Electrical device thermal conditioning system with thermoelectric cooler module

Abstract

The present invention relates to a system comprising: an inner housing; the electronic equipment is arranged in the inner shell, and the electronic equipment comprises a processing circuit and a generator circuit; an outer housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, where the processing circuitry is coupled to the TEC and configured to: receive an electrical signal; determining a temperature of the inner housing based on the received electrical signal; comparing the determined temperature with a threshold temperature; and based on determining that the determined temperature does not meet the threshold temperature, causing the generator circuit to deliver a DC current to the TEC to cause the TEC to modulate the temperature of the inner housing.

Description

Technical Field

[0001] The present disclosure relates to temperature control of surfaces and packages, particularly for surfaces and packages of electronic devices. Background Art

[0002] A thermoelectric cooler (TEC), also known as a Peltier cooler, is a semiconductor-based electronic component that acts as a solid-state heat pump. Applying a direct current (DC) current to the terminals of the TEC results in a thermal temperature difference. This phenomenon allows one face of the module to be cooled while the opposite face is heated. Reversing the polarity of the DC current reverses the thermal temperature difference. If different surfaces of the TEC experience a thermal temperature difference, a DC current can flow through the TEC. In this way, the thermoelectric module can be used for heating and cooling and can be used in precise temperature sensing and control applications. Summary of the Invention

[0003] Some electrical devices may need to be maintained below a threshold temperature, above a threshold temperature, or within a threshold temperature range. A thermal regulation system for an electrical device may need to control the temperature of the electrical device.

[0004] The present disclosure describes applications of one or more thermoelectric cooler (TEC) modules for controlling and / or sensing the temperature of electronic components and / or electrical devices. The electrical component and / or device may be enclosed within an inner housing. The TEC module may be enclosed between the inner housing and an outer housing and may control the temperature of the electrical component and / or electrical device within the inner housing. Thermodynamic control of electrical components and / or devices such as accelerometers, gyroscopes, or other sensors may be beneficial to the performance of the electrical component and / or device, for example, through precise measurements by the accelerometer, gyroscope, or other sensors.

[0005] When the inner housing and / or the outer housing exhibit a curved, angled, or irregular shape, the TEC module may conform to the shape of the inner housing and / or the outer housing to facilitate thermodynamic control of the electrical component and / or device. In some examples, the system senses the temperature of the inner housing and / or the outer housing based on a signal from the TEC and controls the temperature of the electrical component and / or device within the inner housing based on the sensed temperature. The TEC module may include one or more TECs. The one or more TECs may be electrically coupled (e.g., in series, in parallel) and may be actuated individually or in combination to control the temperature of the inner housing.

[0006] In some examples, the present disclosure describes a system that includes: an inner housing; an electronic device disposed within the inner housing, where the electronic device includes one or more of an accelerometer or a gyroscope; an outer housing radially disposed outside the inner housing relative to an axis of the inner housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, where the TEC is configured to transfer thermal energy between the TEC and the inner housing and between the TEC and the outer housing in response to the application of a DC current to modulate the temperature of the electronic device, and where the inner housing defines a first geometry, where the outer housing defines a second geometry, and where the first surface of the TEC is shaped to conform to the first geometry and the second surface of the TEC is shaped to conform to the second geometry.

[0007] In some examples, the present disclosure describes a system that includes: an inner housing; an electronic device disposed within the inner housing; an outer housing radially disposed outside the inner housing relative to an axis of the inner housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including a plurality of semiconductors, each semiconductor including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, where the TEC is configured to transfer thermal energy between the TEC and the inner housing and between the TEC and the outer housing via the plurality of semiconductors in response to the application of a DC current to modulate the temperature of the electronic device, and where one or more of the inner housing or the outer housing includes a ceramic material, and where the plurality of semiconductors of the TEC are in direct contact with the ceramic material.

[0008] In some examples, the present disclosure describes a system that includes: an inner housing; an electronic device disposed within the inner housing, the electronic device including processing circuitry and a generator circuit; an outer housing disposed radially outside the inner housing relative to an axis of the inner housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, wherein the processing circuitry is coupled to the TEC, and wherein the processing circuitry is configured to: receive an electrical signal corresponding to a temperature of the inner housing; determine the temperature of the inner housing based on the received electrical signal; compare the determined temperature to a threshold temperature; and based on determining that the determined temperature does not meet the threshold temperature, cause the generator circuit to deliver a DC current to the TEC to cause the TEC to transfer thermal energy between one or more locations between the TEC and the inner housing and between the TEC and the outer housing to modulate the temperature of the inner housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.

[0010] Figure 1 is a block diagram illustrating an example electrical system in accordance with the present disclosure.

[0011] Figure 2 is a conceptual diagram showing Figure 1 a cross-sectional view of a thermal regulation system of the electrical system.

[0012] Figure 3 is a conceptual diagram showing a thermoelectric cooler (TEC) disposed between an inner housing and an outer housing of a system disposed in Figure 1 the system.

[0013] Figure 4A is a conceptual diagram showing Figure 1 an example TEC of the system.

[0014] Figure 4B is a conceptual diagram showing Figure 1 another example TEC of the system.

[0015] Figure 5 is a flowchart showing an example process for sensing and regulating thermal energy of an electrical system and / or an electrical device.

[0016] Like reference numerals refer to like elements throughout the drawings and the detailed description. DETAILED DESCRIPTION

[0017] The various examples discussed herein describe a thermal regulation system for an electrical system. The thermal regulation system can include a thermoelectric cooler (TEC) module. The thermal regulation system can transfer thermal energy into and / or out of electrical components and / or devices of the electrical system via the TEC module to control the temperature of the electrical system.

[0018] For some electrical systems, the electrical devices and / or components that make up the system need to be maintained at a specific temperature or within a specific operating temperature range. One or more electrical components and / or devices may need to be maintained below a maximum temperature, above a minimum temperature, and / or within an operating temperature range. For example, one or more sensors may need to be maintained at a specific temperature or within a specific temperature range to accurately sense a signal. The operation of electrical components and / or devices can generate thermal energy, and the thermal energy can flow between the environment surrounding the electrical components and / or devices and the electrical components and / or devices. The thermal regulation system can be coupled to the electrical components and / or electrical devices and can thermally regulate the electrical components and / or electrical devices.

[0019] The electrical components and / or electrical devices can be relatively small in size (e.g., occupy a relatively small volume, surface area, or weight). In such examples, the components of the thermal regulation system may need to be small to effectively thermally regulate the electrical components and / or electrical devices without substantially increasing the volume, weight, or surface area occupied by the electrical system.

