Full shielded laminated radio frequency transmission line and method of manufacturing the same

Abstract

The application provides a full-shielded stacked radio frequency transmission line, which comprises a signal line, a first lateral shielding body, a second lateral shielding body, a first shielding line and a second shielding line; the first lateral shielding body, the first shielding line, the second lateral shielding body and the second shielding line are sequentially connected in a head-to-tail mode to form a shielding cavity, and the signal line is arranged in the shielding cavity. The full-shielded stacked radio frequency transmission line provided by the application has the advantages of high frequency shielding. In addition, the application also provides a manufacturing method of the full-shielded stacked radio frequency transmission line.

Description

Technical Field

[0001] This invention belongs to the field of circuit board manufacturing, and particularly relates to a fully shielded stacked radio frequency transmission line and its manufacturing method. Background Technology

[0002] With the rapid advancement of wireless communication technology, especially the widespread application of 5G technology, the performance standards for radio frequency transmission lines and mobile device antennas are becoming increasingly stringent. This demand is mainly reflected in two aspects: firstly, the requirement for high-frequency signal transmission capabilities, and secondly, the expectation for electromagnetic shielding performance.

[0003] Existing shielding methods struggle to achieve the desired electromagnetic shielding performance in frequency ranges up to 50 GHz and above, which directly impacts the overall performance and signal quality of wireless communication systems. Summary of the Invention

[0004] To address the shortcomings of the existing technology, this application provides a fully shielded stacked radio frequency transmission line to provide high-quality electromagnetic shielding in high-frequency transmission.

[0005] A method for manufacturing a fully shielded stacked radio frequency transmission line includes the following steps:

[0006] A core board is provided, the core board being divided into a shielded area, a first enclosed area and a second enclosed area, the shielded area being located between the first enclosed area and the second enclosed area, the shielded area being provided with a signal line, the first enclosed area being provided with a first inner conductor, and the second enclosed area being provided with a second inner conductor.

[0007] A first side plate is provided on one side of the core board. The first side plate includes a first outer conductor, a second outer conductor, and a first shielding line. The first shielding line is connected between the first outer conductor and the second outer conductor. The first outer conductor is provided corresponding to the first enclosed area, the second outer conductor is provided corresponding to the second enclosed area, and the first shielding line is provided corresponding to the shielding area. The first outer conductor is connected to one end of the first inner conductor, and the second outer conductor is connected to one end of the second inner conductor.

[0008] A second side plate is provided on the other side of the core board. The second side plate includes a third outer conductor, a fourth outer conductor, and a second shielding line. The second shielding line is connected between the third outer conductor and the fourth outer conductor. The third conductor is provided corresponding to the first enclosed area, the fourth outer conductor is provided corresponding to the second enclosed area, and the second shielding line is provided corresponding to the shielding area. The third outer conductor is connected to the other end of the first inner conductor, and the fourth outer conductor is connected to the other end of the second inner conductor.

[0009] Remove a portion of the first inner conductor, a portion of the first outer conductor, and a portion of the third outer conductor corresponding to the first enclosed area. Then, connect another portion of the first outer conductor, another portion of the first inner conductor, and another portion of the third outer conductor in sequence to form a first lateral shield. The two ends of the first lateral shield are respectively connected to one end of the first shielding line and one end of the second shielding line.

[0010] Remove a portion of the second inner conductor, a portion of the second outer conductor, and a portion of the fourth outer conductor corresponding to the second enclosure area. Then, connect another portion of the second outer conductor, another portion of the second inner conductor, and another portion of the fourth outer conductor in sequence to form a second lateral shield. Connect the two ends of the second lateral shield to the other end of the first shielding line and the other end of the second shielding line, respectively, to obtain the fully shielded stacked radio frequency transmission line.

