Probe and substrate inspection apparatus comprising the same

Abstract

A probe includes a test plate which contacts a semiconductor substrate to test reliability of the semiconductor substrate; a load pusher which has a frame provided on the test plate and having a penetration area, a plurality of elastic structures which extend from an inner side surface of the frame in the penetration area and are arranged at intervals in a circumferential direction, a load wing which is connected to the frame by the plurality of elastic structures and protrudes the test plate toward the semiconductor substrate; and a support tensioner which supports the load pusher.

Description

TECHNICAL FIELD

[0001] The present application relates to a probe and a substrate inspection apparatus including the same, and more particularly, to a probe for testing reliability of a semiconductor substrate and a substrate inspection apparatus including the same. BACKGROUND

[0002] A test for a semiconductor wafer is performed in a wafer level chip scale package (WLCSP) state through a probing process. A high performance probe card such as a membrane probe card can be used in the probing process. A main structure of a probe of the currently used membrane probe card can be composed of two leaf spring structures. Due to the two leaf spring structures, movement of the probe is limited. When probing is performed on an edge portion of a wafer or a defective solder ball, stress can be applied to the semiconductor wafer or the probe to cause damage. In the case where an epoxy is used in the probe of the membrane probe card, there is a problem in that it is difficult to perform inspection for a long time at high or low temperature. SUMMARY

[0003] PROBLEMS TO BE SOLVED BY THE INVENTION

[0004] An object of the present application is to provide a probe having a structure that can prevent damage to a semiconductor wafer and perform inspection for a long time.

[0005] Another object of the present application is to provide a substrate inspection apparatus including the above probe.

[0006] METHOD FOR SOLVING THE PROBLEMS

[0007] The probe for achieving the above-described exemplary embodiment of the present application includes a test plate which contacts a semiconductor substrate to test reliability of the semiconductor substrate, a load propeller having a frame provided on the test plate and having a penetration area, a plurality of elastic structures which extend from an inner side surface of the frame in the penetration area and are arranged at intervals in a circumferential direction, a load wing which is connected to the frame through the plurality of elastic structures and protrudes the test plate toward the semiconductor substrate, and a support tensioner which supports the load propeller.

[0008] EFFECTS OF THE INVENTION

[0009] According to an exemplary embodiment, the probe may include: a test plate that contacts a semiconductor substrate to test the reliability of the semiconductor substrate; a load pusher having a frame disposed on the test plate and having a through region, a plurality of elastic structures extending from the inner side of the frame and spaced apart from each other in the circumferential direction in the through region, a loading wing connected to the frame through the plurality of elastic structures and causing the test plate to protrude toward the semiconductor substrate; and a support tensioner that supports the load pusher.

[0010] Therefore, the load pusher of the probe can bring the test plate into contact with the semiconductor substrate, allowing the test plate to test the reliability of the semiconductor substrate. During the process of the load pusher pressing the test plate against the semiconductor substrate, the plurality of elastic structures can rotate the loading wing. Since the plurality of elastic structures are spaced apart from each other along the circumferential direction at a predetermined angle, they can stably support the loading wing as it presses the test plate onto the semiconductor substrate.

[0011] Because the loading wings rotate due to the multiple elastic structures, even when the test board is positioned on the edge of a semiconductor wafer, the loading wings can uniformly transmit external forces to the semiconductor substrate. Since the loading wings uniformly transmit the external forces to the semiconductor substrate, damage to the semiconductor substrate can be reduced, and damage to the load actuator can be prevented.

[0012] Furthermore, the aforementioned frame, the plurality of elastic structures, and the loading wing may contain the same material. The aforementioned frame, the plurality of elastic structures, and the loading wing may be formed as a single unit. Because the aforementioned frame, the plurality of elastic structures, and the loading wing are formed as a single unit and do not contain epoxy resin for bonding, the aforementioned probe can perform reliability checks for extended periods at high or extremely low temperatures.

[0013] However, the effects of the present invention are not limited to those mentioned above, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0014] Figure 1 This is a perspective view showing a substrate inspection apparatus according to an exemplary embodiment.

[0015] Figure 2 This is a perspective view showing an exemplary embodiment of the probe.

[0016] Figure 3 It is shownFigure 2 The front view of the probe.

[0017] Figure 4 It is shown Figure 3 A three-dimensional view of the load thruster.

[0018] Figure 5 It is shown Figure 4 A diagram of the load thruster.

[0019] Figure 6 It is along Figure 5 A cross-sectional view of the section cut by line A-A'.

[0020] Figure 7 It is shown Figure 2 A three-dimensional view of the support tensioner.

[0021] Figure 8 It is shown that has Figure 7 A diagram of the probe supporting the tensioner.

[0022] Figure 9 It shows through Figure 1 The front view of the probe during the reliability testing of a semiconductor substrate by the substrate inspection device.

[0023] Figure 10 This illustrates the process of testing the reliability of a semiconductor substrate. Figure 9 A diagram of the load thruster.

[0024] Figure 11 and Figure 12 This is a diagram illustrating a load thruster of an exemplary embodiment.

[0025] Figure 13 This is a perspective view showing an exemplary embodiment of the probe.

[0026] Figure 14 It is shown Figure 13 A three-dimensional view of the load thruster.

[0027] Figure 15 It is shown Figure 14 A diagram of the load thruster.

[0028] Figure 16 It is along Figure 15 A cross-sectional view of the section cut by line B-B'.

