Heating disc device and semiconductor device

Abstract

A heating disc device and a semiconductor device, the heating disc device comprising: a heating disc, the heating disc comprising a disc portion and a shaft portion, the top of the disc portion being used for bearing and heating a wafer, the top of the shaft portion being fixedly connected to the bottom surface of the disc portion and being used for supporting the disc portion; a heat reflecting member; the heat reflection component comprises a first heat reflection part which is arranged on the shaft part at the bottom of the disc part, a gap is formed between the first heat reflection part and the disc part, and the first heat reflection part is provided with a reflection face facing one side of the bottom face of the disc part. The reflecting surface is used for reflecting heat radiated to the reflecting surface from the disc part back to the disc part, so that a path of radiating heat of the heating disc is favorably blocked, the degree of heat loss caused by outward heat radiation of the heating disc is reduced, the effective power of the heating disc is correspondingly increased, the heating effect of the heating disc on a wafer is favorably improved, and the service life of the heating disc is prolonged. And a process temperature window is correspondingly increased.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular, to a heating plate device and a semiconductor device. Background Art

[0002] With the development of semiconductor-related technologies, the manufacturing processes of semiconductor devices and chips are also developing rapidly.

[0003] Heating plate devices are widely used in the field of semiconductor manufacturing. In the semiconductor manufacturing process, the heating plate device is used to carry the wafer, thereby fixing the wafer in the machine tool and providing a process operation platform. At the same time, it can also heat the wafer during the wafer process (for example: deposition process) to maintain the temperature required for the process.

[0004] However, the heating effect of the current heating plate device still needs to be improved. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a heating plate device and a semiconductor device to improve the heating effect of the heating plate device.

[0006] To solve the above problem, an embodiment of the present invention provides a heating plate device, including: a heating plate, the heating plate includes a plate portion and a shaft portion, the top of the plate portion is used to carry the wafer and heat the wafer, the top of the shaft portion is fixedly connected to the bottom surface of the plate portion, and is used to support the plate portion; a heat reflection component; the heat reflection component includes: a first heat reflection portion, disposed on the shaft portion at the bottom of the plate portion, there is a gap between the first heat reflection portion and the plate portion, and the first heat reflection portion has a reflection surface facing the bottom surface of the plate portion.

[0007] Optionally, on a projection plane parallel to the top surface of the plate portion, the projection pattern of the heating plate coincides with the projection pattern of the first heat reflection portion, or the projection pattern of the heating plate is located in the projection pattern of the first heat reflection portion.

[0008] Optionally, when the projection pattern of the heating plate is located in the projection pattern of the first heat reflection portion on a projection plane parallel to the top surface of the plate portion, the heat reflection component further includes: a second heat reflection portion, located on the top surface of the first heat reflection portion, the second heat reflection portion surrounds the side wall of the plate portion, and there is a gap between the second heat reflection portion and the plate portion, and the second heat reflection portion has a reflection surface facing the side wall of the plate portion.

[0009] Optionally, the top of the second heat reflection portion is lower than the top of the plate portion, or the top of the second heat reflection portion is flush with the top of the plate portion.

[0010] Optionally, the material of the heat reflection component includes one or more of aluminum, stainless steel, nickel alloy, and Hastelloy.

[0011] Optionally, the material of the heat reflection component is metal, the surface of the heat reflection component facing the disc portion is a metal mirror surface, and the metal mirror surface serves as the reflection surface.

[0012] Optionally, the arithmetic mean surface roughness Ra of the metal mirror surface is less than or equal to 0.2 μm.

[0013] Optionally, a reflection coating is plated on the surface of the heat reflection component facing the disc portion, and the reflection coating serves as the reflection surface.

[0014] Optionally, the material of the reflection coating includes one or more of aluminum, silver, gold, titanium oxide, zirconium oxide, and silicon carbide.

[0015] Optionally, the reflection surface of the first heat reflection portion is parallel to the bottom surface of the disc portion.

[0016] Optionally, the first heat reflection portion includes a first heat reflection portion body and a first heat reflection portion through hole penetrating the first heat reflection portion body, and the first heat reflection portion body is fixedly sleeved on the shaft portion through the first heat reflection portion through hole; the heating disc device further includes: a spacer ring fixedly sleeved between the disc portion and the first heat reflection portion, and one surface of the spacer ring is in contact with the disc portion and the other surface is in contact with the first heat reflection portion; a fastener fixedly sleeved on the shaft portion at the bottom of the first heat reflection portion and in contact with the first heat reflection portion to fix the first heat reflection portion at a preset position on the shaft portion.

