the water mist on the top surface of the components to form an ultra-thin water film, so that the ultrasonic detection head can detect the components. After the ultrasonic detection head finishes detecting the components, the drying assembly dries the components. The above method for detecting components has a high degree of automation, saves manpower, and improves the detection efficiency of components; in addition, this method of detecting components separates the components from the ultrasonic detection head. Without affecting the detection effect of the components, it avoids the components being directly immersed in water and avoids the internal defects of the components being filled with water and affecting the detection effect, thereby improving the detection accuracy of the components. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the present application or related technologies, the following will briefly introduce the drawings required for use in the embodiments or related technology descriptions. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0024] Figure 1 It is a flowchart of the test method of the embodiment of the present application;

[0025] Figure 2 It is a schematic structural diagram of the feeding component shown in the embodiment of the present application;

[0026] Figure 3 It is a schematic structural diagram of the ultrasonic detection head shown in the embodiment of the present application;

[0027] Figure 4 It is a schematic structural diagram of the pulsed laser shown in the embodiment of the present application;

[0028] Figure 5 It is a schematic structural diagram of the discharging component shown in the embodiment of the present application;

[0029] Figure 6 It is a schematic diagram of the spraying component shown in the embodiment of the present application;

[0030] Figure 7 It is a schematic structural diagram of the hardware of the electronic device shown in the embodiment of the present application.

[0031] Reference numerals: 1, moving station; 11, card slot; 12, supporting tray; 13, third slide rail; 2, spraying component; 21, nozzle; 211, spray hole; 212, dripping section; 22, spray water pipe; 3, ultrasonic detection component; 31, ultrasonic detector; 311, ultrasonic detection head; 3111, ultrasonic transducer; 3112, detection head body; 0311, through hole; 32, thin film container; 321, high-permeability film; 33, pulsed laser; 34, base; 35, collimator; 36, lens; 37, signal conditioning module; 38, data acquisition module; 39, control module; 4, lifting component; 5, drying component; 6, installation platform; 7, feeding component; 71, first slide rail; 72, first slider; 73, first vacuum suction nozzle; 8, discharging component; 81, second vacuum suction nozzle; 82, second slider; 83, second slide rail. Detailed implementation manners

[0032] In order to make the purpose, technical solutions and advantages of the present application clearer and more understandable, the following further details the present application in combination with specific embodiments and with reference to the accompanying drawings.

[0033] It should be noted that unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the ordinary meanings understood by those of ordinary skill in the field to which this application belongs. The "first", "second" and similar terms used in the embodiments of this application do not denote any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "linked" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0034] Based on the background described above, in the current aerospace field, the reliability screening work of electronic components plays a crucial role. This link is directly related to the safety performance and operation stability of aircraft and spacecraft. Among them, the ultrasonic detector, as the core means for detecting internal defects of components, has been widely adopted as the standard method for non-destructive testing. With its high precision and sensitivity to the internal structure of materials, the ultrasonic detector can accurately identify tiny defects inside components, such as cracks, inclusions or pores, etc., so as to ensure that only high-quality components are used in the manufacture of aerospace equipment.

[0035] However, although the ultrasonic detector has significant technical advantages, in the actual application process, its detection process highly depends on manual operation. From the placement and movement of components to the specific detection steps, all need to be completed manually. This highly manual operation mode not only increases the errors that may be brought by human factors, but also makes the automation degree of the entire reliability screening process relatively low. This not only affects the efficiency of the screening work, but also limits the application potential of the ultrasonic detector in a larger scale and more complex environment.

[0036] The following will Figure 1-7 be described in detail with reference to the embodiments of this application.

