Method for producing transaction card defined by plurality of layers

Abstract

A method for manufacturing a transaction card defined by a plurality of layers is provided. The method includes providing a first portion of the card, the first portion including a non-plastic layer having a first face and a second face and a thickness therebetween; forming an opening defined through the first face in the non-plastic layer; an embedded electronic device is arranged in the opening; providing a second portion of the card; providing a filler disposed in a portion of the opening not occupied by the embedded electronics and attaching a first portion of the card to a second portion of the card, the step further comprising: providing a transfer tape comprising a carrier-free adhesive disposed between a first release layer and a second release layer; removing the first release layer and attaching an adhesive to (i) the second portion of the card and (ii) one of the first face and the embedded electronic device; the second release layer is removed and an adhesive is attached to (i) the second portion of the card and (ii) the other of the first face and the embedded electronic device.

Description

[0001] This application is a divisional application of the PCT application with the international application number PCT / US2018 / 049899, titled "Transaction Card with Embedded Electronic Components and Method of Manufacturing the Same", filed on September 7, 2018. The date when this PCT application entered the Chinese national phase is April 7, 2020, with the national application number 201880065325.4 and the priority date being September 7, 2017.

[0002] Cross - reference to related applications

[0003] This application claims the priority of U.S. Provisional Application No. 62 / 555,367, filed on September 7, 2017, the entire content of which is incorporated herein by reference. Technical field

[0004] The present invention relates to a method for manufacturing a transaction card defined by multiple layers. Background art

[0005] Users, manufacturers, and distributors of transaction cards may be interested in embedding electronic devices in the cards as thin printed circuit boards that provide any number of functions. The functions provided by such embedded electronic devices can include, but are not limited to, the following functions: allowing the use of biometrics, one - time passwords, a display for showing messages or product offers (e.g., liquid crystal diode (LCD) or electronic ink), an indicator (e.g., a light such as an LED) that is activated when the function of the card is in operation (e.g., when the card is physically or inductively connected to a reader and read), Internet connectivity to allow the card to join the Internet of Things (IoT), or any other desired function. An illustrative example of using an embedded electronic device in a card is for enabling the use of a dynamically generated security code.

[0006] As described in, for example, U.S. Patent Application Publication No. US20140279555A1 (Guillaud), which is incorporated herein by reference, the use of dynamically generated security codes in transaction cards (such as smart cards, debit cards, credit cards) has increasingly focused on reducing the risk of fraud. As described therein and known in the art, an exemplary security code may be referred to by those skilled in the art as a card verification value ("CVV" or "CVV2"), also known as a card security code ("CSC"), card verification data ("CVD"), card verification value code ("CVVC"), card verification code ("CVC" or "CVC2"), verification code ("V - code" or "V code"), or card code verification ("CCV").

[0007] Guillaud also discloses exemplary electronic components that can be used to implement the generation of a dynamic security code in card 200, as described herein in Figure 2As shown in, the exemplary electronic component includes: a processor / controller 202, a battery or other power source 204, a memory 206, and a display 208. Additional components may include, for example: one or more antennas 210; one or more other user interfaces, such as a touch keyboard 212 or touch-sensitive control buttons 214 connected to the processor / controller; and an internal clock (not shown) embedded in the processor / controller or configured to provide a time input to the processor / controller.

[0008] Cards with dynamically generated codes typically require not only an electronic display and other embedded electronic components to provide the required functionality, but also need to be particularly thin to fit the thickness of a standard credit card, which is typically about 0.030 + / - 0.003 inches (i.e., 1 / 32 inch, 30 mils, or 0.76 mm + / - 10%). The disclosures of Guillaud and U.S. Patent Application Publication No. US20120206869A1, U.S. Patent Nos. 8,448,872, and 9,320,186, all of which are incorporated herein by reference, describe plastic cards with embedded electronic components and / or methods of manufacturing the same. However, there is also a concern in the art to provide embedded electronic components, such as those facilitating the use of dynamic security codes, in cards constructed of materials other than plastic, such as metal or ceramic, the construction of which presents unique manufacturing challenges. Summary of the Invention

[0009] One aspect of the present invention includes a trading card having a non-plastic core such as metal or ceramic, the non-plastic core having a first face and a second face, a slot defined by an opening in the first face, a void, and a bottom of the slot. For example, the non-plastic core can also be a non-plastic polymer since plastic is a specific type of polymer. An embedded electronic device including at least a printed circuit board and a power source is disposed in the void, wherein an EMI shielding layer such as ferrite is disposed between the electronic device and the bottom of the slot of the card having a metal core). For example, the printed circuit board can be a flexible circuit board. The power source does not necessarily need to be a battery, but can be, for example, an RF power source. A cured resin layer is disposed in contact with the first face and the embedded electronic device, and in a portion of the void not occupied by the embedded electronic device, one or more layers are disposed above the cured resin layer. The one or more layers can include a transparent plastic layer, a magnetic stripe, and a laser-responsive layer. For each embodiment, each of the one or more layers can include a layer of glass or fiber-reinforced epoxy laminate material. In some embodiments, the embedded electronic device can further include a display and a processor configured to generate a dynamic security code on the display. A through-hole can be provided in the core that communicates the second face to the bottom of the slot, wherein contacts disposed in the through-hole are configured to be read by a card reader, and an integrated circuit module is connected to the contacts. The core can have a coating on the second face and printed markings on the coating. Markings can also be formed on at least one of the one or more layers disposed above the cured resin layer, such as printed markings, laser-formed markings, or a combination thereof.

[0010] Another aspect of the present invention includes a method for manufacturing a trading card defined by a plurality of layers defining a first portion and a second portion. The method includes: providing a first portion of the card including a core, forming a groove in the core, and disposing an embedded electronic device in the void. A first component of a resin is applied to the first portion of the card to contact the first face and the embedded electronic device and is disposed in the portion of the void not occupied by the embedded electronic device, and a second component of the resin is applied to contact the second portion of the card. The first component and the second component are assembled together, wherein the first component of the resin and the second component of the resin contact each other and the resin is cured. The resin can include, for example, a two-part epoxy resin, wherein the first component of the resin is different from the second component of the resin. However, the resin is not limited to a two-part epoxy resin and, in other embodiments, can include, for example but not limited to, a one-part epoxy resin, a heat-curable epoxy resin, a UV-curable epoxy resin, an anaerobic epoxy resin, etc. The step of curing the resin can include curing the resin in a vacuum press at room temperature. The curing step can comprise, for example, UV-based curing, humidity-based curing, or temperature-based curing. The second portion can have a plurality of layers, in which case the method can include pre-laminating the plurality of layers together before applying the resin. In embodiments where the core includes metal, the method further includes disposing a ferrite layer between the embedded electronic device and the bottom of the groove.

