Head-mounted device

Abstract

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heating device, a heat dissipation plate and an external refrigeration and heat dissipation device, the heating device is arranged in the shell and attached to the heat dissipation plate, a heat conducting medium is arranged in the heat dissipation plate, at least part of the structure of the heat dissipation plate is exposed out of the shell, the external refrigeration heat dissipation device can be attached to the part, exposed out of the shell, of the heat dissipation plate, and then heat dissipation of the heat dissipation plate is achieved. According to the head-mounted equipment provided by the embodiment of the invention, a heat dissipation structure combining the energy storage heat dissipation plate and the external refrigeration heat dissipation device is utilized, heat dissipation is performed by utilizing the energy storage heat dissipation plate under the condition of medium and low power consumption, and rapid heat dissipation is performed by utilizing the external refrigeration heat dissipation device under the condition of high power consumption, so that on one hand, the structure of the head-mounted equipment can be simplified; on the other hand, due to the fact that no fan structure exists, noise can be lowered, and user experience is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of head-mounted devices, and specifically relates to a head-mounted device. Background Art

[0002] Extended Reality (XR) is a term used to describe an environment or interaction behavior that combines virtual and real elements. It includes AR (Augmented Reality), VR (Virtual Reality), and MR (Mixed Reality) technologies, which can cross virtual and real worlds and are one of the technical approaches to realizing the metaverse. In terms of hardware, it also includes head-mounted displays, hand-held devices, foot-mounted devices, and whole-body experience device parts, etc. Among them, the head circumference adjustment mechanism is usually in the rear shell assembly of the head-mounted display device and is used to elongate or shorten the head circumference sizes of various users, thereby achieving comfortable wearing.

[0003] All-in-one machines such as XR, AR, and MR are head-mounted intelligent devices that highly integrate an independent computing system, an optical display system, an audio system, and a perception and interaction system in one space. While gradually developing towards intelligence, they are also developing towards being thinner, lighter, with higher performance, and more functions. As the performance becomes more powerful and the integration degree and assembly density continue to increase, the working power consumption and heat generation increase. Specifically, it includes: 1. Higher frequencies and performance: to achieve smooth and timely images; 2. Larger and clearer optical displays: the optical and display components are involved in image processing and transmission, and as the Field of View (FOV) and image clarity continue to increase, the heat generation is large; 3. Perception and interaction solution design: VR / AR / MR devices require more integrated voice interaction, sound field design, gesture interaction, face recognition, see-through, 6DoF, etc. The heat dissipation problem has become one of the pain points in the overall design of VR / AR / MR. If the heat cannot be dissipated in time, it will cause the temperatures of the GPU, sensors, display screens, and chips to be too high, resulting in the phenomenon of game scene trailing in the system and reducing the experience. At the same time, VR / AR / MR are devices worn on the face and eyes. If the heat dissipation performance is not good, it will also affect the user's wearing experience.

[0004] Currently, the more common heat dissipation methods used in the above-mentioned head-mounted devices are the combination of active air cooling (fan) and passive (heat pipe) cooling. When the power consumption is large, two fans are required. The existing heat dissipation methods have many disadvantages: 1. When the power consumption is large, usually two fans are required, resulting in a large occupied structural volume and an increase in weight. 2. When using two fans, more air inlets and outlets are required, resulting in an increase in structural complexity. 3. When using two fans, it generates greater noise and a greater flow of air, directly affecting the user experience. 4. It makes the overall structure of the head-mounted device heavy and large. Summary of the Invention

[0005] An embodiment of the present application provides a head-mounted device, which includes a housing, a heating device, a heat dissipation plate, and an external refrigeration and heat dissipation device; the heating device is arranged inside the housing and is attached to the heat dissipation plate, a heat conduction medium is arranged inside the heat dissipation plate, at least part of the structure of the heat dissipation plate is exposed outside the housing, and the external refrigeration and heat dissipation device can be attached to the part of the heat dissipation plate exposed outside the housing, so as to realize heat dissipation of the heat dissipation plate.

[0006] For the head-mounted device provided by the embodiment of the present application, by using a heat dissipation structure combining an energy storage heat dissipation plate and an external refrigeration and heat dissipation device, in the case of medium and low power consumption, the energy storage heat dissipation plate is used for heat dissipation, and in the case of high power consumption, the external refrigeration and heat dissipation device is used for rapid heat dissipation. On the one hand, the structure of the head-mounted device itself can be simplified, and its volume and weight can be reduced. On the other hand, since there is no fan structure, the noise can be reduced and the user experience can be improved. Description of the Drawings

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0008] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application;

[0009] Figure 2 is Figure 1 A partial structure schematic diagram of another perspective of the head-mounted device in the embodiment;

[0010] Figure 3 is Figure 2 A structural schematic diagram of the separation state of the host and the external refrigeration and heat dissipation device in the embodiment;

[0011] Figure 4 is Figure 2 A structural disassembly schematic diagram of the embodiment;

[0012] Figure 5 is Figure 2 A structural cross-sectional schematic diagram along line A-A in the embodiment;

[0013] Figure 6 It is a structural disassembly schematic diagram of an embodiment of the external refrigeration and heat dissipation device of the present application;

[0014] Figure 7 It is a structural cross-sectional schematic diagram of an embodiment of the external refrigeration and heat dissipation device of the present application;

[0015] Figure 8 is Figure 6Schematic diagram of the structure of the heat pipe in the embodiment. Detailed implementation manners

[0016] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0017] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "include" and "have" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or components inherent to these processes, methods, products, or devices.