[0017] Optionally, a card slot is provided on the outer periphery of the shaft portion below the first heat reflection portion; the fastener includes: an elastic element fixedly sleeved on the shaft portion between the bottom of the first heat reflection portion and the card slot and in contact with the first heat reflection portion; a retaining ring embedded in the card slot; the total thickness of the spacer ring, the first heat reflection portion, and the fastener when the elastic element is in its original length state is greater than the distance from the bottom surface of the disc portion to the bottommost part of the card slot.

[0018] Optionally, the shape of the elastic element is frustum-shaped, the large end of the frustum is in contact with the first heat reflection portion, and the small end of the frustum is in contact with the retaining ring.

[0019] Optionally, a first hollowed-out pattern is provided on the side wall of the elastic element.

[0020] Optionally, the fastener further includes: an equalizing ring fixedly sleeved on the shaft portion between the elastic element and the retaining ring.

[0021] Optionally, a second hollowed-out pattern is provided on the side wall of the spacer ring.

[0022] Optionally, a plurality of first through holes are provided in the disc portion; a second through hole corresponding to the first through hole is provided in the first heat reflection portion; the heating disc device further includes: a plurality of ejector pins provided on the top surface of the disc portion and passing through the first through hole and the second through hole; a rotation prevention structure is provided between the shaft portion and the first heat reflection portion.

[0023] Optionally, the first heat reflection portion includes a first heat reflection portion body and a first heat reflection portion through hole penetrating the first heat reflection portion body, and the first heat reflection portion body is fixedly sleeved on the shaft portion through the first heat reflection portion through hole, and the first heat reflection portion through hole is a D-shaped through hole; a portion of the shaft portion near the disc portion is a D-shaped shaft, and a flat portion on the outer periphery of the D-shaped shaft cooperates with a flat portion of the D-shaped through hole, and a curved portion on the outer periphery of the D-shaped shaft cooperates with a curved portion of the D-shaped through hole.

[0024] Optionally, the interval range between the first heat reflection portion and the disc portion is 10 mm to 50 mm.

[0025] Correspondingly, an embodiment of the present invention further provides a semiconductor device, including: a cavity; the heating disc device according to the embodiment of the present invention, provided in the cavity.

[0026] Optionally, the semiconductor device includes a chemical vapor deposition device.

[0027] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0028] In the heating disc device provided by the embodiment of the present invention, a heating disc is included, the heating disc includes a disc portion and a shaft portion, and a heat reflection component provided on the shaft portion, the heat reflection component includes a first heat reflection portion provided on the shaft portion at the bottom of the disc portion, there is an interval between the first heat reflection portion and the disc portion, the first heat reflection portion has a reflection surface facing one side of the bottom surface of the disc portion, and the reflection surface is used to reflect the heat radiated from the disc portion to the reflection surface back to the disc portion, which is beneficial to blocking the path of heat radiation of the heating disc, reducing the degree of heat loss caused by the external heat radiation of the heating disc, correspondingly increasing the effective power of the heating disc, thereby being beneficial to improving the effect of heating the wafer by the heating disc, and correspondingly increasing the process temperature window. Description of the Drawings

[0029] Figure 1 is an exploded structural schematic diagram of the first embodiment of the heating plate device of the present invention;

[0030] Figure 2 is an assembled structural schematic diagram of the first embodiment of the heating plate device of the present invention;

[0031] Figure 3 is a top - view structural schematic diagram of the first heat - reflecting part of the heating plate device of the present invention;

[0032] Figure 4 is a top - view structural schematic diagram of the disk part and the first heat - reflecting part of the heating plate device of the present invention;

[0033] Figure 5 is a three - dimensional structural schematic diagram of the disk part and the first heat - reflecting part of the heating plate device of the present invention;

[0034] Figure 6 is an assembled structural schematic diagram of the second embodiment of the heating plate device of the present invention;

[0035] Figure 7 is a structural schematic diagram of the semiconductor device of the embodiment of the present invention. Specific Embodiments

[0036] During the semiconductor process, to ensure good temperature uniformity of the wafer, the heating plate device usually arranges heating wires in a dense pattern. Since the heating plate device radiates heat outward, when the heating plate device radiates a large amount of heat outward, the dense - wire arrangement method is likely to result in poor heating effect of the heating plate device on the wafer.

[0037] To solve the above - mentioned technical problems, an embodiment of the present invention provides a heating plate device, including: a heating plate, the heating plate includes a disk part and a shaft part, the top of the disk part is used to carry the wafer and heat the wafer, the top of the shaft part is fixedly connected to the bottom surface of the disk part and is used to support the disk part; a heat - reflecting component; the heat - reflecting component includes: a first heat - reflecting part, which is arranged on the shaft part at the bottom of the disk part, there is a gap between the first heat - reflecting part and the disk part, and the first heat - reflecting part has a reflecting surface facing the bottom surface of the disk part.

