Feeding and discharging device for wiring operation of multi-bonding-head high-speed die bonding equipment

Abstract

The invention discloses a feeding and discharging device for wiring operation of multi-bonding-head high-speed die bonding equipment, and belongs to the technical field of multi-bonding-head high-speed die bonding equipment. Comprising a feeding section mechanism installed on the left side of the upper surface of the truss, a middle section mechanism is arranged on the right side of the feeding section mechanism, and a discharging section mechanism is arranged on the right side of the middle section mechanism. According to the feeding and discharging device for the multi-binding-head high-speed die bonding equipment wire connection operation, the left buffer connection table and the right buffer connection table are arranged, and the left buffer connection table and the right buffer connection table can be switched up and down through the double-layer buffer connection table in cooperation with the upper-layer track and the lower-layer track and are in butt joint with a main body equipment clamp working platform, so that discharging and product feeding of each working table of each single machine at any time are achieved; in order to maximize the productivity efficiency of the die bonding operation of equipment, an assembly line can have sufficient time to send a die-bonded product to the next stage for reflow soldering in the time of normal die bonding operation.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-head high-speed die bonding equipment, and specifically to a loading and unloading device for continuous operation of multi-head high-speed die bonding equipment. Background Art

[0002] The multi-head high-speed die bonding equipment is a device that works based on precise mechanical control and advanced vision recognition technology. It uses multiple bonding heads for loading and unloading, and is equipped with a loading and unloading device to improve the stability of feeding and discharging. During use, it is not convenient to perform synchronous operation of multiple groups, which affects the loading and unloading efficiency.

[0003] To overcome the above-mentioned defects, a prior art (Chinese patent application with application number CN201811476044.6 and filing date December 4, 2018) is a high-speed double-head automatic loading and unloading die bonder. The bottom of the chip positioning mechanism is fixedly connected to one side of the top of the platen. The chip positioning mechanism includes a first Y-axis single-axis manipulator, a first X-axis single-direction manipulator, and a blue film clamp. A blue film ring is fixedly connected to the inner wall of the blue film clamp. A chip upward pushing mechanism is fixedly connected to the top of the first X-axis single-direction manipulator. The double suction nozzle swing arm mechanism includes a main fixed seat and a rotary servo motor. Swing arms are fixedly connected to both sides of the bottom of the rotary servo motor. Industrial cameras are fixedly connected to both sides of the top of the main fixed seat. Also, a prior art (Chinese patent application with application number CN201521119956.X and filing date December 30, 2015) is a loading and unloading system for a multi-workbench die bonder, including a frame platform, a material separating device for separating materials, and a material unloading device for unloading materials. The material separating device is connected to a loading and unloading device. The loading and unloading device is arranged on a fixed base and slides on the fixed base. The fixed base is arranged on the frame platform. Multiple workbenches are also arranged on the frame platform. The loading and unloading device takes materials from the material separating device, slides to the position of the workbench for dispensing and die bonding, and after completing the dispensing and die bonding, is transported to the material unloading device for unloading through the loading and unloading device. The present invention performs loading and unloading for multiple workbenches and does not require each workbench to be equipped with a loading and unloading device, which can improve the efficiency of loading and unloading. And a prior art (Chinese patent application with application number CN201921569239.5 and filing date September 19, 2019) is an LED high-speed die bonding device and its automatic loading and unloading device. During the whole operation, the operator only needs to place the crystal ring on the feeding structure and start the device, which reduces the actions of the operator for frequently replacing the crystal ring, reduces the operation intensity, reduces the wasted time in manual loading, increases the production capacity of a single LED high-speed die bonding device, improves the efficiency, and improves the automation and intelligence levels of the LED die bonder. Although the prior art can complete multi-position loading and unloading, during the working process, a single-piece product needs to pass through multiple devices after printing before reaching the next-stage reflow soldering, there is a risk of tin paste aging and invalidation. Each device completes the die bonding operation of a single-chip, with many loading and unloading times and a long cumulative time, which affects the actual die bonding production capacity. And if a certain device fails, it affects the operation of the whole line and the production capacity achievement rate is low.