[0018] Referring to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0019] As used herein, an "electronic device" (or a head-mounted device) includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, Wireless Local Area Network (WLAN), digital television network such as a DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notebooks, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices including radiotelephone transceivers. Smart devices such as mobile phones, AR, VR, XR, MR, etc. are all electronic devices configured with cellular communication modules.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application. Figure 2 is Figure 1 a schematic diagram of a partial structure of another perspective of the head-mounted device in the embodiment. It should be noted that the head-mounted device in the present application may include head-mounted display devices such as AR (Augmented Reality), VR (Virtual Reality), MR (Mixed Reality), etc. The head-mounted device 10 may include a headband device 100, a host 200, and an external refrigeration and heat dissipation device 300.

[0021] Specifically, the headband device 100 is used to fix the host 200 to the user's head. The detailed features of this part are within the understanding of those skilled in the art and will not be elaborated here. The host 200 may include a display screen, lenses, a housing, a control chip, etc., for realizing the display of images. The specific structure will not be introduced here. In the embodiment of the present application, only the components related to the heat dissipation structure of the host 200 will be described in detail.

[0022] Among them, the host 200 may include a housing 210, a heating device 220, and a heat dissipation plate 230. Please refer to Figures 3 to 5 , Figure 3 which is Figure 2 a schematic diagram of the structure of the host and the external refrigeration and heat dissipation device in a separated state in the embodiment. Figure 4 is Figure 2 a schematic diagram of the structural split in the embodiment.Figure 5 Yes Figure 2 It is a schematic cross-sectional view of the structure along line A-A in the embodiment. Optionally, in this embodiment, the heating device 220 is disposed inside the housing 210 and is attached to the heat dissipation plate 230. Among them, the heating device 220 can be a control circuit board provided with a chip or a device such as an optical engine.

[0023] Optionally, a heat conduction medium is provided inside the heat dissipation plate in this embodiment. Among them, the heat conduction medium includes any one or a mixture of water, oil, etc., n-eicosane, paraffin, and sodium sulfate pentahydrate. The heat conduction medium can undergo a phase change to thereby achieve heat transfer. At least a part of the structure of the heat dissipation plate 230 is exposed outside the housing 210, and the external refrigeration and heat dissipation device 300 can be attached to the part of the heat dissipation plate 230 exposed outside the housing 210, so as to rapidly dissipate heat from the heat dissipation plate 230.

[0024] Optionally, please continue to refer to Figure 4 and Figure 5 , the head-mounted device in this embodiment further includes a first magnetic member 240, which is embedded on the surface of the housing 210 and is used for aligning and attracting with the external refrigeration and heat dissipation device 300. Among them, the first magnetic member 240 can be in a ring structure and is arranged around the circumference of the part of the heat dissipation plate 230 exposed outside the housing 210. The first magnetic member 240 can be a permanent magnet.

[0025] Optionally, please refer to Figure 6 , Figure 6 is a schematic diagram of the structural disassembly of an embodiment of the external refrigeration and heat dissipation device of the present application. Among them, the external refrigeration and heat dissipation device 300 includes a housing 310, a cooler 320, and a suction connection member 330; the housing 310 can include a first housing 311 and a second housing 312, and the first housing 311 and the second housing 312 cooperate to form a receiving cavity. The cooler 320 is disposed in the receiving cavity of the housing 310. The cooler 320 can be a semiconductor cooler and can achieve refrigeration in the energized state.

[0026] Among them, the suction connection member 330 can be aligned and suction-connected with the first magnetic member 240, and the external refrigeration and heat dissipation device 300 can be detachably connected to the housing 210 ([ Figure 2 in the state) and is attached to the part of the heat dissipation plate 230 exposed outside the housing 210. Among them, the cooler 320 includes a cold source end and a heat source end. In the state where the external refrigeration and heat dissipation device 300 is attached to the heat dissipation plate 230, the cold source end is located on the side close to the heat dissipation plate 230 and is used to rapidly dissipate heat from the heat dissipation plate 230.

[0027] Optionally, please refer to Figure 6 and Figure 7 , Figure 7It is a structural cross-sectional schematic diagram of an embodiment of an external refrigeration and heat dissipation device of the present application. The external refrigeration and heat dissipation device 300 in this embodiment also includes a cooling member 340 and a heat dissipation assembly 350. One side of the cooling member 340 is connected to the cold source end of the refrigerator 320, and the other side is exposed to the second shell 312. When the external refrigeration and heat dissipation device 300 is connected to the outer shell 210, the side of the cooling member 340 facing away from the cold source end is in contact with the heat dissipation plate 230.