[0038] In the solution disclosed in the embodiments of the present invention, a heating plate is included. The heating plate includes a plate portion, a shaft portion, and a heat reflection component disposed on the shaft portion. The heat reflection component includes a first heat reflection portion disposed on the shaft portion at the bottom of the plate portion. There is a gap between the first heat reflection portion and the plate portion. The first heat reflection portion has a reflection surface facing one side of the bottom surface of the plate portion. The reflection surface is used to reflect the heat radiated from the plate portion to the reflection surface back to the plate portion, which is beneficial to blocking the heat radiation path of the heating plate, reducing the degree of heat dissipation caused by the external heat radiation of the heating plate, correspondingly increasing the effective power of the heating plate, thereby being beneficial to improving the heating effect of the heating plate on the wafer, and correspondingly increasing the process temperature window.

[0039] In order to make the above objects, features, and advantages of the embodiments of the present invention more obvious and understandable, the following specifically describes the embodiments of the present invention in detail with reference to the accompanying drawings.

[0040] Figure 1 is an exploded structural schematic diagram of the first embodiment of the heating plate device of the present invention, Figure 2 is an assembled structural schematic diagram of the first embodiment of the heating plate device of the present invention, Figure 3 is a top view structural schematic diagram of the first heat reflection portion of the heating plate device of the present invention, Figure 4 is a top view structural schematic diagram of the plate portion and the first heat reflection portion of the heating plate device of the present invention, Figure 5 is a three-dimensional structural schematic diagram of the plate portion and the first heat reflection portion of the heating plate device of the present invention.

[0041] Refer to Figures 1 to 5 , in this embodiment, the heating plate device 10 includes: a heating plate 100, the heating plate 100 includes a plate portion 101 and a shaft portion 102. The top of the plate portion 101 is used to carry a wafer (not shown in the figure) and heat the wafer. The top of the shaft portion 102 is fixedly connected to the bottom surface of the plate portion 101 and is used to support the plate portion 101; a heat reflection component 110; the heat reflection component 110 includes: a first heat reflection portion 111, disposed on the shaft portion 102 at the bottom of the plate portion 101. There is a gap H (as Figure 2 shown) between the first heat reflection portion 111 and the plate portion 101. The first heat reflection portion 111 has a reflection surface 115 facing one side of the bottom surface of the plate portion 101.

[0042] It should be noted that, in order to clearly show the structure of the heating plate device, Figure 1 the ejector pin is omitted in

[0043] The heating plate 100 is fixedly arranged in the cavity of the semiconductor device, and is used to carry the wafer and heat the wafer during the wafer processing. Among them, the plate portion 101 is used to carry the wafer and heat the wafer during the wafer processing; one end of the shaft portion 102 is used to support the plate portion 101, and the other end is used to be fixedly connected to the bottom of the cavity.

[0044] The heat reflection component 110 is used to provide a process basis for forming the reflection surface 115.

[0045] The reflection surface 115 is used to reflect the heat radiated from the plate portion 101 to the reflection surface 115 back to the plate portion 101, which is beneficial to blocking the heat radiation path of the heating plate 101, reducing the degree of heat dissipation caused by the external heat radiation of the heating plate 100, correspondingly increasing the effective power of the heating plate 100, thereby being beneficial to improving the heating effect of the heating plate 100 on the wafer, and correspondingly increasing the process temperature window.

[0046] As an example, the first heat reflection part 111 is of a plate structure. In other embodiments, the first heat reflection part can also be other structures that can provide a reflection surface.

[0047] In this embodiment, as Figure 2 shown, the reflection surface 115 of the first heat reflection part 111 is parallel to the bottom surface of the plate portion 101, which is beneficial to making the reflection effect of the reflection surface 115 of the first heat reflection part 111 on each area at the bottom of the heating plate 101 better, and thus is beneficial to improving the temperature uniformity of the heating plate 100.

[0048] In this embodiment, on the projection plane parallel to the top surface of the plate portion 101, the projection pattern of the heating plate 100 coincides with the projection pattern of the first heat reflection part 111, or the projection pattern of the heating plate 100 is located in the projection pattern of the first heat reflection part 111, so that the reflection surface 115 of the first heat reflection part 111 has a better effect of blocking the radiation path of the heating plate 100. Especially in the case where there is a temperature difference at the bottom of the cavity, since the reflection surface 115 of the first heat reflection part 111 can better block the radiation path of the heating plate 100, the effect of improving the uneven temperature of each area of the heating plate 100 caused by the different heat absorption capabilities of each area at the bottom of the cavity for each area of the heating plate 100 is better, and correspondingly it is beneficial to improving the temperature uniformity of the heating plate 100.