[0020] As described in this disclosure, a thermal regulation system for an electrical system can include a TEC module that is configured to regulate the temperature of electrical components and / or electrical devices within the electrical system. The TEC module can include one or more TECs. Each TEC can define a first surface and a second surface. In response to applying a direct current (DC) current to the TEC module with a specific polarity, each TEC can experience a thermal temperature difference between the first surface and the second surface. For example, in response to receiving a DC current with a first polarity, each TEC can experience a temperature difference between the first surface and the second surface, where the first surface is at a lower temperature than the second surface. In another example, in response to receiving a DC current with a second polarity opposite to the first polarity, the TEC can experience a temperature difference between the first surface and the second surface in the opposite direction, e.g., where the first surface is at a higher temperature than the second surface. The multiple TECs within the TEC module can be, for example, electrically coupled in parallel. When electrically coupled, the TECs of the TEC module can be individually or simultaneously activated to control the temperature of the electrical components and / or devices. For example, one or more TECs of the TEC module can be individually activated to control thermal events in a local area.

[0021] Each TEC may include one or more electrical semiconductors extending from a first surface to a second surface. The one or more electrical semiconductors may transfer DC current between the first surface and the second surface in response to receiving a DC current or a DC voltage. Due to the DC current passing through the semiconductor of the TEC, the transfer of the DC current may create a temperature difference between the first surface and the second surface. The semiconductor may be in contact with a ceramic material (e.g., a thermoelectric ceramic material) or a compatible metal alloy at the first surface and the second surface. The ceramic material or the compatible alloy may isolate and / or protect the electrical semiconductor from other components of the electrical system (e.g., from the housing of the system). Each TEC may be shaped and / or positioned to conform to the housing of the electrical system and facilitate the use of the TEC module in electrical systems having curved, angled, or other irregular shapes.

[0022] The temperature difference between the surfaces of each TEC may facilitate the cooling and / or heating of the electrical device / system. In some examples, the TEC may define a first temperature difference between the surfaces of the TEC in response to a DC current of an initial polarity (e.g., the first surface of the TEC is at a lower temperature than the second surface of the TEC). In this example, thermal energy may flow from the TEC to the inner housing of the electrical system in a first direction and from the TEC to the outer housing of the electrical system in a second direction different from the first direction (e.g., opposite to the first direction). The flow of thermal energy from the TEC to the inner housing and separately from the TEC to the outer housing may facilitate the cooling of the electrical devices and / or components disposed within the inner housing. In some examples, the TEC may define a second temperature difference between the surfaces of the TEC in response to a DC current of an opposite polarity. The second temperature difference (e.g., the first surface is at a higher temperature than the second surface) may be different from the first temperature difference. In such an example, thermal energy may flow from the TEC to the inner housing in the second direction and independently from the TEC to the outer housing in the first direction, which may facilitate the heating of the electrical devices and / or components disposed within the inner housing.

[0023] The thermal regulation system described in this disclosure can provide several benefits over other thermal regulation systems for electrical systems. In some examples, the TEC of the TEC module can be curved and can be set and / or positioned within a curved, angled, or irregular housing of an electrical system. Such a configuration can allow for increased applicability of the TEC for thermal regulation of electrical equipment, such as within an electrical system with volume and / or size limitations. The thermal regulation system can use one or more TECs to sense the temperature of one or more components and control the temperature of electrical components and / or devices, for example, without the need for a separate or additional temperature sensor coupled to the electrical system. In some examples, one or more TECs of the TEC module can be individually activated to modulate the temperature of the electrical system within a local area, thereby allowing the thermal regulation system to address local temperature fluctuations within the electrical system without changing the functionality of other components within the thermal regulation system (e.g., other TECs of the TEC module).

[0024] Figure 1 is a block diagram showing an example electrical system 100 (also referred to herein as "system 100") according to the present disclosure. System 100 can include one or more electronic devices 102 disposed within an inner housing 106. System 100 can also include an outer housing 108 that is radially disposed outside the inner housing 106 and encloses the inner housing. System 100 can include a thermal regulation system 104 disposed within the outer housing 108. The thermal regulation system 104 can be configured to regulate the temperature of the electronic devices 102 within the inner housing 106.

[0025] The electronic devices 102 can include one or more electronic components or devices configured to perform one or more functions. The electronic devices 102 can include, but are not limited to, sensors, proof mass blocks, communication circuits, sensing circuits, or other computing circuits or electronic components. The sensors can include accelerometers (e.g., resonant beam accelerometers (RBA)), gyroscopes (e.g., fiber optic gyroscopes), or other sensors configured to sense the movement of system 100. In some examples, the type and functionality of the electronic devices will require the inner housing 106 to define different dimensions and / or different shapes (e.g., rectangular shape, cylindrical shape, spherical shape, prismatic shape, irregular shape).

[0026] The thermal regulation system 104 can include a thermoelectric cooler (TEC) module 109, a processing circuit 112, a generator circuit 114, and a thermistor 116. The TEC module 109 can include one or more TECs 110. The TEC 110 can be thermally coupled to the inner housing 106 and thermally coupled to the outer housing 108. For example, a first surface of the TEC 110 can be thermally coupled to the inner housing 106, and a second surface of the TEC 110 can be thermally coupled to the outer housing 108.

[0027] In some examples, one or more thermistors 116 may form a thermistor network 117. The processing circuit 112 may receive electrical signals 118 from the TEC 110 and / or the thermistors 116, and may determine the temperature of the inner housing 106 and / or the outer housing 108 based on the electrical signals 118. For example, the processing circuit 112 may determine the temperature based on the sensed electrical signals 118 and / or from the thermistors 116 thermally coupled to the inner housing 106 and / or the outer housing 108, based on the voltage difference between the surfaces of the TEC 110. The processing circuit 112 may then determine whether the temperature meets a threshold condition (e.g., whether the temperature is above a minimum threshold temperature, below a maximum threshold temperature, or within a threshold temperature range). In response to determining that the temperature does not meet the threshold condition, the processing circuit 112 may transmit an instruction to the generator circuit 114 to cause the generator circuit 114 to deliver a DC current 120 to the TEC module 109, which causes the TEC 110 to transfer thermal energy 122 (e.g., positive thermal energy, negative thermal energy) to the inner housing 106 and / or the outer housing 108. "Positive thermal energy" may refer to the flow of thermal energy from one element (e.g., the TEC 110) to another element (e.g., the inner housing 106, the outer housing 108) in a specified direction (e.g., from the TEC 110 into the inner housing 106). "Negative thermal energy" may refer to the flow of thermal energy from one element (e.g., the TEC 110) to another element (e.g., the inner housing 106, the outer housing 108) in a direction opposite to the specified direction.