[0011] In some possible embodiments, the core board further includes an inner insulating layer, and the signal lines include a first signal line and a second signal line, which are respectively disposed on opposite sides of the inner insulating layer. The manufacturing method of the core board includes the steps of: forming a first slot and a second slot in an inner substrate, the inner substrate including the inner insulating layer and a first inner copper foil layer and a second inner copper foil layer disposed on opposite sides of the inner insulating layer, the first slot and the second slot both penetrating the first inner copper foil layer and the inner insulating layer; disposing a first inner conductor in the first slot and a second inner conductor in the second slot; etching the first inner copper foil layer to form the first signal line layer; and etching the second inner copper foil layer to form the second signal line layer.

[0012] In some possible embodiments, the first side plate further includes a first outer insulating layer. The method of manufacturing the first side plate includes the steps of: forming a first through hole and a second through hole in the first outer substrate, the first outer substrate including the first outer insulating layer and a first outer copper foil layer, the first outer insulating layer being disposed between the core board and the first outer copper foil layer, and both the first through hole and the second through hole penetrating the first outer copper foil layer and the first outer insulating layer; forming a first outer conductor in the first through hole and a second outer conductor in the second through hole; and etching the first outer copper foil layer to form the first shielding line.

[0013] In some possible embodiments, the second side plate further includes a second outer insulating layer, and the manufacturing method of the second side plate includes the steps of: providing a third through hole and a fourth through hole in the second outer substrate, the second outer substrate including a second outer insulating layer and a second outer copper foil layer, the second outer insulating layer being disposed between the core plate and the second outer copper foil layer, and the third through hole and the fourth through hole both penetrating the second outer copper foil layer and the second outer insulating layer.

[0014] The third outer conductor is disposed in the third through hole, and the fourth outer conductor is disposed in the fourth through hole, and the second outer copper foil layer is etched to form the second shielding line.

[0015] In some possible embodiments, the method further includes the steps of: providing a first adhesive layer between one side of the core board and the first side plate, the first outer conductor and the second outer conductor passing through the first adhesive layer, providing a second adhesive layer between the other side of the core board and the second side plate, and the third outer conductor and the fourth outer conductor passing through the second adhesive layer.

[0016] In some possible embodiments, the first outer conductor and the third outer conductor are both formed at both ends of the first inner conductor by electroplating, and the second outer conductor and the fourth outer conductor are both formed at both ends of the second inner conductor by electroplating.

[0017] In some possible embodiments, a portion of the first inner conductor, a portion of the first outer conductor, and a portion of the third outer conductor corresponding to the first enclosure area are removed by laser etching, and a portion of the second inner conductor, a portion of the second outer conductor, and a portion of the fourth outer conductor corresponding to the second enclosure area are removed by laser etching.

[0018] In some possible embodiments, the method further includes the steps of: providing a first protective layer on the first shielding line, the first protective layer covering one end of the first lateral shield and one end of the second lateral shield; and providing a second protective layer on the second shielding line, the second protective layer covering the other end of the first lateral shield and the other end of the second lateral shield.

[0019] In some possible embodiments, the steps of: providing a third protective layer on the first lateral shield and providing a fourth protective layer on the second lateral shield are further included.

[0020] A fully shielded stacked radio frequency transmission line includes a signal line, a first lateral shield, a second lateral shield, a first shield line, and a second shield line. The first lateral shield, the first shield line, the second lateral shield, and the second shield line are connected end to end in sequence to form a shield cavity, and the signal line is disposed within the shield cavity.

[0021] The transmission line manufacturing method provided in this application removes a portion of the enclosed area (first enclosed area, second enclosed area), leaving the remaining portion to form a lateral shield (first lateral shield, second lateral shield). This lateral shield connects to shielded lines (first shield, second shield) to form a shield cavity. This shield cavity provides omnidirectional electromagnetic shielding for the signal lines (first signal line, second signal line). Furthermore, the shield cavity exhibits good structural stability, ensuring that the transmission line maintains a stable and expected shielding effect during both dynamic and static bending, thereby guaranteeing the overall performance and signal quality of the wireless communication system in the high-frequency band. Attached Figure Description

[0022] Figure 1 This is a schematic cross-sectional view of the inner substrate provided in an embodiment of this application.

