Heat dissipation apparatus and electronic device

Abstract

The present application relates to the technical field of heat dissipation, and provides a heat dissipation apparatus and an electronic device, which are used for dissipating heat of a heating element in the electronic device. The heat dissipation apparatus comprises a cold plate main body and a heat conducting member. The cold plate main body is provided with at least one cooling channel for circulation of a cooling medium, and in the thickness direction of the cold plate main body, at least one of two opposite inner walls of at least one cooling channel is provided with a heat dissipation member. The outer wall of the cold plate main body is provided with a cooling area. The heat conducting member surrounds the outer side the cold plate main body and is located in the cooling area, and the heat conducting member is thermally connected to a heating element and the cooling area. By means of such a structural arrangement, the heat dissipation efficiency and performance of the heat dissipation apparatus are improved.

Description

Heat dissipation device and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410436401.5, filed on April 11, 2024, and entitled "Heat dissipation device and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, in particular to a heat dissipation device and an electronic device. BACKGROUND

[0003] With the continuous development of the intelligence of electronic devices, electronic devices integrate a variety of electronic components to meet the requirements of a large amount of information and data processing. These electronic components will generate a large amount of heat during work, and if this part of heat cannot be taken away in time, it will affect the working performance of the electronic device.

[0004] Electronic devices usually strictly consider the heat dissipation requirement due to the integration of a large number of electronic components inside. During work, the heat generated by the electronic components needs to be taken away in time by a heat dissipation device. However, with the continuous upgrading of electronic devices, the electronic components integrated inside the electronic devices are more and more, and the heat generated during work is also higher and higher, and the heat dissipation requirement of the electronic device is also increasing. Therefore, how to improve the heat dissipation efficiency of the electronic device is a problem to be solved.

[0005] SUMMARY

[0006] The present application provides a heat dissipation device and an electronic device, which can improve the heat dissipation efficiency of the heat dissipation device, meet the heat dissipation requirement of the electronic device, and maintain the stable working performance of the electronic device.

[0007] In order to achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0008] The present application provides a heat dissipation device for dissipating heat for a heating element in an electronic device, the heat dissipation device comprising a cold plate main body and a heat conduction member;

[0009] The cold plate main body has at least one cooling channel for the flow of a cooling medium, and at least one of the opposite inner walls of the at least one cooling channel is provided with a heat dissipation member along the thickness direction of the cold plate main body;

[0010] The outer wall of the cold plate main body has a cooling area;

[0011] The heat conduction member is arranged outside the cold plate main body and located in the cooling area, and the heat conduction member is in thermal conduction with the heating element and the cooling area.

[0012] The heat-conducting member in the present application is arranged outside the cold plate main body and in the cooling area, which increases the effective heat-conducting area between the heat-conducting member and the cold plate main body. In this way, the heat-conducting member transmits the heat generated by the heat-generating element to the cold plate main body and dissipates the heat through the cooling area, thereby improving the heat dissipation efficiency of the heat dissipation device on the heat-generating element. In addition, the arrangement of the heat-dissipating member in the cooling channel increases the contact area of the cooling medium flowing in the cooling channel and the length of time during which the cooling medium and the heat-dissipating member are in contact with each other, further improving the heat dissipation efficiency of the heat dissipation device. Such a heat dissipation device can meet the heat dissipation needs of the heat-generating element, maintain the stable operation of the electronic equipment, and improve the performance of the electronic equipment.

[0013] As a possible implementation, the heat-conducting member includes a first heat-conducting part, a second heat-conducting part, and a first connecting part, the first heat-conducting part and the second heat-conducting part are arranged along the thickness direction of the cold plate main body, and the first heat-conducting part and the second heat-conducting part are connected along the same end of the length direction or the width direction of the cold plate main body and the first connecting part.

[0014] At least one of the first heat-conducting part and the second heat-conducting part abuts against the heat-generating element and forms a heat conduction.

[0015] As a possible implementation, the heat-conducting member further includes a second connecting part, the first heat-conducting part is at least two, the at least two first heat-conducting parts are arranged along the length direction or the width direction of the cold plate main body, and the at least two first heat-conducting parts are sequentially connected end to end through the second connecting part.