[0028] The flow of thermal energy 122 may be reversed by reversing the polarity of the DC current 120. In some examples, when induced with a first polarity (e.g., via the DC current 120), positive thermal energy 122 flows from the TEC 110 into the inner housing 106, and negative thermal energy 122 flows from the TEC 110 into the outer housing 108. This energy flow may heat the electronic devices inside the inner housing 106. In another example, when induced with a second polarity different from the first polarity (e.g., via the DC current 120), negative thermal energy 122 flows from the TEC 110 into the inner housing 106, and positive thermal energy 122 flows from the TEC 110 into the outer housing 108. This energy flow may cool the electronic devices inside the inner housing 106.

[0029] When the TEC 110 receives the DC current 120 from the generator circuit 114, the DC current 120 can generate a temperature difference between the surfaces of the TEC 110 via the Peltier - Seebeck effect. The polarity of the DC current 120 received by the TEC 110 can control the temperature difference. For example, in response to the DC current 120, the TEC 110 can be induced with a first polarity (also referred to herein as the "initial polarity"), which causes a first temperature difference to be generated, where the first surface coupled to the inner housing 106 is at a lower temperature than the second surface coupled to the outer housing 108. This first temperature difference can facilitate the transfer of negative thermal energy 122 from the TEC 110 into the inner housing 106 and the transfer of positive thermal energy 122 from the TEC 110 into the outer housing 108, thereby cooling the electronic device 102. In another example, in response to the DC current 120, the TEC 110 can be induced with a second polarity (also referred to herein as the "opposite polarity") that is different from the initial polarity, which causes a second temperature difference to be generated, where the temperature of the second surface is lower than the temperature of the first surface. The second temperature difference can facilitate the transfer of negative thermal energy 122 from the TEC 110 into the outer housing 108 and the transfer of positive thermal energy 122 from the TEC 110 into the inner housing 106, thereby heating the electronic device 102. The processing circuit 112 can cause the generator circuit 114 to deliver a DC current 120 with a different polarity based on the sensed temperature, for example, to heat or cool the electronic device 102 within the inner housing 106.

[0030] The processing circuit 112 and the generator circuit 114 can be disposed within the inner housing 106. In some examples, as Figure 1 shown, the processing circuit 112 and the generator circuit 114 are components of the electronic device 102 or are electrically connected or coupled to the electronic device. For example, the processing circuit 112 can share common computing and / or processing components (e.g., a common circuit board) with the electronic device 102. In such an example, the thermal regulation system 104 can be controlled by one or more of the electronic devices 102 of the system 100. In some examples, the processing circuit 112 and the generator circuit 114 are physically and / or electrically separated from the electronic device 102 and are outside the inner housing 106. In such an example, the thermal regulation system 104 can operate independently of the electronic devices 102 of the system 100.

[0031] The system 100 as described herein can be used in a variety of applications. Example applications include, but are not limited to, use in satellites, vehicles (e.g., cars, airplanes, unmanned aerial vehicles (UAVs), boats), and / or in functions that require an extended period of time between inspections of the system 100.

[0032] Figure 2 is a conceptual diagram of a cross - sectional view showing an example of the thermal regulation system 104 of the system 100. Although Figure 1 the Figure 2The internal housing 106 and the external housing 108 of system 100 are shown as defining a cylindrical shape, but other examples of system 100 may include an internal housing 106 and / or an external housing 108 defining other shapes, including but not limited to a spherical shape, a toroidal shape, a rectangular prism shape, other prism shapes, or an irregular shape. The internal housing 106 and / or the external housing 108 may define different shapes based on constraints on the size, weight, volume, and / or surface area of system 100 and / or based on the size of the electronic device 102 disposed within the internal housing 106.

[0033] The internal housing 106 may define an internal volume 202 configured to hold the electronic device 102 and / or components of the thermal regulation system 104 (e.g., the processing circuitry 112, the generator circuitry 114). The internal housing 106 may isolate the electronic device 102 from external interferences (e.g., from external electromagnetic radiation, from electrostatic discharge (ESD)). The internal housing 106 may also shield the TEC 110 from interference from the electronic device 102 (e.g., electromagnetic radiation from the electronic device 102, ESD). The TEC 110 may further shield the electronic device 102 from external interferences (e.g., electromagnetic radiation, ESD). The internal housing 106 may be thermally coupled to the electronic device 102 and thermally coupled to the TEC 110. Thermal energy 122 may enter or leave the electronic device 102 along a path extending through the internal housing 106.

[0034] The external housing 108 may be disposed radially outside the internal housing 106, for example, with respect to the axis of system 100. The internal housing 106 and the external housing 108 may be separated by a space 206. The external housing 108 may isolate system 100 and the thermal regulation system 104 from the external environment 204 (e.g., physically, electrically). For example, the external housing 108 may isolate the TEC 110 and / or the electronic device 102 from external electromagnetic radiation and / or external ESD. The external housing 108 may be thermally coupled to the TEC 110.

[0035] The thermal regulation system 104 may transfer thermal energy 122 between the internal volume 202 and the TEC 110 and separately between the TEC 110 and the environment 204, for example, to heat or cool the electronic device 102. The TEC 110 may be electrically coupled to the processing circuitry 112 and the generator circuitry 114 within the volume 202, for example, via one or more electrical wires extending from the volume 202 through the internal housing 106 into the space 206. In some examples, the processing circuitry 112 and the generator circuitry 114 are disposed within the space 206.

[0036] As Figure 2As shown, the TEC 110 can be disposed within the space 206 and can be thermally coupled to the inner housing 106 and thermally coupled to the outer housing 108. The TEC 110 can be evenly distributed around the circumference and / or along the length of the axis of the inner housing 106, for example, to evenly cool or heat the inner housing 106. In some examples, two or more TEC 110s can be concentrated around a specific or local area around the circumference of the axis of the inner housing 106 and / or along the length of the axis, for example, to increase temperature control of the inner housing 106 at the specific or local area. For example, depending on the placement of the electronic device 102 within the internal volume 202, a specific or local area of the inner housing 106 may experience increased local temperature variations compared to other areas of the internal volume 202. Two or more TEC 110s can be concentrated around a specific area to increase temperature control at the specific area or local area.

[0037] In some examples, as Figure 2 shown, the thermal regulation system 104 can include one or more thermistors 116 of a thermistor network 117 disposed within the space 206. The thermistor network 117 can include one or more thermistors 116 coupled to one or more thermistor bands. The thermistors 116 can sense the temperature of the inner housing 106 and / or the outer housing 108 at one or more locations. The thermistors 116 can transmit an electrical signal indicative of the sensed temperature to the processing circuit 112. In some examples, the thermal regulation system 104 does not include the thermistors 116, and the TEC 110s within the TEC module 109 are configured to sense and control the temperature of the inner housing 106 and / or the outer housing 108.

