Wafer handling device and method for monitoring wafer handling device

Abstract

A wafer handling apparatus includes a housing, a loading port, a robot arm, a first sensor group, and a processing unit. The loading port is arranged at one side of the shell and is configured to receive a wafer container, and the wafer container is configured to accommodate at least one semiconductor wafer. The mechanical arm is arranged in the shell and is configured to move the semiconductor wafer into or out of the wafer container. The mechanical arm comprises a clamping part and a moving part. The clamping portion is configured to clamp a semiconductor wafer. The moving part is connected with the clamping part and is configured to move the clamping part relative to the loading port. The first sensor group is arranged at the loading port. The first sensor group includes at least one first sensor. The first sensor is configured to acquire a first height level of the nip. The processing unit is in signal connection with the first sensor group. The wafer handling device can effectively reduce the chance of damaging the semiconductor wafer when the clamping part of the mechanical arm moves.

Description

Technical Field

[0001] The present invention relates to a wafer handling device and a method for monitoring a wafer handling device. Background Art

[0002] With the continuous improvement of people's living standards, electronic products have become increasingly important in our daily lives. Facing the huge market of electronic products, major manufacturers have all made efforts to enhance the market competitiveness of their own brands.

[0003] In fact, in addition to strengthening the research and development of the functions and performance of electronic products, how to effectively improve the operation efficiency of the production process of electronic products, thereby reducing the production cost of electronic products, is undoubtedly an important topic that manufacturers are quite concerned about. Summary of the Invention

[0004] One object of the present invention is to provide a wafer handling device that can effectively reduce the chance of damage to a semiconductor wafer caused by the clamping portion of a robotic arm during movement.

[0005] According to an embodiment of the present invention, a wafer handling device includes a housing, a loading port, a robotic arm, a first sensor group, and a processing unit. The loading port is provided on one side of the housing and is configured to receive a wafer container, and the wafer container is configured to accommodate at least one semiconductor wafer. The robotic arm is provided in the housing and is configured to move the semiconductor wafer into or out of the wafer container. The robotic arm includes a clamping portion and a moving portion. The clamping portion is configured to clamp the semiconductor wafer. The moving portion is connected to the clamping portion and is configured to move the clamping portion relative to the loading port. The first sensor group is provided at the loading port. The first sensor group includes at least one first sensor. The first sensor is configured to obtain a first height level of the clamping portion. The processing unit is signal-connected to the first sensor group.

[0006] In one or more embodiments of the present invention, the above-mentioned first sensor is configured to measure a first distance of the clamping portion.

[0007] In one or more embodiments of the present invention, the above-mentioned first sensor group further includes at least one second sensor. The second sensor is configured to obtain a first azimuth level of the clamping portion.

[0008] In one or more embodiments of the present invention, the above-mentioned second sensor includes at least two first sub-sensors, and each of the first sub-sensors is configured to measure a second distance of the clamping portion, and the processing unit is configured to calculate a first tilt angle of the clamping portion according to a first difference between the measured second distances.

[0009] In one or more embodiments of the present invention, the above-mentioned first sub-sensors are spaced apart from each other and are provided at the same level.

[0010] In one or more embodiments of the present invention, the above-mentioned wafer handling device further includes a second sensor group. The second sensor group is disposed within the housing and away from the load port. The second sensor group is signal-connected to the processing unit and includes at least one third sensor. The third sensor is configured to obtain a second height level of the clamping portion.

[0011] In one or more embodiments of the present invention, the above-mentioned third sensor is configured to measure a third distance of the clamping portion.

[0012] In one or more embodiments of the present invention, the above-mentioned second sensor group further includes at least one fourth sensor. The fourth sensor is configured to obtain a second orientation level of the clamping portion.

[0013] In one or more embodiments of the present invention, the above-mentioned fourth sensor includes at least two second sub-sensors. Each of the second sub-sensors is configured to measure a fourth distance of the clamping portion. The processing unit is configured to calculate a second tilt angle of the clamping portion based on a second difference between the measured fourth distances.

