Sucker for silicon wafer and adsorption method thereof

Abstract

The suction cup comprises a suction cup body and an air nozzle connected with the suction cup body, the suction cup body comprises the suction cup body and a flow channel arranged on the suction cup body, one end of the flow channel is an air inlet, the other end of the flow channel is an air outlet, the air nozzle is communicated with the air outlet, the air inlet is formed in the side face of the suction cup body, and the side portion of the air nozzle does not protrude out of the two sides of the suction cup body. The suction nozzle has the advantages that the two sides of the suction nozzle do not protrude out of the two sides of the suction cup, so that edges and corners of the suction nozzle cannot damage silicon wafers in the lifting process of the suction cup in a gap between adjacent silicon wafers, the silicon wafers can be smoothly adsorbed, and the economic loss in the silicon wafer adsorption process is reduced. The groove communicated with the flow channel is formed in one side of the third disc, so that in the silicon wafer adsorption process, only the part, corresponding to the flow channel, of the silicon wafer can generate the adsorption effect with the suction disc, it can be guaranteed that the part, corresponding to the gap, of the silicon wafer and the part, corresponding to the groove, of the silicon wafer can also generate the adsorption effect, and the silicon wafer adsorption stability is improved.

Description

Technical Field

[0001] The present invention relates to the field of suction cups, and specifically to a suction cup for silicon wafers and an adsorption method thereof. Background Art

[0002] Silicon wafers are placed in a flower basket, and then a special suction cup needs to be inserted into the corresponding position on the silicon wafer surface to adsorb the silicon wafers. In the existing silicon wafer suction cups, since the air nozzles protrude from both sides of the suction cup, when the suction cup is inserted into the gap between two adjacent silicon wafers, it is easy to scratch the two adjacent silicon wafers. This not only fails to smoothly complete the adsorption of the silicon wafers, but also causes irreversible damage to the silicon wafers, resulting in economic losses.

[0003] In view of this, it is necessary to provide a suction cup for silicon wafers and an adsorption method thereof. Summary of the Invention

[0004] A suction cup for silicon wafers and an adsorption method thereof provided by the present invention effectively solve the problem that the existing suction cup for silicon wafers is prone to scratching silicon wafers during actual use.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A suction cup for silicon wafers includes a suction cup and an air nozzle connected to the suction cup. The suction cup includes a suction cup body and a flow channel provided on the suction cup body. One end of the flow channel is an air inlet, and the other end of the flow channel is an air outlet. The air nozzle is in communication with the air outlet. The air inlet is provided on the side surface of the suction cup, and the side part of the air nozzle does not protrude from both sides of the suction cup.

[0007] Further: The suction cup includes a first disk, a second disk provided on one side of the first disk, and a third disk provided on the other side of the first disk. The air inlet is provided on the third disk. The upper end of the suction cup is a flat surface, and the air nozzle is provided on the upper end surface of the suction cup.

[0008] Further: A groove is provided on the side surface of the third disk. The groove includes a bottom surface and a side wall. The air inlet is provided on the bottom surface. A plurality of protrusions are also provided on the bottom surface. A gap is formed between the plurality of protrusions. The groove is in communication with the flow channel through the gap. The protrusions are circumferentially provided on the side of the air inlet.

[0009] Further: The protrusions are flush with the outer edge of the side wall.

[0010] Further: Chamfered edges are provided on the lower end surfaces of the second disk and the third disk.

[0011] Further: A plurality of hanging holes are symmetrically provided on the first disk. The hanging holes include a cylindrical section and tapered holes communicating with both ends of the cylindrical section. The hanging holes are used for hanging one end of an external tension spring.

[0012] Furthermore, the thickness of the first disk is less than that of the second disk, and the thickness of the first disk is less than that of the third disk.

[0013] Furthermore, the first disk, the second disk, and the third disk are all provided with arc-shaped outer edges.

[0014] Furthermore, the side of the air nozzle is flush with both sides of the suction cup.

[0015] A method for adsorbing a silicon wafer using a suction cup. The suction cup for silicon wafers is used. The suction cup for silicon wafers is lifted on the installation mechanism so that the suction cup extends between the vertically placed silicon wafers. At this time, the air inlet is aligned with the side of the silicon wafer, and the silicon wafer is adsorbed by evacuating the air from one side of the air inlet.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. By designing the two sides of the suction nozzle not to protrude beyond the two sides of the suction cup, when the suction cup moves up and down in the gap between adjacent silicon wafers, the edges of the suction nozzle will not damage the silicon wafers, and the adsorption of the silicon wafers can be smoothly completed, reducing the economic losses during the adsorption process of the silicon wafers.