[0038] Figure 3 is a conceptual diagram showing the TEC 110 between the inner housing 106 and the outer housing 108 of the system disposed in Figure 1 . In some examples, as Figure 3 shown, the inner housing 106 is thermally coupled to a temperature control element 302 (e.g., a heating element, a cooling element), and the TEC 110 and the thermistors 116 are disposed on the temperature control element 302. In some examples, the TEC 110 and the thermistors 116 are directly disposed on the inner housing 106. In some examples, the TEC 110 can be integrated into the TEC module 109, and the thermistors 116 can be integrated into the thermistor network 117.

[0039] The temperature control element 302 can be formed of a thermally conductive material. The temperature control element 302 can distribute the heating and cooling effects of the TEC 110 over the inner housing 106, for example, heating and cooling the inner housing 106 and the electronic device 102 respectively. The temperature control element 302 can hold the TEC 110 of the TEC module 109 and / or the thermistors 116 of the thermistor network 117 as a single component, for example, to facilitate the assembly of the system 100. For example, a manufacturing system can attach the temperature control element 302 around the inner housing 106 and then radially dispose the outer housing 108 outside the inner housing 106 and the temperature control element 302. The temperature control element 302 can be flexible, semi-flexible, or rigid. The size and shape of the temperature control element 302 can be set to conform to the size and shape of the inner housing 106 (e.g., curvature or irregular geometry).

[0040] The TEC 110 of the TEC module 109 can be disposed between the inner housing 106 and the outer housing 108, for example, disposed on the inner housing 106, disposed on the temperature control element 302. The TEC 110 can be in contact with or otherwise thermally coupled to the inner housing 106 and the outer housing 108. In some examples, as Figure 3 shown, the inner housing 106 and / or the outer housing 108 can define a geometry (e.g., curvature, irregular geometry) across at least a portion of the inner housing 106 and / or the outer housing 108. For example, the inner housing 106 and / or the outer housing 108 can define an O shape, a D shape, a U shape, a C shape, etc. In some examples, the inner housing 106 and / or the outer housing 108 can define an angled, irregular geometry across at least a portion of the inner housing 106 and / or the outer housing 108. The inner housing 106 and the outer housing 108 can define the same, similar, or different shapes. The TEC 110 can be shaped to conform to the geometry of one or more of the inner housing 106 or the outer housing 108. In some examples, multiple TECs 110 are electrically coupled such that the TEC module 109 including the multiple TECs 110 defines a shape configured to conform to one or more of the inner housing 106 and / or the outer housing 108.

[0041] The TEC 110 can be coupled to a generator circuit 114 disposed within the inner housing 106 via one or more conductive contacts 304. The contacts 304 can extend through the temperature control element 302 and / or the inner housing 106 and can link the TEC 110 to the generator circuit 114 in the circuit. The TEC 110 can receive a DC current 120 from the generator circuit 114 via the contacts 304.

[0042] In some examples, the TEC module 109 includes two or more TECs 110. Each TEC 110 can be separate and electrically coupled to the generator circuit 114, for example, via a separate contact 304. In some examples, two or more TECs 110 can be electrically coupled (e.g., in series) and electrically connected via the contact 304. In such an example, the DC current 120 flows from the generator circuit 114 into the first TEC 110 via the contact 304. The DC current 120 can then flow through the electrically coupled TECs 110 and then back to the generator circuit 114 from the second TEC 110 to complete the circuit. In some examples, two or more TECs 110 can be electrically coupled in parallel.

[0043] The generator circuit 114 can transmit the DC current 120 to a specific contact 304 to selectively activate an individual TEC 110 (e.g., to locally control the temperature of the internal housing 106) or activate multiple TECs 110 (e.g., to control the temperature of the internal housing 106 over the entire surface area of the internal housing 106).

[0044] In some examples, the thermal regulation system 104 can sense the temperature of the internal housing 106 and / or the external housing 108 based on an electrical signal from the TEC 110. In such an example, the TEC 110 can be electrically coupled to the processing circuit 112 via the contact 304. In such an example, the contact 304 can be coupled to one or more surfaces of the TEC 110. For example, the contact 304 can couple the processing circuit 112 to a first surface of the TEC 110 that is thermally coupled to the internal housing 106 and couple the processing circuit to a second surface of the TEC 110 that is thermally coupled to the external housing 108.

[0045] Figure 4A is a conceptual diagram of an example TEC 110 of the system 100 shown Figure 1 The TEC 110 can be disposed between the internal housing 106 and the external housing 108 and can be thermally coupled to the internal housing and the external housing. The TEC 110 can define a plurality of surfaces 402A, 402B (collectively referred to herein as "surfaces 402"). The TEC 110 can include a plurality of conductive plates 406A, 406B (collectively referred to herein as "conductive plates 406") that define surfaces and a plurality of semiconductors 404 that extend between the conductive plates 406. Although described with reference to a TEC 110 having a plurality of semiconductors 404 Figure 4A , other example TECs 110 can include the same structure as the example TEC 110 shown Figure 4A where the semiconductors are arranged in the same configuration as described below. Although Figure 4AA single-stage TEC 110 is shown, but other example TECs 110 described herein may include two or more stages.

[0046] The first surface 402A of the TEC 110 may be placed in contact with or otherwise thermally coupled to the internal housing 106. For example, the first conductive plate 406A that defines the first surface 402A may be attached to and / or in contact with the internal housing 106. The second surface 402B of the TEC 110 may be placed in contact with or otherwise thermally coupled to the external housing 108. For example, the second conductive plate 406B that defines the second surface 402B may be attached to and / or in contact with the external housing 108. The TEC 110 may facilitate the transfer of thermal energy 122 between the internal housing 106 and the first surface 402A and between the external housing 108 and the second surface 402B, e.g., in response to a DC current 120. In such an example, the DC current 120 creates a temperature difference between the first surface 402A and the second surface 402B, which facilitates the transfer of thermal energy 122 out of the TEC 110.

[0047] The conductive plates 406 may include a thermally conductive material that electrically isolates the semiconductor 404 from the internal housing 106. When the TEC 110 is in contact with both the internal housing 106 and the external housing 108, the conductive plates 406 may electrically isolate the internal housing 106 from the external housing 108. The thermally conductive material may include, but is not limited to, ceramic materials. Example ceramic materials include alumina ceramics, aluminum nitride ceramics, beryllium oxide ceramics, etc. The conductive plates 406 may be maintained at different temperatures corresponding to the different housings to which the conductive plates 406 are coupled. For example, the first conductive plate 406A and the internal housing 106 may be at a first temperature, while the second conductive plate 406B and the external housing 108 may be at a second temperature different from the first temperature. In some examples, in response to receiving a DC current 120 of an initial polarity, the first conductive plate 406A may be at a higher temperature than the second conductive plate 406B. In some examples, in response to receiving a DC current 120 of a reverse polarity, the first conductive plate 406A may be at a lower temperature than the second conductive plate 406B. The conductive plates 406 may be permanently or removably attached to the internal housing 106 and the external housing 108. The conductive plates 406 may be attached to the internal housing 106 and the external housing 108 via one or more of adhesives, securing features (e.g., screws, bolts, washers), etc.