[0014] In one or more embodiments of the present invention, the above-mentioned second sub-sensors are spaced apart from each other and disposed at the same level.

[0015] One object of the present invention is to provide a method for monitoring a wafer handling device, which can effectively reduce the chance of damage to a semiconductor wafer caused by the clamping portion of a robotic arm during movement.

[0016] According to an embodiment of the present invention, a method for monitoring a wafer handling device includes: providing a first sensor group at a load port, the load port being disposed on one side of a housing of the wafer handling device, the load port being configured to receive a wafer container, the wafer container being configured to accommodate at least one semiconductor wafer, the housing being configured to accommodate a robotic arm therein, the robotic arm being configured to move the semiconductor wafer into or out of the wafer container, the robotic arm including a clamping portion and a moving portion, the clamping portion being configured to clamp the semiconductor wafer, the moving portion being connected to the clamping portion and being configured to move the clamping portion relative to the load port; obtaining a first height level of the clamping portion with the first sensor group; receiving a first signal from the first sensor group; and analyzing the first signal and determining whether the obtained first height level is within a first preset range.

[0017] In one or more embodiments of the present invention, the above-mentioned first sensor group measures a first vertical distance of the clamping portion.

[0018] In one or more embodiments of the present invention, the above-mentioned method for monitoring a wafer handling device further includes: obtaining a first orientation level of the clamping portion with the first sensor group; receiving a second signal from the first sensor group; and analyzing the second signal and determining whether the obtained first orientation level is within a second preset range.

[0019] In one or more embodiments of the present invention, the above-mentioned obtaining of the first azimuth level includes: measuring at least two second vertical distances of the clamping part. Analyzing the second signal includes: calculating a first inclination angle of the clamping part according to a first difference between the measured second vertical distances.

[0020] In one or more embodiments of the present invention, the above-mentioned method for monitoring a wafer handling device further includes: defining a reference area, the reference area being located inside the housing and away from the loading port; providing a second sensor group in the reference area; moving the clamping part to the reference area; obtaining a second height level of the clamping part with the second sensor group; receiving a third signal from the second sensor group; and analyzing the third signal and determining whether the obtained second height level is within a third preset range.

[0021] In one or more embodiments of the present invention, the above-mentioned second sensor group measures a third vertical distance of the clamping part.

[0022] In one or more embodiments of the present invention, the above-mentioned method for monitoring a wafer handling device further includes: obtaining a second azimuth level of the clamping part with the second sensor group; receiving a fourth signal from the second sensor group; and analyzing the fourth signal and determining whether the obtained second azimuth level is within a fourth preset range.

[0023] In one or more embodiments of the present invention, the above-mentioned obtaining of the second azimuth level includes: measuring at least two fourth vertical distances of the clamping part. Analyzing the fourth signal includes: calculating a second inclination angle of the clamping part according to a second difference between the measured fourth vertical distances.

[0024] In one or more embodiments of the present invention, the above-mentioned first sensor group includes a plurality of first distance sensors, the second sensor group includes a plurality of second distance sensors, and a first position arrangement of the first distance sensors is the same as a second position arrangement of the second distance sensors.

[0025] The above embodiments of the present invention have at least the following advantages:

[0026] (1) Since both the vertical height and the levelness of the clamping part of the robotic arm can be monitored, the chance of the clamping part damaging the semiconductor wafer during movement can be effectively reduced.

[0027] (2) Since the first sensor group located at the loading port can be verified by the second sensor group located in the reference area for normal operation, the chance of the clamping part of the robotic arm damaging the semiconductor wafer during movement will be effectively reduced. Description of the Drawings

[0028] Figure 1FIG. 0 is a side cross-sectional view of a wafer handling apparatus according to an embodiment of the present invention.

[0029] Figure 2 FIG. Figure 1 is a cross-sectional view taken along line A-A.

