Methods and apparatus for extending component pins, electronic devices and storage media

Abstract

This disclosure provides a method, apparatus, electronic device, and storage medium for extending component leads, relating to the field of electronic manufacturing technology. Before the target component is inserted, this disclosure allows for advance knowledge of the lead protrusion length and circuit board thickness. Based on this data, the expected lead length is determined, and it is judged whether extension is necessary. This effectively prevents lead protrusion problems caused by excessively short leads, avoiding subsequent rework or scrap, and reducing production costs and time losses. Determining whether to extend based on the expected lead length makes the production process more precise. Only leads that truly require extension are processed, avoiding unnecessary processing steps and improving production efficiency. Simultaneously, the lead extension device is controlled to add lead patch panels, ensuring precise and controllable extension process and guaranteeing consistent product quality. Processing the leads requiring extension ensures that the target lead's length exceeding the circuit board requirements meets requirements, enhancing the soldering effect during wave soldering.

Description

Technical Field

[0001] This disclosure relates to the field of electronic manufacturing technology, and in particular to a method and apparatus for extending component pins, electronic equipment, and storage medium. Background Technology

[0002] In the production of electronic devices, printed circuit boards (PCBs) need to accommodate a large number of electronic components. Among these, through-hole components often fail to protrude from the PCB. These components must be inserted into PCB vias, with their leads extending a certain distance beyond the bottom of the PCB to be successfully wave soldered, as the liquid solder needs to climb along the leads during wave soldering. However, in practice, some through-hole components have leads that are too short to protrude from the bottom of the PCB. This makes it difficult to assess the soldering status, leading to ineffective soldering and frequent rework. Rework can easily result in scrapped boards, increasing costs, reducing production efficiency, and impacting the quality of server boards. Currently, there is a lack of effective methods in related technologies to solve the problem of through-hole components failing to protrude from the PCB. Summary of the Invention

[0003] This disclosure provides a method, apparatus, electronic device, and storage medium for extending component leads. Its main purpose is to solve the problem of components not exiting the board.

[0004] According to a first aspect of this disclosure, a method for extending component pins is provided, comprising:

[0005] In response to the insertion command of the target component, obtain the pin protrusion length of the target component and the target thickness of the target circuit board;

[0006] Based on the pin protrusion length and target thickness, determine whether the target pin in the target component exceeds the expected protrusion length of the target circuit board;

[0007] Based on the expected pin length, determine whether the target pin needs to be lengthened.

[0008] After determining that pin length extension is required, the pin extension device is controlled to attach a pin patch to the target pin to extend the pin length.

[0009] Optionally, obtain the pin protrusion length of the target component, including:

[0010] Based on the identification code of the target component, find the size data of the target component stored in the component database;

[0011] If dimensional data is stored, the stored pin output length is output based on the dimensional data.

[0012] Optionally, if size data is not stored, the method also includes:

[0013] The scanning device is invoked to scan the target component, obtain the size data of the target component, and store the scanned size data into the component database.

[0014] Optionally, based on the pin protrusion length and target thickness, determine the length by which the target pin of the target component exceeds the expected protrusion length on the target circuit board, including:

[0015] Obtain the correction coefficients for the target components during soldering;

[0016] Based on the correction factor, calculate the correction length of the target pin after the target component is inserted into the target circuit board;

[0017] Subtract the target thickness from the corrected length to obtain the expected leg length.

[0018] Optionally, based on the expected pin length, determine whether the target pin needs pin length extension, including:

[0019] Determine whether the expected leg length falls within the standard range defined by the first length to the second length;

[0020] If it is within the standard range, then the target pin does not need to be extended in length.

[0021] If the expected pin length is less than the first length, then the target pin needs to be lengthened.

[0022] Optionally, the method also includes:

[0023] After determining that the expected lead length is greater than the second length, the shearing device is controlled to trim the target lead so that the expected lead length reaches the standard range.

[0024] Optionally, the lead surface mount includes axial surface mount and radial surface mount, and the non-mounted areas of the axial surface mount and radial surface mount are cut out;

[0025] The control pin extension device adds pin patches to the target pin, including:

[0026] Based on the expected board length, calculate the target number of axial patch layers required for the target pins;

[0027] Control pin extension device to attach axial patches of the target number of layers to the target pin;

[0028] After the axial patch is mounted, the control pin extension device mounts radial patches onto the target pin.

[0029] According to a second aspect of this disclosure, an apparatus for extending component pins is provided, comprising:

[0030] The acquisition unit is used to acquire the pin protrusion length of the target component and the target thickness of the target circuit board in response to the insertion command of the target component.

[0031] The determining unit is used to determine, based on the pin protrusion length and target thickness, the expected protrusion length of the target pin in the target component that exceeds the target circuit board.

