MOS transistor packaging device and process

Abstract

The present invention relates to the technical field of transistor packaging, and discloses a MOS transistor packaging device and process, which solves the problem of inconvenience in removing packaged transistors from a transistor molding tray. The device comprises an operating table, the top of which is fixedly connected to a transistor packaging injection molding tray, a transistor packaging molding tray being provided above the transistor packaging injection molding tray, and a position adjustment structure for adjusting the position of the transistor packaging molding tray being installed on the operating table; a plurality of molding grooves adapted to the transistors are provided at the bottom of the transistor packaging molding tray, an annular groove is provided on the top inner wall of the molding groove, a sealing ring is provided in the annular groove, and an elastic supporter for supporting the sealing ring is installed on the transistor packaging molding tray; the fixing method of the transistors is changed to facilitate the packaging of multiple transistors, the handling of transistors, and practical use.

Description

Technical Field

[0001] The present invention belongs to the technical field of transistor packaging, and in particular relates to a MOS transistor packaging device and process. Background Art

[0002] MOS transistor is the abbreviation of Metal-Oxide Semiconductor Field-Effect Transistor. Transistors can be divided into metal packaging, plastic packaging, glass shell packaging, surface mount transistors and ceramic packaging transistors according to the packaging structure. When plastic packaging is performed on transistors, the transistors are generally packaged one by one.

[0003] A search of the prior art revealed that Chinese patent publication number CN110808223A discloses a high-precision transistor packaging device that places transistors one by one in a molding die. The transistors are attracted to the interior of the molding die cavity by the magnetic attraction of a magnetic ring.

[0004] But it is worth considering that after the transistor packaging is completed, the transistor molding disk and the transistor injection molding disk are separated. In order to ensure that the packaged transistor follows the transistor molding disk and separates from the transistor injection molding disk, the magnetic force of the magnetic ring on the transistor needs to be greater than the preset value. When the magnetic force is large, it is not convenient to remove the packaged transistor from the transistor molding disk, which has certain limitations.

[0005] Therefore, in order to solve the above problems, a related facility that is more in line with usage needs needs to emerge. Summary of the Invention

[0006] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a MOS transistor packaging device and process, which effectively solves the problem in the above background technology that it is inconvenient to remove the packaged transistor from the transistor forming tray.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a MOS transistor packaging device, comprising an operating table, a transistor packaging injection molding tray fixedly connected to the top of the operating table, a transistor packaging molding tray provided above the transistor packaging injection molding tray, and a position adjustment structure installed on the operating table for adjusting the position of the transistor packaging molding tray;

[0008] The bottom of the transistor package forming tray is provided with a plurality of forming grooves adapted to the transistors, the top inner wall of the forming groove is provided with an annular groove, a sealing ring is provided in the annular groove, the transistor package forming tray is installed with an elastic support for supporting the sealing ring, the transistor package forming tray is provided with an exhaust chamber connected to the plurality of forming grooves, and the connection point between the exhaust chamber and the forming groove is located at the center of the sealing ring, the transistor package forming tray is installed with an exhaust unit adapted to the exhaust chamber, and the top of the operating table is provided with a pressing mechanism for positioning the transistor into the forming groove.

[0009] Preferably, the elastic support device includes a support seat arranged above the sealing ring, and the support seat is located above the transistor packaging forming disk, the top of the sealing ring is fixedly connected with several first guide columns, and a first movable seat is provided above the support seat, the first guide columns respectively pass through the support seat and the first movable seat, and the support seat and the first guide columns are fixedly connected, the top of the support seat and the bottom of the first movable seat are connected by several first compression springs, and the transistor packaging forming disk is installed with lifting parts compatible with the several first movable seats.

[0010] Preferably, the lifting member includes a movable ring arranged above the transistor packaging forming disk, the top of the first movable seat and the bottom of the movable ring are connected by a connecting column, and a plurality of first hydraulic telescopic rods are fixedly connected to the top of the transistor packaging forming disk, and the telescopic ends of the first hydraulic telescopic rods are fixedly connected to the bottom of the movable ring.

[0011] Preferably, several protective shells are fixedly connected to the top of the transistor packaging forming disk. The protective shells are cavity structures with an open bottom end, and the number of protective shells and support seats is the same. The support seat and the first movable seat are both located in the corresponding protective shells, and the movable ring is located above the protective shells.

[0012] Preferably, the exhaust unit includes an exhaust pump fixedly mounted on the top of the transistor packaging molding disk, the top of the transistor packaging molding disk is fixedly connected with an exhaust pipe adapted to the exhaust chamber, and the exhaust end of the exhaust pump is fixedly connected to the top of the exhaust pipe.

[0013] Preferably, the position adjustment structure includes two first fixed frames fixedly mounted on the top of the operating table, movable boxes are respectively provided on both sides of the transistor packaging and molding disk, the movable box is rotatably connected with a rotating shaft, and the ends of the two rotating shafts that are close to each other are respectively fixedly connected to the two sides of the transistor packaging and molding disk, the rotating shaft is fixedly mounted with a gear located in the movable box, and the movable box is provided with a toothed plate that meshes with the gear, the first fixed frame is fixedly mounted with a second hydraulic telescopic rod, and the telescopic end of the second hydraulic telescopic rod is fixedly connected to the toothed plate, the two sides of the movable box are respectively fixedly connected with support parts, a second guide column passes through the support part, and the two ends of the second guide column are respectively fixedly connected to the operating table and the first fixed frame, the toothed plate is fixedly mounted with an iron plate, a magnet block is provided under the iron plate, and the magnet block is fixedly connected to the inner wall of the movable box, a first stop plate is provided above the movable box, and the first stop plate is fixedly connected to the first fixed frame, and the first fixed frame is equipped with a damping friction mechanism adapted to the movable box.