[0011] Alternatively, in one aspect of the present invention, before applying the two-part epoxy resin, the resin can first be delivered into an opening in the first portion of the card and contact the embedded electronic device. Once the resin is cured, then as described above, the two-part epoxy resin can be applied to the first portion and the second portion of the card.

[0012] The method can include printing a mark on a coating on the second face of the core and forming a mark on one or more layers of the second portion, such as printing a mark on a transparent plastic layer or generating a laser-formed mark by exposing a laser-responsive layer to a laser. The method can further include: forming a through-hole in the first portion that communicates the second face to the bottom of the groove, disposing a contact in the through-hole, and electrically connecting the contact to an integrated circuit module. The plurality of layers of the second portion can include a carrier substrate having an adhesive side and a non-adhesive side, a transparent plastic layer, a magnetic stripe, and a laser-responsive layer, in which case pre-laminating the second portion can include: contacting the adhesive side of the carrier substrate with one side of the transparent plastic layer and laminating the laser-responsive layer to the transparent plastic layer.

[0013] The method can include assembling a plurality of layers defining a card into a composite including a plurality of sheets, each sheet defining one of the plurality of layers and having an area more than twice as large as the area of a single card, in which case the method includes cutting a plurality of individual trading cards from the composite. Then, after cutting the individual trading cards from the composite, the card can be personalized.

[0014] Another aspect of the invention includes a trading card that includes a non-plastic core having a first side and a second side, a core thickness between the first side and the second side, and an opening. An embedded electronic device is disposed in the opening. The embedded electronic device includes an indicator, which can be an LED or a display. One or more layers are disposed over the non-plastic core and the embedded electronic device. The one or more layers can be transparent or include an opening such that the display is visible from the exterior of the trading card.

[0015] One aspect of the invention includes a method for manufacturing a trading card defined by a plurality of layers, the method including the steps of: providing a first portion of the card, the first portion including a non-plastic layer having a first side and a second side and a thickness between the first side and the second side; forming an opening in the non-plastic layer, the opening being defined as passing through the first side; disposing an embedded electronic device in the opening; providing a second portion of the card; providing a filler disposed in the portion of the opening not occupied by the embedded electronic device and attaching the first portion of the card to the second portion of the card; wherein the step of providing the filler and attaching the first portion of the card to the second portion of the card includes the sub-steps of: providing a transfer tape including a carrier-free adhesive disposed between a first release layer and a second release layer; removing the first release layer and attaching the adhesive to (i) the second portion of the card and (ii) one of the first side and the embedded electronic device; removing the second release layer and attaching the adhesive to (i) the second portion of the card and (ii) the other of the first side and the embedded electronic device.

[0016] Another aspect of the invention includes a method for manufacturing a trading card defined by a plurality of layers, the method including the steps of: providing a first portion of the card, the first portion including a non-plastic layer having a first side and a second side and a thickness between the first side and the second side; forming an opening in the non-plastic layer, the opening being defined as passing through the first side; disposing an embedded electronic device in the opening; providing a second portion of the card; providing a filler disposed in the portion of the opening not occupied by the embedded electronic device and attaching the first portion of the card to the second portion of the card; and wherein the step of providing the filler and attaching the first portion of the card to the second portion of the card includes the sub-steps of: laminating the first portion to the second portion at a temperature above room temperature in a lamination process, wherein the filler includes a portion of a flowable polymer layer disposed in the second portion, and wherein the flowable polymer layer is flowable at the lamination temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A is a schematic view of an exemplary card according to an embodiment of the present invention.

[0018] Figure 1B is a schematic view of an exemplary card according to an embodiment of the present invention in which a filling layer is confined to a groove.

[0019] Figure 1C is a schematic view of an exemplary card according to an embodiment of the present invention including a transfer belt.

[0020] Figure 1D is a schematic view of an exemplary card achieved by using a thermal lamination process according to an embodiment of the present invention.

[0021] Figure 2 is a schematic view of an embedded electronic device that can be found in a trading card to provide a dynamic security code function.

[0022] Figure 3 is a schematic view of an exemplary manufacturing method according to an embodiment of the present invention.

[0023] Figure 4A and Figure 4B respectively show the front side and the back side of an exemplary card according to an embodiment of the present invention.

[0024] Figure 5 is a schematic view of an exemplary card according to an embodiment of the present invention.

[0025] Figure 6 is a block diagram depicting an exemplary method for assembling Figure 5 the card.

[0026] Figure 7 depicts a schematic view of an exemplary card according to another embodiment of the present invention. DETAILED DESCRIPTION

[0027] Now referring to Figures 1A to 1D , an exemplary embodiment of the present invention is shown. In this example, the card 100 includes what is sometimes referred to as a "metal veneer card". The card 100 includes a plurality of layers and may include additional layers other than those depicted herein. The layer 110 includes a metal core, such as stainless steel, having a top surface 111 and a back surface 109. The metal core 110 may have a coating 113 that forms the front surface 111 for supporting printing thereon.

[0028] Coating 113 can include, for example, a polyester-based coating that readily accepts UV-curable screen and inkjet inks. A resist can be applied over this coating during any acid etching step (e.g., if the etching step is used to create any slots, as described subsequently herein). For example, the resist is applied to the entire coated side 111 of the metal, while the other side 109 is etched, and the etched side 109 accepts the resist except where slots 112 (and any other slots or surface patterns) are to be formed. After etching, the remaining resist is removed from both sides, and the part is ready for further manufacturing.

[0029] A layer 108 of epoxy resin is adjacent to the bottom surface of the metal core and can also completely or partially fill the slots 112. Layer 106 includes layers of adhesive film on both sides of 105 and 107, such as a transparent polyester-based film with an adhesive, the adhesive being, for example, a copolymer adhesive, such as but not limited to ethylene acrylic (EEA) adhesive. However, the present invention is not limited to any type of adhesive or the carrier substrate for the adhesive. Layer 104 can be a polymeric or plastic layer, such as, for example, a transparent amorphous copolyester film, such as Tritan TM film (manufactured by Eastman Chemical), while layer 102 can be a laser-responsive layer such as laser-responsive PVC, on which a magnetic stripe overlay can also be provided. The window 103 can be cut or punched out of layer 104 during printing. In one exemplary embodiment, the thickness of the metal core layer can be 0.025 inches (0.635 mm), and the thickness of each of the epoxy resin layer 108, adhesive layer 106, plastic layer 104, and laser-responsive layer 102 can be 0.002 inches (0.05 mm). Although the thickness of the resulting product is typically a thickness known in the art to meet the standard thickness of a trading card, the present invention is not limited to any specific size. The present invention is also not limited to any specific material for the construction of the layers or the number of layers described in this example.