[0029] Figure 17 This is a diagram illustrating a load thruster of an exemplary embodiment.

[0030] (Explanation of reference numerals in the attached diagram)

[0031] 1: Substrate inspection device; 10: Probe

[0032] 20: Base; 30: Semiconductor substrate

[0033] 32: Semiconductor chip; 40: Detector card

[0034] 42: Signal line; 44: Support structure.

[0035] 100: Test board; 110: Tip

[0036] 200: Load pusher 210: Frame

[0037] 212: Penetrating area; 214: Inner side surface

[0038] 216: Opening 220: Elastic Structure

[0039] 222: First structure 224: Second structure

[0040] 226: Third structure; 228: First extension

[0041] 229: Second extension; 230: Loaded wing

[0042] 240: First pattern 242: Second pattern

[0043] 250: Third pattern; 260: Second elastic structure

[0044] 300: Support tensioner; 310: Spring pin

[0045] 312: Main body; 314: Contact pin

[0046] 316: Spring; 400: First fixing block

[0047] 410: Locating pin; 412: Protrusion

[0048] 420: Hard plug; 430: Second fixing block

[0049] 440: First spring group; 450: Second spring group Detailed Implementation

[0050] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0051] Figure 1 This is a perspective view showing a substrate inspection apparatus according to an exemplary embodiment.

[0052] Reference Figure 1The substrate inspection apparatus 1 may include a base 20 and a probe 10. The substrate inspection apparatus 1 can perform reliability checks to test the reliability of a semiconductor substrate 30 mounted on the base 20. For example, the substrate inspection apparatus 1 can perform the aforementioned reliability checks on the semiconductor substrate 30 in a wafer-level chip-scale package (WLCSP) state via a probing process. The substrate inspection apparatus 1 can perform microprocesses on the semiconductor substrate 30.

[0053] The semiconductor substrate 30 may include a plurality of semiconductor chips 32. Each of the plurality of semiconductor chips 32 may include electronic circuitry, which may include bonding pads, connection pads, solder joints, etc., for transmitting and receiving electrical signals. For example, the semiconductor substrate 30 may include a semiconductor wafer.

[0054] The base 20 serves as a support for the semiconductor substrate 30. The upper part of the base 20 may include an electrostatic chuck that holds the semiconductor substrate 30 by electrostatic attraction. This electrostatic chuck can attract and hold the semiconductor substrate 30 using electrostatic force through a DC voltage supplied by a DC power supply (not shown). The supporting surface of the electrostatic chuck can support the semiconductor substrate 30, and a focusing ring (not shown) can be installed around the semiconductor substrate 30.

[0055] The substrate inspection device 1 is disposed below the probe 10 and can move the base 20 on which the semiconductor substrate 30 is mounted. The substrate inspection device 1 allows the base 20 to move freely in three-dimensional space. By moving the base 20, the substrate inspection device 1 can bring the semiconductor substrate 30 mounted on the base 20 into contact with the probe 10 to perform the aforementioned reliability inspection. Optionally, the substrate inspection device 1 can allow the probe 10 to move freely in the aforementioned three-dimensional space.

[0056] The substrate inspection apparatus 1 may include a probe card 40 configured with signal lines 42 for data signal movement. For example, the probe card 40 may include a high-performance probe card such as a membrane probe card.

[0057] The probe card 40 may include a support structure 44 for fixing the probe 10. For example, the support structure 44 may be made of polymer. The probe 10 can be fixed to the support structure 44 by bolts and nuts. The probe 10 can be removed from the probe card 40 by the aforementioned bolts and nuts. The probe card 40 can be separated from the substrate inspection device 1 and replaced according to the type of reliability check described above via the support structure 44.

[0058] The probe card 40 may include a central opening. The probe card 40 may expose at least a portion of the probe 10 towards the semiconductor substrate 30 through the central opening. The probe 10 exposed from the central opening of the probe card 40 may contact the semiconductor substrate 30 to perform the aforementioned reliability check.

[0059] The probe of the aforementioned substrate inspection apparatus will now be described in more detail.

[0060] Figure 2 This is a perspective view showing an exemplary embodiment of the probe. Figure 3 It is shown Figure 2 The front view of the probe. Figure 4 It is shown Figure 3 A three-dimensional view of the load thruster. Figure 5 It is shown Figure 4 A diagram of the load thruster. Figure 6 It is along Figure 5 A cross-sectional view of the section cut by line A-A'. Figure 7 It is shown Figure 2 A three-dimensional view of the support tensioner. Figure 8 It is shown that has Figure 7 A diagram of the probe supporting the tensioner.

[0061] Reference Figures 1 to 8 The probe 10 may include: a test plate 100 for testing the aforementioned reliability of the semiconductor substrate 30; a load pusher 200 for pressing the test plate 100 onto the semiconductor substrate 30; and a support tensioner 300 for supporting the load pusher 200.

[0062] The probe 10 can be mounted on the probe card 40. The probe 10 can be electrically connected to the signal line 42 for transmitting the aforementioned data signals. The probe 10 can contact the semiconductor substrate 30 mounted on the base 20 to transmit and receive the aforementioned data signals, through which the reliability of the semiconductor substrate 30 can be tested. For example, the probe 10 can include a dolphin probe head.