[0037] As Figure 1 , Figure 2 and Figure 3 shown, an automatic component detection method includes:

[0038] Preparation of the ultrasonic detection head 311: Immerse the ultrasonic detection head 311 of the ultrasonic detector 31 in the water of the thin film container 32, where the bottom of the thin film container 32 is a high-permeability film 321;

[0039] Pretreatment of components: Place the components on the moving station 1, and the moving station 1 transports the components below the spraying assembly 2. The spraying assembly 2 sprays water mist on the top surface of the components to obtain pretreated components;

[0040] Detection of pretreated components: The moving station 1 transports the pretreated components below the ultrasonic detection head 311, and abuts the top surface of the pretreated components against the high-transparency film 321, so that the detection end of the ultrasonic detection head 311 is opposite to the position of the pretreated components. The ultrasonic detector 31 performs ultrasonic detection on the pretreated components to obtain post-detection components;

[0041] Drying of components: Transport the post-detection components to the drying assembly 5, start the drying assembly 5, and dry the post-detection components.

[0042] Specifically, the ultrasonic detector 31 is a water-immersion ultrasonic detector 31. Therefore, water is required as a coupling agent between the components and the ultrasonic detection head 311. The thin-film container 32 is a water-containing container. The thin-film container 32 is connected to the ultrasonic detector 31 through a bracket. The bottom of the thin-film container 32 is the high-transparency film 321. The high-transparency film 321 can be adhered to the side wall of the container through an adhesive. The high-transparency film 321 can be a polyethylene film. The polyethylene film has high transparency and certain strength, which is beneficial to the transmission of ultrasonic waves and can bear the water in the thin-film container 32. The moving station 1 drives the wetted components to move below the ultrasonic detector 31 and makes the components abut against the high-transparency film 321. The high-transparency film 321 flattens the water mist on the top surface of the components to form an ultra-thin water film for the ultrasonic detection head 311 to detect the components. This method of detecting components separates the components from the ultrasonic detection head 311 through the high-transparency film 321. Without affecting the detection effect of the components, it avoids the components being directly immersed in water, thereby preventing the internal defects of the components from being filled with water and affecting the detection effect.

[0043] In this embodiment, after the components are placed on the moving station 1, the moving station 1 drives the components to rotate below the spraying assembly 2. The spraying assembly 2 sprays water mist on the top surface of the components to wet the top surface of the components. The moving station 1 drives the components to move below the ultrasonic detection head 311. The components abut against the high-transparency film 321. The high-transparency film 321 flattens the water mist on the top surface of the components to form an ultra-thin water film for the ultrasonic detection head 311 to detect the components. After the detection is completed, the drying assembly 5 dries the components. The above process of detecting components has a high degree of automation, saves manpower, and improves the detection efficiency of components; in addition, this method of detecting components separates the components from the ultrasonic detection head 311. Without affecting the detection effect of the components, it avoids the components being directly immersed in water and prevents the internal defects of the components from being filled with water and affecting the detection effect, thereby improving the detection accuracy of the components.

[0044] In some embodiments, such as Figure 3 , Figure 4 and Figure 5 shown, the ultrasonic detector 31 performs ultrasonic detection on the preprocessing components, including: the ultrasonic detection head 311 emits ultrasonic waves and pulsed lasers to the components and receives the ultrasonic waves returned from the components. Wherein, a pulsed laser 33 is provided on one side of the ultrasonic detection head 311, the pulsed laser 33 emits pulsed lasers, and a through hole for the pulsed laser to pass through is provided on the ultrasonic detection head 311.