[0032] The judgment unit is used to determine whether the target pin needs to be lengthened based on the expected pin length.

[0033] The mounting unit is used to control the pin extension device to add a pin patch to the target pin after determining that the pin length needs to be extended, so as to extend the target pin.

[0034] Optionally, the acquisition unit includes:

[0035] The lookup module is used to find the size data of the target component stored in the component database based on the identification code of the target component;

[0036] The output module is used to output the stored pin output length based on the stored dimensional data.

[0037] Optionally, the device also includes:

[0038] The scanning unit is used to invoke the scanning device to scan the target component when no dimensional data is stored, obtain the dimensional data of the target component, and store the scanned dimensional data into the component database.

[0039] Optionally, the determining unit includes:

[0040] The acquisition module is used to acquire the correction coefficients when the target component is being soldered.

[0041] The first calculation module is used to calculate the corrected length of the target pin after the target component is inserted into the target circuit board, based on the correction coefficient.

[0042] The second calculation module is used to subtract the target thickness from the corrected length to obtain the expected leg length.

[0043] Optionally, the decision unit includes:

[0044] The judgment module is used to determine whether the expected leg length is within the standard range defined by the first length to the second length;

[0045] The first determining module is used to determine that the target pin does not need to be extended in length when it is within the standard range;

[0046] The second determining module is used to determine that the target pin needs to be lengthened when the expected pin length is less than the first length.

[0047] Optionally, the device also includes:

[0048] The control unit is used to control the shearing device to trim the target pin after determining that the expected lead length is greater than the second length, so that the expected lead length reaches the standard range.

[0049] Optionally, the lead surface mount includes axial surface mount and radial surface mount, and the non-mounted areas of the axial surface mount and radial surface mount are cut out;

[0050] The added unit includes:

[0051] The third calculation module is used to calculate the target number of axial patches that need to be added to the target pins based on the expected board length.

[0052] The first control module is used to control the pin extension device to attach axial patches of the target number of layers to the target pin.

[0053] The second control module is used to control the pin extension device to attach radial patches to the target pins after the axial patch mounting is completed.

[0054] According to a third aspect of this disclosure, an electronic device is provided, comprising:

[0055] At least one processor; and

[0056] A memory communicatively connected to the at least one processor; wherein,

[0057] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the component pin extension method described in the first aspect above.

[0058] According to a fourth aspect of this disclosure, a non-transitory computer-readable storage medium is provided storing computer instructions, wherein the computer instructions are used to cause the computer to perform the component pin extension method described in the first aspect above.

[0059] According to a fifth aspect of this disclosure, a computer program product is provided, including a computer program that, when executed by a processor, implements the method for extending component pins as described in the first aspect above.

[0060] This disclosure provides a method, apparatus, electronic device, and storage medium for extending component leads, relating to the field of electronic manufacturing technology. Before the target component is inserted, this disclosure allows for advance knowledge of the lead protrusion length and circuit board thickness. Based on this data, the expected lead length is determined, and it is judged whether extension is necessary. This effectively prevents lead protrusion problems caused by excessively short leads, avoiding subsequent rework or scrap, and reducing production costs and time losses. Judging whether to extend based on the expected lead length makes the production process more precise. Only leads that truly require extension are processed, avoiding unnecessary processing steps and improving production efficiency. Simultaneously, the lead extension device is controlled to add lead patch, ensuring precise and controllable extension process and consistent product quality. Processing leads requiring extension ensures that the target lead's length exceeding the circuit board meets requirements, enhancing the soldering effect during wave soldering. Achieving the required lead length facilitates smooth solder flow, resulting in stronger soldering, improved electrical connection stability and mechanical strength, reduced probability of product failure during use, and improved quality and reliability of products such as server boards.

[0061] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0062] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0063] Figure 1 A flowchart illustrating a method for extending component pins according to an embodiment of this disclosure;

[0064] Figure 2 A flowchart illustrating another method for extending component pins according to an embodiment of this disclosure;

[0065] Figure 3 A schematic diagram of an axial patch provided in an embodiment of this disclosure;

[0066] Figure 4 A schematic diagram of a radial patch provided in an embodiment of this disclosure;

[0067] Figure 5 A schematic diagram of a device for extending component pins provided in an embodiment of this disclosure;

[0068] Figure 6 A schematic diagram of another device for extending component pins provided in an embodiment of this disclosure. Detailed Implementation

[0069] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0070] The following description, with reference to the accompanying drawings, outlines a method, apparatus, electronic device, and storage medium for extending component pins according to embodiments of the present disclosure.

[0071] Figure 1 This is a flowchart illustrating a method for extending component pins according to an embodiment of the present disclosure.