[0018] 2. By providing a groove on one side of the third disk that is in communication with the flow channel, during the adsorption process of the silicon wafer, not only the part of the silicon wafer corresponding to the flow channel can adsorb with the suction cup, but also the part of the silicon wafer corresponding to the gap and the part of the silicon wafer corresponding to the groove can produce an adsorption effect, improving the adsorption stability of the silicon wafer.

[0019] 3. The suction cup is designed with a second disk and a third disk respectively on both sides of the first disk, and chamfered obliquely below the second disk and the third disk. During the adsorption process, the chamfered side is close to the silicon wafer in the moving direction, and the chamfer can prevent the silicon wafer from rubbing against the suction cup.

[0020] 4. The suction cup is provided with a mounting hole, and by connecting the end of the external spring through the mounting hole, it is convenient to increase the floating stability of the suction cup. Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall suction cup for silicon wafers provided by the embodiment of the present application.

[0022] Figure 2 It is a schematic diagram of the suction cup of the suction cup for silicon wafers provided by the embodiment of the present application.

[0023] The labels in the figure are: 1. Suction cup; 2. Air nozzle; 101. Flow channel; 102. Air inlet; 103. Air outlet; 11. First disk; 12. Second disk; 13. Third disk; 130. Groove; 131. Protrusion; 132. Gap; 300. Chamfered obliquely; 400. Mounting hole. Detailed implementation manners

[0024] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present invention in conjunction with the accompanying drawings.

[0025] As Figure 1 and Figure 2 shown, the first embodiment provided by the present application is a suction cup for silicon wafers, including a suction cup 1 and a nozzle 2 connected to the suction cup 1. A flow channel 101 is provided on the suction cup 1. One end of the flow channel 101 is an air inlet 102, and the other end of the flow channel 101 is an air outlet 103. The nozzle 2 is in communication with the air outlet 103. The air inlet 102 is provided on the side surface of the suction cup 1, and the side part of the nozzle 2 does not protrude beyond both sides of the suction cup 1.

[0026] The nozzle 2 is a standard part. The side part of the nozzle 2 means the two sides corresponding to the disk surface of the suction cup 1, that is, when the suction cup 1 extends between the silicon wafers, the side opposite to two adjacent silicon wafers.

[0027] During actual use, the suction cup for silicon wafers is lifted on the installation mechanism, so that the suction cup 1 extends between the vertically placed silicon wafers. At this time, the air inlet 102 is aligned with the side of the silicon wafer, and the silicon wafer is adsorbed by evacuating the air from one side of the air inlet 102.

[0028] In the above design, the side part of the nozzle 2 does not protrude beyond both sides of the suction cup 1, so that when the suction cup 1 extends between two silicon wafers, the nozzle 2 will not come into contact with the side of the silicon wafer, effectively preventing the silicon wafer from being scratched by the nozzle 2.

[0029] Specifically: As Figure 2 shown, the suction cup 1 includes a first disk 11, a second disk 12 provided on one side of the first disk 11, and a third disk 13 provided on the other side of the first disk 11. The air inlet 102 is provided on the third disk 13. The upper end of the suction cup 1 is a flat surface, and the nozzle 2 is provided on the upper end surface of the suction cup 1.

[0030] During actual use, when the suction cup 1 extends between the silicon wafers, the third disk 13 corresponds to the side of the silicon wafer, and then the air is evacuated through the air inlet 102, so that the third disk 13 is in adsorption contact with the silicon wafer.

[0031] In the above design, the structural design and specific implementation manner of the suction cup 1 can effectively enhance the structural stability of the suction cup 1.

[0032] Specifically: As Figure 2As shown, a groove 130 is provided on the side surface of the third disk 13. The groove 130 includes a bottom surface and a side wall. The air inlet 102 is provided on the bottom surface. A number of protrusions 131 are also provided on the bottom surface. A gap 132 is formed between the number of protrusions 131. The groove 130 is communicated with the flow channel 101 through the gap 132. The protrusions 131 are circumferentially arranged on the side part of the air inlet 102.

[0033] During actual use, contact is made with the silicon wafer through the protrusions 131 and the outer edge of the side wall. When performing vacuum adsorption, air can move within the groove 130, such that adsorption forces are generated at the parts of the silicon wafer corresponding to the air inlet 102, the parts of the silicon wafer corresponding to the gap 132, and the parts of the silicon wafer corresponding to the groove 130.