[0045] Specifically, the ultrasonic detection assembly 3 includes an ultrasonic detector 31, a thin film container 32, and a pulsed laser 33. The ultrasonic detection head 311 on the ultrasonic detector 31 is used to emit ultrasonic waves to the components, and the pulsed laser 33 is used to emit pulsed lasers. By providing a through hole 0311 on the ultrasonic detection head 311 for the pulsed laser to pass through, the ultrasonic detection head has the function of simultaneously emitting ultrasonic waves and pulsed lasers. When the ultrasonic detection head 311 detects the components, the ultrasonic waves emitted by the ultrasonic detection head 311 reach the surface of the components and then return, and are received by the ultrasonic detection head 311 again, so as to obtain the high-precision defect morphology on the surface of the components. The pulsed laser emitted by the ultrasonic detection head 311 excites ultrasonic waves on the surface of the components, and the ultrasonic waves propagate inside the components, reflect when encountering an interface, and are received by the ultrasonic detection head 311 again, so as to obtain the high-precision defect morphology at different depths inside the components. Therefore, the ultrasonic detector 31 in this application adopts the method of combining laser ultrasonic and conventional ultrasonic into one, and simultaneously obtains the high-precision defect morphology on the surface of the components and the defect morphology at different depths inside the components through one scan, improving the comprehensiveness of component detection, and thus improving the detection efficiency of components.

[0046] In some embodiments, the base 34 of the ultrasonic detector 31 is hollow and internally provided with a reflecting lens. The output end of the pulsed laser 33 is connected to a collimator 35 through an optical fiber. The collimator 35 is provided on one side of the base 34, and the output end of the collimator 35 emits pulsed lasers that penetrate the base 34 and pass through the through hole 0311 through the reflecting lens.

[0047] In this embodiment, the laser pulser is connected to the collimator 35. The collimator 35 converts the light beam emitted by the pulsed laser 33 into a parallel light beam and focuses the parallel light beam into a pulsed laser beam with a smaller diameter, thereby improving the energy and effect of the pulsed laser. The base 34 is used to install the ultrasonic detection head 311. The base 34 is hollow and internally provided with a reflecting lens, which is convenient for adjusting the transmission angle of the pulsed laser so that it accurately passes through the through hole 0311 on the ultrasonic detection head 311, so that the ultrasonic detection head 311 simultaneously has the functions of emitting ultrasonic waves and pulsed lasers.

[0048] In some embodiments, a Peltier device is provided on one side of the inner wall of the thin-film container 32 to lower the water temperature.

[0049] In this embodiment, since pulsed laser can increase the water temperature and affect the propagation of ultrasonic waves, the Peltier device can lower the water temperature, avoiding the influence of water temperature increase on the transmission of ultrasonic waves, thereby improving the accuracy of internal defect detection of components.

[0050] In some embodiments, the ultrasonic detection head 311 includes an ultrasonic transducer 3111 and a detection head body 3112. The detection head body 3112 is hollow, and the ultrasonic transducer 3111 is installed inside the detection head body 3112. The through hole 0311 is disposed through the ultrasonic transducer 3111. The ultrasonic transducer 3111 is used to emit ultrasonic waves and receive the ultrasonic waves returned from the component, and convert them into ultrasonic signals.

[0051] In this embodiment, the detection head body 3112 is hollow for installing the ultrasonic transducer 3111. The through hole 0311 penetrates through the ultrasonic transducer 3111 and communicates with the inside of the detection head body 3112 so that the pulsed laser can pass through. The ultrasonic transducer 3111 is the core component of the ultrasonic detection head 311. It can emit ultrasonic waves and pulsed laser while receiving the ultrasonic waves from the component and convert them into ultrasonic signals for analyzing the surface and internal defects of the component.

[0052] In some embodiments, the ultrasonic detection head 311 further includes a lens 36, which is installed inside the detection head body 3112 and is disposed below the ultrasonic transducer 3111 for adjusting the spot size of the pulsed laser emitted by the pulsed laser device 33. The lens 36 and the ultrasonic transducer 3111 are immersed in the water in the thin-film container 32.

[0053] In this embodiment, the lens 36 is used to adjust the spot size of the pulsed laser emitted by the pulsed laser device 33, facilitating the adjustment of the energy density of the pulsed laser according to the test requirements, thereby improving the flexibility of component detection.