[0072] like Figure 1 As shown, the method includes the following steps:

[0073] Step 101: In response to the insertion command of the target component, obtain the pin protrusion length of the target component and the target thickness of the target circuit board.

[0074] In the embodiments of this disclosure, during the manufacturing process of an electronic device, when an insertion instruction for a target component is received, the stage for acquiring the pin protrusion length of the target component and the thickness of the target circuit board is performed. Specifically, the pin protrusion length data of the target component is acquired through sensors, data interfaces, or pre-stored information databases connected to the production equipment control system. These data sources may include, but are not limited to: pin protrusion length information provided by component suppliers and stored in a database; and pin protrusion length data acquired by scanning the component during its first production run using a scanning device. It should be clarified that the pin protrusion length is not the length of the pin itself, but rather the length from the pin tip to the lowest non-pin structure on the component. For example, in a plug-in connector, the pin is the conductive part used to connect to the PCB, while the connector may also have structures for fixing or insulation. The distance between the lowest of these non-pin structures and the pin tip is the pin protrusion length.

[0075] For the target thickness of the target circuit board, real-time measurement can be performed using a high-precision thickness measuring instrument, or relevant data can be extracted from a pre-established circuit board thickness database. This database stores thickness information for various target circuit boards. After the production process starts, the corresponding thickness data is accurately matched and obtained based on the model, batch, and other identification information of the target circuit board. By obtaining the lead extension length of the target component and the target thickness of the target circuit board in the above ways, a precise data foundation is provided for subsequently determining whether the target lead of the target component exceeds the expected lead length of the target circuit board. This ensures that the entire production process can be based on accurate data for subsequent operations and judgments, thereby guaranteeing product quality and production efficiency.

[0076] Step 102: Based on the pin protrusion length and target thickness, determine that the target pin in the target component exceeds the expected protrusion length of the target circuit board.

[0077] In the embodiments of this disclosure, after obtaining the pinout length data of the target component and the target thickness data of the target circuit board, this determination process is implemented through specific computational logic.

[0078] Some through-hole components have pins with special structures, such as pin bending or irregular pin spacing. These structural features may affect the actual extension length of the pins on the circuit board. If the pins are bent, the impact of the bending on the actual extension length must be considered when calculating the expected lead length. The initially calculated expected lead length should be corrected based on the bending angle and shape of the pin using a specific geometric algorithm. During production, both the component manufacturing process and the circuit board processing process have certain tolerance ranges. For example, there are manufacturing tolerances for the lead extension length of through-hole components and machining tolerances for the circuit board thickness. When determining the expected lead length, adjustments need to be made based on these tolerance ranges. If the lead extension length tolerance is ±ΔL1 and the circuit board thickness tolerance is ±ΔL2, then the impact of these tolerances on the result must be considered when calculating the expected lead length. Adjustments should be made up or down from the initial calculated value to obtain an expected lead length range that better reflects actual production conditions.

[0079] By comprehensively considering the various influencing factors mentioned above, a thorough analysis, judgment, and adjustment were conducted on the initially calculated expected lead length. Ultimately, a more accurate and practically accurate expected lead length was determined for the target component's lead exceeding the target circuit board's length. This precise expected lead length provides a reliable basis for subsequent judgments regarding whether lead length extension is necessary, playing a crucial role in ensuring the smooth operation of the entire production process and the stability of product quality.

[0080] Step 103: Based on the expected pin length, determine whether the target pin needs to be lengthened.

[0081] In the embodiments of this disclosure, a specific standard range, such as 0.5-1mm, is set to better fix components during wave soldering, based on industry standards and manufacturing process requirements (this standard range is set according to the IPC standard and can be adjusted according to actual conditions in different production scenarios). The expected lead length obtained in step 102 is compared with this standard range.

[0082] If the expected lead length is greater than or equal to 0.5mm and less than or equal to 1mm, it indicates that the current length of the target lead meets the requirements of wave soldering and other soldering processes. In this case, the target lead does not need to be lengthened and can directly proceed to the normal production process, such as wave soldering. When the expected lead length is greater than 1mm: it indicates that the target lead is too long. Although this will not cause the lead to not extend beyond the board, it may have some impact on production, such as increasing the cost and time of the lead trimming process after wave soldering. In this case, although lead lengthening is not required, this situation needs to be recorded, and an alarm message for excessive lead length should be recorded for the corresponding part number in the lead extension length database. If more than 3 boards have this alarm record, it means that the impact of the lead length on production has become significant, and a relevant task needs to be triggered to notify the part number applicant to communicate with the supplier to reduce the lead length of the plug-in components, and simultaneously modify the lead length value in the system to ensure that the lead length in subsequent production is more in line with the requirements.