[0016] As a possible implementation, the heat-conducting member is multiple, and the multiple heat-conducting members are arranged along the length direction or the width direction of the cold plate main body.

[0017] As a possible implementation, the cooling channel is two, the two cooling channels are arranged along the thickness direction of the cold plate main body, and the two cooling channels are parallel to each other or connected in series.

[0018] The heat-dissipating member is arranged in the two cooling channels.

[0019] As a possible implementation, the cold plate main body further includes at least one partition, the cold plate main body has a cavity, and the partition is located in the cavity and separates the cavity into at least two cooling channels along the thickness direction of the cold plate main body.

[0020] The partition is provided with a communication hole, and the adjacent cooling channels are communicated through the communication hole.

[0021] As a possible implementation, the heat-dissipating member is arranged on the opposite two side walls of the two cooling channels along the thickness direction of the cold plate main body.

[0022] As a possible implementation, the heat dissipation pieces are two, and the two heat dissipation pieces are arranged in the cooling channel in a manner of being spaced and symmetric along the width direction of the cold plate body or being adjacent and symmetric;

[0023] The heat dissipation pieces extend along the length direction of the cold plate body.

[0024] As a possible implementation, the cold plate body is provided with an inlet and an outlet on the side away from the heat generating element, and the inlet and the outlet are both in communication with the cooling channel.

[0025] Along the length direction of the cold plate body, the inlet and the outlet are arranged on the edge of the cold plate body in a spaced manner.

[0026] In a second aspect, the present application provides an electronic device, which comprises a heat generating element and the heat dissipation device in any of the foregoing embodiments, and the heat generating element and the heat dissipation device are in thermal conduction.

[0027] The electronic device provided by the present application can improve the heat dissipation efficiency of the electronic device and maintain the stable working performance of the electronic device due to the heat dissipation device in any of the foregoing embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0029] Fig. 1 is a structural schematic view of the heat dissipation device provided by the embodiment of the present application;

[0030] Fig. 2 is an exploded view of the structure of the heat dissipation device provided by the embodiment of the present application;

[0031] Fig. 3 is a partial enlarged view of part A in Fig. 2;

[0032] Fig. 4 is a partial structure view of the cold plate body in the heat dissipation device provided by the embodiment of the present application;

[0033] Fig. 5 is a structure view one of the heat conduction piece in the heat dissipation device provided by the embodiment of the present application;

[0034] Fig. 6 is a structure view two of the heat conduction piece in the heat dissipation device provided by the embodiment of the present application.

[0035] Label explanation: 100-heat dissipation device; 110-cold plate body; 110a-top plate; 110b-bottom plate; 110c-connection plate; 111-heat dissipation piece; 112-baffle; 1121-communication hole; 113-inlet; 114-outlet; 115-groove; 120-heat conduction piece; 121-first heat conduction part; 122-second heat conduction part; 123-first connecting part; 124-second connecting part; 130-connection seat. DETAILED DESCRIPTION

[0036] To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0037] With the continuous development of the intelligence of electronic equipment, the electronic equipment integrates various electronic components to meet the requirements of a large amount of information and data processing. These electronic components will generate a large amount of heat in the working process, and if this part of heat cannot be taken away in time, it will affect the working performance of the electronic equipment.

[0038] Electronic equipment usually strictly considers the heat dissipation requirement because a large number of electronic components are integrated inside. In the working process, the heat generated by the electronic components needs to be taken away in time through a heat dissipation device. However, with the continuous upgrading of electronic equipment, more and more electronic components are integrated inside the electronic equipment, and the heat generated during work is also higher and higher, and the heat dissipation requirement of the electronic equipment is also increasing. Therefore, how to meet the improvement of the heat dissipation efficiency of the electronic equipment is a problem to be solved.

[0039] In order to overcome the defects in the prior art, the present application provides a heat dissipation device and electronic equipment. The heat dissipation device comprises a cold plate body and a heat conduction piece. The cold plate body has a cooling channel for the flow of a cooling medium, and the cooling channel is provided with a heat dissipation piece. The outer wall of the cold plate body has a cooling area. The heat conduction piece is arranged outside the cold plate body, and the heat conduction piece is located in the cooling area. The heat conduction piece thermally conducts the heat generating element of the electronic equipment and the cooling area. Through the connection of the heat conduction piece and the cold plate body, the effective thermal conduction area of the heat dissipation device is increased, the heat dissipation efficiency and performance of the heat dissipation device can be improved, and the electronic equipment can work continuously and stably.