[0063] In an exemplary embodiment, the test board 100 may contact the semiconductor substrate 30 to test the aforementioned reliability of the semiconductor substrate 30. The test board 100 may be electrically connected to the signal line 42 for moving the aforementioned data signal. The test board 100 may have a flexible structure. For example, the test board 100 may include a printed circuit board (PCB). The test board 100 may include a flexible printed circuit board (FPCB).

[0064] The test plate 100 can be disposed at the lower part of the load pusher 200. The test plate 100 can be aligned by an alignment pin disposed on the aforementioned probe card and can be attached to the aforementioned lower part of the load pusher 200. The test plate 100 can be flexible. Due to the aforementioned flexibility, the test plate 100 can be bent in a curved manner on the aforementioned lower part of the load pusher 200.

[0065] The test board 100 may include an insulating film, a plurality of data signal lines disposed within the insulating film, and a plurality of tips 110 electrically connected to the plurality of data signal lines. For example, the insulating film may contain polyimide.

[0066] The aforementioned multiple data signal lines can be disposed within the aforementioned insulating film, and the aforementioned multiple tips 110 can protrude from the aforementioned insulating film. The aforementioned multiple data signal lines can be electrically connected to signal line 42, enabling the transmission and reception of data signals. The aforementioned multiple tips 110 can directly contact the aforementioned bonding pads, connecting pads, solder joints, etc., of the semiconductor substrate 30. The aforementioned multiple tips 110 can be electrically connected to the semiconductor substrate 30, and the aforementioned data signals can move within the semiconductor substrate 30, the multiple tips 110, the aforementioned multiple data signal lines, and signal line 42 to perform the aforementioned reliability check.

[0067] In an exemplary embodiment, the load pusher 200 may have upper and lower sides that are opposite to each other. A support tensioner 300 may be disposed on the upper side of the load pusher 200. The load pusher 200 may be mounted on the test plate 100. The load pusher 200 may include: a frame 210 having a through region 212; a plurality of elastic structures 220 disposed within the through region 212; and loading wings 230 that cause the test plate 100 to protrude toward the semiconductor substrate 30.

[0068] In an exemplary embodiment, frame 210 may have a through region 212. Frame 210 may have an inner side surface 214 formed through the through region 212. A loading wing 230 may be provided at the center of the through region 212. For example, from a top view, the through region 212 may include a quadrilateral, a circle, etc.

[0069] For example, frame 210 may contain a first metallic substance. Frame 210 may contain copper (Cu), aluminum (Al), tin (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0070] The frame 210 can be detached from the probe card 40 using the aforementioned bolts and nuts. The frame 210 has multiple openings 216 through which the bolts can pass. The frame 210 is fixed to the probe card 40 using the aforementioned bolts and nuts. Because the frame 210 is fixed to the probe card 40 using the aforementioned bolts and nuts, the probe 10 can be stably fixed even when the load pusher 200 presses the test plate 100 onto the semiconductor substrate 30.

[0071] In an exemplary embodiment, a plurality of elastic structures 220 may be disposed within the through region 212 of the frame 210. The plurality of elastic structures 220 may support the loading wing 230 within the through region 212 of the frame 210. The plurality of elastic structures 220 may stably support the loading wing 230 at the aforementioned center. The plurality of elastic structures 220 may have a structure that generates elastic force. Each of the plurality of elastic structures 220 may have a first surface 220a and a second surface 220b that are opposite to each other. The plurality of elastic structures 220 may have a three-dimensional spring structure.

[0072] Because multiple elastic structures 220 support the loading wing 230, when the loading wing 230 presses the test plate 100 onto the semiconductor substrate 30, the multiple elastic structures 220 can rotate the loading wing 230 through the aforementioned elastic force. The loading wing 230 can rotate freely in the aforementioned three-dimensional space. Because the loading wing 230 rotates through the multiple elastic structures 220, damage to the semiconductor substrate 30 can be prevented when the loading wing 230 presses the test plate 100 onto the semiconductor substrate 30.

[0073] Multiple elastic structures 220 can extend from the inner surface 214 of the frame 210. The multiple elastic structures 220 can be spaced apart from each other in a circumferential direction. The multiple elastic structures 220 can be arranged such that adjacent elastic structures 224a, 226a have a predetermined angle θ between them. For example, the initial number of the multiple elastic structures 220 can be in the range of 4 to 8. The predetermined angle θ can be in the range of 40 degrees to 90 degrees.

[0074] Multiple elastic structures 220 may include a first structure 222, a second structure 224, and a third structure 226. The first structure 222, the second structure 224, and the third structure 226 may extend from the inner side 214 of the frame 210 and connect to the loading wing 230. The first structure 222, the second structure 224, and the third structure 226 may stably support the loading wing 230 on the through area 212 of the frame 210.

[0075] Figures 2 to 12In this design, the direction in which the first structure 222 extends (X direction) is called the first horizontal direction, and the horizontal direction orthogonal to the first horizontal direction (Y direction) is called the second horizontal direction. The direction orthogonal to the first horizontal direction and the second horizontal direction (Z direction) is called the vertical direction.

[0076] The first structure 222 can extend in a first horizontal direction (X direction). Loading wings 230 can be configured between a pair of first structures 222. The second structure 224 can extend in a second horizontal direction (Y direction). Loading wings 230 can be configured between a pair of second structures 224. For example, the angle between the first horizontal direction (X direction) and the second horizontal direction (Y direction) can be 90 degrees.