[0034] In the above design, the adsorption force does not rely solely on the air inlet 102, thereby effectively increasing the adsorption force and friction force to ensure the stability of the silicon wafer after adsorption.

[0035] Specifically: As Figure 2 shown, the protrusions 131 are flush with the outer edge of the side wall.

[0036] In the above design, making the protrusions 131 flush with the outer edge of the side wall is convenient for processing and also convenient for the silicon wafer to come into contact with both the protrusions 131 and the outer edge of the side wall simultaneously, ensuring that the overall silicon wafer does not deform when being adsorbed.

[0037] Specifically: As Figure 2 shown, chamfered edges 300 are provided on the lower end surfaces of the second disk 12 and the third disk 13.

[0038] During actual use, the suction cup 1 extends into the space between the silicon wafers from the outside. During the extension process, the side with the chamfered edge 300 faces the side of the silicon wafers and extends into the space between the silicon wafers.

[0039] In the above design, by providing the chamfered edges 300, it can effectively prevent the suction cup 1 from damaging the silicon wafers during the process of extending into the space between the silicon wafers.

[0040] Specifically: As Figure 2 shown, a number of mounting holes 400 are symmetrically provided on the first disk 11. The mounting holes 400 include a cylindrical section and tapered holes communicating with both ends of the cylindrical section. The mounting holes 400 are used for mounting one end of an external tension spring.

[0041] During actual use, an external tension spring is mounted through the mounting holes 400.

[0042] In the above design, by providing the mounting holes 400, the quick mounting of one end of the external tension spring is realized.

[0043] Specifically: The thickness of the first disk 11 is less than the thickness of the second disk 12, and the thickness of the first disk 11 is less than the thickness of the third disk 13.

[0044] In the above design, the thickness design of the first disk 11, the second disk 12, and the third disk 13 enables the manufacture of the suction cup 1.

[0045] Specifically: as Figure 1 and Figure 2 shown, the first disk 11, the second disk 12, and the third disk 13 are all provided with arc-shaped outer edges.

[0046] In the above design, by providing the arc-shaped outer edges, it can effectively avoid damaging the silicon wafer due to the sharp corners during the telescopic process of the suction cup 1.

[0047] Specifically: the side part of the air nozzle 2 is flush with both sides of the suction cup 1.

[0048] In the above design, the side part of the air nozzle 2 being flush with both sides of the suction cup 1 facilitates the installation of the air nozzle 2 and the suction cup 1.

[0049] The second embodiment provided by the present application is a method for sucking a silicon wafer using a suction cup. Using the suction cup for silicon wafers, the suction cup for silicon wafers is lifted and lowered on the installation mechanism, so that the suction cup 1 extends into the vertically placed silicon wafers. At this time, the air inlet 102 is aligned with the side part of the silicon wafer, and the silicon wafer is adsorbed by evacuating the air from one side of the air inlet 102.

[0050] In the above design, it can effectively prevent the suction cup 1 from scratching the silicon wafer during the lifting and lowering process.

[0051] The third embodiment provided by this application is a suction cup for silicon wafers, which includes a suction cup 1 and a nozzle 2 connected to the suction cup 1. A flow channel 101 is provided on the suction cup 1. One end of the flow channel 101 is an air inlet 102, and the other end of the flow channel 101 is an air outlet 103. The nozzle 2 is in communication with the air outlet 103. The air inlet 102 is provided on the side surface of the suction cup 1, and the side part of the nozzle 2 does not protrude beyond both sides of the suction cup 1. The suction cup 1 includes a first disk 11, a second disk 12 provided on one side of the first disk 11, and a third disk 13 provided on the other side of the first disk 11. The air inlet 102 is provided on the third disk 13. The upper end of the suction cup 1 is a plane, and the nozzle 2 is provided on the upper end surface of the suction cup 1. A groove 130 is provided on the side surface of the third disk 13. The groove 130 includes a bottom surface and a side wall. The air inlet 102 is provided on the bottom surface. A plurality of protrusions 131 are also provided on the bottom surface. A gap 132 is formed between the plurality of protrusions 131. The groove 130 is in communication with the flow channel 101 through the gap 132. The protrusions 131 are circumferentially provided on the side of the air inlet 102. The protrusions 131 are flush with the outer edge of the side wall. Chamfered corners 300 are provided on the lower end surfaces of both the second disk 12 and the third disk 13. A plurality of mounting holes 400 are symmetrically provided on the first disk 11. The mounting holes 400 include a cylindrical section and tapered holes communicating with both ends of the cylindrical section. The mounting holes 400 are used to mount one end of an external tension spring. The thickness of the first disk 11 is less than the thickness of the second disk 12, and the thickness of the first disk 11 is less than the thickness of the third disk 13. The first disk 11, the second disk 12, and the third disk 13 are all provided with arc-shaped outer edges. The side part of the nozzle 2 is flush with both sides of the suction cup 1.