[0054] In addition, the ultrasonic detection assembly 3 further includes a signal conditioning module 37, which is connected to the ultrasonic transducer 3111 for preprocessing and amplifying the ultrasonic signal;

[0055] a data acquisition module 38, which is connected to the signal conditioning module 37 for acquiring the preprocessed and amplified ultrasonic signal;

[0056] The control module 39, connected to the ultrasonic detector 31, is used to control the ultrasonic probe 311 to emit ultrasonic waves to the component and control the pulsed laser 33 to emit pulsed laser, and is connected to the data acquisition module 38 to receive the preprocessed and amplified ultrasonic signal and convert it into ultrasonic data.

[0057] The host computer module, connected to the control module 39, is used to send control instructions to the control module 39 and perform human-machine interface display.

[0058] The ultrasonic transducer 3111 receives the ultrasonic waves returned by the component and converts them into ultrasonic signals. The signal conditioning module 37 amplifies and preprocesses the ultrasonic signals. The data acquisition module 38 accurately acquires the amplified and preprocessed ultrasonic signals. The control module 39 receives the ultrasonic signals and converts them into ultrasonic data. The host computer module displays the ultrasonic data. The inspector judges whether there are defects inside the component according to the ultrasonic data. The above ultrasonic detection assembly 3 has the characteristics of high precision and efficient data acquisition, and can realize comprehensive and accurate detection of internal defects of components.

[0059] In some embodiments, as Figure 2 and Figure 5 shown, the component is placed on the moving station 1, including: the feeding assembly 7 places the component on the moving station 1. Among them, the feeding assembly 7 includes a first slide rail 71, a first slider 72 and a first vacuum suction nozzle 73. Part of the first slide rail 71 is located above the moving station 1. The first slider 72 is slidably connected to the first slide rail 71. The first vacuum suction nozzle 73 is installed on the first slider 72. The first vacuum suction nozzle 73 adsorbs the component and transports it to the moving station through the first slider 72 and the first slide rail 71.

[0060] Specifically, the first slide rail 71 is installed on one side of the moving station 1 through a bracket. Part of the first slide rail 71 is located above the moving station 1 so that the first slider 72 and the first vacuum suction nozzle 73 can move above the moving station 1, thus facilitating the first vacuum suction nozzle 73 to accurately place the adsorbed component in the card slot 11 of the moving station 1. There is also a feeding tray on the installation platform 6. The feeding tray is located below the first slide rail 71. The feeding tray is provided with a plurality of partition chambers, and the partition chambers separate the components to prevent the components from overlapping and affecting the feeding of the feeding assembly 7.

[0061] In this embodiment, the first vacuum suction nozzle 73 realizes the automatic feeding of components through the first slide rail 71 and the first slider 72, saving manual operation steps, improving the feeding efficiency, and at the same time reducing the error rate caused by improper manual operation. The first vacuum suction nozzle 73 can successively adsorb the components on the indexing plate, then slide along the first slide rail 71 to above the card slot 11, and the first vacuum suction nozzle 73 releases the components, and the components fall into the card slot 11. Using a vacuum suction nozzle for the adsorption and transportation of components has lower energy consumption and higher efficiency compared to other mechanical grasping methods, and at the same time reduces the potential damage to the components.

[0062] In some embodiments, such as Figure 2 and Figure 5 shown, the first vacuum suction nozzle 73 adsorbs the component and transports it to the moving station 1 through the first slider 72 and the first slide rail 71, including: the first vacuum suction nozzle 73 transports the adsorbed component to the card slot 11 of the moving station 1, wherein the card slot 11 penetrates through the moving station 1.

[0063] Specifically, the moving station 1 is a rotating turntable, and the components in the circumferential direction of the rotating turntable are evenly distributed along the circumferential direction of the rotating turntable. The card slots 11 can be provided with multiple ones according to the number of components and are evenly distributed along the rotating turntable. Each card slot 11 is provided with a component, so that the components in the circumferential direction of the rotating turntable can operate on different components at the same time, thereby improving the detection efficiency of the components.