[0014] Preferably, the damping friction mechanism includes a first damping plate arranged on the side of the movable box away from the transistor packaging molding disk, a second movable seat is provided on the side of the first damping plate away from the movable box, a plurality of guide plates pass through the second movable seat, the guide plate and the first damping plate are fixedly connected, the first damping plate and the second movable seat are connected by a plurality of second compression springs, the first damping plate and the movable box are in contact, a plurality of third hydraulic telescopic rods are fixedly installed on the first fixed frame, and the telescopic ends of the third hydraulic telescopic rods are fixedly connected to the second movable seat.

[0015] Preferably, the pressing mechanism includes two second fixing frames fixedly mounted on the top of the operating table, a plurality of fixing blocks fixedly connected to the second fixing frames, a sliding groove is provided on the top of the fixing block, a slider is provided for sliding in the sliding groove, the bottom of the slider and the bottom inner wall of the sliding groove are connected by a third compression spring, guide grooves are provided on both sides of the slider, guide blocks are provided for sliding in the guide groove, and the guide blocks are fixedly connected to the inner wall of the sliding groove, a mounting frame is fixedly connected to the top of the slider, a rotating seat is provided above the mounting frame, a plurality of pressing columns for pressing transistors are fixedly connected to the rotating seat, and the number of rotating seats and forming grooves is consistent, and the mounting frame is equipped with a rotating unit adapted to the rotating seat.

[0016] Preferably, the rotating unit includes a connecting shaft rotatably mounted on the mounting frame, the rotating seat and the connecting shaft are fixedly connected, the external fixed sleeve of the connecting shaft is provided with a damping ring, the mounting frame is fixedly installed with a second stop plate adapted to the rotating seat, a movable plate is provided above the second fixed frame, and a plurality of fourth hydraulic telescopic rods are fixedly installed on the second fixed frame, the telescopic ends of the fourth hydraulic telescopic rods are fixedly connected to the bottom of the movable plate, a second damping plate in contact with the damping ring is provided above the fixed block, and the bottom of the second damping plate is fixedly connected to the top of the movable plate.

[0017] The present invention also provides a MOS transistor packaging process, using the MOS transistor packaging device as described above, comprising the following steps:

[0018] Step 1: The position adjustment mechanism drives the transistor package molding plate to move up to the initial height, with the opening direction of the molding groove facing upward. The staff will place the transistor to be packaged in the corresponding molding groove, and the transistor and the sealing ring will be in contact;

[0019] Step 2: Press the transistor with a pressing mechanism so that the bottom of the transistor contacts the inner wall of the forming groove, and the transistor pushes the sealing ring to slide into the annular groove. The elastic support elastically supports the sealing ring so that the force of the sealing ring pressing the transistor is at a preset value;

[0020] Step 3: Start the vacuum unit. The air pressure in the vacuum chamber is lower than the air pressure in the molding tank, so that the transistor is sucked into the molding tank. The position adjustment mechanism drives the transistor package molding plate to rotate 180 degrees so that the opening of the molding tank faces downward.

[0021] Step 4: The transistor package molding plate is driven downward by the position adjustment structure to complete the mold closing between the transistor package molding plate and the transistor package injection molding plate;

[0022] Step 5: After the transistor packaging in the molding tank is completed, the position adjustment structure is used to drive the transistor packaging molding disk to move up to the initial height, and then the position adjustment structure is used to drive the transistor packaging molding disk to rotate 180 degrees in the opposite direction, and the exhaust unit is closed to release the fixation of the packaged transistor, and the staff removes the packaged transistor.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The staff places the transistor to be packaged in the corresponding molding groove, the transistor and the sealing ring are in contact, and the pressing mechanism presses the transistor so that the bottom of the transistor contacts the inner wall of the molding groove, and the transistor pushes the sealing ring to slide into the annular groove. The elastic support elastically supports the sealing ring so that the force of the sealing ring pressing the transistor is at a preset value, and the exhaust unit is started. The air pressure in the exhaust chamber is lower than the air pressure in the molding groove, so that the transistor is adsorbed into the molding groove, and the transistor packaging molding disk is driven to rotate 180 degrees by the position adjustment structure so that the opening of the molding groove faces downward, and the position adjustment structure drives the sealing ring to rotate 180 degrees. The transistor package molding plate is moved downward to complete the mold closing of the transistor package molding plate and the transistor package injection molding plate. When the transistor packaging in the molding groove is completed, the transistor package molding plate is driven to move up to the initial height through the position adjustment structure, and then the transistor package molding plate is driven to rotate one hundred and eighty degrees in the opposite direction through the position adjustment structure. The exhaust unit is closed to make the air pressure in the exhaust chamber consistent with the air pressure in the molding groove, and the fixation of the packaged transistor is released. The staff can remove the packaged transistor and change to the transistor fixing method, which is convenient for packaging multiple transistors and easy to take and place transistors, which is convenient for actual use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0026] In the attached figure:

[0027] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0028] Figure 2This is a schematic structural diagram of a cross-section of a transistor packaging forming disk according to the present invention;

[0029] Figure 3 For the present invention Figure 2 A partial enlarged schematic diagram of point A in the middle;

[0030] Figure 4 Schematic diagram of the structure of the damping friction mechanism of the present invention;

[0031] Figure 5 Schematic diagram of the structure of the first fixing frame of the present invention;

[0032] Figure 6 It is a schematic structural diagram of a cutaway movable box of the present invention;

[0033] Figure 7 Schematic diagram of the structure of the pressing mechanism of the present invention;

[0034] Figure 8 This is a schematic diagram of the structure of the slider and the fixed block separated according to the present invention.