[0048] Multiple semiconductors 404 extend between and connect conductive plates 406. In some examples, the semiconductors 404 may be arranged in pairs, with each pair of semiconductors 404 forming a thermoelectric coupling of the semiconductors 404 that are connected in series electrically and in parallel thermally. In some examples, pairs of conductors 404 may be connected in parallel electrically. Each pair of semiconductors 404 may include an N-type conductor ("N") and a P-type conductor ("P"). Pairs of semiconductors 404 may be connected in series electrically and in parallel thermally to form a matrix of semiconductors 404 spanning the space between the conductive plates 406. The number of semiconductors 404 and / or the contact area between the semiconductors 404 and the conductive plates 406 may determine the cooling / heating rate of the TEC 110. Increasing the number of semiconductors 404 and / or the contact area between the semiconductors 404 and the conductive plates 406 may increase the cooling and / or heating rate of the TEC 110.

[0049] When the thermal regulation system 104 delivers the DC current 120 from the generator circuit 114 to the semiconductors 404 via the contacts 304, the DC current 120 may flow in one direction along the first semiconductor 404 of each pair of semiconductors 404 between the first surface 402A and the second surface 402B and in the opposite direction along the second semiconductor 404 of each pair of semiconductors 404. For example, the DC current 120 may flow from the first surface 402A toward the second surface 402B along the P-type conductor and from the second surface 402B toward the first surface 402A along the N-type conductor, or vice versa. The flow of the DC current 120 along the semiconductors 404 in this manner may create a voltage difference between the first surface 402A and the second surface 402B. The voltage difference may result in a temperature difference between the first surface 402A and the second surface 402B, such as where the first surface 402A is at a higher temperature than the second surface 402B, or vice versa.

[0050] The thermal regulation system 104 can change the polarity of the DC current 120 to heat or cool the internal housing 106. When the thermal regulation system 104 transmits the DC current 120 having a first polarity (e.g., an initial polarity) to the TEC 110, the flow of the DC current 120 through the semiconductor 404 can cause negative thermal energy 122 to be transferred from the TEC 110 (e.g., from the conductive plate 406A of the TEC 110) into the internal housing 106 (e.g., alternatively referred to as positive thermal energy 122 being transferred from the internal housing 106 into the TEC 110), along with positive thermal energy 122 being transferred from the TEC 110 (e.g., from the conductive plate 406B of the TEC 110) to the external housing 108. For example, the DC current 120 of the initial polarity can create a temperature difference between the conductive plates 406, which can create a temperature difference between the internal housing 106 and the conductive plate 406A. The temperature difference between the internal housing 106 and the conductive plate 406A can cause negative thermal energy 122 to be transferred by conduction from the conductive plate 406A into the internal housing 106 (e.g., into the electronic device 102 within the internal housing 106). When the DC current 120 travels along the semiconductor 404 from the conductive plate 406A to the conductive plate 406B, there is a temperature change at the junction between the two semiconductors 404 (e.g., at or around the surface 402). This temperature difference can be multiplied by the multiple junctions formed by the semiconductor 404 between the conductive plates 406, thereby creating a thermal temperature difference between the conductive plate 406A and the conductive plate 406B. There may be a temperature difference between the conductive plate 406B and the external housing 108 (e.g., the temperature of the conductive plate 406B is higher than the temperature of the external housing 108), which may cause positive thermal energy 122 to flow from the conductive plate 406B into the external housing 108.

[0051] When the thermal regulation system 104 transmits the DC current 120 having a reverse polarity opposite to the first polarity to the TEC 110, the DC current 120 can create a thermal temperature difference between the conductive plate 406A and the conductive plate 406B in a direction opposite to that of the DC current 120 having the first polarity. In such an example, negative thermal energy 122 can flow from the TEC 110 (e.g., from the conductive plate 406B) into the external housing 108, and positive thermal energy 122 can flow from the TEC 110 (e.g., from the conductive plate 406A) into the internal housing 106, thereby heating the internal housing 106.

[0052] Figure 4B is shown Figure 1Conceptual diagram of another example TEC 110 of system 100. In some examples, one or more of the inner housing 106 or the outer housing 108 may include a conductive material that defines thermal interfaces 408A, 408B (collectively referred to as "interfaces 408") at surface 402. The interfaces 408 may thermally connect and electrically isolate the semiconductor 404 of the TEC 110 from the inner housing 106 and / or the outer housing 108.

[0053] The interfaces 408 may be formed of a thermally conductive material. The thermally conductive material may electrically isolate the semiconductor 404 from the inner housing 106 and / or the outer housing 108. The thermally conductive material may include, but is not limited to, ceramic materials. Example ceramic materials include alumina ceramics, aluminum nitride ceramics, beryllium oxide ceramics, etc. In some examples, the inner housing 106 and / or the outer housing 108 are partially or entirely formed of a thermally conductive material. In some examples, the interfaces 408 may include a coating or layer of thermally conductive material disposed between the inner housing 106 and / or the outer housing 108 and the semiconductor 404. In some examples, the interfaces 408 may include an adhesive that includes a thermally conductive material. The adhesive may directly attach the semiconductor 404 to the inner housing 106 and / or the outer housing 108, e.g., without the need for the conductive plate 406.

[0054] In some examples, system 100 includes: an inner housing 106; an electronic device 102 disposed within the inner housing, where the electronic device 102 includes one or more of an accelerometer or a gyroscope; an outer housing 108 radially disposed outside the inner housing 106 relative to an axis; and a thermoelectric cooler (TEC) 110 disposed between the inner housing 106 and the outer housing 108, the TEC 110 including: a first surface 402A thermally coupled to the inner housing 106; and a second surface 402B thermally coupled to the outer housing 108, where the TEC 110 is configured to modulate the temperature of the electronic device 102 in response to the application of a DC current 120, and where the inner housing 106 defines a first curvature, where the outer housing 108 defines a second curvature, and where the first surface 402A of the TEC 110 is shaped to conform to the first curvature, and the second surface 402B of the TEC 110 is shaped to conform to the second curvature.