[0077] Each of the third structures 226 can be disposed between the first structure 222 and the second structure 224. The first structure 222, the second structure 224, and the third structure 226 can be disposed on the same plane. The third structure 226 can extend in a third horizontal direction (P1 direction). The third horizontal direction (P1 direction) can extend in a direction between the first horizontal direction (X direction) and the second horizontal direction (Y direction). For example, the angle between the first horizontal direction (X direction) and the third horizontal direction (P1 direction) can be 45 degrees. The angle between the second horizontal direction (Y direction) and the third horizontal direction (P1 direction) can also be 45 degrees.

[0078] For example, a third structure 226a can be provided between the first structure 222a and the second structure 224a. A third structure 226b can be provided between the first structure 222a and the second structure 224b. A third structure 226c can be provided between the first structure 222b and the second structure 224a. A third structure 226d can be provided between the first structure 222b and the second structure 224b.

[0079] Multiple elastic structures 220 may include structures that generate the aforementioned elastic force. The multiple elastic structures 220 can stably support the loading wing 230 through the aforementioned elastic force.

[0080] The first structure 222 and the second structure 224 may have the same first structure. The third structure 226 may have the same second structure. The first and second structures may be different from each other. The first and second structures may be designed differently according to the required degree of flexibility. Optionally, the first and second structures may be the same.

[0081] From a side view, each of the multiple elastic structures 220 may contain a meander structure extending in a zigzag pattern with repeating regular units. The multiple elastic structures 220 can generate the aforementioned elastic force through these meander structures. The multiple elastic structures 220 can stably support the loading wing 230 through these meander structures. When the multiple elastic structures 220 contain the aforementioned meander structures, the load thruster 200 can be a dolphin spinner.

[0082] Multiple elastic structures 220 can absorb the stress applied to the loading wing 230 through the aforementioned meandering structure. When an unstable external force is applied to the loading wing, the multiple elastic structures 220 can perform torsional motion through the aforementioned meandering structure. Because the multiple elastic structures 220 perform this torsional motion, they can stably absorb the stress applied to the loading wing 230.

[0083] Each of the multiple elastic structures 220 may include multiple first extensions 228 and multiple second extensions 229. The first extensions 228 and the second extensions 229 may intersect each other and form each of the multiple elastic structures 220. The first extensions 228 and the second extensions 229 may generate resistance to twisting.

[0084] Multiple first extensions 228 may extend in a vertical direction (Z direction). Each of the multiple first extensions 228 may have a first width W1 in a fourth horizontal direction (P2 direction) orthogonal to the vertical direction (Z direction). The aforementioned fourth horizontal direction may be a direction orthogonal to the direction in which the multiple elastic structures 220 extend.

[0085] Multiple second extensions 229 may extend between multiple first extensions 228. The multiple second extensions 229 may form the aforementioned meandering structure between the multiple first extensions 228. Specifically, the multiple second extensions 229 may be arranged to intersect with the first surface 220a and the second surface 220b between the multiple first extensions 228.

[0086] Each of the plurality of second extensions 229 may have a second width W2 in a fourth horizontal direction (P2 direction) orthogonal to the vertical direction (Z direction). The second width W2 of the second extension 229 may be smaller than the first width W1 of the first extension 228. Since the second width W2 of the second extension 229 is smaller than the first width W1 of the first extension 228, the stress generated between the first extension 228 and the second extension 229 can be reduced in the event of the aforementioned twisting in the elastic structure 220. Due to the reduction in the stress generated between the first extension 228 and the second extension 229, the first extension 228 and the second extension 229 can generate the aforementioned resistance to the twisting.

[0087] Each of the multiple elastic structures 220 may have a first spring distance SL. The first spring distance SL may be the range of movement within which each of the multiple elastic structures 220 can contract and relax. A second extension 229a disposed on the first surface 220a may have a first thickness Tu. A second extension 229b disposed on the second surface 220b may have a second thickness Td. The first thickness Tu and the second thickness Td may have different values ​​depending on the type of engineering plastic. The ratio of the first spring distance SL to the first thickness Tu (SL / Tu) may be in the range of 5 to 12. The ratio of the first spring distance SL to the second thickness Td (SL / Td) may be in the range of 5 to 12.

[0088] Between the first extensions 228, the second extension 229 may have a first length Sw. Each of the first extensions 228 may have a first height Ht. The first height Ht of the first extension 228 may be the distance between the first surface 220a and the second surface 220b. The first height Ht may vary depending on the first spring distance SL.

[0089] The ratio of the first height Ht to the first thickness Tu (Ht / Tu) can be in the range of 4 to 5. The ratio of the first spring distance SL to the first height Ht (SL / Ht) can be in the range of 1.4 to 3. Optionally, when the ratio of the first spring distance SL to the first height Ht (SL / Ht) is 1.4 or higher, an ideal elastic effect can be produced.

[0090] The ratio of the first length Sw to the first height Ht (Sw / Ht) can be in the range of 0.4 to 0.8. The minimum value of the first length Sw can vary depending on the machining capability.

[0091] The distance from the first surface 220a to the second extension 229 on the second surface 220b can be a second length Sd. The distance from the second surface 220b to the second extension 229 on the first surface 220a can be a third length. The second length Sd and the aforementioned third length can vary depending on the first height Ht.