[0040] The content of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can understand the content of the present application more clearly and in detail.

[0041] Fig. 1 is a structural schematic diagram of a heat dissipation device provided by an embodiment of the present application. Fig. 2 is an exploded structural diagram of the heat dissipation device provided by the embodiment of the present application. Fig. 3 is a partial enlarged view of part A in Fig. 2. Fig. 4 is a partial structural diagram of a cold plate body in the heat dissipation device provided by the embodiment of the present application. Fig. 5 is a structural diagram one of a heat conduction member in the heat dissipation device provided by the embodiment of the present application. Fig. 6 is a structural diagram two of the heat conduction member in the heat dissipation device provided by the embodiment of the present application. In combination with Figs. 1-6, the embodiment provides a heat dissipation device 100 for dissipating heat of a heat generating element in an electronic device, which comprises a cold plate body 110 and a heat conduction member 120.

[0042] The cold plate body 110 has at least one cooling channel for cooling medium to flow therethrough, and at least one of opposite inner walls of the at least one cooling channel is provided with a heat dissipation member 111 along a thickness direction (Z direction) of the cold plate body 110.

[0043] An outer wall of the cold plate body 110 has a cooling region.

[0044] The heat conduction member 120 is located outside the cold plate body 110 and in the cooling region, and thermally conducts the heat generating element and the cooling region.

[0045] In the embodiment, the heat conduction member 120 is located outside the cold plate body 110 and in the cooling region, which increases the effective heat conduction area between the heat conduction member 120 and the cold plate body 110. In this way, the heat conduction member 120 can transfer the heat generated by the heat generating element to the cold plate body 110 and dissipate the heat through the cooling region, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the heat generating element. In addition, the heat dissipation member 111 in the cooling channel increases the contact area of the cooling medium in the cooling channel and the heat and the flow duration of the cooling medium in the cooling channel, further improving the heat dissipation efficiency of the heat dissipation device 100. Such a heat dissipation device 100 can meet the heat dissipation requirements of the heat generating element, maintain the stable operation of the electronic device, and improve various performances of the electronic device.

[0046] For example, the cold plate body 110 is connected in sequence along the Z direction by a top plate 110a, a connecting plate 110c and a bottom plate 110b to form a cavity, the cavity forms a cooling channel, and the cooling channel flows with cooling medium. The cooling medium can take away the heat on the cold plate body 110 in the process of flowing, and the outer wall of the cold plate body 110 forms a cooling region. It can be understood that the cold plate body 110 is a metal member, the metal member has heat conductivity, and all the outer walls of the cold plate body 110 are cooling regions.

[0047] Further, the inner wall of the cooling channel is provided with a heat dissipation member 111. When the cooling medium flows in the cooling channel, it also contacts the surface of the heat dissipation member 111. That is, the heat dissipation member 111 increases the flow area of the cooling medium in the cooling channel, that is, the thermal conduction area of the cooling channel is relatively improved. In this way, the cooling medium can take away more heat during the flow process, so that the cold plate body 110 can quickly dissipate heat from the heat generating element, and the heat dissipation efficiency of the heat dissipation device 100 on the heat generating element is improved.

[0048] It can be understood that the outer wall of the cold plate body 110 is a cooling area, the heat conduction member 120 is arranged outside the cold plate body 110 and connected with the outer wall of the cold plate body 110. In this way, the heat conduction member 120 is located in the cooling area, and the heat conduction member 120 is in thermal conduction with the heat generating element and the cooling area of the cold plate body 110. In this way, the heat generated by the heat generating element is transmitted to the cooling area of the cold plate body 110 through the heat conduction member 120, and the multiple side walls of the cold plate body 110 dissipate heat from the heat generating element. In the process of heat dissipation, the heat conduction member 120 is arranged on the cold plate body 110, which increases the thermal conduction area and improves the heat dissipation efficiency of the heat dissipation device 100 on the heat generating element. The overall performance of the heat dissipation device 100 is improved.