[0035] In the figure: 1. operating table; 2. transistor package injection molding plate; 3. transistor package molding plate; 4. molding groove; 5. annular groove; 6. sealing ring; 7. exhaust chamber; 8. exhaust pipe; 9. exhaust pump; 10. support seat; 11. first guide column; 12. first movable seat; 13. first compression spring; 14. protective shell; 15. movable ring; 16. connecting column; 17. first hydraulic telescopic rod; 18. first fixed frame; 19. movable box; 20. rotating shaft; 21. tooth plate; 22. second hydraulic telescopic rod; 23. supporting part; 24. second guide column; 25. Magnet block; 26. Iron plate; 27. First stop plate; 28. First damping plate; 29. ​​Second movable seat; 30. Second compression spring; 31. Guide plate; 32. Third hydraulic telescopic rod; 33. Gear; 34. Second fixed frame; 35. Movable plate; 36. Fourth hydraulic telescopic rod; 37. Mounting frame; 38. Connecting shaft; 39. Damping ring; 40. Second damping plate; 41. Rotating seat; 42. Pressing column; 43. Second stop plate; 44. Fixed block; 45. Slide groove; 46. Slider; 47. Third compression spring; 48. Guide groove; 49. Guide block. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0037] Embodiment 1, by Figure 1 、 Figure 2 and Figure 3 The present invention includes an operating table 1, a transistor package injection molding tray 2 is fixedly connected to the top of the operating table 1, a transistor package molding tray 3 is provided above the transistor package injection molding tray 2, and the operating table 1 is equipped with a position adjustment structure for adjusting the position of the transistor package molding tray 3;

[0038] The bottom of the transistor package forming disk 3 is provided with a plurality of forming grooves 4 adapted to the transistor, the top inner wall of the forming groove 4 is provided with an annular groove 5, a sealing ring 6 is provided in the annular groove 5, the transistor package forming disk 3 is equipped with an elastic support for supporting the sealing ring 6, the transistor package forming disk 3 is provided with an exhaust chamber 7 connected with a plurality of forming grooves 4, and the connection between the exhaust chamber 7 and the forming groove 4 is located in the center of the sealing ring 6, the transistor package forming disk 3 is equipped with an exhaust unit adapted to the exhaust chamber 7, and the top of the operating table 1 is equipped with a pressing mechanism for positioning the transistor into the forming groove 4; the staff places the transistor to be packaged in the corresponding forming groove 4, the transistor and the sealing ring 6 are in contact, and the transistor is pressed by the pressing mechanism so that the bottom of the transistor is in contact with the inner wall of the forming groove 4, and the transistor pushes the sealing ring 6 to slide into the annular groove 5, and the elastic support elastically supports the sealing ring 6 so that The force with which the sealing ring 6 presses the transistor is at a preset value, and the exhaust unit is started. The air pressure in the exhaust chamber 7 is lower than the air pressure in the molding groove 4, so that the transistor is adsorbed into the molding groove 4, and the transistor package molding disk 3 is driven to rotate one hundred and eighty degrees through the position adjustment structure so that the opening of the molding groove 4 faces downward, and the transistor package molding disk 3 is driven downward through the position adjustment structure to complete the mold closing of the transistor package molding disk 3 and the transistor package injection molding disk 2. When the transistor in the molding groove 4 is packaged, the transistor package molding disk 3 is driven to move up to the initial height through the position adjustment structure, and then the transistor package molding disk 3 is driven to rotate one hundred and eighty degrees in the opposite direction through the position adjustment structure, and the exhaust unit is closed to make the air pressure in the exhaust chamber 7 consistent with the air pressure in the molding groove 4, and the fixation of the packaged transistor is released. The staff can remove the packaged transistor, which is convenient for packaging multiple transistors and for taking and placing transistors, which is convenient for actual use.

[0039] Example 2, based on Example 1, Figure 1 、 Figure 2 and Figure 3It is given that the elastic support includes a support seat 10 arranged above the sealing ring 6, and the support seat 10 is located above the transistor packaging molding disk 3, and a plurality of first guide columns 11 are fixedly connected to the top of the sealing ring 6. A first movable seat 12 is provided above the support seat 10, and the first guide columns 11 respectively pass through the support seat 10 and the first movable seat 12, and the support seat 10 and the first guide columns 11 are fixedly connected. The top of the support seat 10 and the bottom of the first movable seat 12 are connected by a plurality of first compression springs 13. The transistor packaging molding disk 3 is equipped with a lifting member adapted to the plurality of first movable seats 12. The lifting member includes a movable ring 15 arranged above the transistor packaging molding disk 3, and the top of the first movable seat 12 and the bottom of the movable ring 15 are connected by connecting columns 1 6 connection, the top of the transistor packaging and forming disk 3 is fixedly connected to a plurality of first hydraulic telescopic rods 17, and the telescopic ends of the first hydraulic telescopic rods 17 are fixedly connected to the bottom of the movable ring 15, the top of the transistor packaging and forming disk 3 is fixedly connected to a plurality of protective shells 14, the protective shells 14 are a cavity structure with an opening at the bottom, and the number of protective shells 14 and the support seats 10 is the same, the support seats 10 and the first movable seats 12 are both located in the corresponding protective shells 14, and the movable ring 15 is located above the protective shells 14, the exhaust unit includes an exhaust pump 9 fixedly mounted on the top of the transistor packaging and forming disk 3, the top of the transistor packaging and forming disk 3 is fixedly connected to an exhaust pipe 8 adapted to the exhaust chamber 7, and the exhaust end of the exhaust pump 9 is fixedly connected to the top of the exhaust pipe 8;

