Cleaning tablet demand assessment method, device, equipment and storage medium

Abstract

The present invention relates to the field of semiconductor technology, and in particular to a method, device, equipment and storage medium for evaluating cleaning sheet requirements. The method includes: obtaining material information of a production task and configuration information of a processing chamber to generate a first pre-allocation scheme for confirming the required cleaning sheet information, and judging whether the obtained cleaning sheet supply information can meet the required cleaning sheet information; if not, checking the status of the production task; if the production task is in progress, adjusting the configuration information of the processing chamber to generate a second pre-allocation scheme; replacing the first pre-allocation scheme with the second pre-allocation scheme, and returning to execute the confirmation of the required cleaning sheet information based on the generated first pre-allocation scheme; the method disclosed in the present application adjusts the pre-allocation scheme by evaluating the supply cleaning sheet information and the required cleaning sheet information, thereby avoiding the invalid time consumption caused by the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a cleaning sheet demand assessment method, device, equipment and storage medium. Background Art

[0002] As the key support for the development of the semiconductor industry, the importance of semiconductor integrated equipment is self-evident. With the continuous advancement of semiconductor wafer manufacturing technology, the process complexity and control precision requirements of integrated equipment in the wafer processing process are also increasing to achieve higher production yields.

[0003] In the current production and processing flow of semiconductor integrated devices, to ensure wafer quality, cleaning sheets (dummy) are usually introduced at specific times to maintain and clean the processing chamber. The use of cleaning sheets is subject to the dual constraints of the processing chamber configuration and the path recipe configuration of the wafers to be processed. The timing of their insertion can be before or after the processing of the wafers to be processed, or after a certain number of wafers has been processed. Therefore, in the scenario of mixed processing of multiple wafer varieties, the use of cleaning sheets poses a major challenge to wafer scheduling. During scheduling, not only the order of wafer output and processing of the wafers to be processed and the cleaning sheets must be planned, but also the connection between the two in the processing chamber must be considered. Otherwise, the scheduling algorithm may become deadlocked, or the processing chamber may become idle and wait, thereby affecting the utilization efficiency of semiconductor integrated devices.

[0004] In existing scheduling algorithms for wafers with cleaning sheets, the usual practice is to trigger the type and quantity of cleaning sheets required before and after the wafer to be processed enters the processing chamber, and lock this information. Subsequently, the scheduling time will be backtracked to the appropriate moment, that is, some of the currently planned actions will be deleted to ensure that the triggered cleaning sheets can be discharged in time and enter the processing chamber for cleaning. Cleaning sheets can be recycled to provide cleaning services for different processing chambers, but their number of uses must not exceed a preset maximum limit. Once all cleaning sheets have reached their maximum limit, there will be no cleaning sheets available. If the task still requires cleaning sheets but cannot obtain them at this time, all previously planned action lists for the task must be deleted, the task cannot be discharged for processing, and an error message indicating that there is a lack of cleaning sheets will be fed back, requiring replacement of cleaning sheets.

[0005] The main problem faced by existing scheduling technology is that in the case of a lack of cleaning sheets, a large amount of computing time is required to determine the tasks that cannot produce sheets due to a lack of cleaning sheets. These tasks do not lack cleaning sheets in the early stage, but in the later stage, the lack of cleaning sheets causes all the action sequences calculated in the early stage to be deleted, thereby increasing the response time of the scheduling algorithm and reducing the equipment production capacity; in addition, for those tasks that lack cleaning sheets in the later stage and need to be recalculated, if the demand for cleaning sheets can be met by reducing the number of processing chambers to continue production, the current scheduling technology cannot effectively cope with it. The main reason is the lack of evaluation of whether the cleaning sheets can meet the cleaning sheet requirements of all tasks in each processing chamber.

[0006] It can be seen that the existing technology still needs to be improved and enhanced. Summary of the Invention

[0007] In order to overcome the shortcomings of the existing technology, the purpose of the present invention is to provide a cleaning sheet demand assessment method. By evaluating the supply and demand cleaning sheet information, the pre-allocation plan is adjusted, thereby avoiding the ineffective time consumption caused by the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process.

[0008] A first aspect of the present invention provides a method for evaluating cleaning sheet demand, comprising: obtaining material information of a production task and configuration information of a processing chamber, and generating a first pre-allocation plan based on the material information and the configuration information; confirming the required cleaning sheet information based on the generated first pre-allocation plan, wherein the required cleaning sheet information includes the type of required cleaning sheet and the quantity corresponding to the type; obtaining cleaning sheet supply information, and determining whether the cleaning sheet supply information can meet the required cleaning sheet information; if it cannot be met, determining whether the production task is in progress; if the production task is in progress, adjusting the configuration information of the processing chamber, and generating a second pre-allocation plan based on the material information and the adjusted configuration information; replacing the first pre-allocation plan with the second pre-allocation plan, and returning to execute the confirmation of the required cleaning sheet information based on the generated first pre-allocation plan.