[0004] In view of the above problems, it is urgently necessary to innovate and design on the basis of the original multi-head high-speed die bonding equipment. Summary of the Invention

[0005] The purpose of the present invention is to provide a loading and unloading device for connecting multi-head high-speed solid crystal equipment, so as to solve the problem proposed in the above background technology that during the working process, a single-chip product needs to pass through multiple devices after printing before it can reach the next stage of reflow soldering, and there is a risk of solder paste failure due to aging. Each device completes the solid crystal operation of a single chip, with many times of loading and unloading and a long cumulative time, which affects the actual solid crystal production capacity. In addition, if a certain device fails, it will affect the operation of the entire line and the production capacity achievement rate is low.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a loading and unloading device for connecting multi-head high-speed crystal bonding equipment, provided with a truss for easy support; including: a feeding section mechanism, installed on the left side of the upper surface of the truss, and an intermediate section mechanism is provided on the right side of the feeding section mechanism, and a discharging section mechanism is provided on the right side of the intermediate section mechanism, and the feeding section mechanism is provided with a spacing adjustment mechanism; a left cache docking station, installed on the rear side of the upper surface of the truss, and a right cache docking station is assembled on the right side of the left cache docking station, and the left cache docking station is provided with a lifting and lowering adjustment mechanism.

[0007] Preferably, the feed section mechanism and the truss form an integrated structure, and the middle section mechanism is located between the feed section mechanism and the discharge section mechanism, and the middle section mechanism and the left buffer docking station form a docking structure.

[0008] Through the above structure, when in use, it is possible to effectively form conveying control, form linked feeding and discharging, and form position conversion, thereby forming a buffer connection.

[0009] Preferably, the spacing adjustment mechanism includes a fixed side rail installed on the upper surface of the feeding section mechanism, and a sensor is installed on the rear side of the outer surface of the fixed side rail, and a roller is nested and rotatably arranged on the inner surface of the fixed side rail, and the fixed side rail is connected to a double-layer belt rail through the roller, and then the upper surface of the feeding section mechanism is connected to the adjusting side rail, and a slider 1 is installed on the lower surface of the adjusting side rail, and the lower surface of the slider 1 is slidably connected to a slide rail 1, and the outer surface of the adjusting side rail is connected to a rail width adjustment device, and a carrier plate is transported between the fixed side rail and the adjusting side rail.

[0010] Through the above structure, the spacing adjustment can be effectively controlled during use, and effective locking control can be formed to avoid tilting and dislocation, and the carrier plate can be controlled to form a stable movement.

[0011] Preferably, the feeding section mechanism and the fixed side track form an integrated structure, and the fixed side track is embedded in the outer surface of the sensor, and the fixed side track forms a rotating structure through rollers and a double-layer belt track, while the feeding section mechanism and the adjusting side track form a telescopic structure.

[0012] Through the above structure, the fixed side track can be effectively controlled to form induction control during use, and the use of rollers and double-layer belt tracks can be combined to improve the stability of the carrier movement and be used in conjunction with the adjustable side track.

[0013] Preferably, the adjustable side rail forms a limited sliding structure with the feeding section mechanism through a slider 1 and a slide rail 1, and the feeding section mechanism forms a locking type moving structure with the track adjusting side rail through a width adjustment device, while the fixed side rail and the adjusting side rail and the carrier plate form a conveying structure.

[0014] Through the above structure, the stability of the movement of the adjustment side rail is improved during use, and the stability of the adjustment is controlled by the width adjustment device to prevent slippage after adjustment.

[0015] Preferably, a synchronous wheel is rotatably provided on the upper surface of the middle section mechanism, and a synchronous belt is connected to the outer surface of the synchronous wheel, and a base plate is installed on the upper surface of the synchronous belt, and a slider 2 is installed on the lower surface of the base plate, and a slide rail 2 is slidably connected to the lower surface of the slider 2, and the slide rail 2 is installed on the middle section mechanism, and a support plate is installed on the upper surface of the base plate, and a rotating part is rotatably connected to the upper surface of the support plate, and a rotating frame is installed on the upper surface of the rotating part, and a limiter is installed on the outer surface of the support plate, and a limit block is installed on the outer surface of the rotating frame, and the limit block is attached to the outer surface of the limiter.

[0016] Through the above structure, the stability of the middle section mechanism can be effectively controlled during use, the position of the support plate can be adjusted, and the angle of the rotating part can be controlled.