[0030] Figure 3 FIG. Figure 1 is a top view of the wafer handling apparatus.

[0031] Figure 4 FIG. Figure 3 is a cross-sectional view taken along line B-B.

[0032] Figure 5 FIG. 22 is a flowchart illustrating a method for monitoring a wafer handling apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION

[0033] The following will disclose multiple embodiments of the present invention with reference to the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details are not intended to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and elements will be illustrated in a simple schematic manner in the drawings, and in all the drawings, the same reference numerals will be used to represent the same or similar elements. And if possible in practice, the features of different embodiments can be applied interactively.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings, which can be understood by those skilled in the art. Further, the definitions of the above terms in commonly used dictionaries should be interpreted as having the same meaning as that in the relevant fields of the present invention. Unless specifically defined, these terms will not be construed as idealized or overly formal meanings.

[0035] Please refer to Figures 1 to 2 . Figure 1 FIG. 37 is a side cross-sectional view of a wafer handling apparatus 100 according to an embodiment of the present invention. Figure 2 FIG. Figure 1 is a cross-sectional view taken along line A-A. In this embodiment, as Figures 1 to 2As shown, a wafer handling device 100 includes a housing 110, a loading port 120, a robotic arm 130, a first sensor group 140, and a processing unit 150. The loading port 120 is disposed on one side of the housing 110 and configured to receive a wafer container 200, which is configured to accommodate at least one semiconductor wafer 210. The robotic arm 130 is disposed within the housing 110 and configured to move the semiconductor wafer 210 into or out of the wafer container 200. The robotic arm 130 includes a gripping portion 131 and a moving portion 132. The gripping portion 131 is configured to grip the semiconductor wafer 210. The moving portion 132 is connected to the gripping portion 131 and configured to move the gripping portion 131 relative to the loading port 120, and thus also move the semiconductor wafer 210. The first sensor group 140 is disposed at the loading port 120. The processing unit 150 is signal-connected to the first sensor group 140. The first sensor group 140 includes at least one first sensor 141 and at least one second sensor 142. The first sensor 141 is configured to obtain a first height level of the gripping portion 131, while the second sensor 142 is configured to obtain a first azimuth level of the gripping portion 131. For example, as Figures 1 to 2 shown, the first sensor 141 and the second sensor 142 define a space SP therein such that the gripping portion 131 of the robotic arm 130 can pass through and reach the wafer container 200. As Figures 1 to 2 shown, when the gripping portion 131 is moved to reach the wafer container 200, the first sensor 141 and the second sensor 142 are located on opposite sides of the gripping portion 131. In other embodiments, according to the actual situation, the first sensor 141 and the second sensor 142 may be located on the same side relative to the gripping portion 131.

[0036] Specifically, as Figure 2 shown, the first sensor 141 is configured to vertically measure a first distance D1 of the gripping portion 131. In practical applications, after the robotic arm 130 completes position calibration, the first sensor 141 measures the first distance D1 of the gripping portion 131 to generate a reference value of the first distance D1. Subsequently, when the robotic arm 130 is used to move the semiconductor wafer 210 into or out of the wafer container 200, the first sensor 141 measures the first distance D1 of the gripping portion 131 and transmits a first signal to the processing unit 150 for analysis. When the processing unit 150 analyzes that the measured first distance D1 exceeds a first preset range compared to the reference value of the first distance D1, an alarm will be activated to attract the attention of the user. Further, when the processing unit 150 analyzes that the measured first distance D1 exceeds the first preset range by a certain degree compared to the reference value of the first distance D1, for safety reasons, the wafer handling device 100 will stop operating in real time. In this way, the vertical height of the gripping portion 131 can be monitored, and the chance of the gripping portion 131 of the robotic arm 130 damaging the semiconductor wafer 210 during movement will be effectively reduced.