[0009] Optionally, in a first implementation method of the first aspect of the present invention, the material information of the production task and the configuration information of the processing chamber are obtained, and a first pre-allocation scheme is generated based on the material information and the configuration information, including: obtaining the material information of the production task and the configuration information of the processing chamber, the material information including the number of production sub-tasks and the path formula corresponding to the production sub-tasks and the number of wafers to be processed; the configuration information including the number of processing chambers and the path formula corresponding to the processing chambers, the initial processing cumulative value and the cumulative processing limit value; confirming the upper limit value of the number of first-type cleaning groups according to the number of wafers to be processed, the initial processing cumulative value and the cumulative processing limit value; confirming the upper limit value of the number of second-type cleaning groups according to the number of wafers to be processed and the number of processing chambers; generating a first pre-allocation scheme according to the material information and the configuration information, the number of cleaning groups of the generated first pre-allocation scheme simultaneously meeting the upper limit value of the number of first-type cleaning groups and the upper limit value of the number of second-type cleaning groups.

[0010] Optionally, in a second implementation of the first aspect of the present invention, the first pre-allocation scheme is generated based on the material information and the configuration information, and the number of cleaning groups of the generated first pre-allocation scheme simultaneously meets the upper limit of the number of first-type cleaning groups and the upper limit of the number of second-type cleaning groups, including: generating a first allocation scheme based on the upper limit of the number of first-type cleaning groups and the number of processing chambers; calculating the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation scheme; generating a second allocation scheme based on the initial processing cumulative value, the upper limit of the number of first-type cleaning groups and the remaining number of wafers to be processed; judging whether the sum of the number of cleaning groups of the first allocation scheme and the number of cleaning groups of the second allocation scheme meets the upper limit of the number of second-type cleaning groups; if so, integrating the first allocation scheme and the second allocation scheme to obtain the first pre-allocation scheme; if not, generating a third allocation scheme based on the number of processing chambers and the upper limit of the number of second-type cleaning groups, and integrating the first allocation scheme, the second allocation scheme and the third allocation scheme to obtain the first pre-allocation scheme.

[0011] Optionally, in a third implementation of the first aspect of the present invention, the required cleaning sheet information is confirmed based on the generated first pre-allocation scheme, and the required cleaning sheet information includes the type of required cleaning sheet and the quantity corresponding to the type, including: obtaining a preset processing chamber cleaning rule; confirming the required cleaning sheet information based on the preset processing chamber cleaning rule and the generated first pre-allocation scheme, and the required cleaning sheet information includes the type of required cleaning sheet and the quantity corresponding to the type.

[0012] Optionally, in a fourth implementation of the first aspect of the present invention, the cleaning sheet supply information is obtained, and it is determined whether the cleaning sheet supply information can meet the required cleaning sheet information, and then the production task is executed based on the generated first pre-allocation plan if the cleaning sheet supply information can meet the required cleaning sheet information; when the production task is completed, the cleaning sheet supply information is updated based on the required cleaning sheet information.

[0013] Optionally, in the fifth implementation method of the first aspect of the present invention, if the requirement cannot be met, it is determined whether the production task is in progress, and then it includes: if the production task is not in progress, stopping the execution of the production task and outputting the material information corresponding to the production task.

[0014] Optionally, in a sixth implementation of the first aspect of the present invention, if a production task is in progress, the configuration information of the processing chamber is adjusted, and a second pre-allocation plan is generated based on the material information and the adjusted configuration information, including: if a production task is in progress, the number of processing chambers is reduced to adjust the configuration information of the processing chambers; the upper limit value of the number of first-type cleaning groups is confirmed according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; the upper limit value of the number of second-type cleaning groups is confirmed according to the number of wafers to be processed and the adjusted number of processing chambers; and a second pre-allocation plan is generated according to the material information and the configuration information, and the number of cleaning groups of the generated second pre-allocation plan simultaneously meets the upper limit value of the number of first-type cleaning groups and the upper limit value of the number of second-type cleaning groups.

[0015] According to a second aspect of the present invention, there is provided a cleaning sheet demand assessment device, comprising: a first generation module for acquiring material information of a production task and configuration information of a processing chamber, and generating a first pre-allocation scheme based on the material information and configuration information; a confirmation module for confirming the required cleaning sheet information based on the generated first pre-allocation scheme, wherein the required cleaning sheet information includes the type of required cleaning sheet and the quantity corresponding to the type; a first judgment module for acquiring cleaning sheet supply information and judging whether the cleaning sheet supply information can meet the required cleaning sheet information; a second judgment module for judging whether the production task is in progress if the information cannot be met; a second generation module for adjusting the configuration information of the processing chamber if the production task is in progress, and generating a second pre-allocation scheme based on the material information and the adjusted configuration information; an iteration module for replacing the first pre-allocation scheme with the second pre-allocation scheme, and returning to execute the confirmation of the required cleaning sheet information based on the generated first pre-allocation scheme.

[0016] A third aspect of the present invention provides a cleaning sheet demand assessment device, which includes: a memory and at least one processor, wherein the memory stores instructions; at least one processor calls the instructions in the memory to enable the cleaning sheet demand assessment device to perform each step of the cleaning sheet demand assessment method described above.

[0017] A fourth aspect of the present invention provides a computer-readable storage medium having instructions stored thereon, wherein the instructions, when executed by a processor, implement the steps of any of the above-mentioned cleaning sheet demand assessment methods.