[0017] Preferably, the middle section mechanism forms a moving structure with the base plate through a synchronous wheel and a synchronous belt, and the base plate forms a limited sliding structure with the middle section mechanism through a slider 2 and a slide rail 2, while the base plate and the support plate form an integrated structure.

[0018] Through the above structure, the synchronous belt can be effectively controlled to adjust the position of the support plate during use, so as to form a position docking with different docking platforms.

[0019] Preferably, the support plate forms a rotating structure with the rotating frame through a rotating member, and the rotating frame forms an angle limiting structure with the support plate through a limiting block and a limiter.

[0020] Through the above structure, the angle of the rotating member can be effectively controlled during use, so as to be transported to different positions.

[0021] Preferably, the lifting and adjusting mechanism includes a lifting cylinder installed on the upper surface of the left buffer transfer table. A lifting rod is telescopically connected to the inner surface of the lifting cylinder. A lifting top plate is installed on the upper surface of the lifting rod. Lifting side plates are installed on the outer surface of the lifting top plate. A slider three is installed on the outer surface of the lifting side plates. A sliding connecting rod is installed inside the slider three and is connected to a slide rail three. The slide rail three is installed on the inner surface of the left buffer transfer table in a limited manner.

[0022] With the above structure, during use, an effective lifting cooperation can be formed, and during buffer transfer, receiving and discharging at different heights can be achieved.

[0023] Preferably, the left buffer transfer table and the lifting top plate form a lifting structure through the lifting cylinder and the lifting rod. The lifting top plate and the left buffer transfer table form a limited telescopic structure through the lifting side plates, the slider three, and the slide rail three.

[0024] With the above structure, the lifting stability of the device is improved during use, preventing dislocation.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. For the loading and unloading device for the multi-head high-speed die bonding equipment in the connection operation, a left buffer transfer table and a right buffer transfer table are provided. Both of them are double-layer buffer transfer tables and can be switched up and down in cooperation with the upper and lower tracks, docking with the fixture working platform of the main equipment, enabling each single machine and each working table to discharge materials at any time and have products fed in at any time. This is to maximize the production efficiency of the die bonding operation of the equipment. At the same time, during the normal die bonding operation, the assembly line has sufficient time to send the products that have completed die bonding to the next-stage reflow soldering, avoiding the problem of solder paste aging, and also having sufficient time to replenish materials for the buffer transfer tables that need replenishment.

[0027] 2. The loading and unloading device for the multi-head high-speed die bonding equipment in the connection operation can flexibly configure the number of devices, and increase or decrease the devices according to production capacity, solder paste aging, floor area, and reflow soldering speed, etc. And each device is set to dock with the left buffer transfer table or the right buffer transfer table. While the device is performing die bonding operation, the products on the left buffer transfer table are exchanged with the assembly line and fed in and out. The time for the device to feed in and out materials is minimized, ensuring the die bonding production capacity of the device to the greatest extent. And in cooperation with the double-layer track design, the products after die bonding can be sent to the subsequent reflow soldering in the first time, avoiding the problem of solder paste timeliness. And in the parallel device operation mode, if a certain device in the line breaks down, it does not affect other devices. And in the single-sided assembly line mode, there is no line body occupation on the operation surface of the device, which is convenient for device operation, and at the same time reduces the total floor area of the device and the line body.

[0028] 3. The loading and unloading device of the multi-head high-speed crystal bonding equipment is equipped with a feeding section mechanism, an intermediate section mechanism, and a discharging section mechanism, which are combined into a single docking station, wherein the intermediate section track mechanism can be docked with the feeding section track mechanism and the discharging section track mechanism to realize normal line body flow, and can also be docked with the left buffer docking station and the right buffer docking station to realize the return of the product to the assembly line after crystal bonding and send it to the next assembly line until the next process; further, the position of the bottom plate is controlled by the use of the intermediate section mechanism in conjunction with the synchronous wheel and the synchronous belt, and the stability of the movement of the bottom plate is improved by the use of the slider 2 and the slide rail 2 installed on the bottom plate, and the stability of the rotation of the middle section mechanism is controlled by the use of the support plate, the cooperation with the rotating part and the rotating frame; further, the height of the fixed side track and the adjustment side track of the lifting top plate assembly is effectively controlled by the cooperation of the lifting cylinder and the lifting rod, and the double-layer belt tracks on the upper and lower sides are used to support and convey the carrier plate, improve the conveying stability, and form conveying according to different situations. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the three-dimensional structure of the multi-head high-speed die bonding equipment of the present invention;