[0049] It should be noted that the cooling medium in the embodiment can be water, refrigerant, or oil, etc. The appropriate cooling medium can also be selected according to the actual use of the heat dissipation device 100. For example, the cooling medium can be water. The specific heat capacity of water is relatively large, which can absorb more heat and improve the heat dissipation efficiency of the heat dissipation device 100.

[0050] In addition, the electronic device in the embodiment can be a computer, a notebook, etc. The corresponding heat generating element can be a central processing unit (CPU), etc. The heat dissipation member 111 can be a heat dissipation fin or a turbulence protrusion, etc.

[0051] In some embodiments, the heat conduction member 120 includes a first heat conduction part 121, a second heat conduction part 122, and a first connecting part 123. The first heat conduction part 121 and the second heat conduction part 122 are arranged along the thickness direction (Z direction) of the cold plate body 110. The first heat conduction part 121 and the second heat conduction part 122 are connected with the first connecting part 123 along the same end of the length direction (Y direction) or the width direction (X direction) of the cold plate body 110. At least one of the first heat conduction part 121 and the second heat conduction part 122 abuts against the heat generating element and forms thermal conduction.

[0052] The first heat-conducting part 121 and the second heat-conducting part 122 in the embodiment are arranged along the thickness direction of the cold plate body 110, the first heat-conducting part 121 and the second heat-conducting part 122 extend along the width direction of the cold plate body 110, and the end parts on the same side of the first heat-conducting part 121 and the second heat-conducting part 122 and the first connecting part 123 are connected along the width direction of the cold plate body 110. In this way, the heat-conducting part 120 forms a U-shaped structure, and the first heat-conducting part 121, the second heat-conducting part 122, and the first connecting part 123 surround the surface of the cold plate body 110 and abut against the cold plate body 110. In this way, at least three wall surfaces of the cold plate body 110 are in thermal conduction with the heat-conducting part 120, the contact area of the thermal conduction is increased, and the heat dissipation efficiency of the heat dissipation device 100 is improved. The three side walls of the cold plate body 110 are in contact with the heat-conducting part 120, and the utilization rate of the cooling area of the cold plate body 110 is improved. In the embodiment, the first heat-conducting part 121 abuts against the heat-generating element in the electronic device and forms thermal conduction. Of course, the heat-generating element can also abut against and form thermal conduction with the second heat-conducting part 122, and the embodiment does not limit this. In practice, the relative position of the heat-generating element connected with the cold plate body 110 can be selected according to the structure of the cold plate body 110.

[0053] It can be understood that, in combination with FIGS. 1, 2, 5, and 6, the first heat-conducting part 121 and the second heat-conducting part 122 can also extend along the length direction of the cold plate body 110, and the end parts on the same side of the first heat-conducting part 121 and the second heat-conducting part 122 and the first connecting part 123 are connected along the length direction of the cold plate body 110. Such a heat-conducting part 120 is similar in structure and identical in function to the heat-conducting part 120 in the above-described embodiment, and the embodiment does not repeat the description.

[0054] It should be noted that, in order to ensure the contact area among the heat-conducting part 120, the cold plate body 110, and the heat-generating element, the cold plate body 110 is provided with a groove 115, the structure of the groove 115 matches that of the heat-conducting part 120, so that the surface of the heat-conducting part 120 and the surface of the cold plate body 110 are as flat as possible. In this way, the heat-conducting part 120 and the cold plate body 110 can abut against and form thermal conduction with the heat-generating element. In addition, the groove 115 can ensure the stability of the connection between the heat-conducting part 120 and the cold plate body 110. In the specific implementation process, the surfaces of the heat-conducting part 120, the cold plate body 110, and the heat-generating element that contact with each other can be coated with heat-conducting silicone grease or the like, so as to improve the heat conduction efficiency of the thermal conduction, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the heat-generating element and the overall performance of the heat dissipation device 100.

[0055] On the basis of the foregoing embodiment, the heat conduction member 120 further comprises a second connecting portion 124, and the first heat conduction portion 121 is at least two, the at least two first heat conduction portions 121 are arranged in the length direction or the width direction of the cold plate body 110, and the at least two first heat conduction portions 121 are sequentially connected in a head-to-tail manner through the second connecting portion 124.