[0049] As an example, as Figure 1 and Figure 2As shown, the projected pattern of the heating plate 100 is located within the projected pattern of the first heat reflection portion 111, which is also conducive to increasing the area of the reflection surface 115 of the first heat reflection portion 111, thereby further enhancing the effect of the reflection surface 115 of the first heat reflection portion 111 in blocking the heat radiation path of the heating plate 100.

[0050] In this embodiment, the material of the heat reflection component 110 is metal.

[0051] Metals generally have good plasticity and strength. Using metal as the material of the heat reflection component 110 is conducive to reducing the difficulty of forming the heat reflection component 110 and also helps the heat reflection component to obtain better structural strength.

[0052] It should be noted that the material of the heat reflection component 110 includes one or more of aluminum, stainless steel, nickel alloy, and Hastelloy.

[0053] Aluminum, stainless steel, nickel alloy, and Hastelloy all have good corrosion resistance, which is conducive to reducing the probability of the heat reflection component 110 being damaged by corrosion.

[0054] It should also be noted that the surface of the heat reflection component 110 facing the disc portion 101 is a metal mirror surface, and this metal mirror surface serves as the reflection surface 115, which is conducive to reducing the steps of forming the heat reflection component 110, thereby reducing the cost of forming the heat reflection component 110.

[0055] More importantly, the arithmetic mean surface roughness Ra of the metal mirror surface should not be too large. If the arithmetic mean surface roughness Ra of the metal mirror surface is too large, it is likely to result in poor effect of improving the heat radiation reflectivity of the reflection surface 115 to the heating plate 100. Therefore, in this embodiment, the arithmetic mean surface roughness Ra of the metal mirror surface is less than or equal to 0.2 μm.

[0056] It can be understood that the arithmetic mean surface roughness is Ra.

[0057] In other embodiments, a reflective coating is plated on the surface of the heat reflection component facing the disc portion, and this reflective coating serves as the reflection surface, which is conducive to improving the heat reflection effect of the reflection surface on the heating plate.

[0058] Specifically, the material of the reflective coating includes one or more of aluminum, silver, gold, titanium oxide, zirconium oxide, and silicon carbide.

[0059] Aluminum, silver, gold, titanium oxide, zirconium oxide, and silicon carbide all have relatively high thermal radiation reflectivity. Selecting aluminum, silver, gold, titanium oxide, zirconium oxide, and silicon carbide as the material of the reflection coating is beneficial to improving the thermal radiation reflectivity of the reflection surface to the heating plate.

[0060] It should be noted that as Figure 2 shown, the interval H between the first thermal reflection part 111 and the disc part 101 should not be too small or too large. If the interval H between the first thermal reflection part 111 and the disc part 101 is too small, it is easy to increase the probability of the first thermal reflection part 111 being deformed by heat, and thus it is easy to cause the reflection effect of the reflection surface 115 of the first thermal reflection part 111 on each area of the bottom of the heating plate 101 to be different. If the interval H between the first thermal reflection part 111 and the disc part 101 is too large, it is easy to cause the reflection effect of the reflection surface 115 of the first thermal reflection part 111 on heat to be poor. Therefore, in this embodiment, the range of the interval H between the first thermal reflection part 111 and the disc part 101 is 10 millimeters to 50 millimeters.

[0061] In this embodiment, as Figure 1 and Figure 2 shown, the first thermal reflection part 111 includes a first thermal reflection part body 1111 and a first thermal reflection part through hole 1110 penetrating the first thermal reflection part body 1111, and the first thermal reflection part body 1111 is fixedly sleeved on the shaft part 102 through the first thermal reflection part through hole 1110; the heating plate device 10 further includes: a spacer 120 fixedly sleeved between the disc part 101 and the first thermal reflection part 111, and one surface of the spacer 120 is in contact with the disc part 101, and the other surface is in contact with the first thermal reflection part 111; a fastener 130 fixedly sleeved on the shaft part 102 at the bottom of the first thermal reflection part 111 and in contact with the first thermal reflection part 111 to fix the first thermal reflection part 111 at a preset position on the shaft part 102.

[0062] Fixing the first thermal reflection part body 1111 on the shaft part 102 through the first thermal reflection part through hole 1110 is beneficial to reducing the difficulty of arranging the first thermal reflection part 111 on the shaft part 102 at the bottom of the disc part 101.

