High-reliability high-density hybrid integrated packaging structure

Abstract

The invention relates to the technical field of hybrid integrated circuit packaging, in particular to a high-reliability and high-density hybrid integrated packaging structure, which comprises a ceramic substrate, a chip, a passive device, a metal ring frame and a cover plate, and is characterized in that the ceramic substrate, the metal ring frame and the cover plate form an airtight cavity; the ceramic base body is of a cubic structure, the front face or the side face except the bottom is used for installing a chip or a passive device, the metal ring frame is arranged on the front face or the side face of the ceramic base body to surround the chip or the passive device, and the cover plate is arranged on the metal ring frame and achieves airtight packaging. The high-reliability and high-density hybrid integrated packaging structure has the advantages of high performance, high reliability, high density, miniaturization, stable performance and long service life.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit hybrid integrated circuit packaging, and particularly relates to a highly reliable and high-density hybrid integrated packaging structure. Background Art

[0002] The packaging of multi-chips assembles components with different functions in a packaging structure through integrated circuit packaging technology. It not only serves as a carrier for components but also realizes the electrical interconnection between each component, thereby achieving specific functions. It is a very key technology in integrated circuits and is crucial for the system to serve stably for a long time as required to achieve the specified functions.

[0003] In special application scenarios such as aviation, aerospace, and military equipment, high reliability requirements are imposed on integrated circuits, such as requirements for airtightness, resistance to high and low temperatures, and resistance to high humidity. At the same time, as the complexity of the tasks performed by aviation, aerospace, military equipment, etc. continues to increase, the number of its electronic components shows an exponential growth trend, which requires the electronic equipment to further improve the packaging density while ensuring high reliability.

[0004] The existing methods for realizing miniaturized packaging are 2.5D / 3D stacking, etc. Such processes generally use ABF / BT substrates as component carriers and EMC plastic encapsulation materials as component encapsulation materials. However, ABF / BT substrates are organic materials, and the substrates and encapsulation materials used in such processes cannot ensure very good airtightness; or use silicon interposers as component carriers and the caps are in the form of silicon caps, but this process is still in the research stage, with high costs and the reliability yet to be verified. Therefore, materials such as ceramics and metals are still the first choice for high-reliability application scenarios.

[0005] However, traditional ceramic packaging structures generally adopt single-sided cavity or front-back symmetric cavity structures. The single-sided cavity structure can place pins at the bottom of the packaging structure to reduce the area occupied by the packaging on the PCB board, but only components can be placed on one side, such as Figure 1 ; the front-back symmetric cavity structure can place components on both sides, but only pins can be placed on the side of the package, which will increase the overall volume of the package, such as Figure 2 . Neither of the above two structures makes good use of the longitudinal space and it is difficult to achieve miniaturized assembly.

[0006] In summary, the existing substrate plastic encapsulation and silicon interposer processes are difficult to meet the requirements of high-reliability application scenarios, and traditional ceramic body packaging structures cannot achieve miniaturized packaging. Therefore, in high-reliability application fields such as aerospace, there is an urgent need for a highly reliable and high-density hybrid integrated packaging solution that can ensure airtightness. Summary of the Invention

[0007] To solve the above technical problems, the present invention provides a highly reliable and high-density hybrid integrated packaging structure, including: the packaging structure consists of a ceramic substrate, chips, passive devices, a metal ring frame, and a cover plate, and the ceramic substrate, the metal ring frame, and the cover plate form an airtight cavity;

[0008] The ceramic substrate has a cubic structure, and the front or side except the bottom is used to mount chips or passive devices. The metal ring frame is placed on the front or side of the ceramic substrate to surround the chips or passive devices, and the cover plate is placed on the metal ring frame to achieve airtight packaging.