[0083] When the expected lead length is greater than 0 and less than 0.5mm: This indicates that the lead can exit the board, but the lead length is too short to meet the soldering process requirements, which may affect the soldering quality and lead to problems such as cold solder joints. In this case, it is determined that the target lead needs to be lengthened to ensure that the lead reaches the standard range of 0.5-1mm after the lengthening, thus meeting the soldering requirements.

[0084] When the expected lead length is less than or equal to 0 and its absolute value is less than the target circuit board thickness, it means that the lead does not extend beyond the board but can be inserted into the PCB. This situation does not meet production requirements, and the lead length must be extended to make the lead extension length reach the standard range.

[0085] When the expected lead length is less than or equal to 0, and its absolute value is greater than or equal to the target circuit board thickness: it means that the target lead cannot enter the through hole of the PCB at all. In this case, the target lead cannot be extended to solve the problem, and an error will be reported directly. It will not enter the production process and other materials that meet the production requirements need to be replaced.

[0086] Through a rigorous judgment process, based on different expected pin lengths, it accurately determines whether the target pin needs to be lengthened, providing clear guidance for subsequent production operations, effectively avoiding production problems caused by pin length issues, and ensuring product quality and production efficiency.

[0087] Step 104: After determining that pin length extension is required, control the pin extension device to attach a pin patch to the target pin to extend the target pin.

[0088] In the embodiments of this disclosure, the pin extension device is the core equipment for realizing this operation. This device possesses precise control and operational capabilities, enabling it to work collaboratively with other equipment on the production line to extend target pins. The pin extension is specifically achieved by attaching a pin patch to the target pin. When controlling the pin extension device to attach the pin patch, precise program control ensures that the pin patch is accurately installed on the target pin. Based on the actual length requirements and position information of the target pin, the program controls the robotic arm, suction cup, and other components of the pin extension device to grasp, move, and attach the pin patch, thereby completing the extension of the target pin and ensuring its length meets production requirements (e.g., 0.5-1mm), thus guaranteeing the smooth operation of subsequent wave soldering and other production processes.

[0089] This disclosure provides a method for extending component leads. Before component insertion, the method obtains the lead length and circuit board thickness in advance, allowing for advance knowledge of the lead extension. Based on this data, the expected lead length is determined, and it is judged whether extension is necessary. This effectively prevents lead length issues caused by excessively short leads, avoiding subsequent rework or scrap, and reducing production costs and time losses. Determining whether to extend based on the expected lead length makes the production process more precise. Only leads that truly require extension are processed, avoiding unnecessary steps and improving production efficiency. Simultaneously, the lead extension device is equipped with lead patch panels, ensuring precise and controllable extension, guaranteeing consistent product quality. Processing leads requiring extension ensures that the target lead's extension beyond the circuit board meets requirements, enhancing the soldering effect during wave soldering. Achieving the required lead length facilitates smooth solder flow, resulting in a stronger solder joint, improving the electrical connection stability and mechanical strength of the product, reducing the probability of product failure during use, and improving the quality and reliability of products such as server boards.

[0090] To clearly illustrate the embodiments of this disclosure, this embodiment provides a flowchart of another method for extending component pins.

[0091] like Figure 2 As shown, the method includes the following steps:

[0092] Step 201: Based on the identification code of the target component, search for the size data of the target component stored in the component database; and obtain the target thickness of the target circuit board.

[0093] If the dimension data is stored, proceed to step 202; if the dimension data is not stored, proceed to step 203.

[0094] Specifically, in step 201, when the insertion operation of the target component is involved, the identification code of the target component is first obtained. This identification code serves as a unique identifier for the component throughout the entire production system, possessing uniqueness and determinism. Using this identification code, the system performs a search operation in a pre-built component database. The component database is an electronic data collection storing a large amount of component information, including dimensional data for various components. This dimensional data is integrated and entered based on multiple aspects of information such as component design specifications, manufacturing processes, and actual measurements. By matching the identification code of the target component with the records in the database, the system can quickly locate and extract the corresponding dimensional data of the target component. This dimensional data covers multiple key dimensions of the target component and is of great significance for determining the component's lead length and subsequent production operations.

[0095] Simultaneously, the system also needs to obtain the target thickness of the target circuit board. The thickness of the target circuit board is one of the key factors affecting the lead length of components. The target thickness can be obtained through direct measurement using a high-precision thickness measuring instrument to measure the target circuit board in real time; alternatively, it can be extracted from a pre-stored database of circuit board thickness information. This database stores corresponding thickness data based on the circuit board's model, batch, and other information. The system accurately retrieves the thickness data from the database by identifying the relevant identifiers of the target circuit board.