[0063] The spacer 120 facilitates having an interval H between the first thermal reflection part 111 and the disc part 101.

[0064] As an example, the surface of the spacer ring 120 facing the side of the disk portion 101 is parallel to the surface of the spacer ring 120 facing the side of the first heat reflection portion 111, so as to facilitate making the reflection surface 115 of the first heat reflection portion 111 parallel to the bottom surface of the disk portion 101.

[0065] The fastener 130 is used to cooperate with the spacer ring 120 to fix the first heat reflection portion 111 at a preset position on the shaft portion 102.

[0066] In other embodiments, the heating disk device may not include a spacer ring and a fastener; correspondingly, a serrated member surrounding the shaft portion is provided on the outer periphery of the shaft portion at the bottom of the disk portion, and the first heat reflection portion body is engaged with the serrated member through the through hole of the first heat reflection portion, so that the first heat reflection portion is disposed on the shaft portion at the bottom of the disk portion; or the first heat reflection portion is disposed on the shaft portion at the bottom of the disk portion by welding.

[0067] Specifically, a card slot 103 is provided on the outer periphery of the shaft portion 102 below the first heat reflection portion 111; the fastener 130 includes: a flexure 131 fixedly sleeved on the shaft portion 102 between the bottom of the first heat reflection portion 111 and the card slot 103 and in contact with the first heat reflection portion 111; a jumpring 132 embedded in the card slot 103; the total thickness of the fastener 130 when the spacer ring 120, the first heat reflection portion 111, and the flexure 131 are in their original lengths is greater than the distance from the bottom surface of the disk portion 101 to the bottommost part of the card slot 103.

[0068] Wherein, the original length state of the flexure 131 means the state when the flexure 131 is not deformed. The total thickness of the fastener 130 when the spacer ring 120, the first heat reflection portion 111, and the flexure 131 are in their original lengths means the sum of the thickness of the spacer ring 120, the thickness of the first heat reflection portion 111, the thickness of the flexure 131 when it is not deformed, and the thickness of the jumpring 132.

[0069] Since the sum of the thickness of the spacer ring 120, the thickness of the first heat-reflecting part 111, the thickness of the elastic element 131 when not deformed, and the thickness of the retaining ring 132 is greater than the distance from the bottom surface of the disc portion 101 to the bottommost part of the card slot 103. Therefore, when the retaining ring 132 is embedded in the card slot 103, the elastic element 131 can be deformed to generate an elastic force, so that the first heat-reflecting part 111 can be fixed at a preset position on the shaft portion 102 through the elastic force.

[0070] Moreover, fixing the first heat-reflecting part 111 through the elastic element 131 and the retaining ring 132 is also beneficial to reducing the probability of generating particles during the process of fixing the first heat-reflecting part 111, thereby being beneficial to improving the quality of the wafer after processing.

[0071] In other embodiments, the fastener may also be other parts capable of fixing the first heat-reflecting part on the shaft portion, such as a clamp.

[0072] More specifically, the fastener 130 further includes an adapter ring 133 fixedly sleeved on the shaft portion 102 between the elastic element 131 and the retaining ring 132.

[0073] It can be understood that when the fastener 130 further includes the adapter ring 133, the total thickness of the fastener 130 when the spacer ring 120, the first heat-reflecting part 111, and the elastic element 131 are in the original length state refers to the sum of the thickness of the spacer ring 120, the thickness of the first heat-reflecting part 111, the thickness of the elastic element 131 when not deformed, the thickness of the adapter ring 133, and the thickness of the retaining ring 132.

[0074] The adapter ring 133 is used to increase the force-bearing area, so that the acting force between the elastic element 131 and the retaining ring 132 can be evenly distributed, thereby being beneficial to improving the service life of the elastic element 131.

[0075] As an example, the shape of the elastic element is frustum-shaped, the large end of the frustum is in contact with the first heat-reflecting part 111, and the small end of the frustum is in contact with the retaining ring 132 (as Figure 2 shown).

[0076] The large end of the frustum is in contact with the first heat reflection part 111, which is beneficial to increasing the contact area between the elastic element 131 and the first heat reflection part 111, thereby facilitating the improvement of the stability of the first heat reflection part 111; the small end of the frustum is in contact with the retaining ring 132, which is beneficial to reducing the volume of the retaining ring 132 and / or the pressure equalizing ring 133, thereby facilitating the reduction of the cost of the retaining ring 132 and / or the pressure equalizing ring 133; moreover, it also facilitates the installation of the retaining ring 132 and / or the pressure equalizing ring 133.