[0023] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the first inner copper foil layer of the inner substrate after the first window is set.

[0024] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the inner insulating layer of the inner substrate after the first opening is provided.

[0025] Figure 4 for Figure 3 The diagram shows a cross-section of the first slot after the first inner conductor is installed.

[0026] Figure 5 For etching Figure 4 The diagram shows a cross-sectional view of the core board obtained after the first inner copper foil layer is used to form the first signal line.

[0027] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the core board after the first adhesive layer and the first outer substrate are provided.

[0028] Figure 7 For etching Figure 6 The diagram shows a cross-sectional view of the first outer copper foil layer forming the first side plate.

[0029] Figure 8 for Figure 7 The diagram shows a cross-section of the first side plate after the first through hole is installed.

[0030] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the first via after the first outer conductor is installed.

[0031] Figure 10 for Figure 9 The diagram shows a cross-sectional view of the first outer conductor after the first protective layer has been installed.

[0032] Figure 11 To remove Figure 9 The diagram shows a cross-sectional view of the first outer conductor process.

[0033] Figure 12 To remove Figure 9 The diagram shows a cross-sectional view of the first outer conductor after obtaining a fully shielded stacked radio frequency transmission line.

[0034] Explanation of main component symbols

[0035] Transmission line 100

[0036] Blocked area 101

[0037] First Enclosed Zone 102

[0038] Second Enclosed Zone 103

[0039] First inner conductor 20

[0040] Second inner conductor 21

[0041] First signal line 22

[0042] Second signal line 23

[0043] Core board 24

[0044] First adhesive layer 30

[0045] First through hole 301

[0046] Second through hole 302

[0047] Second adhesive layer 31

[0048] First outer substrate 40

[0049] First outer insulating layer 401

[0050] First outer copper foil layer 402

[0051] Second outer substrate 41

[0052] Second outer insulating layer 411

[0053] Second outer copper foil layer 412

[0054] First outer circuit layer 43

[0055] First shielded line 431

[0056] First side panel 432

[0057] Second outer circuit layer 44

[0058] Second shielded line 441

[0059] Second side panel 442

[0060] First through hole 50

[0061] Second through hole 51

[0062] First via 52

[0063] Second via 53

[0064] Third through hole 54

[0065] Fourth through hole 55

[0066] Third via 56

[0067] Fourth via 57

[0068] First outer conductor 60

[0069] Second outer conductor 61

[0070] Third outer conductor 62

[0071] Fourth outer conductor 63

[0072] First protective layer 70

[0073] Second protective layer 71

[0074] First lateral shield 80

[0075] Second lateral shield 81

[0076] Third protective layer 90

[0077] Fourth protective layer 91

[0078] Inner substrate 10

[0079] Inner insulation layer 11

[0080] First opening 111

[0081] Second opening 112

[0082] First inner copper foil layer 12

[0083] First window opening 121

[0084] Second window 122

[0085] Second inner copper foil layer 13

[0086] First slot 14

[0087] Second slot 15

[0088] Thickness direction A

[0089] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0090] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0091] Please see Figures 1 to 12 This application provides a method for manufacturing a fully shielded stacked radio frequency transmission line 100 (hereinafter referred to as transmission line 100) according to one embodiment, including the following steps:

[0092] S1: Please see Figure 1 An inner substrate 10 is provided. The inner substrate 10 is a double-sided copper-clad substrate. The inner substrate 10 includes an inner insulating layer 11, a first inner copper foil layer 12, and a second inner copper foil layer 13. The first inner copper foil layer 12 and the second inner copper foil layer 13 are respectively disposed on opposite sides of the inner insulating layer 11. The inner substrate 10 has a thickness direction A, along which the inner substrate 10 is divided into a shielded area 101, a first enclosed area 102, and a second enclosed area 103. The shielded area 101 is connected between the first enclosed area 102 and the second enclosed area 103.