[0096] After completing the above data acquisition operations, the system will select different paths based on the storage status of the acquired target component size data. If the target component size data is successfully found in the component database, it indicates that the system has obtained the key information for the next precise calculation and operation, and step 202 will be executed. If the target component size data is not stored in the database, it means that the currently acquired information is insufficient to support subsequent operations according to the conventional process, and the system will execute step 203 to take other corresponding processing measures to ensure the continuity and stability of the production process and avoid production stoppages or quality problems due to data loss.

[0097] Step 202: Based on the size data, output the stored pin output length.

[0098] Specifically, in step 202, the dimensional data and pin protrusion length data are stored in a mutually related manner in the constructed component database. The dimensional data of each target component corresponds to its specific pin protrusion length information. Based on the acquired dimensional data, the system accurately retrieves and outputs the corresponding pin protrusion length from the database according to pre-set data association rules and query algorithms.

[0099] Step 203: Call the scanning device to scan the target component, obtain the size data of the target component, and store the scanned size data into the component database.

[0100] Specifically, in step 203, when the system fails to find the corresponding size data in the component database based on the identification code of the target component, it uses a scanning device to scan the target component. This scanning device generally adopts non-contact optical scanning technology, such as laser scanning or 3D vision scanning, and obtains key dimensional information such as the outline, pin position, and length of the target component by emitting light of a specific wavelength or by using image acquisition equipment.

[0101] During the scanning operation, the target component is placed within the working area of ​​the scanning device. The scanning device operates according to a preset scanning program and parameters to ensure the completeness and accuracy of the acquired data. For example, the scanning device may rotate 360° around the target component to collect data from different angles, avoiding data omissions due to obstructions. During the scanning process, the scanning device converts the acquired analog signals into digital signals and performs preliminary data processing and analysis to extract the dimensional data of the target component. After acquiring the dimensional data of the target component, the system stores this data in the component database. The component database employs a specific data storage structure and management mechanism to ensure data security, integrity, and retrieval. The system associates the scanned dimensional data with the target component's identification code for subsequent querying and retrieval. During storage, the data may be encrypted to prevent data leakage and tampering.

[0102] Step 204: Obtain the correction coefficient for the target component during the soldering process.

[0103] Specifically, in step 204, the target component is affected by various factors during soldering, such as soldering temperature, soldering time, solder characteristics, and the material properties of the component and circuit board. These factors cause physical changes in the leads during soldering, thus affecting their final lead length. To calculate the lead length more accurately, a correction coefficient is needed. The system searches a pre-established correction coefficient database based on parameters such as the type and material of the target component and the soldering process used, thereby obtaining the corresponding correction coefficient. This database stores correction coefficients under different conditions, providing an important basis for subsequent accurate calculations.

[0104] Step 205: Calculate the corrected length of the target pin after the target component is inserted into the target circuit board, based on the correction factor.

[0105] Specifically, in step 205, after obtaining the correction coefficient, the system will use this correction coefficient to correct the theoretical length of the target component pin. Assuming the theoretical length of the target component pin (such as the pin protrusion length obtained in step 202 or the length determined based on the scanning data) is L, and the obtained correction coefficient is k, then the corrected length of the target pin is calculated using the formula "corrected length = L × k". This calculation process fully considers the influence of the soldering process on the pin length, making the calculation result closer to the actual situation.

[0106] Step 206: Subtract the target thickness from the corrected length to obtain the expected leg length.

[0107] Specifically, in step 206, after obtaining the corrected length of the target pin, the expected pin length is determined by a simple subtraction operation. The corrected length calculated in step 205 is used as the minuend, and the target thickness of the target circuit board is used as the subtrahend. Assuming the corrected length is L1 and the target thickness is T, then the expected pin length L2 = L1 - T. For example, if the corrected length is 0.84 mm and the target thickness is 0.3 mm, then the expected pin length is 0.84 - 0.3 = 0.54 mm.

[0108] Step 207: Determine whether the expected leg length is within the standard range defined by the first length to the second length.

[0109] If it is within the standard range, proceed to step 207; if the expected leg length is less than the first length, proceed to step 208; if the expected leg length is determined to be greater than the second length, proceed to step 209.

[0110] Specifically, in step 207, after obtaining the expected lead length of the target pin after the target component is inserted into the target circuit board, the system compares this expected lead length with a pre-defined standard range defined by a first length to a second length. In the technical field of electronic component and circuit board assembly, this standard range is set based on industry standards, production process requirements, and a large amount of experimental data. Its purpose is to ensure that the target pin length meets the quality standards of subsequent production processes such as soldering. Typically, when wave soldering or other soldering processes are involved, to ensure that the liquid solder can rise smoothly and achieve good soldering results, the first length is set to 0.5mm and the second length to 1mm. However, this range can be reasonably adjusted according to different production scenarios, product types, and process requirements.