[0092] The first extension 228 may have a first width Fw. The first width Fw of the first extension 228 may vary depending on the first height Ht of the first extension 228. The first width Fw may vary depending on the first thickness Tu of the second extension 229. The first width Fw may vary depending on the second thickness Td of the second extension 229. The first width Fw may vary depending on the first thickness Sw of the second extension 229.

[0093] The ratio of the first length Sw to the first width Fw (Sw / fw) can be in the range of 0.2 to 1.0. The ratio of the first length Sw to the first width Fw (Sw / fw) can be changed to set the spring force of the elastic structure 220. The ratio of the first length Sw to the first width Fw (Sw / fw) can be changed to set the bending value of the elastic structure 220.

[0094] For example, the multiple elastic structures 220 may contain a second metallic material. This second metallic material may be the same as the first metallic material of the frame 210. The multiple elastic structures 220 may contain copper (Cu), aluminum (Al), tin (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0095] In an exemplary embodiment, the loading wing 230 may have an upper surface 232 and a lower surface 234 that are opposite to each other. The upper surface 232 of the loading wing 230 may be disposed on the same plane as the aforementioned upper side of the load thruster 200.

[0096] The loading wing 230 can be connected to the frame 210 via multiple elastic structures 220. The loading wing 230 allows the test plate 100 to protrude toward the semiconductor substrate 30. Because the loading wing 230 causes the test plate 100 to protrude toward the semiconductor substrate 30, the test plate 100 can accurately contact the semiconductor substrate 30. Due to the aforementioned flexible structure, the test plate 100 can accurately contact the semiconductor substrate 30 via the loading wing 230.

[0097] Because the loading wing 230 is connected to the frame 210 via multiple elastic structures 220, the loading wing 230 can rotate. The loading wing 230 can rotate freely in the vertical, horizontal, and diagonal directions via the multiple elastic structures 220. The loading wing 230 can also perform torsional motion via the multiple elastic structures 220.

[0098] The loading wing 230 may have a protruding plane 234. The protruding plane 234 may be the lower surface 234. The loading wing 230 can stably press the test plate 100 onto the semiconductor substrate 30 through the aforementioned protruding plane 234. For example, the loading wing 230 may have a circular truncated cone shape, a frustum of quadrangular pyramid shape, a frustum of a square prism shape, etc.

[0099] The loading wing 230 may have a central axis CA. The elastic structure 220 may be arranged radially with respect to the central axis CA of the loading wing 230. The elastic structure 220 may be arranged along the aforementioned circumferential direction with respect to the central axis CA of the loading wing 230.

[0100] The loading wing 230 can be exposed through the central opening of the probe card 40. The loading wing 230 allows the test plate 100 to be exposed through the central opening. The loading wing 230 allows the test plate 100 exposed through the central opening to contact the semiconductor substrate 30.

[0101] For example, the loading wing 230 may contain copper (Cu), aluminum (Al), tin (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0102] For example, the loading wing 230 may contain a third metallic material. This third metallic material may be the same as the first metallic material of the frame 210 and the second metallic material of the elastic structure 220. The loading wing 230 may contain copper (Cu), aluminum (Al), tin (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0103] Since the frame 210, the elastic structure 220, and the loading wing 230 contain the same first to third metallic materials, they can have a one-piece structure. Because the frame 210, the elastic structure 220, and the loading wing 230 have this one-piece structure, epoxy resin does not need to be formed between them. Since the frame 210, the elastic structure 220, and the loading wing 230 do not contain the epoxy resin, the probe 10 can perform the aforementioned reliability checks for extended periods at high or extremely low temperatures.

[0104] Optionally, frame 210 may contain a first plastic material. Multiple elastic structures 220 may contain a second plastic material. Loading wing 230 may contain a third plastic material. The first to third plastic materials may be identical to each other.

[0105] For example, the first to third plastic materials mentioned above may include polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyamides (PA), polyester (PES), polyvinyl chloride (PVC), polyurethanes (PU), polycarbonate (PC), polyvinylidene chloride (PVDC), etc.

[0106] In an exemplary embodiment, the support tensioner 300 may be disposed on the aforementioned upper portion of the load thruster 200. The support tensioner 300 can restrict the movement of the load thruster 200. Since the load thruster 200 rotates due to the plurality of elastic structures 220, the support tensioner 300 can stably restrict the aforementioned movement of the rotating load thruster 200. Because the support tensioner 300 stably restricts the aforementioned movement of the load thruster 200, the aforementioned reliability check can be performed stably.

[0107] The support tensioner 300 may include multiple spring pins 310. The support tensioner 300 may perform calibration of the load actuator 200 via the multiple spring pins 310. The multiple spring pins 310 may include spring probe pins.

[0108] In an exemplary embodiment, the probe 10 may further include: a first fixing block 400 surrounding the periphery of the tensioner 300; a positioning pin 410 marking the position of the tensioner 300; a plurality of rigid plugs 420 controlling the position of the tensioner 300 via the positioning pin 410; and a second fixing block 430 disposed on the positioning pin 410. The probe 10 may further include: a first spring assembly 440 disposed between the second fixing block 430 and the positioning pin 410; and a second spring assembly 450 disposed between the first fixing block 400 and the positioning pin 410.

[0109] The process of performing the above-mentioned reliability check using the above-mentioned substrate inspection apparatus will be described below.

[0110] Figure 9 It shows through Figure 1 The front view of the probe during the process of using a substrate inspection device to test the reliability of a semiconductor substrate. Figure 10 This illustrates the process of testing the reliability of a semiconductor substrate. Figure 9 A diagram of the load thruster.