[0018] In the technical solution of the present invention, the pre-allocation plan is adjusted by evaluating the supply and demand cleaning sheet information, thereby avoiding the ineffective time consumption caused by the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process; the technical solution of the present invention evaluates the cleaning sheet demand before the wafer scheduling algorithm is planned, which not only ensures that the function of the wafer scheduling algorithm is not affected, but also ensures the stability of production capacity; in addition, the technical solution of the present invention has the characteristics of rapid evaluation and can complete the evaluation of the cleaning sheet missing task in a very short time (only 2 milliseconds). BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of a semiconductor assembly device to which the cleaning sheet demand assessment method provided by an embodiment of the present invention is applicable;

[0020] Figure 2 A first flow chart of a cleaning sheet demand assessment method according to an embodiment of the present invention;

[0021] Figure 3 A second flow chart of the cleaning sheet demand assessment method provided by an embodiment of the present invention;

[0022] Figure 4 A schematic structural diagram of a cleaning sheet demand assessment device provided by an embodiment of the present invention;

[0023] Figure 5 This is a schematic structural diagram of a cleaning sheet demand assessment device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The present invention provides a method, apparatus, device, and storage medium for assessing the need for cleaning sheets. In the present invention, the terms "first," "second," "third," "fourth," and so on (if any) in the description and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or apparatuses.

[0025] For ease of understanding, the following describes a semiconductor assembly device to which the present invention is applicable. Figure 1, the semiconductor combination equipment consists of three main areas: the atmospheric end area, the vacuum lock area and the vacuum end area; the atmospheric end area consists of a wafer loader (LP), a buffer module (Buffer), a wafer pre-alignment device (Aligner), an atmospheric end robot (ATR), a cooling module (Cooler) and a cleaning film container (DummyPort); the vacuum end area includes a vacuum lock transfer module (LL), and the vacuum end area consists of a processing chamber (Ch) and a vacuum end robot (VTR); the wafer loader serves as the entrance and exit of the equipment, allowing the material to enter in full boxes, and after each piece is processed according to the recipe path, the whole box leaves. In this embodiment, the semiconductor combination equipment is equipped with 4 wafer loaders, marked as LP1 to LP4, and the capacity of each wafer loader is 25 pieces; the buffer module is set to prevent processed and unprocessed wafers from existing in the same wafer loader at the same time. This embodiment includes 4 buffer modules, marked as Buffer1 to Buffer4, each buffer The module also has a capacity of 25 wafers. The wafer pre-alignment equipment is responsible for calibrating the position of wafers to prevent damage or dropping during processing. The atmospheric end robot is responsible for transporting wafers between the wafer loader and unloader, the wafer pre-alignment equipment, the buffer module, the vacuum lock transfer module, the cooling module, and the cleaning sheet container. The cooling module is used to cool processed wafers. The cleaning sheet container is used to store cleaning sheets and has a capacity of 25 sheets. The vacuum lock transfer module is responsible for performing vacuum pumping and filling operations. The vacuum pumping operation transfers unprocessed wafers from the atmospheric end to the vacuum end, and the filling operation transfers processed wafers from the vacuum end back to the atmospheric end. In this embodiment, the semiconductor assembly equipment includes four vacuum lock transfer modules, labeled LA, LB, LC, and LD. The processing chamber is used for wafer processing, and the cleaning sheet cleaning work is also performed on the processing chamber. This embodiment includes six processing chambers, labeled Ch1 to Ch6. The vacuum end robot is responsible for transporting wafers between the processing chambers and between the processing chambers and the vacuum lock transfer module.

[0026] The processing flow of the semiconductor assembly equipment disclosed in this embodiment is as follows: the atmospheric end robot is responsible for transporting the wafer to be processed from the wafer loader and unloader to the wafer pre-alignment equipment for calibration, and then transporting it to the vacuum lock transfer module; after the vacuum lock transfer module receives the wafer in the atmosphere, it performs a vacuum operation. After the vacuum operation is completed, the vacuum end robot takes out the unprocessed wafer from the vacuum lock transfer module and places it into the processing chamber for processing; if the wafer path recipe specifies that the processing chamber needs to be cleaned before processing, it must be cleaned with a cleaning sheet before the wafer can enter the processing chamber; after the wafer is processed according to the recipe path, the vacuum end robot The robot takes it out of the processing chamber and puts it back into the vacuum lock transfer module. If the wafer is the last wafer of the task, or the processing chamber has accumulated a fixed number of processes, and post-wafer cleaning is configured in the path recipe, the wafer needs to be cleaned with a cleaning sheet after leaving the processing chamber; after the vacuum lock transfer module receives the wafer, it performs ventilation operation; finally, the atmospheric end robot puts the processed wafer into the cooling module for cooling, and finally puts it into the wafer loader and unloader. If there are unprocessed wafers for this task in the wafer loader and unloader, the wafer must first be placed in the buffer module for cache, and then transferred to the wafer loading and unloading when there are no unprocessed wafers in the wafer loader and unloader.