[0040] The bottom of the transistor is in contact with the sealing ring 6. When the transistor is pressed by the pressing mechanism, the bottom of the transistor is in contact with the inner wall of the forming groove 4, and the sealing ring 6 slides into the annular groove 5. The sealing ring 6 drives the first guide column 11 and the support seat 10 to move relative to the first movable seat 12, changing the distance between the support seat 10 and the first movable seat 12, and then adjusting the length of the first compression spring 13. The first compression spring 13 applies pressure to the support seat 10 so that the sealing ring 6 elastically presses the transistor, and the movable ring 15 is driven to move in the vertical direction by the first hydraulic telescopic rod 17. The movable ring 15 drives the first movable seat 12 relative to the support seat 12 through the connecting column 16. The seat 10 moves, which can change the distance between the first movable seat 12 and the support seat 10, and then control the degree of deformation of the first compression spring 13. When the sealing ring 6 slides into the annular groove 5, the force of the sealing ring 6 pressing on the transistor can be further controlled. The vacuum pump 9 is turned on, and the vacuum pump 9 extracts the air in the vacuum chamber 7 through the vacuum pipe 8. The molding groove 4 and the vacuum chamber 7 are separated by the sealing ring 6 and the transistor, so that the air pressure in the vacuum chamber 7 is lower than the air pressure in the molding groove 4. The transistor is adsorbed into the molding groove 4. The support seat 10, the first movable seat 12 and the first compression spring 13 are protected by the design of the protective shell 14.

[0041] Example 3, based on Example 1, Figure 1、 Figure 4 、 Figure 5 and Figure 6 It is given that the position adjustment structure includes two first fixed frames 18 fixedly mounted on the top of the operating table 1, and movable boxes 19 are respectively provided on both sides of the transistor packaging and molding disk 3, and a rotating shaft 20 is rotatably connected to the movable box 19, and the ends of the two rotating shafts 20 that are close to each other are respectively fixedly connected to the two sides of the transistor packaging and molding disk 3, and the rotating shaft 20 is fixedly mounted with a gear 33 located in the movable box 19, and a tooth plate 21 meshing with the gear 33 is provided in the movable box 19, and a second hydraulic telescopic rod 22 is fixedly mounted on the first fixed frame 18, and the telescopic end of the second hydraulic telescopic rod 22 is fixedly connected to the tooth plate 21, and support parts 23 are respectively fixedly connected on both sides of the movable box 19, and a second guide column 24 passes through the support part 23, and the two ends of the second guide column 24 are respectively fixedly connected to the operating table 1 and the first fixed frame 18, and an iron plate 26 is fixedly mounted on the tooth plate 21, and a magnet is provided under the iron plate 26 Block 25, and the magnet block 25 is fixedly connected to the inner wall of the movable box 19, a first stop plate 27 is provided above the movable box 19, and the first stop plate 27 is fixedly connected to the first fixing frame 18, the first fixing frame 18 is equipped with a damping friction mechanism adapted to the movable box 19, the damping friction mechanism includes a first damping plate 28 arranged on the side of the movable box 19 away from the transistor packaging molding disk 3, the first damping plate 28 is provided with a second movable seat 29 on the side away from the movable box 19, a plurality of guide plates 31 pass through the second movable seat 29, the guide plate 31 and the first damping plate 28 are fixedly connected, the first damping plate 28 and the second movable seat 29 are connected by a plurality of second compression springs 30, the first damping plate 28 and the movable box 19 are in contact, the first fixing frame 18 is fixedly equipped with a plurality of third hydraulic telescopic rods 32, and the telescopic end of the third hydraulic telescopic rod 32 is fixedly connected to the second movable seat 29;

[0042] When the transistor package molding disk 3 and the movable box 19 are at the highest position, the opening of the molding groove 4 is facing upward, and the second compression spring 30 is in a compressed state. The second compression spring 30 applies pressure to the first damping plate 28, so that the friction between the first damping plate 28 and the movable box 19 is at a preset value, and the second movable seat 29 is driven by the third hydraulic telescopic rod 32 to slide relative to the guide plate 31 and the first damping plate 28, thereby changing the distance between the second movable seat 29 and the first damping plate 28, thereby controlling the deformation degree of the second compression spring 30, and thus controlling the distance between the first damping plate 28 and the movable box 19. The friction force at this time makes the movable box 19 stationary relative to the first damping plate 28 and the first fixed frame 18. When the transistor package molding disk 3 and the transistor package injection molding disk 2 need to be driven to close the mold, the tooth plate 21 is driven to move downward by the second hydraulic telescopic rod 22. The tooth plate 21 drives the gear 33 and the rotating shaft 20 to rotate. The rotating shaft 20 drives the transistor package molding disk 3 to rotate one hundred and eighty degrees. At this time, when the iron plate 26 and the magnet block 25 are in contact, as the tooth plate 21 continues to move downward, the tooth plate 21 pushes the magnet block 25 and the movable box 19 to move downward synchronously through the iron plate 26. The movable box 19 slides down relative to the first damping plate 28, and the movable box 19 slides down relative to the first damping plate 28. The box 19 drives the support part 23 to slide relative to the second guide column 24. The design of the second guide column 24 and the support part 23 allows the movable box 19 and the transistor packaging molding disk 3 to move smoothly in the vertical direction until the transistor packaging molding disk 3 and the transistor packaging injection molding disk 2 complete the mold closing, and the transistor packaging molding disk 3 stops moving downward. When the transistor packaging is completed, the tooth plate 21 is driven upward by the second hydraulic telescopic rod 22. Due to the magnetic attraction between the iron plate 26 and the magnet block 25, the magnetic force generated between the magnet block 25 and the iron plate 26 is greater than the resistance encountered by the movable box 19 sliding upward relative to the first damping plate 28. At this time, the magnet block 25 and the movable box 19 move up synchronously with the iron plate 26 and the tooth plate 21, and the movable box 19 slides relative to the first damping plate 28. When the movable box 19 moves up to the initial height, the movable box 19 and the bottom of the first stop plate 27 contact each other, and the movable box 19 stops moving up relative to the first fixed frame 18 and the first stop plate 27. As the tooth plate 21 continues to move up, the iron plate 26 and the magnet block 25 are no longer in contact, and the tooth plate 21 drives the gear 33 and the rotating shaft 20 to rotate in the opposite direction, so that the rotating shaft 20 drives the transistor package molding disk 3 to rotate in the opposite direction by one hundred and eighty degrees, so that the opening of the molding groove 4 can be faced upward again.