[0009] Advantages of the present invention:

[0010] The highly reliable and high-density hybrid integrated packaging structure of the present invention is different from the traditional ceramic housing that only mounts chips or passive devices in a single-sided or double-sided cavity. The bottom of the packaging structure of the present invention is a BGA, LGA, DFN, or QFN packaging pin, and chips or passive devices can be mounted on both the front and the side; multiple cavities on the front and the side are all covered with ring frames, and the cover plate is covered on the metal ring frame by parallel seam welding or gold-tin welding and is hermetically connected to the metal ring frame to ensure airtight packaging; electrical interconnection between the chips and passive devices on the front and the side is achieved through printed patterns on the surface and inside of the ceramic body; at the same time, the present invention can ensure the airtightness in the chip mounting cavity, protect the chips from the influence of water vapor or other atmospheres, and the materials and processes used have been verified for a long time in fields such as aerospace, which can ensure the long-term working reliability of the hybrid integrated circuit; and the packaging structure of the present invention can greatly improve the packaging efficiency compared with the traditional integrated shell, and realize the miniaturized packaging of the highly reliable hybrid integrated circuit.

[0011] In summary, the highly reliable and high-density hybrid integrated packaging structure of the present invention has the advantages of high performance, high reliability, high density, miniaturization, stable performance, and long service life. Brief Description of the Drawings

[0012] Figure 1 is a schematic diagram of a conventional hybrid integrated circuit ceramic packaging structure with a single-sided cavity;

[0013] Figure 2 is a schematic diagram of a conventional hybrid integrated circuit ceramic packaging structure with double-sided symmetric cavities;

[0014] Figure 3 is a front perspective view of a highly reliable and high-density hybrid integrated packaging structure according to the first embodiment of the present invention;

[0015] Figure 4 is a side perspective view of a highly reliable and high-density hybrid integrated packaging structure according to the first embodiment of the present invention;

[0016] Figure 5It is a schematic diagram of a highly reliable and high-density hybrid integrated packaging structure of the second embodiment of the present invention. Specific embodiments

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0018] Figure 3 It is a schematic diagram of a highly reliable and high-density hybrid integrated packaging structure of the first embodiment of the present invention. As Figure 3 shown, the hybrid integrated packaging structure of the present invention includes a ceramic body, a ring frame, a cover plate, chips, and passive devices. The surface of the ceramic body has conductive patterns for electrical connection, and through holes or blind holes are provided inside the ceramic body for electrical connection between ceramic body layers or cavities.

[0019] As Figure 3 shown in the front perspective view of the first embodiment, the airtight cavity 1 is used to install the chips and passive devices, and the open cavity 1 and open cavity 2 can only be used to install passive devices.

[0020] As Figure 4 shown in the side perspective view of the first embodiment, chips and passive devices can be installed in the airtight cavity 1, airtight cavity 2, and airtight cavity 3. The first embodiment shown in the figure includes a total of 5 cavities, and the bottom surface is a circuit solder ball as an output terminal.

[0021] According to the preferred embodiment of the present invention, the ceramic substrate is a high-temperature co-fired ceramic, and the material is alumina ceramic.

[0022] According to the preferred embodiment of the present invention, the ceramic substrate is a high-temperature co-fired ceramic, and the material is aluminum nitride ceramic.

[0023] According to the preferred embodiment of the present invention, the ceramic substrate, the metal ring frame, and the cover plate form an airtight cavity mainly for installing active chips to ensure the reliability of the chips;

[0024] According to the preferred embodiment of the present invention, the surface of the ceramic substrate where only passive devices are installed can be designed with a sunken cavity only on the ceramic body, and the metal ring frame and the cover plate do not need to be installed, and airtightness does not need to be ensured.

[0025] According to the preferred embodiment of the present invention, the surface of the ceramic substrate where only passive devices are installed does not need to be designed with a cavity, and the metal ring frame and the cover plate do not need to be installed, and airtightness does not need to be ensured.

[0026] According to a preferred embodiment of the present invention, the hermetic cavity cap is composed of a ceramic substrate, a metal ring frame, and a cover plate, and the hermetic sealing method is parallel seam welding or AuSn cap sealing.

[0027] Its encapsulation steps include but are not limited to:

[0028] Step 1: Process the electrical interconnection patterns on the surface of the ceramic substrate, as well as the internal electrical through holes, blind holes, and buried holes.

[0029] Step 2: Install the metal ring frame on the front and side surfaces of the ceramic substrate using solder.

[0030] Step 3: Install chips and passive devices on the front or side surface of the ceramic substrate.

[0031] Step 4: Install the cover plate on the metal ring frame to achieve hermetic encapsulation.

[0032] Step 5: Install BGA solder balls at the bottom of the ceramic body. This step is not required if LGA, DFN, QFN, etc. packaging forms are used.