[0027] Further, for ease of understanding, the specific process of the embodiment of the present invention is described below. Figure 2 , an embodiment of a cleaning sheet demand assessment method according to an embodiment of the present invention includes:

[0028] 101. Obtain material information of a production task and configuration information of a processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information;

[0029] 102. Confirming required cleaning tablet information based on the generated first pre-allocation plan, the required cleaning tablet information including the type of required cleaning tablet and the quantity corresponding to the type;

[0030] 103. Obtain cleaning sheet supply information and determine whether the cleaning sheet supply information can meet the required cleaning sheet information;

[0031] In this embodiment, the cleaning sheet supply information includes the types of cleaning sheets supplied and the quantities corresponding to the types. If the types of cleaning sheets supplied cover all types of cleaning sheets required, and the quantity of each type of cleaning sheets supplied is not less than the corresponding quantity of cleaning sheets required, then the cleaning sheet supply information satisfies the required cleaning sheet information. On the contrary, if any type of cleaning sheet required is missing from the types of cleaning sheets supplied, or the quantity of any type of cleaning sheets supplied is less than the corresponding quantity of cleaning sheets required, then the cleaning sheet supply information does not satisfy the required cleaning sheet information.

[0032] 104. If it cannot be met, determine whether the production task is in progress;

[0033] In this embodiment, it is determined whether the cleaning sheet supply information can meet the required cleaning sheet information. If not, it is further determined whether the production task is in progress. This step improves the flexibility and adaptability of the first pre-allocation plan, ensuring that in the case of insufficient cleaning sheets, the first pre-allocation plan can be adjusted in time to avoid interruption of the wafer scheduling plan.

[0034] 105. If the production task is in progress, adjust the configuration information of the processing chamber, and generate a second pre-allocation plan based on the material information and the adjusted configuration information;

[0035] In this embodiment, if the production task is not being carried out, the production task is stopped and the material information corresponding to the production task is output.

[0036] 106. Replace the first pre-allocation plan with the second pre-allocation plan, and return to confirm the required cleaning sheet information based on the generated first pre-allocation plan;

[0037] In this embodiment, if a production task is in progress and the supply of cleaning sheets is insufficient, the configuration information of the processing chamber is automatically adjusted, and a second pre-allocation plan is generated based on the material information and the adjusted configuration information; this step not only improves the accuracy of the production plan, but also ensures that the production task can proceed smoothly, thereby improving production efficiency and product quality; at the same time, the second pre-allocation plan is used to replace the first pre-allocation plan, and the relevant steps are returned to execute, thereby realizing the automation and intelligence of the pre-allocation plan generation.

[0038] The present application discloses a method for evaluating the demand for cleaning sheets. By evaluating the information on supplied and required cleaning sheets, the pre-allocation plan is adjusted, thereby avoiding the ineffective time consumption caused by the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process. The technical solution of the present invention evaluates the demand for cleaning sheets before the wafer scheduling algorithm is planned, which not only ensures that the function of the wafer scheduling algorithm is not affected, but also ensures the stability of production capacity. In addition, the technical solution of the present invention has the characteristics of rapid evaluation and can complete the evaluation of the task of missing cleaning sheets in a very short time (only 2 milliseconds).

[0039] Furthermore, a second embodiment of the cleaning sheet demand assessment method according to the embodiment of the present invention includes:

[0040] 201. Obtain material information of the production task and configuration information of the processing chamber. The material information includes the number of production subtasks, the corresponding route recipes for the production subtasks, and the number of wafers to be processed. The configuration information includes the number of processing chambers, the corresponding route recipes, the initial processing cumulative value, and the cumulative processing limit value.

[0041] In this embodiment, the path recipes of all wafers to be processed within the production subtask must be consistent with the path recipe of the processing chamber to avoid conflicts between the production subtask and the configuration of the processing chamber during execution.

[0042] 202. Determine the upper limit of the number of first-type cleaning groups based on the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value;

[0043] 203. Determine an upper limit of the number of second type cleaning groups according to the number of wafers to be processed and the number of processing chambers;

[0044] In this embodiment, according to the preset processing chamber cleaning rules, it can be clearly seen that Predryclean, Dummy cleaning and Postdryclean only need to be executed before and after the production subtask enters the processing chamber; therefore, once the cleaning requirements are specified in the wafer path recipe of the production subtask, the more processing chambers are involved when the production subtask is started, the more Predryclean, Dummy cleaning and Postdryclean cleaning groups are required, which in turn leads to an increase in the number of cleaning sheets required; through analysis, it is concluded that if a production subtask containing w_num wafers needs to pass through ch_num processing chambers in parallel, the upper limit of the number of Predryclean, Dummy cleaning and Postdryclean cleaning groups is min(w_num, ch_num), that is, the maximum value of the total number of cleaning groups depends on the smaller value of w_num and ch_num.

[0045] Next, ILC cleaning and ILCDummy cleaning are related to the cumulative processing limit value (ilc_limit) in the production subtask wafer path recipe; when the number of production subtask processes accumulated in the processing chamber reaches ilc_limit, a group of ILC and ILCDummy cleaning will be generated; therefore, during the pre-allocation plan generation process, if the number of wafers in the production subtask is fixed, the number of ILC and ILCDummy cleaning should be increased as much as possible; analysis shows that in a production subtask containing w_num wafers, if the initial cumulative value (ilc_init) of the processing chamber is 0, the upper limit of the number of ILC and ILCDummy cleaning groups that can be generated is int(w_num / ilc _limit), that is, if the ilc_init value is not 0, the upper limit will be greater than int(w_num / ilc_limit), resulting in additional ILC and ILCDummy cleaning; the specific number depends on the ilc_init value and the remaining number of wafers w_num-int(w_num / ilc_limit)*ilc_limit; where int represents a rounding function used to convert the division result to an integer; that is, when ilc_init is 0, the maximum number of ILC and ILCDummy cleaning groups that can be generated is the result of rounding down the number of wafers to be processed (w_num) divided by the cumulative processing limit value of each group (ilc_limit).