[0077] As another example, a first hollowed-out pattern (as shown in Figure 1 and Figure 2 ) is provided on the side wall of the elastic element 131, which is beneficial to reducing the elastic coefficient of the elastic element 131, thereby facilitating the deformation of the elastic element 131.

[0078] In this embodiment, a second hollowed-out pattern 1201 (as shown in Figure 1 and Figure 2 ) is provided on the side wall of the spacer ring 120, which is beneficial to reducing the contact area between the spacer ring 120 and the disk portion 101, thereby facilitating the reduction of heat conduction between the heating disk 101 and the spacer ring 120, and correspondingly also facilitating the further reduction of the heat release path of the heating disk 100 to the outside.

[0079] In this embodiment, as shown in Figures 1 to 5 , a plurality of first through holes 104 (as shown in Figure 4 and Figure 5 ) are provided in the disk portion 101; a second through hole 114 corresponding to the first through hole 104 is provided in the first heat reflection part 111 (as shown in Figure 3 ); the heating disk device 10 further includes: a plurality of lift pins 140 (as shown in Figure 2 ), which are arranged on the top surface of the disk portion 101 and penetrate through the first through hole 104 and the second through hole 114; a rotation prevention structure 105 is provided between the shaft portion 102 and the first heat reflection part 111.

[0080] The lift pin 140 is used to lift the wafer from the surface of the disk portion 101 under the action of a lift during the process of transferring the wafer.

[0081] The lift pin 140 is used to lift the wafer under the action of a lift during the process of transferring the wafer, and to lower the wafer to the surface of the disk portion 101 under the action of a lift during the process of preparing the wafer for processing.

[0082] The first through hole 104 and the second through hole 114 are used to accommodate the lift pin 140.

[0083] The anti-rotation structure 105 is used to restrict the rotational freedom of the first heat reflection part 111, thereby reducing the probability of damaging the ejector pin 140 due to the rotation of the first heat reflection part 111.

[0084] Specifically, the first heat reflection part 111 includes a first heat reflection part body 1111 and a first heat reflection part through hole 1110 penetrating through the first heat reflection part body 1111, and the first heat reflection part body 1111 is fixedly sleeved on the shaft part 102 through the first heat reflection part through hole 1110. The first heat reflection part through hole 1110 is a D-shaped through hole (as Figure 3 shown); a part of the end of the shaft part 102 close to the disc part 101 is a D-shaped shaft 106 (as Figure 1 shown), and the flat part on the outer periphery of the D-shaped shaft 106 cooperates with the flat part of the D-shaped through hole, and the curved part on the outer periphery of the D-shaped shaft 106 cooperates with the curved part of the D-shaped through hole.

[0085] It can be understood that the D-shaped shaft 106 and the D-shaped through hole (i.e., the first heat reflection part through hole 1110) constitute the anti-rotation structure 105.

[0086] Wherein, the cooperation between the flat part on the outer periphery of the D-shaped shaft 106 and the flat part of the D-shaped through hole means that when the anti-rotation structure 105 is formed, the flat part on the outer periphery of the D-shaped shaft 106 corresponds to the flat part of the D-shaped through hole, and the curved part on the outer periphery of the D-shaped shaft 106 corresponds to the curved part of the D-shaped through hole.

[0087] The anti-rotation structure 105 formed by the D-shaped shaft 106 and the D-shaped through hole is relatively simple, which is beneficial to reducing the difficulty of forming the anti-rotation structure 105 and reducing the number of components. Moreover, the cooperation between the D-shaped shaft 106 and the D-shaped through hole is widely used, which is also beneficial to reducing the cost of forming the anti-rotation structure 105.

[0088] In other embodiments, a part of the end of the shaft part close to the disc part is a square shaft, and correspondingly, the first heat reflection part through hole is a square hole; or a part of the end of the shaft part close to the disc part is a hexagonal shaft, and correspondingly, the first heat reflection part through hole is a hexagonal hole. It can be understood that a part of the end of the shaft part close to the disc part and the first heat reflection part through hole can also be other shapes that can restrict the rotation of the first heat reflection part body.

[0089] In some other embodiments, the anti-rotation structure can also be components such as keys and pins that can restrict the rotation of the first heat reflection part.

[0090] The present invention also provides a heating plate device of the second embodiment. Figure 6 It is a schematic assembly structure diagram of the second embodiment of the heating plate device of the present invention.