[0030] In an exemplary method for manufacturing a card, a card blank is produced from a sheet having an area large enough to allow cutting of multiple cards from the same sheet. For example, a sheet approximately 8" wide × 20" long, such as Figure 3 sheet 300 depicted in can support sixteen card blanks 314 that are two cards wide by eight cards high in rows and columns. Thus, it should be understood that although depicted as a sheet in Figure 3 and as individual cards in Figures 1A to 1D , the Figure 3 sheet can contain all of the Figures 1A to 1D layers prior to cutting the sheet into individual card blanks.

[0031] In a first operation of an exemplary manufacturing method, four positioning holes 310 are created in a sheet 300. Then, sixteen slots are formed in the back side of the sheet, for example, by etching, engraving, milling, or by any method known in the art, including using a standard CNC program. As Figures 1A to 1D depicted, these slots may penetrate only to a depth A, which is less than the thickness B of the card by an amount sufficient to avoid deformation of the slots in the card. For example, in an embodiment where the thickness of the card is approximately 0.025 inches (0.635 millimeters) (the dimension “B” as Figures 1A to 1D shown), the depth of the slots (the dimension “A” as Figures 1A to 1D shown) may be only 0.019 inches (0.48 millimeters). However, the present invention is not limited to any specific dimensions.

[0032] The slots 112 shown have a relatively wide region 112 and a relatively narrow region 116 and may have through-holes 114. Through-holes may be allowed in the slots for aligning a display to be visible from the front of the card or for inserting a payment module that includes an integrated circuit (not shown) and contacts 410 (depicted in Figure 4A ) configured to be read by a contact reader used in the card. In some embodiments, the through-holes for the chip and contacts 410 (and other aspects of the payment module) may not coincide with the slots for embedding the PCB. The through-holes for the payment module may be separate from the slots 112, including adjacent to the slots 112 such that the through-hole 114 shares a boundary with the slot 112, or spaced apart from the slots 112, with a portion of the core layer therebetween. In other embodiments, the contacts and the IC module may be inserted into slots that do not completely penetrate the card, the slots being open from the front of the card, and the slots may be spatially completely non-overlapping with the slots 112 or may only partially overlap. The contacts 410 may be part of a contact-only system or a dual-interface (DI) system configured to be operated by a contact reader or an inductive (non-contact) reader. The relatively wide region 112 may be configured to accommodate a display and a processor for operating the display, while the narrower region 116 may be configured to accommodate an integrated circuit chip module, contacts, and any antenna associated with the DI system. The through-holes 114 may be created in the narrower region during or immediately after the slot etching step, or may be performed later.

[0033] Then, a print may be printed on the front (coated) side 111 of the card, for example, using an inkjet printer or any other printing technique known in the art.

[0034] For example, an electromagnetic interference (EMI) shielding layer insert 120 having the same geometry as the inside of the slot 312, such as a ferrite layer, is prepared by cutting an insert from a ferrite sheet including a layer of ferrite material disposed on one side of a plastic film (such as PET). Then, the ferrite insert 120 is picked and placed, for example, manually or automatically, and the non-coated side of the ferrite film is adhered in the slot using an adhesive. Alternatively, the ferrite insert 120 can be bonded to the inlay or PCB (such as PCB 426) instead of the slot 112. In any case, the ferrite insert 120 is generally located between the bottom of the slot and the electronic component 420.

[0035] In one embodiment, the carrier substrate can have a ferrite on one face of the substrate and an adhesive on the other face, and a release layer that is removed prior to insertion to expose the adhesive. Then, electronic components 420 such as Figure 4B those shown in and described later herein, such as a PCB 426 printed on the substrate and a connected display 424 (such as an electronic ink display that requires very low power to operate) and a power supply 422, are placed on top of the ferrite insert. The electronic components can be adhered in place. The adhesion, as described in various embodiments herein, can be accomplished with any adhesive known in the art, such as but not limited to a pressure-sensitive adhesive, a cyanoacrylate, or an epoxy resin.

[0036] The electronic component 420 can include Figure 2 all of the components, less than all of the components, or components completely different from those schematically illustrated in the figure, depending on the functions required of the card. For example, the component can include a keyboard for inputting information. It is noted that the arrangement of the components as Figures 4A to 4B shown is merely exemplary, and for example, instead of the display 424 facing the back of the card, the card can have a through-hole, and the display can be arranged to face the front of the card. As is known in the art, the power supply 422 can include a battery or any other power supply suitable for inclusion in the card, such as a photovoltaic cell or a circuit that obtains power from a radio frequency (RF) signal (such as including a capacitor relay). Methods for manufacturing a PCB suitable for insertion into a card body - including a PCB containing a flexible substrate - are well known in the art, and the present invention is not limited to any particular type of PCB, nor to any particular type of function of the PCB (nor to other electronic components of any particular function). The material of the EMI shielding layer is not limited to ferrite materials, and the insert can include any material suitable for providing shielding for the electronic components and the antenna from harmful interference generated by the metal core. Additionally, although effective insertion is achieved by cutting an insert from a sheet containing ferrite material and setting it in the slot, in other embodiments, the EMI shielding layer can be provided in some other way, such as by coating the bottom of the slot with an active ingredient.

[0037] The adhesive layer 106 and the plastic layer 104 can be pre-laminated to each other, and the print can be printed on the plastic side of the thus-formed pre-laminate. The plastic layer 104 can have a window 103, which can be a hole cut in the layer or, for example, a transparent or translucent portion that remains unprinted or otherwise uncolored, or has a coloring through which the display below can be suitably read. The adhesive side 105 of the adhesive film can have a release layer to protect the adhesive side 105 from contamination due to handling before the pre-lamination step, prior to coupling the adhesive side to the plastic layer. In some embodiments, the plastic layer can include a layer having a primer or alternatively including a material suitable for direct adhesion to the resin layer 108.

[0038] Then the 104 / 105 / 106 pre-laminate composite is laminated to the laser-responsive layer PVC. A magnetic stripe ( Figure 4B depicted as 403 in ) can be provided, for example, disposed as an overlay on the laser-responsive layer, wherein the combined laser-responsive layer / magnetic stripe composite is covered with a release layer (not shown). Although depicted in Figure 4B as setting the magnetic stripe in a position that does not intersect the embedded electronic device, the magnetic stripe can be disposed over a portion of the electronic device.