[0111] When the expected lead length is within the standard range of the first and second lengths, it indicates that the length of the target lead meets production requirements and satisfies the quality standards of subsequent soldering and other processes. At this point, the system will execute step 207, which determines that the target lead does not require lead length extension, and the target component can directly enter the subsequent normal production process, such as wave soldering. This effectively avoids unnecessary lead length extension processes, improves production efficiency, and also ensures the stability of product quality.

[0112] If the expected lead length is less than the first length, it means the target lead is too short and cannot meet the soldering process's requirements for lead protrusion length, which may lead to quality problems such as weak soldering or cold solder joints. In this case, the system will execute step 208, which will then perform a lead length extension operation on the target lead. Through specific technical means, such as adding lead surface mounts, the target lead length will be brought to the standard range to ensure soldering quality and product performance.

[0113] When the expected lead length is determined to be greater than the second length, it indicates that the target lead is too long. Although this will not affect the lead exit from the board, it may have some impact on subsequent production operations. For example, it may increase the cost and time of the lead trimming process after wave soldering, and may even cause a short circuit risk between leads during production. At this time, the system will execute step 209, which may take corresponding measures, such as recording and statistically analyzing the lead length issues. If the problem of lead length being too long for the same type of component occurs frequently, relevant personnel can be notified to communicate with the supplier to adjust the component lead design, or a targeted lead trimming process can be added in the production process to optimize the production flow and ensure smooth production and product quality reliability. Through this rigorous judgment process, the present invention can effectively deal with different lead length situations, ensuring precise control of the production process and stable improvement of product quality.

[0114] Step 208: Determine that the target pin does not require pin length extension.

[0115] Step 209: Determine the target pin that needs to be lengthened.

[0116] Step 210: Based on the expected board length, calculate the target number of axial patch layers required for the target pins.

[0117] Specifically, in step 210, after determining that the target pin needs pin extension (e.g., when step 208 determines that the expected pin length is less than the first length), the process proceeds to step 210. This step determines the required number of axial patch layers based on the expected board length. The axial patch is one of the key components used for pin extension, and it has specific size specifications. The effective length of each axial patch in the extension direction is fixed. When calculating the target number of layers, a mathematical operation is used, dividing the length that the target pin needs to be extended by the effective length of a single axial patch. The pin extension must ensure that it reaches or exceeds the standard length lower limit; even if the remainder is less than the effective length of a single axial patch, an additional patch layer is required to meet the extension requirements. Through this precise calculation method, the number of axial patch layers that meet the target pin extension requirements can be determined, providing accurate data support for subsequent extension operations.

[0118] Step 211: Control the pin extension device to attach the target number of axial patches to the target pin.

[0119] Specifically, in step 211, upon receiving the placement instruction, the pin extension device starts according to a preset program. First, its robotic arm or similar actuator precisely moves to the location where the axial patches are stored, and uses a vacuum chuck or other gripping tool to sequentially grip the axial patches according to the calculated target layer number. Then, the device accurately places the gripped axial patches one by one onto the target pins. During the placement process, precise position and pressure control ensures that the axial patches are tightly fitted to the target pins, and that the connections between the patches meet the process requirements. For example, adjacent axial patches may require specific overlapping or butt joint methods to ensure the strength and stability of the extended pins. The non-placement areas of the axial and radial patches are cut out. This design reduces the weight of the patches and allows for better solder flow during subsequent wave soldering, enhancing the soldering effect and ensuring the quality of the electrical and mechanical connections between the pins and the circuit board. Figure 3 This is a schematic diagram of an axial patch, which is an "L"-shaped patch. Figure 3Number 5 represents the pin body of the through-hole component. The "L"-shaped patches shown in numbers 1 and 2 are actually a single integrated structure; they are labeled separately to easily explain the function of their different parts. The main function of the "L"-shaped patch is to vertically increase the pin length downwards from the side. Number 3 is a bottom support device responsible for lifting the "L"-shaped patch and attaching it to the side of the pin; number 4 contains an adhesive material used to firmly attach the "L"-shaped patch to the side of the pin. The height of part 1 of the "L"-shaped patch in the diagram is designed to be 0.5mm. This value is based on the premise that attaching a single patch to a pin just above the bottom of the PCB achieves an ideal length range of 0.5-1mm, thereby improving operational efficiency. The horizontal length of part 2 is 0.1mm. This design aims to minimize the horizontal dimension and avoid structural interference in the horizontal direction caused by multiple "L"-shaped patches on the side.

[0120] Step 212: After the axial patch is mounted, control the pin extension device to mount the radial patch onto the target pin.