[0064] In this embodiment, the card slot 11 is used to hold and fix the component, improving the stability of the component during the movement of the moving station 1, preventing other components from not being able to align with the component due to the position deviation of the component, and thus being unable to operate on the component.

[0065] In some embodiments, such as Figure 2 and Figure 6 shown, the spraying component 2 sprays water mist on the top surface of the component, including: through pressurizing the water tank, the water flows through the water spraying pipe 22 to the nozzle 21, and the nozzle 21 is located above the component and sprays water mist on the top of the component.

[0066] Specifically, the spraying component 2 includes a nozzle 21, a water spraying pipe 22, a pressurizing water tank and an air pump. One end of the water spraying pipe 22 is connected to the pressurizing water tank, and the other end is connected to the nozzle 21. The nozzle 21 is located above the moving station 1, and the moving station 1 drives the component to move below the nozzle 21, so that the nozzle 21 sprays water mist on the top of the component. The air pump is connected to the water spraying pipe 22 to adjust the size of the water mist.

[0067] In addition, a plurality of spray holes 211 are evenly arranged on the water spraying end surface of the spray head 21 for spraying water mist onto the top of the component, and a water dripping section 212 is further arranged at the central position of the water spraying end surface of the spray head 21 for dripping water onto the central position of the component.

[0068] In this embodiment, a pressurized water tank, a water spraying pipe 22 and a spray head 21 are used to spray water mist onto the top of the component, so that an ultra-thin water film is formed when the top of the component abuts against the high-transparency film 321, ensuring accurate detection of the component by the ultrasonic detection head 311. The water mist sprayed by the above-mentioned spraying assembly 2 is delicate and uniform, and the size of the water mist can be adjusted by an air pump, which is beneficial to forming a uniform ultra-thin water film on the top of the component and facilitating the accurate detection of the component by the ultrasonic detection head 311. A water dripping section 212 is also arranged at the central position of the water spraying end surface for dripping water onto the central position of the component, improving the efficiency of the spraying assembly 2 to wet the top surface of the component, thereby improving the overall detection efficiency of the component.

[0069] In some embodiments, as Figure 2 , Figure 3 and Figure 5 shown, the abutting of the top surface of the pre-treated component against the high-transparency film 321 includes: the lifting assembly 4 controls the component to rise so that the top surface of the component abuts against the high-transparency film 321. Among them, the lifting assembly 4 is a lift. After the component moves below the ultrasonic detection head, the output shaft of the lift penetrates through the card slot 11, so that the top surface of the component abuts against the high-transparency film 321.

[0070] Specifically, the lifting assembly 4 is a lift, and the lift is installed on the installation platform 6. After the component moves below the ultrasonic detection head, the output shaft of the lift penetrates through the card slot 11 to lift the component so that the top surface of the component abuts against the high-transparency film 321. The card slot 11 includes a square slot and a communication hole. An installation groove for placing the component is arranged in the square slot, and the top surface of the component protrudes from the installation groove. The communication hole is arranged at the bottom of the installation groove for the output shaft of the lift to pass through. The output shaft of the lift penetrates through the communication hole to lift the installation groove and the component. The lift is a hydraulic cylinder. The output of the hydraulic cylinder is stable, ensuring the stability of the component during the rising process. And the hydraulic cylinder can accurately control the rising distance of the component through the control system, so that the component just abuts against the high-transparency film 321, ensuring the normal progress of the detection process.

[0071] In this embodiment, by arranging a lift on the installation platform 6, the automatic lifting of the component is realized, thereby improving the detection efficiency of the component.