[0111] Reference Figure 9 and Figure 10 First, a semiconductor substrate 30 can be placed on the base 20. Next, a probe 10 can be arranged on the semiconductor substrate 30.

[0112] In an exemplary embodiment, the base 20 can move the semiconductor substrate 30 toward the probe 10, and the semiconductor substrate 30 can be pressurized between the base 20 and the probe 10. Optionally, the probe 10 can move toward the semiconductor substrate 30 on the base 20.

[0113] The tip 110 of the test board 100 can contact the bonding pads, connection pads, and solder joints of the semiconductor substrate 30. The load pusher 200 can apply pressure to the test board 100 while the tip 110 of the test board 100 is in contact with the semiconductor substrate 30.

[0114] During the pressure application of the load pusher 200 to the test board 100, the loading wing 230 can rotate with the aid of multiple elastic structures 220. For example, if there is a defective solder joint 34 with abnormal dimensions on the semiconductor substrate 30, a strong impact may occur on the defective solder joint 34. Since the loading wing 230 rotates due to the multiple elastic structures 220, the strong impact generated on the defective solder joint 34 can be absorbed by the multiple elastic structures 220. Because the strong impact is absorbed by the multiple elastic structures 220, the aforementioned damage to the semiconductor substrate 30 and the impact generated on the load pusher 200 can be prevented.

[0115] likeFigure 10 As shown, the multiple elastic structures 220 can have the aforementioned meandering structure. The multiple elastic structures 220 can absorb the aforementioned strong impact by means of the aforementioned meandering structure and by varying according to the external force applied to the loading wing 230.

[0116] Multiple elastic structures 220 can contact each other through the aforementioned meandering structure and control the aforementioned movement of the loading wing 230. Specifically, when external pressure is applied to the loading wing 230, at least a portion of each of the multiple elastic structures 220 in contact with the frame 210 or the loading wing 230 can contact each other through the aforementioned meandering structure. Since at least a portion of each of the multiple elastic structures 220 contacts each other through the aforementioned meandering structure, the movement of the loading wing 230 can be restricted.

[0117] Figure 11 and Figure 12 This is a diagram illustrating a load thruster of an exemplary embodiment. Apart from the configuration of multiple elastic structures, the above-described load thruster is similar to the reference one. Figures 2 to 10 The load thrusters described are substantially the same or similar. Therefore, the same reference numerals are used to denote the same components, and repeated descriptions of the same components are omitted.

[0118] Reference Figure 11 Each of the multiple elastic structures 220 may have a first surface 220a and a second surface 220b that are opposite to each other. Each of the multiple elastic structures 220 may include a plurality of first patterns 240 and second patterns 242 extending from the first surface 220a and the second surface 220b toward each other, respectively.

[0119] Each of the plurality of elastic structures 220 may include a plurality of first extensions 228 and a plurality of second extensions 229. The first extensions 228 and the second extensions 229 may intersect each other and form each of the plurality of elastic structures 220. The first extensions 228 and the second extensions 229 may intersect each other and form a first pattern 240 and a second pattern 242. The first extensions 228 and the second extensions 229 may generate resistance to the aforementioned torsion.

[0120] Multiple first extensions 228 can extend in the vertical direction (Z direction). Multiple second extensions 229 can extend between the multiple first extensions 228. The multiple second extensions 229 can be disposed at the center of the multiple first extensions 228 between the first surface 220a and the second surface 220b. Tension can be controlled according to the position of the multiple second extensions 229 between the multiple first extensions 228.

[0121] In the case where multiple elastic structures 220 include a first pattern 240 and a second pattern 242, the load thruster 200 can be a dolphin bottlenose.

[0122] Reference Figure 12 Each of the multiple elastic structures 220 may have a first surface 220a and a second surface 220b that are opposite to each other. Each of the multiple elastic structures 220 may include a multiple third patterns 250 extending from the second surface 220b.

[0123] Each of the plurality of elastic structures 220 may include a plurality of first extensions 228 and a plurality of second extensions 229. The first extensions 228 and the second extensions 229 may intersect each other and form each of the plurality of elastic structures 220. The first extensions 228 and the second extensions 229 may intersect each other and form a third pattern 250. The first extensions 228 and the second extensions 229 may generate resistance to the aforementioned torsion.

[0124] Multiple first extensions 228 can extend in the vertical direction (Z direction). Multiple second extensions 229 can extend between the multiple first extensions 228. The multiple second extensions 229 can be disposed along the first surface 220a between the multiple first extensions 228. The second extensions 229 can control the force in the vertical direction (Z direction). Specifically, the second extensions 229 can reduce the downward force in the vertical direction (Z direction) and the second extensions 229 can increase the upward force in the vertical direction (Z direction).

[0125] Conversely, a plurality of second extensions 229 may be provided along the second surface 220b between a plurality of first extensions 228. The second extensions 229 may increase the downward force in the vertical direction (Z direction) and decrease the upward force in the vertical direction (Z direction).

[0126] In the case where multiple elastic structures 220 include a third pattern 250, the load thruster 200 can be a Dolphin Amazon.