[0037] Furthermore, as Figure 2 shown, the second sensor 142 includes at least two first sub-sensors 1421, and each of the first sub-sensors 1421 is configured to vertically measure a second distance D2 of the clamping portion 131. The processing unit 150 is configured to calculate a first tilt angle a of the clamping portion 131 according to a first difference between the measured second distances D2. In practical applications, similarly, after the robotic arm 130 completes position calibration, the first sub-sensors 1421 are used to measure the second distance D2 of the clamping portion 131. Then, the processing unit 150 calculates the first tilt angle a according to the first difference between the measured second distances D2 to generate a reference value of the first tilt angle a. Subsequently, when the robotic arm 130 is used to move the semiconductor wafer 210 into or out of the wafer container 200, the first sub-sensors 1421 of the second sensor 142 measure the second distance D2 of the clamping portion 131 and transmit a second signal to the processing unit 150 for analysis. When the processing unit 150 analyzes that the first tilt angle a calculated from the measured second distance D2 exceeds a second preset range compared with the reference value of the first tilt angle a, the alarm will be activated to attract the user's attention. Further, when the processing unit 150 analyzes that the calculated first tilt angle a exceeds the second preset range by a certain degree compared with the reference value of the first tilt angle a, for safety considerations, the wafer handling device 100 will stop operating in real time. In this way, the levelness of the clamping portion 131 can be monitored, and the chance of damaging the semiconductor wafer 210 when the clamping portion 131 of the robotic arm 130 moves will be effectively reduced.

[0038] To improve the accuracy of calculating the first tilt angle a, as Figure 2 shown, the first sub-sensors 1421 are spaced apart from each other and arranged at the same level.

[0039] Please refer to Figures 3 to 4 . Figure 3 To illustrate Figure 1 a top view of the wafer handling device 100. Figure 4 To illustrate a cross-sectional view along line B-B of Figure 3 . In the present embodiment, as Figures 3 to 4As shown, the housing 110 defines a reference area Z therein, and the reference area Z is away from the loading port 120. Furthermore, the wafer handling device 100 further includes a second sensor group 160. The second sensor group 160 is disposed in the reference area Z and is signal-connected to the processing unit 150. The second sensor group 160 includes at least one third sensor 161 and at least one fourth sensor 162. The third sensor 161 is configured to obtain the second height level of the clamping portion 131, and the fourth sensor 162 is configured to obtain the second orientation level of the clamping portion 131. For the sake of simplicity of the drawings, the first sensor 141 and the third sensor 161 are not shown in Figure 3 . In practical applications, after the robotic arm 130 is used several times or within a certain period of time to move the semiconductor wafer 210 into or out of the wafer container 200, the robotic arm 130 can move the clamping portion 131 to the reference area Z to allow the second sensor group 160 to check its height level and orientation level to verify whether the first sensor group 140 located at the loading port 120 is operating properly. For example, as Figure 3 shown, the clamping portion 131 moves from the position shown by the dashed line to the position shown by the solid line, and the position shown by the solid line is at least partially within the reference area Z.

[0040] Specifically, as Figure 4 shown, the third sensor 161 is configured to vertically measure the third distance D3 of the clamping portion 131. In practical applications, after the first sensor 141 of the first sensor group 140 obtains the reference value of the first distance D1, the clamping portion 131 of the robotic arm 130 is moved to the reference area Z, and the third sensor 161 measures the third distance D3 of the clamping portion 131 to generate a reference value of the third distance D3. Subsequently, after the robotic arm 130 is used several times or within a certain period of time to move the semiconductor wafer 210 into or out of the wafer container 200, the robotic arm 130 moves the clamping portion 131 to the reference area Z, and the third sensor 161 measures the third distance D3 of the clamping portion 131 and transmits a third signal to the processing unit 150 for analysis. When the processing unit 150 analyzes that the measured third distance D3 exceeds the third preset range compared with the reference value of the third distance D3, the alarm will be activated to attract the attention of the user. Further, when the processing unit 150 analyzes that the measured third distance D3 exceeds the third preset range by a certain degree compared with the reference value of the third distance D3, for safety considerations, the wafer handling device 100 will stop operating in real time. In this way, it can be verified whether the first sensor 141 of the first sensor group 140 is operating properly, and the chance of the clamping portion 131 of the robotic arm 130 damaging the semiconductor wafer 210 during movement will be effectively reduced.