[0039] Then, an epoxy resin, for example, a two-component transparent epoxy resin system, is applied, for example, by screen printing, where one component is applied to the back side 109 of the metal layer (thereby encapsulating the electronic device in a slot), the other component is applied to the non-adhesive side 107 of the 104 / 105 / 106 pre-laminate composite, and the two epoxy-coated sides are assembled to contact each other. The absence of air gaps / voids at the epoxy resin interface is important for maintaining good peel strength after combination. Then, the assembly is laminated, for example, via a cold lamination method using a vacuum press, which can help remove air gaps / voids. The lamination and curing cycles of the epoxy resin can have a significant impact on the adhesion / peel strength of the card. Although not limited to any specific lamination conditions, it has been demonstrated that cold lamination curing of 20 - 3401 epoxy resin at room temperature (e.g., 75 - 78°F) at a pressure of approximately 15 PSI for a duration of about 22 to 24 hours produces a card with a peel strength tested by the CQM 13.2.1.22 / TM-412 peel strength test using a 90-degree peel adhesion test in a single-column adhesive and peel test system. a card with a peel strength tested by the CQM 13.2.1.22 / TM-412 peel strength test using a 90-degree peel adhesion test in a single-column adhesive and peel test system.

[0040] After 48 hours of further curing of the epoxy resin after removal from the vacuum press, the contacts 410 of the connected chip module can be inserted into through-holes or slots designed to receive the chip module (the through-holes or slots can be created before assembling the core to other layers or at any time after creating the assembly and before placing the chip module). As previously mentioned, the through-holes or slots for receiving the payment module including the contacts 410 can be located inside the slot 112, adjacent to the slot and having a common boundary with the slot or can be separate holes spaced from the slot. Individual card blanks 314 are then cut from the sheet 300. The card blanks are then ready for cleaning, inspection, and any further processing including personalization. As is known in the art, the personalization step can include the steps of exposing a laser-responsive layer to a laser to form, for example, a laser-formed signature personalized for the cardholder, and programming the embedded electronic device with information assigned to the cardholder. For example, in embodiments having an integrated circuit module and contacts readable by a card reader (or a dual-interface module configured for contactless reading), as is well known in the art, the chip can be programmed with information unique to the cardholder. As part of the personalization step, information unique to the cardholder can also be provided to a processor and / or memory associated with a feature for displaying a security code.

[0041] In Figure 1B another exemplary method of manufacturing the card 150 shown in, an electronic device (e.g., with an adhesive) can be adhered into the slot 112, then the slot 112 (instead of the surface 109 of the cover layer 111) can be filled with epoxy resin 108A, and subsequently one or more additional sheets can be "cold" laminated (i.e., at room temperature, as described above) to the back surface 109 of the card. Thus, as Figure 1B shown, the epoxy resin 108 can not be coextensive with the length of the card, but can be confined to the slot 112.

[0042] For assembling such as Figure 1CAnother alternative method for the card of the card 170 shown in [Figure] may include using a transfer tape instead of epoxy resin or some other resin. The transfer tape includes a carrierless or carrier adhesive 128 having release layers 127, 129 on both sides. Exemplary methods include the following steps: printing a backsheet (layer 104), for example, positive printing or reverse printing in a roll-to-roll printing step, and then rolling onto the transfer tape by removing the release layer 127 from one side, applying the transfer tape to the film 104, and leaving the release layer 129 on the opposite side. Then, the printed layer 104 and the transfer tape assembly can be pre-laminated. Then, layer 102 can be disk-laminated to the non-release side of the printed layer 104 and the transfer tape assembly. Then, layer 111 with embedded electronic components (which can be adhered in the slots 112) is prepared as described above, without applying epoxy resin to fill the slots or cover the back of layer 111. Then, the release layer 129 is removed from the 102 / 104 assembly, and the assembly with the transfer tape side facing the sheet 111 is applied to the sheet 111 with electronic components in the slots. Then, the assembly can optionally be further processed, for example, by exposing the assembly to moderate compression under vacuum to maximize the contact of the adhesive with all surfaces and evacuate any air bubbles. Heat can also be applied to reduce the viscosity of the adhesive to improve its fluidity. Applying heat, vacuum, and / or compression may also cause the carrierless adhesive to flow into the slots to partially or completely fill the space between the electronic device and the boundary of the slots.

[0043] As Figure 1D shown, yet another method for embedding electronic devices may include a "thermal lamination" method, which is used to embed electronic devices designed to withstand the amount of heat and pressure present in this method. In the thermal lamination method, layer 111 can be provided with embedded electronic devices adhered to the slots 112 as previously described, and the rest of the card 190 is constructed with various layers and adhesives and laminated under heat, pressure (compressive force F applied to the stack), and / or vacuum (in an environment maintained at a pressure V less than atmospheric pressure to facilitate removing any air remaining between the layers during lamination) above room temperature. Thus, Figure 1D the layer 138 shown in [Figure] represents one or more polymer layers or plastic layers located between layer 104 and the surface 109 of the core, where at least the layer closest to the surface 109 can have a flowable state at a predetermined lamination temperature, such that under the compressive force F and / or in a vacuum environment, the layer closest to the surface 109 will at least partially melt into the slots 112 and at least partially fill the slots 112 during lamination.

[0044] Figure 5 is a schematic diagram of a card 500 according to an exemplary embodiment of the present invention. The card 500 generally includes a plurality of layers shown as disassembled from each other.

[0045] Starting from the front side (i.e., the chip side) of the card 500, layer 502 includes a coated PVC, which can be, for example, 0.001 inches (0.02 mm) thick. Layer 504 mounted to the bottom side of layer 502 includes a glass-reinforced epoxy laminate material (such as FR4), which can be, for example, 0.004 inches (0.1 mm) thick. Layer 506 mounted to the bottom side of layer 504 includes an adhesive, such as an adhesive in the form of a double-sided high-performance adhesive tape, which can be, for example, 0.002 inches (0.05 mm) thick. Both sides of the double-sided tape can be covered by release layers, each of which is removed during the assembly process. Core layer 508 mounted to the bottom side of layer 506 includes a non-plastic material such as metal. For example, the metal can be steel (such as stainless steel) that is 0.018 inches (0.457 mm) thick. Layer 508 has a through-hole or opening 510 in which the electronic component 420 (described above) is positioned. Layer 512 mounted to the bottom side of layer 508 includes a laminated adhesive, which can be, for example, 0.002 inches (0.05 mm) thick (and it can be the same or a different material from layer 506). Layer 514 mounted to the bottom side of layer 512 includes a polymer, which can be, for example, 0.004 inches (0.1 mm) thick. Layer 516 mounted to the bottom side of layer 514 optionally includes a PVC overlay, which can be, for example, 0.002 inches (0.05 mm) thick (and it can be the same or a different material from layer 502). A magnetic stripe can be mounted on or embedded in layer 516. Layer 516 represents the rear side (i.e., the display side) of the card 500. The outer dimensions of the various layers of the card 500 are substantially equal. In Figure 5 the layers shown and described above include only one exemplary embodiment, and any one of them can be optional in other embodiments, which can have fewer layers or all of the layers or additional layers compared to the layers described above. The above thicknesses are only exemplary. The card corresponding to the present invention is not limited to any specific layers, material compositions, or thicknesses of such layers, however certain claimed embodiments and combinations may have distinct advantages.