[0127] Figure 13 This is a perspective view showing an exemplary embodiment of the probe. Figure 14 It is shown Figure 13 A three-dimensional view of the load thruster. Figure 15 It is shown Figure 14 A diagram of the load thruster. Figure 16 It is along Figure 15 A cross-sectional view of the B-B' line. Besides the composition of multiple elastic structures, the aforementioned probe and reference... Figures 1 to 12The probes described are substantially the same or similar. Therefore, the same or similar components are indicated by the same or similar reference numerals, and repeated descriptions of the same components are omitted.

[0128] Reference Figures 13 to 16 The probe 10 may include: a test plate 100 for testing the aforementioned reliability of the semiconductor substrate 30; a load pusher 200 for pressing the test plate 100 onto the semiconductor substrate 30; and a support tensioner 300 for supporting the load pusher 200.

[0129] In an exemplary embodiment, a plurality of elastic structures 220 may be disposed within the through region 212 of the frame 210. The plurality of elastic structures 220 may support the loading wing 230 within the through region 212 of the frame 210. The plurality of elastic structures 220 may stably support the loading wing 230 at the aforementioned center. The plurality of elastic structures 220 may have a structure that generates elastic force. Each of the plurality of elastic structures 220 may have a first surface 220a and a second surface 220b that are opposite to each other. The plurality of elastic structures 220 may have a three-dimensional spring structure.

[0130] Multiple elastic structures 220 can extend from the inner surface 214 of the frame 210. Each of the multiple elastic structures 220 can extend to the corner region CR of the loading wing 230. The multiple elastic structures 220 can extend from the inner surface 214 of the frame 210 and connect to the loading wing 230. The multiple elastic structures 220 can stably support the loading wing 230 on the through region 212 of the frame 210.

[0131] The loading wing 230 may have a corner region CR. Multiple elastic structures 220 may be connected to the corner region CR of the loading wing 230. Each corner region CR may have a first side CR1 and a second side CR2 extending orthogonally to the first side CR1. The corner region CR may constitute the outer surface of the loading wing 230, and the first side CR1 and the second side CR2 of the corner region CR may extend intersectingly to form the aforementioned outer surface. Multiple elastic structures 220 may extend to the first side CR1 of the corner region CR, and the multiple elastic structures 220 may be arranged alternately with respect to the central axis CA of the loading wing 230. Because the multiple elastic structures 220 are arranged alternately with respect to the central axis CA of the loading wing 230, the multiple elastic structures 220 can more stably support the aforementioned rotational force of the loading wing 230.

[0132] The second side CR2 of the loading wing 230 can be configured to protrude further from the central axis CA of the loading wing 230 than the first side CR1. The first side CR1, to which the multiple elastic structures 220 are connected, can be configured to be closer to the central axis CA of the loading wing 230 than the second side CR2. Because the first side CR1, to which the multiple elastic structures 220 are connected, is configured to be closer to the central axis CA of the loading wing 230 than the second side CR2, the multiple elastic structures 220 can be configured to be closer to the center of gravity of the loading wing 230, thus providing more stable support for the loading wing 230.

[0133] The loading wing 230 may have a central axis CA. Multiple elastic structures 220 may be arranged in an alternating manner with respect to the central axis CA of the loading wing 230. The elastic structures 220 may be arranged in an alternating manner with respect to the central axis CA of the loading wing 230 and extend to the corner region CR.

[0134] Figure 17 This is a diagram illustrating a load thruster of an exemplary embodiment. Apart from the configuration of multiple second elastic structures, the above-described load thruster is similar to the reference one. Figures 12 to 16 The load thrusters described are substantially the same or similar. Therefore, the same reference numerals are used to denote the same components, and repeated descriptions of the same components are omitted.

[0135] Reference Figure 17 The load pusher 200 may include: a frame 210 having a through region 212; a plurality of elastic structures 220 disposed within the through region 212; a loading wing 230 that causes the test plate 100 to protrude toward the semiconductor substrate 30; and a plurality of second elastic structures 260 disposed within the through region 212.

[0136] In an exemplary embodiment, a plurality of elastic structures 220 may be disposed within the through region 212 of the frame 210. The plurality of elastic structures 220 may support the loading wing 230 within the through region 212 of the frame 210. A plurality of second elastic structures 260 may be disposed within the through region 212 of the frame 210. The plurality of second elastic structures 260 may, together with the plurality of elastic structures 220, support the loading wing 230 within the through region 212 of the frame 210.

[0137] From the rear view, each of the plurality of second elastic structures 260 may include a meander structure extending in a zigzag pattern with repeating regular units. That is, each of the plurality of second elastic structures 260 extends in a zigzag pattern along a first horizontal direction (X direction) and a second horizontal direction (Y direction). The plurality of second elastic structures 260 can generate the aforementioned elastic force through the aforementioned meander structure. The plurality of second elastic structures 260, together with the plurality of elastic structures 220, can stably support the loading wing 230 through the aforementioned meander structure.

[0138] The multiple elastic structures 220, viewed from the side, may have the aforementioned meandering structure, and the multiple second elastic structures 260, viewed from the rear, may also have the aforementioned meandering structure. That is, each of the multiple elastic structures 220 may extend in a zigzag pattern along a first horizontal direction (X direction), a second horizontal direction (Y direction), and a vertical direction (Z direction). Because the multiple elastic structures 220 and the multiple second elastic structures 260 extend in the aforementioned meandering structure in different directions, when an external force is applied to the loading wing 230, the multiple elastic structures 220 and the multiple second elastic structures 260 can simultaneously cover all directions, causing the loading wing 230 to rotate and providing stable support.