[0093] In this embodiment, the inner insulating layer 11 is made of polyimide. In other embodiments of this application, the inner insulating layer 11 is made of at least one of the following: liquid crystal polymer (LCP), phenyl epoxy resin (EP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxyethylene (PPO), polyimide (PI), polyester resin (PET), and polyethylene naphthalate (PEN).

[0094] S2: Please see Figure 2 A first window 121 and a second window 122 are provided on the first inner copper foil layer 12. The first window 121 is located in the first enclosed area 102. The second window 122 is located in the second enclosed area 103. Parts of the inner insulating layer 11 are exposed at the bottom of the first window 121 and at the bottom of the second window 122, respectively. Specifically, the first window 121 and the second window 122 are formed by dry film processing, exposure development, and etching. The etching solution used in this etching process is for metallic copper, and the etching solution can be a ferric chloride etching solution.

[0095] S3: Please see Figure 3 A first opening 111 and a second opening 112 are provided on the inner insulating layer 11. The first opening 111 corresponds to the first window 121. The second opening 112 corresponds to the second window 122. The first opening 111 connects to the first window 121 to form a first groove 14. The second opening 112 connects to the second window 122 to form a second groove 15. Specifically, the first opening 111 and the second opening 112 are formed by dry film processing, exposure development, and etching. The etching solution used in this etching process is for polyimide, and the etching solution can be hydrofluoric acid.

[0096] S4: Please see Figure 4A first inner conductor 20 is disposed within the first slot 14, and a second inner conductor 21 is disposed within the second slot 15. The first inner conductor 20 is connected to the second inner copper foil layer 13. The second inner conductor 21 is also connected to the second inner copper foil layer 13. Both the first inner conductor 20 and the second inner conductor 21 are formed by selective copper plating.

[0097] S5: Please see Figure 5 The first inner copper foil layer 12 is etched to form a first signal line 22, and the second inner copper foil layer 13 is etched to form a second signal line 23, a first connecting pad 131, and a second connecting pad 132, to obtain a core board 24. The first connecting pad 131 and the second connecting pad 132 are spaced apart and insulated. The second signal line 23 is disposed between the first connecting pad 131 and the second connecting pad 132, and is electrically isolated from both the first connecting pad 131 and the second connecting pad 132. The first signal line 22 and the second signal line 23 are disposed opposite each other on opposite sides of the inner insulating layer 11. Both the first signal line 22 and the second signal line 23 are used to transmit electrical signals in a frequency range of up to 50 GHz and above. Specifically, the first signal line 22 and the second signal line 23 are formed through steps such as dry film processing, exposure development, and etching.

[0098] S6: Please see Figure 6 A first adhesive layer 30 is provided on one side of the core board 24, and a second adhesive layer 31 is provided on the other side of the core board 24. The first adhesive layer 30 has a first through hole 301 and a second through hole 302. The first through hole 301 corresponds to the first inner conductor 20, and the second through hole 302 corresponds to the second inner conductor 21. The second adhesive layer 31 has a third through hole 311 and a fourth through hole 312. The third through hole 311 corresponds to the first through hole 301, and the fourth through hole 312 corresponds to the second through hole 302.

[0099] S7: Please see again Figure 6 A first outer substrate 40 is disposed on the first adhesive layer 30, and a second outer substrate 41 is disposed on the second adhesive layer 31. The first outer substrate 40 includes a first outer insulating layer 401 and a first outer copper foil layer 402. The first outer insulating layer 401 is disposed between the first outer copper foil layer 402 and the first adhesive layer 30. The second outer substrate 41 includes a second outer insulating layer 411 and a second outer copper foil layer 412. The second outer insulating layer 411 is disposed between the second outer copper foil layer 412 and the second adhesive layer 31.

[0100] S8: Please see Figure 7 The first outer copper foil layer 402 is etched to form a first outer circuit layer 43, resulting in a first side plate 432. The second outer copper foil layer 412 is etched to form a second outer circuit layer 44, resulting in a second side plate 442. In the first side plate 432, the first outer circuit layer 43 includes a first shielding line 431 corresponding to the shielded area 101. In the second side plate 442, the second outer circuit layer 44 includes a second shielding line 441 corresponding to the shielded area 101.