[0046] Finally, the OLC cleaning and OLCDummy cleaning configuration information is performed in the processing chamber, which occurs when the used processing chamber is cleaned after the production task is completed; when the cumulative number of processes olc_count accumulates to the olc_limit value, a set of OLC cleaning and OLCDummy cleaning will be generated; therefore, when calculating the maximum number of OLC and OLCDummy cleaning groups, if the sum of the olc_count of the processing chamber and the maximum number of wafers that the processing chamber can process in the production task exceeds olc_limit, a set of OLC and OLCDummy cleaning operations for the processing chamber needs to be calculated, that is, the upper limit of the total number of cleaning groups is still min(w_num, ch_num).

[0047] Based on the analysis of the upper limit of each cleaning group number, the seven cleaning types with cleaning sheets covered by the preset process chamber cleaning rules are divided into two categories: the first category is ILC type cleaning, including ILC cleaning and ILC Dummy cleaning, and the upper limit of the number of cleaning groups of the first type is ILC_max=int(w_num / ilc_limit); the second category is non-ILC (NILC) type cleaning, including Predryclean, Dummy cleaning, Postdryclean, OLC cleaning and OLCDummy cleaning, and the upper limit of the number of cleaning groups of the second type is NILC_max=min(w_num, ch_num).

[0048] 204. Generate a first pre-allocation plan based on the material information and the configuration information, wherein the number of cleaning groups in the generated first pre-allocation plan satisfies both an upper limit of the number of first-type cleaning groups and an upper limit of the number of second-type cleaning groups.

[0049] See also Figure 3 A third embodiment of the cleaning sheet demand assessment method according to the present invention includes:

[0050] 301. Generate a first allocation plan based on an upper limit of the number of first-type cleaning groups and the number of processing chambers;

[0051] 302. Calculate the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation plan;

[0052] 303. Generate a second allocation plan based on the initial processing cumulative value, the upper limit of the number of first-type cleaning groups, and the number of remaining wafers to be processed;

[0053] 304. Determine whether the sum of the number of cleaning groups in the first allocation scheme and the number of cleaning groups in the second allocation scheme meets the upper limit of the number of second-type cleaning groups;

[0054] 305. If satisfied, the first allocation plan and the second allocation plan are integrated to obtain a first pre-allocation plan;

[0055] 306. If the conditions are not met, generate a third allocation plan based on the number of processing chambers and the upper limit of the number of second-type cleaning groups, and integrate the first allocation plan, the second allocation plan, and the third allocation plan to obtain a first preliminary allocation plan;

[0056] In this embodiment, the production subtasks included in the production task will be sorted according to priority and allocated in sequence. First, the maximum number of ILC cleaning groups ILC_max and the maximum number of non-ILC cleaning groups NILC_max that can be generated by each processing chamber when the initial ilc_init is 0 are calculated, and the current accumulated number of processes ilc_count and olc_count of each processing chamber are recorded. Then three rounds of allocation are performed: the first round is allocated to each processing chamber one by one in units of ilc_limit. The purpose is to ensure that the maximum number of ILC_max groups of ILC cleaning are generated while generating as many NILC cleaning groups as possible to achieve NILC_max. The second round sorts the parallel processing chambers from large to small according to the ilc_count value, and then allocates the remaining wafers to be processed (less than ilc_limit) to the processing chambers one by one. When ilc_count reaches ilc_limit, When , an additional set of ILC cleaning and ILCDummy cleaning will be generated, and the next processing chamber will be allocated at this time, and so on, until all wafers to be processed are allocated; the third round of allocation first checks whether the number of cleaning groups of NILC has reached its maximum value NILC_max after all wafers to be processed are allocated. If not, the wafers to be processed are artificially increased to the unopened processing chamber until NILC_max is reached; after each production subtask is allocated, the ilc_count and olc_count of each processing chamber are updated according to the number of wafers to be processed allocated to the processing chamber, which serves as the initial processing cumulative value when the wafers to be processed are allocated to the next production task or production subtask; since the above allocation process aims to maximize the two major types of cleaning, the number of cleaning sheet groups obtained by the generated first pre-allocation plan theoretically ensures that the number of cleaning sheets required for the actual planning of the algorithm will not exceed this value, that is, the evaluated number of cleaning sheets is the upper limit value actually required.

[0057] For example:

[0058] (1) Assume w_num = 20, ch_num = 6, ilc_limit = 3, ilc_count of Ch2 = 1, and ilc_count of the remaining processing chambers = 0. First, calculate ILC_max = int(w_num / ilc_limit) = 6, NILC_max = min(w_num, ch_num) = 6. Allocate according to the above-mentioned process. In the first round of allocation, each processing chamber is allocated 3 wafers to be processed. Sort the processing chambers in descending order of ilc_count. In the second round, the remaining 2 wafers to be processed are preferentially allocated to Ch2. The number of processed times in Ch2 and the remaining 2 wafers to be processed can generate a group of ILC-type cleaning. Therefore, 7 groups of ILC-type cleaning can be achieved, that is, ILC_max + 1 = 7 groups, and the NILC-type cleaning reaches the maximum value of 6 groups. The generated first pre-allocation plan meets the requirements.