[0139] For example, a plurality of second elastic structures 260 may contain a sixth metallic material. The aforementioned sixth metallic material may be the same as the aforementioned first metallic material of the frame 210. The plurality of second elastic structures 260 may contain copper (Cu), aluminum (Al), tin (W), nickel (Ni), molybdenum (Mo), gold (Au), silver (Ag), chromium (Cr), tin (Sn), and titanium (Ti).

[0140] In an exemplary embodiment, the loading wing 230 may have a corner region CR. A plurality of elastic structures 220 and a plurality of second elastic structures 260 may be connected to the corner region CR of the loading wing 230. Each corner region CR may have a first side surface CR1 and a second side surface CR2 extending orthogonally to the first side surface CR1.

[0141] Multiple elastic structures 220 can extend to the first side CR1 of the corner region CR, and the multiple elastic structures 220 can be arranged alternately with reference to the central axis CA of the loading wing 230. Multiple second elastic structures 260 can extend to the second side CR2 of the corner region CR, and the multiple second elastic structures 260 can be arranged alternately with reference to the central axis CA of the loading wing 230. Because the multiple elastic structures 220 and the multiple second elastic structures 260 are arranged alternately with reference to the central axis CA of the loading wing 230, the multiple elastic structures 220 and the multiple second elastic structures 260 can more stably support the aforementioned rotational force of the loading wing 230.

[0142] The second side CR2 of the loading wing 230 can be configured to protrude further from the central axis CA of the loading wing 230 than the first side CR1. Multiple elastic structures 220 can extend to the first side CR1 of the corner region CR, and multiple second elastic structures 260 can extend to the second side CR2 of the corner region CR. Each of the multiple elastic structures 220 can extend in a zigzag pattern along a first horizontal direction (X direction), a second horizontal direction (Y direction), and a vertical direction (Z direction), and each of the multiple second elastic structures 260 can extend in a zigzag pattern along the first horizontal direction (X direction) and the second horizontal direction (Y direction).

[0143] When an external force is applied to the loading wing 230 during the testing process, the test board 100 and the semiconductor substrate 30 are subjected to pressure in the vertical direction (Z direction). Therefore, a greater external force can usually be applied in the vertical direction (Z direction) compared to the first horizontal direction (X direction) and the second horizontal direction (Y direction). Since each of the multiple elastic structures 220 can extend in a zigzag pattern along the first horizontal direction (X direction), the second horizontal direction (Y direction), and the vertical direction (Z direction), and the multiple elastic structures 220 are located closer to the central axis CA of the loading wing 230, the multiple elastic structures 220 can preferentially buffer the aforementioned external force compared to the multiple second elastic structures 260.

[0144] Since each of the multiple second elastic structures 260 can extend in a serrated manner along the first horizontal direction (X direction) and the second horizontal direction (Y direction), and the multiple second elastic structures 260 are located further away from the central axis CA of the loading wing 230, the multiple second elastic structures 260 can buffer the rotational force generated by the loading wing 230. Therefore, the multiple elastic structures 220 and the multiple second elastic structures 260 can effectively buffer the aforementioned external force generated in the vertical direction (Z direction) and the aforementioned rotational force generated in the aforementioned horizontal direction.

[0145] The foregoing has described the cases in which all the constituent elements constituting the embodiments of the present invention are combined into a whole or operated in combination, but the present invention is not necessarily limited to these embodiments. That is, as long as it is within the scope of the purpose of the present invention, it is also possible to selectively combine one or more of the constituent elements for operation.

[0146] The above description is merely illustrative of the technical concept of the present invention. Those skilled in the art should be able to make various modifications and alterations without departing from the essential characteristics of the invention. Therefore, the embodiments disclosed in this invention are intended to illustrate, not limit, the technical concept of the invention, and the technical concept of the invention is not limited by these embodiments. The scope of protection of this invention should be interpreted in accordance with the scope of the appended claims, and all technical concepts within the same scope should be interpreted as being included within the scope of the claims of this invention.

Claims

1. A probe comprising: a test board which contacts a semiconductor substrate to test reliability of the semiconductor substrate; a load pusher which has a frame provided on the test board and having a through region, a plurality of elastic structures which are arranged from an inner side of the frame in the through region and are disposed apart from each other in a circumferential direction, and a load wing which is connected with the frame through the plurality of elastic structures and protrudes the test board toward the semiconductor substrate; and a support tensioner which supports the load pusher, the plurality of elastic structures each include a plurality of first extending portions and a plurality of second extending portions, the plurality of first extending portions extend in a vertical direction and have a first width in a horizontal direction which is orthogonal to a direction in which the plurality of elastic structures each extend, the plurality of second extending portions extend to connect between the plurality of first extending portions and have a second width which is smaller than the first width in the horizontal direction.

2. The probe according to claim 1, the plurality of elastic structures each have a meandering structure which extends in a sawtooth shape in a repeated regular unit.

3. The probe according to claim 1, the plurality of elastic structures each have a first face and a second face which face the vertical direction and are opposite to each other, and have a plurality of first patterns and a plurality of second patterns which extend from the first face and the second face toward each other, respectively.

4. The probe according to claim 1, the plurality of elastic structures each have a first face and a second face which face the vertical direction and are opposite to each other, and have a plurality of third patterns which extend from the first face, respectively.

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