[0056] It can be understood that the first heat conduction portion 121 is two, the two first heat conduction portions 121 extend in the width direction of the cold plate body 110, and the two first heat conduction portions 121 are arranged in the length direction of the cold plate body 110. By arranging a plurality of first heat conduction portions 121, the area of heat conduction is increased, and the heat dissipation efficiency of the cold plate body 110 to the heat generating element is improved. In the embodiment, the two first heat conduction portions 121 are connected through the second connecting portion 124, that is, the two first heat conduction portions 121 are sequentially connected in a head-to-tail manner through the second connecting portion 124. In this way, the contact area of the heat conduction member 120 and the heat generating element and the cold plate body 110 is increased, and accordingly, the heat dissipation efficiency of the heat dissipation device 100 is improved, and the utilization rate of the cooling area of the heat dissipation cold plate is improved.

[0057] In some embodiments, the first heat conduction portion 121 can be multiple, the multiple first heat conduction portions 121 extend in the width direction of the cold plate body 110, and adjacent first heat conduction portions 121 are sequentially connected in a head-to-tail manner through the second connecting portion 124.

[0058] Of course, the first heat conduction portion 121 can also extend in the length direction of the cold plate body 110 and be arranged in the width direction of the cold plate body 110, and the heat conduction member 120 is similar in structure and function to the heat conduction member 120 in the foregoing embodiment, and details are not repeated in this embodiment.

[0059] It can be understood that the heat conduction member 120 is multiple, and the multiple heat conduction members 120 are arranged in the length direction or the width direction of the cold plate body 110. In this way, the multiple heat conduction members 120 are connected with the cold plate body 110, which can increase the heat conduction area between the cold plate body 110, the heat conduction member 120 and the heat generating element, increase the heat dissipation contact area, and effectively improve the heat dissipation efficiency of the heat dissipation device 100. In addition, the multiple heat conduction members 120 are arranged outside the cold plate body 110, and the multiple outer walls of the cold plate body 110 can be cooled, thereby improving the utilization rate of the cooling area of the cold plate body 110.

[0060] In some embodiments, the cooling channel is two, the two cooling channels are arranged in the thickness direction of the cold plate body 110, and the two cooling channels are parallel to each other or connected in series with each other; and the heat dissipation member 111 is arranged in the two cooling channels.

[0061] For example, two cooling channels are arranged along the thickness direction of the cold plate body 110 and are parallel to each other. It can be understood that when the cooling medium flows in the two cooling channels, the bottom of the cold plate body 110, the top of the cold plate body 110, and the side wall of the cold plate body 110 all form cooling areas. The plurality of first heat conduction parts 121 of the heat conduction member 120 are connected to the bottom of the cold plate body 110, the second heat conduction part 122 is connected to the top of the cold plate body 110, and the first connecting part 123 is connected to the side wall of the cold plate body 110. In this way, the heat conduction member 120 transmits the heat of the heat generating element to the cooling area at the bottom of the cold plate body 110 through the first heat conduction part 121 and the second connecting part 124, the first connecting part 123 transmits part of the heat to the cooling area at the side wall of the cold plate body 110, and the second heat conduction part 122 transmits the heat to the cooling area at the top of the cold plate body 110. In this way, the utilization rate of the cooling area is increased, the heat dissipation efficiency of the heat dissipation device 100 is improved, and the overall performance of the heat dissipation device 100 is improved.

[0062] Of course, the two cooling channels can also be connected in series. The cooling medium can first flow into the cooling channel close to the heat generating element. In this way, the temperature of the heat generating element can be reduced first due to the large temperature gradient between the cooling medium and the cooling area. As the cooling medium continues to flow in the cooling channel and the heat continues to be transmitted, the cooling medium is cooled in the cooling area of the cold plate body 110.

[0063] In this embodiment, the heat dissipation member 111 is arranged in each of the two cooling channels. The heat conduction member 120 is connected to the inner wall of the cooling channel, and the heat dissipation member 111 forms resistance to the flow of the cooling medium, which can reduce the flow rate of the cooling medium in the cooling channel and prolong the flow time of the cooling medium in the cooling channel. The cooling medium can carry away more heat. In addition, it can be understood that the arrangement of the heat dissipation member 111 increases the effective heat conduction area of the cold plate body 110, the contact area between the cooling medium and the heat dissipation member 111 is increased, and the heat dissipation efficiency of the cold plate body 110 for the heat generating element is improved.