[0052] During actual use, the suction cup 1 drives the nozzle 2 to extend between two silicon wafers. At this time, the second disk 12 and the third disk 13 respectively correspond to the silicon wafers on both sides. During the process of the suction cup 1 extending between the silicon wafers, the chamfered corners 300 first extend into the space between the silicon wafers, and then after the air inlet 102 and the groove 130 are both completely corresponding to the silicon wafers, external vacuum equipment is used to evacuate the air, so that the silicon wafer corresponding to the third disk 13 is adsorbed.

[0053] In the above design, the structure that the two sides of the nozzle 2 are set not to protrude beyond the side part of the suction cup 1 can effectively prevent the nozzle 2 from scratching the end surface of the silicon wafer. At the same time, the groove 130 is provided, which can increase the adsorption capacity for the silicon wafer and improve the stability of the silicon wafer adsorbed by the suction cup 1 during the transfer process.

[0054] For further detailed description, it should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A suction cup for a silicon wafer, comprising a suction cup (1) and an air nozzle (2) connected to the suction cup (1), characterized in that: The suction cup (1) is provided with a flow channel (101), one end of the flow channel (101) is an air inlet (102), the other end of the flow channel (101) is an air outlet (103), the air nozzle (2) is in communication with the air outlet (103), the air inlet (102) is provided on the side of the suction cup (1), and the side of the air nozzle (2) does not protrude from the two sides of the suction cup (1).

2. The silicon wafer suction cup according to claim 1, characterized in that: The suction cup (1) comprises a first disc (11), a second disc (12) arranged on one side of the first disc (11), and a third disc (13) arranged on the other side of the first disc (11); the air inlet (102) is arranged on the third disc (13); the upper end of the suction cup (1) is a plane; and the air nozzle (2) is arranged on the upper end surface of the suction cup (1).

3. The silicon wafer suction cup according to claim 2, characterized in that: The side of the third disk (13) is provided with a groove (130), the groove (130) includes a bottom surface and a side wall, the air inlet (102) is provided on the bottom surface, a plurality of protrusions (131) are further provided on the bottom surface, a gap (132) is formed between the plurality of protrusions (131), the groove (130) is connected with the flow channel (101) through the gap (132), and the protrusions (131) are circumferentially provided on the side of the air inlet (102).

4. The silicon wafer suction cup according to claim 3, characterized in that: The protrusion (131) is flush with the outer edge of the side wall.

5. The silicon wafer suction cup according to claim 2, characterized in that: The lower end surfaces of the second plate (12) and the third plate (13) are both provided with oblique chamfers (300).

6. The silicon wafer suction cup according to claim 2, characterized in that: The first disk (11) is symmetrically provided with a plurality of mounting holes (400), wherein the mounting holes (400) include a cylindrical section and conical holes communicating with both ends of the cylindrical section, and the mounting holes (400) are used to mount one end of an external tension spring.

7. The silicon wafer suction cup according to claim 2, characterized in that: The thickness of the first disk (11) is smaller than the thickness of the second disk (12), and the thickness of the first disk (11) is smaller than the thickness of the third disk (13).

8. The silicon wafer suction cup according to claim 2, characterized in that: The first disk (11), the second disk (12) and the third disk (13) are all provided with arc outer edges.

9. The silicon wafer suction cup according to claim 1, characterized in that: The side of the air nozzle (2) is flush with the two sides of the suction cup (1).

10. A method for adsorbing a silicon wafer using a suction cup, using the silicon wafer suction cup according to any one of claims 1 to 9, characterized in that: The silicon wafer suction cup is raised and lowered on the mounting mechanism so that the suction cup (1) extends between the vertically placed silicon wafers. At this time, the air inlet (102) is aligned with the side of the silicon wafer, and the silicon wafer is adsorbed by vacuuming from one side of the air inlet (102).

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