[0059] (2) Assume w_num = 10, ch_num = 6, ilc_limit = 3, and ilc_init of each processing chamber = 0. First, calculate ILC_max = int(w_num / ilc_limit) = 3, NILC_max = min(w_num, ch_num) = 6. Allocate according to the above-mentioned process. In the first round, Ch1 / Ch2 / Ch3 are each allocated 3 wafers to be processed. In the second round, the remaining 1 wafer to be processed is allocated to Ch4 to open as many processing chambers as possible. Since ch_num < w_num, NILC_max is not reached after all wafers to be processed are allocated. Therefore, in the third round, 2 virtual wafers to be processed are added to Ch5 / Ch6 to make the generated first pre-allocation plan meet the requirements.

[0060] Further, the fourth embodiment of the cleaning sheet demand evaluation method in the embodiments of the present invention includes:

[0061] 401. Obtain the preset cleaning rules for the processing chamber;

[0062] In this embodiment, the preset cleaning rules for the processing chamber are: cleaning work needs to be carried out before, during, and after the execution of the production subtask and after the production task is completed. Specifically:

[0063] The cleaning before the start of the production subtask should be completed before entering the first wafer in each processing chamber for processing. The cleaning types at this stage include Predryclean, and it is optional to use or not use 1 clean / mix type cleaning sheet, as well as Dummy cleaning. Dummy cleaning is carried out after Predryclean and requires 1 to multiple dummy / mix type cleaning sheets, and the specific quantity is determined by the path recipe;

[0064] During the production subtask, the cleaning is triggered when the cumulative processing value of the processing chamber reaches the preset limit. The cleaning types at this time include ILC cleaning, which can also be selected to use no or one clean / mix type cleaning tablet, and ILC dummy cleaning. The latter is performed after ILC cleaning and requires one or more dummy / mix type cleaning tablets. The specific number is determined by the route recipe.

[0065] The post-production cleaning should be performed after the last wafer is processed. The cleaning type is Postdryclean. You can choose not to use or use one clean / mix type dummy sheet.

[0066] Finally, the cleaning trigger condition after the completion of the production task is that after the production task is completed, if the cumulative processing number of the processing chamber reaches olc_limit, cleaning is required. The cleaning types in this stage include OLC cleaning, which can be selected as not using or using 1 clean / mix type dummy tablet, and OLC Dummy cleaning. OLC Dummy cleaning is performed after OLC cleaning and requires 1 to multiple dummy / mix type cleaning tablets. The specific number is determined by the path recipe.

[0067] 402. Confirm required cleaning sheet information based on a preset processing chamber cleaning rule and the generated first pre-allocation plan, wherein the required cleaning sheet information includes a type of required cleaning sheet and a quantity corresponding to the type;

[0068] In this embodiment, by accurately confirming the information of the required cleaning sheets according to the preset processing chamber cleaning rules and the generated first pre-allocation plan, not only the accuracy and efficiency of the cleaning sheet allocation are improved, but also the problems of insufficient cleaning or waste of resources due to human misjudgment or improper operation are effectively avoided, thereby improving the cleaning quality of the processing chamber and the overall production efficiency.

[0069] Furthermore, a fifth embodiment of the cleaning sheet demand assessment method according to the embodiment of the present invention includes:

[0070] 501. If the cleaning sheet supply information can satisfy the required cleaning sheet information, executing the production task based on the generated first pre-allocation plan;

[0071] 502. When the production task is completed, update the cleaning sheet supply information based on the required cleaning sheet information;

[0072] In this embodiment, when the production task is successfully completed, the cleaning sheet supply information is updated in a timely manner based on the latest demand cleaning sheet information, ensuring the timeliness and accuracy of the supply cleaning sheet information, providing reliable data support for subsequent production tasks, and ensuring the dynamic balance between cleaning sheet supply and demand.

[0073] Furthermore, a sixth embodiment of the cleaning sheet demand assessment method according to the embodiment of the present invention includes:

[0074] 601. If the production task is in progress, reduce the number of processing chambers to adjust the configuration information of the processing chambers;

[0075] In this embodiment, when the second pre-allocation plan is generated for the first time, one processing chamber may be disabled first according to the path recipe; if the required cleaning sheet information corresponding to the second pre-allocation plan generated for the first time still cannot be satisfied by the supplied cleaning sheet information, one more processing chamber may be disabled according to the path recipe, that is, two processing chambers may be disabled, and so on.

[0076] 602. Determine the upper limit of the number of first-type cleaning groups based on the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value;

[0077] 603. Determine the upper limit of the number of second-type cleaning groups according to the number of wafers to be processed and the adjusted number of processing chambers;

[0078] 604. Generate a second pre-allocation plan based on the material information and the configuration information, wherein the number of cleaning groups in the generated second pre-allocation plan satisfies both the upper limit of the number of first-type cleaning groups and the upper limit of the number of second-type cleaning groups.