[0064] It should be noted that the specific structure of the two cooling channels in series or in parallel in this embodiment can be selected according to actual needs.

[0065] Specifically, the cold plate body 110 further comprises at least one partition plate 112. The cold plate body 110 has a cavity, and the partition plate 112 is located in the cavity and divides the cavity into at least two cooling channels along the thickness direction of the cold plate body 110. The partition plate 112 is provided with a communication hole 1121, and adjacent cooling channels are communicated through the communication hole 1121.

[0066] Exemplarily, the cold plate body 110 is connected in sequence along the Z direction by the top plate 110a, the connecting plate 110c and the bottom plate 110b to enclose the inside to form a cavity. In the embodiment, the partition plate 112 is one, and one partition plate 112 is arranged in the cavity. The partition plate 112 can separate the cavity into two cooling channels along the thickness direction of the cold plate body 110. The partition plate 112 has a certain spacing between the edge along the length direction or the width direction of the cold plate body 110 and the wall surface of the cavity, and can realize the communication of the two cooling channels.

[0067] Of course, the edge of the partition plate 112 and the wall surface of the cavity can also be completely connected, and the partition plate 112 is provided with a communication hole 1121. The communication hole 1121 can be two, and the two communication holes 1121 are arranged at intervals on the partition plate 112 and penetrate the opposite sides of the partition plate 112 along the thickness direction of the partition plate 112. Different parts of the two cooling channels are communicated through the two communication holes 1121. In this way, the two cooling channels are connected in parallel or series through the two communication holes 1121. It should be noted that the specific position of the communication hole 1121 relative to the partition plate 112 is not limited in the embodiment. The communication hole 1121 can be a round hole, a square hole or a slit, as long as the two cooling channels can be communicated.

[0068] Of course, the partition plate 112 can also be two, and the two partition plates 112 are arranged at intervals along the thickness direction of the cold plate body 110 in the cavity of the cold plate body 110 and separate the cavity into three cooling channels. Adjacent cooling channels are communicated through the communication hole 1121 on the partition plate 112.

[0069] It should be noted that the number of the partition plate 112 in the embodiment is not limited to one or two as described above, and the number of the communication hole 1121 on the partition plate 112 is also not limited to two as described in the example. The embodiment does not limit this.

[0070] In some embodiments, the heat dissipation piece 111 is arranged on the opposite two side walls of the two cooling channels along the thickness direction of the cold plate body 110.

[0071] It can be understood that the cold plate body 110 needs to be cut by a toothed cutter to form the heat dissipation piece 111 in the cavity of the cold plate body 110 during processing, or other ways such as stamping process are used to form the toothed structure on the inner wall of the cold plate body 110. The heat dissipation piece 111 is arranged on two side walls opposite in the thickness direction of the cold plate body 110, that is, one heat dissipation piece 111 is directly connected with the inner wall of the bottom plate 110b of the cold plate body 110, and the other heat dissipation piece 111 is directly connected with the inner wall of the top plate 110a of the cold plate body 110. At this time, the heat dissipation piece 111 and the cold plate body 110 are in thermal conduction, the heat generating element and the cold plate body 110 are in thermal conduction, the heat generating element and the heat conducting piece 120 are in thermal conduction, the heat conducting piece 120 and the cold plate body 110 are in thermal conduction, and the heat generated by the heat generating element has multiple heat transfer paths, so that the heat generated by the heat generating element is quickly dissipated through these heat transfer paths.

[0072] For example, in combination with FIGS. 2 and 4, the heat dissipation piece 111 is two, and the two heat dissipation pieces 111 are arranged in the cooling channel in the width direction (X direction) of the cold plate body 110 and are spaced apart and symmetrical or adjacent and symmetrical; the heat dissipation piece 111 extends in the length direction (Y direction) of the cold plate body 110. Through such a structure of the heat dissipation piece 111, the temperature distribution of the heat dissipation device 100 is more uniform, and the heat dissipation performance of the heat dissipation device 100 can also be improved.