[0030] Figure 2 It is a schematic diagram of the three-dimensional structure of the truss of the present invention;

[0031] Figure 3 It is a schematic diagram of the three-dimensional structure of the feeding section mechanism of the present invention;

[0032] Figure 4 It is a schematic diagram of the three-dimensional structure of the intermediate section mechanism of the present invention;

[0033] Figure 5 It is a bottom-up three-dimensional structural schematic diagram of the intermediate section mechanism of the present invention;

[0034] Figure 6 It is a schematic diagram of the three-dimensional structure of the discharging section mechanism of the present invention;

[0035] Figure 7 It is a partial cross-sectional three-dimensional structural schematic diagram of the left buffer docking station of the present invention.

[0036] In the figure: 1. Truss; 2. Feeding section mechanism; 3. Middle section mechanism; 4. Discharging section mechanism; 5. Left buffer docking station; 6. Right buffer docking station; 7. Fixed side track; 8. Sensor; 9. Roller; 10. Double-layer belt track; 11. Adjustable side track; 12. Slider 1; 13. Slide rail 1; 14. Track width adjustment device; 15. Carrier plate; 16. Synchronous wheel; 17. Synchronous belt; 18. Bottom plate; 19. Slider 2; 20. Slide rail 2; 21. Support plate; 22. Rotating part; 23. Rotating frame; 24. Limiter; 25. Limit block; 26. Lifting cylinder; 27. Lifting rod; 28. Lifting top plate; 29. ​​Lifting side plate; 30. Slider 3; 31. Slide rail 3. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figures 1-7 The present invention provides a technical solution: a loading and unloading device for connecting multi-head high-speed crystal bonding equipment, which is provided with a truss 1 for easy support.

[0039] Embodiment 1: Figure 1 , Figure 2 , Figure 3 and Figure 6The technical scheme shown in the invention provides the following technical scheme: a loading and unloading device for connecting multi-head high-speed crystal bonding equipment, disclosed: comprising: a feeding section mechanism 2, installed on the left side of the upper surface of the truss 1, and an intermediate section mechanism 3 is provided on the right side of the feeding section mechanism 2, and a discharging section mechanism 4 is provided on the right side of the intermediate section mechanism 3, and the feeding section mechanism 2 is provided with a spacing adjustment mechanism; a left buffer docking platform 5, installed on the rear side of the upper surface of the truss 1, and a right buffer docking platform 6 is assembled on the right side of the left buffer docking platform 5, and the left buffer docking platform 5 is provided with a lifting adjustment mechanism; the feeding section mechanism 2 and the truss 1 form an integrated structure, and the intermediate section mechanism 3 is located between the feeding section mechanism 2 and the discharging section mechanism 4, and the intermediate section mechanism 3 and the left buffer docking platform 5 form a docking structure; the spacing adjustment mechanism comprises a fixed side rail 7 installed on the upper surface of the feeding section mechanism 2, and a sensor 8 is installed on the rear side of the outer surface of the fixed side rail 7, and a roller 9 is nested and rotated on the inner surface of the fixed side rail 7, and the fixed side The track 7 is connected to a double-layer belt track 10 through a roller 9, and then the upper surface of the feeding section mechanism 2 is connected to an adjusting side track 11, and a slider 12 is installed on the lower surface of the adjusting side track 11, and the lower surface of the slider 12 is slidably connected to a slide rail 13, and the outer surface of the adjusting side track 11 is connected to a track width adjustment device 14, and a carrier plate 15 is transported between the fixed side track 7 and the adjusting side track 11; the feeding section mechanism 2 and the fixed side track 7 form an integrated structure, and the fixed side track 7 and the outer surface of the sensor 8 are embedded and installed, and the fixed side track 7 forms a rotating structure with the double-layer belt track 10 through the roller 9, and the feeding section mechanism 2 and the adjusting side track 11 form a telescopic structure; the adjusting side track 11 and the feeding section mechanism 2 form a limited sliding structure through the slider 12 and the slide rail 13, and the feeding section mechanism 2 forms a locking type moving structure with the adjusting side track 11 through the track width adjustment device 14, and the fixed side track 7 and the adjusting side track 11 and the carrier plate 15 form a conveying structure.