[0072] In some embodiments, as Figure 2 and Figure 5As shown, transporting the post - tested component to the drying assembly 5 includes: the discharging assembly 8 removes the component from the moving station 1. Among them, the discharging assembly 8 includes a second vacuum suction nozzle 81, a second slider 82, and a second slide rail 83. The second slide rail 83 is installed on the installation platform 6 and part of the second slide rail 83 is located above the moving station 1. The second slider 82 is slidably connected to the first slide rail 71. The second vacuum suction nozzle 81 is installed on the second slider 82. The second vacuum suction nozzle 81 adsorbs the tested component and removes the component from the moving station 1 through the second slider 82 and the second slide rail 83.

[0073] Specifically, the second slide rail 83 is installed on one side of the moving station 1 through a bracket, and part of the second slide rail 83 is located above the moving station 1, so that the second slider 82 and the second vacuum suction nozzle 81 can move above the moving station 1, so that the second vacuum suction nozzle 81 can adsorb the component in the card slot 11 and remove it from the moving station 1. The second vacuum suction nozzle 81 drives the component to move above the receiving tray 12 and releases the component, and the component falls into the receiving tray 12. The feeding assembly 7, the spraying assembly 2, the ultrasonic detection assembly 3, and the discharging assembly 8 are evenly distributed along the circumferential direction of the rotating platform. Four card slots 11 are provided on the rotating platform, so that the feeding assembly 7, the spraying assembly 2, the ultrasonic detection assembly 3, and the discharging assembly 8 can operate on different components simultaneously, thereby improving the detection efficiency of the components.

[0074] In this embodiment, the second vacuum suction nozzle 81 realizes the automatic discharging of the component through the second slide rail 83 and the second slider 82, saving the manual operation steps and improving the discharging efficiency. The receiving tray 12 is used to collect the components for subsequent centralized processing.

[0075] In some embodiments, as Figure 2 and Figure 5 shown, transporting the post - tested component to the drying assembly 5 further includes: the receiving tray 12 slides into the drying assembly 5 through the third slide rail 13.

[0076] Specifically, the third slide rail 13 is arranged on one side of the moving station 1 and is arranged between the moving station 1 and the bracket of the drying assembly 5. The third slide rail 13 is a linear slide rail and can be driven by a motor. A slider is provided at the bottom of the receiving tray 12, and the slider slides along the linear slide rail to transport the receiving tray 12 to the drying assembly 5. The drying assembly 5 is an oven, and the oven is open. The third slide rail 13 extends into the oven through the opening of the oven so that the receiving tray 12 can enter the oven.

[0077] In this embodiment, the third slide rail 13 transports the bearing tray 12 to the drying component 5, saving manual operation steps and improving the efficiency of transporting components from one side of the moving station 1 to the drying component 5.

[0078] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the present application further provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the program, it implements the automatic component testing method described in any one of the above embodiments.

[0079] Figure 7 FIG. shows a more specific schematic diagram of the hardware structure of the electronic device provided in this embodiment. The device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. Among them, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are communicatively connected to each other inside the device through the bus 1050.

[0080] The processor 1010 can be implemented in a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0081] The memory 1020 can be implemented in the form of a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, etc. The memory 1020 can store an operating system and other application programs. When implementing the technical solutions provided in the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0082] The input / output interface 1030 is used to connect to an input / output module to implement information input and output. The input / output module can be configured as a component in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Among them, the input device can include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device can include a display, a speaker, a vibrator, an indicator light, etc.

[0083] The communication interface 1040 is used to connect to a communication module (not shown in the figure) to enable communication and interaction between this device and other devices. The communication module can achieve communication through wired means (such as USB, network cable, etc.) or through wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0084] The bus 1050 includes a path for transmitting information between various components of the device (such as the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).

[0085] It should be noted that although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040, and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, those skilled in the art can understand that the above device may also only include the components necessary to implement the solution of the embodiments of this specification, and does not necessarily include all the components shown in the figure.

[0086] The electronic device in the above embodiment is used to implement the corresponding component automatic testing method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be elaborated here.