[0046] The arrangement of the various layers can vary. For example, layers 502, 504, and 506 of the card 500 can be replaced by a second set of layers 516, 514, and 512. As will be discussed later, such a card is useful for an electronic device 420 capable of manipulating a thermal lamination process. As another example, layers 502 and 516 can be swapped, such that layer 502 is on the rear side of the card 500 and layer 516 is on the front side of the card 500.

[0047] Layers 512, 514, and 516 are (optionally) transparent such that the display 424 of the electronic component 420 is visible from the back side of the card. As described above, the display 424 can be, for example, a single indicator LED light or a display capable of showing alphanumeric characters. In another embodiment, layers 502, 504, 506 are (optionally) transparent such that the display 424 of the electronic component 420 is visible from the front side of the card. Alternatively, all of the layers 502, 504, 506, 512, 514, and 516 are (optionally) transparent such that the display 424 of the electronic component 420 is visible from both sides of the card.

[0048] Figure 6 is a block diagram depicting an exemplary method 600 for assembling Figure 5 card 500. Method 600 is not necessarily limited to any particular steps or sequence of steps.

[0049] In exemplary method 600, at step 602, layer 502 is laminated to layer 504. The lamination at step 602 can be a thermal lamination involving heat and pressure. At step 604, the laminated layers 502 and 504 are bonded to the top surface of the double-sided tape layer 506 (i.e., after removing the top release sheet from layer 506). At optional step 606, text and graphics can be printed onto layer 502. At optional step 608, text and graphics can be printed on layer 514. Step 608 can be completed before step 602, and vice versa. At step 610, layer 514 is laminated to layer 516. The lamination at step 610 can include a thermal lamination involving heat and pressure. As an alternative to step 610, layer 514 can be laminated to layer 516 and layer 508 using the lamination adhesive of layer 512 in a single step. At step 612, an opening 510 is formed in layer 508. At step 614, layers 514 and 516 are laminated to the bottom side of layer 508 using layer 512. The lamination at step 614 can include a thermal lamination involving heat and pressure. At step 616, the electronic component 420 is positioned within the opening 510 formed in layer 508.

[0050] At step 618, the bonded layers 502, 504, and 506 are bonded to the top side of layer 508 using the bottom surface of the double-sided tape layer 506 (i.e., after removing the bottom release sheet from layer 506). Step 618 is preferably a cold lamination step that does not require significant heat or pressure but can use a vacuum. Method 600 preferably uses a cold lamination method at step 618 to avoid exposing the electronic device 420 to heat and / or pressure.

[0051] For electronic devices that can tolerate the thermal lamination process, as described above, layers 502, 504, and 506 of card 500 can be replaced by layers 516, 514, and 512. To assemble such a card, first, electronic device 420 is placed in opening 510; the first set of layers 516, 514, and 512 is thermally laminated to one side of layer 508; then, the second set of layers 516, 514, and 512 is thermally laminated to the other side of layer 508.

[0052] Figure 7 Exploded view depicting card 700 according to another exemplary embodiment. Card 700 includes a plurality of layers and may include additional layers other than those depicted herein. These layers have substantially the same maximum outer dimensions along axis A and axis B. Layer 702 includes a metal core having a front surface 704 and a rear surface 706, such as including stainless steel. The thickness of layer 702 can be, for example, 0.018 inches (0.45 mm). Layer 702 may have a coating on the front surface 704 for supporting printing thereon.

[0053] Layer 702 has three through openings 708a, 708b, and 708c, each of the through openings extending from the front surface 704 to the rear surface 706. Opening 708c is located at approximately the center of the card and is generally aligned along the longitudinal axis "A" and the transverse axis "B". Openings 708a and 708b are located on each side of opening 708c. Each of the openings 708a, 708b, and 708c has a generally rectangular or square shape with rounded interior corners. Opening 708c is larger than openings 708a and 708b. The size and shape of the openings may be different from the size and shape of the openings shown and described. If desired, the openings can be provided in the form of slots or blind holes.

[0054] Layer 703 is located below layer 702. Layer 703 is a printed circuit board (PCB) made of FR4 material having a thickness of, for example, 0.004 inches (0.1 mm). Layer 703 can generally be made of a glass-reinforced epoxy laminate sheet material. Although not shown, layer 703 includes multiple traces capable of transmitting electrical signals and current, and the traces can be made of, for example, copper.

[0055] A payment module in the form of chip 710 is mounted to the top side of layer 703 and extends above layer 703. As described above, chip 710 can form part of a dual interface (DI) system. In the assembled form of card 700, chip 710 is positioned to be contained within opening 708a.

[0056] The fingerprint pad 712 is also mounted to the top side 707 of the layer 703 and extends above the layer 703. The fingerprint pad 712 is connected to the chip 710 through vias and / or traces (not shown) in the layer 703. In the assembled form of the card 700, the fingerprint pad 712 is positioned to be contained within the opening 708b.

[0057] The capacitive RF antenna 714 is mounted to the top side 707 of the layer 703 or embedded within the layer 703. The antenna 714 is located at an approximate center of the card 700 in an attempt to follow one or more regulatory standards. The antenna 714 is connected to the chip 710 through vias and / or traces (not shown) in the layer 703. In the assembled form of the card 700, the antenna 714 is positioned along axes A and B to be aligned with the opening 708c. The antenna 714 may or may not protrude above the surface of the layer 703. The antenna 714 consumes a large area on the layer 703 in an attempt to enhance wireless performance.