[0079] In this embodiment, the method for generating the second pre-allocation plan refers to the method for generating the first pre-allocation plan described above. When the required cleaning sheet information confirmed by the second pre-allocation plan can be satisfied by the cleaning sheet supply information, constraint conditions are generated to adjust the material information of the production task. The constraint conditions include a set of production sub-tasks that cannot be executed and information about processing chambers that are prohibited from entering.

[0080] The above describes the cleaning sheet demand assessment method according to the embodiment of the present invention. The following describes the cleaning sheet demand assessment device according to the embodiment of the present invention. Figure 4 , an embodiment of a cleaning sheet demand assessment device according to an embodiment of the present invention includes:

[0081] A first generating module 701 is configured to obtain material information of a production task and configuration information of a processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information;

[0082] A confirmation module 702 is configured to confirm required cleaning tablet information based on the generated first pre-allocation plan, wherein the required cleaning tablet information includes a type of required cleaning tablet and a quantity corresponding to the type;

[0083] The first judgment module 703 is used to obtain the cleaning sheet supply information and determine whether the cleaning sheet supply information can meet the required cleaning sheet information;

[0084] The second judgment module 704 is used to judge whether the production task is in progress if the requirement cannot be met;

[0085] The second generating module 705 is configured to adjust the configuration information of the processing chamber if the production task is in progress, and generate a second pre-allocation plan based on the material information and the adjusted configuration information;

[0086] The iterative module 706 is configured to replace the first pre-allocation scheme with the second pre-allocation scheme, and return to confirm the required cleaning sheet information based on the generated first pre-allocation scheme.

[0087] Based on the same idea as the method in the above embodiment, the device provided in this application can implement the method in the above embodiment.

[0088] above Figure 4 The cleaning sheet requirement assessment apparatus in the embodiment of the present invention is described in detail from the perspective of modular functional entities. The cleaning sheet requirement assessment device in the embodiment of the present invention is described in detail from the perspective of hardware processing.

[0089] Figure 5 Figure 8 is a schematic diagram of the structure of a cleaning sheet need assessment device provided in an embodiment of the present invention. The cleaning sheet need assessment device 800 may vary significantly depending on configuration or performance. It may include one or more central processing units (CPUs) 810 (e.g., one or more processors), memory 820, and one or more storage media 830 (e.g., one or more mass storage devices) storing application programs 833 or data 832. The memory 820 and storage medium 830 may be either transient or persistent storage. The program stored in the storage medium 830 may include one or more modules (not shown), each of which may include a series of instructions operating on the cleaning sheet need assessment device 800. Furthermore, the processor 810 may be configured to communicate with the storage medium 830, executing the series of instructions stored in the storage medium 830 on the cleaning sheet need assessment device 800 to implement the steps of the cleaning sheet need assessment method provided in the aforementioned method embodiments.

[0090] The cleaning sheet demand assessment device 800 may further include one or more power supplies 840, one or more wired or wireless network interfaces 850, one or more input and output interfaces 860, and / or one or more operating systems 831, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD, etc. It will be appreciated by those skilled in the art that Figure 5The structure of the cleaning sheet need assessment device shown does not limit the cleaning sheet need assessment device, and the cleaning sheet need assessment device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0091] The present invention also provides a computer-readable storage medium, which may be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. The computer-readable storage medium stores instructions that, when executed on a computer, cause the computer to execute the steps of the cleaning sheet demand assessment method.

[0092] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0093] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0094] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for evaluating the demand for cleaning sheets, characterized in that: include: Obtaining material information of the production task and configuration information of the processing chamber, and generating a first pre-allocation plan based on the material information and the configuration information; specifically, the material information includes the number of production subtasks, the path formula corresponding to the production subtasks, and the number of wafers to be processed; the configuration information includes the number of processing chambers, the path formula corresponding to the processing chambers, the initial processing cumulative value, and the cumulative processing limit value; determining an upper limit value of the number of first-type cleaning groups based on the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; determining an upper limit value of the number of second-type cleaning groups based on the number of wafers to be processed and the number of processing chambers; generating the first pre-allocation plan based on the material information and the configuration information, wherein the number of cleaning groups in the generated first pre-allocation plan satisfies both the upper limit value of the number of first-type cleaning groups and the upper limit value of the number of second-type cleaning groups; confirming required cleaning tablet information based on the generated first pre-allocation plan, the required cleaning tablet information including the type of required cleaning tablet and the quantity corresponding to the type; Obtaining cleaning sheet supply information, and determining whether the cleaning sheet supply information can meet the demand cleaning sheet information; If it cannot be met, it is determined whether the production task is in progress; If the production task is in progress, the configuration information of the processing chamber is adjusted, and a second pre-allocation plan is generated based on the material information and the adjusted configuration information; specifically, if the production task is in progress, the number of processing chambers is reduced to adjust the configuration information of the processing chambers; the upper limit value of the number of first-type cleaning groups is determined according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; the upper limit value of the number of second-type cleaning groups is determined according to the number of wafers to be processed and the adjusted number of processing chambers; the second pre-allocation plan is generated according to the material information and the configuration information, and the number of cleaning groups in the generated second pre-allocation plan satisfies both the upper limit value of the number of first-type cleaning groups and the upper limit value of the number of second-type cleaning groups; The second pre-allocation plan is used to replace the first pre-allocation plan, and the execution returns to confirm the required cleaning sheet information based on the generated first pre-allocation plan to ensure that the first pre-allocation plan can be adjusted in time when there are insufficient cleaning sheets to avoid interruption of the wafer scheduling plan.