[0043] Example 4, based on Example 1, Figure 1 、 Figure 7 and Figure 8The pressing mechanism includes two second fixing frames 34 fixedly mounted on the top of the operating table 1, and a plurality of fixing blocks 44 are fixedly connected to the second fixing frames 34. A slide groove 45 is provided on the top of the fixing block 44, and a slider 46 is provided for sliding in the slide groove 45. The bottom of the slider 46 and the bottom inner wall of the slide groove 45 are connected by a third compression spring 47. A guide groove 48 is provided on both sides of the slider 46, and a guide block 49 is provided for sliding in the guide groove 48. The guide block 49 is fixedly connected to the inner wall of the slide groove 45. The top of the slider 46 is fixedly connected to the mounting frame 37, and a rotating seat 41 is provided above the mounting frame 37. A plurality of pressing columns 42 for pressing the transistor are fixedly connected to the rotating seat 41, and the rotating seat 41 and the forming groove 4 are provided. The number of devices is consistent, the mounting frame 37 is equipped with a rotating unit adapted to the rotating seat 41, the rotating unit includes a connecting shaft 38 rotatably mounted on the mounting frame 37, the rotating seat 41 and the connecting shaft 38 are fixedly connected, the external fixed sleeve of the connecting shaft 38 is provided with a damping ring 39, the mounting frame 37 is fixedly installed with a second stop plate 43 adapted to the rotating seat 41, a movable plate 35 is provided above the second fixing frame 34, and a plurality of fourth hydraulic telescopic rods 36 are fixedly installed on the second fixing frame 34, the telescopic end of the fourth hydraulic telescopic rod 36 is fixedly connected to the bottom of the movable plate 35, a second damping plate 40 in contact with the damping ring 39 is provided above the fixed block 44, and the bottom of the second damping plate 40 is fixedly connected to the top of the movable plate 35;

[0044] The third compression spring 47 is initially in a compressed state, and the third compression spring 47 applies pressure to the slider 46 so that the bottom inner wall of the guide groove 48 abuts the bottom of the guide block 49. At this time, the mounting frame 37 and the slider 46 are stationary relative to the fixed block 44 and the second fixed frame 34. The staff places the transistor to be packaged in the corresponding molding groove 4. When the transistor and the sealing ring 6 are in contact, the fourth hydraulic telescopic rod 36 drives the movable plate 35 and the second damping plate 40 to move downward. The second damping plate 40 drives the damping ring 39 and the connecting shaft 38 to rotate synchronously through friction. When the connecting shaft 38 drives the pressing column 42 to rotate ninety degrees through the rotating seat 41, the rotating seat 41 contacts the second stop plate 43. The second stop plate 43 limits the position of the rotating seat 41 to stop the connecting shaft 38 and the rotating seat 41 from rotating relative to the mounting frame 37. At this time, the pressing column 42 contacts the corresponding transistor. As the second damping plate 40 continues to move downward, the second damping plate 40 cannot drive the damping ring 39 through friction. 9 and the connecting shaft 38 rotate relative to the mounting frame 37, the rotating seat 41 maintains the tilt angle at this time, the damping ring 39, the connecting shaft 38 and the mounting frame 37 move downward synchronously with the second damping plate 40, the slider 46 slides down relative to the slide groove 45, and the pressing column 42 can press the transistor downward so that the bottom of the transistor contacts the inner wall of the forming groove 4. When the transistor does not need to be pressed, the movable plate 35 is driven upward by the fourth hydraulic telescopic rod 36, and the third compression spring 47 pushes the slider 46 and the mounting frame 37 upward synchronously. The second damping plate 40 moves upward until the slider 46 moves up to the initial height relative to the fixed block 44, and the bottom inner wall of the guide groove 48 abuts against the bottom of the guide block 49 again, and the mounting bracket 37 stops moving up. As the second damping plate 40 continues to move upward, the second damping plate 40 drives the damping ring 39 and the connecting shaft 38 to rotate in the opposite direction through friction, so that the connecting shaft 38 drives the pressing column 42 to rotate in the opposite direction by ninety degrees through the rotating seat 41, thereby preventing the rotating seat 41 and the pressing column 42 from interfering with the transistor packaging molding disk 3 from flipping one hundred and eighty degrees.

[0045] A MOS transistor packaging process of this embodiment, using the MOS transistor packaging device described above, includes the following steps:

[0046] Step 1: The position adjustment mechanism drives the transistor package forming plate 3 to move up to the initial height, with the opening direction of the forming groove 4 facing upward. The staff places the transistor to be packaged in the corresponding forming groove 4, and the transistor and the sealing ring 6 are in contact;

[0047] Step 2: Press the transistor with the pressing mechanism so that the bottom of the transistor contacts the inner wall of the forming groove 4, and the transistor pushes the sealing ring 6 to slide into the annular groove 5. The elastic support elastically supports the sealing ring 6 so that the force of the sealing ring 6 pressing the transistor is at a preset value;

[0048] Step 3: Start the vacuum unit. The air pressure in the vacuum chamber 7 is lower than the air pressure in the molding groove 4, so that the transistor is attracted to the molding groove 4. The position adjustment mechanism drives the transistor package molding plate 3 to rotate 180 degrees so that the opening of the molding groove 4 faces downward.