[0121] Specifically, in step 212, the radial patch serves to further enhance the stability of the extended pin during the wave soldering process, preventing displacement or detachment of the pin under the impact of molten solder. The pin extension device restarts, its mechanical structure adjusted to a state suitable for gripping and placing the radial patch. Similar to placing axial patches, the device precisely grips the radial patch and places it at a specific position on the target pin. The placement position and angle of the radial patch need to be strictly controlled to ensure that it can effectively reinforce the axial patch without affecting the normal function of the pin during the soldering process. For example, the radial patch may be placed in a ring around the pin or in a specific distribution pattern on critical parts of the pin. Similarly, the non-patch area of ​​the radial patch is cut out, which does not affect the soldering effect between the pin and the circuit board, and reduces weight while ensuring the functionality of the patch. Figure 4 This is a schematic diagram of a radial surface mount device. The radial surface mount device attaches the bottom of "L"-shaped surface mounts together, as shown on the left. It uses multiple horizontal surface mounts, which has the advantage of being compatible with almost all pin widths, but the disadvantage is its complexity. The design concept of the diagram on the right uses a single horizontal surface mount, which is simple and easy to operate, but the disadvantage is that it can only accommodate some fixed pin widths. This disclosure does not limit the form of the radial surface mount device to be used.

[0122] It should be noted that the embodiments of this disclosure may include multiple steps. For ease of description, these steps are numbered, but these numbers are not a limitation on the execution time slots or execution order between the steps; these steps can be implemented in any order, and the embodiments of this disclosure do not limit this.

[0123] Corresponding to the aforementioned method for extending component pins, this disclosure also proposes a device for extending component pins. Since the device embodiments of this disclosure correspond to the aforementioned method embodiments, details not disclosed in the device embodiments can be referred to the aforementioned method embodiments, and will not be repeated here.

[0124] Figure 5 This is a schematic diagram of a device for extending component pins according to an embodiment of the present disclosure, as shown below. Figure 5 As shown, it includes:

[0125] The acquisition unit 31 is used to acquire the pin protrusion length of the target component and the target thickness of the target circuit board in response to the insertion command of the target component.

[0126] The determining unit 32 is used to determine, based on the pin protrusion length and the target thickness, the length of the target pin in the target component that exceeds the expected protrusion length of the target circuit board;

[0127] The judgment unit 33 is used to determine whether the target pin needs to be lengthened based on the expected pin length.

[0128] The mounting unit 34 is used to control the pin extension device to add a pin patch to the target pin after determining that the pin length needs to be extended, so as to extend the target pin.

[0129] This disclosure provides a device for extending component leads. Before component insertion, this device obtains the lead length and circuit board thickness in advance, allowing for advance knowledge of the lead extension situation. Based on this data, the expected lead length is determined, and it is judged whether extension is necessary. This effectively prevents lead length issues caused by excessively short leads, avoiding subsequent rework or scrap, and reducing production costs and time losses. Determining whether to extend based on the expected lead length makes the production process more precise. Only leads that truly require extension are processed, avoiding unnecessary steps and improving production efficiency. Simultaneously, the lead extension device is equipped with lead patch panels, ensuring precise and controllable extension process and guaranteeing consistent product quality. Processing leads requiring extension ensures that the target lead's length exceeding the circuit board requirements meets specifications, enhancing the soldering effect during wave soldering. Achieving the required lead length facilitates smooth solder flow, resulting in a stronger solder joint, improving the electrical connection stability and mechanical strength of the product, reducing the probability of product failure during use, and improving the quality and reliability of products such as server boards.

[0130] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the acquisition unit 31 includes:

[0131] The lookup module 311 is used to look up the size data of the target component stored in the component database based on the identification code of the target component.

[0132] Output module 312 is used to output the stored pin output length based on the stored dimensional data.

[0133] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the device also includes:

[0134] The scanning unit 35 is used to call the scanning device to scan the target component when no size data is stored, obtain the size data of the target component, and store the scanned size data into the component database.

[0135] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the determining unit 32 includes:

[0136] The acquisition module 321 is used to acquire the correction coefficient when the target component is being soldered.

[0137] The first calculation module 322 is used to calculate the corrected length of the target pin after the target component is inserted into the target circuit board based on the correction coefficient.

[0138] The second calculation module 323 is used to subtract the target thickness from the corrected length to obtain the expected leg length.

[0139] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the judgment unit 33 includes:

[0140] The judgment module 331 is used to determine whether the expected leg length is within the standard range defined by the first length to the second length;

[0141] The first determining module 332 is used to determine that the target pin does not need to be extended in length when it is within the standard range;

[0142] The second determining module 333 is used to determine that the target pin needs to be lengthened when the expected pin length is less than the first length.