[0073] Specifically, the top plate 110a of the cold plate body 110 is provided with two heat dissipation pieces 111, and the bottom plate 110b is provided with two heat dissipation pieces 111. In the embodiment, two heat dissipation pieces 111 are arranged in each cooling channel, and the two heat dissipation pieces 111 are arranged in the width direction of the cold plate body 110 and are spaced apart and symmetrical, so that the temperature change of the two sides of the cold plate body 110 in the width direction is more uniform. Specifically, the reinforcing ribs are arranged on the middle part of the cold plate body 110 in the width direction of the cold plate body 110, and the two heat dissipation pieces 111 are distributed on the opposite sides of the reinforcing ribs. Of course, the two heat dissipation pieces 111 can also be arranged adjacent and symmetrical in the width direction of the cold plate body 110, and the edges of the two heat dissipation pieces 111 are connected with each other at this time.

[0074] Further, the heat dissipation piece 111 extends in the length direction of the cold plate body 110. It can be understood that the surface area of the heat dissipation piece 111 increases, that is, the effective heat conduction area of the heat dissipation piece 111 increases, and the area of the cooling medium and the heat dissipation piece 111 in contact with each other increases, so that the heat dissipation efficiency of the heat dissipation device 100 can be improved.

[0075] Of course, the structure of the shovels of the heat dissipation member 111 also affects the heat dissipation efficiency of the heat dissipation device 100. In some embodiments, the thickness of the shovels of the heat dissipation member 111 (in the width direction of the cold plate body 110) can be selected to be 0.2 mm, and the spacing between adjacent shovels in the width direction of the cold plate body 110 can be 0.2 mm-0.4 mm, which can improve the heat dissipation efficiency of the heat dissipation device 100. For example, the thickness of the shovels of the heat dissipation member 111 is 0.2 mm, and the spacing between the shovels can be one of 0.2 mm, 0.3 mm, and 0.4 mm. The present embodiment does not specifically limit the combination of the thickness of the shovels and the spacing between the shovels on the heat dissipation member 111.

[0076] On the basis of the foregoing embodiments, as shown in FIGS. 1 and 2, the side of the cold plate body 110 facing away from the heat generating element is provided with an inlet 113 and an outlet 114, both of which are in communication with the cooling channel; the inlet 113 and the outlet 114 are arranged at the edges of the cold plate body 110 in the length direction of the cold plate body 110. The inlet 113 and the outlet 114 are connected to a joint, which is connected to an external mechanism to form a loop for the circulation of the cooling medium. The inlet 113 and the outlet 114 are arranged at intervals in the length direction of the cold plate body 110, and the second heat conduction part 122 of the heat conduction member 120 is located between the inlet 113 and the outlet 114, thereby improving the utilization rate of the cooling area of the cold plate body 110.

[0077] Specifically, the heat dissipation device 100 further comprises a connecting seat 130, the cold plate body 110 is arranged in the connecting seat 130, and the connecting seat 130 is fixedly connected to the electronic device to make the cold plate body 110 in thermal conduction with the heat generating element of the electronic device.

[0078] The heat dissipation device 100 provided in the present embodiment is used for dissipating heat from the heat generating element in an electronic device, and comprises a cold plate body 110 and a heat conduction member 120. The cold plate body 110 has at least one cooling channel for the flow of a cooling medium, and at least one of the opposite inner walls of the at least one cooling channel is provided with a heat dissipation member 111 in the thickness direction of the cold plate body 110. The outer wall of the cold plate body 110 has a cooling area. The heat conduction member 120 is arranged outside the cold plate body 110 and in the cooling area, and is in thermal conduction with the heat generating element and the cooling area. Through such a structure, the heat dissipation efficiency and performance of the heat dissipation device 100 are improved, so that the heat dissipation device 100 can meet the heat dissipation requirements of the electronic device.

[0079] In addition, the present embodiment can also provide an electronic device comprising a heat generating element and the heat dissipation device 100 of any one of the foregoing embodiments, and the heat generating element and the heat dissipation device 100 are in thermal conduction.

[0080] The electronic device provided by the embodiment can improve the heat dissipation efficiency of the electronic device and maintain the stable working performance of the electronic device through the heat dissipation device 100.