[0028] The heat dissipation assembly 350 is disposed on the heat source side of the refrigerator 320 to dissipate heat from the heat source side of the refrigerator 320. The heat dissipation assembly 350 in this embodiment includes a fan 351 and a heat spreader 352. Figure 8 , Figure 8 yes Figure 6 Schematic diagram of the structure of the heat spreader in the embodiment, wherein one side of the heat spreader 352 is attached to the heat source end of the refrigerator 320, and the heat from the heat source end of the refrigerator 320 is transferred to the heat spreader 352. A groove 3521 is provided on the other side of the heat spreader 352, and a fan 351 is provided in the groove 3521. The air inlet direction of the fan 351 corresponds to the air inlet hole on the first shell 311, and the air outlet direction of the fan 351 corresponds to the heat source end of the refrigerator 320. The fan 351 is used to dissipate heat from the heat spreader 352. Optionally, the heat spreader 352 is also provided with a plurality of heat dissipation channels 3522 connected to the groove 3521. The heat dissipation channels 3522 can increase the heat dissipation surface area of ​​the heat spreader 352 on the one hand, and increase the flow area of ​​the airflow for the fan 351 on the other hand, thereby improving the heat dissipation efficiency.

[0029] The head-mounted device in the embodiment of the present application performs primary heat dissipation (using a heat sink to dissipate heat) under medium and low power consumption, and the liquid surface energy storage heat dissipation (materials include water and oil, etc.) and phase change energy storage heat dissipation (materials include n-eicosane, paraffin, sodium sulfate pentahydrate, etc.) arranged in the heat sink. Under high power consumption, when the temperature of the head-mounted device is too high, an external refrigeration and heat dissipation device creates a cold source and conducts the low temperature to the heating device to achieve rapid cooling of the heating device. This heat dissipation structure can achieve rapid cooling at high temperatures on the one hand; on the other hand, there is almost no noise and no wind speed, so a better user experience can be obtained.

[0030] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A head-mounted device, It is characterized in that The head-mounted device includes a shell, a heating element, a heat sink and an external cooling and heat dissipation device; the heating element is arranged in the shell and is attached to the heat sink, a heat-conducting medium is arranged in the heat sink, at least part of the structure of the heat sink is exposed from the shell, and the external cooling and heat dissipation device can be attached to the part of the heat sink exposed from the shell, thereby achieving heat dissipation of the heat sink.

2. The head mounted device according to claim 1, It is characterized in that The heat-conducting medium in the heat dissipation plate includes a mixture of any one or more of water, oil, n-eicosane, paraffin, and sodium sulfate pentahydrate.

3. The head mounted device according to claim 1, It is characterized in that The head mounted device further comprises a first magnetic component, which is embedded in the surface of the shell and is used for being aligned and attracted with the external cooling and heat dissipation device.

4. The head mounted device according to claim 3, It is characterized in that The first magnetic component is an annular structure and is arranged around the circumference of the heat dissipation plate exposed from the outer shell.

5. The head mounted device according to claim 3, It is characterized in that The external refrigeration and heat dissipation device includes a shell, a refrigerator and a suction connection member, the refrigerator is arranged in the shell, the suction connection member can be aligningly suction-connected with the first magnetic member, the external refrigeration and heat dissipation device can be detachably connected to the shell through the suction connection member and fit with the part of the heat sink exposed from the shell, the refrigerator includes a cold source end and a hot source end, and when the external refrigeration and heat dissipation device is in a state of being fitted with the heat sink, the cold source end is located on a side close to the heat sink.

6. The head mounted device according to claim 5, It is characterized in that The external refrigeration and heat dissipation device also includes a cooling member, one side of which is connected to the cold source end of the refrigerator, and the other side is exposed to the shell. When the external refrigeration and heat dissipation device is connected to the shell, the side of the cooling member facing away from the cold source end is in contact with the heat sink.

7. The head mounted device according to claim 5, It is characterized in that The external refrigeration and heat dissipation device also includes a heat dissipation component, which is arranged on one side of the heat source end of the refrigerator and is used to dissipate heat from the heat source end of the refrigerator.

8. The head mounted device according to claim 7, It is characterized in that The heat dissipation component includes a fan, and the air outlet direction of the fan corresponds to the heat source end of the refrigerator.

9. The head mounted device according to claim 8, It is characterized in that The heat dissipation component also includes a heat spreader, one side of the heat spreader is attached to the heat source end of the refrigerator, and the other side is provided with a groove, the fan is arranged in the groove, and the heat spreader is also provided with a plurality of heat dissipation channels connected with the groove.

10. The head mounted device according to claim 5, It is characterized in that The refrigerator is a semiconductor refrigerator.

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