[0101] S9: Please see Figure 8 A first through hole 50 and a second through hole 51 are provided on the first side plate 432. The first through hole 50 connects to the first through hole 301 of the first adhesive layer 30 to form a first through hole 52. The second through hole 51 connects to the second through hole 302 of the first adhesive layer 30 to form a second through hole 53. Similarly, a third through hole 54 and a fourth through hole 55 are provided on the second side plate 442. The third through hole 54 connects to the third through hole 311 of the second adhesive layer 31 to form a third through hole 56. The fourth through hole 55 connects to the fourth through hole 312 of the second adhesive layer 31 to form a fourth through hole 57.

[0102] The first via 52 is provided corresponding to the third via 56. The first inner conductor 20 is exposed at the bottom of the first via 52, and the first connecting pad 131 is exposed at the bottom of the third via 56. Both the first via 52 and the third via 56 are provided corresponding to the first enclosing area 102. The second via 53 is provided corresponding to the fourth via 57. The second inner conductor 21 is exposed at the bottom of the second via 53, and the second connecting pad 132 is exposed at the bottom of the fourth via 57. Both the second via 53 and the fourth via 57 are provided corresponding to the second enclosing area 103.

[0103] S10: Please refer to Figure 9A first outer conductor 60 is provided in the first via 52, and a second outer conductor 61 is provided in the second via 53. The first outer conductor 60 connects one end of the first inner conductor 20 and the first shielding line 431, and the second outer conductor 61 connects the other end of the second inner conductor 21 and the first shielding line 431. A third outer conductor 62 is provided in the third via 56, and a fourth outer conductor 63 is provided in the fourth via 57. The third outer conductor 62 connects one end of the first connecting pad 131 and the second shielding line 441, and the fourth outer conductor 63 connects the other end of the second connecting pad 132 and the second shielding line 441. The first outer conductor 60, the second outer conductor 61, the third outer conductor 62, and the fourth outer conductor 63 are all formed by electroplating.

[0104] S11: Please refer to Figure 10 A first protective layer 70 is provided on the first outer conductor 60, the second outer conductor 61 and the first shielding line 431, and a second protective layer 71 is provided on the third outer conductor 62, the fourth outer conductor 63 and the second shielding line 441.

[0105] In this embodiment, the first protective layer 70 and the second protective layer 71 are made of polyimide.

[0106] S12: Please refer to Figure 11 A portion of the first outer conductor 60, a portion of the first inner conductor 20, a portion of the first connecting pad 131, and a portion of the third outer conductor 62 within the first enclosure area 102 are cut along the thickness direction A, such that another portion of the first outer conductor 60, another portion of the first inner conductor 20, another portion of the first connecting pad 131, and another portion of the third outer conductor 62 together form a first lateral shield 80. The two ends of the first lateral shield 80 are respectively connected to one end of the first shielding line 431 and one end of the second shielding line 441. Similarly, a portion of the second outer conductor 61, a portion of the second inner conductor 21, a portion of the second connecting pad 132, and a portion of the fourth outer conductor 63 within the second enclosure area 103 are cut along the thickness direction A, such that another portion of the second outer conductor 61, another portion of the second inner conductor 21, another portion of the second connecting pad 132, and another portion of the fourth outer conductor 63 together form a second lateral shield 81. The two ends of the second lateral shield 81 are respectively connected to the other end of the first shield line 431 and the other end of the second shield line 441 to obtain the transmission line 100.

[0107] In this embodiment, the manufacturing method of the transmission line 100 further includes the step of:

[0108] S13: Please see Figure 12 A third protective layer 90 is provided on the first lateral shield 80, and the two ends of the third protective layer 90 are respectively connected to the first protective layer 70 and the second protective layer 71. Similarly, a fourth protective layer 91 is provided on the second lateral shield 81, and the two ends of the fourth protective layer 91 are respectively connected to the first protective layer 70 and the second protective layer 71. The third protective layer 90 and the fourth protective layer 91 can be formed by 3D printing, and the material of the third protective layer 90 and the fourth protective layer 91 is the same as that of the first protective layer 70.