[0033] It should be noted that the chip interconnection method within the hermetic cavity can be bonding or flip-chip soldering. The present invention does not limit the chip installation and interconnection methods; the side where passive devices are placed may not be designed with a cavity either.

[0034] It should be noted that Figure 3 、 4 The first embodiment shown is only one example of the present invention. The cavities included in the solution of the present invention can be designed with the number of cavities and whether the cavities are hermetic according to actual needs.

[0035] Figure 5 is a schematic diagram of a high-reliability high-density hybrid integrated packaging structure of the second embodiment of the present invention. As Figure 5 The high-reliability high-density hybrid integrated packaging structure shown includes a ceramic body, a metal ring frame, a cover plate, chips, passive devices, and solder balls. The surface of the ceramic body is printed with metallization patterns, and there are vias inside for installing devices and achieving electrical interconnection; the ceramic body, the metal ring frame, and the cover plate form a hermetic cavity to ensure the long-term reliability of the chips inside the cavity.

[0036] As Figure 5 The high-reliability high-density hybrid integrated packaging structure shown in the second embodiment includes a non-hermetic cavity for installing passive devices such as resistors and capacitors necessary for the peripheral configuration of the chips. Generally, the depth of the non-hermetic cavity should be greater than the height of the passive devices inside the cavity to prevent interference between the devices and the substrate during installation on the substrate or to prevent the devices from being knocked.

[0037] As Figure 5The non-hermetic cavity area of the highly reliable and high-density hybrid integrated packaging structure shown in the second embodiment does not completely occupy the bottom of the ceramic body, and there is space around the non-hermetic cavity for installing the solder ball lead-out terminals of the second embodiment.

[0038] It should be noted that the chip interconnection method in the hermetic cavity can be bonding or flip-chip soldering, and the present invention does not limit the chip installation and interconnection methods; the lead-out terminals at the bottom of the hybrid integrated packaging structure can be in the form of BGA or LGA.

[0039] A highly reliable and high-density hybrid integrated packaging structure of the present application is different from the traditional ceramic shell that only installs chips or passive devices in the cavities on one side or both sides. The bottom of the packaging structure of the present invention has BGA, LGA, DFN or QFN packaging pins, and chips or passive devices can be installed on the front and side surfaces; multiple cavities on the front and side surfaces are covered with ring frames, and the cover plate is covered on the metal ring frames by parallel seam welding or gold-tin soldering and is hermetically connected to the metal ring frames to ensure hermetic packaging; the electrical interconnection between the chips and passive devices on the front and side surfaces is realized through the printed patterns on the surface and inside of the ceramic body.

[0040] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-reliability and high-density hybrid integrated packaging structure, characterized in that: include: The packaging structure comprises a ceramic substrate, a chip, a passive device, a metal ring frame and a cover plate, and the ceramic substrate, the metal ring frame and the cover plate form an airtight cavity; The ceramic substrate is a cubic structure, and the front or side except the bottom is used to install chips or passive devices. The metal ring frame is placed on the front or side of the ceramic substrate to surround the chips or passive devices, and the cover plate is placed on the metal ring frame to achieve airtight packaging.

2. A high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: The ceramic matrix is ​​alumina ceramic or aluminum nitride ceramic and has a cubic structure. Its length is set to 5mm-40mm, its width is set to 2mm-40mm, and its thickness is set to 2mm-10mm.

3. The high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: A plurality of chips or passive components are mounted on the front or side of the ceramic substrate, and a conductive pattern is printed thereon to realize electrical interconnection between the plurality of chips or passive components.

4. The high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: The bottom of the ceramic substrate is an LGA solder pad or a BGA solder ball, which realizes the electrical interconnection between the high-reliability and high-density hybrid integrated packaging structure and the PCB.

5. The high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: The ceramic substrate has through holes, blind holes or buried holes inside to achieve electrical interconnection between chips or passive devices on different sides.

6. The high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: The ceramic substrate can be mounted with components on at least 2 sides and at most 5 sides.

7. The high-reliability and high-density hybrid integrated packaging structure according to claim 1, characterized in that: The ceramic substrate is only mounted with passive components on its surface, and a metal ring frame and a cover plate may be mounted to ensure airtight packaging, or the metal ring frame and the cover plate may not be mounted.

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