[0055] In some examples, system 100 includes: an internal housing 106; an electronic device 102 disposed within the internal housing 106; an external housing 108 disposed radially outside the internal housing 106 relative to an axis; and a thermoelectric cooler (TEC) 110 disposed between the internal housing 106 and the external housing 108, the TEC 110 including a plurality of semiconductors 404, each semiconductor 404 including: a first end thermally coupled to the internal housing 106 (e.g., at surface 402A); and a second end thermally coupled to the external housing 108 (e.g., at surface 402B), wherein the TEC 110 is configured to modulate the temperature of the electronic device 102 in response to the application of a DC current 120, and wherein one or more of the internal housing 106 or the external housing 108 includes a ceramic material, and wherein the plurality of semiconductors 404 of the TEC 110 are in direct contact with the ceramic material.

[0056] In some examples, system 100 includes: an internal housing 106; an electronic device 102 disposed within the internal housing 106, the electronic device 102 including a processing circuit 112 and a generator circuit 114; an external housing 108 disposed radially outside the internal housing 106 relative to an axis; and a thermoelectric cooler (TEC) 110 disposed between the internal housing 106 and the external housing 108, the TEC 110 including: a first surface 402A thermally coupled to the internal housing 106; and a second surface 402B thermally coupled to the external housing 108, wherein the processing circuit 112 is coupled to the TEC 110, and wherein the processing circuit 112 is configured to: receive an electrical signal 118 corresponding to the temperature of the internal housing 106; determine the temperature of the internal housing 106 based on the received electrical signal 118; compare the determined temperature to a threshold temperature; and based on determining that the determined temperature does not meet the threshold temperature, cause the generator circuit 114 to deliver a DC current 120 to the TEC 110 to cause the TEC 110 to transfer thermal energy 122 between the internal housing 106 and the TEC 110 and between the TEC 110 and the external housing 108 to modulate the temperature of the internal housing 106.

[0057] Figure 5 is a flowchart showing an example process for controlling the temperature of the electrical system 100. Although mainly described with respect to sensing the temperature of the system 100 via one or more TECs (e.g., TEC 110) within the TEC module 109 Figure 5 , the process may be performed by sensing the temperature of the system 100 via one or more other sensors (e.g., thermistors 116 of the thermistor network 117).

[0058] The thermal regulation system 104 may receive an electrical signal 118 (502) from the TEC 110. The TEC 110 may be disposed within the TEC module 109. The electrical signal 118 may indicate the voltage value of the semiconductor 404 of the TEC 110 at the surface 402. When the TEC 110 experiences a temperature difference at the surface 402, the temperature difference may cause the semiconductor 404 to generate a potential difference, a voltage difference, or a current difference between the ends of the semiconductor 404 (i.e., via the Peltier - Seebeck effect). The TEC 110 may be coupled to the processing circuit 112 via the contact 304. The processing circuit 112 may be disposed within the volume 202 enclosed by the internal housing 106, or may be disposed between the internal housing 106 and the external housing 108. The contact 304 may extend from the TEC 110 within the space 206 and into the volume 202. The contact 304 may extend from the space 206 into the volume 202 through one or more openings and / or ports within the internal housing 106. In some examples, the contact 304 is electrically coupled between the first surface 402A and the internal housing 106 without any openings and / or ports within the internal housing 106. The electrical signal 118 may be transmitted from the TEC 110 to the processing circuit 112 via the contact 304.

[0059] The thermal regulation system 104 may determine the temperature of the internal housing 106 based on the received electrical signal 118 (504). The processing circuit 112 may determine the temperature difference between the first surface 402A and the second surface 402B of the TEC 110 based on the electrical signal 118. The processing circuit 112 may determine the temperature of the internal housing 106 based on the temperature difference between the surfaces 402 of the TEC 110. For example, the processing circuit 112 may determine the temperature of the internal housing 106 based on the temperature of the environment 204 and the temperature difference between the surfaces 402. In some examples where the environment 204 and / or the external housing 108 is maintained at a uniform temperature, the processing circuit 112 may determine the temperature of the internal housing 106 based on the temperature difference between the surfaces 402 and the temperature of the external housing 108.

[0060] The thermal regulation system 104 may determine whether the determined temperature satisfies a threshold condition (506). The thermal regulation system 104 stores or may store one or more threshold conditions (e.g., a threshold temperature range, a minimum threshold temperature, a maximum threshold temperature) within the memory of the thermal regulation system 104. In some examples, the processing circuit 112 determines whether the temperature of the internal housing 106 is within the threshold temperature range. In some examples, the processing circuit 112 determines whether the temperature of the internal housing 106 is greater than or equal to the minimum threshold temperature. In some examples, the processing circuit 112 determines whether the temperature of the internal housing 106 is less than or equal to the maximum threshold temperature. The threshold condition may depend on the environment 204 and / or the components of the electronic device 102 within the internal housing 106 (e.g., the thermal energy output of the components of the electronic device 102).

[0061] Based on determining that the determined temperature satisfies a threshold condition (the "yes" branch of 506), the thermal regulation system 104 may continue to receive the electrical signal 118 (502) from the TEC 110 (e.g., the TEC 110 within the TEC module 109). Based on determining that the temperature does not satisfy any threshold condition (the "no" branch of 506), the thermal regulation system 104 may deliver the DC current 120 to the TEC 110 to modulate the temperature of the internal housing (508).

[0062] The processing circuit 112 may cause the generator circuit 114 to generate the DC current 120 and transmit the DC current 120 to the TEC 110 via the contact 304. In response to receiving the DC current 120, the semiconductor 404 of the TEC 110 may form a voltage potential difference between the surfaces 402, which may cause a temperature difference to be generated between the surfaces 402. The temperature difference may cause positive or negative thermal energy 122 to flow from the TEC 110 into the internal housing 106, while the opposite thermal energy 122 flows from the TEC 110 into the external housing 108, thereby regulating the temperature of the internal housing 106. The processing circuit 112 may cause the generator circuit 114 to generate the DC current 120 with a specific polarity based on the determination of the processing circuit 112, e.g., to heat or cool the internal housing 106. The DC current 120 with different polarities may change the direction of the temperature difference and cause the TEC 110 to heat or cool the internal housing 106. In some examples, the DC current 120 with an initial polarity may cause the first surface 408A to be at a lower temperature than the second surface 408B, which may cause negative thermal energy 122 to flow from the first surface 408A of the TEC 110 into the internal housing 106 and positive thermal energy 122 to flow from the second surface 408B into the external housing 108, thereby cooling the internal housing 106. In some examples, the DC current 120 with an opposite polarity different from the initial polarity may cause the first surface 408A to be at a higher temperature than the second surface 408B, which may cause negative thermal energy 122 to flow from the second surface 408B into the external housing 108 and positive thermal energy 122 to flow from the first surface 408A into the internal housing 106, e.g., thereby heating the internal housing 106.