[0087] Based on the same inventive concept, corresponding to the method in any of the above embodiments, the present application also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the component automatic testing method as described in any of the foregoing embodiments.

[0088] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette tapes, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0089] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the automatic component testing method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be elaborated here.

[0090] It can be understood that before using the technical solutions of the various embodiments of the present disclosure, the types, usage scopes, usage scenarios, etc. of the personal information involved will be informed to the user in an appropriate manner, and the user's authorization will be obtained.

[0091] For example, when responding to receiving an active request from the user, a prompt message is sent to the user to clearly prompt the user that the operation requested by the user will require obtaining and using the user's personal information. Thus, the user can autonomously choose whether to provide personal information to software or hardware such as an electronic device, an application program, a server, or a storage medium that performs the operations of the technical solutions of the present disclosure according to the prompt message.

[0092] As an optional but non-limiting implementation manner, the manner of sending a prompt message to the user in response to receiving an active request from the user can be, for example, in the form of a pop-up window, and the prompt message can be presented in text in the pop-up window. In addition, the pop-up window can also carry selection controls for the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0093] It can be understood that the above process of notifying and obtaining the user's authorization is only illustrative and does not limit the implementation manner of the present disclosure, and other manners that meet relevant laws and regulations can also be applied to the implementation manner of the present disclosure.

[0094] Those of ordinary skill in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the present application is limited to these examples; under the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of brevity.

[0095] In addition, for simplicity of explanation and discussion, and so as not to make the embodiments of the present application difficult to understand, well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Further, the devices may be shown in block diagram form in order to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that details of the implementation of these block diagram devices are highly dependent on the platform on which the embodiments of the present application are to be implemented (i.e., these details should be fully within the understanding of those skilled in the art). In cases where specific details (such as circuits) are set forth to describe exemplary embodiments of the present application, it will be apparent to those skilled in the art that the embodiments of the present application may be practiced without these specific details or with variations of these specific details. Accordingly, these descriptions should be considered illustrative rather than restrictive.

[0096] Although the present application has been described in connection with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (such as dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0097] Embodiments of the present application are intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the claims of the present application. Accordingly, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A component automatic detection method, characterized in that: include: Preparation of the ultrasonic detection head (311): immersing the ultrasonic detection head (311) of the ultrasonic detector (31) into water in a thin film container (32), wherein the bottom of the thin film container (32) is a high-transmittance film (321); Component pretreatment: placing the component on the movable station (1), the movable station (1) transports the component to the bottom of the spray assembly (2), and the spray assembly (2) sprays water mist on the top surface of the component to obtain a pretreated component; Pre-processing component detection: the mobile station (1) transports the pre-processing component to the bottom of the ultrasonic detection head (311), and places the top surface of the pre-processing component against the high-transmittance film (321), so that the detection end of the ultrasonic detection head (311) is opposite to the position of the pre-processing component, and the ultrasonic detector (31) performs ultrasonic detection on the pre-processing component to obtain the detected component; Component drying: transporting the tested components to a drying assembly (5), starting the drying assembly (5), and drying the tested components.

2. The automatic component detection method according to claim 1, characterized in that: The step of placing the components on the movable station (1) comprises: a loading assembly (7) placing the components on the movable station (1), wherein the loading assembly (7) comprises a first slide rail (71), a first slider (72) and a first vacuum suction nozzle (73), a portion of the first slide rail (71) is located above the movable station (1), the first slider (72) is slidably connected to the first slide rail (71), the first vacuum suction nozzle (73) is installed on the first slider (72), and the first vacuum suction nozzle (73) absorbs the components and transports them to the movable station (1) through the first slider (72) and the first slide rail (71).

3. A component automatic detection method according to claim 2, characterized in that: The first vacuum suction nozzle (73) absorbs the component and transports it to the movable station (1) through the first slider (72) and the first slide rail (71), including: the first vacuum suction nozzle (73) transports the absorbed component to the card slot (11) of the movable station (1), wherein the card slot (11) runs through the movable station (1).