[0040] During use, the feeding section mechanism 2 assembled by the truss 1 is used to control the feeding of materials. The intermediate section mechanism 3 arranged on the side of the feeding section mechanism 2 is used for turnover, and the discharging section mechanism 4 on the side of the intermediate section mechanism 3 is used for discharging. In cooperation with the rotation of the intermediate section mechanism 3, the materials can be controlled to be transported to the left buffer connection table 5 or the right buffer connection table 6 through the carrier plate 15, and the output can be formed through the left buffer connection table 5 and the right buffer connection table 6. Before the feeding section mechanism 2 feeds materials, the position of the adjustable side track 11 can be effectively controlled and adjusted through the track width adjustment device 14 assembled by the feeding section mechanism 2. Through the cooperation of the slider one 12 and the slide rail one 13 assembled on the adjustable side track 11, the inclination of the adjustable side track 11 can be prevented. Through the cooperation of the adjusted adjustable side track 11 and the fixed side track 7, the double-layer belt track 10 on the rollers 9 respectively assembled by the two can be used to convey the carrier plate 15, and the movement position can be effectively controlled through the inductor 8 assembled on the fixed side track 7 to prevent excessive movement.

[0041] Embodiment 2: As Figure 1 , Figure 2 , Figure 4 and Figure 5 shown in the technical solution, on the basis of Embodiment 1, the rotational cooperation of the intermediate section mechanism 3 is further disclosed, and the specific content is as follows: A synchronous pulley 16 rotates on the upper surface of the intermediate section mechanism 3, and a synchronous belt 17 is connected to the outer surface of the synchronous pulley 16. A bottom plate 18 is installed on the upper surface of the synchronous belt 17. A slider two 19 is installed on the lower surface of the bottom plate 18. At the same time, the lower surface of the slider two 19 is slidably connected to a slide rail two 20, and the slide rail two 20 is installed on the intermediate section mechanism 3. A support plate 21 is installed on the upper surface of the bottom plate 18. A rotating member 22 is rotatably connected to the upper surface of the support plate 21. At the same time, a rotating frame 23 is installed on the upper surface of the rotating member 22. A limiter 24 is installed on the outer surface of the support plate 21. A limit block 25 is installed on the outer surface of the rotating frame 23, and the limit block 25 is attached to the outer surface of the limiter 24; The intermediate section mechanism 3 and the bottom plate 18 form a moving structure through the synchronous pulley 16 and the synchronous belt 17, and the bottom plate 18 and the intermediate section mechanism 3 form a limiting sliding structure through the slider two 19 and the slide rail two 20. At the same time, the bottom plate 18 and the support plate 21 form an integral structure; The support plate 21 and the rotating frame 23 form a rotating structure through the rotating member 22, and the rotating frame 23 and the support plate 21 form an angular limiting structure through the limit block 25 and the limiter 24.

[0042] The material on the feeding section mechanism 2 is conveyed to the end, and the intermediate section mechanism 3 is required to form a bearing. The intermediate section mechanism 3 is also provided with a fixed side track 7 and an adjustable side track 11 to form a cooperative bearing for the carrier plate 15. After bearing the carrier plate 15 conveyed from the feeding section mechanism 2, an electric motor is assembled in cooperation with the intermediate section mechanism 3. The synchronous pulley 16 is controlled to drive the synchronous belt 17 to rotate, and the position of the bottom plate 18 is controlled, so as to control the cooperation between the second slider 19 installed on the bottom plate 18 and the second slide rail 20, control the stability of the position adjustment of the bottom plate 18, and through the conveyance of the bottom plate 18, the position of the installed support plate 21 is synchronously controlled, so as to control the rotation of the rotating part 22, adjust the angle of the rotating frame 23, and cooperate with the use of the stopper 24 and the limit block 25 to improve the stability of the angle control, so as to be docked to the position of the left buffer transfer table 5 or the right buffer transfer table 6 according to the use requirements, and improve the stability of the docking.