[0041] Furthermore, as Figure 4As shown, the fourth sensor 162 includes at least two second sub-sensors 1621, and each of the second sub-sensors 1621 is configured to vertically measure a fourth distance D4 of the clamping portion 131. The processing unit 150 is configured to calculate a second tilt angle b of the clamping portion 131 according to a second difference between the measured fourth distances D4. In practical applications, similarly, after the second sensor 142 of the first sensor group 140 obtains a reference value of the first tilt angle a, the clamping portion 131 of the robotic arm 130 is moved to the reference area Z, and then the second sub-sensor 1621 measures the fourth distance D4 of the clamping portion 131. Then, the processing unit 150 calculates the second tilt angle b according to the second difference between the measured fourth distances D4 to generate a reference value of the second tilt angle b. Subsequently, after the robotic arm 130 is used several times or within a certain period of time to move the semiconductor wafer 210 into or out of the wafer container 200, the robotic arm 130 moves the clamping portion 131 to the reference area Z, and the second sub-sensor 1621 of the fourth sensor 162 measures the fourth distance D4 of the clamping portion 131 and transmits a fourth signal to the processing unit 150 for analysis. When the processing unit 150 analyzes that the second tilt angle b calculated from the measured fourth distance D4 exceeds a fourth preset range compared with the reference value of the second tilt angle b, the alarm will be activated to attract the attention of the user. Further, when the processing unit 150 analyzes that the calculated second tilt angle b exceeds the fourth preset range by a certain degree compared with the reference value of the second tilt angle b, for safety considerations, the wafer handling device 100 will stop operating in real time. In this way, it can be verified whether the second sensor 142 of the first sensor group 140 is operating normally, and the chance of damaging the semiconductor wafer 210 when the clamping portion 131 of the robotic arm 130 moves can be effectively reduced.

[0042] To improve the accuracy of calculating the second tilt angle b, as Figure 4 shown, the second sub-sensors 1621 are spaced apart from each other and arranged at the same level.

[0043] Further, to enable the second sensor group 160 to verify the first sensor group 140 more accurately, as Figure 2 and Figure 4 shown, the first position arrangement of the first sensor 141 and the first sub-sensor 1421 of the second sensor 142 is the same as the second position arrangement of the third sensor 161 and the second sub-sensor 1621 of the fourth sensor 162.

[0044] Please refer to Figure 5 。 Figure 5FIG. 500 is a flow chart showing a method of monitoring a wafer handling apparatus according to an embodiment of the present invention. In addition to the wafer handling apparatus 100 described above, another aspect of the present invention is to provide a method 500 of monitoring a wafer handling apparatus. As Figure 5 shown, the method 500 of monitoring a wafer handling apparatus includes the following steps (it should be understood that the steps mentioned in some embodiments, unless specifically stated in order, can be adjusted in order according to actual needs, and even can be executed simultaneously or partially simultaneously):

[0045] Step 510: Provide a first sensor group 140 at the load port 120, and the load port 120 is provided on one side of the housing 110 of the wafer handling apparatus 100.

[0046] Step 511: Obtain a first height level of the clamping portion 131 with the first sensor group 140.

[0047] Step 512: Receive a first signal from the first sensor group 140.

[0048] Step 513: Analyze the first signal and determine whether the obtained first height level is within a first preset range.

[0049] Step 514: Obtain a first orientation level of the clamping portion 131 with the first sensor group 140.

[0050] Step 515: Receive a second signal from the first sensor group 140.