[0049] Step 4: The transistor package molding plate 3 is driven downward by the position adjustment structure to complete the mold closing of the transistor package molding plate 3 and the transistor package injection molding plate 2;

[0050] Step 5: After the transistor packaging in the molding groove 4 is completed, the position adjustment structure is used to drive the transistor packaging molding disk 3 to move up to the initial height, and then the position adjustment structure is used to drive the transistor packaging molding disk 3 to rotate one hundred and eighty degrees in the opposite direction, and the exhaust unit is closed to release the fixation of the packaged transistor, and the staff removes the packaged transistor.

[0051] Working principle: The position adjustment structure drives the transistor package molding disk 3 to move up to the initial height, and the opening direction of the molding groove 4 is upward. The staff places the transistor to be packaged in the corresponding molding groove 4, and the transistor and the sealing ring 6 are in contact. The transistor is pressed by the pressing mechanism so that the bottom of the transistor is in contact with the inner wall of the molding groove 4, and the transistor pushes the sealing ring 6 to slide into the annular groove 5. The elastic support elastically supports the sealing ring 6 so that the force of the sealing ring 6 pressing the transistor is at a preset value. The exhaust unit is started, and the air pressure in the exhaust chamber 7 is lower than the air pressure in the molding groove 4, so that the transistor is adsorbed into the molding groove 4, and the transistor package molding disk is driven by the position adjustment structure. 3 is rotated 180 degrees so that the opening of the molding groove 4 faces downward, and the position adjustment structure drives the transistor package molding plate 3 to move downward so that the transistor package molding plate 3 and the transistor package injection molding plate 2 complete the mold closing. When the packaging of the transistors in the molding groove 4 is completed, the position adjustment structure drives the transistor package molding plate 3 to move up to the initial height, and then the position adjustment structure drives the transistor package molding plate 3 to rotate 180 degrees in the opposite direction, and the exhaust unit is closed to make the air pressure in the exhaust chamber 7 consistent with the air pressure in the molding groove 4, thereby releasing the fixation of the packaged transistor, and the staff can remove the packaged transistor, which is convenient for packaging multiple transistors and for taking and placing transistors for actual use;

[0052] The bottom of the transistor is in contact with the sealing ring 6. When the transistor is pressed by the pressing mechanism, the bottom of the transistor is in contact with the inner wall of the forming groove 4, and the sealing ring 6 slides into the annular groove 5. The sealing ring 6 drives the first guide column 11 and the support seat 10 to move relative to the first movable seat 12, changing the distance between the support seat 10 and the first movable seat 12, and then adjusting the length of the first compression spring 13. The first compression spring 13 applies pressure to the support seat 10 so that the sealing ring 6 elastically presses the transistor, and the movable ring 15 is driven to move in the vertical direction by the first hydraulic telescopic rod 17. The movable ring 15 drives the first movable seat 12 relative to the support seat 12 through the connecting column 16. The seat 10 moves to change the distance between the first movable seat 12 and the support seat 10, thereby controlling the degree of deformation of the first compression spring 13. When the sealing ring 6 slides into the annular groove 5, the force with which the sealing ring 6 presses on the transistor can be further controlled. The air pump 9 is turned on, and the air pump 9 extracts the air in the air extraction chamber 7 through the air extraction pipe 8. The molding groove 4 and the air extraction chamber 7 are separated by the sealing ring 6 and the transistor, so that the air pressure in the air extraction chamber 7 is lower than the air pressure in the molding groove 4. The transistor is adsorbed into the molding groove 4. The support seat 10, the first movable seat 12 and the first compression spring 13 are protected by the design of the protective shell 14.

[0053] When the transistor package molding disk 3 and the movable box 19 are at the highest position, the opening of the molding groove 4 is facing upward, and the second compression spring 30 is in a compressed state. The second compression spring 30 applies pressure to the first damping plate 28, so that the friction between the first damping plate 28 and the movable box 19 is at a preset value, and the second movable seat 29 is driven by the third hydraulic telescopic rod 32 to slide relative to the guide plate 31 and the first damping plate 28, thereby changing the distance between the second movable seat 29 and the first damping plate 28, thereby controlling the deformation degree of the second compression spring 30, and thus controlling the distance between the first damping plate 28 and the movable box 19. The friction force at this time makes the movable box 19 stationary relative to the first damping plate 28 and the first fixed frame 18. When the transistor package molding disk 3 and the transistor package injection molding disk 2 need to be driven to close the mold, the tooth plate 21 is driven to move downward by the second hydraulic telescopic rod 22. The tooth plate 21 drives the gear 33 and the rotating shaft 20 to rotate. The rotating shaft 20 drives the transistor package molding disk 3 to rotate one hundred and eighty degrees. At this time, when the iron plate 26 and the magnet block 25 are in contact, as the tooth plate 21 continues to move downward, the tooth plate 21 pushes the magnet block 25 and the movable box 19 to move downward synchronously through the iron plate 26. The movable box 19 slides down relative to the first damping plate 28, and the movable box 19 slides down relative to the first damping plate 28. The box 19 drives the support part 23 to slide relative to the second guide column 24. The design of the second guide column 24 and the support part 23 allows the movable box 19 and the transistor packaging molding disk 3 to move smoothly in the vertical direction until the transistor packaging molding disk 3 and the transistor packaging injection molding disk 2 complete the mold closing, and the transistor packaging molding disk 3 stops moving downward. When the transistor packaging is completed, the tooth plate 21 is driven upward by the second hydraulic telescopic rod 22. Due to the magnetic attraction between the iron plate 26 and the magnet block 25, the magnetic force generated between the magnet block 25 and the iron plate 26 is greater than the resistance encountered by the movable box 19 sliding upward relative to the first damping plate 28. At this time, the magnet block 25 and the movable box 19 move upward synchronously with the iron plate 26 and the toothed plate 21, and the movable box 19 slides relative to the first damping plate 28. When the movable box 19 moves up to the initial height, the movable box 19 contacts the bottom of the first stop plate 27, and the movable box 19 stops moving upward relative to the first fixed frame 18 and the first stop plate 27. As the toothed plate 21 continues to move upward, the iron plate 26 and the magnet block 25 are no longer in contact, and the toothed plate 21 drives the gear 33 and the rotating shaft 20 to rotate in the opposite direction, so that the rotating shaft 20 drives the transistor package molding disk 3 to rotate in the opposite direction by 180 degrees, so that the opening of the molding groove 4 is facing upward again;