[0058] The insert 705 is located within the opening 708c of the layer 702 and resides above the antenna 714 on the layer 703. For example, the insert 705 may be composed of plastic having a thickness of 0.018 inches (0.45 millimeters). The thickness of the insert 705 may be equal to the thickness of the layer 704. The front surface 718 of the insert 705 may have a coating for supporting printing thereon and on the front surface of the layer 702. Alternatively, one or more plastic layers (not shown) may be applied above the insert 705 and the layer 702, and printing may be applied to the outermost layer. The plastic insert 705 is configured to allow RF flux emitted by the antenna 714.

[0059] Although not shown, a small integrated circuit (IC) may also be mounted to the top side (or within) of the layer 703 to process signals transmitted between the fingerprint pad 712 and the chip 710. More particularly, the IC may verify a fingerprint applied to the pad 712. The IC may be connected to other components mounted to the layer 703, and traces and / or vias may connect the IC chip to other components of the card 700. The components mounted to the layer 703 may be different from the components shown and described. These components may include ICs, Bluetooth modules, displays, etc.

[0060] Although exemplary embodiments are described herein as having a metal core, it should be understood that similar structures and manufacturing methods may be associated with the manufacture of cards having a non-plastic core other than metal, such as a ceramic core. Cards having a ceramic core have the advantage of not requiring an EMI shielding layer, such as the ferrite layer described herein, or any method steps associated with the placement or manufacture of an EMI shielding layer. The ceramic core is manufactured to have any number of slots and holes for accommodating electronic devices as needed via molding, machining, etching, or any method known in the art for creating such features in a ceramic body. A method for making a ceramic core is described in U.S. Patent Application No. 15 / 521,519, entitled "CERAMIC-CONTAINING AND CERAMIC COMPOSITE TRANSACTION CARDS", which is assigned to a co-applicant of the present application and incorporated herein by reference. Although described herein as having certain layers, any part of the card may have fewer, more, or different layers compared to those described herein, and each of the layers may have a different construction material compared to those discussed herein. The present invention is not limited to any particular order of layers or the order of assembling the layers. Some layers as described herein may include more than one material or a composite of material layers. Additional layers may be provided between any of the layers disclosed herein, either as part of the finished card or as a temporary layer (e.g., a release layer) that is removed during the assembly process. Layers disclosed herein as discrete films may alternatively be provided as coatings, and vice versa.

[0061] Although the present invention has been shown and described with reference to particular embodiments, the present invention is not intended to be limited to the details shown. Instead, various modifications may be made in the equivalents of the claims and without departing from the present invention.

[0062] The present invention may also be configured as follows:

[0063] 1. A transaction card, comprising:

[0064] A non-plastic core having a first face and a second face, a core thickness between the first face and the second face, and an opening in the first face;

[0065] An embedded electronic device disposed in the opening, the embedded electronic device including at least a printed circuit board and an active or passive power source;

[0066] A filling layer in contact with the embedded electronic device and disposed in a portion of the opening not occupied by the embedded electronic device;

[0067] One or more layers disposed above the filling layer.

[0068] 2. The transaction card according to 1, wherein the one or more layers include a polymer layer and a magnetic stripe.

[0069] 3. The transaction card according to 1, wherein the one or more layers include a laser-responsive layer.

[0070] 4. The transaction card according to 1, wherein the embedded electronic device further includes a display and a processor configured to generate a dynamic security code on the display.

[0071] 5. The transaction card according to 1, wherein the core further includes a groove extending from the opening and having a groove bottom with a depth less than the thickness of the core, a through hole connecting the second surface to the groove bottom, a contact disposed in the through hole and configured to be read by a card reader, and an integrated circuit module connected to the contact.

[0072] 6. The transaction card according to 1, wherein the core has a coating on the second surface and a printed mark on the coating.

[0073] 7. The transaction card according to 1, further including a mark formed on at least one of the one or more layers disposed above the filling layer.

[0074] 8. The transaction card according to 7, wherein the mark includes a printed mark, a laser-formed mark, or a combination thereof.

[0075] 9. The transaction card according to 1, wherein the non-plastic core includes metal, and the non-plastic core further includes a groove extending from the opening, the groove having a groove bottom with a depth less than the thickness of the core, and the transaction card further includes an EMI shielding layer disposed in a gap between the embedded electronic device and the groove bottom.

[0076] 10. The transaction card according to 9, wherein the EMI shielding layer includes ferrite.

[0077] 11. The transaction card according to 1, wherein the non-plastic core includes ceramic.

[0078] 12. The transaction card according to 1, wherein the filling layer includes a cured resin.

[0079] 13. The transaction card according to 1, wherein the filling layer is confined to the opening.

[0080] 14. The transaction card according to 1, wherein the filling layer extends on the first surface of the non-plastic core.

[0081] 15. The transaction card according to 1, wherein the filling layer includes a transfer tape adhesive.

[0082] 16. The trading card according to claim 1, wherein the filling layer comprises a polymer having a flowable state at a predetermined lamination temperature.

[0083] 17. A method for manufacturing a trading card defined by a plurality of layers, the method comprising the steps of:

[0084] Providing a first portion of the trading card, the first portion comprising a non-plastic core having a first side and a second side and a core thickness between the first side and the second side;

[0085] Forming an opening in the core, the opening being defined as passing through the first side;

[0086] Disposing an embedded electronic device in the opening, the embedded electronic device comprising at least a printed circuit board and a battery;

[0087] Providing a second portion of the trading card;

[0088] Providing a filler disposed in a portion of the opening not occupied by the embedded electronic device and attaching the first portion of the trading card to the second portion of the trading card.

[0089] 18. The method according to claim 17, wherein the step of providing the filler and attaching the first portion of the trading card to the second portion of the trading card comprises the following sub-steps:

[0090] Applying a first component of the resin to the first portion of the trading card to contact the first side and the embedded electronic device;

[0091] Applying a second component of the resin to contact the second portion of the trading card;

[0092] Assembling the first component and the second component together, wherein the first component of the resin and the second component of the resin are in contact with each other;

[0093] Curing the resin.

[0094] 19. The method according to claim 17, wherein the resin comprises a two-part epoxy resin, and in the two-part epoxy resin, the first component of the resin is different from the second component of the resin.

[0095] 20. The method according to claim 17, wherein the step of curing the resin comprises curing the resin by ultraviolet light, humidity or heating.

[0096] 21. The method according to 17, wherein the step of curing the resin includes curing the resin in a vacuum press.

[0097] 22. The method according to 17, wherein the step of providing the filler and attaching the first portion of the trading card to the second portion of the trading card includes the following sub-steps:

[0098] Providing a transfer tape including a carrier-free adhesive disposed between a first release layer and a second release layer;

[0099] Removing the first release layer and attaching the adhesive to (i) the second portion of the trading card and (ii) one of the first face and the embedded electronic device; and

[0100] Removing the second release layer and attaching the adhesive to (i) the second portion of the trading card and (ii) the other of the first face and the embedded electronic device.