[0051] Step 516: Analyze the second signal and determine whether the obtained first orientation level is within a second preset range.

[0052] Step 520: Define a reference area Z, and the reference area Z is located within the housing 110 and away from the load port 120.

[0053] Step 521: Provide a second sensor group 160 within the reference area Z.

[0054] Step 522: Move the clamping portion 131 to the reference area Z.

[0055] Step 523: Obtain a second height level of the clamping portion 131 with the second sensor group 160.

[0056] Step 524: Receive a third signal from the second sensor group 160.

[0057] Step 525: Analyze the third signal and determine whether the obtained second height level is within a third preset range.

[0058] Step 526: Obtain a second orientation level of the clamping portion 131 with the second sensor group 160.

[0059] Step 527: Receive a fourth signal from the second sensor group 160.

[0060] Step 528: Analyze the fourth signal and determine whether the obtained second azimuth level is within a fourth preset range.

[0061] In summary, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:

[0062] (1) Since the vertical height and levelness of the clamping part of the robotic arm can be monitored, the chance of damage to the semiconductor wafer caused by the clamping part during movement can be effectively reduced.

[0063] (2) Since the first sensor group located at the loading port can be verified by the second sensor group located in the reference area for normal operation, the chance of damage to the semiconductor wafer caused by the clamping part of the robotic arm during movement will be effectively reduced.

[0064] Although the present invention has been disclosed as above in the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

[0065]

Symbol Description

[0066] 100: Wafer handling device

[0067] 110: Housing

[0068] 120: Loading port

[0069] 130: Robotic arm

[0070] 131: Clamping part

[0071] 132: Moving part

[0072] 140: First sensor group

[0073] 141: First sensor

[0074] 142: Second sensor

[0075] 1421: First sub-sensor

[0076] 150: Processing unit

[0077] 160: Second sensor group

[0078] 161: Third sensor

[0079] 162: Fourth sensor

[0080] 1621: Second sensor

[0081] 200: Wafer container

[0082] 210: Semiconductor wafer

[0083] 500: Method for monitoring wafer handling apparatus

[0084] 510: Step

[0085] 511: Step

[0086] 512: Step

[0087] 513: Step

[0088] 514: Step

[0089] 515: Step

[0090] 516: Step

[0091] 520: Step

[0092] 521: Step

[0093] 522: Step

[0094] 523: Step

[0095] 524: Step

[0096] 525: Step

[0097] 526: Step

[0098] 527: Step

[0099] 528: Step

[0100] A - A, B - B: Line segment

[0101] a: First tilt angle

[0102] b: Second tilt angle

[0103] D1: First distance

[0104] D2: Second distance

[0105] D3: Third distance

[0106] D4: Fourth distance

[0107] SP: Space

[0108] Z: Reference area.

Claims

1. A wafer handling device, characterized in that: Include: case; a loading port disposed on a side of the housing and configured to receive a wafer container configured to accommodate at least one semiconductor wafer; A robot arm is disposed in the housing and configured to move the semiconductor wafer into or out of the wafer container, the robot arm comprising: A clamping portion configured to clamp the semiconductor wafer; as well as a moving part connected to the clamping part and configured to move the clamping part relative to the loading port; a first sensor group disposed at the loading port, the first sensor group comprising: At least one first sensor is configured to obtain a first height level of the clamping portion; and a processing unit is signal-connected to the first sensor group.

2. The wafer operation device according to claim 1, characterized in that: The first sensor is configured to measure a first distance of the clamping portion.

3. The wafer operation device according to claim 1, characterized in that: The first sensor group further comprises: At least one second sensor is configured to obtain a first position level of the clamping portion.

4. The wafer operation device according to claim 3, characterized in that: The second sensor includes at least two first sub-sensors, each of the plurality of first sub-sensors is configured to measure a second distance of the clamping portion, and the processing unit is configured to calculate a first tilt angle of the clamping portion according to a first difference between the measured plurality of second distances.