4. The automatic component detection method according to claim 1, characterized in that: The spray assembly (2) sprays water mist on the top surface of the component, comprising: pressurizing water through a pressurized water tank so that water flows through a water spray pipe (22) to a spray head (21), wherein the spray head (21) is located above the component and sprays water mist on the top of the component.

5. The automatic component detection method according to claim 3, characterized in that: The method of causing the top surface of the pre-processing component to abut against the high-transmittance film (321) comprises: a lifting component (4) controls the component to rise so that the top surface of the component abuts against the high-transmittance film (321), wherein the lifting component (4) is a lift, and after the component moves to below the ultrasonic probe, the output shaft of the lift passes through the slot (11) so that the top surface of the component abuts against the high-transmittance film (321).

6. The automatic component detection method according to claim 1, characterized in that: The method of transporting the tested components to the drying component (5) includes: a discharge component (8) moving the components out of the movable station (1), wherein the discharge component (8) includes a second vacuum suction nozzle (81), a second slider (82) and a second slide rail (83), the second slide rail (83) is installed on the installation platform (6) and a portion of the second slide rail (83) is located above the movable station (1), the second slider (82) is slidably connected to the first slide rail (71), the second vacuum suction nozzle (81) is installed on the second slider (82), and the second vacuum suction nozzle (81) absorbs the tested components and moves the components out of the movable station (1) through the second slider (82) and the second slide rail (83).

7. The automatic component detection method according to claim 6, characterized in that: The second vacuum suction nozzle (81) absorbs the inspected component and moves the component out of the movable station (1) via the second slider (82) and the second slide rail (83), comprising: the second vacuum suction nozzle (81) absorbs the inspected component and moves the component out of the movable station (1) and places the component in a supporting tray (12).

8. The automatic component detection method according to claim 7, characterized in that: The method of transporting the tested components to a drying assembly (5) further comprises: the supporting tray (12) sliding into the drying assembly (5) via a third slide rail (13).

9. The automatic component detection method according to claim 1, characterized in that: The ultrasonic detector (31) performs ultrasonic detection on the pre-processed components, comprising: the ultrasonic detection head (311) emits ultrasonic waves and pulsed lasers to the components, and receives ultrasonic waves returned from the components, wherein a pulsed laser (33) is provided on one side of the ultrasonic detection head (311), the pulsed laser (33) emits pulsed lasers, and the ultrasonic detection head (311) is provided with a through hole (0311) for the pulsed laser to pass through.

10. The automatic component detection method according to claim 9, characterized in that: The base (34) of the ultrasonic detector (31) is hollow and has a reflective lens inside. The output end of the pulse laser (33) is connected to the collimator (35) via an optical fiber, so that the output end of the collimator (35) emits a pulse laser that penetrates the base (34) and passes through the through hole (0311) via the reflective lens.

11. The automatic component detection method according to claim 9, characterized in that: A cooling fin is provided on one side of the inner wall of the film container (32) to reduce the water temperature.

12. The automatic component detection method according to claim 9, characterized in that: The ultrasonic detection head (311) comprises an ultrasonic transducer (3111) and a detection head body (3112); the detection head body (3112) is hollow, the ultrasonic transducer (3111) is installed in the detection head body (3112), the through hole (0311) is arranged through the ultrasonic transducer (3111), and the ultrasonic transducer (3111) is used to emit ultrasonic waves and receive ultrasonic waves returned from the components and convert them into ultrasonic signals.

13. The automatic component detection method according to claim 9, characterized in that: The ultrasonic detection head (311) further comprises a lens (36), which is installed in the detection head body (3112) and is arranged below the ultrasonic transducer (3111) and is used to adjust the spot size of the pulse laser emitted by the pulse laser (33).

14. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 13 is implemented.

15. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable a computer to execute the method according to any one of claims 1 to 13.

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