[0054] The third compression spring 47 is initially in a compressed state, and the third compression spring 47 applies pressure to the slider 46 so that the bottom inner wall of the guide groove 48 abuts the bottom of the guide block 49. At this time, the mounting frame 37 and the slider 46 are stationary relative to the fixed block 44 and the second fixed frame 34. The staff places the transistor to be packaged in the corresponding molding groove 4. When the transistor and the sealing ring 6 are in contact, the fourth hydraulic telescopic rod 36 drives the movable plate 35 and the second damping plate 40 to move downward. The second damping plate 40 drives the damping ring 39 and the connecting shaft 38 to rotate synchronously through friction. When the connecting shaft 38 drives the pressing column 42 to rotate ninety degrees through the rotating seat 41, the rotating seat 41 contacts the second stop plate 43. The second stop plate 43 limits the position of the rotating seat 41 to stop the connecting shaft 38 and the rotating seat 41 from rotating relative to the mounting frame 37. At this time, the pressing column 42 contacts the corresponding transistor. As the second damping plate 40 continues to move downward, the second damping plate 40 cannot drive the damping ring 39 through friction. 9 and the connecting shaft 38 rotate relative to the mounting frame 37, the rotating seat 41 maintains the tilt angle at this time, the damping ring 39, the connecting shaft 38 and the mounting frame 37 move downward synchronously with the second damping plate 40, the slider 46 slides down relative to the slide groove 45, and the pressing column 42 can press the transistor downward so that the bottom of the transistor contacts the inner wall of the forming groove 4. When the transistor does not need to be pressed, the movable plate 35 is driven upward by the fourth hydraulic telescopic rod 36, and the third compression spring 47 pushes the slider 46 and the mounting frame 37 upward synchronously. The second damping plate 40 moves upward until the slider 46 moves up to the initial height relative to the fixed block 44, and the bottom inner wall of the guide groove 48 abuts against the bottom of the guide block 49 again, and the mounting bracket 37 stops moving up. As the second damping plate 40 continues to move upward, the second damping plate 40 drives the damping ring 39 and the connecting shaft 38 to rotate in the opposite direction through friction, so that the connecting shaft 38 drives the pressing column 42 to rotate in the opposite direction by ninety degrees through the rotating seat 41, thereby preventing the rotating seat 41 and the pressing column 42 from interfering with the transistor packaging molding disk 3 from flipping one hundred and eighty degrees.

[0055] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0056] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A MOS transistor packaging device, comprising an operating table (1), characterized in that: A transistor encapsulation injection molding disk (2) is fixedly connected to the top of the operating table (1), a transistor encapsulation molding disk (3) is provided above the transistor encapsulation injection molding disk (2), and a position adjustment structure for adjusting the position of the transistor encapsulation molding disk (3) is installed on the operating table (1); The bottom of the transistor package forming disk (3) is provided with a plurality of forming grooves (4) adapted to the transistors, the top inner wall of the forming groove (4) is provided with an annular groove (5), a sealing ring (6) is provided in the annular groove (5), the transistor package forming disk (3) is provided with an elastic supporter for supporting the sealing ring (6), the transistor package forming disk (3) is provided with an exhaust chamber (7) connected to the plurality of forming grooves (4), and the connection point between the exhaust chamber (7) and the forming groove (4) is located at the center of the sealing ring (6), the transistor package forming disk (3) is provided with an exhaust unit adapted to the exhaust chamber (7), and the top of the operating table (1) is provided with a pressing mechanism for positioning the transistor into the forming groove (4).

2. The MOS transistor packaging device according to claim 1, wherein: The elastic supporter comprises a support seat (10) arranged above the sealing ring (6), and the support seat (10) is located above the transistor packaging forming disk (3), a plurality of first guide columns (11) are fixedly connected to the top of the sealing ring (6), a first movable seat (12) is provided above the support seat (10), the first guide columns (11) respectively penetrate the support seat (10) and the first movable seat (12), and the support seat (10) and the first guide columns (11) are fixedly connected, the top of the support seat (10) and the bottom of the first movable seat (12) are connected by a plurality of first compression springs (13), and the transistor packaging forming disk (3) is installed with lifting members adapted to the plurality of first movable seats (12).

3. The MOS transistor packaging device according to claim 2, wherein: The lifting member comprises a movable ring (15) arranged above the transistor packaging forming disk (3); the top of the first movable seat (12) and the bottom of the movable ring (15) are connected via a connecting column (16); a plurality of first hydraulic telescopic rods (17) are fixedly connected to the top of the transistor packaging forming disk (3); and the telescopic ends of the first hydraulic telescopic rods (17) are fixedly connected to the bottom of the movable ring (15).

4. The MOS transistor packaging device according to claim 3, wherein: A plurality of protective shells (14) are fixedly connected to the top of the transistor packaging forming disk (3); the protective shells (14) are a cavity structure with an open bottom end, and the number of protective shells (14) and support seats (10) is the same; the support seats (10) and the first movable seat (12) are both located in the corresponding protective shells (14), and the movable ring (15) is located above the protective shells (14).