[0091] The similarities between the second embodiment and the first embodiment will not be elaborated here. The differences between the second embodiment and the first embodiment are as follows. Referring to Figure 6 , when the projection pattern of the heating plate 200 is located in the projection pattern of the first heat reflection part 211 on a projection plane parallel to the top surface of the disk part 201, the heat reflection component 210 further includes: a second heat reflection part 212, which is located on the top surface of the first heat reflection part 211, the second heat reflection part 212 surrounds the side wall of the disk part 201, and there is a gap between the second heat reflection part 212 and the disk part 201. The second heat reflection part 212 has a reflection surface 215 facing the side wall of the disk part 201, which is beneficial to blocking the path of heat radiating outward from the side wall of the heating plate 201, thereby further reducing the degree of heat loss caused by the external heat radiation of the heating plate 201.

[0092] It should be noted that, in order to clearly show the structure of the heating device, Figure 6 the ejector pin is omitted in

[0093] Specifically, the top of the second heat reflection part 212 is lower than the top of the disk part 201, or the top of the second heat reflection part 212 is flush with the top of the disk part 201, which is beneficial to reducing the influence on other devices (such as a shower-head) 30 in the cavity as shown in Figure 7 .

[0094] As an example, the second heat reflection part 212 is located at the edge position of the top surface of the first heat reflection part 211.

[0095] As another example, the second heat reflection part 212 and the first heat reflection part 211 are of an integral structure. In other embodiments, the second heat reflection part is arranged on the top surface of the first heat reflection part by welding. In some other embodiments, the second heat reflection part can also be arranged on the top surface of the first heat reflection part by other means.

[0096] Correspondingly, the present invention also provides a heating plate device. Figure 7 It is a schematic structure diagram of a semiconductor device according to an embodiment of the present invention.

[0097] Referring to Figure 7 , and in combination with referring to Figures 1 to 5, the semiconductor device includes: a cavity 20; and a heating plate device 10 according to any embodiment of the present invention, disposed in the cavity 20.

[0098] The cavity 20 is used to provide an operating space for processing wafers.

[0099] The heating plate device 10 is used to be fixedly arranged in the cavity of the semiconductor device, and is used to carry a wafer, and during the wafer processing, heat the wafer. Since the heating plate device 10 includes a heating plate 100, the heating plate 100 includes a plate portion 101 and a shaft portion 102, and a heat reflection component 110 disposed on the shaft portion 102. The heat reflection component 110 includes a first heat reflection portion 111 disposed on the shaft portion 102 at the bottom of the plate portion 101. There is a gap H between the first heat reflection portion 111 and the plate portion 101. The first heat reflection portion 111 has a reflection surface 115 facing the bottom surface side of the plate portion 101. The reflection surface 115 is used to reflect the heat radiated from the plate portion 101 to the reflection surface 115 back to the plate portion 101, which is beneficial to blocking the heat radiation path of the heating plate 100, reducing the degree of heat dissipation caused by the external heat radiation of the heating plate 100, correspondingly increasing the effective power of the heating plate 100, thus being beneficial to improving the heating effect of the heating plate 100 on the wafer, and correspondingly increasing the process temperature window.

[0100] As an example, the semiconductor device includes a chemical vapor deposition device.

[0101] When the semiconductor device includes a chemical vapor deposition device, since the heating effect of the heating plate device 10 on the wafer is improved, it is beneficial to improve the quality of the film layer formed by the chemical vapor deposition process.

[0102] Specifically, the chemical vapor deposition device further includes a gas distribution plate 30.

[0103] In other embodiments, the semiconductor device may further include other types of deposition devices, or other semiconductor devices that require a heating plate device.

[0104] For the specific description of the heating plate device 10, please refer to the detailed introduction in the foregoing embodiments, and will not be elaborated in this embodiment.

[0105] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A heating plate device, characterized in that: include: A heating plate, the heating plate comprising a plate portion and a shaft portion, the top of the plate portion being used to carry and heat the wafer, the top of the shaft portion being fixedly connected to the bottom surface of the plate portion and being used to support the plate portion; Heat reflective components; The heat reflecting component includes: a first heat reflecting portion, which is arranged on the shaft portion at the bottom of the disk portion, with a gap between the first heat reflecting portion and the disk portion, and has a reflecting surface facing the bottom surface of the disk portion.

2. The heating plate device according to claim 1, characterized in that: On a projection plane parallel to the top surface of the disk portion, the projection pattern of the heating disk coincides with the projection pattern of the first heat reflecting portion, or the projection pattern of the heating disk is located in the projection pattern of the first heat reflecting portion.

3. The heating plate device according to claim 2, characterized in that: In a case where the projection pattern of the heating disk is located in the projection pattern of the first heat reflecting portion on a projection plane parallel to the top surface of the disk portion, the heat reflecting component further comprises: a second heat reflecting portion, located on the top surface of the first heat reflecting portion, the second heat reflecting portion surrounds the side wall of the disk portion, and there is a gap between the second heat reflecting portion and the disk portion, and the second heat reflecting portion has a reflecting surface facing one side of the side wall of the disk portion.