[0101] 23. The method according to 17, wherein the step of providing the filler and attaching the first portion of the trading card to the second portion of the trading card includes the following sub-steps:

[0102] Laminating the first portion to the second portion at a temperature above room temperature in a lamination process, wherein the filler includes a portion of a flowable polymer layer disposed in the second portion, and wherein the flowable polymer layer is flowable at the lamination temperature.

[0103] 24. The method according to 17, wherein the step of providing the filler and attaching the first portion of the trading card to the second portion of the trading card includes the following sub-steps:

[0104] Applying resin at least in a portion of the opening, wherein the resin does not extend beyond the opening; and

[0105] Curing the resin.

[0106] 25. The method according to 24, further comprising laminating at least one sheet above the resin and the first portion of the trading card.

[0107] 26. The method according to 17, further comprising adhering the electronic device in the opening before disposing the filler in the opening.

[0108] 27. The method according to 17, wherein the core includes a coating on the second face, and further comprising applying a printed mark to the coating.

[0109] 28. The method according to 17, wherein the second part comprises a plurality of layers.

[0110] 29. The method according to 28, wherein the plurality of layers comprises a polymer layer, a magnetic stripe, and a laser-responsive layer.

[0111] 30. The method according to 17, further comprising forming a mark on the second part.

[0112] 31. The method according to 30, wherein the step of forming the mark comprises printing the mark.

[0113] 32. The method according to 31, wherein the plurality of layers of the second part comprises a transparent polymer layer, and the step of printing the mark comprises printing the mark on the transparent polymer layer.

[0114] 33. The method according to 31, wherein the plurality of layers of the second part comprises a laser-responsive layer, and the step of forming the mark comprises exposing the laser-responsive layer to a laser.

[0115] 34. The method according to 29, wherein the step of providing the second part comprises pre-laminating the plurality of layers together before applying a resin.

[0116] 35. The method according to 34, wherein the plurality of layers of the second part comprises a carrier substrate having an adhesive side and a non-adhesive side, a transparent polymer layer, a magnetic stripe, and a laser-responsive layer, and the step of pre-laminating the second part comprises contacting the adhesive side of the carrier substrate with one side of the transparent polymer layer and laminating the laser-responsive layer to the transparent polymer layer.

[0117] 36. The method according to 34, wherein the forming step comprises forming a groove extending from the opening and having a groove bottom with a depth less than the core thickness.

[0118] 37. The method according to 36, wherein the core comprises metal, and the method further comprises providing a layer of ferrite between the embedded electronic device and the groove bottom.

[0119] 38. The method according to 17, wherein the core comprises metal, and the method further comprises providing a coating over the surface of the metal such that printing can be performed on the coated metal surface.

[0120] 39. The method according to 17, wherein the core comprises ceramic.

[0121] 40. The method according to 17, further comprising forming a through-hole in the core, providing a contact in the through-hole, and electrically connecting the contact to an integrated circuit module.

[0122] 41. The method according to claim 40, wherein the process of forming the through hole is performed before the step of assembling the first component part and the second component part together.

[0123] 42. The method according to claim 17, wherein the trading card has a first area defined by a first length and a first width, and the method includes assembling the plurality of layers defining the trading card into a composite including a plurality of sheets, each sheet defining one of the plurality of layers and having a second area greater than twice the first area, wherein the method further includes cutting the trading card and one or more other trading cards from the composite.

[0124] 43. The method according to claim 42, further including personalizing the trading card after cutting each card from the composite.

[0125] 44. The method according to claim 17, wherein the steps of providing the filler and attaching the first part of the trading card to the second part of the trading card include the following sub-steps:

[0126] Applying a first resin in the opening of the trading card and above the embedded electronic device;

[0127] Curing the first resin;

[0128] Applying a first component part of a second resin to the first part of the trading card to contact the first face and the embedded electronic device;

[0129] Applying a second component part of the second resin to contact the second part of the trading card;

[0130] Assembling the first component part and the second component part together, wherein the first component part of the second resin contacts the second component part of the second resin; and

[0131] Curing the second resin.

[0132] 45. A trading card, comprising:

[0133] A non-plastic core having a first face and a second face, a core thickness between the first face and the second face, and an opening;

[0134] An embedded electronic device disposed in the opening; and

[0135] One or more layers disposed above the non-plastic core and the embedded electronic device.

[0136] 46. The transaction card according to 45 further includes a dual interface (DI) chip mounted or embedded in the non-plastic core.

[0137] 47. The transaction card according to 45, wherein one of the plurality of layers comprises a layer of glass or fiber-reinforced epoxy laminate material.

[0138] 48. The transaction card according to 45, wherein the non-plastic core comprises metal.

[0139] 49. The transaction card according to 45 further includes an adhesive mounted between the core layer and the one or more layers.

[0140] 50. The transaction card according to 49, wherein the adhesive is a lamination adhesive.

[0141] 51. The transaction card according to 45 further includes a magnetic stripe mounted on or embedded within one of the one or more layers.

[0142] 52. The transaction card according to 45, wherein one or more layers are mounted to the first face of the non-plastic core and one or more layers are mounted to the second face of the non-plastic core.

[0143] 53. The transaction card according to 45, wherein the embedded electronic device includes a display or indicator and the one or more layers are transparent such that the display or indicator is visible from the exterior of the transaction card.

[0144] 54. A method for manufacturing a transaction card defined by a plurality of layers, the method comprising the steps of:

[0145] forming an opening in a non-plastic core layer having a first face, a second face, and a core thickness between the first and second faces in the core;

[0146] at least partially disposing an embedded electronic device in the opening; and

[0147] disposing one or more layers over the non-plastic core layer and the embedded electronic device.

[0148] 55. The method according to 54 further includes the step of mounting a dual interface (DI) chip to the non-plastic core.

[0149] 56. The method according to 54, wherein the step of disposing one or more layers over the non-plastic core layer includes disposing one or more layers on each face of the non-plastic core layer.

[0150] 57. The method according to 54 further includes the step of thermally laminating one of the one or more layers to the first side of the transaction card using heat, pressure, or both heat and pressure.

[0151] 58. The method according to 57, wherein the step of disposing the embedded electronic device in the opening of the non - plastic core layer is performed after the laminating step.