5. The wafer operation device according to claim 4, characterized in that: The plurality of first sub-sensors are spaced apart from each other and disposed at the same level.

6. The wafer operation device according to claim 1, characterized in that: Also includes: The second sensor group is disposed in the shell and away from the loading port. The second sensor group is signal-connected to the processing unit and includes at least one third sensor configured to obtain a second height level of the clamping portion.

7. The wafer operation device according to claim 6, characterized in that: The third sensor is configured to measure a third distance of the clamping portion.

8. The wafer operation device according to claim 6, characterized in that: The second sensor group further comprises: At least one fourth sensor is configured to obtain a second position level of the clamping portion.

9. The wafer operation device according to claim 8, characterized in that: The fourth sensor includes at least two second sub-sensors, each of the plurality of second sub-sensors is configured to measure a fourth distance of the clamping portion, and the processing unit is configured to calculate a second tilt angle of the clamping portion according to a second difference between the measured fourth distances.

10. The wafer operation device according to claim 9, characterized in that: The plurality of second sub-sensors are spaced apart from each other and disposed at the same level.

11. A method for monitoring a wafer handling device, characterized in that: Include: A first sensor group is provided at a loading port, the loading port being disposed at a side of a housing of a wafer handling device, wherein the loading port is configured to receive a wafer container, the wafer container being configured to contain at least one semiconductor wafer, the housing being configured to accommodate a robot arm therein, the robot arm being configured to move the semiconductor wafer into or out of the wafer container, the robot arm comprising: a clamping portion configured to clamp the semiconductor wafer; and a moving part connected to the clamping part and configured to move the clamping part relative to the loading port; and obtaining a first height level of the clamping part by using the first sensor group; receiving a first signal from the first sensor group; and The first signal is analyzed to determine whether the acquired first height level is within a first preset range.

12. The method for monitoring a wafer operation device according to claim 11, characterized in that: The first sensor group measures a first vertical distance of the clamping portion.

13. The method for monitoring a wafer operation device according to claim 11, characterized in that: Also includes: Acquiring a first position level of the clamping portion by using the first sensor group; receiving a second signal from the first sensor group; and The second signal is analyzed to determine whether the acquired first orientation level is within a second preset range.

14. The method for monitoring a wafer operation device according to claim 13, characterized in that: Acquiring the first orientation level includes: measuring at least two second vertical distances of the clamping portion, Analyzing the second signal comprises: A first inclination angle of the clamping portion is calculated according to the measured first differences between the plurality of second vertical distances.

15. The method for monitoring a wafer operation device according to claim 11, characterized in that: Also includes: defining a reference area, the reference area being located within the housing and away from the loading port; providing a second sensor set within the reference area; moving the clamping portion to the reference area; acquiring a second height level of the clamping portion by using the second sensor group; receiving a third signal from the second sensor group; as well as The third signal is analyzed to determine whether the acquired second height level is within a third preset range.

16. The method for monitoring a wafer operation device according to claim 15, characterized in that: The second sensor group measures a third vertical distance of the clamping portion.

17. The method for monitoring a wafer operation device according to claim 15, characterized in that: Also includes: Acquiring a second position level of the clamping portion by using the second sensor group; receiving a fourth signal from the second sensor group; and The fourth signal is analyzed to determine whether the acquired second orientation level is within a fourth preset range.

18. The method for monitoring a wafer handling device according to claim 17, wherein: Acquiring the second orientation level includes: measuring at least two fourth vertical distances of the clamping portion, Analyzing the fourth signal includes: A second inclination angle of the clamping portion is calculated according to the measured second differences between the plurality of fourth vertical distances.

19. The method for monitoring a wafer handling device according to claim 15, wherein: The first sensor group includes a plurality of first distance sensors, the second sensor group includes a plurality of second distance sensors, and a first position arrangement of the plurality of first distance sensors is the same as a second position arrangement of the plurality of second distance sensors.

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