4. The heating plate device according to claim 3, characterized in that: The top of the second heat reflecting portion is lower than the top of the disk portion, or the top of the second heat reflecting portion is flush with the top of the disk portion.

5. The heating plate device according to any one of claims 1 to 4, characterized in that: The material of the heat reflection component includes one or more of aluminum, stainless steel, nickel alloy and Hastelloy.

6. The heating plate device according to any one of claims 1 to 4, characterized in that: The material of the heat reflecting component is metal, and the surface of the heat reflecting component facing the disk portion is a metal mirror surface, and the metal mirror surface serves as a reflecting surface.

7. The heating plate device according to claim 6, characterized in that: The arithmetic mean surface roughness Ra of the metal mirror surface is less than or equal to 0.2 μm.

8. The heating plate device according to any one of claims 1 to 4, characterized in that: A reflective coating is plated on the surface of the heat reflective component facing the disk portion, and the reflective coating serves as a reflective surface.

9. The heating plate device according to claim 8, characterized in that: The material of the reflective coating includes one or more of aluminum, silver, gold, titanium oxide, zirconium oxide and silicon carbide.

10. The heating plate device according to claim 1, wherein: A reflecting surface of the first heat reflecting portion is parallel to a bottom surface of the tray portion.

11. The heating plate device according to claim 1 or 10, characterized in that: The first heat reflecting part includes a first heat reflecting part body and a first heat reflecting part through hole penetrating the first heat reflecting part body, and the first heat reflecting part body is fixedly sleeved on the shaft through the first heat reflecting part through hole; the heating plate device also includes: a spacer ring, fixedly sleeved between the disk portion and the first heat reflecting portion, with one side of the spacer ring in contact with the disk portion and the other side in contact with the first heat reflecting portion; A fastener is fixedly sleeved on the shaft portion at the bottom of the first heat reflecting portion and contacts the first heat reflecting portion so as to fix the first heat reflecting portion at a preset position on the shaft portion.

12. The heating plate device according to claim 11, wherein: A clamping groove is provided on the outer periphery of the shaft portion below the first heat reflecting portion; and the fastener comprises: an elastic element, fixedly sleeved on the shaft portion between the bottom of the first heat reflecting portion and the clamping groove, and in contact with the first heat reflecting portion; A retaining ring, embedded in the slot; The total thickness of the spacer ring, the first heat reflecting portion, and the fastener when the elastic element is in the original length state is greater than the distance from the bottom surface of the disk portion to the bottom of the slot.

13. The heating plate device according to claim 12, wherein: The elastic element is in the shape of a truncated cone, the large end of the truncated cone is in contact with the first heat reflecting portion, and the small end of the truncated cone is in contact with the retaining ring.

14. The heating plate device according to claim 12, wherein: A first hollow pattern is provided on the side wall of the elastic element.

15. The heating plate device according to claim 12, wherein: The fastener further comprises: a pressure equalizing ring fixedly sleeved on the shaft portion between the elastic element and the retaining ring.

16. The heating plate device according to claim 11, wherein: A second hollow pattern is arranged on the side wall of the spacer ring.

17. The heating plate device according to claim 1, wherein: The disk portion is provided with a plurality of first through holes; the first heat reflecting portion is provided with second through holes corresponding to the first through holes; the heating disk device further comprises: a plurality of ejector pins, which are provided on the top surface of the disk portion and pass through the first through holes and the second through holes; A rotation-stopping structure is provided between the shaft portion and the first heat reflecting portion.

18. The heating plate device according to claim 17, wherein: The first heat reflecting part comprises a first heat reflecting part body and a first heat reflecting part through hole penetrating the first heat reflecting part body, and the first heat reflecting part body is fixedly sleeved on the shaft portion through the first heat reflecting part through hole, and the first heat reflecting part through hole is a D-shaped through hole; The portion of the shaft portion close to one end of the disk portion is a D-shaped shaft, the planar portion on the outer circumference of the D-shaped shaft matches the planar portion of the D-shaped through hole, and the curved portion on the outer circumference of the D-shaped shaft matches the curved portion of the D-shaped through hole.

19. The heating plate device according to any one of claims 1 to 4, characterized in that: The interval between the first heat reflecting portion and the disk portion ranges from 10 mm to 50 mm.

20. A semiconductor device, characterized in that: include: Cavity; The heating plate device according to any one of claims 1 to 19, arranged in the cavity.

21. The semiconductor device according to claim 20, wherein: The semiconductor equipment includes a chemical vapor deposition equipment.

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