[0063] The thermal regulation system 104 may continue to receive the electrical signal 118(502) from the TEC 110. The thermal regulation system 104 may continue to monitor the temperature of the internal housing 106 while delivering the DC current 120 to the TEC 110 until the thermal regulation system 104 (e.g., the processing circuitry 112) determines that the current temperature of the internal housing 106 meets a threshold condition, at which point the thermal regulation system 104 terminates the delivery of the DC current 120. The thermal regulation system 104 may continue to receive and monitor the electrical signal 118 from the TEC 110 and may adjust the temperature of the internal housing 106 as described above to maintain the temperature of the internal housing 106 below a maximum threshold temperature, above a minimum threshold temperature, and / or within a range of threshold temperatures.

[0064] In some examples, where multiple TECs 110 are disposed between the internal housing 106 and the external housing 108, the thermal regulation system 104 may receive and monitor the electrical signal 118 from each TEC 110 individually and / or separately. The thermal regulation system 104 may determine a local increase or decrease in temperature at or around one or more of the TECs 110 at or around the internal housing 106 and / or the external housing 108 based on the electrical signals 118 from the multiple TECs 110. The thermal regulation system 104 may deliver the DC current 120 to a selected TEC 110 within the TEC module 109 to control the local increase or decrease in temperature.

[0065] The following embodiments may illustrate one or more techniques of the present disclosure.

[0066] Embodiment 1: A system: The system includes: an internal housing; an electronic device disposed within the internal housing, where the electronic device includes one or more of an accelerometer or a gyroscope; an external housing radially disposed outside the internal housing relative to an axis of the internal housing; and a thermoelectric cooler (TEC) disposed between the internal housing and the external housing, the TEC including: a first surface thermally coupled to the internal housing; and a second surface thermally coupled to the external housing, where the TEC is configured to transfer thermal energy between the TEC and the internal housing and between the TEC and the external housing in response to the application of a DC current to modulate the temperature of the electronic device, and where the internal housing defines a first geometry, where the external housing defines a second geometry, and where the first surface of the TEC is shaped to conform to the first geometry and the second surface of the TEC is shaped to conform to the second geometry.

[0067] Example 2: The system according to Example 1, wherein the TEC is configured to: in response to the application of the DC current having an initial polarity, transfer negative thermal energy from the TEC to the inner housing and transfer positive thermal energy from the TEC to the outer housing; and in response to the application of the DC current having a reverse polarity, transfer positive thermal energy from the TEC to the outer housing and transfer negative thermal energy from the TEC to the inner housing, wherein the initial polarity is different from the reverse polarity.

[0068] Example 3: The system according to any one of Examples 1 or 2, wherein the first geometry is different from the second geometry.

[0069] Example 4: The system according to any one of Examples 1 to 3, wherein the electronic device includes: a generator circuit electrically coupled to the TEC and configured to deliver the DC current to the TEC; and a processing circuit electrically coupled to the generator circuit and thermally coupled to the TEC, the processing circuit being configured to: receive an electrical signal from the TEC; determine a temperature value sensed by the TEC based on the electrical signal; compare the temperature value of the TEC with a threshold temperature value; and in response to determining that the temperature value of the TEC does not satisfy the threshold temperature value, cause the generator circuit to deliver the DC current to the TEC.

[0070] Example 5: The system according to Example 4, wherein the electrical signal from the TEC indicates a first voltage potential at the first surface and a second voltage potential at the second surface, and wherein to determine the temperature value sensed by the TEC, the processing circuit is configured to: determine a voltage potential difference between the first surface and the second surface of the TEC based on the first voltage potential and the second voltage potential; and determine one or more of the following based on the voltage potential difference: a temperature difference between the inner housing and the outer housing; a first temperature of the inner housing; or a second temperature of the outer housing.

[0071] Example 6: The system according to any one of Examples 1 to 5, wherein the outer housing is configured to shield the electronic device and the TEC from one or more of electromagnetic radiation or electrostatic discharge (ESD).

[0072] Example 7: The system according to any one of Examples 1 to 6, wherein the electronic device includes a resonant beam accelerometer.

[0073] Example 8: A system: The system includes: an inner housing; an electronic device disposed within the inner housing; an outer housing radially disposed outside the inner housing relative to the axis of the inner housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including a plurality of semiconductors, each semiconductor including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, wherein the TEC is configured to transfer thermal energy between the TEC and the inner housing and between the TEC and the outer housing via the plurality of semiconductors in response to the application of a DC current to modulate the temperature of the electronic device, and wherein one or more of the inner housing or the outer housing includes a ceramic material, and wherein the plurality of semiconductors of the TEC are in direct contact with the ceramic material.

[0074] Example 9: The system according to Example 8, wherein the ceramic material includes a ceramic coating disposed on one or more of the inner housing or the outer housing.

[0075] Example 10: The system according to any one of Examples 8 or 9, wherein the ceramic material includes a ceramic-type adhesive disposed on one or more of the inner housing or the outer housing, and wherein the plurality of semiconductors of the TEC are attached to one or more of the inner housing or the outer housing via the ceramic-type adhesive.

[0076] Example 11: The system according to any one of Examples 8 to 10, wherein the inner housing defines a first geometry, wherein the outer housing defines a second geometry, and wherein the TEC is shaped to conform to the first geometry and to conform to the second geometry.

[0077] Example 12: A system: The system includes: an inner housing; an electronic device disposed within the inner housing, the electronic device including a processing circuit and a generator circuit; an outer housing radially disposed outside the inner housing with respect to an axis of the inner housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC including: a first surface thermally coupled to the inner housing; and a second surface thermally coupled to the outer housing, wherein the processing circuit is coupled to the TEC, and wherein the processing circuit is configured to: receive an electrical signal corresponding to a temperature of the inner housing; determine the temperature of the inner housing based on the received electrical signal; compare the determined temperature with a threshold temperature; and based on determining that the determined temperature does not meet the threshold temperature, cause the generator circuit to deliver a DC current to the TEC to cause the TEC to transfer thermal energy between one or more locations between the TEC and the inner housing and between the TEC and the outer housing to modulate the temperature of the inner housing.

[0078] Example 13: The system according to Example 12, the system further includes one or more thermistors coupled to the inner housing, and wherein the processing circuit is configured to receive the electrical signal from the one or more thermistors.

[0079] Example 14: The system according to any one of Examples 12 or 13, wherein the processing circuit is configured to: receive a first voltage potential from the first surface of the TEC; receive a second voltage potential from the second surface of the TEC; determine a voltage potential difference between the first voltage potential and the second voltage potential; and determine the temperature of the inner housing based on the voltage potential difference.

[0080] Example 15: The system according to any one of Examples 12 to 14, wherein the threshold temperature includes a threshold temperature range, and wherein to determine that the determined temperature does not meet the threshold temperature, the processing circuit is configured to determine that the determined temperature is outside the threshold temperature range.