[0109] Compared with the prior art, the manufacturing method of the transmission line 100 provided in this application has the following advantages:

[0110] (i) By removing part of the enclosed area (first enclosed area 102, second enclosed area 103), the remaining enclosed area forms a lateral shield (first lateral shield 80, second lateral shield 81). This lateral shield connects to shielding lines (first shielding line 431, second shielding line 441) to form a shielding cavity. This shielding cavity can achieve all-round electromagnetic shielding of the signal lines (first signal line, second signal line). At the same time, the shielding cavity has good structural stability, so that it can maintain a stable expected shielding effect during the dynamic and static bending of the transmission line 100, thereby ensuring the overall performance and signal quality of the wireless communication system in the high-frequency band (greater than 50GHz).

[0111] (ii) By cutting part of the enclosed area so that the remaining part forms a lateral shield, it is beneficial to avoid the micro-connection design in the traditional plated hole process. This not only makes the processing convenient, but also enables full coverage of the signal line.

[0112] Also see Figure 12 This application embodiment also provides a transmission line 100, including signal lines (a first signal line and a second signal line), a first lateral shield 80, a second lateral shield 81, a first shielding line 431, and a second shielding line 441. The first lateral shield 80, the first shielding line 431, the second lateral shield 81, and the second shielding line 441 are connected end-to-end to form a shielding cavity (not shown), and the signal lines are disposed within the shielding cavity. The transmission line 100 can be a radio frequency transmission line or an antenna, used for signal transmission in the frequency range above 50 GHz, and maintains a stable shielding effect.

[0113] The above description is merely an optimized implementation of this application, and its application should not be limited to this specific implementation. Other modifications and alterations made by those skilled in the art based on the technical concept of this application should fall within the protection scope of this application.

Claims

1. A method for manufacturing a fully shielded stacked radio frequency transmission line, characterized in that, Including the following steps: A core board is provided, the core board being divided into a shielded area, a first enclosed area and a second enclosed area, the shielded area being located between the first enclosed area and the second enclosed area, the shielded area being provided with a signal line, the first enclosed area being provided with a first inner conductor, and the second enclosed area being provided with a second inner conductor. A first side plate is provided on one side of the core plate. The first side plate includes a first outer conductor, a second outer conductor, and a first shielding line. The first shielding line is connected between the first outer conductor and the second outer conductor. The first outer conductor is provided corresponding to the first enclosed area, the second outer conductor is provided corresponding to the second enclosed area, and the first shielding line is provided corresponding to the shielding area. The first outer conductor is connected to one end of the first inner conductor, and the second outer conductor is connected to one end of the second inner conductor. A second side plate is provided on the other side of the core plate. The second side plate includes a third outer conductor, a fourth outer conductor, and a second shielding line. The second shielding line is connected between the third outer conductor and the fourth outer conductor. The third outer conductor is provided corresponding to the first enclosed area, the fourth outer conductor is provided corresponding to the second enclosed area, and the second shielding line is provided corresponding to the shielding area. The third outer conductor is connected to the other end of the first inner conductor, and the fourth outer conductor is connected to the other end of the second inner conductor. Remove a portion of the first inner conductor, a portion of the first outer conductor, and a portion of the third outer conductor corresponding to the first enclosed area. Then, connect another portion of the first outer conductor, another portion of the first inner conductor, and another portion of the third outer conductor in sequence to form a first lateral shield. The two ends of the first lateral shield are respectively connected to one end of the first shielding line and one end of the second shielding line. Remove a portion of the second inner conductor, a portion of the second outer conductor, and a portion of the fourth outer conductor corresponding to the second enclosure area. Then, connect another portion of the second outer conductor, another portion of the second inner conductor, and another portion of the fourth outer conductor in sequence to form a second lateral shield. Connect the two ends of the second lateral shield to the other end of the first shielding line and the other end of the second shielding line, respectively, to obtain the fully shielded stacked radio frequency transmission line.