2. The cleaning sheet demand assessment method according to claim 1, wherein: The generating of the first pre-allocation scheme according to the material information and the configuration information, wherein the number of cleaning groups in the generated first pre-allocation scheme satisfies both the upper limit of the number of first type cleaning groups and the upper limit of the number of second type cleaning groups, comprises: generating a first allocation plan based on an upper limit of the number of first-type cleaning groups and the number of processing chambers; Calculating the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation plan; generating a second allocation plan based on the initial processing cumulative value, the upper limit of the number of first-type cleaning groups, and the number of remaining wafers to be processed; Determining whether the sum of the number of cleaning groups in the first allocation scheme and the number of cleaning groups in the second allocation scheme meets an upper limit of the number of cleaning groups of the second type; If satisfied, the first allocation plan and the second allocation plan are integrated to obtain a first pre-allocation plan; If not, a third allocation plan is generated based on the number of processing chambers and the upper limit of the number of second-type cleaning groups, and the first allocation plan, the second allocation plan and the third allocation plan are integrated to obtain a first preliminary allocation plan.

3. The cleaning sheet demand assessment method according to claim 1, wherein: The step of confirming the required cleaning tablet information based on the generated first pre-allocation plan, wherein the required cleaning tablet information includes the type of the required cleaning tablet and the quantity corresponding to the type, includes: Obtaining preset processing chamber cleaning rules; The required cleaning sheet information is confirmed based on the preset processing chamber cleaning rule and the generated first pre-allocation plan, where the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type.

4. The cleaning sheet demand assessment method according to claim 1, wherein: The step of obtaining the cleaning sheet supply information and determining whether the cleaning sheet supply information can meet the required cleaning sheet information further includes: If the cleaning sheet supply information can satisfy the required cleaning sheet information, executing the production task based on the generated first pre-allocation plan; When the production task is completed, the cleaning sheet supply information is updated based on the required cleaning sheet information.

5. The cleaning sheet demand assessment method according to claim 1, wherein: If the above conditions cannot be met, it is determined whether the production task is in progress, and then the following are included: If the production task is not carried out, the production task will be stopped and the material information corresponding to the production task will be output.

6. A cleaning sheet demand assessment device, characterized in that: include: A first generation module is configured to obtain material information of a production task and configuration information of a processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information; specifically, the material information includes the number of production subtasks, the path formula corresponding to the production subtasks, and the number of wafers to be processed; the configuration information includes the number of processing chambers, the path formula corresponding to the processing chambers, the initial processing cumulative value, and the cumulative processing limit value; determine an upper limit value for the number of first-type cleaning groups based on the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; determine an upper limit value for the number of second-type cleaning groups based on the number of wafers to be processed and the number of processing chambers; generate the first pre-allocation plan based on the material information and the configuration information, wherein the number of cleaning groups in the generated first pre-allocation plan satisfies both the upper limit value for the number of first-type cleaning groups and the upper limit value for the number of second-type cleaning groups; a confirmation module, configured to confirm required cleaning tablet information based on the generated first pre-allocation plan, wherein the required cleaning tablet information includes a type of required cleaning tablet and a quantity corresponding to the type; A first judgment module is used to obtain the cleaning sheet supply information and judge whether the cleaning sheet supply information can meet the required cleaning sheet information; The second judgment module is used to judge whether the production task is in progress if the requirement cannot be met; The second generation module is configured to adjust the configuration information of the processing chambers if the production task is in progress, and generate a second pre-allocation plan based on the material information and the adjusted configuration information; specifically, if the production task is in progress, reduce the number of processing chambers to adjust the configuration information of the processing chambers; determine the upper limit of the number of first-type cleaning groups based on the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; determine the upper limit of the number of second-type cleaning groups based on the number of wafers to be processed and the adjusted number of processing chambers; generate the second pre-allocation plan based on the material information and the configuration information, wherein the number of cleaning groups in the generated second pre-allocation plan satisfies both the upper limit of the number of first-type cleaning groups and the upper limit of the number of second-type cleaning groups; The iterative module is used to replace the first pre-allocation plan with the second pre-allocation plan, and return to execute the required cleaning sheet information based on the generated first pre-allocation plan to ensure that when the cleaning sheets are insufficient, the first pre-allocation plan can be adjusted in time to avoid interruption of the wafer scheduling plan.

7. A cleaning sheet demand assessment device, characterized in that The cleaning sheet demand assessment device includes: a memory and at least one processor, wherein the memory stores instructions; At least one of the processors calls the instructions in the memory to enable the cleaning sheet need assessment device to perform each step of the cleaning sheet need assessment method according to any one of claims 1 to 5.

8. A computer-readable storage medium having instructions stored thereon, characterized in that: When the instructions are executed by a processor, the steps of the cleaning sheet demand assessment method according to any one of claims 1 to 5 are implemented.

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