[0081] Example 16: The system according to Example 15, wherein the processing circuit is configured to: compare the determined temperature with a maximum threshold temperature of the threshold temperature range; and in response to determining that the determined temperature is greater than or equal to the maximum threshold temperature, cause the generator circuit to deliver the DC current to the TEC to cause the TEC to transfer thermal energy to one or more locations along the inner housing or the outer housing.

[0082] Example 17: The system according to any one of Examples 15 or 16, wherein the processing circuit is configured to: compare the determined temperature with the minimum threshold temperature of the threshold temperature range; and in response to determining that the determined temperature is less than or equal to the minimum threshold temperature, cause the generator circuit to deliver the DC current to the TEC to cause the TEC to transfer thermal energy to one or more locations along the inner housing or the outer housing.

[0083] Example 18: The system according to any one of Examples 12 to 17, wherein the system includes a plurality of TECs disposed between the inner housing and the outer housing, each TEC of the plurality of TECs being coupled to the processing circuit, and wherein the processing circuit is configured to: receive one or more of a voltage potential or a current value from each TEC of the plurality of TECs; determine, based on one or more voltage potentials or the current value from each TEC of the plurality of TECs, the temperature at one or more locations along the inner housing or the outer housing sensed by each TEC; for each TEC, compare the temperature with the threshold temperature; and in response to determining that the determined temperature sensed by one or more of the plurality of TECs does not satisfy the threshold temperature, cause the generator circuit to deliver the DC current to the one or more TECs to modulate the temperature of at least one location inside the inner housing or the outer housing, the at least one location corresponding to the one or more TECs.

[0084] Example 19: The system according to any one of Examples 12 to 18, wherein the TEC is configured to shield the electronic device from one or more of electromagnetic radiation or electrostatic discharge (ESD).

[0085] Example 20: The system according to any one of Examples 12 to 19, wherein the electronic device includes one or more of an accelerometer or a gyroscope.

Claims

1. A system, comprising: inner shell; an electronic device disposed within the internal housing, wherein the electronic device includes one or more of an accelerometer or a gyroscope; an outer shell, the outer shell being arranged radially outside the inner shell relative to the axis of the inner shell; and A thermoelectric cooler (TEC), the thermoelectric cooler being disposed between the inner housing and the outer housing, the TEC comprising: a first surface thermally coupled to the inner housing, and a second surface thermally coupled to the outer housing, wherein the TEC is configured to transfer thermal energy between the TEC and the inner housing and between the TEC and the outer housing in response to application of a DC current to modulate a temperature of the electronic device, and wherein the inner housing defines a first geometry, wherein the outer housing defines a second geometry, and wherein the first surface of the TEC is shaped to conform to the first geometry, and wherein the second surface of the TEC is shaped to conform to the second geometry.

2. The system of claim 1, wherein the TEC is configured to: In response to the application of the DC current having the initial polarity, negative thermal energy is transferred from the TEC to the inner housing and positive thermal energy is transferred from the TEC to the outer housing, and In response to the application of a DC current having a reverse polarity, positive thermal energy is transferred from the TEC to the outer housing and negative thermal energy is transferred from the TEC to the inner housing, wherein the initial polarity is different from the reverse polarity.

3. The system of any one of claims 1 and 2, wherein the first geometry is different from the second geometry.

4. The system according to any one of claims 1 to 3, wherein the electronic device comprises: a generator circuit electrically coupled to the TEC and configured to deliver the DC current to the TEC; and a processing circuit electrically coupled to the generator circuit and to the TEC, the processing circuit being configured to: receiving an electrical signal from the TEC; determining a temperature value sensed by the TEC based on the electrical signal; comparing the temperature value of the TEC to a threshold temperature value; as well as In response to determining that the temperature value of the TEC does not satisfy the threshold temperature value, the generator circuit is caused to deliver the DC current to the TEC.

5. The system according to claim 4, wherein the electrical signal from the TEC is indicative of a first voltage potential at the first surface and a second voltage potential at the second surface, and Wherein, in order to determine the temperature value sensed by the TEC, the processing circuit is configured to: determining a voltage potential difference between the first surface and the second surface of the TEC based on the first voltage potential and the second voltage potential; and Based on the voltage potential difference, one or more of the following is determined: a temperature difference between the inner shell and the outer shell; a first temperature of the inner housing; or a second temperature of the outer housing.

6. The system of any one of claims 1 to 5, wherein the external housing is configured to shield the electronic device and the TEC from one or more of electromagnetic radiation or electrostatic discharge (ESD).

7. The system of any one of claims 1 to 6, wherein the electronic device comprises a resonant beam accelerometer.

8. A system, comprising: inner shell; an electronic device disposed within the internal housing, the electronic device comprising a processing circuit and a generator circuit; an outer shell, the outer shell being arranged radially outside the inner shell relative to the axis of the inner shell; and A thermoelectric cooler (TEC), the thermoelectric cooler being disposed between the inner housing and the outer housing, the TEC comprising: a first surface thermally coupled to the inner housing, and a second surface thermally coupled to the outer housing, wherein the processing circuit is coupled to the TEC, and wherein the processing circuit is configured to: receiving an electrical signal corresponding to a temperature of the inner housing; determining the temperature of the inner housing based on the received electrical signal; comparing the determined temperature to a threshold temperature; and Based on determining that the determined temperature does not satisfy the threshold temperature, causing the generator circuit to deliver a DC current to the TEC to cause the TEC to transfer thermal energy between the TEC and one or more locations of the inner housing and between the TEC and the outer housing to modulate the temperature of the inner housing.

9. The system of claim 8, wherein the processing circuit is configured to: receiving a first voltage potential from the first surface of the TEC; receiving a second voltage potential from the second surface of the TEC; determining a voltage potential difference between the first voltage potential and the second voltage potential; as well as A temperature of the inner housing is determined based on the voltage potential difference.

10. The system according to any one of claims 8 and 9, wherein the system comprises a plurality of TECs disposed between the inner housing and the outer housing, each TEC of the plurality of TECs being coupled to the processing circuit, and wherein the processing circuit is configured to: receiving one or more of a voltage potential or a current value from each TEC of the plurality of TECs; determining a temperature at one or more locations along the inner housing or the outer housing sensed by each TEC based on one or more voltage potentials or the current values ​​from each TEC of the plurality of TECs; for each TEC, comparing the temperature to the threshold temperature; as well as In response to determining that the determined temperature sensed by one or more TECs of the plurality of TECs does not satisfy the threshold temperature, the generator circuit delivers the DC current to the one or more TECs to modulate a temperature of at least one location of the internal housing or the external housing, the at least one location corresponding to the one or more TECs.

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