5. The MOS transistor packaging device according to claim 1, wherein: The exhaust unit comprises an exhaust pump (9) fixedly mounted on the top of the transistor packaging forming disk (3); an exhaust pipe (8) adapted to the exhaust chamber (7) is fixedly connected to the top of the transistor packaging forming disk (3); and an exhaust end of the exhaust pump (9) is fixedly connected to the top of the exhaust pipe (8).

6. The MOS transistor packaging device according to claim 1, wherein: The position adjustment structure comprises two first fixing frames (18) fixedly mounted on the top of the operating table (1); movable boxes (19) are respectively provided on both sides of the transistor packaging forming disk (3); a rotating shaft (20) is rotatably connected to the movable box (19); and the ends of the two rotating shafts (20) close to each other are respectively fixedly connected to the two sides of the transistor packaging forming disk (3); the rotating shaft (20) is fixedly mounted with a gear (33) located in the movable box (19); a tooth plate (21) meshing with the gear (33) is provided in the movable box (19); a second hydraulic telescopic rod (22) is fixedly mounted on the first fixing frame (18); and the telescopic end of the second hydraulic telescopic rod (22) and the tooth plate (21) are fixedly mounted. The movable box (19) is fixedly connected to two sides thereof with support parts (23), a second guide column (24) is passed through the support part (23), and two ends of the second guide column (24) are fixedly connected to the operating table (1) and the first fixed frame (18), respectively. The tooth plate (21) is fixedly installed with an iron plate (26), a magnet block (25) is provided below the iron plate (26), and the magnet block (25) is fixedly connected to the inner wall of the movable box (19), a first stop plate (27) is provided above the movable box (19), and the first stop plate (27) is fixedly connected to the first fixed frame (18), and the first fixed frame (18) is installed with a damping friction mechanism adapted to the movable box (19).

7. The MOS transistor packaging device according to claim 6, wherein: The damping friction mechanism includes a first damping plate (28) arranged on a side of the movable box (19) away from the transistor packaging molding disk (3), a second movable seat (29) is provided on the side of the first damping plate (28) away from the movable box (19), a plurality of guide plates (31) are passed through the second movable seat (29), the guide plates (31) and the first damping plate (28) are fixedly connected, the first damping plate (28) and the second movable seat (29) are connected by a plurality of second compression springs (30), the first damping plate (28) and the movable box (19) are in contact, the first fixed frame (18) is fixedly installed with a plurality of third hydraulic telescopic rods (32), and the telescopic ends of the third hydraulic telescopic rods (32) are fixedly connected to the second movable seat (29).

8. The MOS transistor packaging device according to claim 1, wherein: The pressing mechanism comprises two second fixing frames (34) fixedly mounted on the top of the operating table (1), a plurality of fixing blocks (44) being fixedly connected to the second fixing frames (34), a slide groove (45) being provided on the top of the fixing blocks (44), a slider (46) being provided for sliding in the slide groove (45), the bottom of the slider (46) and the bottom inner wall of the slide groove (45) being connected via a third compression spring (47), a guide groove (48) being provided on both sides of the slider (46), a guide block (49) being provided for sliding in the guide groove (48), and the guide block (49) being fixedly connected to the inner wall of the slide groove (45), a mounting frame (37) being fixedly connected to the top of the slider (46), a rotating seat (41) being provided above the mounting frame (37), a plurality of pressing columns (42) for pressing transistors being fixedly connected to the rotating seat (41), and the number of the rotating seats (41) and the forming groove (4) being the same, and a rotating unit matching the rotating seat (41) being installed on the mounting frame (37).

9. The MOS transistor packaging device according to claim 8, wherein: The rotating unit includes a connecting shaft (38) rotatably mounted on a mounting frame (37), a rotating seat (41) and the connecting shaft (38) are fixedly connected, an outer fixed sleeve of the connecting shaft (38) is provided with a damping ring (39), a second stop plate (43) adapted to the rotating seat (41) is fixedly mounted on the mounting frame (37), a movable plate (35) is provided above the second fixed frame (34), a plurality of fourth hydraulic telescopic rods (36) are fixedly mounted on the second fixed frame (34), the telescopic ends of the fourth hydraulic telescopic rods (36) are fixedly connected to the bottom of the movable plate (35), a second damping plate (40) in contact with the damping ring (39) is provided above the fixed block (44), and the bottom of the second damping plate (40) is fixedly connected to the top of the movable plate (35).

10. A MOS transistor packaging process using the MOS transistor packaging device according to claim 1, characterized in that: The following steps are involved: Step 1: The position adjustment structure drives the transistor package molding plate (3) to move up to the initial height, with the opening direction of the molding groove (4) facing upwards. The staff places the transistor to be packaged in the corresponding molding groove (4), and the transistor and the sealing ring (6) are in contact; Step 2: Pressing the transistor by the pressing mechanism so that the bottom of the transistor contacts the inner wall of the forming groove (4), and the transistor pushes the sealing ring (6) to slide into the annular groove (5), and the elastic support elastically supports the sealing ring (6) so that the force of the sealing ring (6) pressing the transistor is at a preset value; Step 3: Start the exhaust unit, the air pressure in the exhaust chamber (7) is lower than the air pressure in the molding groove (4), so that the transistor is adsorbed into the molding groove (4), and the position adjustment structure drives the transistor package molding disk (3) to rotate 180 degrees so that the opening of the molding groove (4) faces downward; Step 4: driving the transistor package molding plate (3) downward through the position adjustment structure to complete the mold closing of the transistor package molding plate (3) and the transistor package injection molding plate (2); Step 5: After the transistor packaging in the molding groove (4) is completed, the transistor packaging molding disk (3) is driven to move up to the initial height through the position adjustment structure, and then the transistor packaging molding disk (3) is driven to rotate 180 degrees in the opposite direction through the position adjustment structure, and the exhaust unit is closed to release the fixation of the packaged transistor, and the staff removes the packaged transistor.

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