2. The manufacturing method as described in claim 1, characterized in that, The core board further includes an inner insulating layer, and the signal lines include a first signal line and a second signal line, which are respectively disposed on opposite sides of the inner insulating layer. The manufacturing method of the core board includes the following steps: A first slot and a second slot are provided on the inner substrate. The inner substrate includes the inner insulating layer and a first inner copper foil layer and a second inner copper foil layer disposed on opposite sides of the inner insulating layer. The first slot and the second slot both penetrate the first inner copper foil layer and the inner insulating layer. A first inner conductor is disposed within the first slot, and a second inner conductor is disposed within the second slot. The first inner copper foil layer is etched to form the first signal line layer, and the second inner copper foil layer is etched to form the second signal line layer.

3. The manufacturing method as described in claim 1, characterized in that, The first side panel further includes a first outer insulating layer, and the method for manufacturing the first side panel includes the following steps: A first through hole and a second through hole are provided on the first outer substrate. The first outer substrate includes a first outer insulating layer and a first outer copper foil layer. The first outer insulating layer is disposed between the core board and the first outer copper foil layer. The first through hole and the second through hole both penetrate the first outer copper foil layer and the first outer insulating layer. A first outer conductor is disposed in the first through hole, and a second outer conductor is disposed in the second through hole. The first outer copper foil layer is etched to form the first shielding line.

4. The manufacturing method as described in claim 1, characterized in that, The second side plate further includes a second outer insulating layer, and the method for manufacturing the second side plate includes the following steps: A third through hole and a fourth through hole are provided on the second outer substrate. The second outer substrate includes a second outer insulating layer and a second outer copper foil layer. The second outer insulating layer is disposed between the core board and the second outer copper foil layer. The third through hole and the fourth through hole both penetrate the second outer copper foil layer and the second outer insulating layer. The third outer conductor is disposed in the third through hole, and the fourth outer conductor is disposed in the fourth through hole. The second outer copper foil layer is etched to form the second shielding line.

5. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: A first adhesive layer is provided between one side of the core plate and the first side plate, and the first outer conductive body and the second outer conductive body pass through the first adhesive layer. A second adhesive layer is provided between the other side of the core plate and the second side plate, and the third outer conductor and the fourth outer conductor pass through the second adhesive layer.

6. The manufacturing method as described in claim 1, characterized in that, The first outer conductor and the third outer conductor are both formed at both ends of the first inner conductor by electroplating, and the second outer conductor and the fourth outer conductor are both formed at both ends of the second inner conductor by electroplating.

7. The manufacturing method as described in claim 1, characterized in that, The first inner conductor, the first outer conductor, and the third outer conductor corresponding to the first enclosure area are removed by laser etching, and the second inner conductor, the second outer conductor, and the fourth outer conductor corresponding to the second enclosure area are also removed by laser etching.

8. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: A first protective layer is provided on the first shielded line, the first protective layer covering one end of the first lateral shield and one end of the second lateral shield. A second protective layer is provided on the second shielding line, and the second protective layer covers the other end of the first lateral shield and the other end of the second lateral shield.

9. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: A third protective layer is provided in the first lateral shield, and A fourth protective layer is provided on the second lateral shield.

10. A fully shielded stacked radio frequency transmission line manufactured by a method for manufacturing a fully shielded stacked radio frequency transmission line as described in any one of claims 1 to 9, characterized in that, The device includes a signal line, a first lateral shield, a second lateral shield, a first shielding line, and a second shielding line. The first lateral shield, the first shielding line, the second lateral shield, and the second shielding line are connected end to end to form a closed shielding cavity. The signal line is located inside the shielding cavity. The first lateral shield and the second lateral shield are located on opposite sides of the signal line, and the first shielding line and the second shielding line are located on opposite sides of the signal line.

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