[0143] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the device also includes:

[0144] The control unit 36 ​​is used to control the shearing device to trim the target pin after determining that the expected lead length is greater than the second length, so that the expected lead length reaches the standard range.

[0145] Furthermore, in one possible implementation of this embodiment, such as Figure 6 As shown, the pin surface mount includes axial surface mount and radial surface mount, and the non-mounted areas of the axial surface mount and radial surface mount are cut out.

[0146] The added unit 34 includes:

[0147] The third calculation module 341 is used to calculate the target number of axial patches that need to be added to the target pins based on the expected board length.

[0148] The first control module 342 is used to control the pin extension device to attach axial patches of the target number of layers to the target pin.

[0149] The second control module 343 is used to control the pin extension device to attach radial patches to the target pins after the axial patch mounting is completed.

[0150] It should be noted that the foregoing explanation of the method embodiments also applies to the apparatus of this embodiment, and the principle is the same, so it is not limited in this embodiment.

[0151] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above-described methods for extending component pins.

[0152] Embodiments of this application also provide a computer-readable storage medium storing a computer program configured to execute the steps in any of the above-described methods for extending component pins.

[0153] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0154] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in the above-described method embodiments for extending the pins of any of the components.

[0155] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above-described methods for extending component pins.

[0156] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0157] The method for extending component pins provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A method for extending the pins of a component, characterized in that, The method includes: In response to the insertion command of the target component, the pin protrusion length of the target component is obtained, and the target thickness of the target circuit board is obtained. Based on the pin protrusion length and the target thickness, determining that the target pin of the target component exceeds the expected protrusion length of the target circuit board includes: obtaining a correction factor when the target component is soldered; calculating the corrected length of the target pin after the target component is inserted into the target circuit board based on the correction factor; and subtracting the target thickness from the corrected length to obtain the expected protrusion length. Based on the expected pin length, determine whether the target pin needs to be lengthened. After determining that pin length extension is required, the pin extension device is controlled to attach pin patches to the target pin to extend it. The pin patches include axial patches and radial patches, with the non-mounted areas of the axial and radial patches being cut out. The process of controlling the pin extension device to attach pin patches to the target pin includes: calculating the target number of axial patches required for the target pin based on the expected board length; controlling the pin extension device to attach the target number of axial patches to the target pin; and controlling the pin extension device to attach the radial patches to the target pin after the axial patches are attached.

2. The method for extending component pins according to claim 1, characterized in that, The step of obtaining the pin protrusion length of the target component includes: Based on the identification code of the target component, locate the size data of the target component stored in the component database; If the size data is stored, the stored pin output length is output based on the size data.

3. The method for extending component pins according to claim 2, characterized in that, In the absence of storing the size data, the method further includes: The scanning device is invoked to scan the target component, obtain the size data of the target component, and store the scanned size data into the component database.

4. The method for extending component pins according to claim 1, characterized in that, The step of determining whether the target pin needs to be lengthened based on the expected pin length includes: Determine whether the expected leg length is within the standard range defined by the first length to the second length; If it is within the standard range, then it is determined that the target pin does not need to be lengthened. If the expected pin length is less than the first length, then the target pin needs to be lengthened.

5. The method for extending component pins according to claim 4, characterized in that, The method further includes: After determining that the expected lead length is greater than the second length, the cutting device is controlled to trim the target lead so that the expected lead length reaches the standard range.

6. A device for extending the pins of a component, characterized in that, The device includes: The acquisition unit is used to acquire the pin protrusion length of the target component and the target thickness of the target circuit board in response to the insertion command of the target component. A determining unit is configured to determine, based on the pin protrusion length and the target thickness, the expected protrusion length of the target pin in the target component exceeding that of the target circuit board, including: obtaining a correction coefficient when the target component is soldered; calculating, based on the correction coefficient, the corrected length of the target pin after the target component is inserted into the target circuit board; and subtracting the target thickness from the corrected length to obtain the expected protrusion length. The judgment unit is used to determine whether the target pin needs to be lengthened based on the expected pin length. An attachment unit is used to control a pin extension device to attach pin patches to a target pin after determining that pin length extension is required, thereby extending the target pin. The pin patches include axial patches and radial patches, with the non-attached areas of the axial and radial patches being cut out. Controlling the pin extension device to attach pin patches to the target pin includes: calculating the target number of axial patches required for the target pin based on the expected board length; controlling the pin extension device to attach the target number of axial patches to the target pin; and controlling the pin extension device to attach the radial patches to the target pin after the axial patches are attached.

7. An electronic device, characterized in that, include: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, which, when executed by the at least one processor, enables the at least one processor to perform the method for extending component pins as described in any one of claims 1-5.

8. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform a method for extending component pins according to any one of claims 1-5.

Images