[0043] Embodiment 3: As Figure 1 , Figure 2 and Figure 7 shown in the technical solution, on the basis of Embodiment 2, the height receiving adjustment of the left buffer transfer table 5 is also disclosed, and the specific content is as follows: The lifting adjustment mechanism includes a lifting cylinder 26 installed on the upper surface of the left buffer transfer table 5, and a lifting rod 27 is telescopically connected to the inner surface of the lifting cylinder 26, and a lifting top plate 28 is installed on the upper surface of the lifting rod 27. At the same time, a lifting side plate 29 is installed on the outer surface of the lifting top plate 28. At the same time, a third slider 30 is installed on the outer surface of the lifting side plate 29, and a third slide rail 31 is slidably connected to the inner surface of the third slider 30, and the third slide rail 31 is limited and installed on the inner surface of the left buffer transfer table 5; The left buffer transfer table 5 forms a lifting structure through the lifting cylinder 26 and the lifting rod 27 and the lifting top plate 28, and the lifting top plate 28 forms a limit telescopic structure with the left buffer transfer table 5 through the lifting side plate 29, the third slider 30 and the third slide rail 31.

[0044] When the left buffer transfer table 5 or the right buffer transfer table 6 forms a docking connection with the intermediate section mechanism 3, the height of the lifting rod 27 is controlled by the lifting cylinder 26 assembled with the two respectively, so as to form a height adjustment for the lifting top plate 28 and the lifting side plate 29, and cooperate with the use of the third slider 30 and the third slide rail 31 to control the stability of the height adjustment.

[0045] And in the equipment material demand, when there is a material demand for the left buffer transfer table 5 or the right buffer transfer table 6 of a certain equipment, the discharging section mechanism 4 will send a product to be die-bonded to the position of the feeding section mechanism 2, and through the adjustment of the intermediate section mechanism 3, the product will be received from the left side of the feeding section mechanism 2, and moved and rotated through the intermediate section mechanism 3. According to which of the left buffer transfer table 5 or the right buffer transfer table 6 issues the request, it will move to the left buffer transfer table 5 or the right buffer transfer table 6, that is, the action of the product to be die-bonded flowing to the buffer transfer table on the production line is completed.

[0046] When the device has a discharging requirement, when there is a product discharging requirement on the lower track of the left buffer transfer table 5 or the right buffer transfer table 6 of a certain device, the left buffer transfer table 5 or the right buffer transfer table 6 gives a discharging request signal, thereby controlling the middle section mechanism 3 of the assembly line connected to this device to move to the middle position, rotate 90°, and control the movement position of the middle section mechanism 3 according to which of the left buffer transfer table 5 or the right buffer transfer table 6 has the discharging requirement, so as to control the product on the left buffer transfer table 5 or the right buffer transfer table 6 to discharge onto the middle section mechanism 3, and according to the rotation and movement of the middle section mechanism 3, dock it to the discharging section mechanism 4 for discharging, thereby cooperating with the product to be conveyed to the discharging section mechanism 4 until the next assembly line and the next process, thus completing the discharging.

[0047] When there is neither a feeding request nor a discharging request on the left buffer transfer table 5 or the right buffer transfer table 6 of a certain device, but there is a feeding requirement on the left buffer transfer table 5 or the right buffer transfer table 6 of a certain device behind or there is a discharging request on the previous assembly line, the current feeding section mechanism 2 of the assembly line receives the product from the discharging section mechanism 4 of the previous section, and cooperates with the middle section mechanism 3 to move left to receive the product from the feeding section mechanism 2, and moves to the right through the middle section mechanism 3 to dock with the discharging section mechanism 4, so as to discharge to the discharging section mechanism 4 to complete the assembly line feeding.

[0048] The content not detailed in this specification belongs to the prior art well-known to those skilled in the art.

[0049] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A loading and unloading device for connecting multiple high-speed die-bonding equipment, provided with a truss (1) for easy support; It is characterized in that include: A feeding section mechanism (2) is installed on the left side of the upper surface of the truss (1), and an intermediate section mechanism (3) is arranged on the right side of the feeding section mechanism (2), and an outlet section mechanism (4) is arranged on the right side of the intermediate section mechanism (3), and the feeding section mechanism (2) is provided with a spacing adjustment mechanism; The left buffer docking platform (5) is installed on the rear side of the upper surface of the truss (1), and the right buffer docking platform (6) is assembled on the right side of the left buffer docking platform (5), and the left buffer docking platform (5) is provided with a lifting and adjusting mechanism.

2. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 1 is characterized in that: The feed section mechanism (2) and the truss (1) form an integrated structure, and the middle section mechanism (3) is located between the feed section mechanism (2) and the discharge section mechanism (4), and the middle section mechanism (3) and the left buffer docking platform (5) form a docking structure.

3. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 1 is characterized in that: The spacing adjustment mechanism comprises a fixed side rail (7) installed on the upper surface of the feeding section mechanism (2), and a sensor (8) is installed on the rear side of the outer surface of the fixed side rail (7), and a roller (9) is nested and rotatable on the inner surface of the fixed side rail (7), and the fixed side rail (7) is connected to a double-layer belt rail (10) through the roller (9), and then the upper surface of the feeding section mechanism (2) is connected to an adjustment side rail (11), and a slider (12) is installed on the lower surface of the adjustment side rail (11), and the lower surface of the slider (12) is slidably connected to a slide rail (13), and the outer surface of the adjustment side rail (11) is connected to a rail width adjustment device (14), and a carrier plate (15) is transported between the fixed side rail (7) and the adjustment side rail (11).

4. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 3 is characterized in that: The feeding section mechanism (2) and the fixed side track (7) form an integrated structure, and the fixed side track (7) and the outer surface of the sensor (8) are embedded and installed, and the fixed side track (7) forms a rotating structure through the roller (9) and the double-layer belt track (10), and the feeding section mechanism (2) and the adjustment side track (11) form a telescopic structure.

5. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 3 is characterized in that: The adjusting side rail (11) forms a limited sliding structure with the feeding section mechanism (2) through a slider (12) and a slide rail (13), and the feeding section mechanism (2) forms a locking type moving structure with the adjusting side rail (11) through a track width adjusting device (14), while the fixed side rail (7) and the adjusting side rail (11) and the carrier plate (15) form a conveying structure.

6. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 1, characterized in that: The upper surface of the middle section mechanism (3) is rotatably provided with a synchronous wheel (16), and the outer surface of the synchronous wheel (16) is connected with a synchronous belt (17), and the upper surface of the synchronous belt (17) is installed with a bottom plate (18), and the lower surface of the bottom plate (18) is installed with a second slider (19), and the lower surface of the second slider (19) is slidably connected with a second slide rail (20), and the second slide rail (20) is installed on the middle section mechanism (3), and the upper surface of the bottom plate (18) is installed with a support plate (21), and the upper surface of the support plate (21) is rotatably connected with a rotating member (22), and the upper surface of the rotating member (22) is installed with a rotating frame (23), and the outer surface of the support plate (21) is installed with a limiter (24), and the outer surface of the rotating frame (23) is installed with a limit block (25), and the limit block (25) is attached to the outer surface of the limiter (24).

7. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 6 is characterized in that: The intermediate section mechanism (3) forms a movable structure with a base plate (18) through a synchronous wheel (16) and a synchronous belt (17), and the base plate (18) forms a limited sliding structure with the intermediate section mechanism (3) through a second slide block (19) and a second slide rail (20), while the base plate (18) and a support plate (21) form an integrated structure.

8. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 6, characterized in that: The support plate (21) forms a rotating structure with the rotating frame (23) through the rotating member (22), and the rotating frame (23) forms an angle limiting structure with the support plate (21) through the limiting block (25) and the limiter (24).

9. The loading and unloading device for connecting multiple high-speed die-bonding equipment according to claim 1, characterized in that: The lifting and adjusting mechanism comprises a lifting cylinder (26) installed on the upper surface of the left cache docking platform (5), and the inner surface of the lifting cylinder (26) is telescopically connected with a lifting rod (27), and the upper surface of the lifting rod (27) is installed with a lifting top plate (28), and the outer surface of the lifting top plate (28) is installed with a lifting side plate (29), and the outer surface of the lifting side plate (29) is installed with a slider three (30), and the inner surface of the slider three (30) is slidably connected to the rod with a slide rail three (31), and the slide rail three (31) is limitedly installed on the inner surface of the left cache docking platform (5).

10. The loading and unloading device for in-line operation of multi-head high-speed die bonding equipment according to claim 9, characterized in that: The left cache docking platform (5) forms a lifting structure with a lifting top plate (28) through a lifting cylinder (26) and a lifting rod (27), and the lifting top plate (28) forms a limited telescopic structure with the left cache docking platform (5) through a lifting side plate (29), a sliding block three (30) and a sliding rail three (31).

Images