[0081] It should be noted that the "one embodiment", "an embodiment", "certain embodiments", "some embodiments", and the like in the specification mean that the described embodiment can include a particular feature, structure, or characteristic, but every embodiment can not necessarily include the particular feature, structure, or characteristic. In addition, such phrases are not necessarily referring to the same embodiment. In addition, when describing a particular feature, structure, or characteristic in connection with an embodiment, the realization of such feature, structure, or characteristic in connection with other embodiments explicitly or implicitly described is within the knowledge of those skilled in the art.

[0082] Generally, the terms should be understood, at least in part, according to a usage in a context. For example, the term "one or more" as used herein, depending at least in part upon a context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used to describe combinations of features, structures, or characteristics in a plural sense. Similarly, terms such as "a" or "the" can be understood to convey a singular usage or a plural usage, depending at least in part upon a context in which the terms are used.

[0083] It should be readily understood that "on", "above", and "on top of", in the present application, should be interpreted in the broadest manner such that "on" not only means "directly on", but also includes the meaning of "on" with intermediate features or layers therebetween, and "above" or "on top of" not only includes the meaning of "above" or "on top of", but also can include the meaning of "above" or "on top of" without intermediate features or layers therebetween (i.e., directly on).

[0084] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90° or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0085] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device for dissipating heat from a heating element in an electronic device, characterized in that: The heat dissipation device includes a cold plate body and a heat conducting member; The cold plate body has at least one cooling channel for circulating a cooling medium, and at least one of two opposite inner walls of at least one cooling channel is provided with a heat sink along the thickness direction of the cold plate body; The outer wall of the cold plate body has a cooling area; The heat conducting member is disposed around the outside of the cold plate body and is located in the cooling area. The heat conducting member thermally conducts heat between the heating element and the cooling area.

2. The heat dissipation device according to claim 1, characterized in that: The heat conducting member includes a first heat conducting portion, a second heat conducting portion and a first connecting portion, wherein the first heat conducting portion and the second heat conducting portion are spaced apart along the thickness direction of the cold plate body, and the first heat conducting portion and the second heat conducting portion are connected to the first connecting portion at the same end along the length direction or the width direction of the cold plate body; At least one of the first heat conducting portion and the second heat conducting portion contacts the heat generating element and forms thermal conduction therewith.

3. The heat dissipation device according to claim 2, characterized in that: The heat conducting member further includes a second connecting portion. There are at least two first heat conducting portions, and at least two first heat conducting portions are spaced apart along the length direction or width direction of the cold plate body. At least two first heat conducting portions are sequentially connected end to end through the second connecting portion.

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: There are a plurality of heat conducting members, and the plurality of heat conducting members are arranged at intervals along the length direction or the width direction of the cold plate body.

5. The heat dissipation device according to any one of claims 1 to 3, characterized in that: There are two cooling channels, the two cooling channels are spaced apart along the thickness direction of the cold plate body, and the two cooling channels are connected in parallel or in series; The heat sink is provided in each of the two cooling channels.

6. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The cold plate body further comprises at least one partition, the cold plate body having a cavity, the partition being located in the cavity and dividing the cavity into at least two cooling channels along a thickness direction of the cold plate body; The partition is provided with a communication hole, and the adjacent cooling channels are connected through the communication hole.

7. The heat dissipation device according to claim 5, characterized in that: The heat sink is arranged on two opposite side walls of the two cooling channels along the thickness direction of the cold plate body.

8. The heat dissipation device according to claim 7, characterized in that: There are two heat sinks, and the two heat sinks are spaced apart and symmetrically or adjacently and symmetrically arranged in the cooling channel along the width direction of the cold plate body; The heat sink extends along the length direction of the cold plate body.

9. The heat dissipation device according to any one of claims 1 to 3, characterized in that: An inlet and an outlet are provided on a side of the cold plate body facing away from the heating element, and both the inlet and the outlet are connected to the cooling channel; Along the length direction of the cold plate body, the inlet and the outlet are spaced apart and arranged at the edge of the cold plate body.

10. An electronic device, characterized in that: The heat dissipation device comprises a heating element and the heat dissipation device according to any one of claims 1 to 9, wherein the heating element and the heat dissipation device are thermally connected.

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