[0152] 59. The method according to 58 further includes the step of cold - laminating one of the one or more layers to the second side of the transaction card, wherein the cold - laminating step is performed after the step of disposing the embedded electronic device in the opening of the non - plastic core layer.

[0153] 60. The method according to 59, wherein the cold - laminating step includes vacuum, adhesive, or both vacuum and adhesive.

[0154] 61. The method according to 54, wherein the embedded electronic device includes a display or an indicator, and the one or more layers are transparent such that the display or the indicator is visible from the outside of the transaction card.

[0155] 62. A transaction card, comprising:

[0156] A non - plastic core having a first side and a second side, a core thickness between the first side and the second side, and an opening;

[0157] A printed circuit board having an antenna substantially aligned with the opening in the non - plastic core; and

[0158] An insert disposed in the opening and above the antenna.

[0159] 63. The transaction card according to 62, wherein the insert is made of plastic.

[0160] 64. The transaction card according to 62, wherein the non - plastic core is made of polymer, metal, or ceramic.

[0161] 65. The transaction card according to 62 further includes additional components on the printed circuit board and additional openings in the non - plastic core, wherein the additional components are respectively located in the additional openings or respectively aligned with the additional openings.

[0162] 66. The transaction card according to 62, wherein the maximum external longitudinal dimension and the maximum external transverse dimension of the non - plastic core and the printed circuit board are substantially equal.

Claims

1. A method for manufacturing a transaction card defined by multiple layers, the method comprising the steps of: providing a first portion of the transaction card, the first portion including a non-plastic layer having a first face and a second face and a thickness between the first face and the second face; forming an opening in the non-plastic layer, the opening being defined as passing through the first face; disposing an embedded electronic device in the opening; providing a second portion of the transaction card; providing a filler disposed in a portion of the opening not occupied by the embedded electronic device and attaching the first portion of the transaction card to the second portion of the transaction card; wherein the step of providing the filler and attaching the first portion of the transaction card to the second portion of the transaction card includes the following sub-steps: providing a transfer tape including a carrier-free adhesive disposed between a first release layer and a second release layer; removing the first release layer and attaching the adhesive to (i) the second portion of the transaction card and (ii) one of the first face and the embedded electronic device; removing the second release layer and attaching the adhesive to (i) the second portion of the transaction card and (ii) the other of the first face and the embedded electronic device.

2. The method according to claim 1, further comprising adhering the embedded electronic device in the opening before disposing the filler in the opening.

3. The method according to claim 1, wherein, the non-plastic layer includes a coating on the second face, and the method further comprises applying a printed mark to the coating.

4. The method according to claim 1, wherein, the second portion includes multiple layers.

5. The method according to claim 4, wherein, the multiple layers include a polymer layer, a magnetic stripe, and a laser-responsive layer.

6. The method according to claim 1, further comprising forming a mark on the second portion.

7. The method according to claim 6, wherein, the step of forming the mark includes printing the mark.

8. The method according to claim 7, wherein, the second portion includes a transparent polymer layer, and the step of forming the mark includes printing the mark on the transparent polymer layer.

9. The method according to claim 6, wherein, the second portion includes a laser-responsive layer, and the step of forming the mark includes exposing the laser-responsive layer to a laser.

10. The method according to claim 1, wherein, the non-plastic layer includes metal, and the method further comprises providing a coating above the surface of the metal such that printing can be performed on the coated metal surface.

11. The method according to claim 1, wherein, the non-plastic layer includes ceramic.

12. The method according to claim 1, wherein, The trading card has a first region defined by a first length and a first width, and the method includes assembling the plurality of layers defining the trading card into a composite including a plurality of sheets, each sheet defining one of the plurality of layers and having a second region that is more than two times larger than the first region, wherein the method further includes cutting the trading card and one or more other trading cards from the composite.

13. The method according to claim 12, further comprising personalizing the trading card after cutting each card from the composite.

14. The method according to claim 1, further comprising forming a groove extending from the opening and having a groove bottom with a depth less than the thickness.

15. The method according to claim 1 wherein the embedded electronic device includes at least a printed circuit board and a battery.

16. A method for manufacturing a trading card defined by a plurality of layers, the method comprising the steps of: providing a first portion of the trading card, the first portion including a non-plastic layer having a first face and a second face and a thickness between the first face and the second face; forming an opening in the non-plastic layer, the opening being defined as passing through the first face; disposing an embedded electronic device in the opening; providing a second portion of the trading card; providing a filler disposed in a portion of the opening not occupied by the embedded electronic device and attaching the first portion of the trading card to the second portion of the trading card; and wherein the step of providing the filler and attaching the first portion of the trading card to the second portion of the trading card includes the following sub-steps: laminating the first portion to the second portion at a temperature above room temperature in a lamination process, wherein the filler includes a portion of a flowable polymer layer disposed in the second portion, and wherein the flowable polymer layer is flowable at the lamination temperature.

17. The method according to claim 16, further comprising adhering the embedded electronic device in the opening before disposing the filler in the opening.

18. The method according to claim 16 wherein the non-plastic layer includes a coating on the second face, and the method further comprises applying a printed mark to the coating.

19. The method according to claim 16 wherein the second portion includes a plurality of layers.

20. The method according to claim 19 wherein the plurality of layers includes a polymer layer, a magnetic stripe, and a laser-responsive layer.

21. The method according to claim 16, further comprising forming a mark on the second portion.

22. The method according to claim 21 wherein the step of forming the mark includes printing the mark.

23. The method according to claim 22 wherein the plurality of layers of the second portion includes a transparent polymer layer, and the step of forming the mark includes printing the mark on the transparent polymer layer.

24. The method according to claim 21 wherein The second part includes a laser-responsive layer, and the step of forming the mark includes exposing the laser-responsive layer to a laser.

25. The method according to claim 16, wherein, the non-plastic layer includes a metal, and the method further includes providing a coating over the surface of the metal such that printing can be performed on the coated metal surface.

26. The method according to claim 16, wherein, the non-plastic layer includes a ceramic.

27. The method according to claim 16, wherein, the trading card has a first area defined by a first length and a first width, and the method includes assembling the plurality of layers defining the trading card into a composite including a plurality of sheets, each sheet defining one of the plurality of layers and having a second area that is more than two times larger than the first area, wherein the method further includes cutting the trading card and one or more other trading cards from the composite.

28. The method according to claim 16, further including personalizing the trading card after cutting each card from the composite.

29. The method according to claim 16, further including forming a groove extending from the opening and having a bottom of the groove with a depth less than the thickness.

30. The method according to claim 16, wherein, the embedded electronic device includes at least a printed circuit board and a battery.

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